CN114364150A - Processing technology of solder resist ink for thick copper surface - Google Patents
Processing technology of solder resist ink for thick copper surface Download PDFInfo
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- CN114364150A CN114364150A CN202111409017.9A CN202111409017A CN114364150A CN 114364150 A CN114364150 A CN 114364150A CN 202111409017 A CN202111409017 A CN 202111409017A CN 114364150 A CN114364150 A CN 114364150A
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 73
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 73
- 239000010949 copper Substances 0.000 title claims abstract description 73
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 26
- 238000012545 processing Methods 0.000 title claims abstract description 23
- 238000005516 engineering process Methods 0.000 title claims abstract description 18
- 238000005507 spraying Methods 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 44
- 238000007650 screen-printing Methods 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000011161 development Methods 0.000 claims abstract description 6
- 239000007921 spray Substances 0.000 abstract description 5
- 238000004377 microelectronic Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
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Abstract
The invention belongs to the field of microelectronics, and discloses a thick copper surface solder resist ink processing technology, which comprises the following steps: step 1: the first low-pressure spraying, namely spraying a layer of ink on the surface of a base material through a low-pressure spraying process, pre-baking, exposing by adopting an LMS film, and then carrying out developing, baking and plate grinding operations; step 2: spraying a layer of ink on the surface of the base material obtained in the step (1) through a low-pressure spraying process, pre-baking, exposing, and then carrying out developing, baking and plate grinding operations; and step 3: and (4) screen printing, namely, carrying out screen printing operation by adopting a 36T screen, and then carrying out prebaking, exposure and development. The process adopts a green oil flow twice for a thick copper plate with the thickness of more than 3OZ, continuously sprays the thick copper plate twice by low-pressure spraying for the first time, and uses an LMS film for exposure; and (3) carrying out green oil silk-screen printing by using a 36T screen printing plate for the second time, and exposing by using a normal film, wherein the requirements of green oil thickness and height difference can be met after the green oil is finished twice, and the quality problems of ink inlet holes and the like are avoided.
Description
Technical Field
The invention belongs to the technical field of microelectronics, and particularly relates to a processing technology of thick copper surface solder resist ink.
Background
Cn202010905452.x discloses a method for manufacturing a thick copper plate with a sprayed and silk-screened double-layer solder mask. The manufacturing method of the thick copper plate comprises the steps of twice resistance welding flow production, wherein the first resistance welding is performed by spraying production, ink spraying is performed on the cleaned thick copper plate, counterpoint exposure development processing is performed after pre-baking, then low-temperature baking is performed to enable the first layer of ink to be primarily cured, sand blasting, washing and drying processing is performed on the basis of the first layer of ink to clean and enhance the adhesive force between the ink and the plate surface, and then the second resistance welding is performed by adopting a silk-screen printing mode. The method solves the quality problems of solder mask bridge dropping, ink inlet holes, line edge oil bubbles, uneven ink and the like existing in the current solder mask ink manufacturing of the thick copper plate by adopting twice silk screen printing. Simultaneously, through a vacuumizing mode, bubbles in the solder mask silk screen can be quickly and effectively exhausted, and the problem that the quality is poor due to the fact that pinholes appear on the surface of the baked circuit board is solved.
In practical application, it is found that in the process of generating a thick copper surface, if 1 time of low-pressure spraying and 1 time of silk-screen printing are adopted, red leakage of the copper surface can be caused; if only silk screen printing is adopted, oil does not flow into the circuit, the copper surface leaks red, and oil enters into the hole.
Therefore, the technical problems to be solved by the application are as follows: how to realize the enough ink thickness of the thick copper surface and simultaneously avoid the problems of ink inlet holes, red line surface and over-high height difference.
Disclosure of Invention
The invention mainly aims to provide a thick copper surface solder resist ink processing technology, which adopts a green oil flow twice for a thick copper plate with more than 3OZ, continuously sprays twice by low-pressure spraying for the first time, and uses an LMS film for exposure; and (3) carrying out green oil silk-screen printing by using a 36T screen printing plate for the second time, and exposing by using a normal film, wherein the requirements of green oil thickness and height difference can be met after the green oil is finished twice, and the quality problems of ink inlet holes and the like are avoided.
The method of the invention comprises the following steps:
a processing technology of solder resist ink with a thick copper surface comprises the following steps:
step 1: the first low-pressure spraying, namely spraying a layer of ink on the surface of a base material through a low-pressure spraying process, pre-baking, exposing by adopting an LMS film, and then carrying out developing, baking and plate grinding operations; in the exposure process, the part within 2-4mil of the edge of the copper surface is not exposed;
step 2: spraying a layer of ink on the surface of the base material obtained in the step (1) through a low-pressure spraying process, pre-baking, exposing, and then carrying out developing, baking and plate grinding operations; in the exposure process, the windowing part of the copper surface is not exposed according to the size designed by a customer;
and step 3: and (4) screen printing, namely, carrying out screen printing operation by adopting a 36T screen, and then carrying out prebaking, exposure and development.
