CN202029463U - Metal base copper-clad plate with low thermal resistance and high insulation property - Google Patents
Metal base copper-clad plate with low thermal resistance and high insulation property Download PDFInfo
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- CN202029463U CN202029463U CN2010206607424U CN201020660742U CN202029463U CN 202029463 U CN202029463 U CN 202029463U CN 2010206607424 U CN2010206607424 U CN 2010206607424U CN 201020660742 U CN201020660742 U CN 201020660742U CN 202029463 U CN202029463 U CN 202029463U
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Abstract
The utility model discloses a metal base copper-clad plate with low thermal resistance and high insulation property, wherein the metal base copper-clad plate comprises an electric conduction metal layer copper foil; a heat conduction polyimide layer is coated on the electric conduction metal layer copper foil; a heat conduction adhesive layer is coated on the heat conduction polyimide layer; and a heat dissipation metal layer is pressed on the heat conduction adhesive layer. The utility model aims at overcoming the defects in the prior art and providing a metal base copper-clad plate with lower cost, lower thermal resistance and good insulation property. The metal base copper-clad plate of the utility model has the characteristics of being low in thermal resistance, high in insulation property and thin and has excellent heat resistance, fire resistance and high peel strength.
Description
Technical field
The utility model relates to the copper-clad plate of the high insulated metal base of a kind of low thermal resistance.
Background technology
Along with the develop rapidly of electronics industry, the volume size of electronic product is more and more littler, and power density is increasing, and solving heat dissipation problem is the great challenge that electronics industry is designed.The Metal Substrate copper-clad plate solves one of effective means of heat dissipation problem beyond doubt.The Metal Substrate copper-clad plate is a kind of copper-clad plate that good heat radiating function is arranged, and it is made up of the three-decker of uniqueness, is respectively circuit layer, heat conductive insulating layer and metal-based layer.The operation principle of Metal Substrate copper-clad plate is: the power device surface mount is at circuit layer, and the heat that device produced is transmitted to metal-based layer by insulating barrier, is diffused into module-external by metal substrate then, realizes the heat radiation to device.
Structure and operation principle by the Metal Substrate copper-clad plate see that insulating barrier is its core technology.Numerous metal substrate manufacturer, because of the restriction of each side factors such as technology, equipment, material and fund of self, its insulating barrier has used commercial FR-4 prepreg or the copper-clad plate (thermal conductivity factor only is 0.3w/mK) of FR-4 base, do not add any heat filling among this insulating barrier, therefore, the heat conductivity of this Metal Substrate copper-clad plate is very poor, does not also possess high-intensity electrical insulation properties simultaneously.The passing through in the modified epoxy insulating barrier of development in recent years adds a large amount of heat conduction inorganic fillers and improves the heat conductivility of insulating barrier, yet will cause the breakdown voltage of insulating barrier to reduce like this.In order to improve the insulating properties of material, has only the thickness that increases insulating barrier.Because the thickness of the thermal resistance of insulating barrier and material is proportional, will certainly increase the thermal resistance of whole system and then influence the heat dispersion of material, influence the integrated of material simultaneously.In addition, because modified epoxy has higher thermal coefficient of expansion, in the processing of material, be present in the metal level phenomenon that do not match.
Polyimides is a kind of have excellent electric insulating, dielectric properties, dimensional stability energy, mechanical performance and cold-resistant thermal shock resistance properties, and purposes is widely arranged on electronic material.But adopt the insulating barrier of the TPI adhesive of high heat conduction as the copper-clad plate of heat radiating metal base, production cost is higher; Simultaneously, when the pressing heat-dissipating metal sheet, need high temperature (350-400 ℃) roll-in to close equipment, the equipment cost height.
The utility model content
The purpose of this utility model is in order to overcome weak point of the prior art, to provide a kind of cost relatively low, and thermal resistance is relatively low, the Metal Substrate copper-clad plate of good insulating.
In order to achieve the above object, the utility model adopts following scheme:
The copper-clad plate of the high insulated metal base of a kind of low thermal resistance, it is characterized in that: comprise the conductive metal layer Copper Foil, on described conductive metal layer Copper Foil, be coated with the heat conduction polyimide layer, on described heat conduction polyimide layer, be coated with the heat-conducting glue adhensive layer, on described heat-conducting glue adhensive layer, covered heat radiating metallic layer.
