CN216466640U - Perfluoro alkenyl ether copolymer flexible copper-clad plate with low dielectric loss - Google Patents
Perfluoro alkenyl ether copolymer flexible copper-clad plate with low dielectric loss Download PDFInfo
- Publication number
- CN216466640U CN216466640U CN202122934449.3U CN202122934449U CN216466640U CN 216466640 U CN216466640 U CN 216466640U CN 202122934449 U CN202122934449 U CN 202122934449U CN 216466640 U CN216466640 U CN 216466640U
- Authority
- CN
- China
- Prior art keywords
- plate
- copper
- substrate
- ether copolymer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model provides a perfluoro-vinyl ether copolymer flexible copper-clad plate with low dielectric loss, which relates to the technical field of copper-clad plates and comprises a substrate, wherein the upper surface of the substrate is coated with a high-molecular low-dielectric layer, the interior of a copper foil laminated plate is fixedly connected with a heat conducting rod, the bottom end of the heat conducting rod sequentially penetrates through the copper foil laminated plate, a curing plate and the substrate, the lower surface of the substrate is connected with a heat conducting fin in a gluing way, and the upper surface of the copper foil laminated plate, close to the heat conducting rod, is connected with a heat radiation patch in a gluing way. According to the utility model, a large amount of heat generated during the operation of the substrate is transferred through the heat conducting rods, and is dissipated through the heat radiation patches on the surface of the copper-clad plate, so that the heat dissipation effect of the copper-clad plate is improved, and the phenomenon that the material of the internal substrate is deformed or even damaged by heating is further reduced; meanwhile, the high-molecular low-dielectric layer raw material is low-dielectric latex, and a small amount of low-dielectric high-molecular material is used to meet the requirement of low transmission loss required by high-frequency materials.
Description
Technical Field
The utility model relates to the technical field of copper-clad plates, in particular to a perfluoro alkenyl ether copolymer flexible copper-clad plate with low dielectric loss.
Background
Due to the miniaturization requirement of electronic products and equipment, the perfluoro-alkenyl ether copolymer flexible copper-clad plate with low dielectric loss is increasingly used for electronic and electric equipment such as NPC antenna transmission, automobile radar sensors, 5G communication, AI intelligence and internet terminal equipment. The perfluoro alkenyl ether copolymer flexible copper clad laminate with small dielectric loss will occupy more and more markets in future electronic printed circuit boards. The copper clad laminate is also called a base material, and is a plate-shaped material which is formed by soaking a reinforcing material in resin, covering one side or two sides of the reinforcing material with copper foil and performing hot pressing, and is called a copper clad laminate.
If the application number is: CN202023255845.5 provides a copper-clad plate with high peeling strength, which comprises a substrate film, wherein the top and the bottom of the substrate film are respectively provided with an adhesive A and an adhesive B, the top and the bottom of the adhesive A and the adhesive B are respectively provided with a glass fiber layer and wood pulp paper, the top and the bottom of the glass fiber layer and the wood pulp paper are respectively provided with an adhesive C and an adhesive D, the top and the bottom of the adhesive C and the adhesive D are respectively provided with a copper foil A and a copper foil B, and the peripheries of the copper foil A and the copper foil B are wrapped with peeling resistant frames; however, in the above technical scheme, the copper-clad plate can generate a large amount of heat when the copper-clad plate works as a circuit board, and the substrate is wrapped by the layer, the heat generated inside can not be dissipated, after the service life is long, the material of the inner substrate is easily subjected to thermal deformation or even damage because of the continuous influence of high temperature, and most of the surfaces of the existing copper-clad plate lack the material for reducing dielectric loss, so that certain influence is brought to the use of the copper-clad plate, and the adaptation of the technical scheme is improved.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a perfluoro vinyl ether copolymer flexible copper-clad plate with low dielectric loss, which can effectively solve the problems in the background technology.
In order to achieve the purpose, the utility model adopts the technical scheme that:
the perfluoro alkene ether copolymer flexible copper-clad plate that dielectric loss is little, which comprises a substrate, the upper surface of base plate all has the low dielectric polymer layer of polymer coating, the lower surface of base plate has perfluoro alkene ether copolymer layer of coating still, the upper end veneer of base plate is connected with the curing plate, the hot pressfitting of the upper surface of curing plate has the copper foil laminated board, the inside fixedly connected with heat conduction pole of copper foil laminated board, curing plate and base plate are run through in proper order to the bottom of heat conduction pole, the lower surface veneer of base plate is connected with the conducting strip, the upper surface veneer that copper foil laminated board is close to the heat conduction pole is connected with the heat radiation paster.
