KR101751373B1 - Method of manufacturing a printed circuit board for switch of vehicle - Google Patents

Abstract

The present invention minimizes the gap between the contact surface of the switch function and the solder resist surface and the step distance, and adopts a special method of maximizing the plating adhesion on the nickel plating and gold plating portions of the switch contact surface, So as to improve reliability.
In order to achieve the above object, a method of manufacturing a printed circuit board for a switch of an automobile according to the present invention comprises a first step (S100) of preparing an epoxy layer (100) having copper foils (110) on both surfaces thereof, A second step S200 of forming a through hole A and a component insertion hole B through the lower surface of the through hole A and the inner surface of the through hole A and the inner surface of the component insertion hole B, A third step S300 of forming an electroless copper plating layer 200 on the copper foil 110 and forming an electrolytic copper plating layer 300 on the electroless copper plating layer 200, A fourth step (S400) of forming a predetermined circuit pattern by performing a circuit forming process on the electroless copper plating layer (200) and the copper electroplating layer (300) 400, the through holes A and the holes of the component holes B, and a predetermined region other than the circuit are printed with the solder resist A fifth step (S500) of printing the solder resist ink (400) with the ink (400) so that the solder resist ink (400) is spaced apart from the hole of the component hole (B) A nickel plating layer 500 and a gold plating layer 600 are sequentially formed on the inner wall of the component hole B and the hole of the copper foil 110 and the electroless copper plating layer 200, And a sixth step S600 in which the electroplated copper layer 300 and the nickel plated layer 500 and the gold plated layer 600 are formed to have heights and steps of the solder resist ink 400.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed circuit board manufacturing method,

The present invention relates to a method of manufacturing a printed circuit board for a switch of an automobile. More particularly, the present invention relates to a method of manufacturing a printed circuit board for a switch, The present invention relates to a method of manufacturing a printed circuit board for a switch.

Generally, without any operation of turning on the lamp of each function, the sudden change of the weather condition and the lighting function of the entrance and exit of the tunnel are turned on so that the trailing vehicle quickly judges the sudden change of the visual field, A window switch, and an automatic light switch for detecting each of the lamps by a sensor and lighting each lamp are being developed.

However, in the conventional printed circuit board for a switch of the present invention, since the upper portion of the contact surface having a switch function on the PCB is separated from the contact surface and the solder resist surface during the contact with the turn contact, There is a problem in that a durability of the turn contact or a malfunction such as lamp lighting due to wear or the like occurs due to a problem that chattering occurs.

Accordingly, the present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to minimize the gap distance and the step distance between the contact surface of the switch function and the solder resist surface, And a special method of maximizing the plating adhesion to each part is adopted to improve durability and reliability.

In order to achieve the above object, a method of manufacturing a printed circuit board for a switch of an automobile according to the present invention comprises a first step (S100) of preparing an epoxy layer (100) having copper foils (110) on both surfaces thereof, A second step S200 of forming a through hole A and a component insertion hole B through the lower surface of the through hole A and the inner surface of the through hole A and the inner surface of the component insertion hole B, A third step S300 of forming an electroless copper plating layer 200 on the copper foil 110 and forming an electrolytic copper plating layer 300 on the electroless copper plating layer 200, A fourth step (S400) of forming a predetermined circuit pattern by performing a circuit forming process on the electroless copper plating layer (200) and the copper electroplating layer (300) 400, the through holes A and the holes of the component holes B, and a predetermined region other than the circuit are printed with the solder resist A fifth step (S500) of printing the solder resist ink (400) with the ink (400) so that the solder resist ink (400) is spaced apart from the hole of the component hole (B) A nickel plating layer 500 and a gold plating layer 600 are sequentially formed on the inner wall of the component hole B and the hole of the copper foil 110 and the electroless copper plating layer 200, And a sixth step S600 in which the electroplated copper layer 300 and the nickel plated layer 500 and the gold plated layer 600 are formed to have heights and steps of the solder resist ink 400.

In the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, the epoxy layer 100 is formed to a thickness of 1.6 m / m, and Cu is stacked on the upper and lower surfaces of the epoxy layer 100 to a thickness of 1 oz And has a thermal expansion coefficient of 58 ppm / ° C, a glass transition temperature of TG of 140 ° C, and a pyrolysis temperature of 320 ° C.

The method for manufacturing a printed circuit board for a switch of an automobile according to the present invention is characterized in that when forming the through hole (A) and the component insertion hole (B), CNC (Computerized Numerical Control) M / C drilling Process.

In addition, a method for manufacturing a printed circuit board for a switch of an automobile according to the present invention is characterized in that a burr generated during the drilling process is removed between the second step (S200) and the third step (S300) A deburring process is performed to remove scratches generated during the operation. In the deburring process, a brush rotation is performed in a conveyor moving at a speed of 1.7 m / min to 2.0 m / min. (Grit = # 400, upper / lower × 2) having an oscillation cycle of 350 cpm to 400 cpm and a rinse at a high pressure washing pressure of 45 kgf / cm 2 (± 1.0) at 1,700 rpm to 2,000 rpm Followed by drying at 90 캜.

The method for manufacturing a printed circuit board for a switch of an automobile according to the present invention is characterized in that the electroless copper plating layer 200 is composed of 85 g / l of copper sulfate, 156 g / l of ethylenediamine acetic acid (EDTA) A plating solution containing 38 mL / L of formaldehyde (HCHO), 43 g / L of sodium hydroxide (NaOH), 0.12 g / L of polyethylene glycol (PEG) and 84 mL / L of bipyridyl At a temperature of 41 DEG C (+/- 2 DEG C) for 30 minutes to form a thickness of 1.5 mu m to 1.8 mu m.

