JP2013058515A - Manufacturing method of module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology which mounts columnar connection terminals forming interlayer connection conductors, where water repellent treatment is performed at one end part, on a wiring board and thereby manufacturing a module at low cost in a short manufacturing time.SOLUTION: A module 100 is formed by mounting columnar connection terminals 11 forming interlayer connection conductors and electronic components 102 on a wiring board 101 and resin sealing the connection terminals 11 and the electronic components 102. When the module 100 is manufactured, the electronic components 102 are mounted on one main surface of the wiring board 101 and the connection terminals 11 are mounted thereon so that one end part of each connection terminal 11 connects with the wiring board 101 (a first mounting process). Then, water repellent treatment is performed at the other end part of each connection terminal 11 before a first sealing process (a repellent treatment process). The electronic components 102 and the connection terminals 11 are sealed with a resin layer 103 (the first sealing process). This manufacturing method allows the module 100 having the interlayer connection conductors to be manufactured at low cost in a short time.

Description

  The present invention relates to a module manufacturing method using connection terminals for forming an interlayer connection conductor.

  Conventionally, as shown in an example of the module of FIG. 5, a module 500 in which various electronic components 502 mounted on both surfaces of a wiring board 501 are sealed with a resin layer 503 is known (see, for example, Patent Document 1). ). In this case, a metal shield layer 504 is provided on one main surface of the module 500, and a mounting terminal 505 for external connection is provided on the other main surface. The metal shield layer 504 and the mounting terminal 505 are electrically connected to the wiring layer of the wiring board 501 through interlayer connection via conductors 506, respectively.

  However, in the invention described in Patent Document 1, the via conductor 506 includes Ag, Cu, or the like after desmearing is performed on a via hole formed by laser processing on the resin layer 503 provided on the wiring substrate 501. It is formed by filling with a conductive paste or by performing via fill plating. As described above, when a via hole is formed in the resin layer 503 using laser processing, it is difficult to adjust the output of the laser, and the formation accuracy of the via hole becomes a problem. Further, since the via conductor 506 is formed in the resin layer 503 through a plurality of steps, it causes an increase in the manufacturing cost of the module and hinders a reduction in the manufacturing time of the module. In addition, there is a problem that the chemical solution when the desmear treatment is performed on the via hole formed in the resin layer 503 by laser processing or the chemical solution when the via fill plating is performed erodes the resin layer 503 and the wiring substrate 501. It was.

  In view of this, there has been proposed a technique for forming an interlayer connection conductor by mounting columnar connection terminals without using the above-described interlayer connection via conductor 506 in a module having a laminated structure.

International Publication No. 2005/078796 (paragraphs 0017-0025,0035, FIG. 1, abstract, etc.)

  By the way, in a module having a laminated structure, when mounting columnar connection terminals instead of via holes to form an interlayer connection conductor, after mounting the connection terminals on the wiring board, the connection terminals and the electrons mounted on the wiring board It is necessary to seal the parts with resin and then polish the resin to expose the connection terminals on the resin surface.

  At this time, since a lateral load is applied to the connection terminal by polishing or the like, there is a possibility that a crack may occur at the joint portion at the base of the connection terminal (on the mounting side on the wiring board). In addition, since the resin is softer than metal and clogging occurs with a fine-grained grindstone, it is preferable to use a coarse-grained grindstone in terms of productivity. The metal forming the connection terminal (for example, Cu) is If it is easy to extend and is polished with a coarse grindstone, the metal will extend and spread on the surface of the resin (sagging of the connection terminals), so that there is a problem in quality.

  Therefore, in the past, based on quality, measures were taken to prevent clogging of the grindstone by using a fine grindstone and polishing the resin and connection terminals over time while applying sufficient cutting water. However, there is a new problem that it takes a long time to manufacture the module, resulting in a decrease in productivity.

  The present invention has been made in view of the above-described problems, and enables a module capable of interlayer connection without providing a via hole to be provided at a low cost and in a short manufacturing time, and a module having a high-quality laminated structure. An object is to provide a manufacturing method.

  In order to achieve the above-described object, the module manufacturing method of the present invention is a module manufacturing method in which a columnar connection terminal and an electronic component forming an interlayer connection conductor are mounted on a wiring board and sealed with a resin. A first mounting step of mounting an electronic component on one main surface of the wiring board and mounting the connection terminal so that one end of the connection terminal is connected to the wiring board; and the electronic component and the connection A first sealing step for sealing the terminal with a resin layer, before or after the first mounting step, and before the first sealing step, at the other end of the connection terminal A water repellent treatment step for performing a water repellent treatment is further provided (claim 1).

  And you may make it further provide the process of grind | polishing or grinding the surface of the said resin layer after a said 1st sealing process (Claim 2).

  Moreover, you may make it further provide the 2nd mounting process which mounts another electronic component on the other main surface of the said wiring board, and the 2nd sealing process which seals the said other electronic component with a resin layer ( Claim 3).

  In the second mounting step, the connection terminal may be further mounted such that one end of the connection terminal is connected to the other main surface of the wiring board.

  Moreover, you may mount another electronic component so that it may connect with the other end part of the said connection terminal mounted in the other main surface of the said wiring board (Claim 5).

  According to the invention of claim 1, the electronic component is mounted on one main surface of the wiring board, and the connection terminal is connected so that one end of the columnar connection terminal forming the interlayer connection conductor is connected to the wiring board. Is mounted, and the mounted electronic component and connection terminal are sealed with a resin layer.

  After the sealing with the resin layer, since the interlayer connection conductor is formed by the connection terminal, it is not necessary to provide a via hole as in the conventional technique, and the cost for manufacturing the module and the manufacturing time can be reduced. Further, unlike the prior art, there is no problem that the chemical solution when the desmear treatment is performed or the chemical solution when the via fill plating is performed erodes the resin layer or the wiring board.

  In addition, since the water repellent treatment is performed on the other end of the connection terminal before the resin sealing step, the connection terminal (the other end) repels the resin, The upper surface of the other end of the connection terminal is not sealed with resin. Therefore, there is no need for a polishing or grinding process for projecting the end face of the connection terminal, the module can be manufactured at a low cost and in a short manufacturing time, and the productivity of the module is improved. In addition, since a polishing or grinding process is not required, productivity can be improved by polishing the resin with a fine grindstone or the problem of cracks occurring at the joint portion at the base (one end side) of the connection terminal as described above. The problem of lowering does not occur.

  Further, since the sagging of the connection terminal due to polishing or grinding does not occur, the shape of the other end of the connection terminal is stabilized and the quality is improved. In addition, since the shape of the other end of the connection terminal is stable, when a plurality of connection terminals are mounted on the wiring board, the pitch between the connection terminals can be reduced, and the module can be downsized. it can.

  According to the invention of claim 2, since the surface of the resin layer is polished or ground after resin sealing, the resin surface can be flattened and the height of the module can be reduced. .

  According to the invention of claim 3, an electronic component is mounted on the other main surface of the wiring board, and the electronic component mounted on the other main surface of the wiring board is sealed by the second resin layer, whereby the module This is practical because the mounting density of the electronic components mounted on can be increased.

  According to the invention of claim 4, since the connection terminal having the other end portion subjected to the water repellent treatment is mounted on the other main surface of the wiring board, the same effect as the effect of claim 1 is also provided on the other main surface side. Can be obtained.

  According to the invention of claim 5, since the electronic component is further mounted so as to be connected to the other end portion of the connection terminal mounted on the other main surface of the wiring board, the mounting density of the electronic component mounted on the module is reduced. Since it can be further increased, it is practical.

It is a figure which shows the manufacturing method of the module concerning 1st Embodiment of this invention. It is a figure which shows the module concerning 2nd Embodiment of this invention. It is a figure which shows the module concerning 3rd Embodiment of this invention. It is a figure which shows the module concerning 4th Embodiment of this invention. It is a figure which shows an example of the conventional module.

<First Embodiment>
A method for manufacturing a module according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a diagram showing a module manufacturing method according to a first embodiment of the present invention, and (a) to (d) show different processes.

  In the module manufacturing method described in this embodiment, various communication modules such as a Bluetooth (registered trademark) module and a wireless LAN module, which are mounted on a mother board of a communication portable terminal, an antenna switch module, a high frequency such as a power supply module, etc. Circuit modules are manufactured.