The copper-clad plate of the high insulated metal base of aforesaid a kind of low thermal resistance is characterized in that described conductive metal layer Copper Foil is electrolytic copper foil or rolled copper foil, and its thickness is 0.5Oz-5Oz.
The copper-clad plate of the high insulated metal base of aforesaid a kind of low thermal resistance is characterized in that described heat conduction polyimide layer is formed by the polyamic acid imidization on coating and the conductive metal layer, and its thickness is 13um-50um, preferred 13um-30um.
The copper-clad plate of the high insulated metal base of aforesaid a kind of low thermal resistance is characterized in that described heat-conducting glue adhensive layer is modified epoxy adhesive layer or modification acrylate adhesive layer, and its thickness is 13um-50um.
The copper-clad plate of the high insulated metal base of aforesaid a kind of low thermal resistance is characterized in that described modified epoxy adhesive layer made by following component by weight:
Halogen-free epoxy resin: 10-45 part;
Thermoplastic resin and/or synthetic rubber: 0-15 part
Curing agent: 0.1-5 part
High heat filling: 30-80 part.
Butanone solvent is an amount of.
The copper-clad plate of the high insulated metal base of aforesaid a kind of low thermal resistance is characterized in that described modification acrylate adhesive layer made by following component by weight:
Acrylate copolymer resin: 10-45 part
Halogen-free epoxy resin: 0-15 part
Curing agent: 0.1-5 part
High heat filling: 30-80 part.
Butanone solvent is an amount of
The copper-clad plate of the high insulated metal base of aforesaid a kind of low thermal resistance, it is characterized in that containing high heat filling in described heat conduction polyimide layer and heat-conducting glue adhensive layer, described high heat filling is one or more the mixture in aluminium nitride, boron nitride, aluminium oxide, the CNT.
Described high heat filling is granular to be spherical, irregular and sheet, and particle diameter is 20nm-15um.
The mixture of the two or more compounds in the preferred aluminium nitride of described high heat filling, boron nitride, ball-aluminium oxide, irregular aluminium oxide, the nano aluminium oxide.Its consumption is 30-80 part, preferred 50-75 part.
The copper-clad plate of the high insulated metal base of aforesaid a kind of low thermal resistance is characterized in that described heat radiating metallic layer is aluminium sheet, copper coin, iron plate, thickness 0.2mm-5mm.
The copper-clad plate of the high insulated metal base of aforesaid a kind of low thermal resistance is characterized in that the surface of described heat radiating metallic layer is handled through coarse processing of wire drawing and anodic passivity.
Preparation is the method for the high insulated metal base of any one low thermal resistance copper-clad plate as mentioned above, it is characterized in that may further comprise the steps:
A) on the conductive metal layer Copper Foil, apply previously prepared heat conduction polyamic acid resin composition, the oven drying that process is 80-180 ℃ removes and desolvates, then under the blanket of nitrogen condition, dry and the polyamic acid imidization is obtained the single-sided polyimide copper-clad plate of heat conduction through 200 ℃ of-360 ℃ of high temperature non-oxidations;
B) above-mentioned single-sided polyimide copper-clad plate polyimides face is carried out sided corona treatment;
C) the polyimides face coated with thermally conductive adhesive after sided corona treatment is gone out organic solvent through 60-180 ℃ oven drying, makes the heat conduction adhesive become semi-cured state;
D) the heat conduction adhesive with heat-dissipating metal sheet and above-mentioned semi-cured state carries out the HTHP pressing, after the curing promptly.
The aforesaid method for preparing the copper-clad plate of the high insulated metal base of low thermal resistance, it is characterized in that described heat conduction polyamic acid resin preparation of compositions method is specially: high heat filling and solvent are carried out adding reactive tank behind the sand milling, and in reactive tank, add diamine compounds, tetracarboxylic acid anhydride compounds successively, the mol ratio of acid anhydrides and diamines is controlled at 0.98-1.0,5 ℃ of-40 ℃ of polymerisations promptly.
In sum, the beneficial effects of the utility model:
The copper-clad plate of the high insulated metal base of the utility model low thermal resistance has thin insulating barrier, low thermal resistance, high electrical insulating property and Metal Substrate copper-clad plate and has good peel strength and hear resistance.Simultaneously, have low-cost advantage, be convenient to a large amount of productions.
