CN105101662A - Fabrication method for high-aspect rate copper-thickness printed circuit board (pcb) solder mask - Google Patents
Fabrication method for high-aspect rate copper-thickness printed circuit board (pcb) solder mask Download PDFInfo
- Publication number
- CN105101662A CN105101662A CN201510434595.6A CN201510434595A CN105101662A CN 105101662 A CN105101662 A CN 105101662A CN 201510434595 A CN201510434595 A CN 201510434595A CN 105101662 A CN105101662 A CN 105101662A
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- 60min
- aspect ratio
- high aspect
- manufacturing methods
- pcb solder
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
Abstract
The invention belongs to the field of processing of a circuit board, in particular relates to a fabrication method for a high-aspect rate copper-thickness printed circuit board (pcb) solder mask. By respectively carrying out the three steps of plug hole processing, circuit oil spraying and screen printing and circuit boards are respectively processed after three steps, and thus, the technological difficulties that green oil in a plug hole is difficult to dry, humidity of the green oil is high, green oil is expanded fast with high temperature to cause oil explosion in the plug hole on PAD and the like are solved. First post-baking treatment is divided into eight sections, second post-baking treatment is divided into six sections, oil explosion during board baking with high temperature in one time is prevented, the fabrication yield of the high-aspect rate copper-thickness pcb solder mask is effectively improved, and the fabrication method has high favorable market prospect and application value.
Description
Technical field
The invention belongs to wiring board manufacture field, be specifically related to the thick pcb solder-resisting manufacturing methods of a kind of high aspect ratio copper.
Background technology
In prior art, in the wiring board course of processing, the thick copper pcb of current high aspect ratio (thickness of slab > 4mm, consent aperture aspect ratio > 10, table copper thickness > 2OZ) is more and more.The production procedure of PCB former welding resistance is as follows: pre-treatment → consent → silk-screen face oil → pre-baked → exposure → development → quality inspection → bake afterwards.Because table copper is thick in production process, welding resistance silk-screen oil is thin causes the rubescent and disposable baking sheet of the excessive consent of aspect ratio of circuit to occur PAD on the quick-fried oil of welding resistance.
And in actual production process, there is a lot of limitation and shortcoming in this method of prior art: because producing plate thickness of slab > 4mm, consent aperture aspect ratio > 10, table copper thickness > 2OZ, makes welding resistance by this flow process, has occurred because copper is thicker than thick, after silk-screen, circuit is rubescent, directly roasting after 150 DEG C, consent aperture aspect ratio is large, and consent green oil is not easily dried and too fastly with the direct high-temperature expansion of green oil high humidity occurred PAD on the quick-fried oil of consent.
Therefore, provide a kind of development effect good, be not easy to occur quick-fried oily phenomenon, product quality is high, and the thick pcb solder-resisting manufacturing methods of the high aspect ratio copper that scrappage is low is the task of top priority of current wiring board manufacture field.
Summary of the invention
For this reason, technical problem to be solved by this invention is to overcome in prior art, one side window the PCB of jack designs and double-sided windowed plug hole design develop in welding resistance manufacturing process after welding resistance on PAD, fall bridge or afterwards operation fall oily problem, thus it is good to propose a kind of development effect, there is not bridge and fall oily problem, quality is high, the thick pcb solder-resisting manufacturing methods of the high aspect ratio copper that scrappage is low.
For solving the problems of the technologies described above, of the present inventionly disclose the thick pcb solder-resisting manufacturing methods of a kind of high aspect ratio copper, wherein, described method order is divided into consent treatment step, spraying coating line road binders step and silk-screen surface step three steps.
Preferably, the thick pcb solder-resisting manufacturing methods of described high aspect ratio copper, wherein, need before described consent treatment step to carry out first time pre-treatment nog plate to the whole plate of wiring board, need after described consent treatment step separately to consent order carry out pre-baked, develop, check, return exposure, rear roasting process.
More preferred, the thick pcb solder-resisting manufacturing methods of described high aspect ratio copper, wherein, need before described spraying coating line road binders step to carry out second time pre-treatment nog plate to the whole plate of wiring board, need after described spraying coating line road binders step to develop to wiring board order, check, rear roasting process.
Further, the thick pcb solder-resisting manufacturing methods of described high aspect ratio copper, wherein, need before described silk-screen surface step to carry out third time pre-treatment nog plate to the whole plate of wiring board, need after described silk-screen surface step to wiring board order carry out pre-baked, development, check, rear roasting process.
