CN106365507A - Organic ceramic substrate composition, organic ceramic substrate, and copper-clad plate - Google Patents
Organic ceramic substrate composition, organic ceramic substrate, and copper-clad plate Download PDFInfo
- Publication number
- CN106365507A CN106365507A CN201610710594.4A CN201610710594A CN106365507A CN 106365507 A CN106365507 A CN 106365507A CN 201610710594 A CN201610710594 A CN 201610710594A CN 106365507 A CN106365507 A CN 106365507A
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- Prior art keywords
- ceramic substrate
- organic ceramic
- organic
- substrate
- particle diameter
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Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/14—Polyepoxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/025—Particulate layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/12—Mixture of at least two particles made of different materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Abstract
The invention provides an organic ceramic substrate composition, an organic ceramic substrate, and a copper-clad plate. The organic ceramic substrate composition includes a colloid component and a ceramic powder component. The ceramic powder component includes, by weight, 1-10% of aluminum oxide being 100-500 nm in particle size, 60-90% of aluminum oxide being 1-10 [mu]m in particle size, and 0-30% of aluminum oxide being 50-100 [mu]m in particle size. By matching the aluminum oxide in different particle sizes, spatial close stacking of the aluminum oxide is achieved, so that on the basis of maintaining the original mechanical performances of the substrate, product performances, such as heat conductivity coefficient and the like, of the substrate are improved. The ceramic powder component is suitable for combinations of a colloid component and a ceramic powder component in regular ratio in the prior art.
Description
Technical field
The present invention relates to wiring board art, in particular to a kind of organic ceramic substrate in batch compound, organic ceramic substrate
And copper-clad plate.
Background technology
On Vehicles Collected from Market, copper-clad plate is broadly divided into aluminium base, resin substrate and sintered ceramic substrate three class.The hitting of aluminium base
Wear voltage low, substantially in 2kv, highest only 3kv, particularly aluminium-base plate insulating layer constrain the heat conductivility of copper-clad plate, and resistance to
Corrosivity are poor；The heat conductivility of resin substrate is poor；Sintered ceramic substrate high temperature sintering forms, energy resource consumption higher although leading
Hot property very well, but expensive, processing difficulties, plate face area are little.
At present, the copper-clad plate of organic ceramic base, as new copper-clad plate, has breakdown voltage height, good heat conductivity, is easy to machine
Tool processing characteristic.
What heat conductivity characterized is the heat conductivility of copper-clad plate, and copper-clad plate uses as the substrate of circuit board, needs in time
The heat that device is produced by ground conducts, and especially in fields such as high-power LEDs, how to improve heat conductivility always puzzlement and covers
Copper coin industry problem for many years.What breakdown voltage characterized is the ability of the resistance to power-frequency voltage flashover in short-term of copper-clad plate, for ensureing whole machine
The operation of the normal table of electronic product and use, insulated substrate can not have the generation of ion migration phenomenon.Because this
The generation of phenomenon, directly affects insulating reliability, the proof voltage of whole machine, or even short circuit between circuit lead occurs.
But, the heat conductivility of existing organic ceramic copper-clad plate and mechanical property intensity or relative low.
Content of the invention
Present invention is primarily targeted at providing a kind of organic ceramic substrate in batch compound, organic ceramic substrate and copper-clad plate,
To solve the problems, such as that in prior art, the heat conductivility of organic ceramic copper-clad plate and mechanical property are low.
To achieve these goals, according to an aspect of the invention, it is provided a kind of organic ceramic substrate in batch compound, wrap
Include gel component and ceramic powder component, by weight percentage, it is 100 that this ceramic powder component includes 1%～10% particle diameter
The aluminium oxide of～500nm, 60%～90% part of particle diameter are 1～10 μm of aluminium oxide and 0%～30% particle diameter is 50～100 μm of oxygen
Change aluminum.
Further, by weight percentage, above-mentioned ceramic powder component includes 1%～10% particle diameter is 100～500nm
Aluminium oxide, 70%～90% particle diameter is 1～10 μm of aluminium oxide and 5%～20% particle diameter is 50～100 μm of aluminium oxidies.
Further, the weight of above-mentioned gel component and ceramic powder component is than for 1:5～1:2.
Further, by weight percentage, above-mentioned gel component include 30%～60% part epoxy resin, 30%～
The firming agent of 60% part of phenolic resin and 1%～10% part.
Further, above-mentioned epoxy resin is Bisphenol-a Epoxy Resin, preferably e51 epoxy resin or e44 asphalt mixtures modified by epoxy resin
Fat.
Further, above-mentioned phenolic resin is selected from the phenolic resin that can participate in epoxy resin cure reaction, preferably pf-
5118 phenolic resin.
Further, above-mentioned firming agent is dicyandiamide, DADPS.
According to a further aspect in the invention, there is provided a kind of organic ceramic substrate, using organic ceramic substrate in batch compound system
For forming, this organic ceramic substrate in batch compound is any of the above-described kind of compositionss.
According to a further aspect in the invention, there is provided a kind of copper-clad plate, including organic ceramic substrate and Copper Foil, this organic pottery
Porcelain substrate is above-mentioned organic ceramic substrate.
Application technical scheme, is coordinated according to aforementioned proportion by the aluminium oxide of different-grain diameter, is capable of oxygen
Change aluminum tightly packed from space, on the premise of keeping substrate to have mechanical property, improve the products such as the heat conductivity of substrate
Performance.The ceramic powder component of above-mentioned composition goes for the gel component of conventional proportions and ceramic powder group in prior art
The combination dividing.
Specific embodiment
It should be noted that in the case of not conflicting, the embodiment in the application and the feature in embodiment can phases
Mutually combine.To describe the present invention below in conjunction with embodiment in detail.
As described in background technology, the heat conductivility of organic ceramic copper-clad plate of prior art and mechanical property are still inclined
Low, in order to solve this problem, this application provides a kind of organic ceramic substrate in batch compound, organic ceramic substrate and copper-clad plate.
In a kind of typical embodiment of the application, there is provided a kind of organic ceramic substrate in batch compound, including colloid group
Divide and ceramic powder component, by weight percentage, ceramic powder component includes the oxygen that 1%～10% particle diameter is 100～500nm
Changing the aluminium oxide that aluminum, 60%～90% particle diameter are 1～10 μm and 0%～30% particle diameter is 50～100 μm of aluminium oxidies.
The aluminium oxide that the application passes through different-grain diameter coordinates according to aforementioned proportion, is capable of aluminium oxide from space compact reactor
Long-pending, on the premise of keeping substrate to have mechanical property, improve the properties of product such as the heat conductivity of substrate.The pottery of above-mentioned composition
Porcelain powder body component goes for the combination of the gel component of conventional proportions and ceramic powder component in prior art.Preferably with weight
Amount percentages, ceramic powder component includes the aluminium oxide for 500nm for 1%～10% particle diameter, 60%～90% particle diameter is 5 μm
Aluminium oxide and 0%～30% particle diameter are 60 μm of aluminium oxidies.
In order to lift the heat conductivity of substrate further, preferably by weight percentage, above-mentioned ceramic powder component includes
The aluminium oxide and 5%～20% that 1%～10% particle diameter is the aluminium oxide of 100～500nm, 70%～90% particle diameter is 1～10 μm
Particle diameter is 50～100 μm of aluminium oxidies.
The ceramic powder component of above-mentioned composition goes for the gel component of conventional proportions and ceramics in prior art
The combination of body component, and the consumption of colloid can be reduced further, in the lifting heat conductivity of substrate and the base of mechanical property
On plinth, the weight of preferably above-mentioned gel component and ceramic powder component is than for 1:5～1:2.Gel component consumption is made to greatly reduce,
And then saved cost of material to a great extent.
In a kind of preferred embodiment of the application, by weight percentage, above-mentioned gel component includes 30%～60%
Epoxy resin, 30～60% phenolic resin and 1%～10% firming agent.The composition of this gel component is simple, and can
Meet the requirement improving substrate mechanical property, therefore, it is possible to save the cost of manufacture of substrate further.
The epoxy resin of the application, phenolic resin and firming agent all can adopt conventional species of the prior art, for reality
Now more preferable fiting effect and the fiting effect with ceramic powder between each composition, preferably this epoxy resin are Bisphenol A Type ring
Oxygen tree fat, more preferably e51 epoxy resin or e44 epoxy resin.Preferably phenolic resin is pf-5118.Preferably this solidification
Agent is dicyandiamide, DADPS.
In another kind of typical embodiment of the application, there is provided a kind of organic ceramic substrate, using organic ceramic base
Plate compositionss are prepared from, and this organic ceramic substrate in batch compound is combinations of the above thing.Organic ceramic substrate using the application
The heat conductivility of organic ceramic substrate that compositionss prepare and mechanical property are all significantly improved before being relatively improved, and heat conduction
Coefficient can improve substantially to 3.2w/m k, and bending strength, up to 75.14mpa, was not reduced compared with former formula.With this Shen
When compositionss please prepare organic ceramic substrate, can be implemented using conventional preparation method of the prior art, here is not
Repeat again.
