CN108093569A - A kind of processing method for reducing super thick copper circuit board welding resistance difficulty - Google Patents
A kind of processing method for reducing super thick copper circuit board welding resistance difficulty Download PDFInfo
- Publication number
- CN108093569A CN108093569A CN201611031221.0A CN201611031221A CN108093569A CN 108093569 A CN108093569 A CN 108093569A CN 201611031221 A CN201611031221 A CN 201611031221A CN 108093569 A CN108093569 A CN 108093569A
- Authority
- CN
- China
- Prior art keywords
- plate
- copper
- circuit board
- super thick
- welding resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of processing methods for reducing super thick copper circuit board welding resistance difficulty, comprise the following steps：Plate to be processed is laminated first；Then the plate after the lamination is electroplated；Then outer-layer circuit figure registration holes are bored to the plate after the plating；Then the plate for being drilled with outer-layer circuit figure registration holes is exposed, developed, and etch circuitous pattern, the preliminary line pattern for completing super thick copper circuit board makes；Then carry out resin to the gap of copper coin in the super thick copper circuit board to fill and lead up, and plate is pressed again after putting copper foil on outermost layer resin；Then the copper foil on the pressing plate is etched away；Then the plate of copper foil after the etching is carried out evening brush version out, and exposes the copper coin circuitous pattern completely；Then the plate of the exposed copper coin circuitous pattern is processed according to the wiring board work flow of normal 1 2OZ copper thickness, this method can reduce the difference in height of copper face and base material, reduce welding resistance difficulty.
Description
Technical field
The present invention relates to copper circuit board processing technique fields, particularly, it is difficult to be related to a kind of reduction super thick copper circuit board welding resistance
The processing method of degree.
Background technology
Traditional super thick copper circuit board resistance welding processing method is the processing method according to common line plate silk-screen or spraying, is led to
Ink is covered in copper face and substrate surface by the mode for crossing multiple welding resistance exposure, still, is not only flowed using such processing method
Journey is longer, production cost is high, but also can surpass since difference in height is larger between thick copper coin and base material, can not be arranged in silk-screen printing process
Air to the greatest extent, easily generates bubbles of ink so that super thick copper circuit board welding resistance so as to cause during super thick copper circuit board welding resistance
Difficulty is larger.
The content of the invention
Present invention aims at a kind of processing method for reducing super thick copper circuit board welding resistance difficulty is provided, to solve existing skill
In art, due to easily generating bubbles of ink during super thick copper circuit board welding resistance so that super thick copper circuit board welding resistance difficulty compared with
The technical issues of big.
To achieve the above object, the present invention provides a kind of processing method for reducing super thick copper circuit board welding resistance difficulty, including
Following steps：
A, plate to be processed is laminated；
B, the plate after the lamination is electroplated；
C, outer-layer circuit figure registration holes are bored to the plate after the plating；
D, the plate that the outer-layer circuit figure registration holes are drilled in step c is exposed, developed, and etch circuit
Figure, the preliminary line pattern for completing super thick copper circuit board make；
E, resin is carried out to the gap of copper coin in the super thick copper circuit board to fill and lead up, and after outermost layer resin puts copper foil again
Press plate；
F, the copper foil on the pressing plate is etched away；
G, the plate of the copper foil after etching in step f is carried out evening brush version out, and exposes the copper coin circuit completely
Figure；
H, to the plate of the exposed copper coin circuitous pattern in step g according to the wiring board processing stream of normal 1-2OZ copper thickness
Journey is processed.
Further, the thickness after plate plating after being laminated described in the step b is not less than 6OZ.
Further, the copper coin trace clearance in the step e is filled and led up using PP resins.
Further, the copper coin trace clearance is filled and led up by the way of moulding is laminated in the step e.
Further, the step a is omitted when the plate to be processed is dual platen.
The invention has the advantages that：A kind of processing side of reduction super thick copper circuit board welding resistance difficulty of the present invention
Method, this method by super thick copper circuit board outer layer etching after, before super thick copper circuit board welding resistance by the way of moulding is laminated,
The copper sheet gap that PP resins are fused to etching by high-temperature laminating is filled and led up, and using brush board is evened out, will be higher by copper face
Base material polishes off；Then again by normally drilling, heavy copper, plating, figure, etching, welding resistance flow be processed.So for
Welding resistance, thick copper is that the 1-2OZ copper that last time is electroplated is thick, and the flow of a normal welding resistance, which can be used, to be machined.It adopts
The difference in height of copper face and base material can be reduced with this method, air can be drained in silk-screen printing process, so as to effectively prevent in super thick
The generation of bubbles of ink during copper circuit board welding resistance effectively reduces super thick copper circuit board welding resistance difficulty.
Description of the drawings
Below with reference to figure, the present invention is described in further detail.The attached drawing for forming the part of the application is used for
A further understanding of the present invention is provided, schematic description and description of the invention is not formed for explaining the present invention
Inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 is the flow chart of the preferred embodiment of the present invention.