More further, the thick pcb solder-resisting manufacturing methods of described high aspect ratio copper, wherein, described in return in step of exposure the energy value returning exposure be 800 MJs/time, number of times is twice.
Preferably, the thick pcb solder-resisting manufacturing methods of described high aspect ratio copper, wherein, in described consent treatment step, pre-baked temperature is 75 DEG C, and the time is 45min.
Preferably, the thick pcb solder-resisting manufacturing methods of described high aspect ratio copper, wherein, sprays as 0.3-0.35mpa in described spraying coating line road binders step.
Preferably, the thick pcb solder-resisting manufacturing methods of described high aspect ratio copper, wherein, the rear roasting process after described consent treatment step is divided into eight sections, every section of actual temp and time are: 55 DEG C × 60min, 65 DEG C × 60min, 75 DEG C × 60min, 85 DEG C × 60min, 95 DEG C × 60min, 110 DEG C × 60min, 130 DEG C × 60min, 150 DEG C × 60min.
More preferred, the thick pcb solder-resisting manufacturing methods of described high aspect ratio copper, wherein, rear roasting process after described spraying coating line road binders step is divided into six sections, and every section of actual temp and time are: 75 DEG C × 30min, 85 DEG C × 30min, 95 DEG C × 30min, 110 DEG C × 30min, 130 DEG C × 30min, 150 DEG C × 30min.
More preferred, the thick pcb solder-resisting manufacturing methods of described high aspect ratio copper, wherein, rear roasting after described silk-screen surface step, temperature is 150 DEG C, and the time is 60min.
Technique scheme of the present invention has the following advantages compared to existing technology: by the mode of consent treatment step, spraying coating line road binders step and silk-screen surface step three steps separately being carried out respectively, and respectively wiring board is processed after three steps, the division of labor solves consent green oil and not easily dries and too fastly with the direct high-temperature expansion of green oil high humidity to occur on the quick-fried oil of consent the technical bottlenecks such as PAD; After first time, roasting process is divided into eight sections, and after second time, roasting process is divided into six sections, prevents because of the quick-fried oil of high temperature baking sheet, effectively improves the yield that high aspect ratio thick copper pcb welding resistance makes; There is good market prospects and using value.
Embodiment
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention, the present invention is further detailed explanation.
Embodiment 1
The present embodiment disclose the thick pcb solder-resisting manufacturing methods of a kind of high aspect ratio copper, described method is: described method order is divided into consent treatment step, spraying coating line road binders step and silk-screen surface step three steps.
(1) first time pre-treatment nog plate is carried out to the whole plate of wiring board, then carries out consent treatment step, then independent to consent order carry out pre-baked, develop, check, return exposure, rear roasting process; The described energy value returning exposure that returns in step of exposure is 800 MJs/time; In described consent treatment step, pre-baked temperature is 75 DEG C, and the time is 45min; In described step of exposure, exposure guide rule is 9-13 lattice.Described rear roasting process is all divided into eight sections, and every section of actual temp and time are: 55 DEG C × 60min, 65 DEG C × 60min, 75 DEG C × 60min, 85 DEG C × 60min, 95 DEG C × 60min, 110 DEG C × 60min, 130 DEG C × 60min, 150 DEG C × 60min.
(2) second time pre-treatment nog plate is carried out to the whole plate of wiring board, then carries out spraying coating line road binders step, then wiring board order developed, check, rear roasting process; Spray as 0.3-0.35mpa in described spraying coating line road binders step; In described step of exposure, exposure guide rule is 9-13 lattice.Described rear roasting process is all divided into six sections, and every section of actual temp and time are: 75 DEG C × 30min, 85 DEG C × 30min, 95 DEG C × 30min, 110 DEG C × 30min, 130 DEG C × 30min, 150 DEG C × 30min.
(3) need before described silk-screen surface step to carry out third time pre-treatment nog plate to the whole plate of wiring board, then carry out silk-screen surface step, then to wiring board order carry out pre-baked, development, check, rear roasting process.Gear point net is adopted to carry out silk-screen surface in described silk-screen surface step; In described step of exposure, exposure guide rule is 9-13 lattice.Described rear roasting treatment temperature and time are: 150 DEG C × 60min.
Embodiment 2
The present embodiment disclose the thick pcb solder-resisting manufacturing methods of a kind of high aspect ratio copper, described method is: described method order is divided into consent treatment step, spraying coating line road binders step and silk-screen surface step three steps.
