CN115139589B - High-heat-conductivity copper-clad plate and preparation method thereof - Google Patents

High-heat-conductivity copper-clad plate and preparation method thereof Download PDF

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CN115139589B
CN115139589B CN202210735325.9A CN202210735325A CN115139589B CN 115139589 B CN115139589 B CN 115139589B CN 202210735325 A CN202210735325 A CN 202210735325A CN 115139589 B CN115139589 B CN 115139589B
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weight
insulating layer
parts
copper
heat
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CN115139589A (en
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罗龙华
黄行
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Xiamen Yinglewei New Material Technology Co ltd
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Xiamen Yinglewei New Material Technology Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention belongs to the technical field of manufacturing of metal copper-clad plates, and discloses a high-heat-conductivity copper-clad plate and a preparation method thereof. The high heat conduction copper clad laminate comprises: a first copper foil layer; a first insulating layer covering the first copper foil layer; an intermediate layer which is covered on the first insulating layer; a second insulating layer covering the intermediate layer; and a second copper foil layer coated on the second insulating layer. The copper-clad plate with the specific combined structure constructed by the invention not only has excellent overall heat conductivity coefficient which is more than 75W/M.K, but also can effectively improve the heat dissipation effect of the copper-clad plate; the high-heat-conductivity flexible printed circuit board has good bending resistance, the bending resistance times are more than or equal to 15 times, and the high-heat-conductivity flexible printed circuit board can be processed and bent in any mode for many times, so that the high-heat-conductivity flexible printed circuit board has high heat-conductivity and the capability of being processed and bent for many times, can be well applied to printed circuits, and is suitable for industrial production.

Description

High-heat-conductivity copper-clad plate and preparation method thereof
Technical Field
The invention belongs to the technical field of manufacturing of metal copper-clad plates, and particularly relates to a high-heat-conductivity copper-clad plate and a preparation method thereof.
Background
The copper clad laminate is a plate-shaped composite material prepared by immersing electronic glass fiber cloth or other reinforcing materials in resin liquid, coating copper foil on one or both sides, and hot-pressing at a certain temperature and pressure, and is called copper clad laminate (Copper Clad Laminate, CCL), which is called copper clad laminate for short. Copper-clad laminates have become increasingly the basis material for the manufacture of printed circuit boards (Printed Circuit Board, PCBs) due to their excellent heat dissipation capabilities. PCBs are one of the important components of the electronics industry, as small as electronic watches, calculators, as large as computers, communications electronics, and military weapon systems, and as long as there are electronic components of the integrated circuit, printed circuit boards are used.
The copper-clad plate is mainly responsible for conducting, insulating and supporting three functions on the whole printed circuit board. The resin liquid in the copper-clad plate generally uses a thermosetting resin composition. Thermosetting resins are a general class of synthetic resins that are crosslinked and cured to insoluble and infusible materials by chemical reaction of the resins under heat, pressure, or under the action of a curing agent, ultraviolet light, or the like. The thermosetting resin, curing agent, accelerator, filler and the like form a thermosetting resin composition, the thermosetting resin composition is prepared into resin glue solution which is applied to the production of prepreg, and the prepreg is subjected to hot pressing to obtain the copper-clad laminate.
In order to endow the prepreg and the copper-clad plate with ultrahigh heat dissipation characteristics, a metal base is generally used as a substrate in the industry at present, and a large amount of heat-conducting ceramic powder such as aluminum oxide, aluminum nitride and/or silicon carbide is added into an insulating layer so as to achieve the purposes of rapidly dissipating heat and reducing the temperature of an electronic circuit in a use state. However, with the increase of the amount of the heat conductive filler, the metal-based copper-clad plate cannot be applied to circuits requiring complicated processing conditions and assembly modes due to the problems of high hardness, incapability of bending and the like.
In recent years, new energy vehicles are developed day by day, and have been promoted to the strategic level of energy transformation by the state. The new energy vehicle thoroughly breaks the dominant role of the fuel oil vehicle in the market, and the core technology is that the two aspects of charging and electricity storage are required to be rapidly developed and broken through, wherein the rapid charging technology and the high-capacity battery technology are important. Different from the states of other electric appliances in the working process, the new energy vehicle is in a rapid working process in the charging process, namely a charging device part and an electric storage device part, so that a large amount of heat is rapidly accumulated, if the heat cannot be rapidly dissipated to keep the electronic circuit part in a low-temperature state, the circuit is damaged and cannot normally run due to light weight, and the circuit is ignited due to heavy weight to form a major safety accident.
For copper-clad plates applied to the field of new energy vehicles, domestic researchers have carried out a lot of researches on the copper-clad plates. CN 111171771a discloses a bonding sheet and a preparation method thereof, wherein the bonding sheet is prepared by coating epoxy modified high-heat-conductivity glue solution on a release film and then drying the release film, and the obtained bonding sheet has excellent high-heat-conductivity characteristics and high-elasticity low-modulus characteristics. The invention adopts the mode of compounding the organic silicon modified resin with the high heat conduction oxide powder, and the heat conduction coefficient of the obtained insulating layer reaches 3.0W/MK, but the whole heat conduction coefficient is poor. Meanwhile, the invention uses the aluminum plate as a substrate, and as a charging circuit device, an arc-shaped or bending circuit is often required to be used, so that the application range of the design has limitation and small moldability.
CN 104629263a discloses a method for manufacturing a bending-resistant aluminum-based copper-clad plate, which is formed by adopting epoxy resin to compound an amine curing agent, a toughening agent and a proper amount of heat conducting ceramic powder, and coating and pressing. According to the invention, components with excellent toughening effect such as nitrile rubber, chloroprene rubber or polyvinyl butyral are used for modifying epoxy resin, and although the insulating layer which is bending-resistant and convenient to process and assemble is formed, the main heat radiation body is an aluminum plate, so that the deformation-resistant capability of the heat radiation body is greatly reduced after a long time, multiple times of bending cannot be realized, and the heat radiation body is not suitable for a circuit in a charging industry.
In summary, we need to develop a copper-clad plate with ultra-high thermal conductivity and strong heat dissipation performance, which can be processed and bent and assembled in any way for many times.
Disclosure of Invention
The invention aims to overcome the technical defects that the copper-clad plate in the prior art cannot simultaneously have high heat conduction performance and can be processed and bent and assembled at will, and provides the copper-clad plate which has ultrahigh heat conduction coefficient and strong heat dissipation performance and can be processed and bent and assembled at will for many times.
The first object of the present invention is to provide a high heat conduction copper clad laminate comprising:
a first copper foil layer;
a first insulating layer covering the first copper foil layer;
an intermediate layer which is covered on the first insulating layer;
a second insulating layer covering the intermediate layer; and
the second copper foil layer is covered on the second insulating layer;
wherein, the forming raw materials of the first insulating layer and the second insulating layer comprise, by weight: 10 to 80 parts by weight of epoxy resin A, 1 to 40 parts by weight of curing agent B, 0.01 to 1 part by weight of accelerator C, 50 to 200 parts by weight of filler D and 10 to 50 parts by weight of toughening agent E; the heat conductivity coefficients of the first insulating layer and the second insulating layer are respectively and independently 1-3W/MK;
the intermediate layer comprises the following raw materials in parts by weight: 10 to 80 parts by weight of epoxy resin F, 1 to 40 parts by weight of curing agent G, 0.01 to 1 part by weight of accelerator H, 50 to 500 parts by weight of ultra-high conductive inorganic powder I and 10 to 50 parts by weight of toughening agent J; the heat conductivity coefficient of the intermediate layer is 100-200W/MK.
In a preferred embodiment, the thickness of the first copper foil layer and the second copper foil layer is each independently 12 to 105 μm; the thickness of the first insulating layer and the second insulating layer is 50-200 mu m independently; the thickness of the intermediate layer is 100-1000 mu m.
In a preferred embodiment, the epoxy resin a is a difunctional epoxy resin and/or a phenolic epoxy resin; the curing agent B is at least one of dicyandiamide, 4-diamino diphenyl sulfone, phenolic resin, anhydride and active ester; the accelerator C is an imidazole accelerator; the filler D is an inorganic filler; the toughening agent E is at least one of phenoxy resin, polyethylene modified resin, polyurethane modified resin and polybutadiene modified resin.
In a preferred embodiment, the epoxy resin F is a difunctional epoxy resin and/or a phenolic epoxy resin; the curing agent G is at least one of dicyandiamide, 4-diamino diphenyl sulfone, phenolic resin, anhydride and active ester; the accelerator H is an imidazole accelerator; the ultrahigh-conductivity inorganic powder I is at least one of insulating carbon powder, conductive carbon powder, graphene powder and modified conductive carbon powder; the toughening agent J is at least one of phenoxy resin, polyethylene modified resin, polyurethane modified resin and polybutadiene modified resin.
In a preferred embodiment, the first insulating layer and the second insulating layer are formed from raw materials, each independently comprising, in parts by weight: 10 to 45 parts by weight of epoxy resin A, 1 to 10 parts by weight of curing agent B, 0.02 to 0.5 part by weight of accelerator C, 100 to 200 parts by weight of filler D and 20 to 40 parts by weight of toughening agent E.
In a preferred embodiment, the intermediate layer is formed from raw materials in parts by weight including: 10 to 45 parts by weight of epoxy resin F, 1 to 10 parts by weight of curing agent G, 0.02 to 0.5 part by weight of accelerator H, 300 to 500 parts by weight of ultra-high conductive inorganic powder I and 20 to 40 parts by weight of toughening agent J.
The second object of the invention is to provide a preparation method of a high-heat-conductivity copper-clad plate, which comprises the following steps:
s1: adding a curing agent B and an accelerator C into a solvent I for full dissolution, and then sequentially adding an epoxy resin A, a filler D and a toughening agent E for full dissolution to obtain a first insulating layer glue solution and a second insulating layer glue solution respectively and independently;
s2: adding a curing agent G and an accelerator H into a solvent II for full dissolution, and then sequentially adding an epoxy resin F, an ultra-high conductive inorganic powder I and a toughening agent J for full dissolution to obtain an intermediate layer glue solution;
s3: coating a first insulating layer glue solution on a first copper foil layer and baking to obtain a first semi-cured glue film; coating a second insulating layer glue solution on the second copper foil layer and baking to obtain a second semi-cured glue film; coating the intermediate layer glue solution on a release film and baking to obtain an intermediate layer semi-cured glue film;
s4: and stripping the release film on the intermediate layer semi-cured adhesive film, and respectively laminating one surface of the first semi-cured adhesive film coated with the first insulating layer adhesive solution and one surface of the second semi-cured adhesive film coated with the second insulating layer adhesive solution on the surfaces of the two sides of the intermediate layer semi-cured adhesive film stripped with the release film, and carrying out hot-pressing lamination through a hot press to obtain the high-heat-conductivity copper-clad plate.
In a preferred embodiment, in step S1, the solvent I is at least one of acetone, butanone, cyclohexanone, ethylene glycol methyl ether, propylene glycol methyl ether, and propylene glycol methyl ether acetate; in the step S1, the solid content in the first insulating layer glue solution is 65% -75%; in the step S1, the solid content in the second insulating layer glue solution is 65-75%.
In a preferred embodiment, in step S2, the solvent II is at least one of acetone, butanone, cyclohexanone, ethylene glycol methyl ether, propylene glycol methyl ether, and propylene glycol methyl ether acetate; in the step S2, the solid content in the intermediate layer glue solution is 65-75%.
In a preferred embodiment, in step S3, the baking conditions include a temperature of 180 to 220 ℃ for a time of 10 to 20 minutes.
In a preferred embodiment, in step S4, the hot press lamination conditions include:
lamination temperature: heating to 220 ℃ at a heating rate of 1.0-3.0 ℃/min;
lamination pressure: shi Jiaman pressure when the material temperature is 80-100 ℃, and the full pressure is 280-320 psi;
curing: controlling the material temperature to 220 ℃ and preserving heat for 120-150 min.
The beneficial technical effects of the invention are as follows:
(1) According to the invention, the super-high conductive inorganic powder with high heat conductivity is added in the middle layer, the insulating layers with low heat conductivity are respectively covered on the two sides of the middle layer, and finally copper foil is covered on the insulating layers, so that the copper-clad plate with a specific combined structure is constructed, on the basis, the heat conductivity of the insulating layers is controlled to be 1-3W/MK, and the heat conductivity of the middle layer is controlled to be 100-200W/MK, so that the formed copper-clad plate not only has excellent overall heat conductivity, and the overall heat conductivity is more than 75W/M.K, and the heat dissipation effect of the copper-clad plate is effectively improved; the aluminum alloy has good bending resistance, the bending resistance times are as high as or more than 15 times, and the aluminum alloy can be processed and bent in any mode for multiple times, so that the aluminum alloy has high heat conductivity and the capability of being processed and bent for multiple times.
(2) The high-heat-conductivity copper-clad plate provided by the invention has little difference from the prior art in electrical performance, and simultaneously, the interlayer adhesive force and the electrical performance of the high-heat-conductivity copper-clad plate completely meet the requirements in the IPC-4101 standard copper-clad laminate for printed circuits, so that the high-heat-conductivity copper-clad plate provided by the invention can be well applied to printed circuits and is suitable for industrial production.
Drawings
Fig. 1 is a schematic structural view of a copper-clad plate.
Reference numerals illustrate:
10-a first copper foil layer, 10 '-a second copper foil layer, 20-a first insulating layer, 20' -a second insulating layer, 30-an intermediate layer.
Detailed Description
The present invention will be described in detail by examples.
It should be noted that, in the present invention, the directions or positional relationships of terms such as "upper", "lower", etc. are directions or positional relationships based on those shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and are not intended to indicate or imply that the specific directions are necessary for the structure of the product referred to, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "solvent I," "solvent II," "epoxy resin a," "epoxy resin F," "curing agent B," "curing agent G," "accelerator C," "accelerator H," "toughening agent E," and "toughening agent J" are merely for distinguishing between different objects and are not to be construed as indicating or implying relative importance thereof.
The first aspect of the present invention provides a high heat conduction copper clad laminate, as shown in fig. 1, wherein each layered structure of the high heat conduction copper clad laminate is sequentially, from bottom to top, a first copper foil layer 10, a first insulating layer 20, an intermediate layer 30, a second insulating layer 20 'and a second copper foil layer 10'.
In the present invention, the forming raw materials of the first insulating layer 20 and the second insulating layer 20' each independently include, in parts by weight: 10 to 80 parts by weight of epoxy resin A, 1 to 40 parts by weight of curing agent B, 0.01 to 1 part by weight of accelerator C, 50 to 200 parts by weight of filler D and 10 to 50 parts by weight of toughening agent E. Preferably, the forming raw materials of the first insulating layer 20 and the second insulating layer 20' each independently include, in parts by weight: 10 to 45 parts by weight of epoxy resin A, 1 to 10 parts by weight of curing agent B, 0.02 to 0.5 part by weight of accelerator C, 100 to 150 parts by weight of filler D and 20 to 40 parts by weight of toughening agent E. The weight parts of the epoxy resin a may be 10 weight parts, 15 weight parts, 20 weight parts, 25 weight parts, 30 weight parts, 35 weight parts, 40 weight parts, 45 weight parts; the weight parts of the curing agent B can be 1 weight part, 3 weight parts, 5 weight parts and 10 weight parts; the weight part of the accelerator C can be 0.02 weight part, 0.1 weight part, 0.2 weight part, 0.3 weight part, 0.4 weight part and 0.5 weight part; the weight parts of the filler D may be 100 weight parts, 120 weight parts, 140 weight parts, 150 weight parts; the weight parts of the toughening agent E may be 20 weight parts, 30 weight parts, 40 weight parts. The thermal conductivity of the first insulating layer 10 and the second insulating layer 10' may each independently be 1 to 3W/MK. Particularly preferably, when the components and contents of the first insulating layer 20 and the second insulating layer 20 'are the same, the thermal conductivity of the first insulating layer 20 and the second insulating layer 20' are the same, and may be 1W/MK, 1.5W/MK, 2W/MK, 2.5W/MK, 3W/MK.
In the present invention, the intermediate layer 30 is formed from the following raw materials in parts by weight: 10 to 80 parts by weight of epoxy resin F, 1 to 40 parts by weight of curing agent G, 0.01 to 1 part by weight of accelerator H, 50 to 500 parts by weight of ultrahigh conductive inorganic powder I and 10 to 50 parts by weight of toughening agent J. Preferably, the intermediate layer 30 is formed from the following raw materials in parts by weight: 10 to 45 parts by weight of epoxy resin F, 1 to 10 parts by weight of curing agent G, 0.02 to 0.5 part by weight of accelerator H, 300 to 500 parts by weight of ultra-high conductive inorganic powder I and 20 to 40 parts by weight of toughening agent J. The weight parts of the epoxy resin F may be 10 weight parts, 15 weight parts, 20 weight parts, 25 weight parts, 30 weight parts, 35 weight parts, 40 weight parts, 45 weight parts; the weight part of the curing agent G can be 1 weight part, 3 weight parts, 5 weight parts and 10 weight parts; the weight parts of the accelerator H can be 0.02 weight parts, 0.1 weight parts, 0.2 weight parts, 0.3 weight parts, 0.4 weight parts, 0.5 weight parts; the weight parts of the ultra-high conductivity inorganic powder I can be 300 weight parts, 400 weight parts and 500 weight parts; the weight parts of the toughening agent J may be 20 weight parts, 30 weight parts, 40 weight parts. The thermal conductivity of the intermediate layer 30 may be 100 to 200W/MK, for example, 100W/MK, 150W/MK, 200W/MK.
As shown in fig. 1, in the present invention, the thickness of the first copper foil layer 10 and the second copper foil layer 10' is 12 to 105 μm each independently, and may be, for example, 12 μm, 25 μm, 35 μm, 45 μm, 55 μm, 65 μm, 75 μm, 85 μm, 95 μm, 105 μm; the thickness of the first insulating layer 20 and the second insulating layer 20' is 50 to 200 μm independently, and may be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm, for example; the thickness of the intermediate layer 30 is 100 to 1000. Mu.m, for example, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm. Preferably, the first copper foil layer 10 and the second copper foil layer 10' have the same thickness, and may be 35 μm; preferably, the thickness of the first insulating layer 20 and the second insulating layer 20' is the same, and may be 100 μm; preferably, the thickness of the intermediate layer may be 400 μm.
In the present invention, the epoxy resin a may be a difunctional epoxy resin and/or a novolac epoxy resin; preferably, the difunctional epoxy resin is bisphenol a epoxy resin and/or biphenyl epoxy resin; preferably, the novolac epoxy resin is at least one of phenol novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol a novolac epoxy resin, and dicyclopentadiene phenol epoxy resin. The curing agent B may be at least one of dicyandiamide (dic), 4-diaminodiphenyl sulfone (DDS), phenolic resin, acid anhydride and active ester. The accelerator C can be an imidazole accelerator; preferably, the imidazole-based accelerator is at least one of 2-methylimidazole, 1-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole and 2-phenyl-4-methylimidazole. The filler D may be an inorganic filler; preferably, the inorganic filler is at least one of alumina, magnesia, silicon carbide, silicon nitride, calcium silicate, calcium carbonate, clay, talc and mica. The toughening agent E can be at least one of phenoxy resin, polyethylene modified resin, polyurethane modified resin and polybutadiene modified resin.
In the present invention, the epoxy resin F may be a difunctional epoxy resin and/or a novolac epoxy resin; preferably, the difunctional epoxy resin is bisphenol a epoxy resin and/or biphenyl epoxy resin; preferably, the novolac epoxy resin is at least one of phenol novolac epoxy resin, o-cresol novolac epoxy resin, bisphenol a novolac epoxy resin, and dicyclopentadiene phenol epoxy resin. The curing agent G may be at least one of dicyandiamide (dic), 4-diaminodiphenyl sulfone (DDS), phenolic resin, acid anhydride and active ester. The accelerator H can be an imidazole accelerator; preferably, the imidazole-based accelerator is at least one of 2-methylimidazole, 1-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-undecylimidazole and 2-phenyl-4-methylimidazole. The ultrahigh-conductivity inorganic powder I can be at least one of insulating carbon powder, conductive carbon powder, graphene powder and modified conductive carbon powder. The toughening agent J can be at least one of phenoxy resin, polyethylene modified resin, polyurethane modified resin and polybutadiene modified resin.
In the present invention, more preferably, the specific chemical components of the epoxy resin a and the epoxy resin F are the same, and specific examples include, but are not limited to: macro-Chang GESN901 and/or Olin. More preferably, the specific chemical components of the curing agent B and the curing agent G are the same, and specific examples include, but are not limited to: dicyandiamide (dic). More preferably, the accelerator C is the same as the accelerator H in specific chemical composition, and specific examples include, but are not limited to: 2-methylimidazole. More preferably, specific examples of the filler D include, but are not limited to: alumina (particle size 1 to 10 μm, purity 99% or more) and/or aluminum nitride (particle size 1 to 5 μm, purity 99% or more). More preferably, the specific chemical compositions of toughener E and toughener J are the same, specific examples include, but are not limited to: MEK solution (35% solids). More preferably, specific examples of the ultra-high conductive inorganic powder I include, but are not limited to: conductive carbon powder. It should be noted that, when the specific chemical components of the epoxy resin a and the epoxy resin F are the same, the specific chemical components of the curing agent B and the curing agent G are the same, the specific chemical components of the accelerator C and the accelerator H are the same, and the specific chemical components of the toughening agent E and the toughening agent J are the same, in order to simplify the description, in the subsequent experimental process, the epoxy resin F is directly represented by the epoxy resin a, the curing agent G is directly represented by the curing agent B, the accelerator H is directly represented by the accelerator C, and the toughening agent J is directly represented by the toughening agent E.
The second aspect of the invention provides a preparation method of a high-heat-conductivity copper-clad plate, which comprises the following steps:
s1: adding a curing agent B and an accelerator C into a solvent I for full dissolution, and then sequentially adding an epoxy resin A, a filler D and a toughening agent E for full dissolution to obtain a first insulating layer glue solution and a second insulating layer glue solution respectively and independently;
s2: adding a curing agent G and an accelerator H into a solvent II for full dissolution, and then sequentially adding an epoxy resin F, an ultra-high conductive inorganic powder I and a toughening agent J for full dissolution to obtain an intermediate layer glue solution;
s3: coating a first insulating layer glue solution on a first copper foil layer and baking to obtain a first semi-cured glue film; coating a second insulating layer glue solution on the second copper foil layer and baking to obtain a second semi-cured glue film; coating the intermediate layer glue solution on a release film and baking to obtain an intermediate layer semi-cured glue film;
s4: and stripping the release film on the intermediate layer semi-cured adhesive film, and respectively laminating one surface of the first semi-cured adhesive film coated with the first insulating layer adhesive solution and one surface of the second semi-cured adhesive film coated with the second insulating layer adhesive solution on the surfaces of the two sides of the intermediate layer semi-cured adhesive film stripped with the release film, and carrying out hot-pressing lamination through a hot press to obtain the high-heat-conductivity copper-clad plate.
Preferably, in step S1, the solvent I is at least one of acetone, butanone, cyclohexanone, ethylene glycol methyl ether, propylene glycol methyl ether, and propylene glycol methyl ether acetate; more preferably, specific examples of the solvent I include, but are not limited to: butanone. Preferably, in step S1, the solid content in the first insulating layer glue solution may be 65% to 75%, for example 65%, 70%, 75%; preferably, in step S1, the solid content in the second insulating layer glue may be 65% to 75%, for example 65%, 70%, 75%. More preferably, the components, the component contents and the solid contents of the first insulating layer glue solution and the second insulating layer glue solution are the same.
In the present invention, preferably, in step S2, the solvent II is at least one of acetone, butanone, cyclohexanone, ethylene glycol methyl ether, propylene glycol methyl ether, and propylene glycol methyl ether acetate; more preferably, specific examples of the solvent II include, but are not limited to: butanone. Preferably, in step S2, the solid content in the intermediate layer glue solution may be 65% to 75%, for example 65%, 70%, 75%.
In the present invention, preferably, in step S3, the baking condition includes a temperature that may be 180 to 220 ℃, for example 180 ℃, 200 ℃, 220 ℃; the time may be 10 to 20 minutes, for example 10 minutes, 15 minutes, 20 minutes.
In the present invention, preferably, in step S4, the hot press lamination conditions include:
lamination temperature: heating to 220 ℃ at a heating rate of 1.0-3.0 ℃/min; for example, the heating rate may be 1.0deg.C/min, 1.5deg.C/min, 2.0deg.C/min, 2.5deg.C/min, 3.0deg.C/min.
Lamination pressure: the pressure of Shi Jiaman at 80-100deg.C, and the full pressure can be 280-320 psi, such as 280psi, 290psi, 300psi, 310psi, 320psi.
Curing: the temperature of the materials is controlled to be 220 ℃, and the materials are kept for 120-150 min, such as 120min, 130min, 140min and 150min.
Examples
Raw materials:
(A) The epoxy resin has an epoxy equivalent of 170-950 g/eq. The epoxy resin may be selected from the following two epoxy resins A-1 and A-2:
(A-1) Hongchang GESN901, epoxy equivalent 459g/eq;
(A-2) Olin, manufactured by Orchidaceae, trade name DER593, epoxy equivalent 330g/eq;
(B) Curing agent: dicyandiamide;
(C) And (3) an accelerator: 2-phenylimidazole, commercially available from four kingdoms chemical industry Co;
(D) And (3) filling:
(D-1) alumina (particle size of 1 to 10 μm, purity of 99% or more);
(D-2) aluminum nitride (particle size of 1 to 5 μm, purity of 99% or more);
(E) Toughening agent: MEK solution (35% solids);
(I) Ultra-high conductivity inorganic powder: conductive carbon powder.
The preparation method of the high-heat-conductivity copper-clad plate comprises the following steps:
s1: accurately weighing each raw material component, adding dicyandiamide and 2-phenylimidazole into butanone solvent, stirring at 50rpm to fully dissolve, sequentially adding Hongchang GESN901, olin, aluminum oxide, aluminum nitride and MEK solution, stirring at 200rpm to fully dissolve, and finally regulating the solid content of the solution to 65% by using butanone solvent to prepare the first insulating layer glue solution and the second insulating layer glue solution.
S2: accurately weighing each raw material component, adding dicyandiamide and 2-phenylimidazole into butanone solvent, stirring at 50rpm to fully dissolve, sequentially adding Hongchang GESN901, olin, conductive carbon powder and MEK solution, stirring at 200rpm to fully dissolve, and finally regulating the solid content of the solution to 65% by using butanone solvent to prepare the intermediate layer glue solution.
S3: coating the first insulating layer glue solution in the step S1 on a first copper foil layer, standing for 3min at normal temperature, and then placing into a 200 ℃ oven for baking for 15min, and pre-curing to obtain a 110 mu m first semi-cured glue film; coating the second insulating layer glue solution in the step S1 on a second copper foil layer, standing for 3min at normal temperature, and then placing into a 200 ℃ oven for baking for 15min, and pre-curing to obtain a 110 mu m second semi-cured glue film; and (3) coating the intermediate layer glue solution in the step (S2) on a release film, standing for 3min at normal temperature, and then placing the release film in a baking oven at 200 ℃ for baking for 15min, and pre-curing to obtain the 420 mu m intermediate layer semi-cured glue film.
S4: and stripping the release film on the intermediate layer semi-cured adhesive film, and respectively coating one side of the first semi-cured adhesive film coated with the first insulating layer adhesive solution and one side of the second semi-cured adhesive film coated with the second insulating layer adhesive solution on the surfaces of the two sides of the intermediate layer semi-cured adhesive film stripped with the release film, and carrying out hot pressing lamination through a hot press to obtain the high-heat-conductivity copper-clad plate with the double-sided copper foil. The heating and pressurizing conditions are as follows: (1) temperature setting: heating to 220 ℃ at a heating rate of 3.0 ℃/min; (2) pressure setting: the material temperature is heated to 100 ℃ and full pressure is applied, and the full pressure is 300psi; (3) curing: controlling the temperature of the materials to 220 ℃, and preserving the temperature for 120min.
