CN113881190A - Epoxy resin composite material for packaging power electronic transformer and preparation method thereof - Google Patents
Epoxy resin composite material for packaging power electronic transformer and preparation method thereof Download PDFInfo
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- CN113881190A CN113881190A CN202111218049.0A CN202111218049A CN113881190A CN 113881190 A CN113881190 A CN 113881190A CN 202111218049 A CN202111218049 A CN 202111218049A CN 113881190 A CN113881190 A CN 113881190A
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 63
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 63
- 239000002131 composite material Substances 0.000 title claims abstract description 50
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 29
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 22
- 150000001875 compounds Chemical class 0.000 claims abstract description 22
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 21
- 239000010432 diamond Substances 0.000 claims abstract description 21
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims abstract description 16
- 238000003756 stirring Methods 0.000 claims abstract description 13
- 239000002245 particle Substances 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 6
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 6
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical group CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims description 2
- 239000006082 mold release agent Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 abstract description 7
- 239000004593 Epoxy Substances 0.000 abstract description 4
- 239000011159 matrix material Substances 0.000 abstract description 3
- 238000010292 electrical insulation Methods 0.000 abstract description 2
- 238000009776 industrial production Methods 0.000 abstract description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000006872 improvement Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920000784 Nomex Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 239000004763 nomex Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000012407 engineering method Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011858 nanopowder Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000011087 paperboard Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
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Abstract
The invention discloses an epoxy resin composite material for packaging a power electronic transformer and a preparation method thereof, belonging to the field of packaging insulating materials of power electronic devices. The epoxy resin composite material is a micron diamond/nano alumina blended epoxy composite material and is prepared from epoxy resin, a compound filler, a curing agent and an accelerant, wherein the compound filler is prepared from micron diamond and nano alumina. The preparation method comprises the steps of adding the compound filler into an epoxy resin matrix, stirring, adding the curing agent accelerator according to the proportion, slowly injecting the mixture into a mold, placing the mold into a vacuum oven for defoaming, and finally curing to form the epoxy resin composite material. The preparation method is simple and suitable for industrial production, and the prepared epoxy composite material has excellent electrical insulation performance and heat conduction performance and can effectively solve the problems of insufficient packaging stability and reliability of the high-power electronic transformer.
Description
Technical Field
The invention relates to the field of power electronic device packaging insulating materials, in particular to an epoxy resin composite material for packaging a power electronic transformer and a preparation method thereof.
Background
With the continuous progress of the power electronic device technology, the power electronic equipment is inevitably developed towards high frequency, miniaturization, high voltage, large current and the like, the output power density is continuously improved, and higher requirements are provided for the process level, the basic material and the working reliability of the power electronic device. With the replacement of silicon material by silicon carbide (SiC) material, silicon carbide power devices can withstand higher breakdown voltage and higher current and higher operating temperature, while having faster switching speed and less switching loss than conventional silicon power devices. Power electronic transformers will be developed towards faster switching speeds and higher operating voltages. However, compared with the conventional power frequency power transformer, the power electronic transformer has a more compact structure and more turns, and turn-to-turn insulation may bear stronger electrical stress, thereby causing insulation failure.
The packaging technology of the module is an important component of the integration of power electronic systems, and the electrical performance and the thermal performance of the module can be directly influenced. When the power electronic transformer works in a higher-frequency and higher-voltage environment, the electric-thermal stress borne by the insulating material is more severe, and the stability and the reliability of the insulating material become bottlenecks which restrict the future development of the power electronic transformer, so that the research on the improvement of the insulating property of the packaging material has important significance and value.
With the continuous development of high-power electronic technology, power electronic transformers have attracted extensive attention, so that the packaging problem of the power electronic transformers is also widely researched. The invention has been made by the academic papers about the deep theoretical analysis, and also has the practical engineering methods, such as the invention patent application specification "an epoxy resin micro-nano blending composite material for packaging power electronic high-power devices and its preparation method" (CN 111777840A) and "an insulating shell for power electronic transformer and its processing method" (CN 109817412A).
Chinese patent application publication CN 109817412a published in 2019, 5, 28 and provides an insulating case for a power electronic transformer and a processing method thereof, in which a case is made of glass fiber reinforced plastic, and each surface of the case is wrapped with an interlayer made of Nomex paper board, so that the high voltage resistance of the insulating case is improved. However, the method has the disadvantages that the related technology of the Nomex plate is monopolized abroad and depends on import at home, the import period is long, the time and the economic cost are high, in addition, although the glass fiber reinforced plastics have the insulating property, the voltage-resistant grade is low, and if the insulating property with higher requirement exists, the insulating material is difficult to meet the requirement.
