CN211942401U - Low-dielectric-constant double-sided flexible copper-clad plate - Google Patents
Low-dielectric-constant double-sided flexible copper-clad plate Download PDFInfo
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- CN211942401U CN211942401U CN202020312520.7U CN202020312520U CN211942401U CN 211942401 U CN211942401 U CN 211942401U CN 202020312520 U CN202020312520 U CN 202020312520U CN 211942401 U CN211942401 U CN 211942401U
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Abstract
The utility model relates to a copper-clad plate equipment technical field, in particular to two-sided flexible copper-clad plate of low dielectric constant, including first copper foil layer, through being equipped with first louvre and second louvre for the heat is convenient for dispel the heat through first louvre and second louvre looks outside, avoids the heat to be in the utility model discloses an inside production is piled up, influences the utility model discloses a transmission effect is equipped with the pull rod, and the both ends of stopper are located the inside of first copper foil layer and second copper foil layer respectively, and then makes and strains each other between first adhesive layer, first polyimide thin layer, low dielectric constant layer, second polyimide thin layer and the second adhesive layer, avoids when using for a long time, the utility model discloses in break away from each other between the different materials, prolong the utility model discloses a life.
Description
Technical Field
The utility model relates to a copper-clad plate equipment technical field, in particular to two-sided flexible copper-clad plate of low dielectric constant.
Background
Electronic glass fiber cloth or other reinforcing materials are soaked with resin, one side or two sides of the electronic glass fiber cloth or other reinforcing materials are covered with copper foil and are made into a plate-shaped material through hot pressing, the plate-shaped material is called a copper-clad plate, the copper-clad plate is used as a substrate material in the manufacturing of a printed circuit board and mainly plays roles of interconnection conduction, insulation and support for the printed circuit board, along with the development of electronic information and communication industry, the process of the copper-clad plate is greatly improved and advanced, and along with the strong market demand of consumer electronics, higher technical requirements are continuously provided for the copper-clad plate, thereby promoting the continuous development of high-frequency and high-speed application technology, but most of the existing copper-clad plates have the problem of poor heat dissipation in the use process, and the existing copper-clad plates are mostly made of multi-layer materials through gluing and pressing, in the actual use process, the generated heat, and then influence the transmission effect of copper-clad plate, influence the use of product, and current copper-clad plate when the mutual veneer of multilayer material is suppressed, adopt the adhesive to bond mostly, then form through the hot-roller pressing, in long-term use, make easily and break away from each other between the different materials, and then influence the life of copper-clad plate, and then influence product quality, be not convenient for use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a two-sided flexible copper-clad plate of low dielectric constant to solve the relatively poor and problem that breaks away from each other easily between the different materials of thermal diffusivity that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a low-dielectric-constant double-sided flexible copper-clad plate comprises a first copper foil layer, wherein a first adhesive layer is fixedly mounted on the lower surface of the first copper foil layer in an adhering mode, a first polyimide thin film layer is fixedly mounted on the lower surface of the first adhesive layer in an adhering mode, a low-dielectric-constant layer is arranged on the lower surface of the first polyimide thin film layer, a second polyimide thin film layer is arranged on the lower surface of the low-dielectric-constant layer, a second adhesive layer is fixedly mounted on the lower surface of the second polyimide thin film layer in an adhering mode, a second copper foil layer is mounted on the lower surface of the second adhesive layer in an adhering mode, first through holes are uniformly formed in the upper surfaces of the first copper foil layer and the second copper foil layer, first heat dissipation holes are uniformly formed between the first through holes in the upper surfaces of the first copper foil layer and the second copper foil layer, and the first polyimide thin film layer, Second through holes are uniformly formed in the upper surfaces of the low dielectric constant layer, the second polyimide thin film layer and the second adhesive layer, pull rods are embedded in the second through holes, the upper ends and the lower ends of the pull rods respectively extend into the first through holes in the upper surfaces of the first copper foil layer and the second copper foil layer, and second heat dissipation holes are uniformly formed in the upper surfaces of the first adhesive layer, the first polyimide thin film layer, the low dielectric constant layer, the second polyimide thin film layer and the second adhesive layer between the second through holes.
Preferably, the first through hole is communicated with the second through hole, and the diameter of the upper end of the first through hole is larger than that of the second through hole.
Preferably, the first heat dissipation hole is vertically communicated with the second heat dissipation hole, and the diameters of the first heat dissipation hole and the second heat dissipation hole are the same.
Preferably, the first polyimide film layer and the second polyimide film layer are both subjected to high-temperature imide treatment.
Preferably, the first through hole is of a T-shaped structure, and the diameter of one end of the first through hole is the same as the diameter of the second through hole.
Preferably, the pull rod includes connecting rod and stopper, the stopper is fixed respectively the both ends of connecting rod, just the connecting rod with the stopper is cylindrical structure, the diameter of connecting rod with the diameter of second through-hole is the same, the diameter of stopper with the diameter of first through-hole one end is the same.