Examples 1 to 3 and comparative examples 1 to 6
The copper-clad laminate was prepared according to the above-mentioned preparation method of the high heat conduction copper-clad laminate, wherein the specific proportions (in parts by weight) of the raw materials A-1, A-2, B, C, D-1, D-2, E and I in examples 1 to 3 are shown in Table 1.
Comparative examples 1 to 3 are different from examples 1 to 3 in that comparative examples 1 to 3 have no intermediate layer, and are prepared by: uniformly coating the prepared resin on a copper foil, baking and cooling to be in a semi-cured state, and then pressing and forming the adhesive surface of the two copper foils coated with the semi-cured adhesive film; the other conditions were the same as in examples 1 to 3, and the specific raw material ratios (in parts by weight) of each comparative example are shown in Table 1. Comparative examples 4 to 6 are different from examples 1 to 3 in that the ratios of the raw materials in comparative examples 4 to 6 are not within the above-mentioned ranges, and the other preparation methods are the same as examples 1 to 3, and the specific ratios (in parts by weight) of the raw materials in each comparative example are shown in Table 1.
Test method
Surface resistance: examples 1 to 3 and comparative examples 1 to 6 were measured using a resistor box according to the standard IPC-TM-650, clause 2.5.17.1, and the test results are shown in Table 2.
Volume resistance: examples 1 to 3 and comparative examples 1 to 6 were measured using a resistor box according to the standard IPC-TM-650, clause 2.5.17.1, and the test results are shown in Table 2.
Interlayer adhesion: examples 1 to 3 and comparative examples 1 to 6 were measured according to the standard IPC-TM-650, clause 2.4.8.2, using a peel strength tester, and the test results are shown in Table 2.
Bending resistance: examples 1 to 3 and comparative examples 1 to 6 were measured by using a fpc bending resistance tester according to the standard IPC-4101, and the test results are shown in table 2.
Thermal conductivity of insulating layer: the above examples 1 to 3 and comparative examples 1 to 6 were measured using a thermal conductivity tester according to standard astm d-5470, and the test results are shown in table 2.
Thermal conductivity of the intermediate layer: the above examples 1 to 3 and comparative examples 1 to 6 were measured using a thermal conductivity tester according to standard astm d-5470, and the test results are shown in table 2.
Overall thermal conductivity: the above examples 1 to 3 and comparative examples 1 to 6 were measured using a thermal conductivity tester according to standard astm d-5470, and the test results are shown in table 2.
Test results
TABLE 2
As can be seen from the test results of Table 2, the copper-clad plate with a specific combined structure is constructed by adding the ultra-high-conductivity inorganic powder with high heat conductivity into the intermediate layer, respectively coating the insulating layers with low heat conductivity on the two sides of the intermediate layer, and finally coating the copper foil on the insulating layers, and on the basis, the heat conductivity of the insulating layers is controlled to be 1-3W/MK and the heat conductivity of the intermediate layer is controlled to be 100-200W/MK, so that the formed copper-clad plate not only has excellent overall heat conductivity, and the overall heat conductivity is more than 75W/M.K, and the heat dissipation effect of the copper-clad plate is effectively improved; in addition, the copper-clad plate prepared by the preparation method provided by the invention has good bending resistance, the bending resistance times are more than or equal to 15 times, and the copper-clad plate can be processed and bent and assembled in any mode for a plurality of times, so that the copper-clad plate has high heat conductivity and the capability of being processed and bent and assembled for a plurality of times.
Although embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives, and variations may be made in the above embodiments by those skilled in the art without departing from the spirit and principles of the invention.

Claims (10)

1. The utility model provides a high heat conduction copper-clad plate which characterized in that includes:
a first copper foil layer;
a first insulating layer covering the first copper foil layer;
an intermediate layer which is covered on the first insulating layer;
a second insulating layer covering the intermediate layer; and
the second copper foil layer is covered on the second insulating layer;
wherein, the forming raw materials of the first insulating layer and the second insulating layer comprise, by weight: 10-80 parts by weight of epoxy resin A, 1-40 parts by weight of curing agent B, 0.01-1 part by weight of accelerator C, 50-200 parts by weight of filler D and 10-50 parts by weight of toughening agent E; the heat conductivity coefficients of the first insulating layer and the second insulating layer are respectively and independently 1-3W/m.k;
the intermediate layer comprises the following raw materials in parts by weight: 10-80 parts by weight of epoxy resin F, 1-40 parts by weight of curing agent G, 0.01-1 part by weight of accelerator H, 300-500 parts by weight of ultra-high conductive inorganic powder I and 10-50 parts by weight of toughening agent J; the heat conductivity coefficient of the middle layer is 100-200W/m.k;
the filler D is at least one selected from aluminum oxide, magnesium oxide, silicon carbide, silicon nitride, calcium silicate, calcium carbonate, clay, talcum and mica;
the ultrahigh-conductivity inorganic powder I is conductive carbon powder and/or graphene powder;
the thickness of the first copper foil layer and the second copper foil layer is 12-105 mu m independently; the thickness of the first insulating layer and the second insulating layer is 50-200 mu m independently; the thickness of the intermediate layer is 100-1000 mu m.