Chinese patent application publication CN 111777840a published in 10/16/2020, provides an epoxy resin micro-nano blended composite material for packaging power electronic high-power devices and a preparation method thereof, in the material, nano aluminum nitride on the surface of a silane coupling agent is prepared as a heat-conducting filler, and the nano aluminum nitride is uniformly dispersed in epoxy resin by using ultrasound, and the micro-nano blended composite material is prepared by processes such as vacuum degassing, infusion molding and the like. The composite material is excellent in thermal conductivity and electrical insulating properties. However, the method has the defects that the treatment mode used in the preparation is mostly suitable for the layered small-batch production in the laboratory, the flow is more and complicated, and the industrial landing is difficult.
In summary, the following problems still exist in the prior art:
1. the existing insulating material is not enough to bear stronger electric stress possibly due to turn-to-turn insulation, is easy to cause insulation failure, and is not beneficial to the safe and stable operation of the power electronic transformer.
2. The existing insulating material has low thermal conductivity coefficient and is not enough to solve the heat problem generated when the power electronic transformer works.
3. The existing preparation process of the packaging composite material of the power electronic transformer is complex and is not beneficial to industrial production.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the problems of poor packaging stability, insufficient reliability and improved insulating property and heat conductivity of the high-power electronic transformer are solved, the epoxy resin composite material with high breakdown strength, better insulating property and strong heat conductivity is provided, and the preparation method is simple to operate. Specifically, the compound filler of the micro-diamond and the nano-alumina is added into the epoxy resin matrix for modification, so that the micro-diamond/nano-alumina blended epoxy resin composite material with more excellent insulating property is obtained.
In order to achieve the purpose, the invention provides an epoxy resin composite material for packaging a power electronic transformer, which is prepared from epoxy resin, a compound filler, a curing agent and an accelerator in the mass parts of 100: 200-250: 80: 0.5-2;
the composite filler is prepared from micron diamond and nano aluminum oxide, and the mass parts of the composite filler are 4-12: 1 in the above sequence.
Preferably, the particle size of the micro-diamond is 20 μm, and the particle size of the nano-alumina is 100 nm.
Preferably, the epoxy resin is a bisphenol a type epoxy resin.
Preferably, the curing agent is at least one of methylhexahydrophthalic anhydride and tetrahydrophthalic anhydride.
Preferably, the accelerator is dimethylbenzylamine.
The invention also provides a preparation method of the epoxy resin composite material for packaging the power electronic transformer, which comprises the following steps:
step 1, mixing micro diamond and nano alumina to obtain a compound filler;
step 2, adding the epoxy resin and the compound filler into a reaction kettle, and stirring for 1.5-2.5 h under the vacuum condition of 70-130 ℃, wherein the stirring speed is 200-400 rpm;
then adding the curing agent and the accelerator into a reaction kettle in sequence, and stirring for 10min at the vacuum condition of 100 ℃ to obtain a mixture, wherein the stirring speed is 200-400 rpm;
step 3, firstly, brushing a mold release agent on the mold in advance, and putting the mold into a 100 ℃ oven for preheating for 2 hours; secondly, pouring the mixture obtained in the step 2 into a preheated mold, and placing the mold into an oven for vacuum defoaming for 5-10 min; then, precuring in an oven, wherein the precuring temperature is 80-110 ℃, and the precuring time is 3-5 h;
demolding is carried out after the precuring is finished, and a mixture demolding part is obtained;
step 4, placing the mixture demolding piece obtained in the step 3 into an oven for curing, wherein the curing temperature is 120-140 ℃, and the curing time is 12-14 hours;
and (3) transferring the epoxy resin composite material to room temperature for standing, wherein the mixture demolding member after the curing is finished is the epoxy resin composite material.
According to the technical scheme, the epoxy resin composite material is a micron diamond/nano aluminum oxide blended epoxy composite material, and compared with the prior art, the epoxy resin composite material has the following beneficial effects:
1. the micron diamond has extremely high heat conductivity coefficient, and the addition of the micron diamond can promote the formation of a heat conduction channel and further form a heat conduction network, so that phonon scattering is reduced, and the heat conductivity is improved; meanwhile, the micron diamond serving as an ultra-wide bandgap semiconductor material has extremely high breakdown field intensity, and the electrical insulation performance of the composite material can be effectively improved.
