CN108093569A - A kind of processing method for reducing super thick copper circuit board welding resistance difficulty - Google Patents

A kind of processing method for reducing super thick copper circuit board welding resistance difficulty Download PDF

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Publication number
CN108093569A
CN108093569A CN201611031221.0A CN201611031221A CN108093569A CN 108093569 A CN108093569 A CN 108093569A CN 201611031221 A CN201611031221 A CN 201611031221A CN 108093569 A CN108093569 A CN 108093569A
Authority
CN
China
Prior art keywords
plate
copper
circuit board
super thick
welding resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611031221.0A
Other languages
Chinese (zh)
Inventor
徐凯
高德萌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shennan Circuit Co Ltd
Original Assignee
Shennan Circuit Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shennan Circuit Co Ltd filed Critical Shennan Circuit Co Ltd
Priority to CN201611031221.0A priority Critical patent/CN108093569A/en
Publication of CN108093569A publication Critical patent/CN108093569A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/282Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0562Details of resist

Abstract

The invention discloses a kind of processing methods for reducing super thick copper circuit board welding resistance difficulty, comprise the following steps:Plate to be processed is laminated first;Then the plate after the lamination is electroplated;Then outer-layer circuit figure registration holes are bored to the plate after the plating;Then the plate for being drilled with outer-layer circuit figure registration holes is exposed, developed, and etch circuitous pattern, the preliminary line pattern for completing super thick copper circuit board makes;Then carry out resin to the gap of copper coin in the super thick copper circuit board to fill and lead up, and plate is pressed again after putting copper foil on outermost layer resin;Then the copper foil on the pressing plate is etched away;Then the plate of copper foil after the etching is carried out evening brush version out, and exposes the copper coin circuitous pattern completely;Then the plate of the exposed copper coin circuitous pattern is processed according to the wiring board work flow of normal 1 2OZ copper thickness, this method can reduce the difference in height of copper face and base material, reduce welding resistance difficulty.

Description

A kind of processing method for reducing super thick copper circuit board welding resistance difficulty
Technical field
The present invention relates to copper circuit board processing technique fields, particularly, it is difficult to be related to a kind of reduction super thick copper circuit board welding resistance The processing method of degree.
Background technology
Traditional super thick copper circuit board resistance welding processing method is the processing method according to common line plate silk-screen or spraying, is led to Ink is covered in copper face and substrate surface by the mode for crossing multiple welding resistance exposure, still, is not only flowed using such processing method Journey is longer, production cost is high, but also can surpass since difference in height is larger between thick copper coin and base material, can not be arranged in silk-screen printing process Air to the greatest extent, easily generates bubbles of ink so that super thick copper circuit board welding resistance so as to cause during super thick copper circuit board welding resistance Difficulty is larger.
The content of the invention
Present invention aims at a kind of processing method for reducing super thick copper circuit board welding resistance difficulty is provided, to solve existing skill In art, due to easily generating bubbles of ink during super thick copper circuit board welding resistance so that super thick copper circuit board welding resistance difficulty compared with The technical issues of big.
To achieve the above object, the present invention provides a kind of processing method for reducing super thick copper circuit board welding resistance difficulty, including Following steps:
A, plate to be processed is laminated;
B, the plate after the lamination is electroplated;
C, outer-layer circuit figure registration holes are bored to the plate after the plating;
D, the plate that the outer-layer circuit figure registration holes are drilled in step c is exposed, developed, and etch circuit Figure, the preliminary line pattern for completing super thick copper circuit board make;
E, resin is carried out to the gap of copper coin in the super thick copper circuit board to fill and lead up, and after outermost layer resin puts copper foil again Press plate;
F, the copper foil on the pressing plate is etched away;
G, the plate of the copper foil after etching in step f is carried out evening brush version out, and exposes the copper coin circuit completely Figure;
H, to the plate of the exposed copper coin circuitous pattern in step g according to the wiring board processing stream of normal 1-2OZ copper thickness Journey is processed.
Further, the thickness after plate plating after being laminated described in the step b is not less than 6OZ.
Further, the copper coin trace clearance in the step e is filled and led up using PP resins.
Further, the copper coin trace clearance is filled and led up by the way of moulding is laminated in the step e.
Further, the step a is omitted when the plate to be processed is dual platen.
The invention has the advantages that:A kind of processing side of reduction super thick copper circuit board welding resistance difficulty of the present invention Method, this method by super thick copper circuit board outer layer etching after, before super thick copper circuit board welding resistance by the way of moulding is laminated, The copper sheet gap that PP resins are fused to etching by high-temperature laminating is filled and led up, and using brush board is evened out, will be higher by copper face Base material polishes off;Then again by normally drilling, heavy copper, plating, figure, etching, welding resistance flow be processed.So for Welding resistance, thick copper is that the 1-2OZ copper that last time is electroplated is thick, and the flow of a normal welding resistance, which can be used, to be machined.It adopts The difference in height of copper face and base material can be reduced with this method, air can be drained in silk-screen printing process, so as to effectively prevent in super thick The generation of bubbles of ink during copper circuit board welding resistance effectively reduces super thick copper circuit board welding resistance difficulty.
Description of the drawings
Below with reference to figure, the present invention is described in further detail.The attached drawing for forming the part of the application is used for A further understanding of the present invention is provided, schematic description and description of the invention is not formed for explaining the present invention Inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is the flow chart of the preferred embodiment of the present invention.
Specific embodiment
The embodiment of the present invention is described in detail below in conjunction with attached drawing.
Referring to Fig. 1, the preferred embodiment of the present invention provides a kind of processing for reducing super thick copper circuit board welding resistance difficulty Method comprises the following steps:First, plate to be processed is laminated, the step can be omitted when plate to be processed is dual platen Suddenly;Then the plate after the lamination is electroplated, the panel thickness after plating is not less than 6OZ;Next it is drilled with outside to described The plate of sandwich circuit figure registration holes is exposed, develops, and etches circuitous pattern, the preliminary line for completing super thick copper circuit board Road graphic making etches the circuitous pattern of customer requirement;Next to the super-thick copper by the way of moulding is laminated Copper coin trace clearance is filled and led up using PP resins in wiring board, and presses plate again after PP resin outermost layers put copper foil, is kept away Exempt from the steel plate of pollution pressing during pollution pressing plate;Next the copper foil on the pressing plate is etched away;Next The plate of copper foil after the etching is carried out evening brush version out, and exposes the copper coin circuitous pattern completely, to ensure PP resins It is all evened out totally, copper coin circuit can be evened out and brush off a part;Next to the plate of the exposed copper coin circuitous pattern According to the wiring board work flow of normal 1-2OZ copper thickness:Drilling, heavy copper, plating, figure, etching, welding resistance are processed, and can be adopted It can be machined with the flow of a normal welding resistance.
It can be seen from the above description that the above embodiments of the present invention realize following technique effect:This method is led to It crosses after the etching of super thick copper circuit board outer layer, before super thick copper circuit board welding resistance by the way of moulding is laminated, PP resins is led to It crosses high-temperature laminating and is fused to the copper sheet gap of etching and filled and led up, using brush board is evened out, the base material for being higher by copper face is polished off; Then again by normally drilling, heavy copper, plating, figure, etching, welding resistance flow be processed.So for welding resistance, thick of copper It is the 1-2OZ copper thickness of last time plating, the flow of a normal welding resistance, which can be used, to be machined.It can be dropped using this method The difference in height of low copper face and base material can drain air in silk-screen printing process, so as to effectively prevent in super thick copper circuit board welding resistance The generation of bubbles of ink in the process effectively reduces super thick copper circuit board welding resistance difficulty.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the invention;For the skill of this field For art personnel, the invention may be variously modified and varied.Within the spirit and principles of the invention, that is made any repaiies Change, equivalent substitution, improvement etc., should all be included in the protection scope of the present invention.

