CN108237742A - A kind of two layers of method double side flexible copper coated board and preparation method thereof - Google Patents
A kind of two layers of method double side flexible copper coated board and preparation method thereof Download PDFInfo
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- CN108237742A CN108237742A CN201810015591.8A CN201810015591A CN108237742A CN 108237742 A CN108237742 A CN 108237742A CN 201810015591 A CN201810015591 A CN 201810015591A CN 108237742 A CN108237742 A CN 108237742A
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- pbs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/728—Hydrophilic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of two layers of method double side flexible copper coated board and preparation method thereof, including upper and lower two copper foil layer and the insulating layer being located between two copper foil layers, the PBS films of insulating layer both sides including intermediate Kapton and above and below Kapton.The existing good ductility of PBS and elongation at break that the present invention uses, also there is preferable heat resistance and impact resistance, flexible group is not contained in its strand and free volume is small, it is not hygroscopic, and PBS is also thermoplastic material in itself, the bonding between insulating layer and copper foil can be equally realized under its high temperature after melting pressing, thermoplastic polyimide resin (TPI), which is substituted, using it perfectly solves TPI poor heat resistances afterwards, the problems such as hygroscopic, therefore, double side flexible copper coated board provided by the invention is provided with high peel strength and dimensional stability simultaneously, solve the problems of existing two layers of method double side flexible copper coated board.
Description
Technical field
The present invention relates to a kind of copper-clad plate and preparation method thereof more particularly to a kind of double side flexible copper coated board and its preparation sides
Method belongs to copper-clad plate technical field.
Background technology
In recent years, along with digital camera, DV, automobile navigation instrument, computer fittings and other electronic products
High performance, miniaturization, lightness and high-end electronic product, such as the appearance of tablet computer, smart mobile phone, electricity therein
Sub-line road is also constantly towards the trend development of " light, thin, short, small ".The rigid copper-clad plate that tradition uses, does not have pliability, raw
Assembling can not be bent by producing obtained electronic circuit, bulky, can not meet actual demand.Densification, multiple stratification, height
The double side flexible copper coated board of heat resistance, high-dimensional stability is gradually replacing these rigid copper-clad plates, becomes the market mainstream.
The manufacturing method of traditional double side flexible copper coated board, which is three layers, glue-type, and thickness is generally 24.5~110 μm, nothing
Method meets the demands such as copper-clad plate slimming, pliability, and the adhesive for having used heat resistance not high in producing, and can not meet resistance to
The performances such as hot, soldering stability, applied at elevated temperature are easily layered blistering, therefore, people consider extensively without using epoxy resin or
Acrylic tackifier only uses polyimide material to do the two of insulating layer layers of gum-free double side flexible copper coated board.
Known polyimide material is divided into non-thermal plasticity polyimide resin (PI) and thermoplastic polyimide resin
(TPI) two kinds, for both polyimide resins due to the difference of monomer structure, performance has apparent difference, non-thermoplastic
Property polyimide resin (PI) coefficient of thermal expansion than relatively low, apply in copper-clad plate, copper-clad plate made to have the good size steady
Qualitative and high-fire resistance, but its peel strength with copper foil is than relatively low, it is difficult to it is used alone；Thermoplastic polyimide resin
(TPI) heat resistance is not so good as non-thermal plasticity polyimide resin, but coefficient of thermal expansion is very high, the dimensional stability of copper-clad plate of support
It shrinks excessive, but pressing can be melted at high temperature, realize the heat pressure adhesive between resin layer and copper foil, it is therefore, existing
Two kinds of thermoplastic polyimide and non-thermal plasticity polyimides are existed simultaneously in two layers of method double side flexible copper coated board, wherein, it is non-thermal
Plastic polyimide resin provides excellent dimensional stability rather than thermoplastic polyimide resin plays cementation, with
Phase obtains good dimensional stability and high-peeling strength simultaneously.