Preferably, the height of the limiting block is half of the height of the first through hole.
The utility model discloses a technological effect and advantage:
1. the utility model discloses a first louvre and second louvre are equipped with evenly, and make and link up each other between first louvre and the second louvre, and then increase the contact area of the inside material of the utility model and outside, improve the inside radiating effect of the utility model, avoid when using for a long time, lead to the heat to accumulate in the inside of the utility model, make the utility model discloses stable and good transmission effect has in long-time use;
2. the utility model discloses a be equipped with the pull rod, and the stopper is located the inside of first copper foil layer and second copper foil layer respectively, and then makes and strains each other between first adhesive layer, first polyimide thin layer, low dielectric constant layer, second polyimide thin layer, the second adhesive layer, when avoiding long time to use, breaks away from each other between the different materials, prolongs the utility model discloses a life.
Drawings
Fig. 1 is a front sectional view of the present invention.
Fig. 2 is a schematic view of the structure of the first copper foil layer of the present invention.
Fig. 3 is a schematic structural diagram of the low-k dielectric layer according to the present invention.
Fig. 4 is a schematic view of the structure of the middle pull rod of the present invention.
In the figure: 1. a first copper foil layer; 2. a first adhesive layer; 3. a first polyimide film layer; 4. a low dielectric constant layer; 5. a second polyimide film layer; 6. a second adhesive layer; 7. a second copper foil layer; 8. a first through hole; 9. a first heat dissipation hole; 10. a second through hole; 11. a pull rod; 12. a second heat dissipation hole; 13. a connecting rod; 14. and a limiting block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a as shown in fig. 1-4 two-sided flexible copper-clad plate of low dielectric constant, including first copper foil layer 1, the lower surface pasting fixed mounting of first copper foil layer 1 has first adhesive layer 2, the lower surface pasting fixed mounting of first adhesive layer 2 has first polyimide thin layer 3, the lower surface of first polyimide thin layer 3 is equipped with low dielectric constant layer 4, the lower surface of low dielectric constant layer 4 is equipped with second polyimide thin layer 5, first polyimide thin layer 3 and second polyimide thin layer 5 all process the high temperature imine and handle, the lower surface pasting fixed mounting of second polyimide thin layer 5 has second adhesive layer 6, the lower surface pasting of second adhesive layer 6 installs second copper foil layer 7, first through-hole 8 has evenly been seted up with the upper surface of second copper foil layer 7 to first louvre copper foil layer 1, first through-hole 9 has evenly been seted up with the upper surface of second copper foil layer 7 between first through-hole 8 Second through holes 10 are uniformly formed in the upper surfaces of the first adhesive layer 2, the first polyimide film layer 3, the low dielectric constant layer 4, the second polyimide film layer 5 and the second adhesive layer 6, the first through hole 8 is communicated with the second through hole 10, the diameter of the upper end of the first through hole 8 is larger than that of the second through hole 10, the first through hole 8 is of a T-shaped structure, the diameter of the lower end of the first through hole 8 is the same as that of the second through hole 10, a pull rod 11 is embedded in the second through hole 10, the upper end and the lower end of the pull rod 11 respectively extend into the first through hole 8 in the upper surfaces of the first copper foil layer 1 and the second copper foil layer 7, second heat dissipation holes 12 are uniformly formed between the upper surfaces of the first adhesive layer 2, the first polyimide film layer 3, the low dielectric constant layer 4, the second polyimide film layer 4 and the second adhesive layer 5, and the first heat dissipation holes 9 are vertically communicated with the second heat dissipation holes 12, and the diameters of the first heat dissipation hole 9 and the second heat dissipation hole 12 are the same.
As shown in fig. 4, the pull rod 11 includes a connecting rod 13 and a stopper 14, the stoppers 14 are respectively fixed at two ends of the connecting rod 13, the connecting rod 13 and the stopper 14 are both cylindrical structures, the diameter of the connecting rod 13 is the same as that of the second through hole 10, the diameter of the stopper 14 is the same as that of one end of the first through hole 8, and the height of the stopper 14 is half of that of the first through hole 8.