The utility model adopts the advantage of modified epoxy or modification acrylate and polyimides, on the conductive metal layer Copper Foil, apply the polyamic acid that one deck contains high heat filling earlier, through becoming the polyimide copper clad lamination of heat conduction after the high-temperature sub amination, on the polyimides glue face of heat conduction, be coated with the modified epoxy or the modification acrylate adhesive layer of heat conduction again.Adopt legal polyimide copper clad lamination that will scribble the heat-conducting glue adhensive layer of high-temperature high-pressure and metal substrate pressing then and form the copper-clad plate of the high insulated metal base of low thermal resistance.The utility model does not use the high temperature press equipment, can prepare slimming, the outstanding heat radiating metal base copper-clad plate of low thermal resistance high insulation combination property.
Description of drawings
Fig. 1 is the schematic diagram of the high insulated metal base of low thermal resistance of the present utility model copper-clad plate.
The specific embodiment
Below in conjunction with the specific embodiment the utility model is described further:
As shown in Figure 1, the copper-clad plate of the high insulated metal base of low thermal resistance of the present utility model, comprise conductive metal layer Copper Foil 1, be coated on the heat conduction polyimide layer 2 on the conductive metal layer Copper Foil, be coated on the heat-conducting glue adhensive layer 3 on the heat conduction polyimide layer 2 and be overlaid on heat radiating metallic layer 4 on the heat-conducting glue adhensive layer 3.Wherein conductive metal layer Copper Foil 1 is electrolytic copper foil or rolled copper foil, and its thickness is 0.5Oz-5Oz; Described heat conduction polyimide layer is formed by the polyamic acid imidization on coating and the conductive metal layer, and its thickness is 13um-50um, preferred 13um-30um.Described heat-conducting glue adhensive layer is by modified epoxy adhesive or modification acrylate adhesive layer, and its thickness is 13um-50um, preferred 13um-30um.The thickness of described low thermal resistance high insulation is 25-60um; Described heat radiating metallic layer is aluminium sheet, copper coin, iron plate, thickness 0.2mm-5mm, and preferred aluminium plate thickness is 0.5mm-2.0mm.
Embodiment 1.
30g aluminium nitride (average grain diameter 2-3um) and 500g NMP (N-methyl pyrrolidone) are carried out sand milling in sand mill; the back adds in the flask; and then to add mol ratio under the nitrogen protection be 0.98 the BPDA (BPDA) and the mixture 70g of diamines yl diphenyl ether (ODA); stirred 20 hours down at 25 ℃, carry out the polyamic acid solution that polymerization obtains heat conduction.
The polyamic acid solution of above-mentioned heat conduction is coated on the cathode copper of 1Oz; thickness is 15um; 160 ℃ of bakings 5 minutes; put into the nitrogen protection baking oven then in 200-350 ℃ of high-temperature sub amination; obtain heat conduction single-sided polyimide copper-clad plate after cold the going; again the polyimides face is carried out sided corona treatment, for future use.
Halogen-free epoxy resin GESR901 (HongChang Electronic Materials Co., Ltd, epoxide equivalent: 475g/eq) 5 weight portions, FC Hard XI-1072 (Resinous Kasei Co., Ltd. epoxide equivalent: 253g/eq) 4 weight portions, GELR128E (HongChang Electronic Materials Co., Ltd, epoxide equivalent: 185g/eq) 5 weight portions; HyPox RK 84L (CVC Thermoset Specialties, the elasticity scale of construction 32 quality %, epoxide equivalent: 1350g/eq) 7 weight portions, JER1256 (Mitsubishi chemical Co., Ltd, epoxide equivalent: 9052g/eq) 6 weight portions; DADPS 2.5 weight portions; 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN) 0.05 weight portion; Boron nitride (average grain diameter 2-3 μ m, purity is more than 99%) 35 weight portions, aluminium oxide (average grain diameter 2-3 μ m, purity is more than 99%) 25 weight portions; Antioxidant 1010 (CIBA GEIGY Co., Ltd.) 0.1 weight portion.Said components is placed sand mill, add butanone solvent, the solids content of regulating composition is 65%, carries out the liquid dispersion that mixed grinding is made the halogen-free flameproof adhesive composition then.
With coating machine the liquid dispersion of halogen-free flameproof high heat conductive insulating resin combination is coated in the heat conduction single-sided polyimide copper-clad plate that above-mentioned gained corona is crossed, coating layer thickness is 15 μ m, in the forced ventilation baking oven, coated coating is descended dry 5 minutes at 150 ℃ then, thereby make halogen-free flameproof adhesive composition coating change the glue-line of semi-cured state into.The coarse treated side that RCC is had the surface of glue-line and aluminium sheet (model: 5052H32, thickness are 1mm) uses vacuum pressure transmission machine to be bonded together by hot pressing under 60-190 ℃, makes the copper-clad plate of heat radiating metal base.