At present, there are two types of the mainstream structures of two layers of method double side flexible copper coated board of commercialization, Cu/TPI/PI/TPI/Cu and
Cu/PI/TPI/PI/Cu, the existing higher peel strength of double side flexible copper coated board of former structure have the good size steady again
Qualitative, but its problem is that the TPI heat resistances of outer layer are poor, when encountering burning, TPI layers are easy to decompose, cause this two
The anti-flammability of layer method double side flexible copper coated board is poor, simultaneously because TPI is in itself containing more flexible group and with larger
Free volume, be easy to absorb water, under the repeatedly damp and hot impact of the following process of pcb board, it is easy to lead to plate bursting, it is latter
Although kind of structure avoids to a certain extent to be influenced caused by the deficiency of TPI, it is difficult to avoid TPI performances completely not
Problem caused by foot, and the structure is higher to the formula of TPI and PI, manufacturing process technological requirement, increases production difficulty.
Invention content
The present invention provides a kind of two layers of method double-faced flexible for deficiency existing for the double side flexible copper coated board of existing two layers of method
Copper-clad plate and preparation method thereof.
The technical solution that the present invention solves above-mentioned technical problem is as follows：
A kind of two layers of method double side flexible copper coated board, including upper and lower two copper foil layer and the insulation being located between two copper foil layers
Layer, the PBS films of insulating layer both sides including intermediate Kapton and above and below Kapton.
Further, the thickness of the insulating layer is 18~65 μm.
Further, the copper foil is one kind in rolled copper foil or electrolytic copper foil.
The advantageous effect of double side flexible copper coated board provided by the invention is：
Present invention employs poly butylene succinate (PBS) as the material for carrying out heat pressure adhesive in insulating layer with copper foil
Material, the existing good ductility of PBS and elongation at break, it may have preferable heat resistance and impact resistance, in strand not
Containing flexible group and free volume it is small, it is not hygroscopic, and PBS is in itself also for thermoplastic material, under high temperature after melting pressing
It can equally realize the bonding between insulating layer and copper foil, it is perfect afterwards to substitute thermoplastic polyimide resin (TPI) using it
Solves the problems such as TPI poor heat resistances, hygroscopic, therefore, double side flexible copper coated board provided by the invention is provided with high simultaneously
Peel strength and dimensional stability solve the problems of existing two layers of method double side flexible copper coated board.
The preparation method of above-mentioned double side flexible copper coated board is also claimed in the present invention, includes the following steps：
1) PBS raw materials agitating and heating is dried, and is delivered to the storage bin of laminating machine；
2) raw material in storage bin heats propulsion after entering the screw rod of laminating machine, is divided into laminating machine along screw rod direction multiple
Bringing-up section, the temperature of each bringing-up section are gradually risen along screw rod direction until reaching the fusing point of PBS, and PBS reaches lamination after melting
PBS laminations are coated on Kapton by the film head of machine, control laminating machine, postcooling make the PBS films of molten condition
Solidification can be quickly cooled down after being coated on Kapton, obtains the Kapton of single side coating PBS films；
3) using the Kapton of the single side coating PBS films of gained in step 2) as base material, control laminating machine drenches PBS
Film is coated on the another side of Kapton, postcooling the PBS films of molten condition is made to be coated on Kapton after
Solidification can be quickly cooled down, obtains the Kapton of two-sided coating PBS films, i.e. insulating layer；
4) last layer copper foil is respectively covered on the two sides of insulating layer, hot pressing is carried out at 250~300 DEG C through vacuum pressing-combining machine,
So that the melting of PBS films is bonded with copper foil, so as to which double side flexible copper coated board be made.
Further, the pressure of vacuum pressing-combining machine described in step 4) is 10~15MPa, and the time of hot pressing is 60~90s.
Further, the range of number-average molecular weight of the PBS is 1~1,000,000.
Further, multiple bringing-up sections described in step 2) are 6 bringing-up sections, and the heating temperatures of 6 bringing-up sections is from 50
DEG C increased with 15~20 DEG C incremented by successively, 15~20 DEG C, 10~20 DEG C, 10~20 DEG C, 10~20 DEG C of rule.
The advantageous effect of preparation method provided by the invention is：
1) copper-clad plate is made using the method that hot pressing after insulating layer is made in lamination in situ in preparation method of the invention so that
Bond strength between Kapton and PBS films, between PBS films and copper foil reaches maximum so that obtained copper foil tool
There are highest peel strength and dimensional stability；
2) its thickness of the copper-clad plate obtained by preparation method using the present invention is much lower with respect to conventional method, insulating layer
Thickness is substantially at 60 μm hereinafter, can meet the application demand of high-end electronic product；
3) process of synthesis and coating that laminating machine is come instead of chemistry is cleverly utilized in preparation method of the invention,
Chemical reagent and artificial use are greatly reduced, is greatly improved working efficiency.
Specific embodiment
The principle of the present invention and feature are described below in conjunction with example, the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the present invention.
Embodiment 1：
A kind of two layers of method double side flexible copper coated board, including upper and lower two copper foil layer and the insulation being located between two copper foil layers
Layer, the PBS films of insulating layer both sides including intermediate Kapton and above and below Kapton.
Wherein, the copper foil is rolled copper foil, and thickness is 12~35 μm, and the thickness of Kapton is 6~25 μm,
The thickness of PBS films is 6~20 μm, and the number-average molecular weight of PBS is 1~600,000.
The preparation method of above-mentioned double side flexible copper coated board is as follows：
1) PBS raw materials agitating and heating is dried, and is delivered to the storage bin of laminating machine；
2) raw material in storage bin heats propulsion after entering the screw rod of laminating machine, and laminating machine is interior to be divided into 6 along screw rod direction
Bringing-up section, the heating temperatures of 6 bringing-up sections is from 50~60 DEG C with 15 DEG C incremented by successively, 20 DEG C, 10 DEG C, 20 DEG C, 20 DEG C of rule
The fusing point for reaching PBS is increased up, the film head of laminating machine is reached after PBS meltings, PBS laminations are coated on polyamides by control laminating machine
On imines film, postcooling make the PBS films of molten condition that can be quickly cooled down solidification after being coated on Kapton,
Obtain the Kapton of single side coating PBS films；
3) using the Kapton of the single side coating PBS films of gained in step 2) as base material, control laminating machine drenches PBS
Film is coated on the another side of Kapton, postcooling the PBS films of molten condition is made to be coated on Kapton after
Solidification can be quickly cooled down, obtains the Kapton of two-sided coating PBS films, i.e. insulating layer；
4) last layer copper foil is respectively covered on the two sides of insulating layer, hot pressing, vacuum pressure is carried out at 250 DEG C through vacuum pressing-combining machine
The pressure of conjunction machine is 15MPa, and the time of hot pressing is 60s so that PBS films are melted to be bonded with copper foil, so as to which double-faced flexible be made
Copper-clad plate.
Embodiment 2：
A kind of two layers of method double side flexible copper coated board, including upper and lower two copper foil layer and the insulation being located between two copper foil layers
Layer, the PBS films of insulating layer both sides including intermediate Kapton and above and below Kapton.
Wherein, the copper foil is electrolytic copper foil, and thickness is 12~70 μm, and the thickness of Kapton is 6~25 μm,
The thickness of PBAT films is 6~20 μm, and the number-average molecular weight of PBAT is 60~1,000,000.
The preparation method of above-mentioned double side flexible copper coated board is as follows：
1) PBS raw materials agitating and heating is dried, and is delivered to the storage bin of laminating machine；
2) raw material in storage bin heats propulsion after entering the screw rod of laminating machine, and laminating machine is interior to be divided into 6 along screw rod direction
Bringing-up section, the heating temperatures of 6 bringing-up sections is from 50~60 DEG C with 20 DEG C incremented by successively, 15 DEG C, 20 DEG C, 10 DEG C, 10 DEG C of rule
The fusing point for reaching PBS is increased up, the film head of laminating machine is reached after PBS meltings, PBS laminations are coated on polyamides by control laminating machine
On imines film, postcooling make the PBS films of molten condition that can be quickly cooled down solidification after being coated on Kapton,
Obtain the Kapton of single side coating PBS films；
3) using the Kapton of the single side coating PBS films of gained in step 2) as base material, control laminating machine drenches PBS
Film is coated on the another side of Kapton, postcooling the PBS films of molten condition is made to be coated on Kapton after
Solidification can be quickly cooled down, obtains the Kapton of two-sided coating PBS films, i.e. insulating layer；
4) last layer copper foil is respectively covered on the two sides of insulating layer, hot pressing, vacuum pressure is carried out at 300 DEG C through vacuum pressing-combining machine
The pressure of conjunction machine is 15MPa, and the time of hot pressing is 90s so that PBS films are melted to be bonded with copper foil, so as to which double-faced flexible be made
Copper-clad plate.