This practical theory of operation: the utility model has the advantages that the first heat dissipation holes 9 are uniformly arranged on the first copper foil layer 1 and the second copper foil layer 7, the second heat dissipation holes 12 are uniformly arranged on the first adhesive layer 2, the first polyimide film layer 3, the low dielectric constant layer 4, the second polyimide film layer 5 and the second adhesive layer 6, and the first heat dissipation holes 9 are communicated with the second heat dissipation holes 12, so that when the utility model is used for a long time, the heat generated by the utility model can be conveniently dissipated outside through the first heat dissipation holes 9 and the second heat dissipation holes 12, the heat is prevented from being accumulated in the utility model, and further the utility model is prevented from generating the change of the dielectric constant due to the change of the internal temperature, the transmission effect of the utility model is influenced, and the first polyimide film layer 3 and the second polyimide film layer 5 in the utility model are all treated by high temperature imine, and then the numerical value of effectual first polyimide thin layer of reduction 3 and the dielectric constant of second polyimide thin layer 5, the utility model discloses a be equipped with pull rod 11, and stopper 14's both ends are located the inside of first copper foil layer 1 and second copper foil layer 7 respectively, connecting rod 13 is located first adhesive layer 2, first polyimide thin layer 3, low dielectric constant layer 4, the inside of second polyimide thin layer 5 and second adhesive layer 6, and then make first adhesive layer 2, first polyimide thin layer 3, low dielectric constant layer 4, take-up each other between second polyimide thin layer 5 and the second adhesive layer 6, avoid when using for a long time, the utility model discloses in break away from each other between the different materials, prolong the utility model discloses a life.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. The utility model provides a two-sided flexible copper-clad plate of low dielectric constant, includes first copper foil layer (1), its characterized in that: the lower surface of the first copper foil layer (1) is fixedly adhered with a first adhesive layer (2), the lower surface of the first adhesive layer (2) is fixedly adhered with a first polyimide film layer (3), the lower surface of the first polyimide film layer (3) is provided with a low dielectric constant layer (4), the lower surface of the low dielectric constant layer (4) is provided with a second polyimide film layer (5), the lower surface of the second polyimide film layer (5) is fixedly adhered with a second adhesive layer (6), the lower surface of the second adhesive layer (6) is adhered with a second copper foil layer (7), first through holes (8) are uniformly formed in the upper surfaces of the first copper foil layer (1) and the second copper foil layer (7), first heat dissipation holes (9) are uniformly formed between the first through holes (8) and the upper surface of the first copper foil layer (1) and the second copper foil layer (7), second through holes (10) are uniformly formed in the upper surfaces of the first adhesive layer (2), the first polyimide film layer (3), the low dielectric constant layer (4), the second polyimide film layer (5) and the second adhesive layer (6), pull rods (11) are embedded in the second through holes (10), the upper ends and the lower ends of the pull rods (11) respectively extend into the first through holes (8) in the upper surfaces of the first copper foil layer (1) and the second copper foil layer (7), and second heat dissipation holes (12) are uniformly formed between the second through holes (10) in the upper surfaces of the first adhesive layer (2), the first polyimide film layer (3), the low dielectric constant layer (4), the second polyimide film layer (5) and the second adhesive layer (6).
2. The low-dielectric-constant double-sided flexible copper-clad plate according to claim 1, wherein: the first through hole (8) is communicated with the second through hole (10), and the diameter of the upper end of the first through hole (8) is larger than that of the second through hole (10).
3. The low-dielectric-constant double-sided flexible copper-clad plate according to claim 1, wherein: the first heat dissipation hole (9) is vertically communicated with the second heat dissipation hole (12), and the diameters of the first heat dissipation hole (9) and the second heat dissipation hole (12) are the same.
4. The low-dielectric-constant double-sided flexible copper-clad plate according to claim 1, wherein: the first polyimide film layer (3) and the second polyimide film layer (5) are both subjected to high-temperature imine treatment.
5. The low-dielectric-constant double-sided flexible copper-clad plate according to claim 1, wherein: the first through hole (8) is of a T-shaped structure, and the diameter of one end of the first through hole (8) is the same as that of the second through hole (10).
6. The low-dielectric-constant double-sided flexible copper-clad plate according to claim 1, wherein: pull rod (11) are including connecting rod (13) and stopper (14), stopper (14) are fixed respectively the both ends of connecting rod (13), just connecting rod (13) with stopper (14) are cylindrical structure, the diameter of connecting rod (13) with the diameter of second through-hole (10) is the same, the diameter of stopper (14) with the diameter of first through-hole (8) one end is the same.
7. The low-dielectric-constant double-sided flexible copper-clad plate according to claim 6, wherein: the height of the limiting block (14) is half of the height of the first through hole (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202020312520.7U CN211942401U (en) | 2020-03-13 | 2020-03-13 | Low-dielectric-constant double-sided flexible copper-clad plate |
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| CN202020312520.7U CN211942401U (en) | 2020-03-13 | 2020-03-13 | Low-dielectric-constant double-sided flexible copper-clad plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113147147A (en) * | 2021-03-23 | 2021-07-23 | 林州市诚雨电子材料有限公司 | Device and method for manufacturing double-sided flexible copper-clad plate |
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- 2020-03-13 CN CN202020312520.7U patent/CN211942401U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113147147A (en) * | 2021-03-23 | 2021-07-23 | 林州市诚雨电子材料有限公司 | Device and method for manufacturing double-sided flexible copper-clad plate |
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