In the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, the electrodeposited copper plating layer 300 may include 190 g / l of semi-tower sulfuric acid (Surfuric Acid), 82 g / l of copper sulfate, A plating solution containing an additive of 1 ml / l, 55 ml / l of a leveling agent and 55 ml / l of a brightener (Brightner) And electroplated at a current density of 2.6 A / dm < 2 > to a thickness of 25 mu m to 32 mu m.

In the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, the circuit forming step may include a step of forming the copper foil 110, the electroless copper plating layer 120 and the electrolytic copper plating layer 120 formed by the third step (S300) A photoresist PR is laminated on the photoconductive layer 130 (actually, the upper surface of the electrolytic copper plating layer 130), and a roller temperature of 100 占 폚 to 110 占 폚 (占 5 占 폚), a roller pressure of 0.40 to 0.60 MPa, A lamination step (A1) of laminating a dry film having a thickness of 40 占 퐉 in which a circuit pattern of a predetermined shape is formed on the photoresist by a roller having a roller speed of from 0.80 m / min to a predetermined shape (B1) for irradiating light to be irradiated with light of 70 to 110 mJ / cm < 2 > by an exposure device of 8 kW to form a circuit pattern of a predetermined shape on the dry film having a circuit pattern of a predetermined shape, A sodium carbonate developer of 0.60% to 1.00% (VOL) at a temperature of ~ 30 ° C (± 2 ° C) A developing step C1 of spraying the photoresist at a spraying pressure of 0.11 MPa to 0.15 MPa to remove photoresist in a region excluding a circuit pattern of a predetermined shape and a developing step C1 of 45 ° C. to 55 ° C. (± 1 ° C.) A copper metal etchant having a specific gravity (占 폚) of 占 0.03 is sprayed at a pressure of 1.55 kgf / cm2 (占 .1) An etching step D1 for removing the copper foil 110, the electroless copper plating layer 120 and the electrolytic copper plating layer 130 (actually, the upper surface of the electrolytic copper plating layer 130) formed by the third step S300 ) And a 2.0% to 4.5% (VOL) sodium hydroxide peeling solution at a temperature of 47 ° C to 60 ° C (± 2 ° C) are sprayed at a spray pressure of 0.15 MPa to 0.17 MPa to remain on a circuit pattern of a predetermined shape And a stripping step E1 for removing the photoresist are performed to form a predetermined circuit pattern.

In the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, after the circuit forming step, a gap between a circuit and a circuit, a first JET scrubbing and a first ultrasonic cleaning ) a respective further performs a step, wherein the polishing is 1 JET 1.5m / min ~ 2.0m / on a conveyor moving at a speed of min 1.3㎏f / ㎠ ~ 2.0㎏f / ㎠ of aluminum oxide with a spray pressure (Al ₂ O ₃ carried out by spraying (# 440)), the first ultrasonic cleaning step is a 1,200Watt × 2zone in 4㎑ × 4Zone at 70 ℃ after hot (hot) rinsing the washed 4zone, and at 90 ℃ ~ 95 ℃ Dry.

The method for manufacturing a printed circuit board for a switch of an automobile according to the present invention may further include performing a microetching process after the first JET polishing and the first ultrasonic cleaning process, (H ₂ SO ₄ ), 60 mL / L of 35% hydrogen peroxide (H ₂ O ₂ ) and 35 mL / L of corrosion solution Etching with a specific gravity of 1.030 to 1.050, a pH of 3.00 or less, and an etching rate of 1.8 to 2.3 占 퐉 using a microetching solution containing an etchant solution and a DI water.

In the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, the printing process for printing with the solder resist ink 400 is performed by stirring a subject of 190 ± 10 poise and a curing agent of 90 ± 10 poise for 40 minutes or more The printing process is carried out using an 80 mesh printing silk screen with a solder resist ink 400 having an ink viscosity of ± 10 poise, a specific gravity of 1.30 to 1.40, and a mixing ratio of 3: 1, , Pre-curing at 78 占 폚 for 16 minutes to 21 minutes followed by secondary curing at 78 占 폚 for 21 minutes to 26 minutes and then pre-curing at 150 占 폚 for 55 minutes Followed by post-curing for ~ 78 minutes, followed by exposure to light at a dose of 320-350 mJ / cm 2 and a 1.0 wt% sodium carbonate developer at a temperature of 30 ° C (± 1 ° C) Is sprayed at a spray pressure of 2.5 to 3.0 kgf / cm < 2 > for 90 seconds to 110 seconds, It is printed.

In the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, a second JET scrubbing and a second ultrasonic cleaning process are further performed on the holland and the circuit after the printing process, wherein the polishing JET 2 is 1.3m / min ~ 2.0m / on a conveyor moving at a speed of min, 95% of 35㎖ / ℓ of sulfuric acid (H ₂ SO ₄₎ and deionized water (DI water) arithmetic three (Acid containing the second ultrasonic cleaning is washing with water in rinse 1400) and carried out with water after a four-stage spray rinse, the pressure of aluminum oxide of 1.5㎏f / ㎠ ~ 2.0㎏f / ㎠ ( Al 2 O 3 (# 440)), and Watt × 4 ㎑ × 4zone, rinse 4 times with water and clean with ultra-pure water (4-rinse) and dry at 90 ℃ ~ 95 ℃.