In the thick copper surface solder resist ink processing technology, the copper surfaces are copper surfaces and circuits for mounting electronic components;
if the width of the copper surface is less than 6 mils, then all of the copper surface is not exposed in step 1.
In the above processing technology of the thick copper surface solder resist ink, in the steps 1 and 2, the process parameters of the low-pressure spraying are as follows: the viscosity of the ink is 60-70S, and the ejection pressure of the ink is 0.15-0.4 MPa; the single-gun stepping speed is 25 +/-5 mm or the double-gun stepping speed is 50 +/-5 mm; the thickness of the ink is 70-90 μm.
In the processing technology of the solder resist ink with the thick copper surface, in the step 1, the baking technological parameters are as follows: baking at 60 + -5 deg.C for 60 + -5 min, 70 + -5 deg.C for 30 + -5 min, 90 + -5 deg.C for 30 + -5 min, 110 + -5 deg.C for 30 + -5 min, and 150 + -5 deg.C for at least 10 min;
the baking process parameters in the step 2 are as follows: 60 plus or minus 5min, baking at 70 plus or minus 5 ℃ for 30 plus or minus 5min, baking at 90 plus or minus 5 ℃ for 30 plus or minus 5min, baking at 110 plus or minus 5 ℃ for 30 plus or minus 5min, and baking at 150 plus or minus 5 ℃ for at least 20 min.
In the processing technology of the solder resist ink with the thick copper surface, in the step 3, the viscosity of the ink for silk-screen printing is 50 +/-10 dps.
In the processing technology of the solder resist ink with the thick copper surface, in the steps 1-3, the developing speed is 5 +/-0.5 m/min.
In the processing technology of the thick copper surface solder resist ink, the height of the copper surface is more than 3 ounces.
One of the above technical solutions of the present invention has at least one of the following advantages or beneficial effects:
aiming at a thick copper plate with the thickness of more than 3OZ, the invention adopts a green oil flow twice, continuously sprays twice by low-pressure spraying for the first time, and uses an LMS film for exposure; and (3) carrying out green oil silk-screen printing by using a 36T screen printing plate for the second time, exposing by using a normal film, meeting the requirements of green oil thickness and height difference after twice green oil is finished, and having no quality problems such as ink inlet holes and the like, wherein the production of the copper plate with the thickness of more than 3OZ can be finished by the self process. The method of 4 ounce to 5 ounce is to use spraying to fill the base material twice and then to use silk screen printing once to meet the relevant requirements.
Drawings
The invention is further described below with reference to the accompanying drawings and examples;
FIG. 1 is a flow chart of example 1 of the present invention;
fig. 2 is a cut-away view of a circuit board of an embodiment of the present invention.
FIG. 3 is a cut-away view of a circuit board prepared with a 36T stop-grid process only;
fig. 4 is a cut-away view of a circuit board prepared by a low pressure spray only process.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
Example 1
Referring to fig. 1, a processing technology of a thick copper surface solder resist ink comprises the following steps:
step 1: the first low-pressure spraying, namely spraying a layer of ink on the surface of a base material through a low-pressure spraying process, pre-baking, exposing by adopting an LMS film, and then carrying out developing, baking and plate grinding operations; in the exposure process, the part within 2-4mil of the edge of the copper surface is not exposed, namely the middle part of the copper surface is not exposed; if the width of the copper surface is less than 6mil, the copper surface is not exposed in step 1, and the reserved part of the high copper surface is not exposed in step 1, so that the bottom layer ink can be laid in the first low-pressure spraying process, the surface oil is sprayed for the second time after the plate is normally ground after the plate is baked, and a larger line angle can be formed after the second low-pressure spraying.
It should be explained that: the copper surface is used for installing electronic components and circuits.
The product produced in this example was model 23247, the copper face height was 3 ounces, and the finished copper thickness was 4 ounces.
In this step, the baking process parameters are as follows: baking at 60 + -5 deg.C for 60min, 70 + -5 deg.C for 30min, 90 + -5 deg.C for 30min, 110 + -5 deg.C for 30min, and 150 + -5 deg.C for 20 min;
by adopting the parameters of the baking plate, the wrinkling of the baking plate can be effectively avoided.
