CN204069492U - A kind of printed circuit board (PCB) - Google Patents
A kind of printed circuit board (PCB) Download PDFInfo
- Publication number
- CN204069492U CN204069492U CN201420492060.5U CN201420492060U CN204069492U CN 204069492 U CN204069492 U CN 204069492U CN 201420492060 U CN201420492060 U CN 201420492060U CN 204069492 U CN204069492 U CN 204069492U
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- Prior art keywords
- conductive layer
- printed circuit
- pcb
- circuit board
- layer area
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Abstract
The utility model relates to printed circuit board technology field, discloses a kind of printed circuit board (PCB), comprises the conductive layer that at least one deck is formed primarily of the first metal material, wherein, also comprises: the conductive layer area being exposed to described printed circuit board surface; Described exposed conductive layer area surface-coated has the second metal material layer.Exposed conductive layer area can be arranged at the PCB region needing big current through-current capacity by the utility model, and by arranging the second metal material layer in exposed conductive layer area, the thickness of conductive layer area is increased, thus increase electric current cross-sectional flow area, thus play the effect improving electric current through-current capacity; Meanwhile, because conductive layer area metal large area is exposed, improve the heat-sinking capability of pcb board.
Description
Technical field
The utility model relates to printed circuit board technology field, particularly relates to a kind of printed circuit board (PCB) (Printed Circuit Board, PCB) with increase electric current through-current capacity performance.
Background technology
Along with the development of science and technology, the functional requirement of user to electronic product constantly increases, and appearance requirement that is miniaturized, light and thin type, PCB board area is constantly reduced.But due to the free space of existing two-layer pcb board own just limited, and turn increase the device of pcb board, the electric current through-current capacity of PCB mainboard cannot be ensured, and make PCB mainboard heat-sinking capability worse and worse.If adopt multi-layer PCB board can increase production cost again.
Summary of the invention
For the problems referred to above that existing two-layer pcb board exists, now provide one to be intended to realize improving current flowing amount, and increase the printed circuit board (PCB) of area of dissipation.
Concrete technical scheme is as follows:
A kind of printed circuit board (PCB), comprises the conductive layer that at least one deck is formed primarily of the first metal material, wherein, also comprises:
Be exposed to the conductive layer area of described printed circuit board surface;
Described exposed conductive layer area surface-coated has the second metal material layer.
Preferably, described first metal material is copper.
Preferably, described second metal material is tin.
Preferably, described conductive layer is provided with at least two-layer, near the described conductive layer in described printed circuit board (PCB) front in described at least two conductive layers, forms described conductive layer area in described printed circuit board (PCB) front; Near the described conductive layer of described printed circuit back, form described conductive layer area in described printed circuit back;
Two-layer described conductive layer is interconnected.
Preferably, be provided with a plurality of via hole in the conductive layer area in described printed circuit board (PCB) front and the conductive layer area of described printed circuit back, the conductive layer area in described printed circuit board (PCB) front and the conductive layer area of described printed circuit back are interconnected by described a plurality of via hole.
Preferably, the diameter of described via hole is between 0.3mm-0.6mm.
The beneficial effect of technique scheme:
Exposed conductive layer area can be arranged at the PCB region needing big current through-current capacity, and by arranging the second metal material layer in exposed conductive layer area, the thickness of conductive layer area is increased, thus increases electric current cross-sectional flow area, thus play the effect improving electric current through-current capacity; Meanwhile, because conductive layer area metal large area is exposed, improve the heat-sinking capability of pcb board.
Accompanying drawing explanation
Fig. 1 is the partial front structural representation that the utility model is provided with a kind of embodiment of the pcb board of exposed conductive layer area;
Fig. 2 is the part section structural representation that the utility model is provided with a kind of embodiment of the pcb board of exposed conductive layer area;
Fig. 3 is the part section structural representation that the utility model tow sides are provided with a kind of embodiment of the pcb board of exposed conductive layer area.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of the utility model protection.
It should be noted that, when not conflicting, the embodiment in the utility model and the feature in embodiment can combine mutually.
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, but not as restriction of the present utility model.
As depicted in figs. 1 and 2, a kind of printed circuit board (PCB), comprises the conductive layer 1 that at least one deck is formed primarily of the first metal material, wherein, also comprises: the conductive layer area 2 being exposed to printed circuit board surface; Exposed conductive layer area 2 surface-coated has the second metal material layer 3.
In existing PCB board making process, a procedure is had to be brushing solder mask.Solder mask: being a kind of protective layer, is also a kind of insulating barrier, be coated in printed board do not need weld base material and circuit on.Object produces bridge joint between circuit when preventing welding, provides the protective layer of permanent electric circumstance and chemical resistance, heat-resisting, insulation, make PCB appearance looks elegant simultaneously.Brushing solder mask detailed process is, one deck welding resistance 4 is applied on the surface (comprising upper surface and lower surface) of PCB, pass through exposure imaging, expose the dish that will weld (to comprise surface and paste Surface Mounted Devices SMD pad, with dip Dual Inline-pin Package DIP pad) and hole, and other positions needing welding resistance to window, the place not having welding resistance to window needs brush one deck solder mask.