(Module manufacturing method)
First, a columnar connection terminal having a desired cross-sectional diameter and length is prepared, and water repellent treatment is performed on one end portion (the other end portion) (water repellent treatment step). As the water repellent material 10, for example, it is preferable to use silicon resin, fluorine resin, or the like. The water repellent treatment may be performed after the first mounting step described later and before the first sealing step. At this time, after the connection terminal 11 is mounted on the wiring board 101, the connection terminal 11 is subjected to a water repellent treatment by a transfer method, or a needle is attached to the tip of the syringe into which the water repellent material 10 has been injected, Water repellent treatment may be performed by applying by applying air pressure.

  Next, an end portion (the other end portion) subjected to the water-repellent treatment protrudes from a jig having recesses spaced at predetermined intervals corresponding to positions where the plurality of connection terminals 11 are mounted on the wiring board 101. The other end portion of each connection terminal 11 is supported by the support body 12 by pressing the support body 12 fixed in a state and provided with an adhesive portion or the like vertically from above, and each connection terminal 11 is supported by the support body 12. Supported by

  Further, the connection terminal 11 may be formed so as to have a T-shaped cross section in which the diameter of the other end is larger than that of the one end. In this case, since the connection terminal 11 can be fixed by the other end of the connection terminal 11 having a large diameter coming into contact with the peripheral edge of the recess of the jig described above, the recess of the jig is formed so that the other end protrudes. High machining accuracy is not necessary, and jig manufacturing costs can be reduced.

  Then, by pulling up the support body 12 vertically, an assembly of the connection terminals 11 supported by the support body 12 is completed.

  Next, as shown in FIG. 1A, a support body 12 on which a plurality of connection terminals 11 are supported, and electronic components 102 such as various chip components and ICs are arranged on a predetermined main surface of the wiring board 101. Is mounted by a general surface mounting technique such as solder reflow or ultrasonic bonding (first mounting step). At this time, the connection terminal 11 is mounted such that one end thereof is connected to the wiring board 101. Further, the mounting method of the connection terminals 11 is not limited to the method of mounting the plurality of connection terminals 11 on the wiring board 101 at a time by supporting the plurality of connection terminals 11 on the support body 12. It may be sucked by a normal suction method such as vacuum suction one by one and mounted on the wiring board 101 using a mounter or the like.

  In this embodiment, the wiring substrate 101 is a multilayer ceramic substrate in which a plurality of ceramic green sheets are laminated and fired. A ceramic green sheet is a sheet in which a mixed powder of alumina and glass is mixed with an organic binder and solvent. A via hole is formed at a predetermined position of the ceramic green sheet by laser processing or the like. The formed via hole is filled with a conductor paste containing Ag, Cu or the like to form a via conductor for interlayer connection, and various electrode patterns are formed by printing with the conductor paste. Thereafter, the ceramic green sheets are laminated and pressure-bonded to form a ceramic laminate, which is formed by so-called low-temperature firing at a low temperature of about 1000 ° C.

  Thus, the wiring board 101 is provided with various electrode patterns such as an internal wiring pattern, a mounting electrode on which the connection terminal 11 and the electronic component 102 are mounted, and an external connection electrode. It can be formed of a printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc. using a resin or a polymer material. The wiring board 101 may be formed by selecting an optimum material.

  Next, as shown in FIG. 1B, the support 12 that supports each connection terminal 11 mounted on one main surface of the wiring board 101 is removed from each connection terminal 11. When the connection terminals 11 are mounted on the wiring substrate 101 one by one, the support 12 is not necessary.

  And as shown in FIG.1 (c), when the one main surface of the wiring board 101 is filled with resin, the electronic component 102 and the connection terminal 11 which were mounted on the one main surface of the wiring board 101 are 1st resin. Sealed by the layer 103 (first sealing step). At this time, since the other end portion of the connection terminal 11 is subjected to water repellent treatment, the upper surface of the other end portion repels the resin and the other end portion is exposed on the surface of the first resin layer 103. One resin layer 103 is formed. The first resin layer 103 is a composite resin formed by mixing an inorganic filler such as aluminum oxide, silica (silicon dioxide), or titanium dioxide in a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin. Can be formed.

  For example, when the first resin layer 103 is formed using a resin sheet obtained by molding and semi-curing a composite resin on a PET film, a spacer (mold) having a desired thickness is arranged around Forming the first resin layer 103 having a desired thickness by covering the wiring substrate 101 with a resin sheet and heat-pressing the spacer so as to have a spacer thickness, and then heating the wiring substrate 101 in an oven to cure the resin. Can do. The first resin layer 103 may be formed using a general molding technique for forming a resin layer, such as a potting technique using a liquid resin, a transfer molding technique, or a compression molding technique.

  Then, as shown in FIG. 1 (d), the surface of the first resin layer 103 is flattened by grinding or polishing the surface of the first resin layer 103 with a roller blade or the like to remove unnecessary resin. (Polishing or grinding process), the module 100 is completed. In addition, when the surface of the 1st resin layer 103 is grind | polished or ground, the water repellent material 10 of the other end part of the connecting terminal 11 is removed together. Even if the resin on the surface of the first resin layer 103 is not removed, the other end of the connection terminal 11 is exposed on the surface of the first resin layer 103, and thus this polishing or grinding process is not necessarily required. In particular, when the surface of the first resin layer 103 can be formed at substantially the same height as the other end portion of the connection terminal 11, the polishing or grinding process is unnecessary.

  Therefore, in this embodiment, since the other end portion of the connection terminal 11 is subjected to water repellent treatment before the first sealing step, the connection terminal 11 and the electronic component 102 mounted on the wiring board 101 are connected to the first resin. When sealing with the layer 103, the resin on the upper surface of the other end is repelled by the water repellent material 10 applied to the other end of the connection terminal 11, so that the other end is on the surface of the first resin layer 103. Exposed.

  For example, when a connection terminal is mounted to form an interlayer connection conductor as in the prior art, polishing or grinding is necessary to expose the end face of the connection terminal. There is a problem that productivity decreases due to the use of, and sagging of connection terminals due to the use of a coarse-grained grindstone occurs, resulting in poor quality. In this respect, the module according to the present embodiment is formed by exposing the other end portion of the connection terminal 11, so that a polishing or grinding process for exposing the end surface of the connection terminal 11 is not required, and the connection terminal 11 is sag. The problem of doing does not occur. Further, the removal of the first resin layer 103 itself can be made unnecessary, and if necessary, only the first resin layer 103 has to be removed, so that a rough grindstone optimal for resin polishing can be used. The productivity of the module 100 can be improved.

  Further, since there is no need to polish or grind the connection terminal 11, no load is applied to the connection terminal 11, and there is no possibility that a crack will occur at the joint of the connection terminal at the base (mounting side on the wiring board).

  Furthermore, since the sagging of the connection terminal due to polishing or grinding does not occur, the shape of the other end of the connection terminal is stabilized and the quality is improved. In addition, since the shape of the other end of the connection terminal is stable, when a plurality of connection terminals are mounted on the wiring board, the pitch between the connection terminals can be reduced, and the module can be downsized. it can.

  Further, since the water repellent material 10 applied to the other end of the connection terminal 11 is removed together with the surface of the first resin layer by a polishing or grinding process, when connecting to an external component or the like, Connection with external parts can be easily performed.

  Moreover, since the connection terminal 11 and the support body 12 can be mounted only by changing the shape of the suction collet of the mounter on which the electronic component 102 is mounted, there is an advantage that existing facilities can be used. Furthermore, the connection terminal 11 forms an interlayer connection conductor, and there is no need to form a via hole as in the prior art. That is, there is a great advantage that the interlayer connection conductor can be formed only by the mounter.

  Further, since the plurality of connection terminals 11 are supported by the support 12 and mounted on the wiring board 101, the production efficiency can be improved.

  The support 12 is removed after the connection terminals 11 and the electronic component 102 are mounted and before the first resin layer 103 is formed (first sealing step). Therefore, the filling property of the resin filling one main surface of the wiring substrate 101 for forming the first resin layer 103 is improved. Moreover, the air sealed with resin is easy to escape, and it is possible to suppress the generation of voids in the first resin layer 103.

  In addition, since the support 12 that supports the connection terminal 11 mounted on one main surface of the wiring board 101 is removed before resin sealing, a liquid resin or resin is used to form the first resin layer 103. Various modes of resin such as a sheet can be used, and the first resin layer 103 can be easily formed by various generally known methods.

  Moreover, the surface of the 1st resin layer 103 can be planarized by grinding and grinding | polishing the surface of the 1st resin layer 103 after a 1st sealing process, and the module 100 can be made low-profile.

  In addition, when the connection terminal 11 is formed so as to have a T-shaped cross section having a larger diameter at the other end as described above, the other end opposite to the one end connected to the wiring substrate 101 is used. An external connection land having a large area can be formed in the portion. Therefore, by using the large area external connection land of the module 100, it is possible to improve electrical connectivity when the module 100 is mounted on a mother board of a communication portable terminal. In this case, since the external connection land (the other end) exposed on the surface of the first resin layer 103 and the connection terminal 11 are integrally formed, the connection terminal 11 exposed on the surface of the first resin layer 103 is formed. Compared with the case where the land is formed by screen printing or photolithography, the connection strength between the land (the other end) and the connection terminal 11 can be improved.

  In addition, since the electrical connectivity and connection strength required when connecting to a mother board or the like can be ensured by the land at the other end having a large area, the diameter of one end of the connection terminal 11 is set to the land for external connection. It can be formed smaller than the diameter of (the other end).

  Moreover, since the interlayer connection conductor is formed by the connection terminal 11 after sealing with the first resin layer 103, there is no need to provide a via hole as in the conventional technique, and the cost for production of the module 100 can be reduced. Manufacturing time can be shortened. Further, unlike the prior art, there is no problem that the chemical solution when the desmear treatment is performed or the chemical solution when the via fill plating is performed erodes the resin layer or the wiring board.

Second Embodiment
A module 100a according to a second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a diagram showing a module 100a according to the second embodiment of the present invention.

  The module 100a according to this embodiment differs from the first embodiment described above in that an electronic component 102 is further mounted on the other main surface of the wiring board 101 of the module 100a (second mounting) as shown in FIG. And the electronic component 102 is sealed with the second resin layer 104 (second sealing step). Since other configurations are the same as those in the first embodiment, description of the configuration is omitted by giving the same reference numerals.

  Therefore, the electronic component 102 is mounted on the other main surface of the wiring substrate 101, and the electronic component 102 mounted on the other main surface of the wiring substrate 101 is sealed with the second resin layer 104, so that it is mounted on the module 100a. This is practical because the mounting density of the electronic components 102 can be increased.

<Third Embodiment>
A module 100b according to a third embodiment of the present invention will be described with reference to FIG. FIG. 3 is a diagram showing a module 100b according to the third embodiment of the present invention.

  The module 100b according to this embodiment differs from the second embodiment described above in that a metal shield layer is formed on the second resin layer 104 provided on the other main surface of the wiring substrate 101 of the module 100b as shown in FIG. 105 is provided. Since other configurations are the same as those in the first and second embodiments described above, description of the configuration is omitted by giving the same reference numerals. Note that the metal shield layer 105 is preferably electrically connected to the GND wiring provided on the wiring board 101.

  With this configuration, since the metal shield layer 105 is provided on the second resin layer 104, it is possible to prevent noise from the outside from propagating to the electronic component 102 that is sealed by the second resin layer 104. In addition, electromagnetic waves and the like can be prevented from being radiated from the electronic component 102 sealed in the second resin layer 104.

<Fourth embodiment>
A module 100c according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 4 is a diagram showing a module 100c according to the fourth embodiment of the present invention.

  The module 100c according to this embodiment differs from the second embodiment described with reference to FIG. 2 in that the connection terminals 11 are mounted on the other main surface of the wiring board 101 of the module 100c as shown in FIG. Thus (second mounting step), the second resin layer 104 is provided with an interlayer connection conductor by the connection terminals 11. The second resin layer 104 is formed by filling the resin after the support 12 supporting the plurality of connection terminals 11 mounted on the other main surface of the wiring substrate 101 is removed from the connection terminals 11. The

  In this embodiment, the electronic component 102 is further mounted on the second resin layer 104 so as to be connected to the interlayer connection conductor formed by the connection terminals 11 provided on the second resin layer 104. Since other configurations are the same as those in the first to third embodiments, description of the configuration is omitted by giving the same reference numerals.

  If comprised in this way, since the connection terminal 11 is further mounted in the other main surface of the wiring board 101, an interlayer connection conductor can be formed in the 2nd resin layer 104. FIG. In addition, before the electronic component 102 and the connection terminal 11 mounted on the other main surface of the wiring board 101 are sealed by the second resin layer 104, the support 12 on the other main surface of the wiring board 101 is connected to the connection terminal 11. Since it is removed, the resin for forming the second resin layer 104 can be efficiently filled into the other main surface of the wiring board 101.

  Further, since the electronic component 102 is further mounted on the second resin layer 104 formed by the second sealing step so as to be connected to the connection terminal 11 provided on the second resin layer 104, the electronic component 102 is mounted on the module 100c. This is practical because the mounting density of the electronic component 102 can be further increased.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention.

  For example, in the above-described embodiment, the water repellent material 10 is removed by polishing or grinding the water repellent material 10 together with the surface of the first resin layer 103, but the surface of the first resin layer 103 is polished or ground. Later, the water repellent material 10 may be removed using a chemical solution or the like. This also facilitates connection when connecting the modules 100, 100a, 100b, and 100c to external components.

Further, after removing the water repellent material 10 at the other end of the exposed connection terminal 11, for example, Ni / Au plating may be applied, and bumps such as solder may be formed thereon. By doing so, when connecting the modules 100, 100a, 100b, and 100c to an external substrate or the like, it is practically unnecessary to form solder bumps on the external components or the like.
In addition, although the removal process of the water repellent material was described in the said embodiment, when plating on the other end part of the connection terminal 11, water repellent is carried out by the degreasing process of pre-processing for plating formation, or a washing process. Since the material can be removed, the water repellent material removal step does not have to be performed. Of course, even when the water repellent material is removed, the remaining water repellent material can be reliably removed through the pretreatment step for forming the plating.

  In the above-described embodiment, the manufacturing method for each module has been described. However, after forming an assembly of a plurality of modules, the modules may be manufactured by dividing them into individual modules. In this case, when mounting the support body 12 that supports the plurality of connection terminals 11 on the assembly of the wiring boards 101, the assembly of the support bodies 12 before being singulated is mounted on the assembly of the wiring boards 101. May be. In this way, the mounting time of the support 12 on the wiring substrate 101 can be shortened, so that the module manufacturing time can be shortened.

  In addition, the present invention can be widely applied to a technique for forming an interlayer connection conductor of a module by mounting columnar connection terminals on the circuit board of the module using a surface mounting technique as in the present invention. By mounting the electronic component on the wiring board, a module having various functions can be configured.

DESCRIPTION OF SYMBOLS 10 Water repellent material 11 Connection terminal 100,100a, 100b, 100c Module 101 Wiring board 102 Electronic component 103 1st resin layer 104 2nd resin layer

Claims (5)

In the method of manufacturing a module formed by mounting resin-sealed columnar connection terminals and electronic components that form interlayer connection conductors on a wiring board,
A first mounting step of mounting an electronic component on one main surface of the wiring board and mounting the connection terminal so that one end of the connection terminal is connected to the wiring board;
A first sealing step of sealing the electronic component and the connection terminal with a resin layer,
A water repellent treatment step of performing a water repellent treatment on the other end of the connection terminal, which is performed before or after the first mounting step and before the first sealing step. Module manufacturing method.   The method for manufacturing a module according to claim 1, further comprising a step of polishing or grinding the surface of the resin layer after the first sealing step.   2. The method according to claim 1, further comprising: a second mounting step of mounting another electronic component on the other main surface of the wiring board; and a second sealing step of sealing the other electronic component with a resin layer. 2. A method for producing the module according to 2.   4. The second mounting step of mounting the other electronic component, wherein the connection terminal is mounted so that one end of the columnar end is connected to the other main surface of the wiring board. A manufacturing method of the module described. The method for manufacturing a module according to claim 4, wherein another electronic component is mounted so as to be connected to the other end of the connection terminal mounted on the other main surface of the wiring board.

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