CN110740566A - high-thermal-conductivity metal-based double-sided copper-based copper-clad plate and preparation process thereof - Google Patents
high-thermal-conductivity metal-based double-sided copper-based copper-clad plate and preparation process thereof Download PDFInfo
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- CN110740566A CN110740566A CN201910976311.4A CN201910976311A CN110740566A CN 110740566 A CN110740566 A CN 110740566A CN 201910976311 A CN201910976311 A CN 201910976311A CN 110740566 A CN110740566 A CN 110740566A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to the technical field of circuit boards, and discloses high-thermal-conductivity metal-based double-sided copper-based copper-clad plates, which comprise a metal copper plate, a protective film layer, a heat conducting layer and a copper foil layer, wherein the metal copper plate is arranged in the middle, the copper foil layer is fixedly arranged at the top and the bottom of the metal copper plate, and the heat conducting layer is fixedly arranged at the top and the bottom of the copper foil layer.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to an high-thermal-conductivity metal-based double-sided copper-based copper-clad plate and a preparation process thereof.
Background
The copper-clad plate is products which are formed by using wood pulp paper or glass fiber cloth and the like as reinforcing materials, soaking the wood pulp paper or the glass fiber cloth and the like in resin, coating copper foil on one side or two sides of the wood pulp paper or the glass fiber cloth and performing hot pressing, the copper-clad plate is a basic material of the electronic industry and is mainly used for processing and manufacturing Printed Circuit Boards (PCBs), is widely applied to electronic products such as televisions, radios, computers, mobile communication and the like, the copper-clad plate can be divided into a plurality of types according to the material of the copper-clad plate, the copper-clad plate comprises a metal-based copper-clad plate, a metal-based copper-clad plate is generally composed of a metal substrate, an insulating medium layer and a conducting layer ( is generally copper foil), and the side.
Along with the rapid development of the electronic industry, the volume size of electronic products is smaller and smaller, the power density is larger and larger, and huge challenges designed for the electronic industry are solved.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides metal-based double-sided copper-based copper-clad plates with high thermal conductivity and a preparation process thereof, which have the advantages of good thermal conductivity and good oxidation resistance, and solve the problems that the heat conductivity of the existing metal-based double-sided copper-based copper-clad plate is not outstanding, the heat of a power device cannot be dissipated timely, the use of of the metal-based double-sided copper-based copper-clad plate is greatly limited, meanwhile, the metal-based double-sided copper-based copper-clad plate is easy to oxidize, the service life of the metal-based double-sided copper-based copper-clad plate is shortened, the use cost of the metal-based double-sided copper-based copper-clad plate is improved.
In order to achieve the purposes of good heat conductivity and good oxidation resistance effect, the invention provides the following technical scheme that the high-heat-conductivity metal-based double-sided copper-based copper-clad plate comprises a metal copper plate, a protective film layer, a heat conduction layer and a copper foil layer, wherein the metal copper plate is arranged in the middle position, the copper foil layer is fixedly arranged at the top and the bottom of the metal copper plate, the heat conduction layer is fixedly arranged at the top and the bottom of the copper foil layer, and the protective film layer is fixedly arranged at the top and the bottom of the heat conduction layer.
Preferably, a glue layer is coated between the metal copper plate and the copper foil layer, the glue layer is heat-conducting glue, the heat-conducting glue takes organic silica gel as a main body, and silica gel is formed by mixing polymer materials such as fillers, heat-conducting materials and the like.
Preferably, the metal copper plate, the copper foil layer and the heat conduction layer are all sheet-like structures, and the thickness of the copper foil layer is between 35 and 280 mu m.
Preferably, the core heat conducting component of the heat conducting layer is composed of a combination of aluminum oxide and silicon powder and a polymer filled with epoxy resin.
Preferably, the protective film layer is composed of a polymer insulating material and a copper surface antioxidant, the copper surface antioxidant and copper atoms form covalent bonds and coordination bonds by utilizing organic acid, the covalent bonds and the coordination bonds are replaced by chain polymers, and a multilayer protective film is formed on the surface of copper, so that the surface of copper is free from oxidation-reduction reaction and hydrogen, and the effect of preventing oxidation is achieved.
The invention aims to solve another technical problem of providing a preparation process of high-thermal-conductivity metal-based double-sided copper-based copper-clad plates, which comprises the following steps:
1) preparing a heat conduction layer, namely putting 5-10 parts of aluminum oxide and 8-12 parts of silicon powder into a stirrer for stirring and mixing, then adding epoxy resin into the stirrer and continuously stirring for 20-30min, and finally curing the materials to form the heat conduction layer, wherein the curing temperature of the heat conduction layer is 50-70 ℃;
2) taking a metal copper plate, cutting the metal copper plate according to the specification of , and then processing the metal copper plate in a form of '3% dilute sulfuric acid + grinding brush';
3) coating heat-conducting glue on the upper side and the lower side of the metal copper plate treated in the step 2), so that the copper foil layer and the metal copper plate are bonded at ;
4) taking the heat conduction layer prepared in the step 1), hot-pressing and melting the heat conduction layer, coating the heat conduction layer on the upper side and the lower side of the copper foil layer, and curing;
5) and sequentially coating the upper side and the lower side of the heat conducting layer with a high-molecular insulating material and a copper surface antioxidant, so that a protective film layer is formed on the upper side and the lower side of the heat conducting layer, and finally the high-heat-conductivity metal-based double-sided copper-based copper-clad plate is prepared.
Compared with the prior art, the invention provides high-thermal-conductivity metal-based double-sided copper-based copper-clad plates and a preparation process thereof, and the copper-clad plates have the following beneficial effects:
1. according to the high-thermal-conductivity metal-based double-sided copper-based copper-clad plate and the preparation process thereof, the heat-conducting glue has excellent cold and hot alternation resistance, aging resistance and electric insulation performance, excellent moisture resistance, shock resistance, corona resistance, electric leakage resistance and chemical medium resistance, can be continuously used at-60-280 ℃, can maintain the performance, does not swell, has good adhesion to most of metals and non-metallic materials, has small thermal resistance (0.15) and excellent viscoelastic performance by being provided with the heat-conducting layer, has thermal aging resistance, can bear mechanical and thermal stress, can greatly improve the thermal conductivity of the metal-based double-sided copper-based copper-clad plate by adding the heat-conducting glue and the heat-conducting layer, can quickly dissipate the heat of an electronic device when being used together with the electronic device, and is beneficial to pushing of the metal-based double-sided copper-based copper-clad plate.
2. The high-heat-conductivity metal-based double-sided copper-based copper-clad plate and the preparation process thereof are characterized in that a copper surface antioxidant is added, and 3% of dilute sulfuric acid and grinding treatment are adopted, so that the original oxide layer on the surface of the metal copper plate can be removed by the 3% of dilute sulfuric acid and grinding treatment, and the copper surface antioxidant is coated to ensure that the surface of the metal copper plate is reformed into oxidation protection.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only partial embodiments of of the present invention, rather than all embodiments.
high-thermal-conductivity metal-based double-sided copper-based copper-clad plate comprises a metal copper plate, a protective film layer, a heat conduction layer and a copper foil layer, wherein the metal copper plate is arranged in the middle, the copper foil layer is fixedly arranged at the top and the bottom of the metal copper plate, a glue layer is coated between the metal copper plate and the copper foil layer and is a heat conduction glue, the heat conduction glue is silica gel formed by mixing organic silica gel and high-molecular materials such as fillers and heat conduction materials, the silica gel has excellent heat conduction performance (heat dissipation performance), the cured heat conduction coefficient [ W/(m.k) ] reaches 1.1-1.5, a high-guaranteed heat dissipation coefficient is provided for electronic products, the stable guarantee effect of the electronic products (particularly high-heat dissipation products) in the using process is achieved, the service performance and service life of the products are improved, the high-electrical insulation performance and heat conduction performance, aging resistance, cold-heat alternation resistance, moisture expansion resistance, electrical insulation performance, power recession rate, shock resistance, water resistance, vibration absorption resistance and vibration absorption resistance are improved, the adhesion strength of the electronic products in the use process is excellent, the high-safety adhesive performance of the high-insulating copper foil layer, the high-insulating plastic has excellent adhesive-resistant performance, the high-insulating film layer, the high-resistant adhesive-insulating material, the high-resistant adhesive-insulating material, the high-resistant adhesive-insulating material is more-resistant adhesive-.
Example 1
preparation process of high-thermal-conductivity metal-based double-sided copper-based copper-clad plate, comprising the following steps:
1) preparing a heat conducting layer, namely putting 7.5 parts of aluminum oxide and 10 parts of silicon powder into a stirrer for stirring and mixing, then adding epoxy resin into the stirrer and continuously stirring for 25 min, and finally curing the materials to form the heat conducting layer, wherein the curing temperature of the heat conducting layer is 60 ℃;
2) taking a metal copper plate, cutting the metal copper plate according to the specification of , and then processing the metal copper plate in a form of '3% dilute sulfuric acid + grinding brush';
3) coating heat-conducting glue on the upper side and the lower side of the metal copper plate treated in the step 2), so that the copper foil layer and the metal copper plate are bonded at ;
4) taking the heat conduction layer prepared in the step 1), hot-pressing and melting the heat conduction layer, coating the heat conduction layer on the upper side and the lower side of the copper foil layer, and curing;
5) and sequentially coating the upper side and the lower side of the heat conducting layer with a high-molecular insulating material and a copper surface antioxidant, so that a protective film layer is formed on the upper side and the lower side of the heat conducting layer, and finally the high-heat-conductivity metal-based double-sided copper-based copper-clad plate is prepared.