The nickel plating layer 500 and the gold plating layer 600 may be formed by a combination of 22 g / l of nickel sulfate and 22 g / A nickel plating solution containing sodium hypophosphite, 11 g / l of maleic acid, 21 g / l of Disodium Succinate and 1 g / l of sodium thiosulfate, Electroless plating was performed at a temperature of 50 캜 for 5 minutes to 20 minutes at a pH of 5.0 to form a nickel plating layer 500 having a thickness of 5 탆 to 6 탆 and 2 g / l potassium potassium cyanide, The solution was mixed with 11 g / l Potassium Phosphate, 16 g / l EDTA (Ethylenediaminetetraacetic Acid), 1 g / l Formic Acid, 10 g / l Carboxylic Acid-Amide ) Was subjected to electroless plating at a temperature of 52 占 폚 and a pH of 7.0 for 25 minutes to form 0.06 占 퐉 to 0.08 The gold plating layer 600 is formed.

In the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, a palladium plating layer is further formed between the nickel plating layer (500) and the gold plating layer (600), and the palladium plating layer contains 5 g / (Palladium Chloride), 26 g / l of ethylenediamine, 11 g / l of ethylenediaminetetraacetic acid (EDTA), 2 g / l of glycine and 10 g / l of fumaric acid Palladium plating solution is electroless plated at a temperature of 48 캜 and a pH of 8.0 for 15 minutes to 20 minutes to form a palladium plating layer with a thickness of 0.05 탆.

Further, in the method for manufacturing a printed circuit board for a switch of a vehicle according to the present invention, the spacing distance is 5 占 퐉 to 15 占 퐉, and the step distance is 5 占 퐉 to 20 占 퐉.

According to the present invention, when a sudden change of weather condition or a lighting function of a tunnel entrance / exit is turned on without a lamp lighting operation of each function of a driver, a tailgate is quickly judged to detect each lamp lighting function by a sensor Thereby making it possible to provide a method of manufacturing a printed circuit board for a switch of an automobile.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing a manufacturing sequence flow of a method for manufacturing a printed circuit board for a switch of a vehicle according to the present invention; Fig.
2 is a sectional view showing a first step of a method for manufacturing a printed circuit board for a switch of an automobile according to the present invention;
3 is a sectional view showing a second step of a method for manufacturing a printed circuit board for a switch of an automobile according to the present invention.
4 is a cross-sectional view showing a third step of a method of manufacturing a printed circuit board for a switch of an automobile according to the present invention.
5 is a sectional view showing a fourth step of a method of manufacturing a printed circuit board for a switch of an automobile according to the present invention.
6 is a cross-sectional view showing a fifth step of a method for manufacturing a printed circuit board for a switch of an automobile according to the present invention.
7 is a cross-sectional view showing a sixth step of a method of manufacturing a printed circuit board for a switch of an automobile according to the present invention.
8 is a cross-sectional view showing a printed shape of a solder resist ink on a printed circuit board for a switch of an automobile according to the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Also, the terms " part, "" module," and the like, which are described in the specification, mean a unit for processing at least one function or operation, and may be implemented by hardware or software or a combination of hardware and software.

In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a flow chart showing a manufacturing procedure flow of a method for manufacturing a printed circuit board for a switch of an automobile according to the present invention.

Referring to FIG. 1, a method of manufacturing a printed circuit board for a switch of an automobile according to the present invention includes a first step S100 of preparing an epoxy layer 100 having copper foils 110 on both sides thereof, A second step S200 of forming a through hole A and a component insertion hole B penetrating through the lower surface of the through hole A and the inner surface of the component insertion hole B, A third step S300 of forming an electroless copper plating layer 200 on the electroless copper plating layer 200 and forming an electroless copper plating layer 300 on the electroless copper plating layer 200; (S400) of forming a predetermined circuit pattern by performing a circuit forming process on the copper electroplating layer (300) and the copper electroplating layer (300), and printing a solder resist ink (400) on the inner surface of the through hole A solder resist ink 400 is printed on the lands of the component holes A and the component holes B and a predetermined area other than the circuit by the solder resist ink 400, A nickel plating layer 500 and a gold plating layer 600 are formed on the circuit of the circuit board 500 in such a manner that the nickel plating layer 500 and the gold plating layer 600 are formed on the inner surface of the hole of the component hole B and the component hole B, The height of the copper foil 110, the electroless copper plating layer 200, the copper electroplating layer 300, the nickel plating layer 500 and the gold plating layer 600 is set to be higher than the height of the solder resist ink 400 And a sixth step S600 of forming a stepped portion.

2 to 7, a method for manufacturing a printed circuit board for a switch of an automobile according to the present invention will be described below.

2 is a cross-sectional view showing a first step of a method of manufacturing a printed circuit board for a switch of an automobile according to the present invention.

Referring to FIG. 2, in a first step S100 of a method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, an epoxy layer 100 having copper foils 110 on both sides is prepared.

Here, the epoxy layer 100 is formed to have a thickness of 1.6 m / m, and each of the Cu layers is made of FR-4 material having a thickness of 1 oz (35 탆) on the upper and lower surfaces thereof. The thermal expansion coefficient is CTE of 58 ppm / , The glass transition temperature is TG 140 ° C, and the thermal decomposition temperature is TD 320 ° C.

After that, according to the specification, cut according to the specifications.

3 is a cross-sectional view showing a second step of the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention.

Referring to FIG. 3, in a second step S200 of a method of manufacturing a printed circuit board for a switch of an automobile according to the present invention, a through hole A and a component insertion hole B, Respectively.

When forming the through hole (A) and the component insertion hole (B), the CNC Drill M / C that can ensure the accuracy is selected in order to minimize the tolerance range of the drilling process.

Here, the CNC (Computerized Numerical Control) M / C drilling process with the RPM of 200,000 is performed, and the use of the drill bit in the drilling process requires only the new bit and the primary polishing bit.

