JPS6436440A - Clad material for electronic components - Google Patents
Clad material for electronic componentsInfo
- Publication number
- JPS6436440A JPS6436440A JP19353987A JP19353987A JPS6436440A JP S6436440 A JPS6436440 A JP S6436440A JP 19353987 A JP19353987 A JP 19353987A JP 19353987 A JP19353987 A JP 19353987A JP S6436440 A JPS6436440 A JP S6436440A
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- make
- plate
- clad
- clad material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
Abstract
PURPOSE:To make a clad material for electronic components which has low expansibility and high adhesiveness, thermal conductivity and electrical conductivity, by preparing a Fe-Ni-alloy plate as base material, cladding one side of the plate with Cu and the other side with Al, and making the percentage by volume of Al more than that of Cu when preventing the bending of this plate. CONSTITUTION:A clad material is made by rolling, pressing and sticking Al 3 on one side and Cu 2 on the other side of a Fe-Ni-alloy plate 1. Then, epoxy resin as an insulating layer 5 is pressed and sticked by heating on the Al side 3 of the clad and an electrolytic copper foil 6 is pressed and sticked by heating on the epoxy resin to make a surface mounting substrate. After the surface Cu foil of this composite substrate is patterned by etching and a circuit is formed on it, an IC element 8 is mounted on it and connected with a bonding wire 7 to make a semiconductor device. In this way it is possible to obtain a cladding material for electronic components which has low expansibility, high adhesiveness with isolation material, also high electrical conductivity and thermal conductivity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19353987A JPS6436440A (en) | 1987-08-01 | 1987-08-01 | Clad material for electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19353987A JPS6436440A (en) | 1987-08-01 | 1987-08-01 | Clad material for electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6436440A true JPS6436440A (en) | 1989-02-07 |
Family
ID=16309756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19353987A Pending JPS6436440A (en) | 1987-08-01 | 1987-08-01 | Clad material for electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6436440A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0716981A (en) * | 1993-07-02 | 1995-01-20 | Tokyo Tungsten Co Ltd | Metallic composite component |
JP2003237010A (en) * | 2002-02-18 | 2003-08-26 | Toyo Kohan Co Ltd | Method for manufacturing resistance plate laminated material and method for manufacturing component using resistance plate laminated material |
JP2005340578A (en) * | 2004-05-28 | 2005-12-08 | Sanyo Electric Co Ltd | Circuit device |
CN102602111A (en) * | 2012-02-21 | 2012-07-25 | 甄凯军 | Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product |
-
1987
- 1987-08-01 JP JP19353987A patent/JPS6436440A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0716981A (en) * | 1993-07-02 | 1995-01-20 | Tokyo Tungsten Co Ltd | Metallic composite component |
JP2003237010A (en) * | 2002-02-18 | 2003-08-26 | Toyo Kohan Co Ltd | Method for manufacturing resistance plate laminated material and method for manufacturing component using resistance plate laminated material |
JP2005340578A (en) * | 2004-05-28 | 2005-12-08 | Sanyo Electric Co Ltd | Circuit device |
CN102602111A (en) * | 2012-02-21 | 2012-07-25 | 甄凯军 | Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product |
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