CN109496082A - A kind of super thick copper sheet anti-welding printing method - Google Patents
A kind of super thick copper sheet anti-welding printing method Download PDFInfo
- Publication number
- CN109496082A CN109496082A CN201811192547.0A CN201811192547A CN109496082A CN 109496082 A CN109496082 A CN 109496082A CN 201811192547 A CN201811192547 A CN 201811192547A CN 109496082 A CN109496082 A CN 109496082A
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- China
- Prior art keywords
- ink
- copper sheet
- halftone
- thick copper
- face
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Abstract
The invention discloses a kind of super thick copper sheet anti-welding printing method, include the following steps: Step 1: according to circuit board line figure, design and printing halftone, route and PAD；Slurry seal is carried out on halftone at big copper face, windowing is handled at route and the gap PAD；Thickness >=200um of copper sheet in halftone；Then by the way of the anti-solder ink that is printed on one side, the gap between route and PAD is all filled with anti-solder ink, then carries out the pre-baked semi-cured state that do not glue to ink after the bubble in static release ink；Step 2: after halftone two-face printing, line face anti-solder ink is republished；Third step: pre-baked, exposure, development are carried out.It is high-efficient the present invention provides a kind of reduction manpower, ensure quality in PCB aperture, the fixture of high-precision deburring.The present invention is before the super-thick copper anti-welding printing of PCB printed circuit board surface layer, substrate surface between printing resin ink filling line, reduces the difference in height in copper lines face and substrate, improves anti-welding printing quality.
Description
Technical field
The invention belongs to pcb board production technical fields, more particularly, to a kind of super thick copper sheet anti-welding printing method.
Background technique
PCB printed circuit board anti-welding printing, is usually printed using 36T, 42T halftone, by plate during printing
The factor of face copper layer thickness influences, and lower oil is poor, and route and the edge PAD are lost control of one's feelings ink, and circuit surface ink is thin, the quality such as rubescent
Problem.
Conventional thickness copper sheet, can be made by the method printed twice, i.e., the edge of first printed wire and PAD exposes
It does the second printing, line face and substrate surface after light, development again, anti-welding insulation is achieved the purpose that with this.
But when super thick copper sheet (single layer copper thickness >=200um), because copper face and substrate surface height fall are excessive, both the above method
It has been unable to satisfy the needs of solder mask green printing technology.
The shortcomings that prior art is that solder mask printing technology processing procedure, time production cycle increases one times, has seriously affected life
The efficiency and cost of production, product quality are not effectively improved really, and ink thin, rubescent quality problems in line face are not had yet
The improvement of effect.
Explanation of nouns:
PAD: it pads.
Summary of the invention
In order to solve the above technical problems, the invention discloses a kind of super thick copper sheet anti-welding printing methods.The present invention is printed in PCB
Before circuit board surface layer super-thick copper anti-welding printing processed, substrate surface between printing resin ink filling line reduces copper lines face and substrate
Difference in height improves anti-welding printing quality.
To achieve the above object, technical scheme is as follows:
A kind of super thick copper sheet anti-welding printing method, includes the following steps:
Step 1: according to circuit board line figure, design and printing halftone, route and PAD；It is sealed on halftone at copper face
Windowing is handled at slurry, route and the gap PAD；Thickness >=200um of copper sheet in halftone；Then using the anti-solder ink that is printed on one side
Gap between route and PAD is all filled with anti-solder ink by mode, then is carried out after the bubble in static release ink pre-
Bake the semi-cured state that do not glue to ink；
Step 2: after halftone two-face printing, line face anti-solder ink is republished；
Third step: pre-baked, exposure, development are carried out.
Further to improve, the pre-baked method is as follows: preexamination temperature is 73-75 DEG C, and preexamination temperature-time is
25min-30min。
Further to improve, when preexamination, carries out ultrasonication, and the frequency of ultrasonic wave is 30-40KHz.
Further to improve, the viscosity of the anti-solder ink is 170-180dpas.
Further to improve, when pre-baked, super thick copper sheet is placed in nitrogen atmosphere.
The invention has the advantages that
By being preferentially filled in trace clearance solder-mask printing ink, route copper face and substrate surface can be adequately reduced
Available head makes it reach the standard of conventional copper thickness circuit board up to drop, and the super thick copper sheet that may achieve anti-welding printing with this is (single
Layer copper thickness >=200um) technology and quality requirements.
Specific embodiment
A kind of super thick copper sheet anti-welding printing method, includes the following steps:
Step 1: according to circuit board line figure, design and printing halftone, route and PAD；It is sealed on halftone at copper face
Windowing is handled at slurry, route and the gap PAD；Thickness >=200um of copper sheet in halftone；Then using the anti-solder ink that is printed on one side
Gap between route and PAD is all filled with anti-solder ink by mode, then is carried out after the bubble in static release ink pre-
Bake the semi-cured state that do not glue to ink；
Step 2: after halftone two-face printing, line face anti-solder ink is republished；
Third step: pre-baked, exposure, development are carried out.