Comparative example 1：
1) prepare the rolled copper foil that thickness is 12~35 μm, polyamide thermoplastic acid resin glue and thermosetting polyamide acid
Resin adhesive liquid；
2) thermosetting polyamide acid resin glue-coating is obtained into double-deck knot in the surface of copper foil through 120 DEG C of drying of baking oven
The single sided board of structure in single sided board surface drying layer surface coating thermoplastic polyamic acid resin glue, is dried after 120 DEG C, using
Imidization obtains the single sided board of three-decker；
3) single sided board of two pieces of three-deckers is obtained into the dual platen of five-layer structure through 350~400 DEG C of pressings of pressing machine.
Comparative example 2：
1) prepare the electrolytic copper foil that thickness is 12~70 μm, polyamide thermoplastic acid resin glue and thermosetting polyamide acid
Resin adhesive liquid；
2) polyamide thermoplastic acid resin glue-coating is obtained into double-deck knot in the surface of copper foil through 120 DEG C of drying of baking oven
The single sided board of structure is coated with thermosetting property polyamic acid resin glue in single sided board surface drying layer surface, is dried after 120 DEG C, using
Imidization obtains the single sided board of three-decker；
3) single sided board of two pieces of three-deckers is obtained into the dual platen of five-layer structure through 350~400 DEG C of pressings of pressing machine.
The preparation method of thermosetting polyamide acid resin glue is as follows：
NMP (N-Methyl pyrrolidone) and DMAc (DMAC N,N' dimethyl acetamide) is added in the three-necked flask of 1L altogether
360g weighs the PDA of the ODA and 16.006g of 6.50g, is dissolved in above-mentioned polar solvent NMP and DMAc and obtains solution, then will
The solution cools down in a water bath, adds in the BPDA (bibenzene tetracarboxylic dianhydride) of 52.665g under nitrogen flowing, and controlling reaction temperature is
It 15~20 DEG C, persistently stirs 8 hours and is reacted, thermosetting polyamide acid resin glue, solid content 15% is prepared.
The preparation method of polyamide thermoplastic acid resin glue is as follows：
NMP (N-Methyl pyrrolidone) and DMAc (DMAC N,N' dimethyl acetamide) is added in the three-necked flask of 1L altogether
460g weighs the BAPP of the BAPS and 32.841g of 8.654g, is dissolved in above-mentioned polar solvent NMP and DMAc and obtains solution, then
The solution is cooled down in a water bath, adds in the BPDA (bibenzene tetracarboxylic dianhydride) and 18.631g of 11.697g under nitrogen flowing
OPDA (3,3', 4,4'- diphenyl ether dianhydride), controlling reaction temperature are 15~20 DEG C, persistently stir 8 hours and are reacted, are prepared
Obtain polyamide thermoplastic acid resin glue, solid content 14%.
In order to verify the technique effect of double side flexible copper coated board provided by the invention, we are by embodiment 1,2 and of embodiment
The copper-clad plate of comparative example 1,2 gained of comparative example carries out the test of properties, and concrete outcome is as shown in table 1：
Glass transition temperature is tested：Using dynamic thermomechanical analysis apparatus (DMA2980, TA companies of the U.S.)；Assign 1Hz's
Vibration frequency, in a nitrogen atmosphere with the heating rate of 3 DEG C/min from room temperature to 400 DEG C, in dielectric loss angle tangent
Glass transition temperature is obtained at maximum value survey；
Heat decomposition temperature (Td 5%):Use thermogravimetric analyzer (TGA) with the rate of 10 DEG C/min by room temperature to 800
DEG C, weight change is observed, 5% weight is obtained and reduces temperature；
Crimpness test method：Material is cut into the size of 250mm × 250mm, tiling on the table, measures the curling of four sides
The average value of height；
Thermal stress：Plank is placed in 340 DEG C of tin stoves after handling 10 seconds and taken out, observation plank performance situation；
Coefficient of thermal expansion：Using thermomechanical analyzer (TMA), the polyimides sample to test is warming up in TMA
It 250 DEG C, keeps after ten minutes, with the rate of temperature fall of 5 DEG C/min, the thermal expansion between 240 DEG C to 100 DEG C being obtained at such a temperature
Coefficient；
Dimensional stability：It is tested according to the method for IPC-TM-650-2.4.4；
Peel strength：It is tested according to the method for IPC-TM-650-2.4.8；
Anti-flammability：It is tested with reference to UL94 standards.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (7)
1. a kind of two layers of method double side flexible copper coated board, which is characterized in that including upper and lower two copper foil layer and be located in two copper foil layers it
Between insulating layer, the insulating layer includes intermediate Kapton and the PBS of both sides is thin above and below Kapton
Film.
2. double side flexible copper coated board according to claim 1, which is characterized in that the thickness of the insulating layer is 18~65 μ
m。
3. double side flexible copper coated board according to claim 1 or 2, which is characterized in that the copper foil is rolled copper foil or electricity
Solve one kind in copper foil.
4. a kind of preparation method of two layers of method double side flexible copper coated board, which is characterized in that include the following steps：
1) PBS raw materials agitating and heating is dried, and is delivered to the storage bin of laminating machine；
2) raw material in storage bin heats propulsion after entering the screw rod of laminating machine, and laminating machine is interior to be divided into multiple heating along screw rod direction
Section, the temperature of each bringing-up section are gradually risen along screw rod direction until reaching the fusing point of PBS, and PBS reaches laminating machine after melting
PBS laminations are coated on Kapton by film head, control laminating machine, postcooling make the PBS film coatings of molten condition
Solidification can be quickly cooled down after on Kapton, obtains the Kapton of single side coating PBS films；
3) using the Kapton of the single side coating PBS films of gained in step 2) as base material, control laminating machine drapes over one's shoulders PBS laminations
Overlay on the another side of Kapton, postcooling make the PBS films of molten condition can after being coated on Kapton
Solidification is quickly cooled down, obtains the Kapton of two-sided coating PBS films, i.e. insulating layer；
4) last layer copper foil is respectively covered on the two sides of insulating layer, hot pressing is carried out at 250~300 DEG C through vacuum pressing-combining machine so that
PBS films are melted to be bonded with copper foil, so as to which double side flexible copper coated board be made.
5. preparation method according to claim 4, which is characterized in that the pressure of vacuum pressing-combining machine described in step 4) is 10
~15MPa, the time of hot pressing is 60~90s.
6. preparation method according to claim 4, which is characterized in that the range of number-average molecular weight of the PBS is 1~100
Ten thousand.
7. preparation method according to claim 4, which is characterized in that multiple bringing-up sections described in step 2) are 6 heating
Section, the heating temperatures of 6 bringing-up sections from 50 DEG C with 15~20 DEG C incremented by successively, 15~20 DEG C, 10~20 DEG C, 10~20
DEG C, 10~20 DEG C of rule increases.
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| CN201810015591.8A CN108237742A (en) | 2018-01-08 | 2018-01-08 | A kind of two layers of method double side flexible copper coated board and preparation method thereof |
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| CN201810015591.8A CN108237742A (en) | 2018-01-08 | 2018-01-08 | A kind of two layers of method double side flexible copper coated board and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111757592A (en) * | 2020-06-18 | 2020-10-09 | 昆山国显光电有限公司 | Flexible circuit board and display screen body assembly |
| CN115368566A (en) * | 2022-09-02 | 2022-11-22 | 中国科学技术大学先进技术研究院 | Polyimide composite membrane with low moisture absorption rate and low thermal expansion coefficient, preparation method thereof, thermosetting polyamic acid and thermosetting polyamic acid solution |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202986235U (en) * | 2012-12-10 | 2013-06-12 | 广东生益科技股份有限公司 | Double-faced flexible copper-clad plate |
-
2018
- 2018-01-08 CN CN201810015591.8A patent/CN108237742A/en not_active Withdrawn
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202986235U (en) * | 2012-12-10 | 2013-06-12 | 广东生益科技股份有限公司 | Double-faced flexible copper-clad plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111757592A (en) * | 2020-06-18 | 2020-10-09 | 昆山国显光电有限公司 | Flexible circuit board and display screen body assembly |
| CN111757592B (en) * | 2020-06-18 | 2021-12-10 | 昆山国显光电有限公司 | Flexible circuit board and display screen body assembly |
| CN115368566A (en) * | 2022-09-02 | 2022-11-22 | 中国科学技术大学先进技术研究院 | Polyimide composite membrane with low moisture absorption rate and low thermal expansion coefficient, preparation method thereof, thermosetting polyamic acid and thermosetting polyamic acid solution |
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