CN215872000U

CN215872000U - Multilayer PCB circuit board with heat dissipation function

Info

Publication number: CN215872000U
Application number: CN202121317475.5U
Authority: CN
Inventors: 尹国强; 雷仁庆; 钟晓环
Original assignee: Boluo Konka Exactitude Science Technology Co ltd
Current assignee: Boluo Konka Exactitude Science Technology Co ltd
Priority date: 2021-06-11
Filing date: 2021-06-11
Publication date: 2022-02-18
Anticipated expiration: 2031-06-11

Abstract

The application discloses multilayer PCB circuit board with heat dissipation function relates to the electronic component field, including substrate layer, chip, heat dissipation layer and coupling assembling, the top at the substrate layer is installed on the heat dissipation layer, and the top on heat dissipation layer still is equipped with the copper foil layer, the top at the copper foil layer is installed to the chip, coupling assembling is the matrix setting in the four corners on copper foil layer, and coupling assembling's bottom runs through the copper foil layer, the heat dissipation layer extends to outside the substrate layer with the substrate layer. The utility model has the advantages that: the utility model has simple, compact and reasonable structure, convenient and quick assembly and reliable connection, and the chip can be effectively isolated from the outside air, thereby improving the integral electrical property of the product, improving the heat dissipation performance of the PCB, prolonging the service life of the PCB and greatly improving the working reliability of the PCB.

Description

Multilayer PCB circuit board with heat dissipation function

Technical Field

The application relates to the technical field of electronic elements, in particular to a multilayer PCB circuit board with a heat dissipation function.

Background

A PCB, i.e., a printed circuit board, also called a PCB, is a provider of electrical connection of electronic components. In the present PCB, because the number of electronic components disposed on the PCB is increasing, the heat dissipation performance of the PCB becomes more important, the heat exchange between the central area of the PCB and the outside is slow, so that the heat is easily accumulated, and the increase of the temperature easily causes the performance degradation of the PCB and even the delamination.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a multilayer PCB circuit board with heat dissipation function.

The embodiment of the application adopts the following technical scheme: the utility model provides a multilayer PCB circuit board with heat dissipation function, includes substrate layer, chip, heat dissipation layer and coupling assembling, the top at the substrate layer is installed on the heat dissipation layer, and the top on heat dissipation layer still is equipped with the copper foil layer, the top at the copper foil layer is installed to the chip, coupling assembling is the matrix setting in the four corners of copper foil layer, and coupling assembling's bottom runs through copper foil layer, heat dissipation layer and substrate layer and extends to outside the substrate layer.

Preferably, the substrate layer, the heat dissipation layer and the four corners of the copper foil layer are all provided with through holes.

Preferably, coupling assembling includes insulating cap, connection screw and insulating screw, it is equipped with four to connect the screw, and four connection screws set up respectively in four through-holes, the insulating cap is equipped with four, and four insulating caps set up respectively on four tops of connecting the screw, and the bottom of every insulating cap all with copper foil layer fixed connection, insulating screw is equipped with four, and four insulating screws set up respectively in four connection screws, and every insulating screw all with a connection screw spiro union.

Preferably, an epoxy glass fiber layer is further arranged between the base material layer and the heat dissipation layer.

Preferably, the bottom of the base material layer is provided with an insulating layer.

Preferably, the heat dissipation layer is composed of a plurality of heat dissipation blocks, and heat-conducting media are arranged in the plurality of heat dissipation blocks.

The embodiment of the application adopts at least one technical scheme which can achieve the following beneficial effects:

the heat dissipation layer formed by the heat dissipation blocks comprises a plurality of heat dissipation channels, and the heat dissipation channels form a heat dissipation channel network, so that the heat can be quickly exchanged with a heat dissipation medium in the middle of the heat dissipation layer with concentrated heat, and the heat can be timely dissipated.

And secondly, welding the insulating cap with the top of the connecting screw hole, fixing the connecting screw hole in the through hole, inserting the insulating screw into the connecting screw hole, rotating the insulating screw to ensure that the insulating screw and the connecting screw hole are connected with each other in an inward screwed manner, and ensuring that the PCB cannot delaminate due to high temperature in a double-layer fixing manner and ensure that the laminating between every two layers is more tight.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a side view of the present invention;

FIG. 3 is a schematic view of a connecting assembly according to the present invention;

FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3;

in the figure: substrate layer 1, chip 2, heat dissipation layer 3, heat dissipation piece 31, coupling assembling 4, insulating cap 41, connection screw 42, insulating screw 43, through-hole 5, epoxy glass fiber layer 6, insulating layer 7, copper foil layer 8.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The technical solutions provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings.

This embodiment, as shown in fig. 1 to 4, a multilayer PCB circuit board with heat dissipation function, it includes substrate layer 1, chip 2, heat dissipation layer 3 and coupling assembling 4, heat dissipation layer 3 is installed at substrate layer 1's top, and heat dissipation layer 3's top still is equipped with copper foil layer 8, chip 2 is installed at copper foil layer 8's top, coupling assembling 4 is the matrix setting in copper foil layer 8's four corners, and coupling assembling 4's bottom runs through copper foil layer 8, heat dissipation layer 3 and substrate layer 1 and extends to outside substrate layer 1.

Specifically, all be equipped with through-hole 5 on the four corners of substrate layer 1, heat dissipation layer 3 and copper foil layer 8, make things convenient for coupling assembling 4's installation.

Specifically, the connecting assembly 4 includes four insulating caps 41, four connecting screw holes 42 and four insulating screws 43, the four connecting screw holes 42 are respectively disposed in the four through holes 5, the four insulating caps 41 are respectively disposed at the top ends of the four connecting screw holes 42, the bottom of each insulating cap 41 is fixedly connected to the copper foil layer 8, the four insulating screws 43 are respectively disposed in the four connecting screw holes 42, each insulating screw 43 is screwed to one connecting screw hole 42, the insulating caps 41 are welded to the top of the connecting screw holes 42, the connecting screw holes 42 are fixed in the through holes 5, the insulating screws 43 are inserted into the connecting screw holes 42, the insulating screws 43 are rotated to screw the insulating screws 43 to the connecting screw holes 42, and the PCB is not delaminated due to high temperature by a double-layer fixing method, and the fit between each layer is tighter.

Specifically, an epoxy glass fiber layer 6 is further arranged between the substrate layer 1 and the heat dissipation layer 3, and has certain heat resistance, mechanical properties and the like.

Specifically, the bottom of substrate layer 1 is equipped with insulating layer 7, prevents to lead electrically and damages the PCB circuit board.

Specifically, the heat dissipation layer 3 comprises a plurality of radiating blocks 31, and is equipped with heat-conducting medium in the plurality of radiating blocks 31, and the heat dissipation layer 3 that constitutes through a plurality of radiating blocks 31 contains many radiating channels to many radiating channels form a radiating channel net, make heat 3 middle part positions of concentrated heat dissipation layer can be faster carry out the heat exchange with heat-conducting medium, in time distribute away the heat, heat-conducting medium is heat-conducting liquid.

The working process of the utility model is as follows: the heat dissipation layer 3 that constitutes through a plurality of radiating blocks 31 contains many heat dissipation channel, and many heat dissipation channel form a heat dissipation channel net, make heat concentrated heat dissipation layer 3 middle part position can be faster carry out the heat exchange with the heat dissipation medium, in time distribute away the heat, weld insulating cap 41 and the top of being connected screw 42 mutually, make again and connect screw 42 and fix in through-hole 5, insert insulating screw 43 and connect in the screw 42, and rotatory insulating screw 43, make insulating screw 43 and be connected screw 42 inside spiro union, the phenomenon of delaminating can not appear because of high temperature to make the PCB circuit board through the mode of bilayer fixing, and make the laminating between every layer inseparabler.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. The utility model provides a multilayer PCB circuit board with heat dissipation function which characterized in that: including substrate layer (1), chip (2), heat dissipation layer (3) and coupling assembling (4), install at the top of substrate layer (1) heat dissipation layer (3), and the top of heat dissipation layer (3) still is equipped with copper foil layer (8), the top at copper foil layer (8) is installed in chip (2), coupling assembling (4) are the matrix setting in the four corners of copper foil layer (8), and the bottom of coupling assembling (4) runs through copper foil layer (8), heat dissipation layer (3) and substrate layer (1) and extends to outside substrate layer (1).

2. The multilayer PCB circuit board with the heat dissipation function as recited in claim 1, wherein: the four corners of the base material layer (1), the heat dissipation layer (3) and the copper foil layer (8) are provided with through holes (5).

3. The multilayer PCB circuit board with the heat dissipation function as recited in claim 2, wherein: coupling assembling (4) are including insulating cap (41), connection screw (42) and insulating screw (43), it is equipped with four to connect screw (42), and four connection screw (42) set up respectively in four through-holes (5), insulating cap (41) are equipped with four, and four insulating caps (41) set up respectively on the top of four connection screw (42), and the bottom of every insulating cap (41) all with copper foil layer (8) fixed connection, insulating screw (43) are equipped with four, and four insulating screws (43) set up respectively in four connection screw (42), and every insulating screw (43) all with one connection screw (42) looks spiro union.

4. The multilayer PCB circuit board with the heat dissipation function as recited in claim 1, wherein: an epoxy glass fiber layer (6) is further arranged between the base material layer (1) and the heat dissipation layer (3).

5. The multilayer PCB circuit board with the heat dissipation function as recited in claim 1, wherein: and an insulating layer (7) is arranged at the bottom of the base material layer (1).

6. A multilayer PCB circuit board with heat dissipation function as defined in claim 3, wherein: the heat dissipation layer (3) is composed of a plurality of heat dissipation blocks (31), and heat conducting media are arranged in the plurality of heat dissipation blocks (31).