CN102316682B - Method for processing multi-layer PCB (printed circuit board) - Google Patents
Method for processing multi-layer PCB (printed circuit board) Download PDFInfo
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- CN102316682B CN102316682B CN 201110185850 CN201110185850A CN102316682B CN 102316682 B CN102316682 B CN 102316682B CN 201110185850 CN201110185850 CN 201110185850 CN 201110185850 A CN201110185850 A CN 201110185850A CN 102316682 B CN102316682 B CN 102316682B
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Abstract
The invention provides a method for processing a multi-layer PCB (printed circuit board). The method for processing the multi-layer PCB provided by the invention comprises the following steps: completing the processing on compression joint blind holes on an outer sub-board; covering a protective film on a surface (used as the outside surface of the multi-layer PCB) of the outer sub-board so as to shield the compression joint blind holes, wherein a cavate area pre-formed for a to-be-processed through hole is arranged on the protective film; carrying out lamination processing on sub-boards in all layers of the multi-layer PCB and insulating media between the layers so as to obtain the multi-layer PCB; finishing the processing of the through hole in the cavate area of the protective film on the outside surface of the multi-layer PCB; and carrying out laser ablation on the parts (for shielding the compression joint blind holes) of the protective film on the outside surface of the multi-layer PCB. So, the compression joint blind holes can be shielded by the protective layer in the process of processing, therefore, a situation that coppers in the compression joint blind holes and coppers on the surface of a bonding pad are corroded is not caused; and the parts (for shielding the compression joint blind holes) of the protective film are removed in a laser ablation mode, therefore, various problems caused by manual tearing do not exist.
Description
Technical field
The present invention relates to PCB(Printed Circuit Board, printed circuit board (PCB)) process technology, particularly to the processing method of a kind of multi-layer PCB with crimping blind hole and through hole.
Background technology
Usually all have crimping blind hole and through hole in the multi-layer PCB.Wherein, the crimping blind hole is positioned at the outermost layer daughter board of multi-layer PCB, so that at the outer surface grafting components and parts of multi-layer PCB.
In the course of processing of the multi-layer PCB with crimping blind hole and through hole, can not process simultaneously crimping blind hole and through hole, but need to process the crimping blind hole at outermost daughter board first, then after being obtained multi-layer PCB, each straton flaggy pressure can process through hole.Therefore, when the processing through hole, need to protect the crimping blind hole that has processed.
A kind of processing method of the prior art processes the crimping blind hole at daughter board, and after the daughter board that will process the crimping blind hole is laminated to multi-layer PCB, cover the low semi-solid preparation that flows of No-flow PP(at the multi-layer PCB outer surface) sheet, this No-flow PP sheet has area of knockout in the crimping blind hole at the opening part of multi-layer PCB outer surface; Then, the multi-layer PCB outer surface utilize Copper Foil cover No-flow PP sheet, to block the crimping blind hole at the area of knockout place that is positioned at No-flow PP sheet; Afterwards, again the multi-layer PCB that is coated with No-flow PP sheet and Copper Foil is carried out secondary and press layer; After this, after the multi-layer PCB board behind the secondary lamination processes through hole, tear Copper Foil as protective layer off with manual mode.
Although such scheme can be protected the crimping blind hole, but there are the following problems:
1, since the pad of crimping blind hole be positioned at the area of knockout of No-flow PP sheet and do not covered by the No-flowPP sheet, therefore, the pad of easy scratch crimping blind hole when craft removes Copper Foil;
2, in order to make crimping blind hole device on every side have enough arrangement spaces, it is as far as possible little that distance between the area of knockout of No-flow PP sheet and the opening of crimping blind hole can arrange, but thus, when removing Copper Foil with regard to the area of knockout edge that makes easily No-flow PP sheet removing and produce and tear with Copper Foil;
Make easily the area of knockout edge roughness of No-flow PP sheet when 3, removing Copper Foil, steam is invaded between No-flow PP sheet and the multi-layer PCB outer surface from the area of knockout edge, thereby reduce the reliability of multi-layer PCB.
That is to say, utilize the above-mentioned processing method of No-flow PP sheet and Copper Foil may cause the pad of crimping blind hole to damage, also have the other problems that may be caused by No-flow PP sheet, thereby make multi-layer PCB have reliability hidden danger.
Another kind of processing method also is provided in the prior art; this processing method does not provide the protective layer that blocks the crimping blind hole; but adopt ENIG(Electroless Nickel/Immersion Gold; chemical nickel and gold) surface treatment, and the characteristics against corrosion of the surface self after the utilization processing are protected hole copper and the pad face copper of crimping blind hole.