Preferably, the middle part of the heat radiation patch is fixedly connected with the heat conducting rod, and the upper surface of the copper foil laminated plate is further connected with an antioxidant plate in a gluing mode.
Preferably, the inner portion of the upper surface of the substrate is provided with a fixing groove.
Preferably, the two fixing grooves are symmetrical with the center of the substrate, and the fixing blocks are tightly abutted to the inside of the fixing grooves.
Preferably, the upper end of the fixing block is fixedly connected with the lower surface of the curing plate.
Compared with the prior art, the utility model has the following beneficial effects:
the heat conducting rod adopts silicone grease as a raw material, the silicone grease has good heat dissipation performance, the heat radiation patch adopts graphene as a raw material, the graphene can conduct heat to conduct certain diffusion, a large amount of heat generated during the operation of the substrate is transferred through the heat conducting rod, after the heat is conveyed to the heat conducting rod by the heat conducting fins in the curing plate and the copper foil laminated plate, the heat is radiated out through the heat radiation patch on the surface of the copper-clad plate, the internal part of the copper-clad plate can be kept at a normal and stable temperature all the time, the heat radiation effect of the copper-clad plate is improved, the copper-clad plate can work for a long time, and the phenomenon that the material of the internal substrate is deformed by heating or even damaged is further reduced; meanwhile, the raw material of the high-molecular low-dielectric layer is low-dielectric latex, the coating thickness of the layer is small, and the low transmission loss required by the high-frequency material is low by using a small amount of low-dielectric high-molecular material.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a perfluoroolefin ether copolymer flexible copper-clad plate with low dielectric loss according to the utility model;
FIG. 2 is a schematic diagram of a substrate connection structure of the perfluoroolefin ether copolymer flexible copper-clad plate with low dielectric loss;
FIG. 3 is an enlarged structural schematic diagram of the perfluorinated vinyl ether copolymer flexible copper-clad plate with low dielectric loss at the position A;
FIG. 4 is an enlarged structural schematic diagram of the perfluorinated vinyl ether copolymer flexible copper-clad plate with low dielectric loss at the position B.
In the figure: 1. a substrate; 2. fixing grooves; 3. a fixed block; 4. curing the plate; 5. a heat conducting rod; 6. a copper foil laminate; 7. a heat radiation patch; 8. an oxidation resistant plate; 9. a polymer low dielectric layer; 10. a heat conductive sheet; 11. a layer of a perfluoroalkylene ether copolymer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
As shown in fig. 1-4, the little perfluoro vinyl ether copolymer flexible copper-clad plate of dielectric loss, including base plate 1, base plate 1's upper surface all coats polymer low dielectric layer 9, base plate 1's lower surface still coats perfluoro vinyl ether copolymer layer 11, base plate 1's upper end veneer is connected with curing plate 4, curing plate 4's upper surface hot pressfitting has copper foil laminate 6, copper foil laminate 6's inside fixedly connected with heat conduction pole 5, copper foil laminate 6 is run through in proper order to heat conduction pole 5's bottom, curing plate 4 and base plate 1, base plate 1's lower surface veneer is connected with heat conduction piece 10, copper foil laminate 6 is close to heat conduction pole 5's upper surface veneer and is connected with heat radiation paster 7.