2. The high thermal conductivity copper clad laminate according to claim 1, wherein the epoxy resin a is a difunctional epoxy resin and/or a phenolic epoxy resin; the curing agent B is at least one of dicyandiamide, 4-diamino diphenyl sulfone, phenolic resin, anhydride and active ester; the accelerator C is an imidazole accelerator; the toughening agent E is at least one of phenoxy resin, polyethylene modified resin, polyurethane modified resin and polybutadiene modified resin.
3. The high thermal conductivity copper clad laminate according to claim 1, wherein the epoxy resin F is a difunctional epoxy resin and/or a novolac epoxy resin; the curing agent G is at least one of dicyandiamide, 4-diamino diphenyl sulfone, phenolic resin, anhydride and active ester; the accelerator H is an imidazole accelerator; the toughening agent J is at least one of phenoxy resin, polyethylene modified resin, polyurethane modified resin and polybutadiene modified resin.
4. The high-heat-conductivity copper-clad plate according to claim 1, wherein the forming raw materials of the first insulating layer and the second insulating layer each independently comprise, in parts by weight: 10-45 parts by weight of epoxy resin A, 1-10 parts by weight of curing agent B, 0.02-0.5 part by weight of accelerator C, 100-200 parts by weight of filler D and 20-40 parts by weight of toughening agent E.
5. The high-heat-conductivity copper-clad plate according to claim 1, wherein the intermediate layer comprises the following raw materials in parts by weight: 10-45 parts by weight of epoxy resin F, 1-10 parts by weight of curing agent G, 0.02-0.5 part by weight of accelerator H, 300-500 parts by weight of ultra-high conductive inorganic powder I and 20-40 parts by weight of toughening agent J.
6. A method for preparing the high-heat-conductivity copper-clad plate according to any one of claims 1 to 5, which is characterized by comprising the following steps:
s1: adding a curing agent B and an accelerator C into a solvent I for full dissolution, and then sequentially adding an epoxy resin A, a filler D and a toughening agent E for full dissolution to obtain a first insulating layer glue solution and a second insulating layer glue solution respectively and independently;
s2: adding a curing agent G and an accelerator H into a solvent II for full dissolution, and then sequentially adding an epoxy resin F, an ultra-high conductive inorganic powder I and a toughening agent J for full dissolution to obtain an intermediate layer glue solution;
s3: coating a first insulating layer glue solution on a first copper foil layer and baking to obtain a first semi-cured glue film; coating a second insulating layer glue solution on the second copper foil layer and baking to obtain a second semi-cured glue film; coating the intermediate layer glue solution on a release film and baking to obtain an intermediate layer semi-cured glue film;
s4: and stripping the release film on the intermediate layer semi-cured adhesive film, and respectively laminating one surface of the first semi-cured adhesive film coated with the first insulating layer adhesive solution and one surface of the second semi-cured adhesive film coated with the second insulating layer adhesive solution on the surfaces of the two sides of the intermediate layer semi-cured adhesive film stripped with the release film, and carrying out hot-pressing lamination through a hot press to obtain the high-heat-conductivity copper-clad plate.
7. The method for producing a copper clad laminate with high heat conductivity according to claim 6, wherein in step S1, the solvent I is at least one of acetone, butanone, cyclohexanone, ethylene glycol methyl ether, propylene glycol methyl ether, and propylene glycol methyl ether acetate; in the step S1, the solid content in the first insulating layer glue solution is 65% -75%; in the step S1, the solid content in the second insulating layer glue solution is 65% -75%.
8. The method for producing a copper clad laminate with high heat conductivity according to claim 6, wherein in step S2, the solvent II is at least one of acetone, butanone, cyclohexanone, ethylene glycol methyl ether, propylene glycol methyl ether, and propylene glycol methyl ether acetate; in the step S2, the solid content in the intermediate layer glue solution is 65% -75%.
9. The method of manufacturing a copper clad laminate according to claim 6, wherein in step S3, the baking condition includes a temperature of 180 to 220 ℃ and a time of 10 to 20 minutes.
10. The method of manufacturing a high thermal conductivity copper clad laminate according to claim 6, wherein in step S4, the hot press lamination conditions include:
lamination temperature: heating to 220 ℃ at a heating rate of 1.0-3.0 ℃/min;
lamination pressure: applying full pressure at the material temperature of 80-100 ℃ and the full pressure of 280-320 psi;
curing: controlling the material temperature to 220 ℃ and preserving heat for 120-150 min.
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