Yet the characteristic surperficial against corrosion of the ENIG that above-mentioned processing method adopts can not be enough to protect the hole copper of crimping blind hole and pad face copper, the hole copper that can't avoid the crimping blind hole and pad face copper to be corroded, thereby makes multi-layer PCB have reliability hidden danger.
As seen, multi-layer PCB processing method of the prior art be owing to can't effectively protect processing blind hole, thereby causes the reliability of multi-layer PCB not high.
Summary of the invention
In view of this, the invention provides a kind of processing method of multi-layer PCB.
The processing method of a kind of multi-layer PCB provided by the invention comprises:
A, finish processing to the crimping blind hole at outer field daughter board;
B, outer field daughter board as a covered with protective film of multi-layer PCB outer surface, so that the crimping blind hole is blocked; Wherein, diaphragm molds area of knockout in advance in through hole to be processed;
C, the daughter board of all layers and the dielectric of interlayer are carried out lamination treatment, obtain multi-layer PCB;
D, finish the processing to through hole at the area of knockout place of the diaphragm of multi-layer PCB outer surface;
E, the part of blocking the crimping blind hole of the diaphragm of multi-layer PCB outer surface is carried out laser ablation.
Described diaphragm is the material with insulating properties, welding resistance characteristic and corrosion resistance.
Described diaphragm is polyimide film.
The diameter of described crimping blind hole is less than or equal to 0.6mm.
The size of area of knockout equals the pad external diameter of through hole, and the size of ablated part equals the pad external diameter of crimping blind hole.
Step e utilizes carbon dioxide laser or Ultra-Violet Laser to ablate.
All process the crimping blind hole at two outer field daughter boards among the step a.
The position of the crimping blind hole that two outer field daughter boards process is corresponding.
The daughter board that carries out lamination treatment among the step c is two-layer.
Described dielectric is prepreg.
As above as seen, in the present invention, the crimping blind hole can be protected blocking of film in the course of processing, thereby can not cause the hole copper of crimping blind hole and pad face copper to be corroded; And the part diaphragm that blocks the crimping blind hole is to remove in the mode of laser ablation, thereby can not have the manual variety of issue that causes that removes.Thereby than existing multi-layer PCB processing method, the present invention can improve the reliability of multi-layer PCB.
Description of drawings
Fig. 1 is the schematic flow sheet of the processing method of the multi-layer PCB in the embodiment of the invention;
Fig. 2 a to Fig. 2 f is followed successively by the operation schematic diagram that utilizes the processing instance that the processing method of multi-layer PCB realizes in the embodiment of the invention.
Embodiment
For making purpose of the present invention, technical scheme and advantage clearer, referring to the accompanying drawing embodiment that develops simultaneously, the present invention is described in more detail.
Fig. 1 is the schematic flow sheet of the processing method of the multi-layer PCB in the embodiment of the invention.As shown in Figure 1, the processing method of the multi-layer PCB in the present embodiment comprises:
Step 101 is finished processing to the crimping blind hole at outer field daughter board.
Outer field daughter board as herein described refers to be exposed to outer daughter board, and the one side of outer field daughter board can be used as the multi-layer PCB outer surface; And the daughter board outside not being exposed to all is called the daughter board of internal layer.
And the outer field daughter board that processes the crimping blind hole in this step can be one, also can be two, so that a side external surface of multi-layer PCB board or two side external surfaces have the crimping blind hole.
And the processing to the crimping blind hole in this step can realize according to existing any one technique.
Step 102 is at a covered with protective film as the multi-layer PCB outer surface of outer field daughter board, so that the crimping blind hole is blocked.Because the follow-up processing that also relates to through hole, therefore, diaphragm need to mold area of knockout in advance for through hole to be processed, and the size of this area of knockout that molds for the processing through hole need to be identical with the pad external diameter of through hole.
Wherein, diaphragm can be selected the material with insulation and welding resistance effect, like this; not only can when the following process through hole, realize the protection to the crimping blind hole; can also substitute green oil as the solder mask of multi-layer PCB, like this, just remove the operation that should before this step, be coated with green oil from.And, also need can have the corrosion resistance that tolerates electroplate liquid, etching solution corrosion as the material of diaphragm.
Can select PI Film(polyimide film in the present embodiment) as the diaphragm with insulation and welding resistance effect.Although PI Film is usually used in the FPC(flexible circuit board) Surface mulch; but because PI Film has corrosion resistance and other physical characteristics of insulating properties, thermal endurance, tolerance electroplate liquid and the etching solution corrosion of the PCB processing request that satisfies rigidity; thereby present embodiment is introduced into PI Film in the PCB processing of rigidity, and utilize PI Film protect the crimping blind hole, and as solder mask.