Thereafter, a deburring step is performed between the second step (S200) and the third step (S300) to remove burrs generated during the drilling process and to remove scratches generated during the operation The deburring process is carried out in a conveyor moving at a speed of 1.7 m / min to 2.0 m / min, a brush having a brush rotation of 1,700 rpm to 2,000 rpm and an oscillation cycle of 350 cpm to 400 cpm (Bristle type; Grit = # 400, upper / lower × 2) and rinsed with water at a pressure of 45 kgf / cm 2 (± 1.0) at a high pressure washing pressure and dried at 90 ° C.

4 is a sectional view showing a third step of the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention.

4, the inner surface of the through hole A, the inner surface of the component insertion hole B, and the inner surface of the component insertion hole B are electrically connected to each other through the copper foil 110. In the third step S300 of the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, An electroless copper plating layer 200 is formed on the electroless copper plating layer 200, and an electrolytic copper plating layer 300 is formed on the electroless copper plating layer 200.

The reason for performing this electroless copper plating layer 200 is to convert the inside of the hole into a conductor hole by using a chemical agent to convert the hole inside the hole to the hole of the conductor from the hole of the non-conductor by hole of the non-conductor after the drilling process .

That is, the electroless copper plating layer 200 is formed of copper sulfate, 156 g / l of ethylenediamine acetic acid (EDTA), 38 ml / l of formaldehyde (HCHO) and 43 g / l of (+/- 2 DEG C) with a plating solution containing sodium hydroxide (NaOH), 0.12 g / l of polyethylene glycol (PEG) and 84 ml / l of bipyridyl for 30 minutes And is formed to have a thickness of 1.5 탆 to 1.8 탆.

Here, by maintaining the plating thickness of the electroless copper plating layer 200 at 1.5 탆 to 1.8 탆, the thickness of the electroless copper plating in the hole is made uniform, thereby suppressing the generation of micro voids, thereby improving the adhesion of the electroless copper plating Reliability can be improved.

Further, after the electroless copper plating layer 200 is formed, an electrolytic copper plating layer 300 is formed on the inside and the outside of the hole. In the case of electrolytic copper plating, the plating thickness inside the hole and the plating thickness of the outer layer satisfy the reliability and durability The electrolytic copper plating layer 300 was formed by mixing 190 g / L of semi-tower sulfuric acid, 82 g / L of copper sulfate, 20 mL / L of additive and 55 mL / L And a plating solution containing 55 ml / l of a brightener (Brightner) was electroplated at a current density of 2.4 A / dm 2 to 2.6 A / dm 2 at a temperature of 25 캜 for 70 minutes, To 32 탆.

5 is a cross-sectional view showing a fourth step of the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention.

5, in a fourth step (S400) of a method of manufacturing a printed circuit board for a switch of an automobile according to the present invention, a circuit is formed on a copper foil 110, an electroless copper plating layer 200, and an electrolytic copper plating layer 300 A predetermined circuit pattern is formed.

In the present invention, various switch functions such as a fog lamp, a wiper switch, a window switch, and an auto light lamp of an automobile correspond to the accuracy of the contact pads and the width of the circuit Spacing, and the size of the hole lands must be accurately maintained.

This is because there is a correlation between the accuracy of the contact surface and the original functionality when the contact pad of the various switch functions is in close contact with the turn contact (turn contact). Further, the dry film allows the work to be performed to a thickness of 40 mu m.

That is, in the circuit forming step, the copper foil 110, the electroless copper plating layer 120, and the electrolytic copper plating layer 130 (actually, the upper surface of the electrolytic copper plating layer 130) A photoresist PR was laminated on the photoresist film by a roller having a roller temperature of 100 占 폚 to 110 占 폚 (占 5 占 폚), a roller pressure of 0.40 to 0.60 MPa, and a roller speed of 0.70 to 0.80 m / A lamination step (A1) of laminating a dry film having a thickness of 40 占 퐉 in which a circuit pattern of a predetermined shape is formed on the photoresist and a circuit pattern of a predetermined shape are formed on the photoresist, by 70 to 110 mJ / (BOL) of 0.60% to 1.00% (VOL) at a temperature of 25 占 폚 to 30 占 폚 (占 2 占 폚); a step (B1) of exposing the exposed light to a dry film on which a circuit pattern of a predetermined shape is formed; Of the sodium carbonate developer was sprayed at a spray pressure of 0.11 MPa to 0.15 MPa to form a A developing step C1 of removing the photoresist and a step of forming a copper plating layer having a temperature of 45 DEG C to 55 DEG C (1 DEG C) and a copper weight of 150 g / l to 215 g / l of a specific gravity (20 DEG C) the copper metal etchant is sprayed at a pressure of 1.55 kgf / cm 2 (± 1.0) to form the copper foil 110, the electroless copper plating layer 120 formed by the third step S300 of the area excluding the circuit pattern of the predetermined shape, And an electrolytic copper plating layer 130 (actually, an upper surface of the electrodeposited copper layer 130) are removed; and a step of etching at a temperature of 47 to 60 占 폚 (占 2 占 폚) of 2.0 to 4.5% (VOL) sodium hydroxide stripping liquid is sprayed at a spray pressure of 0.15 MPa to 0.17 MPa to remove the photoresist remaining on the circuit pattern of a predetermined shape, thereby performing a stripping process (E1) .

Next, a reliability check (AOI) test is performed. In the reliability test, the printed circuit board according to the present invention has a correlation with lifespan due to its characteristics, and the defect caused by the open and short of the circuit of the printed circuit board for the automobile is directly related to the fatal result The circuit is open and the short-circuit defect is treated as 100% defective.

Thereafter, after the circuit forming step, a gap between the circuit and the circuit, and a first JET scraping and a first ultrasonic cleaning process are further performed on the holland portion.