30g aluminium nitride (average grain diameter 2-3um) and 500g NMP are carried out sand milling in sand mill; the back adds in the flask; and then to add mol ratio under the nitrogen protection be 0.99 the benzophenone tetracarboxylic dianhydride (BTDA) and the mixture 70g of diamines yl diphenyl ether (ODA); stirred 20 hours down at 25 ℃, carry out the polyamic acid solution that polymerization obtains heat conduction.
The polyamic acid solution of above-mentioned heat conduction is coated on the cathode copper of 1Oz; thickness is 20um; 160 ℃ of bakings 5 minutes; put into the nitrogen protection baking oven then in 200-350 ℃ of high-temperature sub amination; obtain heat conduction single-sided polyimide copper-clad plate after cold the going; carry the polyimides face is carried out sided corona treatment, for future use.
Halogen-free epoxy resin GESR901 (HongChang Electronic Materials Co., Ltd, epoxide equivalent: 475g/eq) 4 weight portions, FC Hard XI-1072 (Resinous Kasei Co., Ltd. epoxide equivalent: 253g/eq) 4 weight portions, GELR128E (HongChang Electronic Materials Co., Ltd, epoxide equivalent: 185g/eq) 3 weight portions; HyPox RK 84L (CVC Thermoset Specialties, the elasticity scale of construction 32 quality %, epoxide equivalent: 1350g/eq) 2 weight portions, KET4131A70 (KOLON, epoxide equivalent: 215.5g/eq) 1 weight portion; Synthetic rubber 1072CG (Nantex Industry Co., Ltd. acrylonitrile content 27 quality %) 8 weight portions; DADPS 2 weight portions; 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN) 0.05 weight portion; Aluminium oxide (average grain diameter 2-3 μ m, purity is more than 99%) 75 weight portions; Antioxidant 1010 (CIBA GEIGY Co., Ltd.) 0.1 weight portion.Said components is placed sand mill, add butanone solvent, the solids content of regulating composition is 65%, carries out the liquid dispersion that mixed grinding is made the halogen-free flameproof adhesive composition then.
With coating machine the liquid dispersion of halogen-free flameproof high heat conductive insulating resin combination is coated on the heat conduction single-sided polyimide copper-clad plate that above-mentioned gained corona crosses, coating layer thickness is 20 μ m, in the forced ventilation baking oven, coated coating is descended dry 5 minutes at 150 ℃ then, thereby make halogen-free flameproof adhesive composition coating change the glue-line of semi-cured state into.The surface and the coarse treated side of aluminium sheet (model: 5052H32, thickness are 2mm) that RCC are had glue-line use vacuum pressure transmission machine to be bonded together by hot pressing down at 60-190 ℃, make the copper-clad plate of heat radiating metal base.
Embodiment 3
30g aluminium nitride (average grain diameter 2-3um) and 500g NMP are carried out sand milling in sand mill; the back adds in the flask; and then to add mol ratio under the nitrogen protection be 0.98 the BPDA (BPDA) and the mixture 70g of diamines yl diphenyl ether (ODA); stirred 20 hours down at 25 ℃, carry out the polyamic acid solution that polymerization obtains heat conduction.
The polyamic acid solution of above-mentioned heat conduction is coated on the cathode copper of 1Oz; thickness is 15um; 160 ℃ of bakings 5 minutes; put into the nitrogen protection baking oven then in 200-350 ℃ of high-temperature sub amination; obtain heat conduction single-sided polyimide copper-clad plate after cold the going; carry the polyimides face is carried out sided corona treatment, for future use.
Acrylate copolymer SG-70L (HongChang Electronic Materials Co., Ltd) 15 weight portions, FC Hard XI-1072 (Resinous Kasei Co., Ltd. epoxide equivalent: 253g/eq) 4 weight portions, GELR128E (HongChang Electronic Materials Co., Ltd, epoxide equivalent: 185g/eq) 5 weight portions; HyPox RK 84L (CVC Thermoset Specialties, the elasticity scale of construction 32 quality %, epoxide equivalent: 1350g/eq) 7 weight portions; DADPS 1.5 weight portions; 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN) 0.05 weight portion; Boron nitride (average grain diameter 2-3 μ m, purity is more than 99%) 35 weight portions, aluminium oxide (average grain diameter 2-3 μ m, purity is more than 99%) 25 weight portions; Antioxidant 1010 (CIBA GEIGY Co., Ltd.) 0.1 weight portion.Said components is placed sand mill, add butanone solvent, the solids content of regulating composition is 65%, carries out the liquid dispersion that mixed grinding is made the halogen-free flameproof adhesive composition then.
