CN103642442B - High-heat-conduction insulating glue for aluminum substrate and preparation method thereof - Google Patents
High-heat-conduction insulating glue for aluminum substrate and preparation method thereof Download PDFInfo
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- CN103642442B CN103642442B CN201310637725.7A CN201310637725A CN103642442B CN 103642442 B CN103642442 B CN 103642442B CN 201310637725 A CN201310637725 A CN 201310637725A CN 103642442 B CN103642442 B CN 103642442B
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Abstract
The invention relates to the technical field of insulating materials and particularly relates to high-heat-conduction insulating glue for an aluminum substrate. The high-heat-conduction insulating glue contains the following ingredients in percentage by weight: 40-50% of modified epoxy resin, 40-50% of mixed heat conducting filler, 3-7% of curing agent, 1-3% of accelerating agent and 2-5% of liquid-state silica gel. According to the high-heat-conduction insulating glue disclosed by the invention, based on the mixing of heat conducting fillers of different varieties, specifications and sizes, the fillers are subjected to compatibility surface treatment under given process conditions, so as to increase the coefficient of heat conductivity of the fillers, and then, the treated fillers are uniformly dispersed into an epoxy resin matrix, so that the coefficient of heat conductivity of the insulating glue is increased greatly.
Description
Technical field
The present invention relates to insulating material technical field, particularly relate to a kind of aluminium base high heat conductive insulating glue and preparation method thereof.
Background technology
Along with the universal of electronic product and widespread use, the production of the LED circuit board that metal matrix makes and manufacturing technology are also constantly updated and develop, for producing development and the demand of the heat radiation of different electronic product, its technological core depends on insulation layer thermal conductivity, current domestic technique is also in the development phase, along with the widespread use of product and perfect, product requirement is more and more tighter, so only carry out renewal from technology to promote breakthrough, heat-conducting glue has a lot of advantage compared with other radiating mode, its thermal conductive metal plate not only than traditional is lightweight, efficiency is high, and required component is less, heat-conducting glue insulation layer glue is significant to the precision and life-span that improve electric and microelectronic device.At present, domestic industry difficult point is that the thermal conductivity of insulation layer cannot be broken through, and its quality cannot ensure.
Summary of the invention
Embodiment of the present invention goal of the invention, being to provide a kind of aluminium base high heat conductive insulating glue and preparation method thereof, improves thermal conductivity.
In order to realize foregoing invention object, complete skill scheme of the present invention is:
A kind of aluminium base high heat conductive insulating glue, is characterized in that, comprise following composition by weight percentage:
Concrete, comprise following composition by weight percentage:
Concrete, described mixing heat conductive filler comprises following composition by weight percentage:
Concrete, the particle diameter of described alumina in Nano level is 3-6 nanometer;
The particle diameter of described nano level aluminium nitride is 10-13 nanometer;
The particle diameter of described nanometer diamond powder is 15-21 nanometer.
A preparation method for above-mentioned aluminium base high heat conductive insulating glue, is characterized in that, comprise the following steps:
(1) alumina in Nano level 40-60%, nano level aluminium nitride 30-50%, nanometer diamond powder 5-10% are mixed, add acetone by the total mass ratio of 1:3, insert shredder together and grind and make mixing heat conductive filler in 2 hours;
(2) in the vacuum tightness of-0.08MP, under the condition of 300 revs/min of rotational velocities, add successively epoxy resin 45%, liquid-state silicon gel 2.5%, dicyandiamide solidifying agent 5%, methylimidazole 2%, stir discharging after 3 hours;
(3), after discharging, by the speed of 2.5M/M discharging is coated on Copper Foil or release film and synthesizes semicure high heat conductive insulating layer glue.
Implement the embodiment of the present invention, there is following beneficial effect:
High heat conductive insulating matrix of the present invention mixes in the heat conductive filler of different sorts specification size, under set processing condition, intermiscibility surface treatment is carried out to filler, improve its thermal conductivity, uniform filling will be handled again well be scattered in epoxy resin-base, thus significantly improve the thermal conductivity of insulation paste.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly, below the present invention is described in further detail.
Embodiment of the present invention aluminium base high heat conductive insulating glue, is made up of following component: modified epoxy resin 45% by mass percentage; Mixing heat conductive filler 45.5%; Dicyandiamide solidifying agent 5%; Methylimidazole 2%; Liquid-state silicon gel 2.5%.
The preparation method of this aluminium base high heat conductive insulating glue is as follows:
(1) alumina in Nano level 40-60%, nano level aluminium nitride 30-50%, nanometer diamond powder 5-10% are mixed, add acetone by the total mass ratio of 1:3, insert shredder together and grind and make mixing heat conductive filler in 2 hours;
(2) in the vacuum tightness of-0.08MP, under the condition of 300 revs/min of rotational velocities, add successively epoxy resin 45%, liquid-state silicon gel 2.5%, dicyandiamide solidifying agent 5%, methylimidazole 2%, stir discharging after 3 hours;
(3), after discharging, by the speed of 2.5M/M discharging is coated on Copper Foil or release film and synthesizes semicure high heat conductive insulating layer glue.