In another typical embodiment in the application, there is provided a kind of copper-clad plate, including organic ceramic substrate and copper
Paper tinsel, this organic ceramic substrate is above-mentioned organic ceramic substrate.As previously described, because the heat conduction of the organic ceramic substrate of the application
Performance and mechanical property be improved significantly, then so that the copper-clad plate with this organic ceramic substrate also has higher heat conduction
Performance and mechanical property, and then improve reliability and the service life of its work.
Below with reference to embodiment and comparative example, further illustrate the beneficial effect of the application.
Embodiment 1
Organic ceramic substrate using following steps preparation embodiment 1:
(1) configure colloid: e51 epoxy resin is processed in 70 DEG C of baking ovens 20min (to reduce the viscous of e51 epoxy resin
Degree, is easy to sampling and stirs below), weigh 18g, then weigh the dicyandiamide of 20g phenolic resin and 2g, after three's mixing stirs evenly
Put into baking oven 10min to be beneficial to dicyandiamide dissolving and be uniformly dispersed；
(2) configure powder body: weigh 500nm aluminium oxide 1.6g, 5 μm of aluminium oxide 142.4g and 60 μm of aluminium oxide 16g respectively, stir
Mix 5min；
(3) rubber powder mixing: by the colloid having configured and powder body mix homogeneously in pallet, then dry in 70 DEG C of baking ovens
20min, to remove the solvent in batch mixing (solvent carrying in phenolic resin), is pulverized with pulverizer after drying, remaining big
Grain mortar is pulverized and is obtained rubber powder batch mixing completely, and measures its particle diameter distribution with laser fineness gage, and result for d50 is
164.8 μm, d90 is 470.5 μm.
(4) compressing: the big press compression molding of rubber powder batch mixing obtains model, mould upper and lower surface temperature is 35 DEG C,
Pressure 19mpa, dwell time 25s.
(5) complete to solidify: the method that the model suppressing is solidified using two-stage nitration completes to solidify in Reflow Soldering, concrete solidification
Parameter is shown in Table 1, obtains the organic ceramic substrate of embodiment 1.
Table 1
| Temperature (DEG C) | 1st area | 2nd area | 3rd area | 4th area | 5th area | 6th area |
| On | 120 | 140 | 160 | 180 | 200 | 220 |
| Under | 120 | 140 | 160 | 180 | 200 | 220 |
Embodiment 2 to 9 and comparative example 1 to 3
Preparation method is shown in Table 2 with embodiment 1, compositionss composition.
Embodiment 10 to 12
Preparation method is shown in Table 3 with embodiment 1, compositionss composition.
Detect the heat conductivity of the organic ceramic substrate of each embodiment and comparative example using tci thermal conductivity measuring apparatus, adopt
Detect the bending strength of the organic ceramic substrate of each embodiment and comparative example with electronic universal tester, testing result is shown in Table 2 Hes
3.
Table 2
Table 3
Can be seen that the application by the Data Comparison in table 2 and 3 adopts the aluminium oxide cooperation of different-grain diameter really obvious
Improve heat conductivity and the bending strength of substrate, and the cooperation of this aluminium oxide is applied to the cooperation of different gel component；With
When, the contrast of embodiment 5 and embodiment 8 is as can be seen that further by the ratio to gel component and ceramic powder component
Optimization can improve heat conductivity and the bending strength of substrate further.
As can be seen from the above description, the above embodiments of the present invention achieve following technique effect:
The aluminium oxide that the application passes through different-grain diameter coordinates according to aforementioned proportion, is capable of aluminium oxide from space compact reactor
Long-pending, on the premise of keeping substrate to have mechanical property, improve the properties of product such as the heat conductivity of substrate.The pottery of above-mentioned composition
Porcelain powder body component goes for the combination of the gel component of conventional proportions and ceramic powder component in prior art.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.All within the spirit and principles in the present invention, made any repair
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (9)
1. a kind of organic ceramic substrate in batch compound, including gel component and ceramic powder component it is characterised in that with weight percent
Ratio meter, described ceramic powder component include 1%～10% particle diameter be the aluminium oxide of 100～500nm, 60%～90% part of particle diameter be
1～10 μm of aluminium oxide and 0%～30% particle diameter are 50～100 μm of aluminium oxidies.