With coating machine the liquid dispersion of halogen-free flameproof high heat conductive insulating resin combination is coated on the heat conduction single-sided polyimide copper-clad plate that above-mentioned gained corona crosses, coating layer thickness is 15 μ m, in the forced ventilation baking oven, coated coating is descended dry 5 minutes at 150 ℃ then, thereby make halogen-free flameproof adhesive composition coating change the glue-line of semi-cured state into.The coarse treated side that RCC is had the surface of glue-line and aluminium sheet (model: 5052H32, thickness are 1mm) uses vacuum pressure transmission machine to be bonded together by hot pressing under 60-190 ℃, makes the copper-clad plate of heat radiating metal base.
Comparative Examples 1
Halogen-free epoxy resin GESR901 (HongChang Electronic Materials Co., Ltd, epoxide equivalent: 475g/eq) 5 weight portions, FC Hard XI-1072 (Resinous Kasei Co., Ltd. epoxide equivalent: 253g/eq) 4 weight portions, GELR128E (HongChang Electronic Materials Co., Ltd, epoxide equivalent: 185g/eq) 5 weight portions; HyPox RK 84L (CVC Thermoset Specialties, the elasticity scale of construction 32 quality %, epoxide equivalent: 1350g/eq) 7 weight portions; DADPS 2 weight portions; 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN) 0.05 weight portion; Aluminium nitride (average grain diameter 2-3 μ m, purity is more than 99%) 35 weight portions, aluminium oxide (average grain diameter 2-3 μ m, purity is more than 99%) 25 weight portions; Antioxidant 1010 (CIBA GEIGY Co., Ltd.) 0.1 weight portion.Said components is placed sand mill, add butanone solvent, the solids content of regulating composition is 65%, carries out the liquid dispersion that mixed grinding is made the halogen-free flameproof adhesive composition then.
Be coated on the electrolytic copper foil that thickness is 1Oz with the liquid dispersion of coating machine halogen-free flameproof high heat conductive insulating resin combination, coating layer thickness is 40 μ m, in the forced ventilation baking oven, coated coating is descended dry 5 minutes at 150 ℃ then, thereby make halogen-free flameproof adhesive composition coating change the glue-line of semi-cured state into.The coarse treated side that RCC is had the surface of glue-line and aluminium sheet (model: 5052H32, thickness are 1mm) uses vacuum pressure transmission machine to be bonded together by hot pressing under 60-190 ℃, makes the copper-clad plate of heat radiating metal base.
Below the performance of the heat radiating metal base copper-clad plate of the foregoing description and Comparative Examples gained is measured contrast, gained the results are shown in Table one:
Method of testing is as follows:
1, welding hear resistance:
Carry out the welding hear resistance of test material according to IPC-6502.4.13, it is by downcutting 25cm from Metal Substrate copper-clad plate material
2Size preparation specimen makes these specimen melt at 300 ℃ tin then and soaks 1min in bathing and measure.Bubble, layering do not appear in test sample, are judged to be " OK ".
2, peel strength:
According to the IPC-6502.4.9 method, the peel strength of test Copper Foil.Concrete grammar is: forming the Copper Foil width by the exposure etching in the Metal Substrate copper-clad plate is the circuit of 1mm, showing the minimum of a value of peeling off the required power of copper foil circuit on the direction that forms 180 degree angles with the speed of 50mm/min with laminated material measuring under 25 ℃ the condition then, and with this measured value as peel strength.
3, thermal conductivity test
According to ASTM D5470-2006 method, the thermal conductivity of test heat conductive insulating layer.
4, breakdown voltage test
According to the IEC60243-1 method, test the breakdown voltage of heat conductive insulating layer, get the mean value of 5 points.
