CN219204791U

CN219204791U - High-wear-resistance high-stability carbonaceous conductive ink PCB

Info

Publication number: CN219204791U
Application number: CN202223478683.0U
Authority: CN
Inventors: 沈海平; 沈哲; 严星冈; 詹学武
Original assignee: Guangde Dongfeng Electronics Co ltd
Current assignee: Guangde Dongfeng Electronics Co ltd
Priority date: 2022-12-26
Filing date: 2022-12-26
Publication date: 2023-06-16
Anticipated expiration: 2032-12-26

Abstract

The utility model relates to a high-wear-resistance high-stability carbonaceous conductive ink PCB board, which comprises a PCB substrate, wherein an upper PCB copper foil board is attached to the upper surface of the PCB substrate, a lower PCB copper foil board is attached to the lower surface of the PCB substrate, and a PCB heat dissipation plate is arranged in the PCB substrate; the upper surface laminating of going up PCB copper foil board is provided with the PCB and hinders the welded plate, and the lower surface laminating of lower PCB copper foil board is provided with down the PCB and hinder the welded plate, goes up the upper surface laminating of PCB and hinders the welded plate and be provided with the carbonaceous conductive ink board of PCB, and the lower surface laminating of lower PCB hinders the welded plate is provided with the carbonaceous conductive ink board of PCB down. According to the utility model, the heat generated by the heat dissipation block is timely led out, so that the PCB structure is prevented from being damaged by high temperature, the solder resist is arranged between the copper foil and the carbonaceous conductive ink, the short circuit caused by unnecessary excessive contact between the copper foil and the carbonaceous conductive ink is avoided, and the solder resist is paved on the surface of the carbonaceous conductive ink again, so that the PCB is protected from being worn to damage the structure, and the wear resistance, the stability and the heat dissipation effect of the PCB are obviously improved.

Description

High-wear-resistance high-stability carbonaceous conductive ink PCB

Technical Field

The utility model relates to the technical field of PCB manufacturing, in particular to a high-wear-resistance high-stability carbonaceous conductive ink PCB.

Background

The PCB has the main function of enabling various electronic parts to form connection of a preset circuit, plays a role of relay transmission, is a key interconnection piece of electronic products, and is a support body and a carrier of electric connection of the electronic components.

With the rapid development of PCB technology, the conductive carbon oil printed circuit board has the advantages of simple production flow, relatively low cost, abrasion resistance and corrosion resistance, is still sought after by some PCB clients, and occupies a certain market share. The conductive carbon oil printed circuit board is that carbon oil is printed on partial welding spots or welding pads of the circuit board to form a carbon oil finger structure, and the printed carbon oil can lead the printed carbon oil to be partially conductive.

The carbon oil board is a PCB printed with carbon oil, the carbon oil printing is to print the carbon oil at the appointed position of the PCB by adopting a screen printing technology, and a qualified carbon film with a certain resistance value is formed to replace the original resistance element after oven curing test OK. The manufacturing is almost the same as the character silk screen printing, the difference is that the carbon oil has good conductivity, and the characters are semiconductor materials, so that the functions of identification and separation welding are achieved.

The surface of a common carbon oil plate is not coated with a solder mask layer or other protective layers, so that the carbon conductive ink is easy to be worn and scratched, the stability of the carbon conductive ink is greatly reduced, and even the normal use of the whole PCB is directly influenced, so that the wear resistance stability of the carbon conductive ink is ensured. The normal use of the PCB is ensured, and the actual technical problem to be solved by the carbon oil plate at present is solved.

Disclosure of Invention

The utility model aims to design a high-wear-resistance high-stability carbonaceous conductive ink PCB, which is characterized in that a radiating block is arranged in the PCB to timely guide out generated heat, so that the PCB structure is prevented from being damaged by high temperature, a solder resist is arranged between a copper foil and carbonaceous conductive ink to prevent the copper foil from being in unnecessary excessive contact with the carbonaceous conductive ink to form a short circuit, and the solder resist is paved on the surface of the carbonaceous conductive ink again, so that the whole PCB is protected from being worn to damage the structure, and the wear resistance, the stability and the radiating effect of the PCB are obviously improved.