2. compositionss according to claim 1 it is characterised in that by weight percentage, described ceramic powder group subpackage
Include particle diameter described in 1%～10% be the aluminium oxide of 100～500nm, particle diameter described in 70%～90% be 1～10 μm aluminium oxide and
Particle diameter described in 5%～20% is 50～100 μm of aluminium oxidies.
3. compositionss according to claim 1 are it is characterised in that the weight of described gel component and described ceramic powder component
Amount ratio is 1:5～1:2.
4. it is characterised in that by weight percentage, described gel component includes compositionss according to claim 3
The firming agent of 30%～60% part of epoxy resin, 30%～60% part of phenolic resin and 1%～10% part.
5. compositionss according to claim 4 are it is characterised in that described epoxy resin is Bisphenol-a Epoxy Resin, preferably
For e51 epoxy resin or e44 epoxy resin.
6. compositionss according to claim 4 can participate in epoxy resin admittedly it is characterised in that described phenolic resin is selected from
Change the phenolic resin of reaction, preferably pf-5118 phenolic resin.
7. compositionss according to claim 4 are it is characterised in that described firming agent is dicyandiamide, DADPS.
8. a kind of organic ceramic substrate, is prepared from it is characterised in that described organic ceramic using organic ceramic substrate in batch compound
Substrate in batch compound is the compositionss any one of claim 1 to 7.
9. a kind of copper-clad plate, including organic ceramic substrate and Copper Foil it is characterised in that described organic ceramic substrate is claim
Organic ceramic substrate described in 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610710594.4A CN106365507A (en) | 2016-08-23 | 2016-08-23 | Organic ceramic substrate composition, organic ceramic substrate, and copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610710594.4A CN106365507A (en) | 2016-08-23 | 2016-08-23 | Organic ceramic substrate composition, organic ceramic substrate, and copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106365507A true CN106365507A (en) | 2017-02-01 |
Family
ID=57878980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610710594.4A Pending CN106365507A (en) | 2016-08-23 | 2016-08-23 | Organic ceramic substrate composition, organic ceramic substrate, and copper-clad plate |
Country Status (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611208A (en) * | 2017-10-12 | 2018-01-19 | 绍兴文理学院 | A kind of preparation method of heat radiating type solar cell backboard |
| CN112500031A (en) * | 2020-12-14 | 2021-03-16 | 晟大科技(南通)有限公司 | Ceramic substrate material and preparation method and application thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6855399B2 (en) * | 2002-07-17 | 2005-02-15 | Ngk Spark Plug Co., Ltd. | Copper paste and wiring board using the same |
| CN102212250A (en) * | 2011-04-15 | 2011-10-12 | 广东生益科技股份有限公司 | Filler compound and copper clad laminate made of same |
| CN103192577A (en) * | 2013-04-26 | 2013-07-10 | 铜陵浩荣电子科技有限公司 | High-thermal-conductivity copper-clad plate manufacturing method |
| CN103582564A (en) * | 2011-05-30 | 2014-02-12 | 松下电器产业株式会社 | Laminate sheet, application therefor, and method for producing same |
| CN104558689A (en) * | 2014-12-26 | 2015-04-29 | 广东生益科技股份有限公司 | Filler composition and application thereof |
-
2016
- 2016-08-23 CN CN201610710594.4A patent/CN106365507A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6855399B2 (en) * | 2002-07-17 | 2005-02-15 | Ngk Spark Plug Co., Ltd. | Copper paste and wiring board using the same |
| CN102212250A (en) * | 2011-04-15 | 2011-10-12 | 广东生益科技股份有限公司 | Filler compound and copper clad laminate made of same |
| CN103582564A (en) * | 2011-05-30 | 2014-02-12 | 松下电器产业株式会社 | Laminate sheet, application therefor, and method for producing same |
| CN103192577A (en) * | 2013-04-26 | 2013-07-10 | 铜陵浩荣电子科技有限公司 | High-thermal-conductivity copper-clad plate manufacturing method |
| CN104558689A (en) * | 2014-12-26 | 2015-04-29 | 广东生益科技股份有限公司 | Filler composition and application thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611208A (en) * | 2017-10-12 | 2018-01-19 | 绍兴文理学院 | A kind of preparation method of heat radiating type solar cell backboard |
| CN112500031A (en) * | 2020-12-14 | 2021-03-16 | 晟大科技(南通)有限公司 | Ceramic substrate material and preparation method and application thereof |
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