Claims (5)

1. a kind of processing method for reducing super thick copper circuit board welding resistance difficulty, which is characterized in that comprise the following steps:
A, plate to be processed is laminated;
B, the plate after the lamination is electroplated;
C, outer-layer circuit figure registration holes are bored to the plate after the plating;
D, the plate that the outer-layer circuit figure registration holes are drilled in step c is exposed, developed, and etch circuit diagram Shape, the preliminary line pattern for completing super thick copper circuit board make;
E, carry out resin to the gap of copper coin in the super thick copper circuit board to fill and lead up, and pressed again after outermost layer resin puts copper foil Plate;
F, the copper foil on the pressing plate is etched away;
G, the plate after etching in step f is carried out evening brush version out, and exposes the copper coin circuitous pattern completely;
H, to the plate of the exposed copper coin circuitous pattern in step g according to normal 1-2OZ copper thickness wiring board work flow into Row processing.
2. a kind of processing method for reducing super thick copper circuit board welding resistance difficulty according to claim 1, it is characterised in that:Institute It states the thickness after the plate plating after being laminated described in step b and is not less than 6OZ.
3. a kind of processing method for reducing super thick copper circuit board welding resistance difficulty according to claim 1, it is characterised in that:Institute The gap for stating the copper coin in step e is filled and led up using PP resins.
4. a kind of processing method for reducing super thick copper circuit board welding resistance difficulty according to claim 1, it is characterised in that:Institute Step e is stated to fill and lead up the copper coin trace clearance by the way of moulding is laminated.
5. a kind of processing method for reducing super thick copper circuit board welding resistance difficulty according to claim 1, it is characterised in that:Institute Plate to be processed is stated to omit the step a during dual platen.
CN201611031221.0A 2016-11-22 2016-11-22 A kind of processing method for reducing super thick copper circuit board welding resistance difficulty Pending CN108093569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611031221.0A CN108093569A (en) 2016-11-22 2016-11-22 A kind of processing method for reducing super thick copper circuit board welding resistance difficulty

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611031221.0A CN108093569A (en) 2016-11-22 2016-11-22 A kind of processing method for reducing super thick copper circuit board welding resistance difficulty

Publications (1)

Publication Number Publication Date
CN108093569A true CN108093569A (en) 2018-05-29

Family

ID=62168571

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611031221.0A Pending CN108093569A (en) 2016-11-22 2016-11-22 A kind of processing method for reducing super thick copper circuit board welding resistance difficulty

Country Status (1)

Country Link
CN (1) CN108093569A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109496082A (en) * 2018-10-13 2019-03-19 奥士康科技股份有限公司 A kind of super thick copper sheet anti-welding printing method
CN111818738A (en) * 2020-07-08 2020-10-23 沪士电子股份有限公司 Method for processing thick copper PCB by using prepreg without glass cloth

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101861049A (en) * 2009-04-08 2010-10-13 昆山市华升电路板有限公司 Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof
CN103118496A (en) * 2013-01-25 2013-05-22 广东生益科技股份有限公司 Method for improving solder-mask cracking in heavy copper printed circuit boards
CN103491731A (en) * 2013-09-23 2014-01-01 惠州市金百泽电路科技有限公司 Super-thick copper multi-layer printed-circuit board manufacturing method
CN104717840A (en) * 2013-12-13 2015-06-17 深南电路有限公司 Circuit board manufacturing method and circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101861049A (en) * 2009-04-08 2010-10-13 昆山市华升电路板有限公司 Thick copper circuit board and circuit etching and solder-resisting manufacturing methods thereof
CN103118496A (en) * 2013-01-25 2013-05-22 广东生益科技股份有限公司 Method for improving solder-mask cracking in heavy copper printed circuit boards
CN103491731A (en) * 2013-09-23 2014-01-01 惠州市金百泽电路科技有限公司 Super-thick copper multi-layer printed-circuit board manufacturing method
CN104717840A (en) * 2013-12-13 2015-06-17 深南电路有限公司 Circuit board manufacturing method and circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109496082A (en) * 2018-10-13 2019-03-19 奥士康科技股份有限公司 A kind of super thick copper sheet anti-welding printing method
CN111818738A (en) * 2020-07-08 2020-10-23 沪士电子股份有限公司 Method for processing thick copper PCB by using prepreg without glass cloth

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Application publication date: 20180529