2. The addition of a proper amount of nano alumina utilizes the difference of the grain sizes of the two fillers, which is beneficial to filling the defects and gaps existing between the epoxy resin and the fillers, further enhances the formation of a heat conduction network, and simultaneously the uniformly dispersed nano powder can enhance the resin matrix and improve the mechanical property.
3. The preparation method of the epoxy resin composite material is simple to operate, does not need complex treatment and is convenient for large-scale production.
Detailed Description
The technical solution of the present invention is further illustrated below with reference to specific examples and comparative examples.
Example 1.
The epoxy resin composite material in the embodiment 1 is prepared from epoxy resin, a compound filler, a curing agent and an accelerator, and the mass parts of the epoxy resin composite material are respectively 100: 250: 80: 1 according to the sequence. The compound filler is prepared from micron diamond and nano alumina, and the mass parts of the compound filler are 4: 1 in the above sequence.
In example 1, the particle size of the microdiamond was 20 μm, and the particle size of the nano alumina was 100 nm. The epoxy resin is bisphenol A type epoxy resin. The curing agent is methylhexahydrophthalic anhydride. The accelerator is dimethylbenzylamine.
In example 1, a method for preparing an epoxy resin composite material includes the steps of:
step 1, mixing micro diamond and nano alumina to obtain a compound filler;
and 2, adding the epoxy resin and the compound filler into a reaction kettle, and stirring for 2 hours at the vacuum condition of 100 ℃ at the stirring speed of 250 rpm.
And then adding the curing agent and the accelerator into the reaction kettle in sequence, and stirring for 10min at the vacuum condition of 100 ℃ to obtain a mixture, wherein the stirring speed is 250 rpm.
And 3, firstly, brushing a release agent on the mold in advance, and putting the mold into a 100 ℃ oven for preheating for 2 hours. And secondly, pouring the mixture obtained in the step 2 into a preheated mold, and placing the mold into an oven for vacuum defoaming for 10 min. Then, pre-curing is carried out in an oven, wherein the pre-curing temperature is 100 ℃, and the pre-curing time is 4 hours.
And demolding after the pre-curing is finished to obtain a mixture demolding part.
And 4, placing the mixture demolding piece obtained in the step 3 into an oven for curing, wherein the curing temperature is 140 ℃, and the curing time is 12 hours.
And (3) after the curing is finished, the mixture demolding part is the epoxy resin composite material with the mass ratio of the micro diamond to the nano alumina being 4: 1, and the epoxy resin composite material is moved to room temperature and stands.
Example 2.
In the embodiment 2, the epoxy resin composite material is prepared from epoxy resin, a compound filler, a curing agent and an accelerator, and the mass parts of the epoxy resin composite material are respectively 100: 225: 80: 1 according to the above sequence. The compound filler is prepared from micron diamond and nano alumina, and the mass parts of the compound filler are 8: 1 in the above sequence.
In example 2, the particle size of the microdiamond was 20 μm, and the particle size of the nano alumina was 100 nm. The epoxy resin is bisphenol A type epoxy resin. The curing agent is methylhexahydrophthalic anhydride. The accelerator is dimethylbenzylamine.
In example 2, the epoxy resin composite material was prepared in the same manner as in example 1. Finally, the epoxy resin composite material with the mass ratio of the micron diamond to the nano alumina being 8: 1 is prepared.
Example 3.
The epoxy resin composite material in the embodiment 3 is prepared from epoxy resin, a compound filler, a curing agent and an accelerator, and the mass parts of the epoxy resin composite material are respectively 100: 216.7: 80: 1 according to the above sequence. The compound filler is prepared from micron diamond and nano alumina, and the mass parts of the compound filler are 12: 1 in the above sequence.
In example 3, the particle size of the microdiamond was 20 μm and the particle size of the nano alumina was 100 nm. The epoxy resin is bisphenol A type epoxy resin. The curing agent is methylhexahydrophthalic anhydride. The accelerator is dimethylbenzylamine.
The epoxy composite material of example 3 was prepared in the same manner as in example 1. Finally, the epoxy resin composite material with the mass ratio of the micron diamond to the nano alumina being 12: 1 is prepared.
Comparative example.
The comparative example is prepared by bisphenol A type epoxy resin and a curing agent, and the mass parts of the bisphenol A type epoxy resin and the curing agent are 100: 80 in the above sequence. Wherein the curing agent is methylhexahydrophthalic anhydride.