PI Film is comprised of three layers of PI layer, adhesive layer and release liners, and the PI layer is used for insulation, adhesive layer and is used for bonding, release liners and avoids adhesive to pollute, and release liners can be removed during use.Generally, less than the 1mm hole, PI Film can effectively block and can not cause in the ostium of adhesive layer for diameter, so,, also can realize effectively blocking usually all less than the crimping blind hole of 0.6mm for diameter.
Certainly, if still keep with green oil as solder mask in practical application, then before this step, need to increase the operation that the one side as the multi-layer PCB outer surface of outer field daughter board is coated with green oil, and in this step the diaphragm of crimping blind hole is covered in the one side that scribbles green oil; Because the one side as the multi-layer PCB outer surface of outer field daughter board has scribbled the green oil as solder mask, therefore, after the processing of finishing multi-layer PCB, also needs to remove the diaphragm that is covered in green oil.
Step 103 is carried out lamination treatment to the daughter board of all layers and the dielectric of interlayer, obtains multi-layer PCB.
Can select the PP(semi-solid preparation in the present embodiment) sheet is as insulating medium layer.
Step 104 is finished the processing to through hole at the area of knockout place of the diaphragm of multi-layer PCB outer surface.
The processing to through hole of finishing in this step specifically comprises: boring, the hole copper that electroplate to form through hole and pad face copper, with dry film protection through hole, remove the copper, striping and the surface treatment that are deposited on the diaphragm.
For the situation of PI Film as diaphragm, because PI Film can tolerate the corrosion at the electroplate liquid of processing in the via process, etching solution etc., thereby can not cause PI Film damage.
Step 105 is carried out laser ablation to the part of blocking the crimping blind hole of the diaphragm of multi-layer PCB outer surface.Wherein, the size of the part of blocking the crimping blind hole of diaphragm equals the pad external diameter of crimping blind hole.
Can select carbon dioxide laser or UV(ultraviolet in the present embodiment) laser, can ablate with realization completely as the situation of diaphragm for PI Film, and for the situation of selecting other materials as diaphragm, other materials that then need to select can be ablated.
So far, above-mentioned flow process finishes.
In above-mentioned flow process, the crimping blind hole can be protected blocking of film in the course of processing, thereby can not cause the hole copper of crimping blind hole and pad face copper to be corroded; And the part diaphragm that blocks the crimping blind hole is to remove in the mode of laser ablation, thereby can not have the manual variety of issue that causes that removes.Thereby than existing multi-layer PCB processing method, above-mentioned flow process can improve the reliability of multi-layer PCB.
Below, be further detailed in conjunction with an example again.In this example, the multi-layer PCB board of processing has two-layer daughter board, and two-layer daughter board is outer field daughter board, also all needs the crimping blind hole position of two-layer daughter board corresponding; This example also selects PI Film to be used as dielectric as diaphragm, PP sheet.
Please order referring to Fig. 2 a to Fig. 2 f:
Among Fig. 2 a, process respectively the corresponding crimping blind hole 20 in position at outer field daughter board 21 and 22.
Among Fig. 2 b, the one side as the multi-layer PCB outer surface in outer field daughter board 21 and 22 covers PIFilm 30, crimping blind hole 20 is blocked and is used as solder mask, simultaneously, PI Film 30 molds area of knockout 300 in advance for through hole to be processed, and the size of this area of knockout 300 need to be greater than the pad external diameter of through hole;
Among Fig. 2 c, to two outer field daughter boards 21 and 22 and the PP sheet 23 of interlayer carry out lamination treatment;
Among Fig. 2 d, process through hole 40 at area of knockout 300 places by boring and plating, then with dry film logical 40 holes are protected, etch away the copper that is deposited on the PI Film 30 in electroplating ventilating hole process 40, remove at last dry film and carry out surface treatment.
Among Fig. 2 e, utilize laser (shown in dotted arrow) to ablate to blocking in the part of crimping blind hole of PI Film 30.
Among Fig. 2 f, blocking of PI Film 30 be ablated in the part of crimping blind hole, and form by opening 50, process finishing.
The above only is preferred embodiment of the present invention, and is in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of making, is equal to replacement, improvement etc., all should be included within the scope of protection of the invention.
Claims (10)
1. the processing method of a multi-layer PCB is characterized in that, comprising:
A, finish processing to the crimping blind hole at outer field daughter board;
B, outer field daughter board as a covered with protective film of multi-layer PCB outer surface, so that the crimping blind hole is blocked; Wherein, diaphragm molds area of knockout in advance in through hole to be processed;
C, the daughter board of all layers and the dielectric of interlayer are carried out lamination treatment, obtain multi-layer PCB;
D, finish the processing to through hole at the area of knockout place of the diaphragm of multi-layer PCB outer surface;
E, the part of blocking the crimping blind hole of the diaphragm of multi-layer PCB outer surface is carried out laser ablation.