The technical indicator of aluminium base high heat conductive insulating glue prepared by the present embodiment is as follows:
By testing the thermal conductivity of its high heat conductive insulating glue below, test reference establishing criteria CPCA-4105-2010, ASTM D5470-06, its result and contrast are as following table:
| The embodiment of the present invention | Ancient cooking vessel glue is gathered in Taiwan | U.S. LRIAD heat-conducting glue | Brightness glue is risen in Taiwan |
| 3.6-3.8W/M.K | 2.67W/M.K | 3.2W/M.K | 2.2W/M.K |
The present invention is directed to existing modified epoxy resin stick and rely on stopping composition to obtain raising thermal conductivity, kind, particle diameter, shape, size, the heat conductivility of self of filler, the synergy between processing conditions and different filler all has impact to thermal conductive insulation glue,
The present invention adopts powder to mix composite algorithm, utilize different heat conductive filler material and different granular sizes to form reticulated structure, size is different, the thermal conductivity of resulting materials also can difference to some extent, the nanometer of filler grain is the effective way improving himself thermal conductivity, also be obtain high heat-conducting polymer material effective way, under identical loading level, different-grain diameter more easily obtains high heat conductance with the use of this than single particle size filled polymer, during the composite packing/polymer of the stopping composition of different-grain diameter, small particle size particle can enter into the space of Large stone particle, obtain maximum degree of piling up, form more thermal conducting path, therefore the thermal conductivity of resulting materials is better than single particle size packing material thermal conductivity, ideally, the thermal conductivity of matrix material can reach 20 times of matrix.
Above disclosedly be only a kind of preferred embodiment of the present invention, certainly can not limit the interest field of the present invention with this, therefore according to the equivalent variations that the claims in the present invention are done, still belong to the scope that the present invention is contained.
Claims (2)
1. an aluminium base high heat conductive insulating glue, is characterized in that, comprises following composition by weight percentage:
Wherein, mix heat conductive filler and comprise following composition by weight percentage:
Particle diameter is the alumina in Nano level 40-60% of 3-6 nanometer;
Particle diameter is the nano level aluminium nitride 30-50% of 10-13 nanometer;
Particle diameter is the nanometer diamond powder 5-10% of 15-21 nanometer.
2. the preparation method of aluminium base high heat conductive insulating glue according to claim 1, is characterized in that, comprise the following steps:
(1) alumina in Nano level 40-60%, nano level aluminium nitride 30-50%, nanometer diamond powder 5-10% are mixed, add acetone by the total mass ratio of 1:3, insert shredder together and grind and make mixing heat conductive filler in 2 hours;
(2) in the vacuum tightness of-0.08MPa, under the condition of 300 revs/min of rotational velocities, add modified epoxy resin 45%, liquid-state silicon gel 2.5%, dicy-curing agent 5%, methylimidazole 2% successively, stir discharging after 3 hours;
(3), after discharging, by the speed of 2.5M/M discharging is coated on Copper Foil or release film and synthesizes semicure high heat conductive insulating layer glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310637725.7A CN103642442B (en) | 2013-12-02 | 2013-12-02 | High-heat-conduction insulating glue for aluminum substrate and preparation method thereof |
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|---|---|---|---|
| CN201310637725.7A CN103642442B (en) | 2013-12-02 | 2013-12-02 | High-heat-conduction insulating glue for aluminum substrate and preparation method thereof |
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| CN103642442A CN103642442A (en) | 2014-03-19 |
| CN103642442B true CN103642442B (en) | 2015-07-15 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105647345B (en) * | 2016-03-13 | 2018-08-21 | 浙江展邦电子科技有限公司 | A kind of high thermal conductivity aluminum matrix plate |
| CN113881190A (en) * | 2021-10-19 | 2022-01-04 | 合肥工业大学 | Epoxy resin composite material for packaging power electronic transformer and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1962799A (en) * | 2006-11-09 | 2007-05-16 | 上海大学 | Low-viscosity heat-conductive adhesive and process for preparing same |
| CN103254569A (en) * | 2012-02-15 | 2013-08-21 | 新日铁住金化学株式会社 | Highly thermally conductive resin cured product, highly thermally conductive semi-cured resin film, method of manufacturing same, and highly thermally conductive resin composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20080039555A1 (en) * | 2006-08-10 | 2008-02-14 | Michel Ruyters | Thermally conductive material |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1962799A (en) * | 2006-11-09 | 2007-05-16 | 上海大学 | Low-viscosity heat-conductive adhesive and process for preparing same |
| CN103254569A (en) * | 2012-02-15 | 2013-08-21 | 新日铁住金化学株式会社 | Highly thermally conductive resin cured product, highly thermally conductive semi-cured resin film, method of manufacturing same, and highly thermally conductive resin composition |
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