In this comparative example, the production method was substantially the same as that of example 1 except that step 1 was omitted.
The relevant performance tests were performed for examples 1-3 and comparative example and the test results are shown in table 1.
As can be seen from the test results in Table 1, compared with the comparative example without the compound filler, the breakdown strength and the thermal conductivity of the three examples are greatly improved, the improvement rates of the breakdown strength are respectively 27.6%, 40.7% and 31.7%, and the improvement rates of the thermal conductivity are respectively 542.9%, 576.2% and 561.9%. The test result fully shows that the epoxy resin composite material prepared by the preparation method can effectively improve the insulating property and the thermal property of the packaging material and can effectively solve the heat resistance and the electric resistance problems of the packaging of the power electronic transformer.
Claims (6)
1. The epoxy resin composite material for packaging the power electronic transformer is characterized by being prepared from epoxy resin, a compound filler, a curing agent and an accelerator in a mass ratio of 100: 200-250: 80: 0.5-2;
the composite filler is prepared from micron diamond and nano aluminum oxide, and the mass parts of the composite filler are 4-12: 1 in the above sequence.
2. The power electronic transformer encapsulating epoxy resin composite material as claimed in claim 1, wherein the particle size of the micro diamond is 20 μm, and the particle size of the nano alumina is 100 nm.
3. The power electronic transformer encapsulating epoxy resin composite material as claimed in claim 1, wherein the epoxy resin is bisphenol a type epoxy resin.
4. The power electronic transformer encapsulating epoxy resin composite material according to claim 1, wherein the curing agent is at least one of methylhexahydrophthalic anhydride and tetrahydrophthalic anhydride.
5. The power electronic transformer encapsulating epoxy resin composite material as claimed in claim 1, wherein the accelerator is dimethylbenzylamine.
6. The preparation method of the epoxy resin composite material for encapsulating the power electronic transformer as claimed in any one of claims 1 to 5, characterized by comprising the following steps:
step 1, mixing micro diamond and nano alumina to obtain a compound filler;
step 2, adding the epoxy resin and the compound filler into a reaction kettle, and stirring for 1.5-2.5 h under the vacuum condition of 70-130 ℃, wherein the stirring speed is 200-400 rpm;
then adding the curing agent and the accelerator into a reaction kettle in sequence, and stirring for 10min at the vacuum condition of 100 ℃ to obtain a mixture, wherein the stirring speed is 200-400 rpm;
step 3, firstly, brushing a mold release agent on the mold in advance, and putting the mold into a 100 ℃ oven for preheating for 2 hours; secondly, pouring the mixture obtained in the step 2 into a preheated mold, and placing the mold into an oven for vacuum defoaming for 5-10 min; then, precuring in an oven, wherein the precuring temperature is 80-110 ℃, and the precuring time is 3-5 h;
demolding is carried out after the precuring is finished, and a mixture demolding part is obtained;
step 4, placing the mixture demolding piece obtained in the step 3 into an oven for curing, wherein the curing temperature is 120-140 ℃, and the curing time is 12-14 hours;
and (3) transferring the epoxy resin composite material to room temperature for standing, wherein the mixture demolding member after the curing is finished is the epoxy resin composite material.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114292498A (en) * | 2022-02-22 | 2022-04-08 | 陕西理工大学 | Preparation method of lycopodium clavatum powder-epoxy resin waterproof composite material |
| CN114350110A (en) * | 2021-12-02 | 2022-04-15 | 西安理工大学 | Nano-grade filler and liquid rubber co-modified epoxy composite material and preparation method thereof |
| CN116836610A (en) * | 2023-06-30 | 2023-10-03 | 西安交通大学 | Epoxy composite coating material for improving surface flashover voltage and preparation method thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103030929A (en) * | 2011-09-30 | 2013-04-10 | 联茂电子股份有限公司 | Resin composition |
| CN103642442A (en) * | 2013-12-02 | 2014-03-19 | 惠州市绿标光电科技有限公司 | High-heat-conduction insulating glue for aluminum substrate and preparation method thereof |
| CN104493734A (en) * | 2014-12-23 | 2015-04-08 | 广东奔朗新材料股份有限公司 | Latent curing epoxy resin binder diamond grinding tool and preparation method thereof |
| CN104693686A (en) * | 2015-03-19 | 2015-06-10 | 西安交通大学 | Preparation method for micro/nanostructure epoxy composite insulating material for GIS |
| CN104910845A (en) * | 2015-06-12 | 2015-09-16 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
| JP2019176023A (en) * | 2018-03-28 | 2019-10-10 | 京セラ株式会社 | Semiconductor-sealing resin composition and semiconductor device |
| CN111500023A (en) * | 2020-05-23 | 2020-08-07 | 湖南东映碳材料科技有限公司 | High-thermal-conductivity composite material and preparation method thereof |
| CN111777840A (en) * | 2020-07-14 | 2020-10-16 | 浙江大学 | Epoxy resin micro-nano blending composite material for packaging power electronic high-power device and preparation method thereof |
| WO2021128895A1 (en) * | 2019-12-26 | 2021-07-01 | 苏州巨峰电气绝缘系统股份有限公司 | High-thermal-conductivity insulating layer material, metal substrate, and preparation method |
| CN113072797A (en) * | 2021-03-26 | 2021-07-06 | 清华大学 | Epoxy resin-based composite material and preparation method thereof |
| CN113336978A (en) * | 2021-05-28 | 2021-09-03 | 西安交通大学 | Preparation method of epoxy micro-nano co-doped composite material |
| US20220389300A1 (en) * | 2019-10-24 | 2022-12-08 | Sekisui Chemical Co., Ltd. | Resin composition and heat-dissipating member |
-
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Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103030929A (en) * | 2011-09-30 | 2013-04-10 | 联茂电子股份有限公司 | Resin composition |
| CN103642442A (en) * | 2013-12-02 | 2014-03-19 | 惠州市绿标光电科技有限公司 | High-heat-conduction insulating glue for aluminum substrate and preparation method thereof |
| CN104493734A (en) * | 2014-12-23 | 2015-04-08 | 广东奔朗新材料股份有限公司 | Latent curing epoxy resin binder diamond grinding tool and preparation method thereof |
| CN104693686A (en) * | 2015-03-19 | 2015-06-10 | 西安交通大学 | Preparation method for micro/nanostructure epoxy composite insulating material for GIS |
| CN104910845A (en) * | 2015-06-12 | 2015-09-16 | 深圳先进技术研究院 | Underfill adhesive and preparation method thereof |
| JP2019176023A (en) * | 2018-03-28 | 2019-10-10 | 京セラ株式会社 | Semiconductor-sealing resin composition and semiconductor device |
| US20220389300A1 (en) * | 2019-10-24 | 2022-12-08 | Sekisui Chemical Co., Ltd. | Resin composition and heat-dissipating member |
| WO2021128895A1 (en) * | 2019-12-26 | 2021-07-01 | 苏州巨峰电气绝缘系统股份有限公司 | High-thermal-conductivity insulating layer material, metal substrate, and preparation method |
| CN111500023A (en) * | 2020-05-23 | 2020-08-07 | 湖南东映碳材料科技有限公司 | High-thermal-conductivity composite material and preparation method thereof |
| CN111777840A (en) * | 2020-07-14 | 2020-10-16 | 浙江大学 | Epoxy resin micro-nano blending composite material for packaging power electronic high-power device and preparation method thereof |
| CN113072797A (en) * | 2021-03-26 | 2021-07-06 | 清华大学 | Epoxy resin-based composite material and preparation method thereof |
| CN113336978A (en) * | 2021-05-28 | 2021-09-03 | 西安交通大学 | Preparation method of epoxy micro-nano co-doped composite material |
Non-Patent Citations (2)
| Title |
|---|
| 姚裕成 等: "《人造金刚石和超高压高温技术》", 31 March 1996, 化学工业出版社, pages: 11 - 12 * |
| 陈;杨威;张;张卓;陈新;边凯;郭安儒;: "高导热氧化铝/氮化硼环氧复合绝缘材料性能研究", 化学与黏合, no. 04, 15 July 2018 (2018-07-15), pages 21 - 24 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114350110A (en) * | 2021-12-02 | 2022-04-15 | 西安理工大学 | Nano-grade filler and liquid rubber co-modified epoxy composite material and preparation method thereof |
| CN114292498A (en) * | 2022-02-22 | 2022-04-08 | 陕西理工大学 | Preparation method of lycopodium clavatum powder-epoxy resin waterproof composite material |
| CN116836610A (en) * | 2023-06-30 | 2023-10-03 | 西安交通大学 | Epoxy composite coating material for improving surface flashover voltage and preparation method thereof |
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