The middle part of the heat radiation patch 7 is fixedly connected with the heat conducting rod 5, and the upper surface of the copper foil laminated plate 6 is also connected with an antioxidant plate 8 in a gluing way. The upper surface of the substrate 1 is provided with a fixing groove 2. The two fixing grooves 2 are symmetrical with the center of the substrate 1, and the fixing blocks 3 are tightly propped against the inside of the fixing grooves 2. The upper end of the fixed block 3 is fixedly connected with the lower surface of the curing plate 4, it needs to be explained that firstly, the copper foil laminated plate 6 adopts pure copper as raw material, the antioxidant plate 4 adopts epoxy resin as raw material, the epoxy resin has good inoxidizability, the substrate 1 adopts synthetic fiber cloth as raw material, the curing plate 4 adopts glass fiber paper with resin glued on the surface as raw material, the glass fiber paper has higher hardness, the hardness of the copper clad plate is increased, the curing plate 4 is glued and connected on both sides of the substrate 1, the surface of the copper foil laminated plate 6 can be effectively prevented from being oxidized after long use, and the service life is prolonged;
the heat conducting rod 5 adopts silicone grease as a raw material, the silicone grease has good heat dissipation performance, the heat radiation patch 7 adopts graphene as a raw material, the graphene can conduct heat out, the heat conducting sheet 7 adopts heat conducting rubber as a raw material, the heat conducting rubber has good insulation performance, heat generated during the operation of the substrate 1 is transferred through the heat conducting rod 5, the heat conducting sheets 7 in the substrate 1, the curing plate 4 and the copper foil laminated plate 6 convey the heat into the heat conducting rod 5, the heat is dissipated through the heat radiation patch 7 on the surface of the copper clad plate, normal temperature can be kept inside the copper clad plate all the time, the copper clad plate can work for a long time, the service life of the copper clad plate is prolonged, the heat dissipation effect of the copper clad plate is improved, and the phenomenon that the material of the internal substrate is deformed by heating or even damaged is reduced;
meanwhile, the raw material of the high-molecular low-dielectric layer is low-dielectric latex, the coating thickness of the layer is small, and the low transmission loss required by the high-frequency material is low by using a small amount of low-dielectric high-molecular material. The layer 11 of the perfluoroalkylene ether copolymer has heat resistance and oxidation stability, and the perfluoropolyether oil is nonflammable, but when used after being exposed to air, gradually decomposes at temperatures exceeding 400 ℃. In the oxidation stability test, extremely high exothermic temperatures were produced after decomposition, which did not have the ether properties at all. Chemical stability, perfluoropolyether oils are stable to highly corrosive acids, bases, oxidants, etc., even at high temperatures. The compound has slight instability tendency to organic alkali and Lewis acid, which is the common characteristic of perfluoropolyether and the defect of ether bond position. However, at normal temperature, the decomposition is promoted only by the metallic sodium and the liquid ammonia, and besides, the liquid ammonia is stable to all other chemicals.
The working principle of the perfluoro vinyl ether copolymer flexible copper-clad plate with low dielectric loss is as follows:
firstly, pure copper is adopted as a raw material of a copper foil laminated plate 6, epoxy resin is adopted as a raw material of an antioxidant plate 4, the epoxy resin has good inoxidizability, a synthetic fiber cloth is adopted as a raw material of a substrate 1, glass fiber paper with resin glued on the surface is adopted as a raw material of a curing plate 4, the hardness of the glass fiber paper is high, the hardness of a copper-clad plate is increased, and the curing plate 4 is glued and connected on both sides of the substrate 1, so that the surface of the copper foil laminated plate 6 can be effectively prevented from being oxidized after the use time is long;
the heat conducting rod 5 adopts silicone grease as a raw material, the silicone grease has good heat dissipation performance, the heat radiation patch 7 adopts graphene as a raw material, the graphene can conduct heat out, the heat conducting sheet 7 adopts heat conducting rubber as a raw material, the heat conducting rubber has good insulation performance, heat generated during the operation of the substrate 1 is transferred through the heat conducting rod 5, the heat conducting sheets 7 in the substrate 1, the curing plate 4 and the copper foil laminated plate 6 convey the heat into the heat conducting rod 5, the heat is dissipated through the heat radiation patch 7 on the surface of the copper clad plate, normal temperature can be kept inside the copper clad plate all the time, the copper clad plate can work for a long time, the service life of the copper clad plate is prolonged, the heat dissipation effect of the copper clad plate is improved, and the phenomenon that the material of the internal substrate is deformed by heating or even damaged is reduced; meanwhile, the raw material of the high-molecular low-dielectric layer is low-dielectric latex, the coating thickness of the layer is small, and the low transmission loss required by the high-frequency material is low by using a small amount of low-dielectric high-molecular material.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (5)
1. The perfluoro vinyl ether copolymer flexible copper-clad plate with small dielectric loss comprises a substrate (1), and is characterized in that: the upper surface of base plate (1) all coats polymer low dielectric layer (9), the lower surface of base plate (1) still coats perfluor alkene ether copolymer layer (11), the upper end veneer of base plate (1) is connected with curing plate (4), the hot pressfitting of the upper surface of curing plate (4) has copper foil laminated board (6), the inside fixedly connected with heat conduction pole (5) of copper foil laminated board (6), the bottom of heat conduction pole (5) runs through copper foil laminated board (6), curing plate (4) and base plate (1) in proper order, the lower surface veneer of base plate (1) is connected with conducting strip (10), the upper surface veneer that copper foil laminated board (6) are close to heat conduction pole (5) is connected with heat radiation paster (7).
2. The perfluoroolefin ether copolymer flexible copper-clad plate with low dielectric loss according to claim 1, characterized in that: the middle part of the heat radiation patch (7) is fixedly connected with the heat conducting rod (5), and the upper surface of the copper foil laminated board (6) is also connected with an antioxidant board (8) in a gluing mode.
3. The perfluoroolefin ether copolymer flexible copper-clad plate with low dielectric loss according to claim 1, characterized in that: the inner part of the upper surface of the substrate (1) is provided with a fixing groove (2).
4. The perfluoroolefin ether copolymer flexible copper-clad plate with low dielectric loss according to claim 3, characterized in that: the two fixing grooves (2) are symmetrical with the center of the substrate (1), and the fixing blocks (3) are tightly abutted to the inside of the fixing grooves (2).
5. The perfluoroolefin ether copolymer flexible copper-clad plate with low dielectric loss according to claim 4, characterized in that: the upper end of the fixing block (3) is fixedly connected with the lower surface of the curing plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122934449.3U CN216466640U (en) | 2021-11-26 | 2021-11-26 | Perfluoro alkenyl ether copolymer flexible copper-clad plate with low dielectric loss |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122934449.3U CN216466640U (en) | 2021-11-26 | 2021-11-26 | Perfluoro alkenyl ether copolymer flexible copper-clad plate with low dielectric loss |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216466640U true CN216466640U (en) | 2022-05-10 |
Family
ID=81400481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122934449.3U Active CN216466640U (en) | 2021-11-26 | 2021-11-26 | Perfluoro alkenyl ether copolymer flexible copper-clad plate with low dielectric loss |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216466640U (en) |
-
2021
- 2021-11-26 CN CN202122934449.3U patent/CN216466640U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108045022B (en) | LCP (liquid crystal display) or fluorine polymer high-frequency high-transmission double-sided copper foil substrate and FPC (flexible printed circuit) | |
| CN207772540U (en) | LCP or fluorine system polymer high frequency high-transmission Double-sided copper clad laminate and FPC | |
| CN108012414B (en) | High-frequency high-transmission FPC with FRCC and preparation method | |
| TWM556457U (en) | Flexible gum-coating copper foil substrate having composite lamination structure | |
| CN111844976B (en) | Polyimide-fluoropolymer insulating composite material, preparation method and application thereof | |
| CN206840863U (en) | Combined type LCP high-frequency high-speed Double-sided copper clad laminates | |
| WO2018107924A1 (en) | Flexible circuit board and preparation method, and solar photovoltaic assembly | |
| CN207744230U (en) | Combined type fluorine system polymer high frequency high-transmission Double-sided copper clad laminate and FPC | |
| CN216466640U (en) | Perfluoro alkenyl ether copolymer flexible copper-clad plate with low dielectric loss | |
| CN108307579B (en) | Low dielectric loss FRCC substrate with composite stacking structure and preparation method thereof | |
| JP3238674U (en) | New material layer structure manufacturing method for wiring board and its product | |
| JP2004195776A (en) | Laminated film for built-up wiring board and built-up wiring board | |
| TW201930076A (en) | High-frequency high-transmission double-sided copper foil substrate, composite material for flexible printed circuit board and production method thereof | |
| CN110740566A (en) | high-thermal-conductivity metal-based double-sided copper-based copper-clad plate and preparation process thereof | |
| CN110677978A (en) | Printed circuit board and manufacturing method thereof | |
| TW201932292A (en) | Double-sided copper foil substrate with fluorine polymer and high frequency and high transmission characteristics and the preparation method thereof and composite | |
| CN211942401U (en) | Low-dielectric-constant double-sided flexible copper-clad plate | |
| CN210328139U (en) | Waterproof flexible circuit board | |
| CN110062520A (en) | Combined type fluorine system polymer high frequency high-transmission Double-sided copper clad laminate and preparation method | |
| CN102065634A (en) | LED high-frequency aluminum-based circuit board | |
| CN110366309B (en) | FPC (flexible printed circuit) and technology based on high-frequency FRCC (frequency division multiplexing) and FCCL (frequency division multiplexing) single panel | |
| CN211378346U (en) | Novel flexible printed copper paste circuit board | |
| CN210609859U (en) | Aluminum-based copper-clad laminate without reinforced dielectric layer | |
| CN214592122U (en) | Ceramic-based high-frequency circuit board | |
| CN215835594U (en) | Photocuring aluminum sheet with organic coating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |