CN102602111B - Production method of a kind of aluminum-based copper-clad plate and products thereof - Google Patents
Production method of a kind of aluminum-based copper-clad plate and products thereof Download PDFInfo
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- CN102602111B CN102602111B CN201210038869.6A CN201210038869A CN102602111B CN 102602111 B CN102602111 B CN 102602111B CN 201210038869 A CN201210038869 A CN 201210038869A CN 102602111 B CN102602111 B CN 102602111B
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Abstract
The present invention relates to its production method of production method of a kind of aluminum-based copper-clad plate and products thereof is adopt roller pressing and glue-line and copper film layer are attached on aluminium base and produce by the mode of synchronous bonding, first, the mode pressing thermally conductive insulating layer of roll extrusion is adopted on aluminium base surface, utilize laminating machine that this thermally conductive insulating layer is pressed together on this aluminium base on the surface, obtain first step semi-finished product, then, these first step semi-finished product are exhausted and are shaped, finally, pressure Copper treatment is carried out to these first step semi-finished product, thus obtains finished product.
Description
Technical field
The present invention relates to a kind of method of producing aluminum-based copper-clad plate and products thereof, refer to especially and a kind ofly utilize roll extrusion mode production method of producing aluminum-based copper-clad plate and products thereof.
Background technology
As everyone knows, aluminum-based copper-clad plate is the raw-material one of aluminium base, it is that a kind of electronic glass-fiber cloth or other reinforcing material soak with resin, one side or the two-sided a kind of board-like material made coated with Copper Foil and through hot pressing, be called as copper-clad laminate, referred to as aluminum-based copper-clad plate, baseplate material during aluminum-based copper-clad plate manufactures as printed circuit board, mainly interconnection is played to printed circuit board, insulation and the effect supported, to the transmission speed of signal in circuit, energy loss and characteristic impedance etc. have a great impact, the performance of printed circuit board, quality, processability in manufacture, manufacture level, manufacturing cost and long-term reliability and stability depend on aluminum-based copper-clad plate to a great extent.
Aluminum-based copper-clad plate manufacturing is a rising industry, and it, with the development of electronic information, communications industry, has vast potential for future development, and its manufacturing technology is a multidisciplinary mutual intersection, the new and high technology that interpenetrates, mutually promote.It and electronics and information industry are particularly with PCB industry synchronized development, indivisible.Its progress and development, the innovation being always subject to electronic system product, semiconductor fabrication, electronic mounting technology and Manufacturing Technology for PCB driven with development.
Along with the development of the courage new industries such as LED illumination, especially LED illumination market scale promotes fast, in producing as electron trade, the demand of indispensable raw material aluminum-based copper-clad plate in electron trade grows with each passing day, especially the development of LED technology makes the brightness of LED chip more and more higher, more and more higher to technical requirements such as the thermal conductivity factors of aluminum-based copper-clad plate, the aluminum-based copper-clad plate that now traditional semifastening sheet is produced has been difficult to meet the requirement that its technology improves constantly, in addition the manufacture technique production capacity of traditional aluminum-based copper-clad plate is low, power consumption is large, the shortcomings such as the large and cost of equipment maintenance of equipment investment is high, be difficult to meet the requirement that the great demand amount in market and technology in the future improve constantly, and this is the major defect for prior art.
Summary of the invention
The invention provides production method of a kind of aluminum-based copper-clad plate and products thereof, the present invention adopts roller to press bonding mode to produce its small investment, production technology is simple, easy to operate, the end properties produced can substitute the quality requirement that conventional fiber glass cloth makes aluminium base entirely, and this is main purpose of the present invention.
The technical solution adopted in the present invention is: a kind of production method of aluminum-based copper-clad plate, and this production method adopts roller pressing and glue-line and copper film layer are attached on aluminium base and produce by the mode of synchronous bonding, and it specifically comprises following production stage:
The first step, the mode pressing thermally conductive insulating layer of roll extrusion is adopted on aluminium base surface, utilize laminating machine that this thermally conductive insulating layer is pressed together on this aluminium base on the surface, obtain first step semi-finished product, the nip roll temperature of this laminating machine is controlled between 110-130 degree in the process of pressing, control pressing speed at 0.5-1.5 rice per minute, need to ensure that this thermally conductive insulating layer and this aluminium base are fitted completely in the process of the pressing of the first step, bubble or wrinkle folding can not be there is, after completing the process of pressing, these first step semi-finished product are left standstill cool to room temperature, afterwards the release transparent film layer in this thermally conductive insulating layer is peeled off.
Second step, these first step semi-finished product in the first step are exhausted and are shaped, these first step semi-finished product peeling off release transparent film layer in the first step are inserted in heater, control heater internal temperature between 140-150 degree, the time of inserting is 9-10 minute, carries out insulation sizing to these first step semi-finished product.
3rd step, pressure Copper treatment is carried out to these first step semi-finished product after sizing in second step, first, the mode of roller Copper Foil pressing is adopted to utilize roller Copper Foil pressing machine to be pressed together on by Copper Foil on this aluminium base, obtain the 3rd step semi-finished product, this Copper Foil is pressed together on the other one side of this aluminium base relative to this thermally conductive insulating layer, the bowl temperature of this roller Copper Foil pressing machine is controlled between 130-150 degree in the bonding processes of the 3rd step, control the pressure force of this roller Copper Foil pressing machine in 5-10 kg/cm, then, 3rd step semi-finished product are inserted in heater and carries out depth-hardened process, control heater internal temperature between 170-180 degree, the time of inserting is 30-60 minute, afterwards, under 3rd step semi-finished product are taken out cool to room temperature condition from heater, thus complete the half-finished cooling of the 3rd step and sizing, obtain finished product.
This aluminium base is that cold bundle or heat prick aluminium sheet in a first step, and this aluminium base is not through sealing of hole anodized.
Heater in second step and the 3rd step is baking box or continuous tunnel furnace.
In the process of carrying out the 3rd step, adopt the mode of concora crush to utilize spreader bar to be pressed together on by Copper Foil on this aluminium base, obtain the 3rd step semi-finished product, first, the other one side feeding spreader bar that this Copper Foil is laid on this aluminium base relative to this thermally conductive insulating layer is carried out pressing, disposablely after compressed portion being vacuumized in bonding processes to exert pressure, control pressure force in 35-45 kg/cm, then, 3rd step semi-finished product are inserted in heater and carries out depth-hardened process, control heater internal temperature between 170-180 degree, the time of inserting is 30-60 minute, afterwards, under 3rd step semi-finished product are taken out cool to room temperature condition from heater, thus complete the half-finished cooling of the 3rd step and sizing, obtain finished product.
This thermally conductive insulating layer of the some layers of mode pressing of roll extrusion can be adopted in a first step on aluminium base surface.
When pressing this thermally conductive insulating layer two-layer, the thickness of this thermally conductive insulating layer two-layer is 50 microns.
And the peel strength of the aluminum-based copper-clad plate utilizing the production method of this aluminum-based copper-clad plate to produce is 1.90N/mm after thermal stress, sheet resistance is 7.8 × 10^9M Ω in acceptance state, volume resistor rate is 7.2 × 10^8M Ω .m in acceptance state, thermal resistance is 0.48 DEG C/W, and dielectric constant is 3.9, and dielectric dissipation factor is 0.021, thermal conductivity factor is 2W/m. DEG C, 180S under the condition of 260 DEG C is not stratified, non-foaming for resistance to dip brazing tin, and breakdown voltage is 3KV, and arc resistance is 280S.
The performance of the aluminum-based copper-clad plate determining to utilize the production method of this aluminum-based copper-clad plate to produce by the number of plies and thickness controlling this thermally conductive insulating layer.
Be two-layer in the number of plies of this thermally conductive insulating layer, time its thickness is 50 microns, the breakdown voltage of aluminum-based copper-clad plate is DC3KV, and thermal stress is 288 DEG C of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.48 DEG C/W.
Be three layers in the number of plies of this thermally conductive insulating layer, time its thickness is 75 microns, the breakdown voltage of aluminum-based copper-clad plate is DC4KV, and thermal stress is 288 DEG C of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.5 DEG C/W.
Be four layers in the number of plies of this thermally conductive insulating layer, time its thickness is 100 microns, the breakdown voltage of aluminum-based copper-clad plate is DC5KV, and thermal stress is 288 DEG C of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.56 DEG C/W.
A kind of aluminum-based copper-clad plate, comprise aluminium base flaggy, thermally conductive insulating layer, copper foil layer and release transparent film layer, wherein, this aluminium base flaggy has the first stitching surface and the second stitching surface, the bottom surface of this thermally conductive insulating layer is fitted on this first stitching surface of this aluminium base flaggy, this copper foil layer is fitted on this second stitching surface of this aluminium base flaggy, and this release transparent film layer is fitted on the end face of this thermally conductive insulating layer.This thermally conductive insulating layer is made up of some layer insulatings.
Beneficial effect of the present invention is: it is thin that the product utilizing method of the present invention to produce has glue-line, reactance voltage is strong, the heat of Copper Foil can be made to arrive rapidly aluminium sheet and to play the heat conduction of high speed and the effect of heat radiation, its production technology is convenient, use this technology can realize high-speed production of not stopping, broken away from use semifastening sheet and supporting large laminator production equipment, have high input/inefficient puzzlement.Solve this product fast in production aluminum-based copper-clad plate process speed, operation is simple, the advantages such as stability is good.
Accompanying drawing explanation
Fig. 1 is the section of structure utilizing the inventive method to produce product.
Fig. 2 is the section of structure of aluminum-based copper-clad plate of the present invention.
Detailed description of the invention
As shown in Figure 1, a production method for aluminum-based copper-clad plate, this production method adopts roller pressing and glue-line and copper film layer are attached on aluminium base and produce by the mode of synchronous bonding, carries out production have small investment according to method of the present invention, production technology is simple, easy to operate feature.
It specifically comprises following production stage:
The first step, adopt the mode pressing thermally conductive insulating layer 20 of roll extrusion on aluminium base 10 surface.
This aluminium base 10 is that cold bundle or heat prick aluminium sheet, and this aluminium base 10 is not through sealing of hole anodized.
Utilize laminating machine that this thermally conductive insulating layer 20 is pressed together on this aluminium base 10 on the surface, obtain first step semi-finished product, in the process of pressing, control the nip roll temperature of this laminating machine between 110-130 degree, control pressing speed at 0.5-1.5 rice per minute.
Need to ensure that this thermally conductive insulating layer 20 is fitted completely with this aluminium base 10 in the process of the pressing of the first step, bubble or wrinkle folding can not be occurred.
After completing the process of pressing, these first step semi-finished product are left standstill cool to room temperature, afterwards the release transparent film layer 21 in this thermally conductive insulating layer 20 is peeled off.
Second step, these first step semi-finished product in the first step are exhausted and are shaped.
Insert in heater by these first step semi-finished product peeling off release transparent film layer 21 in the first step, control heater internal temperature between 140-150 degree, the time of inserting is 9-10 minute, carries out insulation sizing to these first step semi-finished product.
3rd step, in second step through sizing after these first step semi-finished product carry out pressure Copper treatment.
First, adopt the mode of roller Copper Foil pressing to utilize roller Copper Foil pressing machine to be pressed together on this aluminium base 10 by Copper Foil 40, obtain the 3rd step semi-finished product.
This Copper Foil 40 is pressed together on the other one side of this aluminium base 10 relative to this thermally conductive insulating layer 20.
In the bonding processes of the 3rd step, control the bowl temperature of this roller Copper Foil pressing machine between 130-150 degree, control the pressure force of this roller Copper Foil pressing machine in 5-10 kg/cm.
Then, inserted in heater by the 3rd step semi-finished product and carry out depth-hardened process, control heater internal temperature between 170-180 degree, the time of inserting is 30-60 minute.
Afterwards, under the 3rd step semi-finished product are taken out cool to room temperature condition from heater, thus complete the half-finished cooling of the 3rd step and sizing, obtain finished product.
Also the mode of concora crush can be adopted in the third step to utilize spreader bar to be pressed together on this aluminium base 10 by Copper Foil 40 when concrete enforcement.
First, adopt the mode of concora crush to utilize spreader bar to be pressed together on this aluminium base 10 by Copper Foil 40, obtain the 3rd step semi-finished product.
The other one side feeding spreader bar that this Copper Foil 40 is laid on this aluminium base 10 relative to this thermally conductive insulating layer 20 is carried out pressing.
Disposablely after compressed portion being vacuumized in bonding processes to exert pressure, control pressure force in 35-45 kg/cm.
Then, inserted in heater by the 3rd step semi-finished product and carry out depth-hardened process, control heater internal temperature between 170-180 degree, the time of inserting is 30-60 minute.
Afterwards, under the 3rd step semi-finished product are taken out cool to room temperature condition from heater, thus complete the half-finished cooling of the 3rd step and sizing, obtain finished product.
Heater in second step and the 3rd step is baking box or continuous tunnel furnace.
When concrete enforcement, this thermally conductive insulating layer 20 of the some layers of mode pressing of roll extrusion can be adopted in a first step on aluminium base 10 surface.
When pressing two-layer this thermally conductive insulating layer 20, the thickness of this thermally conductive insulating layer 20 two-layer is 50 microns.
In pressing this thermally conductive insulating layer 20 two-layer while, the thickness of this thermally conductive insulating layer 20 two-layer is 50 microns, the aluminum-based copper-clad plate utilizing the production method of this aluminum-based copper-clad plate to produce.
Peel strength is 1.90N/mm after thermal stress, sheet resistance is 7.8 × 10^9M Ω in acceptance state, volume resistor rate is 7.2 × 10^8M Ω .m in acceptance state, thermal resistance is 0.48 DEG C/W, and dielectric constant is 3.9, and dielectric dissipation factor is 0.021, thermal conductivity factor is 2W/m. DEG C, 180S under the condition of 260 DEG C is not stratified, non-foaming for resistance to dip brazing tin, and breakdown voltage is 3KV, and arc resistance is 280S.
The performance of the aluminum-based copper-clad plate can determining to utilize the production method of this aluminum-based copper-clad plate to produce by the number of plies and thickness controlling this thermally conductive insulating layer 20 in addition.
Be two-layer in the number of plies of this thermally conductive insulating layer 20, time its thickness is 50 microns, the breakdown voltage of aluminum-based copper-clad plate is DC3KV, and thermal stress is 288 DEG C of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.48 DEG C/W.
Be three layers in the number of plies of this thermally conductive insulating layer 20, time its thickness is 75 microns, the breakdown voltage of aluminum-based copper-clad plate is DC4KV, and thermal stress is 288 DEG C of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.5 DEG C/W.
Be four layers in the number of plies of this thermally conductive insulating layer 20, time its thickness is 100 microns, the breakdown voltage of aluminum-based copper-clad plate is DC5KV, and thermal stress is 288 DEG C of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.56 DEG C/W.
When concrete enforcement, this Copper Foil 40 is also attached with diaphragm 41.
As shown in Figure 2, a kind of aluminum-based copper-clad plate, it comprises aluminium base flaggy 1, thermally conductive insulating layer 2, copper foil layer 3 and release transparent film layer 4, wherein, this aluminium base flaggy 1 has the first stitching surface 11 and the second stitching surface 12, the bottom surface of this thermally conductive insulating layer 2 is fitted on this first stitching surface 11 of this aluminium base flaggy 1, and this copper foil layer 3 is fitted on this second stitching surface 12 of this aluminium base flaggy 1, and this release transparent film layer 4 is fitted on the end face of this thermally conductive insulating layer 2.
This aluminium base flaggy 1, this thermally conductive insulating layer 2, this copper foil layer 3 and this release transparent film layer 4 order fit together and form this aluminum-based copper-clad plate of the present invention.
This aluminium base flaggy 1 is that cold bundle or heat prick aluminium sheet, and when concrete enforcement, this thermally conductive insulating layer 2 is made up of some layer insulatings.
When concrete enforcement, this Copper Foil 3 is also attached with diaphragm 5.
Claims (5)
1. a production method for aluminum-based copper-clad plate, is characterized in that: this production method adopts roller pressing and glue-line and copper film layer are attached on aluminium base and produce by the mode of synchronous bonding, and it specifically comprises following production stage:
The first step, the mode pressing thermally conductive insulating layer of roll extrusion is adopted on aluminium base surface, utilize laminating machine that this thermally conductive insulating layer is pressed together on this aluminium base on the surface, obtain first step semi-finished product, the nip roll temperature of this laminating machine is controlled between 110-130 degree Celsius in the process of pressing, control pressing speed at 0.5-1.5 rice per minute, need to ensure that this thermally conductive insulating layer and this aluminium base are fitted completely in the process of the pressing of the first step, bubble or wrinkle folding can not be there is, after completing the process of pressing, these first step semi-finished product are left standstill cool to room temperature, afterwards the release transparent film layer in this thermally conductive insulating layer is peeled off,
Second step, these first step semi-finished product in the first step are exhausted and are shaped, these first step semi-finished product peeling off release transparent film layer in the first step are inserted in heater, control heater internal temperature between 140-150 degree Celsius, the time of inserting is 9-10 minute, insulation sizing is carried out to these first step semi-finished product
3rd step, pressure Copper treatment is carried out to these first step semi-finished product after sizing in second step, first, the mode of roller Copper Foil pressing is adopted to utilize roller Copper Foil pressing machine to be pressed together on by Copper Foil on this aluminium base, obtain the 3rd step semi-finished product, this Copper Foil is pressed together on the other one side of this aluminium base relative to this thermally conductive insulating layer, the bowl temperature of this roller Copper Foil pressing machine is controlled between 130-150 degree Celsius in the bonding processes of the 3rd step, control the pressure force of this roller Copper Foil pressing machine in 5-10 kg/cm, then, 3rd step semi-finished product are inserted in heater and carries out depth-hardened process, control heater internal temperature between 170-180 degree Celsius, the time of inserting is 30-60 minute, afterwards, under 3rd step semi-finished product are taken out cool to room temperature condition from heater, thus complete the half-finished cooling of the 3rd step and sizing, obtain finished product,
This aluminum-based copper-clad plate, comprise aluminium base flaggy, thermally conductive insulating layer, copper foil layer and release transparent film layer, wherein, this aluminium base flaggy has the first stitching surface and the second stitching surface, the bottom surface of this thermally conductive insulating layer is fitted on this first stitching surface of this aluminium base flaggy, this copper foil layer is fitted on this second stitching surface of this aluminium base flaggy, and this release transparent film layer is fitted on the end face of this thermally conductive insulating layer, and this thermally conductive insulating layer is made up of some layer insulatings.
2. the production method of a kind of aluminum-based copper-clad plate as claimed in claim 1, is characterized in that: the heater in second step and the 3rd step is baking box or continuous tunnel furnace.
3. the production method of a kind of aluminum-based copper-clad plate as claimed in claim 1, it is characterized in that: in the process of carrying out the 3rd step, adopt the mode of concora crush to utilize spreader bar to be pressed together on by Copper Foil on this aluminium base, obtain the 3rd step semi-finished product, first, the other one side feeding spreader bar that this Copper Foil is laid on this aluminium base relative to this thermally conductive insulating layer is carried out pressing, disposablely after compressed portion being vacuumized in bonding processes to exert pressure, control pressure force in 35-45 kg/cm, then, 3rd step semi-finished product are inserted in heater and carries out depth-hardened process, control heater internal temperature between 170-180 degree Celsius, the time of inserting is 30-60 minute, afterwards, under 3rd step semi-finished product are taken out cool to room temperature condition from heater, thus complete the half-finished cooling of the 3rd step and sizing, obtain finished product.
4. the production method of a kind of aluminum-based copper-clad plate as claimed in claim 1, is characterized in that: this thermally conductive insulating layer of the some layers of mode pressing that can adopt roll extrusion in a first step on aluminium base surface.
5. the production method of a kind of aluminum-based copper-clad plate as claimed in claim 4, is characterized in that: when pressing this thermally conductive insulating layer two-layer, the thickness of this thermally conductive insulating layer two-layer is 50 microns,
And the peel strength of the aluminum-based copper-clad plate utilizing the production method of this aluminum-based copper-clad plate to produce is 1.90N/mm after thermal stress, sheet resistance is 7.8 × 10^9M Ω in acceptance state, specific insulation is 7.2 × 10^8M Ω .m in acceptance state, thermal resistance is 0.48 DEG C/W, and dielectric constant is 3.9, and dielectric dissipation factor is 0.021, thermal conductivity factor is 2W/m. DEG C, 180S under the condition of 260 DEG C is not stratified, non-foaming for resistance to dip brazing tin, and breakdown voltage is 3KV, and arc resistance is 280S.
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CN103648253B (en) * | 2013-11-21 | 2016-01-20 | 苏州市莱赛电车技术有限公司 | A kind of Novel heat-conducting insulation system |
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JPS6436440A (en) * | 1987-08-01 | 1989-02-07 | Hitachi Cable | Clad material for electronic components |
JPH06350213A (en) * | 1993-06-14 | 1994-12-22 | Denki Kagaku Kogyo Kk | Metal base board |
JPH0823165A (en) * | 1994-07-08 | 1996-01-23 | Hitachi Chem Co Ltd | Manufacture of metal cored wiring board using copper foil with insulating bonding agent |
KR101044787B1 (en) * | 2008-06-30 | 2011-06-29 | 삼성전기주식회사 | Manufacturing method for printed circuit board having VOP structure |
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