CN201491366U - Multilayered extra-thick printed circuit board with blind hole structure - Google Patents
Multilayered extra-thick printed circuit board with blind hole structure Download PDFInfo
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- CN201491366U CN201491366U CN2009200615848U CN200920061584U CN201491366U CN 201491366 U CN201491366 U CN 201491366U CN 2009200615848 U CN2009200615848 U CN 2009200615848U CN 200920061584 U CN200920061584 U CN 200920061584U CN 201491366 U CN201491366 U CN 201491366U
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- circuit board
- printed circuit
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Abstract
The utility model relates to a circuit board, in particular to a multilayered extra-thick printed circuit board with a blind hole structure, comprising a multilayered printed circuit board. One layer or multiple layers of the inner layer of the multilayered printed circuit board is/are provided with blind holes; the inner walls of the blind holes are plated with blind hole copper layers; the blind holes are filled with solder proof printing ink or resin; the solder proof printing ink or the resin inside the blind holes are exposed or cured and then polished to enable the blind holes to be smooth; and semi-cured sheets are arranged among each layer of printed circuit boards and laminated with the multilayered extra-thick printed circuit board into an integer. The blind holes positioned among printed circuit board layers are filled and leveled up by the solder proof printing ink or the resin, thus the problem of the exposure of the hole-wall copper of the blind holes is unnecessary to worry in subsequent processing, i.e. the problem that the hole-wall copper of the blind holes is etched and removed in the subsequent process is prevented; and the surface of the multilayered extra-thick printed circuit board is similar to that of a plane circuit board and can still be obtained by conducting a common dry film manufacture process without any difficulty, thus the manufacture process has good compatibility.
Description
Technical field
The utility model relates to a kind of circuit board, especially has the multilayer of blind hole structure, a super thick printed circuit board (PCB).
Background technology
Multilayer, super thick printed circuit board (PCB) need to adopt blind hole structure to realize connection between the adjacent inner layer between the circuit board of its internal layer, the internal layer that will be provided with blind hole usually is called the blind hole layer.
Known, adopt the method for lamination combination when multilayer, super thick print circuit plates making: put many prepregs (PP sheet) at the blind hole layer, fill between the line of circuit with the amount of resin that increases interlayer and blind hole.Though the flow process of above-mentioned technology is simple, has more serious hidden danger of quality: the one, gummosis is too much during lamination, easily causes blind hole interlayer starved, influences the interlayer adhesion of blind hole plate; The 2nd, cause easily that filler in the blind hole is not enough to form the cavity, and the blind hole perforate is very easily caused in this cavity in the processing of postorder, such as when the outer-layer circuit etching, etching liquid medicine enters and etches away hole wall copper in the blind hole.So making flow process circuit board manufacturing, particularly thickness of the prior art surpass 6.6mm and have the multilayer of blind hole structure, super thick printed circuit board (PCB), exist more serious hidden danger of quality.
The utility model content
The technical problems to be solved in the utility model is: guarantee the interlayer adhesion of multilayer, super thick printed circuit board (PCB) and the hole wall quality of blind hole, improve the quality of product.
For achieving the above object, the utility model has adopted following technical scheme:
The multilayer of tool blind hole structure, super thick printed circuit board (PCB), comprise multilayer board, in its internal layer of described multilayer board one or more layers is provided with blind hole, the inwall of this blind hole is coated with blind hole copper layer, and fill up welding resistance printing ink or resin in the hole, welding resistance printing ink in the hole or resin polish flat this hole through overexposure or after solidifying; Be provided with prepreg between each layer printed circuit board, this prepreg and multilayer board are laminated to one.
As improvement of the technical scheme, the prepreg between each layer printed circuit board is that a slice is to the multi-disc more than a slice.
As improvement of the technical scheme, the edge of the prepreg between each layer printed circuit board flushes with the edge of printed circuit board (PCB).
As improvement of the technical scheme, the surface of one or more layers in its internal layer of described multilayer board is provided with the internal layer copper foil circuit, and the internal layer copper foil circuit is electrically connected with the blind hole copper layer that this layer gone up blind hole.
As improvement of the technical scheme, the blind hole copper layer of blind hole is electrically connected on the internal layer copper foil circuit on one or more layers printed circuit board (PCB) in its internal layer of described multilayer board and the adjacent layer.
As improvement of the technical scheme, be laminated to and be drilled with the through hole that connects each layer on the multilayer board of one.
As improvement of the technical scheme, the inwall of described through hole is coated with through hole copper layer.
As improvement of the technical scheme, the surface of its outer circuit plate of described multilayer board is provided with the outer copper foil circuit, and this outer copper foil circuit is electrically connected with the through hole copper layer of described through-hole wall.
As improvement of the technical scheme, the surface of one or more layers in its internal layer of described multilayer board is provided with the internal layer copper foil circuit, and wherein the internal layer copper foil circuit on one or more layers is electrically connected with the through hole copper layer of described through-hole wall.
Compare with prior art, the utility model adopts the beneficial effect after the technique scheme to be:
(1) blind hole of interlayer is filled and led up with welding resistance printing ink or resin, so needn't worry the problem that the hole wall copper of blind hole exposes, the problem that can exempt hole wall copper etched removal in the postorder flow process of blind hole in postorder processing;
(2) blind hole of interlayer is filled and led up with welding resistance printing ink or resin, and its surface is as the planar circuit board, still can be implemented and is not had hell and high water by general dry film processing procedure, so the good compatibility of processing procedure is arranged.
Description of drawings
Fig. 1 is the structural representation of multilayer board of the present utility model.
Fig. 2 is the blind hole copper layer structural representation of blind hole of the present utility model.
Fig. 3 is the structural representation that blind hole of the present utility model is filled up welding resistance printing ink or resin.
Fig. 4 is the structural representation after the blind hole polishing of the present utility model.
Fig. 5 is the structural representation of prepreg of the present utility model.
Fig. 6 is a structural representation of the present utility model.
Embodiment
Below in conjunction with specification drawings and specific embodiments the utility model is further described; but protection range of the present utility model is not limited thereto, and distortion that the technician in this area can run away with and combination all belong to protection category of the present utility model.
As shown in Figure 1, the multilayer of tool blind hole structure, super thick printed circuit board (PCB) comprise multilayer board 1, and one or more layers in described multilayer board 1 its internal layer is provided with blind hole 11.
As shown in Figure 2, the inwall of this blind hole 11 is coated with blind hole copper layer 12, and as shown in Figure 3, fills up welding resistance printing ink or resin 13 in the hole, and more as shown in Figure 4, welding resistance printing ink in the hole or resin 13 polish flat this hole through overexposure or after solidifying.
And for example be provided with prepreg 2 between each layer printed circuit board 1 of Fig. 5 and Fig. 6, this prepreg 2 is laminated to one with multilayer board 1.
Prepreg 2 between each layer printed circuit board 1 is three, and the edge of prepreg 2 flushes with the edge of printed circuit board (PCB) 1.
Each laminar surface in described multilayer board 1 its internal layer is provided with internal layer copper foil circuit 14, and internal layer copper foil circuit 14 is electrically connected with the blind hole copper layer 12 that this layer gone up blind hole 11.Optionally, the internal layer copper foil circuit 14 of one or more layers in described multilayer board 1 its internal layer also is electrically connected with the blind hole copper layer 12 of blind hole 11 on the adjacent layer.
Be laminated to the through hole 15 that also is drilled with one or more a plurality of each layers of perforation on the multilayer board 1 of one, the inwall of described through hole 15 is coated with through hole copper layer 16, the surface of described multilayer board 1 its outer circuit plate is provided with outer copper foil circuit 17, and this outer copper foil circuit 17 is electrically connected with the through hole copper layer 16 of described through hole 15 inwalls.Optionally, the internal layer copper foil circuit 14 on the surface of one or more layers in described multilayer board 1 its internal layer also is electrically connected with the through hole copper layer 16 of described through hole 15 inwalls.
Claims (9)
1. have the multilayer of blind hole structure, a super thick printed circuit board (PCB), it is characterized in that: comprise multilayer board, in its internal layer of described multilayer board one or more layers is provided with blind hole, the inwall of this blind hole is coated with blind hole copper layer, and fill up welding resistance printing ink or resin in the hole, welding resistance printing ink in the hole or resin polish flat this hole through overexposure or after solidifying; Be provided with prepreg between each layer printed circuit board, this prepreg and multilayer board are laminated to one.
2. the multilayer of tool blind hole structure according to claim 1, super thick printed circuit board (PCB) is characterized in that: the prepreg between each layer printed circuit board is that a slice is to the multi-disc more than a slice.
3. the multilayer of tool blind hole structure according to claim 2, super thick printed circuit board (PCB) is characterized in that: the edge of the prepreg between each layer printed circuit board flushes with the edge of printed circuit board (PCB).
4. the multilayer of tool blind hole structure according to claim 1, super thick printed circuit board (PCB), it is characterized in that: the surface of one or more layers in its internal layer of described multilayer board is provided with the internal layer copper foil circuit, and copper foil circuit is electrically connected with the blind hole copper layer that this layer gone up blind hole.
5. the multilayer of tool blind hole structure according to claim 4, super thick printed circuit board (PCB) is characterized in that: the blind hole copper layer of blind hole is electrically connected on the internal layer copper foil circuit on one or more layers printed circuit board (PCB) in its internal layer of described multilayer board and the adjacent layer.
6. the multilayer of tool blind hole structure according to claim 1, super thick printed circuit board (PCB) is characterized in that: be laminated to and be drilled with the through hole that connects each layer on the multilayer board of one.
7. the multilayer of tool blind hole structure according to claim 6, super thick printed circuit board (PCB) is characterized in that: the inwall of described through hole is coated with through hole copper layer.
8. the multilayer of tool blind hole structure according to claim 7, super thick printed circuit board (PCB), it is characterized in that: the surface of its outer circuit plate of described multilayer board is provided with the outer copper foil circuit, and this outer copper foil circuit is electrically connected with the through hole copper layer of described through-hole wall.
9. the multilayer of tool blind hole structure according to claim 7, super thick printed circuit board (PCB), it is characterized in that: the surface of one or more layers in its internal layer of described multilayer board is provided with the internal layer copper foil circuit, and wherein the internal layer copper foil circuit on one or more layers is electrically connected with the through hole copper layer of described through-hole wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200615848U CN201491366U (en) | 2009-07-31 | 2009-07-31 | Multilayered extra-thick printed circuit board with blind hole structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200615848U CN201491366U (en) | 2009-07-31 | 2009-07-31 | Multilayered extra-thick printed circuit board with blind hole structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201491366U true CN201491366U (en) | 2010-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200615848U Expired - Lifetime CN201491366U (en) | 2009-07-31 | 2009-07-31 | Multilayered extra-thick printed circuit board with blind hole structure |
Country Status (1)
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| CN (1) | CN201491366U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101868122A (en) * | 2010-06-24 | 2010-10-20 | 深南电路有限公司 | PCB manufacturing process and hole plugging process thereof |
| CN102316682A (en) * | 2011-07-01 | 2012-01-11 | 杭州华三通信技术有限公司 | Method for processing multi-layer PCB (printed circuit board) |
| CN102811565A (en) * | 2011-06-03 | 2012-12-05 | 联能科技（深圳）有限公司 | Circuit board and manufacturing method thereof |
| CN103369821A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
| CN103402332A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
| CN104582323A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | High-density interconnection circuit board and manufacturing method thereof |
| CN105491803A (en) * | 2015-12-31 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Improvement method for solder plug hole depressions of IC substrate and manufacturing method |
-
2009
- 2009-07-31 CN CN2009200615848U patent/CN201491366U/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101868122A (en) * | 2010-06-24 | 2010-10-20 | 深南电路有限公司 | PCB manufacturing process and hole plugging process thereof |
| CN102811565A (en) * | 2011-06-03 | 2012-12-05 | 联能科技（深圳）有限公司 | Circuit board and manufacturing method thereof |
| CN102811565B (en) * | 2011-06-03 | 2015-05-20 | 联能科技（深圳）有限公司 | Circuit board and manufacturing method thereof |
| CN102316682A (en) * | 2011-07-01 | 2012-01-11 | 杭州华三通信技术有限公司 | Method for processing multi-layer PCB (printed circuit board) |
| CN102316682B (en) * | 2011-07-01 | 2013-04-03 | 杭州华三通信技术有限公司 | Method for processing multi-layer PCB (printed circuit board) |
| CN103369821B (en) * | 2013-07-25 | 2016-04-20 | 东莞生益电子有限公司 | Possesses pcb board of high density interconnect designs and radiator structure and preparation method thereof |
| CN103369821A (en) * | 2013-07-25 | 2013-10-23 | 东莞生益电子有限公司 | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof |
| CN103402332A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
| CN103402332B (en) * | 2013-07-25 | 2016-04-20 | 东莞生益电子有限公司 | Possesses pcb board of high density interconnect designs and radiator structure and preparation method thereof |
| CN104427786A (en) * | 2013-08-20 | 2015-03-18 | 深圳崇达多层线路板有限公司 | Processing method of printed circuit board |
| CN104582323A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | High-density interconnection circuit board and manufacturing method thereof |
| CN104582323B (en) * | 2014-12-31 | 2017-09-29 | 广州兴森快捷电路科技有限公司 | High-density interconnected circuit board and its manufacture method |
| CN105491803A (en) * | 2015-12-31 | 2016-04-13 | 广州兴森快捷电路科技有限公司 | Improvement method for solder plug hole depressions of IC substrate and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN JINBAIZE ELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER NAME: KING BROTHER TECHNOLOGY LIMITED |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Five, W2-A, building 518057, South Road, Nanshan Science Park, Guangdong, Shenzhen, China Patentee after: Shenzhen Jin Baize electronics technology limited company Address before: Five, W2-A, building 518057, South Road, Nanshan Science Park, Guangdong, Shenzhen, China Patentee before: King Brother Technology Limited |
|
| CX01 | Expiry of patent term |
Granted publication date: 20100526 |
|
| CX01 | Expiry of patent term |