CN216466571U - High-thermal-conductivity metal-based double-sided copper-based copper-clad plate - Google Patents
High-thermal-conductivity metal-based double-sided copper-based copper-clad plate Download PDFInfo
- Publication number
- CN216466571U CN216466571U CN202122869164.6U CN202122869164U CN216466571U CN 216466571 U CN216466571 U CN 216466571U CN 202122869164 U CN202122869164 U CN 202122869164U CN 216466571 U CN216466571 U CN 216466571U
- Authority
- CN
- China
- Prior art keywords
- copper
- metal substrate
- conductive copper
- conductive
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model provides a high-thermal-conductivity metal-based double-sided copper-based copper-clad plate, which relates to the technical field of copper-clad plates and comprises a metal substrate, wherein a plurality of wavy grooves and connecting through holes are formed in the metal substrate, conductive groups are arranged on two sides of the metal substrate and comprise a first conductive copper plate and a second conductive copper plate, a connecting rod is fixedly connected to one side of the first conductive copper plate, a wavy convex block is fixedly connected to one side of the second conductive copper plate, a plurality of glue storage grooves are formed in the wavy convex block, a first thermal-conductivity silica gel layer and a second thermal-conductivity silica gel layer are respectively and fixedly connected to one sides, far away from the metal substrate, of the first conductive copper plate and the second conductive copper plate, a first insulating layer and a second insulating layer are respectively arranged on one sides, far away from the metal substrate, of the first conductive copper plate and the connecting rod, The metal substrate and the second conductive copper plate are connected, so that the overall tensile resistance and strength of the copper-clad plate can be improved.
Description
Technical Field
The utility model relates to the technical field of copper-clad plates, in particular to a high-thermal-conductivity metal-based double-sided copper-based copper-clad plate.
Background
The printed circuit board-PCB board is made of copper clad laminate, which is composed of base plate, copper foil and adhesive, and the printed circuit boards with different forms and different functions are made into different printed circuits by selectively processing, etching, drilling and copper plating on the copper clad laminate.
The copper-clad plate mainly plays roles of interconnection, conduction, insulation and support for the printed circuit board, and has great influence on the transmission speed, energy loss, characteristic impedance and the like of signals in the circuit, so that the performance, quality, processability in manufacturing, manufacturing level, manufacturing cost, long-term reliability and stability of the printed circuit board are greatly dependent on the copper-clad plate.
Most of copper-clad plates in the prior art have the problems of poor tensile resistance and poor thermal conductivity, and can cause the copper-clad plates to have the conditions of cracks, high heat and the like in the using process, so that the use of equipment is seriously influenced, and therefore, the copper-clad plates are improved, and the high-thermal-conductivity metal-based double-sided copper-based copper-clad plate is provided.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a high-thermal-conductivity metal-based double-sided copper-based copper-clad plate which can effectively solve the problems in the background technology.
In order to achieve the purpose, the utility model adopts the technical scheme that:
high heat conduction metal-based double-sided copper-based copper-clad plate, including the metal substrate, a plurality of wave recesses and connect the through-hole have been seted up to metal substrate inside, the metal substrate both sides are provided with electrically conductive group, electrically conductive group is including first electrically conductive copper and second electrically conductive copper, a plurality of connect the recess have been seted up respectively to one side that metal substrate was kept away from to first electrically conductive copper and second electrically conductive copper, one side fixedly connected with protecting frame and a plurality of connecting rod that first electrically conductive copper is close to the metal substrate, one side fixedly connected with a plurality of wave lugs that second electrically conductive copper is close to the metal substrate, a plurality of glue storage tank have been seted up respectively to wave lug inside, a plurality of connect the jack have been seted up to one side that second electrically conductive copper is close to the metal substrate, the spread groove has been seted up to second electrically conductive copper edge all around, one side that metal substrate was kept away from to first electrically conductive copper and second electrically conductive copper is fixedly connected with first heat conduction silica gel layer and second heat conduction silica gel layer respectively The first heat-conducting silica gel layer and the second heat-conducting silica gel layer are respectively provided with a plurality of connecting lugs at one side close to the metal substrate, and a first insulating layer and a second insulating layer are respectively arranged at one side of the first heat-conducting silica gel layer and one side of the second heat-conducting silica gel layer far away from the metal substrate.