Specific embodiment
The embodiment of the present invention is described in detail below in conjunction with attached drawing.
Referring to Fig. 1, the preferred embodiment of the present invention provides a kind of processing for reducing super thick copper circuit board welding resistance difficulty
Method comprises the following steps：First, plate to be processed is laminated, the step can be omitted when plate to be processed is dual platen
Suddenly；Then the plate after the lamination is electroplated, the panel thickness after plating is not less than 6OZ；Next it is drilled with outside to described
The plate of sandwich circuit figure registration holes is exposed, develops, and etches circuitous pattern, the preliminary line for completing super thick copper circuit board
Road graphic making etches the circuitous pattern of customer requirement；Next to the super-thick copper by the way of moulding is laminated
Copper coin trace clearance is filled and led up using PP resins in wiring board, and presses plate again after PP resin outermost layers put copper foil, is kept away
Exempt from the steel plate of pollution pressing during pollution pressing plate；Next the copper foil on the pressing plate is etched away；Next
The plate of copper foil after the etching is carried out evening brush version out, and exposes the copper coin circuitous pattern completely, to ensure PP resins
It is all evened out totally, copper coin circuit can be evened out and brush off a part；Next to the plate of the exposed copper coin circuitous pattern
According to the wiring board work flow of normal 1-2OZ copper thickness：Drilling, heavy copper, plating, figure, etching, welding resistance are processed, and can be adopted
It can be machined with the flow of a normal welding resistance.
It can be seen from the above description that the above embodiments of the present invention realize following technique effect：This method is led to
It crosses after the etching of super thick copper circuit board outer layer, before super thick copper circuit board welding resistance by the way of moulding is laminated, PP resins is led to
It crosses high-temperature laminating and is fused to the copper sheet gap of etching and filled and led up, using brush board is evened out, the base material for being higher by copper face is polished off；
Then again by normally drilling, heavy copper, plating, figure, etching, welding resistance flow be processed.So for welding resistance, thick of copper
It is the 1-2OZ copper thickness of last time plating, the flow of a normal welding resistance, which can be used, to be machined.It can be dropped using this method
The difference in height of low copper face and base material can drain air in silk-screen printing process, so as to effectively prevent in super thick copper circuit board welding resistance
The generation of bubbles of ink in the process effectively reduces super thick copper circuit board welding resistance difficulty.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention；For the skill of this field
For art personnel, the invention may be variously modified and varied.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should all be included in the protection scope of the present invention.
Claims (5)
1. a kind of processing method for reducing super thick copper circuit board welding resistance difficulty, which is characterized in that comprise the following steps：
A, plate to be processed is laminated；
B, the plate after the lamination is electroplated；
C, outer-layer circuit figure registration holes are bored to the plate after the plating；
D, the plate that the outer-layer circuit figure registration holes are drilled in step c is exposed, developed, and etch circuit diagram
Shape, the preliminary line pattern for completing super thick copper circuit board make；
E, carry out resin to the gap of copper coin in the super thick copper circuit board to fill and lead up, and pressed again after outermost layer resin puts copper foil
Plate；
F, the copper foil on the pressing plate is etched away；
G, the plate after etching in step f is carried out evening brush version out, and exposes the copper coin circuitous pattern completely；
H, to the plate of the exposed copper coin circuitous pattern in step g according to normal 1-2OZ copper thickness wiring board work flow into
Row processing.
2. a kind of processing method for reducing super thick copper circuit board welding resistance difficulty according to claim 1, it is characterised in that：Institute
It states the thickness after the plate plating after being laminated described in step b and is not less than 6OZ.
3. a kind of processing method for reducing super thick copper circuit board welding resistance difficulty according to claim 1, it is characterised in that：Institute
The gap for stating the copper coin in step e is filled and led up using PP resins.
4. a kind of processing method for reducing super thick copper circuit board welding resistance difficulty according to claim 1, it is characterised in that：Institute
Step e is stated to fill and lead up the copper coin trace clearance by the way of moulding is laminated.
5. a kind of processing method for reducing super thick copper circuit board welding resistance difficulty according to claim 1, it is characterised in that：Institute
Plate to be processed is stated to omit the step a during dual platen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611031221.0A CN108093569A (en) | 2016-11-22 | 2016-11-22 | A kind of processing method for reducing super thick copper circuit board welding resistance difficulty |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611031221.0A CN108093569A (en) | 2016-11-22 | 2016-11-22 | A kind of processing method for reducing super thick copper circuit board welding resistance difficulty |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108093569A true CN108093569A (en) | 2018-05-29 |
Family
ID=62168571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611031221.0A Pending CN108093569A (en) | 2016-11-22 | 2016-11-22 | A kind of processing method for reducing super thick copper circuit board welding resistance difficulty |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108093569A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109496082A (en) * | 2018-10-13 | 2019-03-19 | 奥士康科技股份有限公司 | A kind of super thick copper sheet anti-welding printing method |
| CN111447750A (en) * | 2020-04-17 | 2020-07-24 | 景旺电子科技(龙川)有限公司 | Manufacturing method of super-thick copper PCB |
| CN111818738A (en) * | 2020-07-08 | 2020-10-23 | 沪士电子股份有限公司 | Method for processing thick copper PCB by using prepreg without glass cloth |
| CN113099613A (en) * | 2021-03-29 | 2021-07-09 | 福建福强精密印制线路板有限公司 | Secondary drilling explosion-proof method for circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861049A (en) * | 2009-04-08 | 2010-10-13 | 昆山市华升电路板有限公司 | Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof |
| CN103118496A (en) * | 2013-01-25 | 2013-05-22 | 广东生益科技股份有限公司 | Method for improving solder-mask cracking in heavy copper printed circuit boards |
| CN103491731A (en) * | 2013-09-23 | 2014-01-01 | 惠州市金百泽电路科技有限公司 | Super-thick copper multi-layer printed-circuit board manufacturing method |
| CN104717840A (en) * | 2013-12-13 | 2015-06-17 | 深南电路有限公司 | Circuit board manufacturing method and circuit board |
-
2016
- 2016-11-22 CN CN201611031221.0A patent/CN108093569A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861049A (en) * | 2009-04-08 | 2010-10-13 | 昆山市华升电路板有限公司 | Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof |
| CN103118496A (en) * | 2013-01-25 | 2013-05-22 | 广东生益科技股份有限公司 | Method for improving solder-mask cracking in heavy copper printed circuit boards |
| CN103491731A (en) * | 2013-09-23 | 2014-01-01 | 惠州市金百泽电路科技有限公司 | Super-thick copper multi-layer printed-circuit board manufacturing method |
| CN104717840A (en) * | 2013-12-13 | 2015-06-17 | 深南电路有限公司 | Circuit board manufacturing method and circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109496082A (en) * | 2018-10-13 | 2019-03-19 | 奥士康科技股份有限公司 | A kind of super thick copper sheet anti-welding printing method |
| CN111447750A (en) * | 2020-04-17 | 2020-07-24 | 景旺电子科技(龙川)有限公司 | Manufacturing method of super-thick copper PCB |
| CN111447750B (en) * | 2020-04-17 | 2023-05-05 | 景旺电子科技(龙川)有限公司 | Manufacturing method of ultra-thick copper PCB |
| CN111818738A (en) * | 2020-07-08 | 2020-10-23 | 沪士电子股份有限公司 | Method for processing thick copper PCB by using prepreg without glass cloth |
| CN113099613A (en) * | 2021-03-29 | 2021-07-09 | 福建福强精密印制线路板有限公司 | Secondary drilling explosion-proof method for circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106211638B (en) | A kind of processing method of ultra-thin multilayer printed circuit board | |
| CN108093569A (en) | A kind of processing method for reducing super thick copper circuit board welding resistance difficulty | |
| CN103369820B (en) | Possesses pcb board of high density interconnect designs and radiator structure and preparation method thereof | |
| CN104918416B (en) | Circuit board resistance welding processing method and outer layer super thick copper circuit board | |
| CN102427685A (en) | Manufacturing process of HDI (High Density Interconnection) board | |
| CN102573339A (en) | Process for laminating printed circuit board (PCB) with buried/blind via structure | |
| CN106535490A (en) | Ultra-thick copper printed board and solder resisting processing method | |
| CN107241876A (en) | A kind of processing method for printed circuit board of being sunken cord without core plate one side | |
| WO2022156321A1 (en) | Method for manufacturing high-density interconnect circuit board | |
| CN110099523A (en) | A kind of manufacture craft of multilayer circuit board | |
| CN102802367A (en) | Multilayer board manufacturing method for improving bonding force of hole wall of PTH slot | |
| CN105530771A (en) | Process of manufacturing multilayer printed circuit board with embedded magnetic core | |
| CN103369821A (en) | PCB (printed circuit board) with high-density interconnection design and heat dissipation structure and manufacturing method thereof | |
| CN101765341B (en) | Molding structure and method for laser-assisting base plate line | |
| CN110461085B (en) | Circuit board capable of realizing crimping of components in stepped groove and manufacturing method thereof | |
| CN102858098A (en) | Production method of asymmetric PCB (printed circuit board) | |
| CN204031575U (en) | A kind of printed circuit board (PCB) | |
| CN211531434U (en) | Step type circuit board | |
| CN104981108B (en) | The processing method and circuit board of hanging structure golden finger | |
| CN107787131A (en) | A kind of preparation method of multilayer copper base | |
| CN102638948B (en) | Manufacturing method of printed circuit board | |
| CN103052261B (en) | For making break edge manufacture method and the jigsaw of PCB | |
| JP2011171353A (en) | Method of manufacturing printed board, and printed board using this | |
| CN201571253U (en) | High-layer circuit board | |
| KR100771283B1 (en) | Plugging Method of via hole in PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180529 |
|
| RJ01 | Rejection of invention patent application after publication |