CN215041049U - High-flame-retardant heat-resistant copper-clad plate - Google Patents
High-flame-retardant heat-resistant copper-clad plate Download PDFInfo
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- CN215041049U CN215041049U CN202022940854.1U CN202022940854U CN215041049U CN 215041049 U CN215041049 U CN 215041049U CN 202022940854 U CN202022940854 U CN 202022940854U CN 215041049 U CN215041049 U CN 215041049U
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Abstract
The utility model discloses a high fire-retardant heat-resistant copper-clad plate, which comprises a substrate, the top of base plate is provided with the heat-conducting layer, the heat-conducting layer includes heat conduction silica gel, heat conduction silica gel fixed connection is in the top of base plate, heat conduction silica gel's top fixedly connected with waterproof board, thermal-insulated chamber has been seted up to the inside of waterproof board, the inside of waterproof board just is located to run through between the thermal-insulated chamber and is provided with the enhancement post, the top fixedly connected with insulation board of waterproof board. The utility model discloses a cooperation of base plate, heat conduction silica gel, waterproof board, enhancement post, thermal-insulated chamber, insulation board, reinforcing plate, heat-resisting board, fire-retardant board, copper foil and fire retardant coating is used, possesses the heat-resisting advantage of high fire-retardant, has solved the fire-retardant heat resistance of current copper-clad plate relatively poor, and at the in-process that uses, the heat that produces on the printed circuit board hardly distributes fast, and then can cause the operation of component on the circuit board to cause the influence, has reduced the problem of copper-clad plate practicality.
Description
Technical Field
The utility model relates to a copper-clad plate technical field specifically is a high fire-retardant heat-resisting copper-clad plate.
Background
The copper clad laminate is a plate material prepared by soaking electronic glass fiber cloth or other reinforcing materials with resin, covering one side or two sides with copper foil and hot pressing, which is called copper clad laminate for short, and various printed circuit boards with different forms and different functions are all prepared by selectively processing, etching, drilling, copper plating and other procedures on the copper clad laminate to prepare different printed circuits, mainly play the roles of interconnection, insulation and support for the printed circuit boards, and have great influence on the transmission speed, energy loss, characteristic impedance and the like of signals in the circuits, therefore, the performance, quality, processability, manufacturing level, manufacturing cost, long-term reliability and stability of the printed circuit boards are greatly dependent on the copper clad laminate.
The existing copper-clad plate has poor flame-retardant and heat-resistant performance, and heat generated on a printed circuit board is difficult to rapidly dissipate in the using process, so that the operation of elements on the circuit board is influenced, and the practicability of the copper-clad plate is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high fire-retardant heat-resistant copper-clad plate possesses the high fire-retardant heat-resistant advantage, and it is relatively poor to have solved the fire-retardant heat resistance of current copper-clad plate, and at the in-process that uses, the heat that produces on the printed circuit board hardly gives off fast, and then can cause the operation of component to cause the influence on the circuit board, has reduced the problem of copper-clad plate practicality.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high fire-retardant heat-resistant copper-clad plate, includes the base plate, the top of base plate is provided with the heat-conducting layer, the heat-conducting layer includes heat-conducting silica gel, heat-conducting silica gel fixed connection is in the top of base plate, heat-conducting silica gel's top fixedly connected with waterproof board, thermal-insulated chamber has been seted up to the inside of waterproof board, the inside of waterproof board just is located to run through between the thermal-insulated chamber and is provided with the enhancement post, the top fixedly connected with insulation board of waterproof board, the top of heat-conducting layer is provided with the inoxidizing coating, the inoxidizing coating includes the reinforcing plate, reinforcing plate fixed connection is in the top of insulation board, the top fixedly connected with heat-resistant plate of reinforcing plate, the fire-retardant board of top fixedly connected with of heat-resistant plate, the top of inoxidizing coating is provided with fire-retardant coating.
Preferably, the reinforcing column is made of 304-grade stainless steel, the copper foil is coated on the top of the flame-retardant plate, and the insulating plate is a PET plate.
Preferably, the copper foil coats the top of fire-retardant board, the reinforcing plate is the nylon panel, the heat-resistant board is whole aromatic acyl inferior resin, fire-retardant board is fibre reinforced silicate fire prevention board.
Preferably, the copper foil and the flame-retardant plate are bonded through a box adhesive, and the thickness of the fireproof coating is 3mm-5 mm.