Preferably, the protective frame is located at the edge of the first conductive copper plate, and the connecting rod is located inside the protective frame.
Preferably, the connecting through hole, the connecting jack and the connecting rod are arranged correspondingly, and the wave lug is arranged correspondingly to the wave groove.
Preferably, the wave lug is sleeved inside the wave groove, and the inner wall of the connecting jack is attached to the outer side face of the metal substrate.
Preferably, the connection parts of the first conductive copper plate and the second conductive copper plate and the metal substrate are coated with flame-retardant epoxy adhesives, and the connecting rod penetrates through the connecting through hole and then penetrates inside the connecting jack.
Preferably, the connecting rod is fixedly connected with the inner walls of the connecting through holes and the connecting jacks through flame-retardant epoxy adhesives.
Preferably, the protection frame and the connecting groove are arranged correspondingly, and one side of the protection frame, which is close to the metal substrate, is attached to the connecting groove.
Compared with the prior art, the utility model has the following beneficial effects:
(1) the first conductive copper plate is provided with the wavy bump and is connected with the wavy groove in the metal substrate, and the first conductive copper plate, the metal substrate and the second conductive copper plate are connected through the connecting rod, so that the overall tensile resistance and strength of the copper-clad plate are improved, and the copper-clad plate is more reliable to use;
(2) through set up heat conduction silica gel layer respectively in first electrically conductive copper and the electrically conductive copper outside of second, and be connected through connecting the lug, can play the heat conduction well effect to two electrically conductive copper, through at the fire-retardant epoxy gluing agent of metal substrate both sides and inside coating, can effectively improve the security of copper-clad plate.
Drawings
FIG. 1 is an exploded view of the overall structure of a high thermal conductivity metal-based double-sided copper-based copper-clad plate according to the present invention;
FIG. 2 is a schematic diagram of a top view structure of the high thermal conductivity metal-based double-sided copper-based copper-clad plate of the present invention;
FIG. 3 is a schematic view of the section A-A in FIG. 2 of the high thermal conductivity metal-based double-sided copper-based copper-clad plate of the present invention;
FIG. 4 is a schematic view of a partial structure of a first conductive copper plate in the high thermal conductivity metal-based double-sided copper-based copper-clad plate of the utility model;
FIG. 5 is a schematic view of a partial structure of a second conductive copper plate in the high thermal conductivity metal-based double-sided copper-based copper-clad plate of the utility model.
In the figure: 1. a metal substrate; 2. a conductive group; 3. a first heat-conducting silica gel layer; 4. a second heat-conducting silica gel layer; 5. a first insulating layer; 6. a second insulating layer; 7. a connection bump; 101. a wave groove; 102. a connecting through hole; 201. a first conductive copper plate; 202. a second conductive copper plate; 2011. a connecting groove; 2012. a protective frame; 2013. a connecting rod; 2021. connecting the jacks; 2022. a wave projection; 2023. connecting grooves; 2024. glue storage tank.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
As shown in fig. 1-5, the high thermal conductivity metal-based double-sided copper-based copper-clad plate comprises a metal substrate 1, a plurality of wave-shaped grooves 101 and connecting through holes 102 are formed in the metal substrate 1, conductive groups 2 are arranged on two sides of the metal substrate 1, each conductive group 2 comprises a first conductive copper plate 201 and a second conductive copper plate 202, a plurality of connecting grooves 2011 are formed in one sides of the first conductive copper plate 201 and the second conductive copper plate 202 away from the metal substrate 1, a protective frame 2012 and a plurality of connecting rods 2013 are fixedly connected to one side of the first conductive copper plate 201 close to the metal substrate 1, a plurality of wave-shaped protrusions 2022 are fixedly connected to one side of the second conductive copper plate 202 close to the metal substrate 1, a plurality of glue storage grooves 2024 are formed in the wave-shaped protrusions 2022, a plurality of connecting jacks 2021 are formed in one side of the second conductive copper plate 202 close to the metal substrate 1, connecting grooves 2023 are formed in the peripheral edges of the second conductive copper plate 202, one side of the first conductive copper plate 201 and one side of the second conductive copper plate 202 far away from the metal substrate 1 are fixedly connected with a first heat-conducting silica gel layer 3 and a second heat-conducting silica gel layer 4 respectively, one side of the first heat-conducting silica gel layer 3 and one side of the second heat-conducting silica gel layer 4 near the metal substrate 1 are provided with a plurality of connecting convex blocks 7 respectively, and one side of the first heat-conducting silica gel layer 3 and one side of the second heat-conducting silica gel layer 4 far away from the metal substrate 1 are provided with a first insulating layer 5 and a second insulating layer 6 respectively.