Pre-baked method is as follows: when pre-baked, super thick copper sheet is placed in nitrogen atmosphere, and preexamination temperature is 73-75 DEG C, preexamination temperature
Spending the time is 25min-30min, and carries out ultrasonication, and the frequency of ultrasonic wave is 30-40KHz.To prevent surface layer ink oxygen
Change, and makes black grain uniform.
Claims (5)
1. a kind of super thick copper sheet anti-welding printing method, which comprises the steps of:
Step 1: according to circuit board line figure, design and printing halftone, route and PAD；Slurry seal, line are carried out on halftone at copper face
Windowing is handled at road and the gap PAD；Thickness >=200um of copper sheet in halftone；Then by the way of the anti-solder ink that is printed on one side,
Gap between route and PAD is all filled with anti-solder ink, then it is static release ink in bubble after carry out it is pre-baked extremely
The semi-cured state that ink does not glue；
Step 2: after halftone two-face printing, line face anti-solder ink is republished；
Third step: pre-baked, exposure, development are carried out.
2. super thick copper sheet anti-welding printing method as described in claim 1, which is characterized in that the pre-baked method is as follows: pre-
Examining temperature is 73-75 DEG C, and preexamination temperature-time is 25min-30min.
3. super thick copper sheet anti-welding printing method as claimed in claim 2, which is characterized in that carried out at ultrasonic wave when the preexamination
Reason, the frequency of ultrasonic wave are 30-40KHz.
4. super thick copper sheet anti-welding printing method as described in claim 1, which is characterized in that the viscosity of line face anti-solder ink
For 170-180dpas.
5. super thick copper sheet anti-welding printing method as described in claim 1, which is characterized in that when pre-baked, super thick copper sheet is placed in nitrogen
During atmosphere is enclosed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811192547.0A CN109496082A (en) | 2018-10-13 | 2018-10-13 | A kind of super thick copper sheet anti-welding printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811192547.0A CN109496082A (en) | 2018-10-13 | 2018-10-13 | A kind of super thick copper sheet anti-welding printing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109496082A true CN109496082A (en) | 2019-03-19 |
Family
ID=65689802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811192547.0A Pending CN109496082A (en) | 2018-10-13 | 2018-10-13 | A kind of super thick copper sheet anti-welding printing method |
Country Status (1)
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| CN (1) | CN109496082A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248489A (en) * | 2019-07-08 | 2019-09-17 | 景旺电子科技(龙川)有限公司 | A method of promoting thick copper plate solder resistance producing efficiency |
| CN110366323A (en) * | 2019-07-03 | 2019-10-22 | 深圳明阳电路科技股份有限公司 | A kind of production method of wiring board soldermask layer |
| CN110802963A (en) * | 2019-11-06 | 2020-02-18 | 四会富仕电子科技股份有限公司 | Character processing method for PCB (printed circuit board) super-thick copper plate |
| CN112087883A (en) * | 2019-06-12 | 2020-12-15 | 群翊工业股份有限公司 | Substrate surface feeding method and substrate surface feeding equipment |
| CN112188732A (en) * | 2019-07-03 | 2021-01-05 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of medical instrument detection plate |
| CN113710000A (en) * | 2021-08-30 | 2021-11-26 | 江西志浩电子科技有限公司 | Linemask processing technology of thick copper plate |
| CN114143978A (en) * | 2021-12-27 | 2022-03-04 | 百强电子（深圳）有限公司 | Solder mask preparation process for selective surface fine treatment of thick copper plate |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112087883A (en) * | 2019-06-12 | 2020-12-15 | 群翊工业股份有限公司 | Substrate surface feeding method and substrate surface feeding equipment |
| CN110366323A (en) * | 2019-07-03 | 2019-10-22 | 深圳明阳电路科技股份有限公司 | A kind of production method of wiring board soldermask layer |
| CN112188732A (en) * | 2019-07-03 | 2021-01-05 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of medical instrument detection plate |
| CN110248489A (en) * | 2019-07-08 | 2019-09-17 | 景旺电子科技(龙川)有限公司 | A method of promoting thick copper plate solder resistance producing efficiency |
| CN110802963A (en) * | 2019-11-06 | 2020-02-18 | 四会富仕电子科技股份有限公司 | Character processing method for PCB (printed circuit board) super-thick copper plate |
| CN110802963B (en) * | 2019-11-06 | 2021-03-05 | 四会富仕电子科技股份有限公司 | Character processing method for PCB (printed circuit board) super-thick copper plate |
| CN113710000A (en) * | 2021-08-30 | 2021-11-26 | 江西志浩电子科技有限公司 | Linemask processing technology of thick copper plate |
| CN114143978A (en) * | 2021-12-27 | 2022-03-04 | 百强电子（深圳）有限公司 | Solder mask preparation process for selective surface fine treatment of thick copper plate |
| CN114143978B (en) * | 2021-12-27 | 2022-07-05 | 百强电子（深圳）有限公司 | Solder mask preparation process for selective surface fine treatment of thick copper plate |
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Application publication date: 20190319 |
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| RJ01 | Rejection of invention patent application after publication |