Preferably, the top and the bottom of the reinforcing column are respectively contacted with the top of the heat-conducting silica gel and the bottom of the insulating plate.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a cooperation of base plate, heat conduction silica gel, waterproof board, enhancement post, thermal-insulated chamber, insulation board, reinforcing plate, heat-resisting board, fire-retardant board, copper foil and fire retardant coating is used, possesses the heat-resisting advantage of high fire-retardant, has solved the fire-retardant heat resistance of current copper-clad plate relatively poor, and at the in-process that uses, the heat that produces on the printed circuit board hardly distributes fast, and then can cause the operation of component on the circuit board to cause the influence, has reduced the problem of copper-clad plate practicality.
2. The utility model discloses a heat conduction silica gel's use, have excellent cold and hot alternation resistance, ageing-resistant performance and electrical insulation performance, use through the waterproof board, it is high to have intensity, the extensibility can be better, the deformation modulus is big, acid and alkali-resistance, it is anticorrosive, characteristics such as ageing-resistant and anti-seepage performance are good, use through strengthening post and reinforcing plate, can improve the compressive property of copper-clad plate, use through thermal-insulated chamber, can effectively completely cut off the temperature, avoid the base plate overheated, use through the insulation board, sliding property has, wear strength and electrical insulation are good characteristics, use through heat-resistant board and fire-retardant board, can play heat-resisting fire-retardant effect, avoid the copper-clad plate to appear because of the high temperature condition of warping.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional structural view of the heat-conducting layer of the present invention;
fig. 3 is a cross-sectional view of the protective layer of the present invention.
In the figure: the heat-conducting heat-insulating plate comprises a base plate 1, a heat-conducting layer 2, heat-conducting silica gel 21, a waterproof plate 22, a reinforcing column 23, a heat-insulating cavity 24, an insulating plate 25, a protective layer 3, a reinforcing plate 31, a heat-resistant plate 32, a flame-retardant plate 33, copper foil 4 and fireproof paint 5.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a high flame-retardant heat-resistant copper-clad plate comprises a substrate 1, a heat conducting layer 2 is arranged on the top of the substrate 1, the heat conducting layer 2 comprises heat conducting silica gel 21, the heat conducting silica gel 21 has excellent cold and hot alternation resistance, aging resistance and electrical insulation performance, the heat conducting silica gel 21 is fixedly connected to the top of the substrate 1, a waterproof plate 22 is fixedly connected to the top of the heat conducting silica gel 21, and the waterproof plate 22 has the characteristics of high strength, good extensibility, large deformation modulus, acid and alkali resistance, corrosion resistance, aging resistance and good anti-seepage performance through the use of the waterproof plate 22, a heat insulation cavity 24 is formed in the waterproof plate 22, the temperature can be effectively isolated through the use of the heat insulation cavity 24, the substrate 1 is prevented from overheating, a reinforcing column 23 is arranged in the waterproof plate 22 and positioned between the heat insulation cavities 24, and an insulating plate 25 is fixedly connected to the top of the waterproof plate 22, through the use of the insulating plate 25, the copper-clad plate has the characteristics of good sliding property, wear resistance and electrical insulation, the protective layer 3 is arranged at the top of the heat conducting layer 2, the protective layer 3 comprises the reinforcing plate 31, the compressive property of the copper-clad plate can be improved through the use of the reinforcing columns 23 and the reinforcing plate 31, the reinforcing plate 31 is fixedly connected to the top of the insulating plate 25, the heat-resistant plate 32 is fixedly connected to the top of the reinforcing plate 31, the flame-retardant plate 33 is fixedly connected to the top of the heat-resistant plate 32, through the use of the heat-resistant plate 32 and the flame-retardant plate 33, the heat-resistant flame-retardant effect can be achieved, the situation that the copper-clad plate deforms due to high temperature is avoided, the copper foil 4 is arranged at the top of the protective layer 3, and the fireproof paint 5 is coated at the top of the copper foil 4;
the reinforcing column 23 is made of 304-grade stainless steel, the copper foil 4 is coated on the top of the flame-retardant plate 33, and the insulating plate 25 is a PET plate;
the copper foil 4 is coated on the top of the flame retardant board 33, the reinforcing board 31 is a nylon board, the heat-resistant board 32 is wholly aromatic imide, and the flame retardant board 33 is a fiber reinforced silicate fireproof board;
the copper foil 4 and the flame-retardant plate 33 are bonded through a box bonding agent, and the thickness of the fireproof coating 5 is 3mm-5 mm;
the top and the bottom of the reinforcing column 23 are respectively contacted with the top of the heat-conducting silica gel 21 and the bottom of the insulating plate 25;
the base plate 1, the heat-conducting silica gel 21, the waterproof plate 22, the reinforcing column 23, the heat insulation cavity 24, the insulating plate 25, the reinforcing plate 31, the heat-resistant plate 32, the flame-retardant plate 33, the copper foil 4 and the fireproof coating 5 are matched for use, so that the high-flame-retardant and heat-resistant copper-clad plate has the advantages of high flame retardance and heat resistance, and the problems that the conventional copper-clad plate is poor in flame retardance and heat resistance, heat generated on a printed circuit board is difficult to dissipate quickly in the using process, further, the operation of elements on the circuit board is influenced, and the practicability of the copper-clad plate is reduced are solved;
when the heat-conducting silica gel composite board is used, the heat-conducting silica gel 21 has excellent cold and hot alternation resistance, aging resistance and electrical insulation performance, the waterproof board 22 has the characteristics of high strength, good extensibility, large deformation modulus, acid and alkali resistance, corrosion resistance, aging resistance, good seepage resistance and the like, the reinforcing columns 23 and the reinforcing board 31 can be used for improving the compression resistance of the copper-clad board, the heat insulation cavity 24 can be used for effectively isolating the temperature and avoiding the overheating of the base board 1, the insulating board 25 has the characteristics of good sliding performance, wear resistance and electrical insulation performance, the heat-resisting board 32 and the flame-retardant board 33 can be used for achieving the heat-resisting and flame-retardant effects and avoiding the deformation of the copper-clad board due to high temperature, and the fireproof performance of the copper-clad board is further improved by using the fireproof coating 5.