In this embodiment, the protective frame 2012 is located at the edge of the first conductive copper plate 201, the connecting rod 2013 is located inside the protective frame 2012, through setting up a plurality of connecting grooves 2011 on one side of the first conductive copper plate 201 and the second conductive copper plate 202 and setting up the corresponding connecting bump 7 on the corresponding surface of the first conductive silica gel layer 3 and the second conductive silica gel layer 4, the connection between the first conductive silica gel layer 3 and the second conductive silica gel layer 4 and the first conductive copper plate 201 and the second conductive copper plate 202 can be more compact, the degree of adhesion is enhanced, through setting up the first conductive silica gel layer 3 and the second conductive silica gel layer 4, the metal substrate 1 can be realized, the heat dissipation effect can be realized on the first conductive copper plate 201 and the second conductive copper plate 202, and the copper-clad plate has good heat dissipation performance.
In this embodiment, the connection through hole 102, the connection jack 2021, and the connection rod 2013 are disposed correspondingly, and the wave protrusion 2022 is disposed correspondingly to the wave groove 101.
In this embodiment, the wavy bump 2022 is disposed inside the wavy groove 101, and the inner wall of the connection socket 2021 is attached to the outer side surface of the metal substrate 1.
In this embodiment, the joints of the first conductive copper plate 201 and the second conductive copper plate 202 and the metal substrate 1 are coated with the flame-retardant epoxy adhesive, and the connecting rod 2013 penetrates through the connecting through hole 102 and then penetrates through the connecting jack 2021, wherein the oxygen index of the epoxy adhesive reaches 29.6%, and is greatly improved compared with 20% of pure epoxy resin, and reaches the standard of 27% of flame-retardant material, so that the safety of the copper-clad plate can be effectively improved.
In this embodiment, the connecting rod 2013 is fixedly connected to the inner walls of the connecting through hole 102 and the connecting jack 2021 through a flame-retardant epoxy adhesive.
In this embodiment, the protective frame 2012 is disposed corresponding to the connecting groove 2023, and one side of the protective frame 2012 close to the metal substrate 1 is attached to the connecting groove 2023.
When specifically setting up, through setting up connect the via hole 102 and the jack 2021 for metal substrate 1 and the inside epoxy adhesive that can pour into of the electrically conductive copper of second 202 ensure that connecting rod 2013 is connected closely with connect the via hole 102 and jack 2021, through setting up wave groove 101 and glue storage tank 2024, can ensure that wave lug 2022 and wave groove 101 inner wall are connected closely, and then improve the compactness that first electrically conductive copper 201, the electrically conductive copper of second 202 and metal substrate 1 are connected.
It should be noted that the wavy groove 101 and the connecting through hole 102 formed inside the metal substrate 1 can also play a good role in heat dissipation, and the wavy bump 2022 is arranged inside the wavy groove 101, so that not only the second conductive copper plate 202 is more firmly connected with the metal substrate 1, but also the overall tensile strength of the copper-clad plate can be improved, and by arranging the protective frame 2012 and the connecting groove 2023 to be correspondingly connected, the metal substrate 1 can be well fixed between the first conductive copper plate 201 and the second conductive copper plate 202, and the metal substrate 1 can be protected.
The working principle of the high-thermal-conductivity metal-based double-sided copper-based copper-clad plate is as follows:
during processing, firstly, flame-retardant epoxy adhesives are uniformly coated on two sides of a metal substrate 1, then a second conductive copper plate 202 and a first conductive copper plate 201 are correspondingly attached to two sides of the metal substrate 1 respectively, so that a wave lug 2022 is positioned inside a wave groove 101, a connecting rod 2013 penetrates through a connecting through hole 102 and then is fixed inside a connecting jack 2021, then the first conductive copper plate 201, the metal substrate 1 and the second conductive copper plate 202 are pressed, then a first heat-conducting silica gel layer 3 and a second heat-conducting silica gel layer 4 are respectively attached to the outer sides of the first conductive copper plate 201 and the second conductive copper plate 202, so that a connecting lug 7 is positioned inside a connecting groove 2011 respectively, finally a first insulating layer 5 and a second insulating layer 6 are respectively attached to the outer sides of the first heat-conducting silica gel layer 3 and the second heat-conducting silica gel layer 4, and when the copper-clad laminate is used, the wave lug 2022 arranged on the second conductive copper plate 202 can enable the copper-clad laminate to have good tensile property, the connecting rod 2013 arranged on the first conductive copper plate 201 penetrates through the metal substrate 1 and is connected to the second conductive copper plate 202, so that the copper-clad plate has high strength, and the performance of the copper-clad plate is better.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (7)
1. High heat conduction metal-based double-sided copper-based copper-clad plate, including metal substrate (1), its characterized in that: the metal substrate is characterized in that a plurality of wavy grooves (101) and connecting through holes (102) are formed in the metal substrate (1), conductive groups (2) are arranged on two sides of the metal substrate (1), each conductive group (2) comprises a first conductive copper plate (201) and a second conductive copper plate (202), a plurality of connecting grooves (2011) are formed in one sides, far away from the metal substrate (1), of the first conductive copper plates (201) and the second conductive copper plates (202), a protective frame (2012) and a plurality of connecting rods (2013) are fixedly connected to one sides, close to the metal substrate (1), of the first conductive copper plates (201), a plurality of wavy convex blocks (2022) are fixedly connected to one sides, close to the metal substrate (1), of the second conductive copper plates (202), a plurality of glue storage grooves (2024) are formed in the wavy convex blocks (2022), a plurality of connecting jacks (2021) are formed in one side, close to the metal substrate (1), of the second conductive copper plates (202), the edge has seted up spread groove (2023) all around in second electrically conductive copper (202), one side that metal substrate (1) was kept away from in first electrically conductive copper (201) and second electrically conductive copper (202) is first heat conduction silica gel layer (3) of fixedly connected with and second heat conduction silica gel layer (4) respectively, one side that metal substrate (1) was close to in first heat conduction silica gel layer (3) and second heat conduction silica gel layer (4) is provided with a plurality of connecting convex blocks (7) respectively, one side that metal substrate (1) was kept away from in first heat conduction silica gel layer (3) and second heat conduction silica gel layer (4) is provided with first insulating layer (5) and second insulating layer (6) respectively.
2. The high thermal conductivity metal-based double-sided copper-based copper-clad plate according to claim 1, characterized in that: the protective frame (2012) is located at the edge of the first conductive copper plate (201), and the connecting rod (2013) is located inside the protective frame (2012).
3. The high thermal conductivity metal-based double-sided copper-based copper-clad plate according to claim 1, characterized in that: the connecting through hole (102), the connecting jack (2021) and the connecting rod (2013) are arranged correspondingly, and the wave lug (2022) and the wave groove (101) are arranged correspondingly.