Step 2: spraying a layer of ink on the surface of the base material obtained in the step (1) through a low-pressure spraying process, pre-baking, exposing, and then carrying out developing, baking and plate grinding operations; in the exposure process, the windowing part of the copper surface is not exposed according to the size designed by a customer;
the baking process parameters in the step are as follows: 60min, baking at 70 + -5 deg.C for 30min, baking at 90 + -5 deg.C for 30min, baking at 110 + -5 deg.C for 30min, and baking at 150 + -5 deg.C for 20 min.
The viscosity of the ink sprayed at low pressure in the steps 1 and 2 can be 65S, and the ink spraying pressure is 0.25 MPa; the single-gun stepping speed is 25 +/-5 mm/min; the ink thickness was 80 μm.
And step 3: and (4) screen printing, namely, carrying out screen printing operation by adopting a 36T screen, and then carrying out prebaking, exposure and development.
The viscosity of the screen printing ink is 50 dps.
In steps 1-3, the developing speed is 5 + -0.5 m/min.
Through the operation, the line angle of the product is 15-22 mu m, the line surface is 25-30um, and the height difference is less than 5 um; spraying is continuously carried out twice, exposure is carried out for the first time according to LMS film manufacturing, and the second time is carried out for the first time according to normal 36T silk screen printing, so that the oil thickness can reach the standard.
Example 2
A processing technology of solder resist ink with a thick copper surface comprises the following steps:
step 1: the first low-pressure spraying, namely spraying a layer of ink on the surface of a base material through a low-pressure spraying process, pre-baking, exposing by adopting an LMS film, and then carrying out developing, baking and plate grinding operations; in the exposure process, the part within 2-4mil of the edge of the copper surface is not exposed, namely the middle part of the copper surface is not exposed; if the width of the copper surface is less than 6mil, the copper surface is not exposed in step 1, and the reserved part of the high copper surface is not exposed in step 1, so that the bottom layer ink can be laid in the first low-pressure spraying process, the surface oil is sprayed for the second time after the plate is normally ground after the plate is baked, and a larger line angle can be formed after the second low-pressure spraying.
It should be explained that: the copper surface is used for installing electronic components and circuits.
The product produced in this example was model 23247, the copper face height was 3 ounces, and the finished copper thickness was 4 ounces.
In this step, the baking process parameters are as follows: baking at 60 + -5 deg.C for 55min, 70 + -5 deg.C for 35min, 90 + -5 deg.C for 35min, 110 + -5 deg.C for 25min, and 150 + -5 deg.C for 10 min;
by adopting the parameters of the baking plate, the wrinkling of the baking plate can be effectively avoided.
Step 2: spraying a layer of ink on the surface of the base material obtained in the step (1) through a low-pressure spraying process, pre-baking, exposing, and then carrying out developing, baking and plate grinding operations; in the exposure process, the windowing part of the copper surface is not exposed according to the size designed by a customer;
the baking process parameters in the step are as follows: 55min, baking at 70 + -5 deg.C for 35min, baking at 90 + -5 deg.C for 35min, baking at 110 + -5 deg.C for 25min, and baking at 150 + -5 deg.C for 20 min.
The viscosity of the ink sprayed at low pressure in the steps 1 and 2 can be 65S, and the ink spraying pressure is 0.25 MPa; the double-gun stepping speed is 50 +/-5 mm/min; the ink thickness was 80 μm.
And step 3: and (4) screen printing, namely, carrying out screen printing operation by adopting a 36T screen, and then carrying out prebaking, exposure and development.
The viscosity of the screen printing ink is 50 dps.
In steps 1-3, the developing speed is 5 +/-0.5 m/min, and the exposure energy is 11/12 grids.
Comparative examples 1 to 4
Comparative examples 1 to 4 each used the following protocol:
scheme 1: carrying out primary screen printing by adopting a 32T shift dot screen;
scheme 2: carrying out primary screen printing by adopting a 36T gear dot screen;
scheme 3: adopting primary low-pressure spraying;
scheme 4: two times of low-pressure spraying are adopted.
The process parameters are as follows in tables 1 and 2:
TABLE 1
TABLE 2
Table 1 shows the process and ink parameters, and table 2 shows the parameters of the green oil after the treatment of table 1;
it can be seen that line redness can occur whether one or two low pressure sprays are used, and the reason for line redness is due to the ink thickness being too small.
If the stop point net is adopted, the problems of ink hole blocking, no oil dropping of the circuit and the like exist.
Comparative example 5
Compared with the example 1, the comparative example mainly has the difference of the effect of one-time low-pressure spraying and two-time low-pressure spraying, and the specific parameters can be seen in the following table 3:
TABLE 3
In table 3, the first condition is that the second spraying represents the scheme of the low-pressure spraying twice in example 1;
referring to fig. 2, fig. 2 shows a process of spraying twice +36T once, line angle 18.17, and line surface 21.01.
Referring to FIG. 3, FIG. 3 is a 36T baffle net process only, which has the problem of no oil in the line;
referring to fig. 4, fig. 4 is a process of only low pressure spraying, which has a problem that the ink of the wire is thin and does not drop.
It can be seen that the number of times of low-pressure spraying is a very significant factor in the influence of line angle and pad height difference.
In the actual production process, the partial exposure operation is required for the copper surface with the large copper surface and the line surface larger than 6mil, which is a very important factor for controlling the height difference of the bonding pad and the thickness of the ink on the large copper surface. And (3) adopting the LMS film to carry out through window design on all the large copper sheets, wherein the single-side oil covering 3mil and the whole oil covering less than 6mil are required to be reserved when the circuit is more than 6 mil.
By combining the comprehensive means, the problem that the copper surface circuit pattern cannot be completely covered by the screen printing ink once when the copper thickness is too thick is solved, and the solder mask can be completed by a small batch of test boards when the copper thickness is 4 ounces to 5 ounces, and the flow of spraying twice and the screen printing; and the quality is qualified to make a corresponding reliability test.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (7)
1. A processing technology of solder resist ink with a thick copper surface is characterized by comprising the following steps:
step 1: the first low-pressure spraying, namely spraying a layer of ink on the surface of a base material through a low-pressure spraying process, pre-baking, exposing by adopting an LMS film, and then carrying out developing, baking and plate grinding operations; in the exposure process, the part within 2-4mil of the edge of the copper surface is not exposed;
step 2: spraying a layer of ink on the surface of the base material obtained in the step (1) through a low-pressure spraying process, pre-baking, exposing, and then carrying out developing, baking and plate grinding operations; in the exposure process, the windowing part of the copper surface is not exposed according to the size designed by a customer;
and step 3: and (4) screen printing, namely, carrying out screen printing operation by adopting a 36T screen, and then carrying out prebaking, exposure and development.
2. The thick copper surface solder mask ink processing technology as claimed in claim 1, wherein the copper surface is a copper surface for mounting electronic components and circuits;
if the width of the copper surface is less than 6 mils, then all of the copper surface is not exposed in step 1.
3. The thick copper surface solder mask ink processing technology as claimed in claim 1, wherein in the steps 1 and 2, the technological parameters of the low-pressure spraying are as follows: the viscosity of the ink is 60-70S, and the ejection pressure of the ink is 0.15-0.4 MPa; the single-gun stepping speed is 25 +/-5 mm or the double-gun stepping speed is 50 +/-5 mm; the thickness of the ink is 70-90 μm.
4. The thick copper surface solder mask ink processing technology as claimed in claim 3, wherein in the step 1, the baking technological parameters are as follows: baking at 60 + -5 deg.C for 60 + -5 min, 70 + -5 deg.C for 30 + -5 min, 90 + -5 deg.C for 30 + -5 min, 110 + -5 deg.C for 30 + -5 min, and 150 + -5 deg.C for at least 10 min;
the baking process parameters in the step 2 are as follows: 60 plus or minus 5min, baking at 70 plus or minus 5 ℃ for 30 plus or minus 5min, baking at 90 plus or minus 5 ℃ for 30 plus or minus 5min, baking at 110 plus or minus 5 ℃ for 30 plus or minus 5min, and baking at 150 plus or minus 5 ℃ for at least 20 min.
5. The thick copper surface solder mask ink processing process of claim 1, wherein in step 3, the viscosity of the silk-screen ink is 50 ± 10 dps.
6. The process for processing the thick copper surface solder resist ink as claimed in claim 1, wherein in steps 1-3, the developing speed is 5 ± 0.5 m/min.
7. The process for thick copper surface solder mask ink processing of claim 1, wherein the height of said copper surface is more than 3 ounces.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111409017.9A CN114364150B (en) | 2021-11-19 | 2021-11-19 | Processing technology of thick copper surface solder resist ink |
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| CN202111409017.9A CN114364150B (en) | 2021-11-19 | 2021-11-19 | Processing technology of thick copper surface solder resist ink |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115003031A (en) * | 2022-06-15 | 2022-09-02 | 富乐德科技发展（大连）有限公司 | Processing method for improving poor hole plugging of solder-resisting thick copper plate |
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| CN115003031B (en) * | 2022-06-15 | 2024-06-14 | 富乐德科技发展（大连）有限公司 | Processing method for improving poor hole plugging of solder mask thick copper plate |
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| CN114364150B (en) | 2024-06-25 |
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