(1) first time pre-treatment nog plate is carried out to the whole plate of wiring board, then carries out consent treatment step, then independent to consent order carry out pre-baked, develop, check, return exposure, rear roasting process; The described energy value returning exposure that returns in step of exposure is 800 MJs/time, and number of times is twice; In described consent treatment step, pre-baked temperature is 75 DEG C, and the time is 45min; In described step of exposure, exposure guide rule is 9-13 lattice.Described rear roasting process is all divided into eight sections, and every section of actual temp and time are: 55 DEG C × 60min, 65 DEG C × 60min, 75 DEG C × 60min, 85 DEG C × 60min, 95 DEG C × 60min, 110 DEG C × 60min, 130 DEG C × 60min, 150 DEG C × 60min.
(2) second time pre-treatment nog plate is carried out to the whole plate of wiring board, then carries out spraying coating line road binders step, then wiring board order developed, check, rear roasting process; Spray as 0.3-0.35mpa in described spraying coating line road binders step; In described step of exposure, exposure guide rule is 9-13 lattice.Described rear roasting process is all divided into six sections, and every section of actual temp and time are: 75 DEG C × 30min, 85 DEG C × 30min, 95 DEG C × 30min, 110 DEG C × 30min, 130 DEG C × 30min, 150 DEG C × 30min.
(3) need before described silk-screen surface step to carry out third time pre-treatment nog plate to the whole plate of wiring board, then carry out silk-screen surface step, then to wiring board order carry out pre-baked, development, check, rear roasting process.Gear point net is adopted to carry out silk-screen surface in described silk-screen surface step; In described step of exposure, exposure guide rule is 9-13 lattice.Described rear roasting treatment temperature and time are: 150 DEG C × 60min.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (10)
1. the thick pcb solder-resisting manufacturing methods of high aspect ratio copper, is characterized in that, described method order is divided into consent treatment step, spraying coating line road binders step and silk-screen surface step three steps.
2. the thick pcb solder-resisting manufacturing methods of high aspect ratio copper as claimed in claim 1, it is characterized in that, need before described consent treatment step to carry out first time pre-treatment nog plate to the whole plate of wiring board, need after described consent treatment step separately to consent order carry out pre-baked, develop, check, return exposure, rear roasting process.
3. the thick pcb solder-resisting manufacturing methods of high aspect ratio copper as claimed in claim 1, it is characterized in that, need before described spraying coating line road binders step to carry out second time pre-treatment nog plate to the whole plate of wiring board, need after described spraying coating line road binders step to develop to wiring board order, check, rear roasting process.
4. the thick pcb solder-resisting manufacturing methods of high aspect ratio copper as claimed in claim 1, it is characterized in that, need before described silk-screen surface step to carry out third time pre-treatment nog plate to the whole plate of wiring board, need after described silk-screen surface step to wiring board order carry out pre-baked, development, check, rear roasting process.
5. the thick pcb solder-resisting manufacturing methods of high aspect ratio copper according to claim 2, is characterized in that, described in return in step of exposure the energy value returning exposure be 800 MJs/time, number of times is twice.
6. the thick pcb solder-resisting manufacturing methods of high aspect ratio copper according to claim 1 and 2, is characterized in that, in described consent treatment step, pre-baked temperature is 75 DEG C, and the time is 45min.
7. the thick pcb solder-resisting manufacturing methods of the high aspect ratio copper according to claim 1 or 3, is characterized in that, sprays as 0.3-0.35mpa in described spraying coating line road binders step.
8. the thick pcb solder-resisting manufacturing methods of high aspect ratio copper according to claim 2, it is characterized in that, rear roasting process after described consent treatment step is divided into eight sections, and every section of actual temp and time are: 55 DEG C × 60min, 65 DEG C × 60min, 75 DEG C × 60min, 85 DEG C × 60min, 95 DEG C × 60min, 110 DEG C × 60min, 130 DEG C × 60min, 150 DEG C × 60min.
9. the thick pcb solder-resisting manufacturing methods of high aspect ratio copper according to claim 3, it is characterized in that, rear roasting process after described spraying coating line road binders step is divided into six sections, every section of actual temp and time are: 75 DEG C × 30min, 85 DEG C × 30min, 95 DEG C × 30min, 110 DEG C × 30min, 130 DEG C × 30min, 150 DEG C × 30min.
