CN103192577A - High-thermal-conductivity copper-clad plate manufacturing method - Google Patents
High-thermal-conductivity copper-clad plate manufacturing method Download PDFInfo
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- CN103192577A CN103192577A CN2013101497394A CN201310149739A CN103192577A CN 103192577 A CN103192577 A CN 103192577A CN 2013101497394 A CN2013101497394 A CN 2013101497394A CN 201310149739 A CN201310149739 A CN 201310149739A CN 103192577 A CN103192577 A CN 103192577A
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Abstract
The invention discloses a high-thermal-conductivity copper-clad plate manufacturing method. The method comprises the following steps of: treating three fillers, namely aluminum nitride, magnesium oxide and aluminum oxide, by utilizing a surface treating agent; by mass, evenly stirring 20-60% of epoxy resin, 5-20% of aluminum nitride, 10-35% of magnesium oxide, 20-45% of aluminum oxide, 1-10% of curing agent and 1-5% of accelerant with a right amount of solvent to form liquid state; coating a glass cloth with the prepared mixture, drying the glass cloth into a film, electrolyzing copper foil on one or both sides of the film, and performing hot press molding to get the product. In the method, the inorganic filling material with higher heat conductivity coefficient is used for partially replacing the resin component with lower heat conductivity coefficient, so as to improve the heat dissipation effect; various heat conductivity coefficients and various grain sizes are mixed and matched, so that the corrosion resistance and thermal performance of the product are improved greatly, the aims of simplifying operations to the high-thermal conductivity copper-clad plate and lowering the cost of the high-thermal conductivity copper-clad plate can be realized, and the reliability of electronic products is improved.
Description
Technical field
What the present invention relates to is a kind of method for manufacturing cover clad laminate, in particular a kind of highly heat-conductive copper-clad plate preparation method.
Background technology
(Copper Clad Laminate is that electronics glass cloth or other reinforcing material are soaked with resin CCL) to the used copper-clad laminate of printed circuit board (PCB), and one side or two-sided coated with Copper Foil and a kind of board-like material of making through hot pressing abbreviates copper-clad plate as.The printed circuit board of various multi-form, difference in functionalitys, all be in copper-clad plate, process selectively, operation such as etching, boring and copper facing, make different printed circuits.Printed circuit board is mainly played interconnection, insulation and support, transmission speed, energy loss and characteristic impedance etc. to signal in the circuit have very big influence, therefore, the processability in the performance of printed circuit board, quality, the manufacturing, manufacture level, manufacturing cost and long-term reliability and stability depend on copper-clad plate to a great extent.
Electronic product can generate heat under long-term work in a large number, if the untimely heat that leaves, function has the risk of inefficacy.At present, in the copper-clad plate field, mainly adopt the Metal Substrate copper-clad plate to reach the purpose of quick heat radiating, existing metal substrate is not corrosion-resistant, production efficiency is low, cost is high.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of highly heat-conductive copper-clad plate preparation method is provided, realize anticorrosive rapid heat dissipation, reduce the cost simultaneously.
The present invention is achieved by the following technical solutions, the present invention includes following steps:
(1) use surface conditioning agent that aluminium nitride, magnesia, three kinds of fillers of aluminium oxide are handled;
(2) by mass, epoxy resin 20～60%, aluminium nitride 5～20%, magnesia 10～35%, aluminium oxide 20～45%, curing agent 1～10%, promoter 1～5% and an amount of stirring solvent are evenly become liquid;
(3) mixture that step (2) is made is coated in and is dried into film on the glass cloth, and one or both sides stick electrolytic copper foil, hot-forming getting final product.
As one of optimal way of the present invention, in the described step (1), surface conditioning agent is the silanes surface conditioning agent.
As one of optimal way of the present invention, in the described step (2), curing agent is phenolic resins.
As one of optimal way of the present invention, in the described step (2), promoter is tertiary amines promoter.
The present invention has the following advantages compared to existing technology: the present invention uses the higher inorganic filling material of thermal conductivity factor, and part substitutes the lower resin composition of thermal conductivity factor, to improve radiating effect; And adopt the mode of multiple thermal conductivity factor, multiple particle size mix and match, and significantly improve the corrosion-resistant and hot property of product, can realize the purpose that high heat radiation copper-clad plate simplifies the operation, reduces cost, thereby improve the reliability of electronic product.
The specific embodiment
Below embodiments of the invention are elaborated, present embodiment is being to implement under the prerequisite with the technical solution of the present invention, provided detailed embodiment and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
Embodiment 1
The preparation method of present embodiment highly heat-conductive copper-clad plate may further comprise the steps:
(1) use surface conditioning agent that aluminium nitride, magnesia, three kinds of fillers of aluminium oxide are handled; Surface conditioning agent is silane KH series coupling agent in the present embodiment.