In summary, the following steps: this high fire-retardant heat-resisting copper-clad plate, through base plate 1, heat conduction silica gel 21, waterproof board 22, strengthen post 23, thermal-insulated chamber 24, insulation board 25, reinforcing plate 31, heat-resistant plate 32, fire-retardant board 33, copper foil 4 and fire retardant coating 5's cooperation is used, it is relatively poor to have solved the fire-retardant heat resistance of current copper-clad plate, at the in-process that uses, the heat that produces on the printed circuit board hardly gives off fast, and then can cause the operation of component to cause the influence on the circuit board, the problem of copper-clad plate practicality has been reduced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The copper-clad plate with high flame retardance and heat resistance comprises a substrate (1), and is characterized in that: the heat-conducting layer (2) is arranged at the top of the substrate (1), the heat-conducting layer (2) comprises heat-conducting silica gel (21), the heat-conducting silica gel (21) is fixedly connected to the top of the substrate (1), a waterproof board (22) is fixedly connected to the top of the heat-conducting silica gel (21), a heat insulation cavity (24) is formed in the waterproof board (22), a reinforcing column (23) penetrates through the waterproof board (22) and is located between the heat insulation cavities (24), an insulating board (25) is fixedly connected to the top of the waterproof board (22), a protective layer (3) is arranged at the top of the heat-conducting layer (2), the protective layer (3) comprises a reinforcing board (31), the reinforcing board (31) is fixedly connected to the top of the insulating board (25), a heat-resistant plate (32) is fixedly connected to the top of the reinforcing board (31), and a flame-retardant plate (33) is fixedly connected to the top of the heat-resistant plate (32), the top of inoxidizing coating (3) is provided with copper foil (4), fireproof paint (5) is scribbled on the top of copper foil (4).
2. The copper-clad plate with high flame retardance and heat resistance according to claim 1, is characterized in that: the reinforcing column (23) is made of 304-grade stainless steel, the copper foil (4) is coated on the top of the flame-retardant plate (33), and the insulating plate (25) is a PET plate.
3. The copper-clad plate with high flame retardance and heat resistance according to claim 1, is characterized in that: copper foil (4) coat in the top of fire-retardant board (33), reinforcing plate (31) are the nylon board, heat-resistant board (32) are aromatic acyl inferior resin, fire-retardant board (33) are fibre reinforcement silicate fire prevention board.
4. The copper-clad plate with high flame retardance and heat resistance according to claim 1, is characterized in that: the copper foil (4) and the flame-retardant plate (33) are bonded through a box bonding agent, and the thickness of the fireproof coating (5) is 3-5 mm.
5. The copper-clad plate with high flame retardance and heat resistance according to claim 1, is characterized in that: the top and the bottom of the reinforcing column (23) are respectively contacted with the top of the heat-conducting silica gel (21) and the bottom of the insulating plate (25).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022940854.1U CN215041049U (en) | 2020-12-07 | 2020-12-07 | High-flame-retardant heat-resistant copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022940854.1U CN215041049U (en) | 2020-12-07 | 2020-12-07 | High-flame-retardant heat-resistant copper-clad plate |
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| Publication Number | Publication Date |
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| CN215041049U true CN215041049U (en) | 2021-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022940854.1U Active CN215041049U (en) | 2020-12-07 | 2020-12-07 | High-flame-retardant heat-resistant copper-clad plate |
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| CN (1) | CN215041049U (en) |
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- 2020-12-07 CN CN202022940854.1U patent/CN215041049U/en active Active
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