In the technical solution of the utility model, except dish and hole and other position needing welding resistance to start, welding resistance is not applied needing the region of big current through-current capacity, make the exposed formation conductive layer area 2 of conductive layer, and conductive layer 1 exposed in conductive layer area 2 applies the second metal material layer 3, the thickness of the zone conducts current layer 1 of big current through-current capacity that needs made increases, thus increases electric current through-current capacity, and due to this zone conducts current exposed metal/bare metal, improve heat-sinking capability.
In one preferably execution mode, the first metal material can be copper.Certain first metal material also can be other metals, such as aluminium.
In one preferably execution mode, the second metal material can be tin.Certain second metal material also can be other metals, such as silver.
Second metal material layer 3 is by PCB making sheet operation, and on the steel mesh of auxiliary brushing solder, window in the position of corresponding conductive layer area 2, and further brushes containing bimetallic solder in conductive layer area 2, then passes through stove and add thermosetting.
In one preferably execution mode, as shown in Figure 3, conductive layer 1 can arrange at least two-layer, at least in two conductive layers near the conductive layer 11 in printed circuit board (PCB) front, form conductive layer area 21 in printed circuit board (PCB) front; Near the conductive layer 12 of printed circuit back, form conductive layer area 22 in printed circuit back; The region of two conductive layers medium potential is interconnected.
Above-mentioned execution mode, by all arranging exposed conductive layer area in printed circuit board (PCB) two sides, increases electric current cross-sectional flow area further, thus further increases electric current through-current capacity, and further increase heat dispersion.
In one preferably execution mode, be provided with a plurality of via hole 5 in the conductive layer area 21 in printed circuit board (PCB) front and the conductive layer area 22 of printed circuit back, the conductive layer area 21 in printed circuit board (PCB) front and the conductive layer area 22 of printed circuit back are interconnected by a plurality of via hole 5.
In further execution mode, the diameter of via hole 5 is between 0.3mm-0.6mm.
The foregoing is only the utility model preferred embodiment; not thereby execution mode of the present utility model and protection range is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilization the utility model specifications and diagramatic content and apparent change obtain in protection range of the present utility model.
Claims (6)
1. a printed circuit board (PCB), comprises the conductive layer that at least one deck is formed primarily of the first metal material, it is characterized in that, also comprise:
Be exposed to the conductive layer area of described printed circuit board surface;
Described exposed conductive layer area surface-coated has the second metal material layer.
2. printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described first metal material is copper.
3. printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described second metal material is tin.
4. printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described conductive layer is provided with at least two-layer, near the described conductive layer in described printed circuit board (PCB) front in described at least two conductive layers, forms described conductive layer area in described printed circuit board (PCB) front; Near the described conductive layer of described printed circuit back, form described conductive layer area in described printed circuit back;
Two-layer described conductive layer is interconnected.
5. printed circuit board (PCB) as claimed in claim 4, it is characterized in that, be provided with a plurality of via hole in the conductive layer area in described printed circuit board (PCB) front and the conductive layer area of described printed circuit back, the conductive layer area in described printed circuit board (PCB) front and the conductive layer area of described printed circuit back are interconnected by described a plurality of via hole.
6. printed circuit board (PCB) as claimed in claim 5, it is characterized in that, the diameter of described via hole is between 0.3mm-0.6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420492060.5U CN204069492U (en) | 2014-08-28 | 2014-08-28 | A kind of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420492060.5U CN204069492U (en) | 2014-08-28 | 2014-08-28 | A kind of printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204069492U true CN204069492U (en) | 2014-12-31 |
Family
ID=52210928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420492060.5U Expired - Fee Related CN204069492U (en) | 2014-08-28 | 2014-08-28 | A kind of printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204069492U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104640343A (en) * | 2015-02-15 | 2015-05-20 | 宁波百年电器有限公司 | Power converter PCB (Printed Circuit Board) and manufacture method thereof |
| CN105674147A (en) * | 2016-01-14 | 2016-06-15 | 京东方科技集团股份有限公司 | Backlight module and display device |
| CN110099506A (en) * | 2019-05-09 | 2019-08-06 | 深圳市锐尔觅移动通信有限公司 | A kind of electronic equipment, printed circuit board and preparation method thereof |
| CN112105140A (en) * | 2020-09-09 | 2020-12-18 | Oppo（重庆）智能科技有限公司 | Printed circuit board with conducting layer, circuit board and manufacturing method |
-
2014
- 2014-08-28 CN CN201420492060.5U patent/CN204069492U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104640343A (en) * | 2015-02-15 | 2015-05-20 | 宁波百年电器有限公司 | Power converter PCB (Printed Circuit Board) and manufacture method thereof |
| WO2016127563A1 (en) * | 2015-02-15 | 2016-08-18 | 宁波百年电器有限公司 | Power source converter pcb board and manufacturing method therefor |
| CN105674147A (en) * | 2016-01-14 | 2016-06-15 | 京东方科技集团股份有限公司 | Backlight module and display device |
| CN110099506A (en) * | 2019-05-09 | 2019-08-06 | 深圳市锐尔觅移动通信有限公司 | A kind of electronic equipment, printed circuit board and preparation method thereof |
| CN112105140A (en) * | 2020-09-09 | 2020-12-18 | Oppo（重庆）智能科技有限公司 | Printed circuit board with conducting layer, circuit board and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20190828 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |