CN102602111A - Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product - Google Patents
Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product Download PDFInfo
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- CN102602111A CN102602111A CN2012100388696A CN201210038869A CN102602111A CN 102602111 A CN102602111 A CN 102602111A CN 2012100388696 A CN2012100388696 A CN 2012100388696A CN 201210038869 A CN201210038869 A CN 201210038869A CN 102602111 A CN102602111 A CN 102602111A
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Abstract
The invention relates to a method for producing an aluminum-base copper-clad plate and an aluminum-base copper-clad plate product. The method is characterized in that an adhesive layer and a copper film layer are pressed by using a roller and adhered synchronously so that the adhesive layer and the copper film layer are attached to a substrate for production. The method comprises the following steps: firstly, pressing a heat-conducting insulating layer on the surface of an aluminum-base plate in a rolling way by adopting a film laminating machine to obtain a first-step semi-finished product, secondly, exhausting and shaping the first-step semi-finished product, and finally, pressing copper on the first-step semi-finished product to obtain the finished product.
Description
Technical field
The present invention relates to a kind of method of producing aluminium base copper-clad plate and products thereof, be meant that especially a kind of roll extrusion mode of utilizing produces production method of aluminium base copper-clad plate and products thereof.
Background technology
As everyone knows; Aluminium base copper-clad plate is the raw-material a kind of of aluminium base; It is that a kind of electronics glass cloth or other reinforcing material soak with resin; One side or two-sided covering with Copper Foil and a kind of board-like material of processing through hot pressing are called as copper-clad laminate, abbreviate aluminium base copper-clad plate as; Baseplate material during aluminium base copper-clad plate is made as printed circuit board; Printed circuit board is mainly played interconnection, insulation and support, transmission speed, energy loss and the characteristic impedance etc. of signal in the circuit are had very big influence, the processability in the performance of printed circuit board, quality, the manufacturing, manufacture level, manufacturing cost and long-term reliability and stability depend on aluminium base copper-clad plate to a great extent.
Aluminium base copper-clad plate manufacturing is a rising industry, and it follows the development of electronic information, communications industry, has vast potential for future development, the new and high technology that its manufacturing technology is a multidisciplinary mutual intersection, interpenetrate, mutually promote.It and electronics and information industry are particularly with printed circuit industry synchronized development, indivisible.Its progress and development, the innovation that always receives electronic system product, semiconductor fabrication, electronic mounting technology and printed circuit board manufacturing technology drives with development.
Development along with courage new industries such as LED illuminations; Especially LED illumination market scale promotes fast; Grow with each passing day as the demand of the aluminium base copper-clad plate of indispensable raw material in electron trade in the electron trade production; Especially the development of LED technology makes the brightness of led chip increasingly high; Specification requirements such as thermal conductivity factor to aluminium base copper-clad plate are increasingly high, and traditional semifastening sheet aluminium base copper-clad plate of producing now has been difficult to satisfy the requirement that its technology improves constantly, and the manufacture technology production capacity of traditional aluminium base copper-clad plate is low in addition, power consumption is big, equipment has high input and many shortcomings such as cost of equipment maintenance height; Be difficult to satisfy the great demand amount and the technological requirement that improves constantly in market in the future, and this is the major defect for prior art.
Summary of the invention
The present invention provides production method of a kind of aluminium base copper-clad plate and products thereof; The present invention adopts roller to press bonding mode to produce its small investment; Production technology is simple; Easy to operate, the end properties of producing can substitute the quality requirement that the traditional glass cloth is made aluminium base entirely, and this is to be main purpose of the present invention.
The technical scheme that the present invention adopted is: a kind of production method of aluminium base copper-clad plate, this production method adopt roller pressing and synchronously bonding mode with glue-line and copper film layer attached to producing on the aluminium base, it specifically comprises following production stage:
The first step, adopt the mode pressing heat conductive insulating layer of roll extrusion on aluminium base surface; Utilize laminating machine that this heat conductive insulating lamination is combined on this aluminium base surface; Obtain first step semi-finished product, the nip roll temperature of this laminating machine of control is between the 110-130 degree in the process of pressing, and the control pressing speed is at per minute 0.5-1.5 rice; Need in the process of the pressing of the first step to guarantee that this heat conductive insulating layer and this aluminium base fit fully; Bubble can not occur or the Zhe that wrinkles, the process of accomplishing pressing leaves standstill cool to room temperature with these first step semi-finished product afterwards, afterwards the release transparent film layer on this heat conductive insulating layer is peeled off.
Second the step, these first step semi-finished product in the first step are carried out exhaust and typing; These first step semi-finished product that peel off release transparent film layer in the first step are inserted in the heater; Control heater internal temperature is between the 140-150 degree; The time of inserting is 9-10 minute, and these first step semi-finished product are incubated typing.
The 3rd step, press copper to handle, at first, adopt the mode of roller Copper Foil pressing to utilize roller Copper Foil pressing machine that Copper Foil is pressed together on this aluminium base these first step semi-finished product in second step through after the typing; Obtain the 3rd step semi-finished product; This Copper Foil is combined in the other one side of this aluminium base with respect to this heat conductive insulating lamination, and the bowl temperature of this roller Copper Foil pressing machine of control is between the 130-150 degree in the pressing process in the 3rd step, and the pressure force of controlling this roller Copper Foil pressing machine is in the 5-10 kg/cm; Then; The 3rd step semi-finished product are inserted carry out depth-hardened in the heater and handle, control heater internal temperature is between the 170-180 degree, and the time of inserting is 30-60 minute; Afterwards; The 3rd step semi-finished product are taken out under the cool to room temperature condition from heater, thereby accomplish, obtain finished product the 3rd half-finished cooling of step and typing.
This aluminium base is that cold bundle or heat are pricked aluminium sheet in the first step, and this aluminium base does not pass through the sealing of hole anodized.
Heater in second step and the 3rd step is baking box or continuous tunnel furnace.
In the process of carrying out for the 3rd step, adopt the mode of concora crush to utilize spreader bar that Copper Foil is pressed together on this aluminium base, obtain the 3rd step semi-finished product, at first; The other one side that this Copper Foil is laid on this aluminium base with respect to this heat conductive insulating layer is sent into spreader bar and is carried out pressing, in the pressing process, pressing is partly vacuumized disposable the exerting pressure in back, and the control pressure force is in the 35-45 kg/cm; Then; The 3rd step semi-finished product are inserted carry out depth-hardened in the heater and handle, control heater internal temperature is between the 170-180 degree, and the time of inserting is 30-60 minute; Afterwards; The 3rd step semi-finished product are taken out under the cool to room temperature condition from heater, thereby accomplish, obtain finished product the 3rd half-finished cooling of step and typing.
In the first step, can adopt this heat conductive insulating layer of mode pressing several layers of roll extrusion on the aluminium base surface.
Under the situation of two-layer this heat conductive insulating layer of pressing, the thickness of two-layer this heat conductive insulating layer is 50 microns.
And the peel strength of the aluminium base copper-clad plate that the production method of utilizing this aluminium base copper-clad plate is produced is 1.90N/mm after thermal stress, and sheet resistance is 7.8 * 10^9M Ω in the acceptance attitude, and the volume resistor rate is 7.2 * 10^8M Ω .m in the acceptance attitude; Thermal resistance is 0.48 ℃/W, and dielectric constant is 3.9, and dielectric dissipation factor is 0.021; Thermal conductivity factor is 2W/m. ℃; 180S under 260 ℃ condition is not stratified, non-foaming for the tin of anti-immersed solder, and breakdown voltage is 3KV, and arc resistance is 280S.
The number of plies through controlling this heat conductive insulating layer and thickness confirm to utilize the performance of the aluminium base copper-clad plate that the production method of this aluminium base copper-clad plate produces.
The number of plies at this heat conductive insulating layer is two-layer, and when its thickness was 50 microns, the breakdown voltage of aluminium base copper-clad plate was DC 3KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.48 ℃/W.
The number of plies at this heat conductive insulating layer is three layers, and when its thickness was 75 microns, the breakdown voltage of aluminium base copper-clad plate was DC 4KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.5 ℃/W.
The number of plies at this heat conductive insulating layer is four layers, and when its thickness was 100 microns, the breakdown voltage of aluminium base copper-clad plate was DC 5KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.56 ℃/W.
A kind of aluminium base copper-clad plate; Comprise aluminium base flaggy, heat conductive insulating layer, copper foil layer and release transparent film layer; Wherein, this aluminium base flaggy has first stitching surface and second stitching surface, and the bottom surface of this heat conductive insulating layer is fitted on this first stitching surface of this aluminium base flaggy; This copper foil layer is fitted on this second stitching surface of this aluminium base flaggy, and this release transparent film layer is fitted on the end face of this heat conductive insulating layer.This heat conductive insulating layer is made up of the several layers insulating barrier.
Beneficial effect of the present invention is: the product that utilizes method of the present invention to produce has glue-line and approaches; Reactance voltage is strong; Can make the heat of Copper Foil arrive aluminium sheet rapidly and play the heat conduction at a high speed and the effect of heat radiation, its production technology makes things convenient for, and use should technology can realize the high-speed production of not stopping; Broken away from the use semifastening sheet and supporting large laminator production equipment has high input/inefficient puzzlement.Advantages such as it is fast in the aluminium base copper-clad plate process speed of production to have solved this product, and operation is simple, and stability is good.
Description of drawings
Fig. 1 utilizes the inventive method to produce the section of structure of product.
Fig. 2 is the section of structure of the aluminium base copper-clad plate of the present invention.
The specific embodiment
As shown in Figure 1; A kind of production method of aluminium base copper-clad plate, this production method adopt roller pressing and synchronously bonding mode with glue-line and copper film layer attached to producing on the aluminium base, produce according to method of the present invention and to have small investment; Production technology is simple, convenience operation.
It specifically comprises following production stage:
The first step, adopt the mode pressing heat conductive insulating layers 20 of roll extrusion on aluminium base 10 surface.
This aluminium base 10 is that cold bundle or heat are pricked aluminium sheet, and this aluminium base 10 does not pass through the sealing of hole anodized.
Utilize laminating machine that this heat conductive insulating layer 20 is pressed together on these aluminium base 10 surfaces, obtain first step semi-finished product, the nip roll temperature of this laminating machine of control is between the 110-130 degree in the process of pressing, and the control pressing speed is at per minute 0.5-1.5 rice.
Need in the process of the pressing of the first step to guarantee that this heat conductive insulating layer 20 fits with this aluminium base 10 fully, the bubble Zhe that perhaps wrinkles can not occur.
The process of accomplishing pressing leaves standstill cool to room temperature with these first step semi-finished product afterwards, afterwards the release transparent film layer 21 on this heat conductive insulating layer 20 is peeled off.
Second the step, these first step semi-finished product in the first step are carried out exhaust and typing.
These first step semi-finished product that peel off release transparent film layer 21 in the first step are inserted in the heater, and control heater internal temperature is between the 140-150 degree, and the time of inserting is 9-10 minute, and these first step semi-finished product are incubated typing.
The 3rd step, press copper to handle to these first step semi-finished product in second step through after the typing.
At first, adopt the mode of roller Copper Foil pressing to utilize roller Copper Foil pressing machine that Copper Foil 40 is pressed together on this aluminium base 10, obtain the 3rd step semi-finished product.
This Copper Foil 40 is pressed together on the other one side of this aluminium base 10 with respect to this heat conductive insulating layer 20.
The bowl temperature of this roller Copper Foil pressing machine of control is between the 130-150 degree in the pressing process in the 3rd step, and the pressure force of controlling this roller Copper Foil pressing machine is in the 5-10 kg/cm.
Then, the 3rd step semi-finished product are inserted carry out depth-hardened in the heater and handle, control heater internal temperature is between the 170-180 degree, and the time of inserting is 30-60 minute.
Afterwards, the 3rd step semi-finished product are taken out under the cool to room temperature condition from heater, thereby accomplish, obtain finished product the 3rd half-finished cooling of step and typing.
In practical implementation, in the 3rd step, also can adopt the mode of concora crush to utilize spreader bar that Copper Foil 40 is pressed together on this aluminium base 10.
At first, adopt the mode of concora crush to utilize spreader bar that Copper Foil 40 is pressed together on this aluminium base 10, obtain the 3rd step semi-finished product.
The other one side that this Copper Foil 40 is laid on this aluminium base 10 with respect to this heat conductive insulating layer 20 is sent into spreader bar and is carried out pressing.
In the pressing process, pressing is partly vacuumized disposable the exerting pressure in back, the control pressure force is in the 35-45 kg/cm.
Then, the 3rd step semi-finished product are inserted carry out depth-hardened in the heater and handle, control heater internal temperature is between the 170-180 degree, and the time of inserting is 30-60 minute.
Afterwards, the 3rd step semi-finished product are taken out under the cool to room temperature condition from heater, thereby accomplish, obtain finished product the 3rd half-finished cooling of step and typing.
Heater in second step and the 3rd step is baking box or continuous tunnel furnace.
In practical implementation, in the first step, can adopt this heat conductive insulating layer 20 of mode pressing several layers of roll extrusion on aluminium base 10 surfaces.
Under the situation of two-layer this heat conductive insulating layer 20 of pressing, the thickness of two-layer this heat conductive insulating layer 20 is 50 microns.
At two-layer this heat conductive insulating layer 20 of pressing when the thickness of two-layer this heat conductive insulating layer 20 is 50 microns simultaneously, utilize aluminium base copper-clad plate that the production method of this aluminium base copper-clad plate produces.
Peel strength is 1.90N/mm after thermal stress, and sheet resistance is 7.8 * 10^9M Ω in the acceptance attitude, and the volume resistor rate is 7.2 * 10^8M Ω .m in the acceptance attitude; Thermal resistance is 0.48 ℃/W, and dielectric constant is 3.9, and dielectric dissipation factor is 0.021; Thermal conductivity factor is 2W/m. ℃; 180S under 260 ℃ condition is not stratified, non-foaming for the tin of anti-immersed solder, and breakdown voltage is 3KV, and arc resistance is 280S.
The number of plies that in addition can be through controlling this heat conductive insulating layer 20 and thickness confirm to utilize the performance of the aluminium base copper-clad plate that the production method of this aluminium base copper-clad plate produces.
The number of plies at this heat conductive insulating layer 20 is two-layer, and when its thickness was 50 microns, the breakdown voltage of aluminium base copper-clad plate was DC 3KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.48 ℃/W.
The number of plies at this heat conductive insulating layer 20 is three layers, and when its thickness was 75 microns, the breakdown voltage of aluminium base copper-clad plate was DC 4KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.5 ℃/W.
The number of plies at this heat conductive insulating layer 20 is four layers, and when its thickness was 100 microns, the breakdown voltage of aluminium base copper-clad plate was DC 5KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.56 ℃/W.
In practical implementation, also be attached with diaphragm 41 on this Copper Foil 40.
As shown in Figure 2; A kind of aluminium base copper-clad plate, it comprises aluminium base flaggy 1, heat conductive insulating layer 2, copper foil layer 3 and release transparent film layer 4, wherein; This aluminium base flaggy 1 has first stitching surface 11 and second stitching surface 12; The bottom surface of this heat conductive insulating layer 2 is fitted on this first stitching surface 11 of this aluminium base flaggy 1, and this copper foil layer 3 is fitted on this second stitching surface 12 of this aluminium base flaggy 1, and this release transparent film layer 4 is fitted on the end face of this heat conductive insulating layer 2.
This aluminium base flaggy 1, this heat conductive insulating layer 2, this copper foil layer 3 and this release transparent film layer 4 orders fit together and form this aluminium base copper-clad plate of the present invention.
This aluminium base flaggy 1 is that cold bundle or heat are pricked aluminium sheet, and this heat conductive insulating layer 2 is made up of the several layers insulating barrier in practical implementation.
In practical implementation, also be attached with diaphragm 5 on this Copper Foil 3.
Claims (9)
1. the production method of an aluminium base copper-clad plate is characterized in that: this production method adopt roller pressing and synchronously bonding mode with glue-line and copper film layer attached to producing on the aluminium base, it specifically comprises following production stage:
The first step, adopt the mode pressing heat conductive insulating layer of roll extrusion on aluminium base surface; Utilize laminating machine that this heat conductive insulating lamination is combined on this aluminium base surface, obtain first step semi-finished product, the nip roll temperature of this laminating machine of control is between the 110-130 degree in the process of pressing; The control pressing speed is at per minute 0.5-1.5 rice; Need in the process of the pressing of the first step to guarantee that this heat conductive insulating layer and this aluminium base fit fully, bubble can not occur or the Zhe that wrinkles, the process of accomplishing pressing leaves standstill cool to room temperature with these first step semi-finished product afterwards; Afterwards the release transparent film layer on this heat conductive insulating layer is peeled off
Second the step, these first step semi-finished product in the first step are carried out exhaust and typing; These first step semi-finished product that peel off release transparent film layer in the first step are inserted in the heater; Control heater internal temperature is between the 140-150 degree; The time of inserting is 9-10 minute, and these first step semi-finished product are incubated typing
The 3rd step, press copper to handle, at first, adopt the mode of roller Copper Foil pressing to utilize roller Copper Foil pressing machine that Copper Foil is pressed together on this aluminium base these first step semi-finished product in second step through after the typing; Obtain the 3rd step semi-finished product; This Copper Foil is combined in the other one side of this aluminium base with respect to this heat conductive insulating lamination, and the bowl temperature of this roller Copper Foil pressing machine of control is between the 130-150 degree in the pressing process in the 3rd step, and the pressure force of controlling this roller Copper Foil pressing machine is in the 5-10 kg/cm; Then; The 3rd step semi-finished product are inserted carry out depth-hardened in the heater and handle, control heater internal temperature is between the 170-180 degree, and the time of inserting is 30-60 minute; Afterwards; The 3rd step semi-finished product are taken out under the cool to room temperature condition from heater, thereby accomplish, obtain finished product the 3rd half-finished cooling of step and typing.
2. the production method of a kind of aluminium base copper-clad plate as claimed in claim 1 is characterized in that: this aluminium base is that cold bundle or heat are pricked aluminium sheet in the first step, and this aluminium base does not pass through the sealing of hole anodized.
3. the production method of a kind of aluminium base copper-clad plate as claimed in claim 1 is characterized in that: the heater in second step and the 3rd step is baking box or continuous tunnel furnace.
4. the production method of a kind of aluminium base copper-clad plate as claimed in claim 1 is characterized in that: in the process of carrying out for the 3rd step, adopt the mode of concora crush to utilize spreader bar that Copper Foil is pressed together on this aluminium base, obtain the 3rd step semi-finished product; At first, the other one side that this Copper Foil is laid on this aluminium base with respect to this heat conductive insulating layer is sent into spreader bar and is carried out pressing, in the pressing process, pressing is partly vacuumized disposable the exerting pressure in back; The control pressure force is in the 35-45 kg/cm, then, the 3rd step semi-finished product inserted carry out depth-hardened in the heater and handle; Control heater internal temperature is between the 170-180 degree; The time of inserting is 30-60 minute, afterwards, from heater, takes out the 3rd step semi-finished product under the cool to room temperature condition; Thereby accomplish the 3rd half-finished cooling of step and typing, obtain finished product.
5. the production method of a kind of aluminium base copper-clad plate as claimed in claim 1 is characterized in that: this heat conductive insulating layer of mode pressing several layers that in the first step, can adopt roll extrusion on the aluminium base surface.
6. the production method of a kind of aluminium base copper-clad plate as claimed in claim 5, it is characterized in that: under the situation of two-layer this heat conductive insulating layer of pressing, the thickness of two-layer this heat conductive insulating layer is 50 microns,
And the peel strength of the aluminium base copper-clad plate that the production method of utilizing this aluminium base copper-clad plate is produced is 1.90N/mm after thermal stress, and sheet resistance is 7.8 * 10^9M Ω in the acceptance attitude, and the volume resistor rate is 7.2 * 10^8M Ω .m in the acceptance attitude; Thermal resistance is 0.48 ℃/W, and dielectric constant is 3.9, and dielectric dissipation factor is 0.021; Thermal conductivity factor is 2W/m. ℃; 180S under 260 ℃ condition is not stratified, non-foaming for the tin of anti-immersed solder, and breakdown voltage is 3KV, and arc resistance is 280S.
7. the production method of a kind of aluminium base copper-clad plate as claimed in claim 5 is characterized in that: the number of plies through controlling this heat conductive insulating layer and thickness confirm to utilize the performance of the aluminium base copper-clad plate that the production method of this aluminium base copper-clad plate produces,
The number of plies at this heat conductive insulating layer is two-layer, and when its thickness was 50 microns, the breakdown voltage of aluminium base copper-clad plate was DC 3KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.48 ℃/W,
The number of plies at this heat conductive insulating layer is three layers, and when its thickness was 75 microns, the breakdown voltage of aluminium base copper-clad plate was DC 4KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.5 ℃/W,
The number of plies at this heat conductive insulating layer is four layers, and when its thickness was 100 microns, the breakdown voltage of aluminium base copper-clad plate was DC 5KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.56 ℃/W.
8. aluminium base copper-clad plate; It is characterized in that: comprise aluminium base flaggy, heat conductive insulating layer, copper foil layer and release transparent film layer; Wherein, this aluminium base flaggy has first stitching surface and second stitching surface, and the bottom surface of this heat conductive insulating layer is fitted on this first stitching surface of this aluminium base flaggy; This copper foil layer is fitted on this second stitching surface of this aluminium base flaggy, and this release transparent film layer is fitted on the end face of this heat conductive insulating layer.
9. a kind of aluminium base copper-clad plate as claimed in claim 8 is characterized in that: this heat conductive insulating layer is made up of the several layers insulating barrier.
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| CN201210038869.6A CN102602111B (en) | 2012-02-21 | 2012-02-21 | Production method of a kind of aluminum-based copper-clad plate and products thereof |
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| CN201210038869.6A CN102602111B (en) | 2012-02-21 | 2012-02-21 | Production method of a kind of aluminum-based copper-clad plate and products thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103648253A (en) * | 2013-11-21 | 2014-03-19 | 苏州市莱赛电车技术有限公司 | Novel thermally conductive and insulating structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103648253A (en) * | 2013-11-21 | 2014-03-19 | 苏州市莱赛电车技术有限公司 | Novel thermally conductive and insulating structure |
| CN103648253B (en) * | 2013-11-21 | 2016-01-20 | 苏州市莱赛电车技术有限公司 | A kind of Novel heat-conducting insulation system |
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| CN102602111B (en) | 2016-01-20 |
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