2. processing method according to claim 1 is characterized in that, described diaphragm is the material with insulating properties, welding resistance characteristic and corrosion resistance.
3. processing method according to claim 2 is characterized in that, described diaphragm is polyimide film.
4. processing method according to claim 3 is characterized in that, the diameter of described crimping blind hole is less than or equal to 0.6mm.
5. processing method according to claim 3 is characterized in that, the size of area of knockout equals the pad external diameter of through hole, and the size of ablated part equals the pad external diameter of crimping blind hole.
6. processing method according to claim 3 is characterized in that, step e utilizes carbon dioxide laser or Ultra-Violet Laser to ablate.
7. each described processing method in 6 according to claim 1 is characterized in that, all processes the crimping blind hole at two outer field daughter boards among the step a.
8. each described processing method in 6 according to claim 1 is characterized in that, the position of the crimping blind hole that two outer field daughter boards process is corresponding.
9. processing method according to claim 8 is characterized in that, the daughter board that carries out lamination treatment among the step c is two-layer.
10. each described processing method in 6 according to claim 1 is characterized in that described dielectric is prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110185850 CN102316682B (en) | 2011-07-01 | 2011-07-01 | Method for processing multi-layer PCB (printed circuit board) |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201110185850 CN102316682B (en) | 2011-07-01 | 2011-07-01 | Method for processing multi-layer PCB (printed circuit board) |
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| CN102316682A CN102316682A (en) | 2012-01-11 |
| CN102316682B true CN102316682B (en) | 2013-04-03 |
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| CN 201110185850 Active CN102316682B (en) | 2011-07-01 | 2011-07-01 | Method for processing multi-layer PCB (printed circuit board) |
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Families Citing this family (10)
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| CN103687308B (en) * | 2012-09-14 | 2016-12-21 | 北大方正集团有限公司 | Blind hole crimping multilayer board and preparation method thereof |
| CN104349610B (en) * | 2013-07-24 | 2018-03-27 | 北大方正集团有限公司 | The manufacture method and printed circuit board of printed circuit board daughter board and printed circuit board |
| CN104754886B (en) * | 2013-12-27 | 2019-06-14 | 中兴通讯股份有限公司 | PCB processing method and PCB |
| CN105430906B (en) * | 2014-09-18 | 2018-08-07 | 深南电路有限公司 | A kind of boring method of circuit board |
| CN104661436B (en) * | 2015-02-06 | 2019-04-30 | 深圳市五株科技股份有限公司 | Printed circuit board blind slot processing method |
| CN104640345B (en) * | 2015-02-26 | 2018-03-06 | 华为技术有限公司 | Printed circuit board (PCB) and board, printed circuit board manufacturing method |
| CN109548276A (en) * | 2018-12-28 | 2019-03-29 | 郑州云海信息技术有限公司 | A kind of large capacity high-layer communication backboard and processing method |
| CN113225940B (en) * | 2021-04-30 | 2022-06-21 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN113179588B (en) * | 2021-04-30 | 2022-06-21 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN114340157B (en) * | 2021-11-26 | 2023-07-14 | 苏州浪潮智能科技有限公司 | Method, system, apparatus and storage medium for manufacturing printed circuit board |
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| CN101640983A (en) * | 2009-09-10 | 2010-02-03 | 深南电路有限公司 | Processing method of printing circuit board blind hole |
| CN201491366U (en) * | 2009-07-31 | 2010-05-26 | 深圳市金百泽电路板技术有限公司 | Multilayered extra-thick printed circuit board with blind hole structure |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1136758A (en) * | 1995-05-23 | 1996-11-27 | 日立化成工业株式会社 | Method for producing multi-layer printing circuit board |
| US5826330A (en) * | 1995-12-28 | 1998-10-27 | Hitachi Aic Inc. | Method of manufacturing multilayer printed wiring board |
| CN101296583A (en) * | 2008-04-24 | 2008-10-29 | 苏州市惠利华电子有限公司 | Method for processing printed circuit board |
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| CN102316682A (en) | 2012-01-11 |
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Address after: 310052 Binjiang District Changhe Road, Zhejiang, China, No. 466, No. Patentee after: Xinhua three Technology Co., Ltd. Address before: 310053 Hangzhou hi tech Industrial Development Zone, Zhejiang province science and Technology Industrial Park, No. 310 and No. six road, HUAWEI, Hangzhou production base Patentee before: Huasan Communication Technology Co., Ltd. |