Example 2
preparation process of high-thermal-conductivity metal-based double-sided copper-based copper-clad plate, comprising the following steps:
1) preparing a heat conducting layer, namely putting 5 parts of aluminum oxide and 8 parts of silicon powder into a stirrer for stirring and mixing, then adding epoxy resin into the stirrer and continuing stirring for 20min, and finally curing the materials to form the heat conducting layer, wherein the curing temperature of the heat conducting layer is 50 ℃;
2) taking a metal copper plate, cutting the metal copper plate according to the specification of , and then processing the metal copper plate in a form of '3% dilute sulfuric acid + grinding brush';
3) coating heat-conducting glue on the upper side and the lower side of the metal copper plate treated in the step 2), so that the copper foil layer and the metal copper plate are bonded at ;
4) taking the heat conduction layer prepared in the step 1), hot-pressing and melting the heat conduction layer, coating the heat conduction layer on the upper side and the lower side of the copper foil layer, and curing;
5) and sequentially coating the upper side and the lower side of the heat conducting layer with a high-molecular insulating material and a copper surface antioxidant, so that a protective film layer is formed on the upper side and the lower side of the heat conducting layer, and finally the high-heat-conductivity metal-based double-sided copper-based copper-clad plate is prepared.
Example 3
preparation process of high-thermal-conductivity metal-based double-sided copper-based copper-clad plate, comprising the following steps:
1) preparing a heat conducting layer, namely putting 10 parts of aluminum oxide and 12 parts of silicon powder into a stirrer for stirring and mixing, then adding epoxy resin into the stirrer and continuing stirring for 30min, and finally curing the materials to form the heat conducting layer, wherein the curing temperature of the heat conducting layer is 70 ℃;
2) taking a metal copper plate, cutting the metal copper plate according to the specification of , and then processing the metal copper plate in a form of '3% dilute sulfuric acid + grinding brush';
3) coating heat-conducting glue on the upper side and the lower side of the metal copper plate treated in the step 2), so that the copper foil layer and the metal copper plate are bonded at ;
4) taking the heat conduction layer prepared in the step 1), hot-pressing and melting the heat conduction layer, coating the heat conduction layer on the upper side and the lower side of the copper foil layer, and curing;
5) and sequentially coating the upper side and the lower side of the heat conducting layer with a high-molecular insulating material and a copper surface antioxidant, so that a protective film layer is formed on the upper side and the lower side of the heat conducting layer, and finally the high-heat-conductivity metal-based double-sided copper-based copper-clad plate is prepared.
The high-heat-conduction metal-based double-sided copper-based copper-clad plate and the preparation process thereof have the advantages that the high-heat-conduction metal-based double-sided copper-based copper-clad plate and the preparation process thereof have excellent cold and hot alternation resistance, aging resistance and electric insulation performance, excellent moisture resistance, shock resistance, corona resistance, electric leakage resistance and chemical medium resistance by adding heat-conduction glue, can be continuously used at-60-280 ℃ and maintain the performance, do not swell and have good adhesion to most metals and non-metallic materials, the heat-conduction layer is small in heat conduction resistance (0.15) by arranging the heat-conduction layer, has excellent performance, has thermal aging resistance and can bear mechanical and thermal stress, the heat-conduction performance of the metal-based double-sided copper-based copper-clad plate can be greatly improved by adding the heat-conduction glue and the heat-conduction layer, can quickly dissipate the heat of an electronic device when being matched with an electronic device, the heat-conduction layer is favorable for pushing the copper-based double-sided copper-clad plate , the copper-based anti-oxidation copper-plate can be easily protected by adding a copper-oxidation-copper-oxidation-copper-oxidation-copper-plate, the anti-oxidation-copper-oxidation-copper-oxidation-copper-oxidation-copper-oxidation-copper-oxidation-copper-oxidation-copper-oxidation-copper-plate can be used for-copper.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
- The high-thermal-conductivity metal-based double-sided copper-based copper-clad plate is characterized by comprising a metal copper plate, a protection film layer, a heat-conducting layer and a copper foil layer, wherein the metal copper plate is arranged at the middle position, the copper foil layer is fixedly arranged at the top and the bottom of the metal copper plate, the heat-conducting layer is fixedly arranged at the top and the bottom of the copper foil layer, and the protection film layer is fixedly arranged at the top and the bottom of the heat-conducting layer.
- 2. The high-thermal-conductivity metal-based double-sided copper-based copper-clad plate according to claim 1, wherein an adhesive layer is coated between the copper plate and the copper foil layer, the adhesive layer is a thermal conductive adhesive, the thermal conductive adhesive is a silica gel prepared by mixing organic silica gel as a main body with polymer materials such as filler and thermal conductive material.
- 3. The high thermal conductivity metal-based double-sided copper-based copper-clad plate of claim 1, wherein the copper metal plate, the copper foil layer and the thermal conductive layer are all in a sheet-like structure, and the thickness of the copper foil layer is between 35 μm and 280 μm.
- 4. The high thermal conductivity metal-based double-sided copper-based copper-clad plate of claim 1, wherein the core thermal conductive component of the thermal conductive layer is composed of a combination of aluminum oxide and silicon powder and a polymer filled with epoxy resin.
- 5. The high thermal conductivity metal-based double-sided copper-based copper-clad plate of claim 1, wherein the protective film layer is composed of a polymer insulating material and a copper-based antioxidant, the copper-based antioxidant forms covalent bonds and coordination bonds with copper atoms by organic acids, and replaces the covalent bonds and coordination bonds with each other to form chain polymers, and a multilayer protective film is formed on the copper surface, so that the copper surface does not undergo redox reaction and hydrogen, thereby playing a role of preventing oxidation.
- 6, preparation technology of high heat conduction metal base double-sided copper base copper-clad plate, which is characterized by comprising the following steps:1) preparing a heat conduction layer, namely putting 5-10 parts of aluminum oxide and 8-12 parts of silicon powder into a stirrer for stirring and mixing, then adding epoxy resin into the stirrer and continuing stirring for 20-30min, and finally curing the materials to form the heat conduction layer, wherein the curing temperature of the heat conduction layer is 50-70 ℃;2) taking a metal copper plate, cutting the metal copper plate according to the specification of , and then processing the metal copper plate in a form of '3% dilute sulfuric acid + grinding brush';3) coating heat-conducting glue on the upper side and the lower side of the metal copper plate treated in the step 2), so that the copper foil layer and the metal copper plate are bonded at ;4) taking the heat conduction layer prepared in the step 1), hot-pressing and melting the heat conduction layer, coating the heat conduction layer on the upper side and the lower side of the copper foil layer, and curing;5) and sequentially coating the upper side and the lower side of the heat conducting layer with a high-molecular insulating material and a copper surface antioxidant, so that a protective film layer is formed on the upper side and the lower side of the heat conducting layer, and finally the high-heat-conductivity metal-based double-sided copper-based copper-clad plate is prepared.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910976311.4A CN110740566A (en) | 2019-10-15 | 2019-10-15 | high-thermal-conductivity metal-based double-sided copper-based copper-clad plate and preparation process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910976311.4A CN110740566A (en) | 2019-10-15 | 2019-10-15 | high-thermal-conductivity metal-based double-sided copper-based copper-clad plate and preparation process thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112512223A (en) * | 2020-12-15 | 2021-03-16 | 深圳市瀚鼎电路电子有限公司 | Circuit forming method of circuit board |
| CN114928935A (en) * | 2022-04-28 | 2022-08-19 | 江苏诺德新材料股份有限公司 | High-heat-conductivity ultra-thick copper-based copper-clad plate and manufacturing method thereof |
-
2019
- 2019-10-15 CN CN201910976311.4A patent/CN110740566A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112512223A (en) * | 2020-12-15 | 2021-03-16 | 深圳市瀚鼎电路电子有限公司 | Circuit forming method of circuit board |
| CN112512223B (en) * | 2020-12-15 | 2022-12-27 | 深圳市瀚鼎电路电子有限公司 | Circuit forming method of circuit board |
| CN114928935A (en) * | 2022-04-28 | 2022-08-19 | 江苏诺德新材料股份有限公司 | High-heat-conductivity ultra-thick copper-based copper-clad plate and manufacturing method thereof |
| CN114928935B (en) * | 2022-04-28 | 2024-01-26 | 江苏诺德新材料股份有限公司 | High-heat-conductivity type ultra-thick copper-based copper-clad plate and manufacturing method thereof |
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Application publication date: 20200131 |