In order to achieve the aim of the utility model, the technical scheme adopted is as follows:

the high-wear-resistance high-stability carbonaceous conductive ink PCB comprises a PCB substrate, wherein an upper PCB copper foil is attached to the upper surface of the PCB substrate, a lower PCB copper foil is attached to the lower surface of the PCB substrate, and a PCB heat dissipation plate is arranged in the PCB substrate; the upper surface laminating of going up PCB copper foil board is provided with the PCB and hinders the welded plate, and the lower surface laminating of lower PCB copper foil board is provided with down the PCB and hinder the welded plate, goes up the upper surface laminating of PCB and hinders the welded plate and be provided with the carbonaceous conductive ink board of PCB, and the lower surface laminating of lower PCB hinders the welded plate is provided with the carbonaceous conductive ink board of PCB down, goes up the carbonaceous conductive ink board of PCB, the surface and the both sides of the carbonaceous conductive ink board of lower PCB are all wrapped up and are provided with PCB outward appearance solder mask.

Preferably, a plurality of square radiating blocks are arranged inside the PCB radiating plate, and a plurality of PCB substrate reinforcing ribs penetrating through the PCB radiating plate are arranged between the square radiating blocks.

Preferably, a plurality of PCB through holes which coaxially penetrate through the PCB substrate, the upper PCB copper foil and the lower PCB copper foil are formed in the PCB substrate, the upper PCB copper foil and the lower PCB copper foil, PCB conductive carbon paste is coated on the inner wall surface of the PCB through holes, and a plurality of conductive carbon paste bulges embedded into the upper PCB copper foil and the lower PCB copper foil are formed at the positions of the upper PCB copper foil and the lower PCB copper foil.

Preferably, a plurality of irregular carbonaceous conductive ink penetrating grooves are formed between the upper PCB solder mask plate and the upper PCB carbonaceous conductive ink plate, and between the lower PCB solder mask plate and the lower PCB carbonaceous conductive ink plate, the upper PCB carbonaceous conductive ink plate penetrates through the upper PCB solder mask plate and is in fit electrical connection with the upper PCB copper foil plate through the carbonaceous conductive ink penetrating grooves, and the lower PCB carbonaceous conductive ink plate penetrates through the lower PCB solder mask plate and is in fit electrical connection with the lower PCB copper foil plate through the carbonaceous conductive ink penetrating grooves.

Preferably, a plurality of irregular copper foil/carbonaceous conductive ink caulking grooves are formed between the upper PCB carbonaceous conductive ink board and the upper PCB copper foil board and between the lower PCB carbonaceous conductive ink board and the lower PCB copper foil board, the upper PCB carbonaceous conductive ink board is embedded into the upper PCB copper foil board through the copper foil/carbonaceous conductive ink caulking grooves through the upper PCB solder mask board, and the lower PCB carbonaceous conductive ink board is embedded into the lower PCB copper foil board through the copper foil/carbonaceous conductive ink caulking grooves through the lower PCB solder mask board.

Preferably, the PCB heat dissipation meshes are arranged on two sides of the PCB outer surface solder mask in a lamination mode, and the PCB heat dissipation plates penetrate through the PCB outer surface solder mask and are connected with the PCB heat dissipation meshes in a jogged mode.

The beneficial effects of the utility model are as follows: the high-wear-resistance high-stability carbonaceous conductive ink PCB disclosed by the utility model has the advantages that the heat generated by the high-wear-resistance high-stability carbonaceous conductive ink PCB is timely led out by arranging the heat dissipation block inside the PCB, the PCB structure is prevented from being damaged by high temperature, the solder resist is arranged between the copper foil and the carbonaceous conductive ink, the short circuit is prevented from being formed by unnecessary excessive contact between the copper foil and the carbonaceous conductive ink, and the solder resist is paved on the surface of the carbonaceous conductive ink again, so that the whole PCB is protected from being worn to damage the structure, the wear resistance, the stability and the heat dissipation effect of the PCB are obviously improved, the conductivity and the practicability of the PCB are obviously improved by simple structural design and improvement, and the high-wear-resistance high-stability carbonaceous conductive ink PCB has excellent application value and popularization prospect.

Drawings

Fig. 1 is a schematic diagram 1 of a cross-sectional structure of a high-wear-resistance high-stability carbonaceous conductive ink PCB board of the utility model.

Fig. 2 is a schematic diagram of a cross-sectional structure of a high-wear-resistance high-stability carbonaceous conductive ink PCB board of the utility model 2.

In the figure: 1. a PCB substrate; 2. a PCB copper foil board is arranged on the upper surface of the PCB; 3. a lower PCB copper foil plate; 4. a PCB heat dissipation plate; 5. a PCB solder mask is arranged on the upper PCB; 6. a lower PCB solder mask; 7. a PCB carbonaceous conductive ink board is arranged on the upper surface of the PCB; 8. a lower PCB carbonaceous conductive ink plate; 9. a solder mask layer on the outer surface of the PCB; 10. a PCB through hole; 11. PCB conductive carbon paste; 12. PCB heat dissipation net piece; 13. square heat dissipation block; 14. PCB base plate reinforcing ribs; 15. copper foil/carbonaceous conductive ink caulking; 16. carbonaceous conductive ink penetrates the trough; 17. conductive carbon paste bumps.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

Referring to fig. 1, a high-wear-resistance high-stability carbonaceous conductive ink PCB board comprises a PCB substrate 1, wherein an upper PCB copper foil 2 is attached to the upper surface of the PCB substrate 1, a lower PCB copper foil 3 is attached to the lower surface of the PCB substrate, and a PCB heat dissipation plate 4 is internally installed; the laminating of the upper surface of going up PCB copper foil board 2 is provided with and goes up PCB and hinder and weld board 5, and the laminating of the lower surface of lower PCB copper foil board 3 is provided with down PCB and hinder and weld board 6, goes up the laminating of the upper surface of going up PCB and hinders and welds board 5 and be provided with and go up PCB carbonaceous conductive ink board 7, and the laminating of the lower surface of lower PCB hinders and welds board 6 and is provided with down PCB carbonaceous conductive ink board 8, goes up PCB carbonaceous conductive ink board 7, down the surface and the both sides of PCB carbonaceous conductive ink board 8 all wrap up and are provided with PCB outward appearance solder mask 9.

Referring to FIG. 2, a high wear-resistant high stability carbonaceous conductive ink PCB board is provided, a plurality of square heat dissipation blocks 13 are arranged inside a PCB heat dissipation plate 4, a plurality of PCB substrate reinforcing ribs 14 penetrating through the PCB heat dissipation plate 4 are arranged between the square heat dissipation blocks, a plurality of PCB through holes 10 coaxially penetrating through the PCB substrate 1, the upper PCB copper foil 2 and the lower PCB copper foil 3 are arranged in a PCB substrate 1, an upper PCB copper foil 2 and a lower PCB copper foil 3, PCB conductive carbon paste 11 is coated on the inner wall surface of the PCB through holes 10, a plurality of conductive carbon paste protrusions 17 embedded into the upper PCB copper foil 2 and the lower PCB copper foil 3 are arranged at the positions of the upper PCB copper foil 2 and the lower PCB copper foil 3, a plurality of irregular carbonaceous conductive ink through grooves 16 are arranged between the upper PCB solder resist plate 5 and the upper PCB carbonaceous conductive ink plate 7 and between the lower PCB solder resist plate 6 and the lower PCB carbonaceous conductive ink plate 8, the upper PCB carbonaceous conductive ink board 7 is in fit electrical connection with the upper PCB copper foil board 2 through the upper PCB solder mask plate 5 by the carbonaceous conductive ink through slot 16, the lower PCB carbonaceous conductive ink board 8 is in fit electrical connection with the lower PCB copper foil board 3 through the lower PCB solder mask plate 6 by the carbonaceous conductive ink through slot 16, a plurality of irregular copper foil/carbonaceous conductive ink caulking grooves 15 are arranged between the upper PCB carbonaceous conductive ink board 7 and the upper PCB copper foil board 2 and between the lower PCB carbonaceous conductive ink board 8 and the lower PCB copper foil board 3, the upper PCB carbonaceous conductive ink board 7 is embedded into the upper PCB copper foil board 2 through the copper foil/carbonaceous conductive ink caulking grooves 15, the lower PCB carbonaceous conductive ink board 8 is embedded into the lower PCB copper foil board 3 through the lower PCB solder mask plate 6 by the copper foil/carbonaceous conductive ink caulking grooves 15, the PCB heat dissipation net piece 12 is arranged on the two sides of the PCB surface solder mask layer 9 in a fitting mode, and the PCB heat dissipation plate 4 penetrates through the PCB surface solder mask layer 9 and is connected with the PCB heat dissipation net piece 12 in a fitting mode.

Working principle: the PCB heat dissipation plate 4 in the PCB substrate 1 inside the PCB board absorbs heat generated by the electrifying operation of the upper PCB copper foil board 2, the lower PCB copper foil board 3, the upper PCB carbonaceous conductive ink board 7 and the lower PCB carbonaceous conductive ink board 8 and dissipates heat from the PCB heat dissipation meshes 12 on two sides of the PCB board, the upper PCB carbonaceous conductive ink board 7 and the lower PCB carbonaceous conductive ink board 8 of the whole PCB board are protected by the PCB surface solder mask layer 9 from abrasion and damage, and the upper PCB solder mask plate 5 and the lower PCB solder mask plate 6 avoid short circuits caused by conduction between the upper PCB carbonaceous conductive ink board 7 and the upper PCB copper foil board 2 and between the lower PCB carbonaceous conductive ink board 8 and the lower PCB copper foil board 3 in unnecessary parts.

Example 2

This embodiment differs from embodiment 1 in that:

a high-wear-resistance high-stability carbonaceous conductive ink PCB board is characterized in that a PCB heat dissipation plate 4 inside a PCB substrate 1 is arranged in an I shape, the PCB heat dissipation plate 4 does not penetrate through the PCB substrate 1 to be connected with an upper PCB copper foil plate 2 or a lower PCB copper foil plate 3, and a plurality of PCB substrate reinforcing ribs 14 are arranged in the PCB substrate 1 to penetrate through the PCB heat dissipation plate 4.

Example 3

This embodiment differs from embodiments 1 and 2 in that:

the high-wear-resistance high-stability carbonaceous conductive ink PCB board is characterized in that an upper PCB solder mask 5 and a lower PCB solder mask 6 are replaced by a conventionally used PCB insulating layer, a PCB outer solder mask 9 is only arranged on the outer surface of the PCB board, and a plurality of PCB through holes 10 which coaxially penetrate through the PCB board 1, the upper PCB copper foil 2 and the lower PCB copper foil 3 are arranged in the PCB board 1, the upper PCB copper foil 2 and the lower PCB copper foil 3, and are electrically connected with the upper PCB carbonaceous conductive ink board 7 or the lower PCB carbonaceous conductive ink board 8 directly through the PCB insulating layer.

According to the utility model, the high-wear-resistance high-stability carbonaceous conductive ink PCB disclosed by the utility model is provided with the radiating block inside the PCB to timely guide out generated heat, so that the PCB structure is prevented from being damaged at high temperature, the solder resist is arranged between the copper foil and the carbonaceous conductive ink to prevent the copper foil from being in short circuit due to unnecessary excessive contact with the carbonaceous conductive ink, and the solder resist is paved on the surface of the carbonaceous conductive ink again, so that the whole PCB is protected from being worn to damage the structure, the wear resistance, the stability and the radiating effect of the PCB are obviously improved, the conductivity and the practicability of the PCB are obviously improved through simple structural design and improvement, and the high-wear-resistance high-stability carbonaceous conductive ink PCB has excellent application value and popularization prospect.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high wear-resisting high stability carbonaceous conductive ink PCB board, its characterized in that: the PCB comprises a PCB substrate (1), wherein an upper PCB copper foil plate (2) is attached to the upper surface of the PCB substrate (1), a lower PCB copper foil plate (3) is attached to the lower surface of the PCB substrate, and a PCB heat dissipation plate (4) is arranged in the inner part of the PCB substrate;

the upper surface laminating of going up PCB copper foil board (2) is provided with PCB and hinders welded plate (5), and the lower surface laminating of lower PCB copper foil board (3) is provided with down PCB and hinder welded plate (6), and the upper surface laminating of going up PCB and hinder welded plate (5) is provided with PCB carbonaceous conductive ink board (7), and the lower surface laminating of lower PCB and hinder welded plate (6) is provided with down PCB carbonaceous conductive ink board (8), goes up PCB carbonaceous conductive ink board (7), and the surface and the both sides of lower PCB carbonaceous conductive ink board (8) are all wrapped up and are provided with PCB outward appearance solder mask (9).

2. The high wear resistant high stability carbonaceous conductive ink PCB board of claim 1, wherein: the PCB heat dissipation plate is characterized in that a plurality of square heat dissipation blocks (13) are arranged inside the PCB heat dissipation plate (4), and a plurality of PCB substrate reinforcing ribs (14) penetrating through the PCB heat dissipation plate (4) are arranged between the square heat dissipation blocks.

3. The high wear resistant high stability carbonaceous conductive ink PCB board of claim 1, wherein: the PCB substrate (1), the upper PCB copper foil plate (2) and the lower PCB copper foil plate (3) are internally provided with a plurality of PCB through holes (10) which coaxially penetrate through the PCB substrate (1), the upper PCB copper foil plate (2) and the lower PCB copper foil plate (3).

4. The high wear resistant high stability carbonaceous conductive ink PCB board of claim 3, wherein: the PCB through hole (10) is provided with a PCB conductive carbon paste (11) in a coating manner on the inner wall surface, and the PCB conductive carbon paste (11) is provided with a plurality of conductive carbon paste bulges (17) embedded into the upper PCB copper foil plate (2) and the lower PCB copper foil plate (3) at the upper PCB copper foil plate (2) and the lower PCB copper foil plate (3).

5. The high wear resistant high stability carbonaceous conductive ink PCB board of claim 1, wherein: the upper PCB solder mask plate (5) is connected with the upper PCB copper foil plate (2) in a bonding manner, a plurality of irregular carbonaceous conductive ink penetrating grooves (16) are formed between the upper PCB solder mask plate (5) and the upper PCB carbonaceous conductive ink plate (7) and between the lower PCB solder mask plate (6) and the lower PCB carbonaceous conductive ink plate (8), the upper PCB carbonaceous conductive ink plate (7) penetrates through the carbonaceous conductive ink penetrating grooves (16) to be connected with the upper PCB copper foil plate (2) in a bonding manner, and the lower PCB carbonaceous conductive ink plate (8) penetrates through the lower PCB solder mask plate (6) and the lower PCB copper foil plate (3) in a bonding manner through the carbonaceous conductive ink penetrating grooves (16).

6. The high wear resistant high stability carbonaceous conductive ink PCB board of claim 1, wherein: the upper PCB carbonaceous conductive ink board (7) and the upper PCB copper foil board (2), the lower PCB carbonaceous conductive ink board (8) and the lower PCB copper foil board (3) are respectively provided with a plurality of irregular copper foil/carbonaceous conductive ink caulking grooves (15), the upper PCB carbonaceous conductive ink board (7) is embedded into the upper PCB copper foil board (2) by penetrating through the copper foil/carbonaceous conductive ink caulking grooves (15) and the lower PCB carbonaceous conductive ink board (8) is embedded into the lower PCB copper foil board (3) by penetrating through the lower PCB solder resist board (6) by the copper foil/carbonaceous conductive ink caulking grooves (15).

7. The high wear resistant high stability carbonaceous conductive ink PCB board of claim 1, wherein: the PCB heat dissipation net piece (12) is arranged on two sides of the PCB outer surface solder mask layer (9) in a laminating mode, and the PCB heat dissipation plate (4) penetrates through the PCB outer surface solder mask layer (9) to be connected with the PCB heat dissipation net piece (12) in a jogged mode.