In other words, Al ₂ O ₃ is used for the circuit-to-circuit spacing and the hole land area after circuit formation to remove residues of copper (Cu), residues of the dry film, And the surface of the hole land are artificially formed so as to improve the adhesion of the ink during the PSR printing process.

The reason why the first ultrasonic cleaning process is performed is to prevent noise generation due to generation of minute current due to components of residues such as copper (Cu), etc. between circuit, circuit, and hole land. Since the Al ₂ O ₃ used during the JET polishing process may remain between the circuit and the circuit and in the hole lands, the first ultrasonic cleaning is to remove Al ₂ O ₃ residues.

Here, the first JET polishing was performed by using aluminum oxide (Al ₂ O ₃ (# 440)) at a spray pressure of 1.3 kgf / cm 2 to 2.0 kgf / cm 2 on a conveyor moving at a speed of 1.5 m / min to 2.0 m / And the first ultrasonic cleaning step is performed by hot rinsing 2zone at 1,200 Watt x 4 kHz x 4 Zone, followed by 4 Zone, and drying at 90 ° C to 95 ° C.

Next, a micro-etching process is further performed after the first JET polishing and the first ultrasonic cleaning process.

That is, the reasons for carrying out the micro-etching process include a circuit forming process and an etching process, and a process for removing residues of copper (Cu), etc. between the circuit and the circuit after the first JET polishing and the first ultrasonic cleaning process, And micro-etching is performed on the surface of the upper part of the circuit and the upper part of the circuit board, especially the contact pad area to form a fine roughness, thereby removing minute residues such as Cu and the like, And a micro-etching process is performed to maximize the adhesion of the ink during the printing process.

In this microetching process, 83 ml / l of 95% sulfuric acid (H ₂ SO ₄ ) and 60 ml / l of 35% hydrogen peroxide (H ₂ ) in a conveyor moving at a speed of 1.5 m / min to 2.5 m / O ₂ ), a 35 mL / L etchant solution and a DI water, a pH of 3.00 or less, a pH of 1.8 to 2.3 μm Etching is carried out under the condition of etching rate.

6 is a cross-sectional view showing a fifth step of a method for manufacturing a printed circuit board for a switch of an automobile according to the present invention.

Referring to FIG. 6, in a fifth step S500 of the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, the inner surface of the through hole A is printed with the solder resist ink 400, And the solder resist ink 400 are printed on the hole of the component hole B and the predetermined area of the component hole B so as to be spaced apart from the hole and the circuit of the component hole B by a predetermined distance Print.

In the method of manufacturing a printed circuit board for a switch of an automobile according to the present invention, the printing process of a printed circuit board for a switch such as an automobile fog lamp, a wiper switch, a window switch, and an automatic light lamp is very important. By minimizing the separation distance (D) and the step distance (C) between the contact surface of the switch function on the printed circuit board and the solder resist surface, it is possible to reduce the problem of chattering due to bouncing of the contact surface . (D) and the stepped distance (C) between the contact surface of the switch function and the solder resist surface are different from each other due to the deterioration of durability of the turn contact or the occurrence of wear or the like, Should be minimized.

To maintain the separation distance (D) and the step distance (C) between the contact surface and the solder resist ink, the following working method is performed.

That is, the printing process for printing with the solder resist ink 400 is performed by stirring a subject of 190 ± 10 poise and a curing agent of 90 ± 10 poise for 40 minutes or more to have an ink viscosity of 150 ± 10 poise and a specific gravity of 1.30 to 1.40, The printing process was carried out using an 80 mesh printed silk screen with a solder resist ink 400 having a mixing ratio of 3: 1 by weight of a curing agent. The printing was performed at 78 ° C for 16 minutes to 21 minutes, followed by secondary curing at 78 ° C for 21 minutes to 26 minutes followed by post curing at 150 ° C for 55 minutes to 78 minutes to dry , Followed by exposure to light at a dose of 320 to 350 mJ / cm 2 and a 1.0 wt% sodium carbonate developer at a temperature of 30 ° C (± 1 ° C) with a spray pressure of 2.5 to 3.0 kgf / cm 2 for 90 seconds to 110 seconds To be printed.

Next, a marking printing process is performed to print special marks such as characters or symbols, manufacturing cycle numbers, etc. on the printed circuit board.

Then, the second JET scrubbing and the second ultrasonic cleaning process are further performed on the holland and the circuit, respectively.

There is an oxidized part on the surface of the hole land and circuit while performing the printing process and the marking process so as to remove the obstacle of the adhesion force of nickel and gold plating and the remnants of the ink stream during the subsequent nickel and gold plating process, In order to increase the adhesion of nickel plating and gold plating, the second ultrasonic cleaning step is performed in parallel with the Acid Rinse in order to remove the residues and the like with Al ₂ O ₃ at the portion where the solder resist is not applied during the process do.

This second JET polishing was carried out on a conveyor moving at a speed of 1.3 m / min to 2.0 m / min, using 35 ml / l of acidic water containing 95% sulfuric acid (H ₂ SO ₄ ) and DI water rinse in washing) and carried out by spraying with water and then rinsed four-stage, the pressure of aluminum oxide of 1.5㎏f / ㎠ ~ 2.0㎏f / ㎠ ( Al 2 O 3 (# 440)) , and the second ultrasonic cleaning is 1,400Watt After rinsing four times with x4 kHz x 4 zones, rinse with ultra pure water (4 rinses) and dry at 90 ℃ ~ 95 ℃.

7 is a sectional view showing a sixth step of the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention.

7, in a sixth step (S600) of the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, the inner wall of the hole of the component hole B and the component hole B, The copper foil 110, the electroless copper plating layer 200, the copper electroplating layer 300, the nickel plating layer 500, and the gold plating layer 600 are successively formed on the copper plating layer 500 and the gold plating layer 600, The height of the solder resist ink 400 is set so as to have a height and a step difference.

Because of the characteristics of the present invention, the portion of the contact surface of the switch function that continuously and repeatedly contacts or non-contacts with the turn contact is a part of durability deterioration due to abrasion of the contact surface and the like, Reliability and functionality must be maintained. Therefore, the purity of raw materials such as nickel plating and gold plating is very important, and the original functionality should be maintained by using raw materials of high purity in which raw materials do not contain impurities. Further, the following method is adopted to maximize adhesion between the nickel plating layer 500 and the gold-plated layer 600 to minimize the wear rate even by repeated contact on the contact surface, thereby improving durability and reliability.

Namely, the nickel plating layer 500 and the gold plating layer 600 are formed by mixing 22 g / l of nickel sulfate, 22 g / l of sodium hypophosphite, 11 g / l of maleic acid, , A nickel plating solution containing 21 g / l of Disodium Succinate and 1 g / l of Sodium Thiosulfate was electrolessly deposited at a temperature of 50 ° C at a pH of 5.0 for 15 minutes to 20 minutes A nickel plating layer 500 was formed to a thickness of 5 to 6 占 퐉, and 2 g / l of Potassium Gold Cyanide, 11 g / l of Potassium Phosphate, 16 g / l of EDTA A gold plating solution containing Ethylenediaminetetraacetic Acid, 1 g / l Formic Acid and 10 g / l Carboxylic Acid-Amide at a temperature of 52 ° C and a pH of 7.0 Electroless plating is performed for 25 minutes to form a gold plating layer 600 with a thickness of 0.06 mu m to 0.08 mu m.

A palladium plating layer may be further formed between the nickel plating layer 500 and the gold plating layer 600. The palladium plating layer may contain 5 g / l of palladium chloride and 26 g / l of ethylenediamine A palladium plating solution containing 11 g / l Ethylenediaminetetraacetic acid (EDTA), 2 g / l glycine and 10 g / l Fumaric Acid at a temperature of 48 ° C and a pH of 8.0 For 15 minutes to 20 minutes to form a palladium plating layer with a thickness of 0.05 탆.

Next, the outer shape is to be machined according to the specifications. In the mechanism hole where the injection molding of the fixing lever is inserted in the center of the finished product, there should be no clearance when the lever is shifted left, right or up and down. +0.00, -0.10 and inner diameter of +0.10 and -0.00.

Next, an auto bare board test is carried out for the purpose of verifying the electronic reliability of a printed circuit board for a switch of an automobile according to the present invention, so that the circuit and the circuit, the open space between the hole and the hole, In particular, since the continuous contact is made on the upper surface of the contact portion of the printed circuit board according to the present invention, the type of the head of the working pin in the auto bare board test is a round type, In order to prevent damage to the contact surface due to pin marks on the surface, the working conditions are as follows.

The test voltage is 250 volts, the continuity resistance is 50 ohms, and the insulation resistance is 20 mega ohms.

Next, when the fixing lever injection member is inserted into the center of the finished product after the completion of assembly of the component according to the present invention, when the flexure is generated by being mounted on the case, a play may occur when the injection lever or the case is mounted on the case. (Baking), and the working conditions are as follows.

Using a box oven, the baking temperature is 130 ° C, the time is 90 minutes, the weight of the calibrated material is 30 kgs on the stack, and 100 kg is the material calibration / m 2 .

Thereafter, the inspection, dimensional measurement, inspection, packaging, and shipment are performed.

At this time, visual inspection and measurement based on each specification will be packed and shipped after visual inspection for defects.

Fig. 8 is a cross-sectional view showing a shape in which a solder resist ink is printed on a printed circuit board for a switch of an automobile according to the present invention.

8, in the printed circuit board for a switch of an automobile according to the present invention, the inner surface of the through hole A is printed with the solder resist ink 400, and the through hole A and the component hole B And a predetermined area other than the circuit are printed with the solder resist ink 400 while the solder resist ink 400 is printed so as to be spaced apart from the hole of the component hole B and the circuit at a predetermined interval.

A nickel plating layer 500 and a gold plating layer 600 are sequentially formed on the inner wall of the component hole B and the inner wall of the component hole B and the copper foil 110 and the electroless copper plating layer The height of the solder resist ink 400 and the height of the electroplated copper layer 300 and the thickness of the nickel plated layer 500 and the gold plated layer 600 are formed to have a height and a step difference.

In the method of manufacturing a printed circuit board for a switch of an automobile according to the present invention, the printing process of a printed circuit board for a switch such as an automobile fog lamp, a wiper switch, a window switch, and an automatic light lamp is very important. By minimizing the separation distance (D) and the step distance (C) between the contact surface of the switch function on the printed circuit board and the solder resist surface, it is possible to reduce the problem of chattering due to bouncing of the contact surface . (D) and the stepped distance (C) between the contact surface of the switch function and the solder resist surface are different from each other due to the deterioration of durability of the turn contact or the occurrence of wear or the like, Should be minimized.

Therefore, as a result of the experiment of the present applicant, the distance D between the contact surface of the switch function and the solder resist surface should be 5 탆 to 15 탆, and the step distance C should be 5 탆 to 20 탆.

The experimental results were obtained by performing the following conditions.

That is, the mixture was stirred at a temperature of 190 ± 10 poise and a curing agent of 90 ± 10 poise for 40 minutes or more to have an ink viscosity of 150 ± 10 poise, a specific gravity of 1.30 to 1.40, and a mixing ratio of 3: 1 After pre-curing for 16 to 21 minutes at 78 캜 and secondary pre-curing for 21 to 26 minutes at 78 캜 using an 80-mesh printed silk screen having a thickness of 5 mm, Drying at 150 ° C for 55 minutes to 78 minutes, exposure at a light intensity of 320 to 350 mJ / cm 2, and exposure at a temperature of 30 ° C (± 1 ° C) of 1.0 wt% The solder resist ink 400 was printed under the condition that the sodium carbonate developer was sprayed at a spray pressure of 2.5 to 3.0 kgf / cm 2 for 90 seconds to 110 seconds.

Accordingly, in the method for manufacturing a printed circuit board for a switch of an automobile according to the present invention, the upper portion of the contact surface of the switch function on the printed circuit board is separated from the contact surface and the solder resist surface, In order to solve the problem of chattering due to bouncing of the switch function and malfunction of each lamp due to decrease in durability of the turn contact or occurrence of wear and the like, (D) and stepped distance (C) of the switch contact surface and minimizes the GAP of the step distance (C), and adopts a special method of maximizing the plating adhesion to the nickel plating and gold plating part of the switch contact surface.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100: Epoxy layer
110: Copper foil
200: Electroless copper plating layer
300: Electrolytic copper plating layer
400: solder resist ink
500: Nickel plated layer
600: Gold plated layer

Claims (14)

A first step S100 of preparing an epoxy layer 100 having copper foils 110 on both sides,
A second step (S200) of forming a through hole (A) and a component insertion hole (B) through the upper and lower surfaces at a predetermined position,
An electroless copper plating layer 200 is formed on the inner surface of the through hole A and the inner surface of the component insertion hole B and on the copper foil 110 and the electrolytic copper plating layer 200 is formed on the electroless copper plating layer 200, A third step S300 of forming a plating layer 300,
A fourth step (S400) of forming a predetermined circuit pattern by performing a circuit forming process on the copper foil 110, the electroless copper plating layer 200, and the copper electroplating layer 300;
The inner surfaces of the through holes A are printed with the solder resist ink 400 and the holes of the through holes A and the component insertion holes B and the predetermined areas of the solder resist ink 400, (S500) of printing the solder resist ink (400) so as to be spaced apart from the hole of the component insertion hole (B) and the circuit by a predetermined distance,
A nickel plating layer 500 and a gold plating layer 600 are successively formed on the circuit board and the circuit board by inserting a hole of the component insertion hole B and an inner wall of the component insertion hole B, The heights of the electroless copper plating layer 200, the copper electroplating layer 300, the nickel plating layer 500 and the gold plating layer 600 are set to be equal to or higher than the height of the solder resist ink 400, Step S600.
(CNC) M / C drilling process with an RPM of 200,000 to form the through hole (A) and the component insertion hole (B), and the second step (S200) and the third In step S300, a deburring process is performed to remove burrs generated during the drilling process and to remove scratches generated during the operation,
The deburring step is carried out in a conveyor moving at a speed of 1.7 m / min to 2.0 m / min, and a Bristle type brush having a brush rotation of 1,700 rpm to 2,000 rpm and an oscillation cycle of 350 cpm to 400 cpm (Grit = # 400, upper / lower × 2), rinsing with water at a high pressure of 45 kgf / cm 2 (± 1.0) and drying at 90 ° C. ≪ / RTI > The method according to claim 1,
The epoxy layer 100 is formed to have a thickness of 1.6 m / m and has a thickness of 1 oz (35 m) laminated on the top and bottom thereof. The epoxy layer 100 is made of FR-4, has a CTE of 58 ppm / A method for manufacturing a printed circuit board for a switch in a car having a glass transition temperature of Tg 140 deg. C and a pyrolysis temperature TD of 320 deg. delete delete The method according to claim 1,
The electroless copper plating layer 200 was prepared by mixing 85 g / l of copper sulfate, 156 g / l of ethylenediamine acetic acid (EDTA), 38 ml / l of formaldehyde (HCHO), 43 g / (+/- 2 < 0 > C) for 30 minutes with a plating solution containing sodium (NaOH), 0.12 g / l of polyethylene glycol (PEG) and 84 ml / l of bipyridyl, Wherein the thickness of the resin layer is in the range of from about 1 占 퐉 to about 1.8 占 퐉. The method according to claim 1,
The electrolytic copper plating layer 300 was prepared by mixing 190 g / l of semi-tower sulfuric acid, 82 g / l of copper sulfate, 20 ml / l of additive, 55 ml / a plating solution containing 55 ml / l of a brightening agent (Brightner) was electroplated at a current density of 2.4 A / dm 2 to 2.6 A / dm 2 at a temperature of 25 캜 for 70 minutes, Of the thickness of the printed circuit board. The method according to claim 1,
The circuit forming step includes:
A photoresist PR is formed on the copper foil 110, the electroless copper plating layer 200 and the copper electroplating layer 300 (actually, the upper surface of the copper electroplating layer 130) formed by the third step S300 And a roller pattern having a roller temperature of 100 占 폚 to 110 占 폚 (占 5 占 폚), a roller pressure of 0.40 to 0.60 MPa, and a roller speed of 0.70 to 0.80 m / min, A lamination step (A1) of laminating a dry film having a thickness of 40 m formed thereon and a step of irradiating the photoresist with light of 70 to 110 mJ / cm < 2 > An exposure step (B1) of irradiating the light onto the dry film on which the circuit pattern of a predetermined shape is formed and a step of irradiating the dry film with a sodium carbonate developer solution of 0.60% to 1.00% (VOL) at 25 占 폚 to 30 占 폚 Spraying is carried out at a spray pressure of 0.11 MPa to 0.15 MPa to form a photoreceptor A developing step (C1) for removing the copper (Cu), a copper (Cu) metal having a temperature of 45 ° C to 55 ° C (± 1 ° C) and a specific gravity (20 ° C) of 1.20 ± 0.03 the copper metal etchant is sprayed at a pressure of 1.55 kgf / cm 2 (± 1.0) to remove the copper foil 110, the electroless copper plating layer 200 formed by the third step S300 of the area excluding the circuit pattern of the predetermined shape, And an electrolytic copper plating layer 300 (actually, the upper surface of the electrolytic copper plating layer 130) are removed, and a step of etching at a temperature of 47 ° C to 60 ° C (± 2 ° C) of 2.0% to 4.5% (VOL) sodium hydroxide stripping liquid is sprayed at a spray pressure of 0.15 MPa to 0.17 MPa to remove the photoresist remaining on the circuit pattern of a predetermined shape, thereby performing a stripping process (E1) Of the printed circuit board (10). 8. The method of claim 7,
After the circuit forming step, a first JET scrubbing and a first ultrasonic cleaning process are further performed on the space between the circuit and the circuit,
The first JET polishing was carried out by using aluminum oxide (Al ₂ O ₃ (# 440)) at a spray pressure of 1.3 kgf / cm 2 to 2.0 kgf / cm 2 on a conveyor moving at a speed of 1.5 m / min to 2.0 m / Spraying,
Wherein the first ultrasonic cleaning step is a step of rinsing 2zone at 1,200 Watt x 4 kHz x 4 Zone with hot rinsing at 70 ° C followed by drying with 4zone and drying at 90 ° C to 95 ° C. 9. The method of claim 8,
Further performing a micro-etching process after the first JET polishing and the first ultrasonic cleaning process,
The micro-etching process, 1.5m / min ~ 2.5m / on a conveyor moving at a speed of min, 95% sulfuric acid (H ₂ SO ₄₎ and 35% hydrogen peroxide in 60㎖ / ℓ of 83㎖ / ℓ (H ₂ O ₂ ), a 35 mL / L etchant solution and a DI water, a pH of 3.00 or less, a pH of 1.8 to 2.3 μm Wherein the etching is carried out under the condition that the etching is carried out at an etching rate. The method according to claim 1,
In the printing process for printing with the solder resist ink 400,
A mixture of a mixture of a mixture of a mixture having a specific gravity of 1.30 to 1.40 and a mixing ratio of 3: The printing process was carried out with an 80 mesh printing silk screen with resist ink 400, pre-curing for 16 to 21 minutes at 78 ° C followed by 21 to 26 minutes at 78 ° C After secondary pre-curing, post-curing is carried out at 150 ° C for 55 minutes to 78 minutes, followed by drying at a dose of 320 to 350 mJ / cm 2 And a printed circuit for a switch of an automobile which is printed under the condition that exposure and a 1.0 wt% sodium carbonate developer at a temperature of 30 DEG C (+/- 1 DEG C) are sprayed at a spray pressure of 2.5 to 3.0 kgf / ≪ / RTI > 11. The method of claim 10,
After the printing process, a second JET scrubbing and a second ultrasonic cleaning process are further performed on the holland and the circuit,
Wherein the polishing JET 2 is 1.3m / min ~ 2.0m / on a conveyor moving at a speed of min, 95% of 35㎖ / ℓ of sulfuric acid (H ₂ SO ₄₎ and deionized water (DI water) arithmetic three (Acid containing Rinse), rinsed four times with water, sprayed with aluminum oxide (Al ₂ O ₃ (# 440)) at a pressure of 1.5 kgf / cm 2 to 2.0 kgf /
Wherein the second ultrasonic cleaning is carried out by rinsing in 1,400 Watt x 4 kHz x 4 zones with 4 rinses in time and ultrapure water (4 rinses) followed by drying at 90 ° C to 95 ° C. The method according to claim 1,
The nickel plating layer (500) and the gold plating layer (600)
22 g / l of Nickel Sulfate, 22 g / l of Sodium Hypophosphite, 11 g / l of Maleic Acid, 21 g / l of Disodium Succinate, And 1 g / l of sodium thiosulfate were electroless-plated at a temperature of 50 ° C at a pH of 5.0 for 15 minutes to 20 minutes to form a nickel plating layer 500 having a thickness of 5 μm to 6 μm, Lt; / RTI >
A mixture of 2 g / l Potassium Gold Cyanide, 11 g / l Potassium Phosphate, 16 g / l EDTA (Ethylenediaminetetraacetic Acid), 1 g / l Formic Acid ) And 10 g / l of Carboxylic Acid-Amide was subjected to electroless plating at a temperature of 52 캜 and a pH of 7.0 for 25 minutes to form a gold plating layer 600 (thickness: 0.06 탆 to 0.08 탆 thick) Of the printed circuit board for a switch of an automobile. 13. The method of claim 12,
A palladium plating layer is further formed between the nickel plating layer 500 and the gold plating layer 600,
The palladium plating layer contained 5 g / l of palladium chloride, 26 g / l of ethylenediamine, 11 g / l of ethylenediaminetetraacetic acid (EDTA), 2 g / l of glycine, A palladium plating solution containing 10 g / l of fumaric acid was electroless plated at a temperature of 48 캜 and a pH of 8.0 for 15 to 20 minutes to form a palladium plating layer with a thickness of 0.05 탆. ≪ / RTI > The method according to claim 1,
The spacing distance D is 5 占 퐉 to 15 占 퐉,
Wherein the stepped distance (C) is 5 占 퐉 to 20 占 퐉.

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