(2) by mass, epoxy resin 20%, aluminium nitride 20%, magnesia 10%, aluminium oxide 40%, curing agent 5%, promoter 5% and an amount of stirring solvent are evenly become liquid, curing agent is phenolic resins, and promoter is tertiary amines promoter;
(3) mixture that step (2) is made is coated in and is dried into film on the glass cloth, and one or both sides stick electrolytic copper foil, hot-forming getting final product.
Embodiment 2
Present embodiment by mass, epoxy resin 60%, aluminium nitride 5%, magnesia 10%, aluminium oxide 20%, curing agent 2%, promoter 3%, other embodiments are identical with embodiment 1.
Embodiment 3
Present embodiment by mass, epoxy resin 40%, aluminium nitride 15%, magnesia 15%, aluminium oxide 25%, curing agent 4%, promoter 1%, other embodiments are identical with embodiment 1.
Claims (4)
1. a highly heat-conductive copper-clad plate preparation method is characterized in that, may further comprise the steps:
(1) use surface conditioning agent that aluminium nitride, magnesia, three kinds of fillers of aluminium oxide are handled;
(2) by mass, epoxy resin 20～60%, aluminium nitride 5～20%, magnesia 10～35%, aluminium oxide 20～45%, curing agent 1～10%, promoter 1～5% and an amount of stirring solvent are evenly become liquid;
(3) mixture that step (2) is made is coated in and is dried into film on the glass cloth, and one or both sides stick electrolytic copper foil, hot-forming getting final product.
2. a kind of highly heat-conductive copper-clad plate preparation method according to claim 1, it is characterized in that: in the described step (1), surface conditioning agent is the silanes surface conditioning agent.
3. a kind of highly heat-conductive copper-clad plate preparation method according to claim 1, it is characterized in that: in the described step (2), curing agent is phenolic resins.
4. a kind of highly heat-conductive copper-clad plate preparation method according to claim 1, it is characterized in that: in the described step (2), promoter is tertiary amines promoter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101497394A CN103192577A (en) | 2013-04-26 | 2013-04-26 | High-thermal-conductivity copper-clad plate manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101497394A CN103192577A (en) | 2013-04-26 | 2013-04-26 | High-thermal-conductivity copper-clad plate manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103192577A true CN103192577A (en) | 2013-07-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101497394A Pending CN103192577A (en) | 2013-04-26 | 2013-04-26 | High-thermal-conductivity copper-clad plate manufacturing method |
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| CN (1) | CN103192577A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105437673A (en) * | 2015-12-25 | 2016-03-30 | 广东生益科技股份有限公司 | Ultrathin copper clad laminate and production method thereof |
| CN105437668A (en) * | 2015-12-25 | 2016-03-30 | 广东生益科技股份有限公司 | Ultrathin copper clad laminate and production method thereof |
| CN106365507A (en) * | 2016-08-23 | 2017-02-01 | 廊坊市高瓷新材料科技有限公司 | Organic ceramic substrate composition, organic ceramic substrate, and copper-clad plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283829A (en) * | 1992-04-02 | 1993-10-29 | Matsushita Electric Works Ltd | Metal-base circuit board |
| CN101767481A (en) * | 2009-01-06 | 2010-07-07 | 金安国纪科技股份有限公司 | Method for preparing highly heat-conductive copper-clad plate |
| CN102786771A (en) * | 2011-05-19 | 2012-11-21 | 腾辉电子（苏州）有限公司 | Resin liquid, metal substrate adopting the resin liquid, and manufacturing method of the metal substrate |
-
2013
- 2013-04-26 CN CN2013101497394A patent/CN103192577A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283829A (en) * | 1992-04-02 | 1993-10-29 | Matsushita Electric Works Ltd | Metal-base circuit board |
| CN101767481A (en) * | 2009-01-06 | 2010-07-07 | 金安国纪科技股份有限公司 | Method for preparing highly heat-conductive copper-clad plate |
| CN102786771A (en) * | 2011-05-19 | 2012-11-21 | 腾辉电子（苏州）有限公司 | Resin liquid, metal substrate adopting the resin liquid, and manufacturing method of the metal substrate |
Non-Patent Citations (1)
| Title |
|---|
| 骆光林主编: "《包装材料学（第二版）》", 31 August 2011, 印刷工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105437673A (en) * | 2015-12-25 | 2016-03-30 | 广东生益科技股份有限公司 | Ultrathin copper clad laminate and production method thereof |
| CN105437668A (en) * | 2015-12-25 | 2016-03-30 | 广东生益科技股份有限公司 | Ultrathin copper clad laminate and production method thereof |
| CN106365507A (en) * | 2016-08-23 | 2017-02-01 | 廊坊市高瓷新材料科技有限公司 | Organic ceramic substrate composition, organic ceramic substrate, and copper-clad plate |
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Application publication date: 20130710 |