10. the thick pcb solder-resisting manufacturing methods of high aspect ratio copper according to claim 4, is characterized in that, rear roasting after described silk-screen surface step, and temperature is 150 DEG C, and the time is 60min.
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| CN201510434595.6A CN105101662A (en) | 2015-07-22 | 2015-07-22 | Fabrication method for high-aspect rate copper-thickness printed circuit board (pcb) solder mask |
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| CN201510434595.6A CN105101662A (en) | 2015-07-22 | 2015-07-22 | Fabrication method for high-aspect rate copper-thickness printed circuit board (pcb) solder mask |
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| CN201510434595.6A Pending CN105101662A (en) | 2015-07-22 | 2015-07-22 | Fabrication method for high-aspect rate copper-thickness printed circuit board (pcb) solder mask |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105916306A (en) * | 2016-05-19 | 2016-08-31 | 湖北龙腾电子科技有限公司 | PCB jack panel segmented panel baking method |
| CN106793552A (en) * | 2017-02-10 | 2017-05-31 | 昆山元茂电子科技有限公司 | The soldering-inhibiting method of printed circuit board (PCB) |
| CN107124826A (en) * | 2017-06-20 | 2017-09-01 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN107708323A (en) * | 2017-10-30 | 2018-02-16 | 惠州市和信达线路板有限公司 | Thick copper printed circuit board welding resistance consent solidify afterwards baking sheet technique and its apparatus for baking |
| CN109475046A (en) * | 2018-12-17 | 2019-03-15 | 汕头凯星印制板有限公司 | A kind of production method and its printed board of the copper printed board of solder mask pore-free thickness |
| CN109496082A (en) * | 2018-10-13 | 2019-03-19 | 奥士康科技股份有限公司 | A kind of super thick copper sheet anti-welding printing method |
| CN109831874A (en) * | 2019-02-21 | 2019-05-31 | 深圳崇达多层线路板有限公司 | A method of solving the upper PAD of the quick-fried oil of welding resistance |
| CN110225660A (en) * | 2019-03-25 | 2019-09-10 | 珠海崇达电路技术有限公司 | A kind of production method of high thermal conductivity thickness copper base |
| CN112118685A (en) * | 2020-09-01 | 2020-12-22 | 金禄电子科技股份有限公司 | Manufacturing method of thick copper plate with screen printing double-layer solder mask |
| CN114364150A (en) * | 2021-11-19 | 2022-04-15 | 清远市富盈电子有限公司 | Processing technology of solder resist ink for thick copper surface |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105916306A (en) * | 2016-05-19 | 2016-08-31 | 湖北龙腾电子科技有限公司 | PCB jack panel segmented panel baking method |
| CN106793552A (en) * | 2017-02-10 | 2017-05-31 | 昆山元茂电子科技有限公司 | The soldering-inhibiting method of printed circuit board (PCB) |
| CN107124826A (en) * | 2017-06-20 | 2017-09-01 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN107708323A (en) * | 2017-10-30 | 2018-02-16 | 惠州市和信达线路板有限公司 | Thick copper printed circuit board welding resistance consent solidify afterwards baking sheet technique and its apparatus for baking |
| CN109496082A (en) * | 2018-10-13 | 2019-03-19 | 奥士康科技股份有限公司 | A kind of super thick copper sheet anti-welding printing method |
| CN109475046A (en) * | 2018-12-17 | 2019-03-15 | 汕头凯星印制板有限公司 | A kind of production method and its printed board of the copper printed board of solder mask pore-free thickness |
| CN109831874A (en) * | 2019-02-21 | 2019-05-31 | 深圳崇达多层线路板有限公司 | A method of solving the upper PAD of the quick-fried oil of welding resistance |
| CN110225660A (en) * | 2019-03-25 | 2019-09-10 | 珠海崇达电路技术有限公司 | A kind of production method of high thermal conductivity thickness copper base |
| CN112118685A (en) * | 2020-09-01 | 2020-12-22 | 金禄电子科技股份有限公司 | Manufacturing method of thick copper plate with screen printing double-layer solder mask |
| CN112118685B (en) * | 2020-09-01 | 2021-05-18 | 金禄电子科技股份有限公司 | Manufacturing method of thick copper plate with screen printing double-layer solder mask |
| CN114364150A (en) * | 2021-11-19 | 2022-04-15 | 清远市富盈电子有限公司 | Processing technology of solder resist ink for thick copper surface |
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Application publication date: 20151125 |