Table one: embodiment 1-3 and Comparative Examples 1 performance
As shown in Table 1, the composition of embodiment 1 to embodiment 3 preparation satisfies demand of the present utility model, the Metal Substrate copper-clad plate material of producing demonstrates high breakdown voltage, low thermal resistance, good welding hear resistance, and be used alone the modified epoxy insulating barrier in the Comparative Examples 1, and when comparing with the Metal Substrate copper-clad plate of satisfying the utility model demand, the Metal Substrate copper-clad plate material thermal resistance of its gained is very high, is more than 10 times of the utility model Metal Substrate copper-clad plate; And its breakdown voltage only is 2.0KV, half of not enough Metal Substrate copper-clad plate of the present utility model.
Claims (5)
1. the high insulated metal base of low thermal resistance copper-clad plate, it is characterized in that: comprise conductive metal layer Copper Foil (1), on described conductive metal layer Copper Foil (1), be coated with heat conduction polyimide layer (2), on described heat conduction polyimide layer (2), be coated with heat-conducting glue adhensive layer (3), on described heat-conducting glue adhensive layer (3), covered heat radiating metallic layer (4).
2. the copper-clad plate of the high insulated metal base of a kind of low thermal resistance according to claim 1 is characterized in that described conductive metal layer Copper Foil (1) is electrolytic copper foil or rolled copper foil, and its thickness is 0.5Oz-5Oz.
3. the copper-clad plate of the high insulated metal base of a kind of low thermal resistance according to claim 1, the thickness that it is characterized in that described heat conduction polyimide layer (2) is 13um-50um.
4. the copper-clad plate of the high insulated metal base of a kind of low thermal resistance according to claim 1 is characterized in that described heat-conducting glue adhensive layer (3) is modified epoxy adhesive layer or modification acrylate adhesive layer, and its thickness is 13um-50um.
5. the copper-clad plate of the high insulated metal base of a kind of low thermal resistance according to claim 1 is characterized in that described heat radiating metallic layer is aluminium sheet, copper coin, iron plate, thickness 0.2mm-5mm.
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| CN2010206607424U CN202029463U (en) | 2010-12-15 | 2010-12-15 | Metal base copper-clad plate with low thermal resistance and high insulation property |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102529222A (en) * | 2010-12-15 | 2012-07-04 | 新高电子材料（中山）有限公司 | High-insulation metal-based copper-clad plate with low thermal resistance and preparation method thereof |
| CN102602111A (en) * | 2012-02-21 | 2012-07-25 | 甄凯军 | Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product |
| WO2013086814A1 (en) * | 2011-12-16 | 2013-06-20 | 新高电子材料（中山）有限公司 | Weather-resistant coating with high thermal conductivity, heat-dissipating solar back sheet, and highly efficient solar cell panel |
| CN103702511A (en) * | 2013-12-31 | 2014-04-02 | 广东生益科技股份有限公司 | High thermal conductivity metal substrate and manufacturing method thereof |
| CN105172259A (en) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | Preparation method of high heat dissipation aluminum based copper clad laminate |
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| CN102529222A (en) * | 2010-12-15 | 2012-07-04 | 新高电子材料（中山）有限公司 | High-insulation metal-based copper-clad plate with low thermal resistance and preparation method thereof |
| CN102529222B (en) * | 2010-12-15 | 2014-07-02 | 新高电子材料（中山）有限公司 | High-insulation metal-based copper-clad plate with low thermal resistance and preparation method thereof |
| WO2013086814A1 (en) * | 2011-12-16 | 2013-06-20 | 新高电子材料（中山）有限公司 | Weather-resistant coating with high thermal conductivity, heat-dissipating solar back sheet, and highly efficient solar cell panel |
| CN102602111A (en) * | 2012-02-21 | 2012-07-25 | 甄凯军 | Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product |
| CN102602111B (en) * | 2012-02-21 | 2016-01-20 | 甄凯军 | Production method of a kind of aluminum-based copper-clad plate and products thereof |
| CN103702511A (en) * | 2013-12-31 | 2014-04-02 | 广东生益科技股份有限公司 | High thermal conductivity metal substrate and manufacturing method thereof |
| CN105172259A (en) * | 2015-08-11 | 2015-12-23 | 深圳长宝覆铜板科技有限公司 | Preparation method of high heat dissipation aluminum based copper clad laminate |
| CN106867435A (en) * | 2015-12-11 | 2017-06-20 | 华烁科技股份有限公司 | A kind of flexible printed circuit polyimides stiffening plate modified acrylic ester adhesion agent and its application |
| CN106867435B (en) * | 2015-12-11 | 2019-03-08 | 华烁科技股份有限公司 | A kind of flexible printed circuit polyimides stiffening plate modified acrylic ester adhesion agent and its application |
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