4. The high thermal conductivity metal-based double-sided copper-based copper-clad plate according to claim 1, characterized in that: the wave lug (2022) is sleeved inside the wave groove (101), and the inner wall of the connecting jack (2021) is attached to the outer side surface of the metal substrate (1).
5. The high thermal conductivity metal-based double-sided copper-based copper-clad plate according to claim 1, characterized in that: the connection part of the first conductive copper plate (201) and the second conductive copper plate (202) and the metal substrate (1) is coated with flame-retardant epoxy adhesive, and the connecting rod (2013) penetrates through the connecting through hole (102) and then penetrates through the connecting jack (2021).
6. The high thermal conductivity metal-based double-sided copper-based copper-clad plate according to claim 5, characterized in that: the connecting rod (2013) is fixedly connected with the inner walls of the connecting through hole (102) and the connecting jack (2021) through flame-retardant epoxy adhesives.
7. The high thermal conductivity metal-based double-sided copper-based copper-clad plate according to claim 1, characterized in that: the protective frame (2012) and the connecting groove (2023) are arranged correspondingly, and one side, close to the metal substrate (1), of the protective frame (2012) is attached to the connecting groove (2023).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122869164.6U CN216466571U (en) | 2021-11-22 | 2021-11-22 | High-thermal-conductivity metal-based double-sided copper-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122869164.6U CN216466571U (en) | 2021-11-22 | 2021-11-22 | High-thermal-conductivity metal-based double-sided copper-based copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216466571U true CN216466571U (en) | 2022-05-10 |
Family
ID=81397781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122869164.6U Active CN216466571U (en) | 2021-11-22 | 2021-11-22 | High-thermal-conductivity metal-based double-sided copper-based copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216466571U (en) |
-
2021
- 2021-11-22 CN CN202122869164.6U patent/CN216466571U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN216466571U (en) | High-thermal-conductivity metal-based double-sided copper-based copper-clad plate | |
| CN206686441U (en) | A kind of flexible PCB radiator structure and wearable device | |
| CN203219607U (en) | High-heat-conduction flexible LED lead plate | |
| CN110740566A (en) | high-thermal-conductivity metal-based double-sided copper-based copper-clad plate and preparation process thereof | |
| CN215121297U (en) | Copper-clad plate with holes and of multilayer composite structure | |
| CN214046155U (en) | Copper-clad plate based on spraying integrated structure | |
| CN211942401U (en) | Low-dielectric-constant double-sided flexible copper-clad plate | |
| CN210807782U (en) | Substrate heat dissipation substrate structure | |
| CN209748885U (en) | High-oxidation-resistance copper substrate | |
| CN214774489U (en) | Copper-clad plate capable of rapidly dissipating heat | |
| CN219107758U (en) | Low-thickness aluminum-based copper-clad laminate | |
| CN216217701U (en) | High-hardness anti-fracture high-power circuit board | |
| CN215041049U (en) | High-flame-retardant heat-resistant copper-clad plate | |
| CN215704667U (en) | High CTI copper-clad plate | |
| CN214125627U (en) | Copper-clad plate with heat dissipation structure | |
| CN212266903U (en) | High-voltage-resistant high-thermal-conductivity aluminum-based copper-clad plate | |
| CN211606921U (en) | Stable in structure's multilayer circuit board | |
| CN214046152U (en) | Copper-clad plate with cold spraying bonding pad structure | |
| CN215345227U (en) | Multilayer circuit board with non-porous surface | |
| CN214046156U (en) | Copper-clad plate with die-casting forming structure | |
| CN220535124U (en) | Low-water-absorption copper-clad plate | |
| CN215096045U (en) | Copper-clad plate based on curved surface substrate molding | |
| CN215871979U (en) | High-temperature-resistant flexible circuit board | |
| CN213907018U (en) | Anti-static circuit board | |
| CN215835594U (en) | Photocuring aluminum sheet with organic coating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |