CN103458621A - Spraying method for thick copper circuit board - Google Patents
Spraying method for thick copper circuit board Download PDFInfo
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- CN103458621A CN103458621A CN2012101689046A CN201210168904A CN103458621A CN 103458621 A CN103458621 A CN 103458621A CN 2012101689046 A CN2012101689046 A CN 2012101689046A CN 201210168904 A CN201210168904 A CN 201210168904A CN 103458621 A CN103458621 A CN 103458621A
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- copper circuit
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Abstract
An embodiment of the invention discloses a spraying method and spraying equipment for a thick copper circuit board. The spraying method for the thick copper circuit board can include performing solder mask spraying on the thick copper circuit board if a current number of solder mask spraying performed on the thick copper circuit board is lower than n, and performing exposure development processing on the thick copper circuit board by the aid of a first type of negative films after solder mask spraying is performed on the thick copper circuit board so as to perform solder mask opening on a surface patch on the thick copper circuit board and lines within a specified range around the surface patch; performing solder mask spraying on the thick copper circuit board if the current number of solder mask spraying performed on the thick copper circuit board is n, and performing exposure development processing on the thick copper circuit board by the aid of a second type of negative films after solder mask spraying is performed on the thick copper circuit board so as to perform solder mask opening on the surface patch on the thick copper circuit board. The total number of solder mask spraying performed on the thick copper circuit board is m. According to the scheme of the embodiment of the invention, the spraying method and the spraying equipment have the advantage that the solderability and the assembly performance of the surface patch and components on the thick copper circuit board can be improved advantageously.
Description
Technical field
The present invention relates to the printed circuit board (PCB) manufacture field, be specifically related to the spraying method of thick copper circuit board.
Background technology
At present, printed circuit board (PCB) (PCB, Printed Circuit Board) is made in processing, for thick copper circuit board, while especially being greater than the above super thick copper coin processing welding resistance of 6OZ, usually adopts the method for electrostatic spraying to solve the problem of welding resistance bubble.
Prior art is usually by repeatedly looping spraying welding resistance, exposure, development and curing flow process, until the resist thickness of graph line curb section reaches requirement.Practice is found, usually like this, can cause the resist thickness on figure copper face or circuit surface blocked up, when particularly copper is thick, need the number of times of spraying just more, the resist thickness on the figure copper face is just thicker, after the spraying number of times surpasses 3 times, resist thickness on copper face is usually very thick, this causes because the resist thickness on surface label side is too high with regard to as easy as rolling off a log, and then affects the welding of components and parts and surface label, causes the defect of failure welding (rosin joint); Overproof and the impact assembling of the thickness that also easily causes plate when simultaneously, on copper face, welding resistance printing ink is blocked up.
Summary of the invention
The embodiment of the present invention provides spraying method and the spraying equipment of thick copper circuit board, and to improving, the thick copper circuit board upper surface pastes and solderability and the assembleability of components and parts.
The embodiment of the present invention provides a kind of spraying method of thick copper circuit board on the one hand, can comprise:
Thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to the described thick copper circuit board carried out after the welding resistance spraying, with the welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing; If the current number of times that described thick copper circuit board is carried out to the welding resistance spraying does not also reach n time, described thick copper circuit board is carried out to the welding resistance spraying, and utilize described first kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing; If the current number of times that described thick copper circuit board is carried out to the welding resistance spraying reaches n time, described thick copper circuit board is carried out to the welding resistance spraying, and the thick copper circuit board after utilizing the Equations of The Second Kind egative film to the welding resistance spraying carries out the exposure imaging processing, the surface label of windowing on described thick copper circuit board with welding resistance, wherein, described thick copper circuit board need to carry out m welding resistance spraying altogether, and described n is less than described m.
Optionally, the resist thickness in logicalnot circuit zone on the described m described thick copper circuit board that spraying obtains based on the single welding resistance, and the thick value of the copper of described thick copper circuit board is determined.
Optionally, the difference of described m and described n is 1 or 2 or 3.
Optionally, the copper of described thick copper circuit board is thick is more than or equal to 6 ounces, and is less than or equal to 21 ounces.
Optionally, the described welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing comprises: welding resistance window surface label and all circuits on described thick copper circuit board.
Optionally, the thick copper circuit board after the welding resistance spraying is carried out also comprising after the exposure imaging processing: described thick copper circuit board is carried out to welding resistance and solidify processing.
The embodiment of the present invention also provides the spraying method of another kind of thick copper circuit board on the other hand, can comprise:
Detect the current resist thickness in logicalnot circuit zone on thick copper circuit board; If on the described thick copper circuit board detected, the current resist thickness in logicalnot circuit zone is less than the thick copper number of this thick copper circuit board, and the difference of the resist thickness that the zone of the logicalnot circuit on described thick copper circuit board is current and the thick value of copper of this thick copper circuit board is greater than first threshold, described thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing; If on the described thick copper circuit board detected, the current resist thickness in logicalnot circuit zone is less than the thick copper number of described thick copper circuit board, and the difference of the resist thickness that the zone of the logicalnot circuit on described thick copper circuit board is current and the thick value of copper of described thick copper circuit board is less than or equal to first threshold, described thick copper circuit board is carried out to the welding resistance spraying, and utilize the Equations of The Second Kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, the surface label of windowing on described thick copper circuit board with welding resistance.
Optionally, described first threshold is less than or equal to 2 ounces.
Optionally, the described welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing comprises: welding resistance window surface label and all circuits on described thick copper circuit board.
Optionally, the thick copper circuit board after the welding resistance spraying is carried out also comprising after the exposure imaging processing: described thick copper circuit board is carried out to welding resistance and solidify processing.
The embodiment of the present invention also provides a kind of spraying equipment on the other hand, can comprise:
The first spray equipment, judgment means and the second spray equipment,
Wherein, the first spray equipment, for thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to this thick copper circuit board carried out after the welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing;
Whether judgment means, reach n time for judging the current number of times that described thick copper circuit board is carried out to the welding resistance spraying;
The second spray equipment, if judging the current number of times that above-mentioned thick copper circuit board is carried out to the welding resistance spraying for described judgment means reaches n time, this thick copper circuit board is carried out to the welding resistance spraying, and utilize the Equations of The Second Kind egative film to carry out the exposure imaging processing to this thick copper circuit board after welding resistance spraying, the surface label of windowing on this thick copper circuit board with welding resistance.
Optionally, the resist thickness in logicalnot circuit zone on the described m described thick copper circuit board that spraying obtains based on the single welding resistance, and the thick value of the copper of described thick copper circuit board is determined.
Optionally, the difference of described m and described n is 1 or 2 or 3.
Optionally, the copper of described thick copper circuit board is thick is more than or equal to 6 ounces, and is less than or equal to 21 ounces.
Optionally, the described welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing comprises: welding resistance window surface label and all circuits on described thick copper circuit board.
Optionally, described the second spray equipment also for, after the thick copper circuit board to after welding resistance spraying carries out the exposure imaging processing, described thick copper circuit board is carried out to welding resistance and solidifies and process.
Optionally, described the first spray equipment also for, after the thick copper circuit board to after welding resistance spraying carries out the exposure imaging processing, described thick copper circuit board is carried out to welding resistance and solidifies and process.
The embodiment of the present invention also provides another kind of spraying equipment on the other hand, can comprise:
Checkout gear, the second judgment means, the 3rd spray equipment and the 4th spray equipment;
Wherein, checkout gear, detect the current resist thickness in logicalnot circuit zone on thick copper circuit board;
Judgment means, for judging on the thick copper circuit board that described checkout gear detects, whether the current resist thickness in logicalnot circuit zone is greater than first threshold with the difference of thick copper number, and on thick copper circuit board, the regional current resist thickness of logicalnot circuit is less than thick copper number;
The 3rd spray equipment, if judge for described judgment means the thick copper number that the current resist thickness in the zone of logicalnot circuit on thick copper circuit board is less than this thick copper circuit board, and on this thick copper circuit board, the difference of the thick copper number of the current resist thickness in logicalnot circuit zone and this thick copper circuit board is greater than first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to this thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing;
The 4th spray equipment, if judge for described judgment means the thick copper number that the current resist thickness in the zone of logicalnot circuit on thick copper circuit board is less than this thick copper circuit board, and on thick copper circuit board, the difference of the thick copper number of the current resist thickness in logicalnot circuit zone and this thick copper circuit board is less than or equal to first threshold, described thick copper circuit board is carried out to the welding resistance spraying, and utilize the Equations of The Second Kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, the surface label of windowing on this thick copper circuit board with welding resistance.
Optionally, described first threshold is less than or equal to 2 ounces.
Optionally, the described welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing comprises: welding resistance window surface label and all circuits on described thick copper circuit board.
Optionally, described the 3rd spray equipment also for, after the thick copper circuit board to after welding resistance spraying carries out the exposure imaging processing, described thick copper circuit board is carried out to welding resistance and solidifies and process.
Optionally, described the 3rd spray equipment also for, after the thick copper circuit board to after welding resistance spraying carries out the exposure imaging processing, described thick copper circuit board is carried out to welding resistance and solidifies and process.
Therefore, in a kind of scheme that the embodiment of the present invention provides, at thick copper circuit board, carry out repeatedly in the welding resistance spraying process, front carry out the welding resistance spraying n time after, utilize first kind egative film to carry out the exposure imaging processing to the thick copper circuit board carried out after the welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing, after then carrying out the welding resistance spraying, this thick copper circuit board after utilizing the Equations of The Second Kind egative film to the welding resistance spraying carries out the exposure imaging processing, the surface label of windowing on this thick copper circuit board with welding resistance, so, be conducive to reduce surface label and around it resist thickness of circuit poor, the resist thickness of control circuit, and then raising thick copper circuit board upper surface pastes and solderability and the assembleability of components and parts.
In the another kind of scheme that the embodiment of the present invention provides, in thick copper circuit board is carried out repeatedly to the welding resistance spraying process, detect the current resist thickness in logicalnot circuit zone on thick copper circuit board, if on the thick copper circuit board detected, the regional current resist thickness of logicalnot circuit and the difference of copper thickness are greater than first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing; If on this thick copper circuit board detected, the regional current resist thickness of logicalnot circuit and the difference of copper thickness are less than or equal to first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and the thick copper circuit board after utilizing the Equations of The Second Kind egative film to the welding resistance spraying carries out the exposure imaging processing, the surface label of windowing on this thick copper circuit board with welding resistance, so, be conducive to reduce surface label and around it resist thickness of circuit poor, the resist thickness of control circuit, and then raising thick copper circuit board upper surface pastes and solderability and the assembleability of components and parts.
The accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, below will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1-a is the schematic flow sheet of the spraying method of a kind of thick copper circuit board of providing of the embodiment of the present invention;
Fig. 1-b is the spraying process schematic diagram of a kind of thick copper circuit board of providing of the embodiment of the present invention;
Fig. 2 is the schematic flow sheet of the spraying method of the another kind of thick copper circuit board that provides of the embodiment of the present invention;
Fig. 3 is the schematic diagram of a kind of spraying equipment of providing of the embodiment of the present invention;
Fig. 4 is the another kind of spraying equipment schematic diagram that the embodiment of the present invention provides.
Embodiment
The embodiment of the present invention provides the spraying method of thick copper circuit board, and to improving, the thick copper circuit board upper surface pastes and solderability and the assembleability of components and parts.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making under the creative work prerequisite the every other embodiment obtained, belong to the scope of protection of the invention.
Be elaborated respectively by the following examples.
An embodiment of the spraying method of thick copper circuit board of the present invention, can comprise: thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to this thick copper circuit board carried out after the welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing; If the current number of times that this thick copper circuit board is carried out to the welding resistance spraying does not also reach n time, this thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to this thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing; If the current number of times that thick copper circuit board is carried out to the welding resistance spraying reaches n time, this thick copper circuit board is carried out to the welding resistance spraying, and this thick copper circuit board after utilizing the Equations of The Second Kind egative film to the welding resistance spraying carries out the exposure imaging processing, the surface label of windowing on this thick copper circuit board with welding resistance, wherein, this thick copper circuit board need to carry out m welding resistance spraying altogether, and this n is less than m.
Referring to Fig. 1, the spraying method of a kind of thick copper circuit board that the embodiment of the present invention provides can comprise following content:
101, thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to this thick copper circuit board carried out after the welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing.
102, judge whether the current number of times that above-mentioned thick copper circuit board is carried out to the welding resistance spraying reaches n time.
If return to step 101;
If not, perform step 103.
Wherein, thick copper circuit board for example need to carry out m welding resistance spraying altogether, and m is greater than n.In some embodiments of the invention, this m can for example based on the single welding resistance, spray the resist thickness in logicalnot circuit zone on the thick copper circuit board obtained and the thick value of copper of this thick copper circuit board is determined.For example, the resist thickness in the thick copper circuit board logicalnot circuit zone that each spraying thick copper circuit board obtains is identical, the resist thickness of supposing at every turn to spray the thick copper circuit board logicalnot circuit zone that thick copper circuit board obtains is 0.5 ounce, and the thick value of the copper of thick copper circuit board is 4 ounces, can estimates m and equal 8(0.5/4=8).Certainly, in some other embodiment of the present invention, also can determine by alternate manner the size of m, determine the size of m such as the parameter such as can be according to the copper of shower nozzle rotating speed, thick copper circuit board transfer rate, spray gun translational speed, printing ink spraying air pressure and thick copper circuit board thick.
For example, the difference of m and n is 1 or 2 or 3 or other value.
103, this thick copper circuit board is carried out to the welding resistance spraying, and utilize the Equations of The Second Kind egative film to carry out the exposure imaging processing to this thick copper circuit board after welding resistance spraying, the surface label of windowing on this thick copper circuit board with welding resistance.
If the current number of times that above-mentioned thick copper circuit board is carried out to the welding resistance spraying reaches m time, now on thick copper circuit board, the current resist thickness in logicalnot circuit zone equals or substantially equals the thick copper number of this thick copper circuit board, now stops the welding resistance spraying.
Be appreciated that first kind egative film and Equations of The Second Kind egative film are two kinds of different egative films, in order to realize the different effects of windowing.
In some embodiments of the invention, the welding resistance step of the circuit in specified scope around surface label on thick copper circuit board and this surface label of windowing for example can comprise: welding resistance window surface label and all circuits on thick copper circuit board; Or the welding resistance circuit of windowing around surface label on this thick copper circuit board and this surface label in 5 millimeters, 10 millimeters or 15 millimeters or other specified scope.
In some embodiments of the invention, the window value of windowing of the surface label on thick copper circuit board of welding resistance is for example surface label size+6mil(or other value), the window value of windowing of the circuit on thick copper circuit board of welding resistance is for example wire sizes+6mil(or other value).
In some embodiments of the invention, after the thick copper circuit board to after the welding resistance spraying carries out the exposure imaging processing, also can further to this thick copper circuit board, carry out welding resistance and solidify processing (for example the welding resistance hot curing is processed or other solidifies processing), for example, after the thick copper circuit board after the welding resistance spraying being carried out to the exposure imaging processing at every turn, further this thick copper circuit board is carried out to welding resistance and solidify processing, then (if need to) again this thick copper circuit board is carried out to the welding resistance spraying.In some embodiments of the invention, at every turn before thick copper circuit board is carried out to the welding resistance spraying, also can be first to this thick copper circuit board carry out the welding resistance pre-treatment (as surface cleaning process, and surface coarsening processing etc. for strengthening the processing of adhesive force).
In the present embodiment, the mode of welding resistance spraying can be electrostatic spraying or other existing spraying method.
In the present embodiment, the copper of thick copper circuit board is thick for example is more than or equal to 6 ounces, and is less than or equal to 21 ounces, and the copper of thick copper circuit board is thick certainly can be also the value in other scope.
Referring to Fig. 1-b, Fig. 1-b shows a kind of spraying process of thick copper circuit board for example, need carry out altogether 4 welding resistance sprayings, wherein, in Fig. 1-b, 3 times in spraying process, uses first kind egative film, uses the Equations of The Second Kind egative film last 1 time.Certainly, also can adjust as required in other embodiments the access times of first kind egative film and Equations of The Second Kind egative film.
Therefore, in the present embodiment, at thick copper circuit board, carry out repeatedly in the welding resistance spraying process, front carry out the welding resistance spraying n time after, utilize first kind egative film to carry out the exposure imaging processing to the thick copper circuit board carried out after the welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing, after then carrying out the welding resistance spraying, this thick copper circuit board after utilizing the Equations of The Second Kind egative film to the welding resistance spraying carries out the exposure imaging processing, the surface label of windowing on this thick copper circuit board with welding resistance, so, be conducive to reduce surface label and around it resist thickness of circuit poor, the resist thickness of control circuit, and then raising thick copper circuit board upper surface pastes and solderability and the assembleability of components and parts.
An embodiment of the spraying method of thick copper circuit board of the present invention can comprise: detect the current resist thickness in logicalnot circuit zone on thick copper circuit board; If on the thick copper circuit board detected, the regional current resist thickness of logicalnot circuit and the difference of copper thickness are greater than first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing; If on the thick copper circuit board detected, the regional current resist thickness of logicalnot circuit and the difference of copper thickness are less than or equal to first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and utilize the Equations of The Second Kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, the surface label of windowing on this thick copper circuit board with welding resistance.
Referring to Fig. 2, the spraying method of the another kind of thick copper circuit board that the embodiment of the present invention provides can comprise following content:
201, detect the current resist thickness in logicalnot circuit zone on thick copper circuit board.
202, on the thick copper circuit board that judgement detects, whether the regional current resist thickness of logicalnot circuit and the difference of thick copper number are greater than first threshold, and on thick copper circuit board, the current resist thickness in logicalnot circuit zone is less than thick copper number.
Wherein, if on thick copper circuit board, the current resist thickness in logicalnot circuit zone is less than the thick copper number of this thick copper circuit board, and on thick copper circuit board, the difference of the thick copper number of the current resist thickness in logicalnot circuit zone and this thick copper circuit board is greater than first threshold, performs step 203;
If judge the thick copper number that the current resist thickness in the zone of logicalnot circuit on thick copper circuit board is less than this thick copper circuit board, and on thick copper circuit board, the difference of the thick copper number of the current resist thickness in logicalnot circuit zone and this thick copper circuit board is less than or equal to first threshold, performs step 204.
If judge the thick copper number that the current resist thickness in the zone of logicalnot circuit on thick copper circuit board is more than or equal to this thick copper circuit board, stop the welding resistance spraying.
In some embodiments of the invention, first threshold for example is less than or equal to 1 ounce, 2 ounces, 3 ounces or other one-tenth-value thickness 1/10.For example, first threshold is less than or equal to once or twice or three welding resistances and is sprayed on getable resist thickness on thick copper circuit board logicalnot circuit zone.
203, this thick copper circuit board is carried out to the welding resistance spraying, and the thick copper circuit board after utilizing first kind egative film to the welding resistance spraying carries out the exposure imaging processing, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing, return to step 201.
204, above-mentioned thick copper circuit board is carried out to the welding resistance spraying, and utilize the Equations of The Second Kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, the surface label of windowing on this thick copper circuit board with welding resistance, return to step 201.
Be appreciated that first kind egative film and Equations of The Second Kind egative film are two kinds of different egative films, in order to realize the different effects of windowing.
In some embodiments of the invention, the welding resistance step of the circuit in specified scope around surface label on thick copper circuit board and this surface label of windowing for example can comprise: welding resistance window surface label and all circuits on thick copper circuit board; The perhaps welding resistance circuit in 5 millimeters, 10 millimeters or 15 millimeters or other specified scope of windowing around surface label on this thick copper circuit board and this surface label.
In some embodiments of the invention, the window value of windowing of the surface label on thick copper circuit board of welding resistance is for example surface label size+6mil(or other value), the window value of windowing of the circuit on thick copper circuit board of welding resistance is for example wire sizes+6mil(or other value).
In some embodiments of the invention, after the thick copper circuit board to after the welding resistance spraying carries out the exposure imaging processing, also can further to this thick copper circuit board, carry out welding resistance and solidify processing (for example the welding resistance hot curing is processed or other solidifies processing), for example, after the thick copper circuit board after the welding resistance spraying being carried out to the exposure imaging processing at every turn, further this thick copper circuit board is carried out to welding resistance and solidify processing, then (if need to) again this thick copper circuit board is carried out to the welding resistance spraying.In some embodiments of the invention, before thick copper circuit board is carried out to the welding resistance spraying, also can first to this thick copper circuit board, carry out welding resistance pre-treatment (as the processing of the enhancing adhesive force such as surface cleaning processing, surface coarsening processing) at every turn.
In the present embodiment, the mode of welding resistance spraying can be electrostatic spraying or other existing spraying method.
In the present embodiment, the copper of thick copper circuit board is thick for example is more than or equal to 6 ounces, and is less than or equal to 21 ounces, and the copper of thick copper circuit board is thick certainly can be also the value in other scope.
Therefore, in the present embodiment, at thick copper circuit board, carry out repeatedly in the welding resistance spraying process, detect the current resist thickness in logicalnot circuit zone on thick copper circuit board, if on the thick copper circuit board detected, the regional current resist thickness of logicalnot circuit and the difference of copper thickness are greater than first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing; If on the thick copper circuit board detected, the regional current resist thickness of logicalnot circuit and the difference of copper thickness are less than or equal to first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and the thick copper circuit board after utilizing the Equations of The Second Kind egative film to the welding resistance spraying carries out the exposure imaging processing, the surface label of windowing on this thick copper circuit board with welding resistance, be conducive to like this to reduce surface label and around it resist thickness of circuit poor, the resist thickness of control circuit, and then raising thick copper circuit board upper surface pastes and solderability and the assembleability of components and parts.
For ease of better implementing the such scheme of the embodiment of the present invention, below also be provided for implementing the relevant device of said method.
Referring to Fig. 3, a kind of spraying equipment 300 that the embodiment of the present invention provides can comprise:
The first spray equipment 310, judgment means 320 and the second spray equipment 330.
Wherein, the first spray equipment 310, for thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to this thick copper circuit board carried out after the welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing;
Whether judgment means 320, reach n time for judging the current number of times that above-mentioned thick copper circuit board is carried out to the welding resistance spraying;
Wherein, thick copper circuit board for example need to carry out m welding resistance spraying altogether, and m is greater than n.In some embodiments of the invention, this m can for example based on the single welding resistance, spray the resist thickness in logicalnot circuit zone on the thick copper circuit board obtained and the thick value of copper of this thick copper circuit board is determined.For example, the resist thickness in the thick copper circuit board logicalnot circuit zone that each spraying thick copper circuit board obtains is identical, the resist thickness of supposing at every turn to spray the thick copper circuit board logicalnot circuit zone that thick copper circuit board obtains is 0.5 ounce, and the thick value of the copper of thick copper circuit board is 4 ounces, can estimates m and equal 8(0.5/4=8).Certainly, in some other embodiment of the present invention, also can determine by alternate manner the size of m, determine the size of m such as the parameter such as can be according to the copper of shower nozzle rotating speed, thick copper circuit board transfer rate, spray gun translational speed, printing ink spraying air pressure and thick copper circuit board thick.
For example, the difference of m and n is 1 or 2 or 3 or other value.
The second spray equipment 330, if judging the current number of times that above-mentioned thick copper circuit board is carried out to the welding resistance spraying for judgment means 320 reaches n time, this thick copper circuit board is carried out to the welding resistance spraying, and utilize the Equations of The Second Kind egative film to carry out the exposure imaging processing to this thick copper circuit board after welding resistance spraying, the surface label of windowing on this thick copper circuit board with welding resistance.
If the current number of times that above-mentioned thick copper circuit board is carried out to the welding resistance spraying reaches m time, now on thick copper circuit board, the current resist thickness in logicalnot circuit zone equals or substantially equals the thick copper number of this thick copper circuit board, and now the second spray equipment 330 stops the welding resistance spraying.
The first spray equipment 310 also for, if judging the current number of times that above-mentioned thick copper circuit board is carried out to the welding resistance spraying, judgment means 320 do not reach n time, thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to this thick copper circuit board carried out after the welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing.
Be appreciated that first kind egative film and Equations of The Second Kind egative film are two kinds of different egative films, in order to realize the different effects of windowing.
In some embodiments of the invention, surface label and all circuits but the first spray equipment 310 welding resistances are windowed on thick copper circuit board; But or the first spray equipment 310 welding resistances circuit of windowing around surface label on this thick copper circuit board and this surface label in 5 millimeters, 10 millimeters or 15 millimeters or other specified scope.
In some embodiments of the invention, the window value of windowing of the surface label on thick copper circuit board of the first spray equipment 310 welding resistances is for example surface label size+6mil(or other value), the window value of windowing of the circuit on thick copper circuit board of welding resistance is for example wire sizes+6mil(or other value).The window value of windowing of the surface label on thick copper circuit board of the second spray equipment 330 welding resistances is for example surface label size+6mil(or other value).
In some embodiments of the invention, the first spray equipment 310 also can be used for, after the thick copper circuit board to after the welding resistance spraying carries out the exposure imaging processing, further this thick copper circuit board is carried out to welding resistance and solidify processing (for example the welding resistance hot curing is processed or other solidifies processing), for example, the first spray equipment 310 after carrying out the exposure imaging processing to the thick copper circuit board after the welding resistance spraying at every turn, further this thick copper circuit board is carried out to welding resistance and solidify processing, then (if need to) again this thick copper circuit board is carried out to the welding resistance spraying.In some embodiments of the invention, the first spray equipment 310 also can be used for, at every turn before thick copper circuit board is carried out to the welding resistance spraying, first to this thick copper circuit board carry out the welding resistance pre-treatment (as surface cleaning process, and surface coarsening processing etc. for strengthening the processing of adhesive force).
In some embodiments of the invention, the second spray equipment 330 also can be used for, after the thick copper circuit board to after the welding resistance spraying carries out the exposure imaging processing, further this thick copper circuit board is carried out to welding resistance and solidify processing (for example the welding resistance hot curing is processed or other solidifies processing), for example, the second spray equipment 330 after carrying out the exposure imaging processing to the thick copper circuit board after the welding resistance spraying at every turn, further this thick copper circuit board is carried out to welding resistance and solidify processing, then (if need to) again this thick copper circuit board is carried out to the welding resistance spraying.In some embodiments of the invention, the second spray equipment 330 also can be used for, at every turn before thick copper circuit board is carried out to the welding resistance spraying, first to this thick copper circuit board carry out the welding resistance pre-treatment (as surface cleaning process, and surface coarsening processing etc. for strengthening the processing of adhesive force).
In the present embodiment, the mode of the first spray equipment 310 and the second spray equipment 330 welding resistance sprayings can be electrostatic spraying or other existing spraying method.
In the present embodiment, the copper of thick copper circuit board is thick for example is more than or equal to 6 ounces, and is less than or equal to 21 ounces, and the copper of thick copper circuit board is thick certainly can be also the value in other scope.
Be understandable that, the method specific implementation that the function of each functional module of the spraying equipment 300 of the present embodiment can be introduced according to said method embodiment, its specific implementation process can be referring to the associated description in above-described embodiment, wherein can also comprise for assisting electronic equipment of carrying out said method embodiment etc., not repeat them here.
Therefore, in the present embodiment, spraying equipment 300 carries out repeatedly in the welding resistance spraying process at thick copper circuit board, front carry out the welding resistance spraying n time after, utilize first kind egative film to carry out the exposure imaging processing to the thick copper circuit board carried out after the welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing, after then carrying out the welding resistance spraying, this thick copper circuit board after utilizing the Equations of The Second Kind egative film to the welding resistance spraying carries out the exposure imaging processing, the surface label of windowing on this thick copper circuit board with welding resistance, like this be conducive to reduce surface label and around it resist thickness of circuit poor, the resist thickness of control circuit, and then raising thick copper circuit board upper surface pastes and solderability and the assembleability of components and parts.
Referring to Fig. 4, the embodiment of the present invention also provides another kind of spraying equipment 400, can comprise: checkout gear 410, the second judgment means 420, the 3rd spray equipment 430 and the 4th spray equipment 440.
Wherein, checkout gear 410, detect the current resist thickness in logicalnot circuit zone on thick copper circuit board.
Judgment means 420, for judging on the thick copper circuit board that checkout gear 410 detects, whether the current resist thickness in logicalnot circuit zone is greater than first threshold with the difference of thick copper number, and on thick copper circuit board, the regional current resist thickness of logicalnot circuit is less than thick copper number.
The 3rd spray equipment 430, if judge for judgment means 420 the thick copper number that the current resist thickness in the zone of logicalnot circuit on thick copper circuit board is less than this thick copper circuit board, and on this thick copper circuit board, the difference of the thick copper number of the current resist thickness in logicalnot circuit zone and this thick copper circuit board is greater than first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to this thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing.
The 4th spray equipment 440, if judge for judgment means 420 the thick copper number that the current resist thickness in the zone of logicalnot circuit on thick copper circuit board is less than this thick copper circuit board, and on thick copper circuit board, the difference of the thick copper number of the current resist thickness in logicalnot circuit zone and this thick copper circuit board is less than or equal to first threshold, above-mentioned thick copper circuit board is carried out to the welding resistance spraying, and utilize the Equations of The Second Kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, the surface label of windowing on this thick copper circuit board with welding resistance.
In addition, if judgment means 420 is judged the thick copper number that the current resist thickness in the zone of logicalnot circuit on thick copper circuit board is more than or equal to this thick copper circuit board, stop the welding resistance spraying.
In some embodiments of the invention, first threshold for example is less than or equal to 1 ounce, 2 ounces, 3 ounces or other one-tenth-value thickness 1/10.For example, first threshold is less than or equal to once or twice or three welding resistances and is sprayed on getable resist thickness on thick copper circuit board logicalnot circuit zone.
Be appreciated that first kind egative film and Equations of The Second Kind egative film are two kinds of different egative films, in order to realize the different effects of windowing.
In some embodiments of the invention, the window value of windowing of the surface label on thick copper circuit board of the 3rd spray equipment 430 welding resistances is for example surface label size+6mil(or other value), the window value of windowing of the circuit on thick copper circuit board of welding resistance is for example wire sizes+6mil(or other value).The window value of windowing of the surface label on thick copper circuit board of the 4th spray equipment 440 welding resistances is for example surface label size+6mil(or other value).
In some embodiments of the invention, the 3rd spray equipment 430 also can be used for, after the thick copper circuit board to after the welding resistance spraying carries out the exposure imaging processing, further this thick copper circuit board is carried out to welding resistance and solidify processing (for example the welding resistance hot curing is processed or other solidifies processing), for example, the 3rd spray equipment 430 after carrying out the exposure imaging processing to the thick copper circuit board after the welding resistance spraying at every turn, further this thick copper circuit board is carried out to welding resistance and solidify processing, then (if need to) again this thick copper circuit board is carried out to the welding resistance spraying.In some embodiments of the invention, the 3rd spray equipment 430 also can be used for, at every turn before thick copper circuit board is carried out to the welding resistance spraying, first to this thick copper circuit board carry out the welding resistance pre-treatment (as surface cleaning process, and surface coarsening processing etc. for strengthening the processing of adhesive force).
In some embodiments of the invention, the 4th spray equipment 440 also can be used for, after the thick copper circuit board to after the welding resistance spraying carries out the exposure imaging processing, further this thick copper circuit board is carried out to welding resistance and solidify processing (for example the welding resistance hot curing is processed or other solidifies processing), for example, the 4th spray equipment 440 after carrying out the exposure imaging processing to the thick copper circuit board after the welding resistance spraying at every turn, further this thick copper circuit board is carried out to welding resistance and solidify processing, then (if need to) again this thick copper circuit board is carried out to the welding resistance spraying.In some embodiments of the invention, the 4th spray equipment 440 also can be used for, at every turn before thick copper circuit board is carried out to the welding resistance spraying, first to this thick copper circuit board carry out the welding resistance pre-treatment (as surface cleaning process, and surface coarsening processing etc. for strengthening the processing of adhesive force).
In the present embodiment, the mode of the 3rd spray equipment 430 and the 4th spray equipment 440 welding resistance sprayings can be electrostatic spraying or other existing spraying method.
In the present embodiment, the copper of thick copper circuit board is thick for example is more than or equal to 6 ounces, and is less than or equal to 21 ounces, and the copper of thick copper circuit board is thick certainly can be also the value in other scope.
Be understandable that, the method specific implementation that the function of each functional module of the spraying equipment 400 of the present embodiment can be introduced according to said method embodiment, its specific implementation process can be referring to the associated description in above-described embodiment, wherein can also comprise for assisting electronic equipment of carrying out said method embodiment etc., not repeat them here.
Therefore, in the present embodiment, spraying equipment 400 carries out repeatedly in the welding resistance spraying process at thick copper circuit board, detect the current resist thickness in logicalnot circuit zone on thick copper circuit board, if on the thick copper circuit board detected, the regional current resist thickness of logicalnot circuit and the difference of copper thickness are greater than first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing; If on the thick copper circuit board detected, the regional current resist thickness of logicalnot circuit and the difference of copper thickness are less than or equal to first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and the thick copper circuit board after utilizing the Equations of The Second Kind egative film to the welding resistance spraying carries out the exposure imaging processing, the surface label of windowing on this thick copper circuit board with welding resistance, so just be conducive to reduce surface label and around it resist thickness of circuit poor, the effectively resist thickness of control circuit, and then raising thick copper circuit board upper surface pastes solderability and the assembleability with components and parts.
It should be noted that, for aforesaid each embodiment of the method, for simple description, therefore it all is expressed as to a series of combination of actions, but those skilled in the art should know, the present invention is not subject to the restriction of described sequence of movement, because according to the present invention, some step can adopt other orders or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and related action and module might not be that the present invention is necessary.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, there is no the part described in detail in certain embodiment, can be referring to the associated description of other embodiment.
To sum up, in a kind of technical scheme that the embodiment of the present invention provides, at thick copper circuit board, carry out repeatedly in the welding resistance spraying process, front carry out the welding resistance spraying n time after, utilize first kind egative film to carry out the exposure imaging processing to the thick copper circuit board carried out after the welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing, after then carrying out the welding resistance spraying, this thick copper circuit board after utilizing the Equations of The Second Kind egative film to the welding resistance spraying carries out the exposure imaging processing, the surface label of windowing on this thick copper circuit board with welding resistance, so, be conducive to reduce surface label and around it resist thickness of circuit poor, the resist thickness of control circuit, and then raising thick copper circuit board upper surface pastes and solderability and the assembleability of components and parts.
In the another kind of scheme that the embodiment of the present invention provides, in thick copper circuit board is carried out repeatedly to the welding resistance spraying process, detect the current resist thickness in logicalnot circuit zone on thick copper circuit board, if on the thick copper circuit board detected, the regional current resist thickness of logicalnot circuit and the difference of copper thickness are greater than first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on this thick copper circuit board and this surface label of windowing; If on this thick copper circuit board detected, the regional current resist thickness of logicalnot circuit and the difference of copper thickness are less than or equal to first threshold, this thick copper circuit board is carried out to the welding resistance spraying, and the thick copper circuit board after utilizing the Equations of The Second Kind egative film to the welding resistance spraying carries out the exposure imaging processing, the surface label of windowing on this thick copper circuit board with welding resistance, so, be conducive to reduce surface label and around it resist thickness of circuit poor, the resist thickness of control circuit, and then raising thick copper circuit board upper surface pastes and solderability and the assembleability of components and parts.
Spraying method and the relevant device of the above thick copper circuit board that the embodiment of the present invention is provided are described in detail, applied specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, to sum up, this description should not be construed as limitation of the present invention simultaneously.
Claims (10)
1. the spraying method of a thick copper circuit board, is characterized in that, comprising:
Thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to the described thick copper circuit board carried out after the welding resistance spraying, with the welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing;
If the current number of times that described thick copper circuit board is carried out to the welding resistance spraying does not also reach n time, described thick copper circuit board is carried out to the welding resistance spraying, and utilize described first kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing; If the current number of times that described thick copper circuit board is carried out to the welding resistance spraying reaches n time, described thick copper circuit board is carried out to the welding resistance spraying, and the thick copper circuit board after utilizing the Equations of The Second Kind egative film to the welding resistance spraying carries out the exposure imaging processing, the surface label of windowing on described thick copper circuit board with welding resistance, wherein, described thick copper circuit board need to carry out m welding resistance spraying altogether, and described n is less than described m.
2. method according to claim 1, is characterized in that, the resist thickness in logicalnot circuit zone on the described m described thick copper circuit board that spraying obtains based on the single welding resistance, and the thick value of the copper of described thick copper circuit board is determined.
3. method according to claim 2, is characterized in that,
The difference of described m and described n is 1 or 2 or 3.
4. according to the described method of claims 1 to 3 any one, it is characterized in that, the copper of described thick copper circuit board is thick is more than or equal to 6 ounces, and is less than or equal to 21 ounces.
5. according to the described method of claims 1 to 3 any one, it is characterized in that, the described welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing comprises: welding resistance window surface label and all circuits on described thick copper circuit board.
6. according to the described method of claim 1 to 4 any one, it is characterized in that, describedly thick copper circuit board after welding resistance spraying is carried out to exposure imaging also comprise after processing: described thick copper circuit board is carried out to welding resistance and solidify and process.
7. the spraying method of a thick copper circuit board, is characterized in that, comprising:
Detect the current resist thickness in logicalnot circuit zone on thick copper circuit board;
If on the described thick copper circuit board detected, the current resist thickness in logicalnot circuit zone is less than the thick copper number of this thick copper circuit board, and the difference of the resist thickness that the zone of the logicalnot circuit on described thick copper circuit board is current and the thick value of copper of this thick copper circuit board is greater than first threshold, described thick copper circuit board is carried out to the welding resistance spraying, and utilize first kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, with the welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing;
If on the described thick copper circuit board detected, the current resist thickness in logicalnot circuit zone is less than the thick copper number of described thick copper circuit board, and the difference of the resist thickness that the zone of the logicalnot circuit on described thick copper circuit board is current and the thick value of copper of described thick copper circuit board is less than or equal to first threshold, described thick copper circuit board is carried out to the welding resistance spraying, and utilize the Equations of The Second Kind egative film to carry out the exposure imaging processing to the thick copper circuit board after welding resistance spraying, the surface label of windowing on described thick copper circuit board with welding resistance.
8. method according to claim 7, is characterized in that,
Described first threshold is less than or equal to 2 ounces.
9. according to the described method of claim 7 to 8 any one, it is characterized in that, the described welding resistance circuit in specified scope around surface label on described thick copper circuit board and this surface label of windowing comprises: welding resistance window surface label and all circuits on described thick copper circuit board.
10. according to the described method of claim 7 to 9 any one, it is characterized in that, describedly thick copper circuit board after welding resistance spraying is carried out to exposure imaging also comprise after processing: described thick copper circuit board is carried out to welding resistance and solidify and process.
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| CN106304665A (en) * | 2016-08-30 | 2017-01-04 | 江门全合精密电子有限公司 | The manufacture method of 10 ounce's copper printed circuit board (PCB)s |
| CN107027244A (en) * | 2016-01-29 | 2017-08-08 | 无锡深南电路有限公司 | A kind of preparation method of super thick copper circuit board |
| CN107072063A (en) * | 2017-05-26 | 2017-08-18 | 江门崇达电路技术有限公司 | A kind of PCB solder-resisting manufacturing methods |
| CN107148158A (en) * | 2017-06-29 | 2017-09-08 | 珠海杰赛科技有限公司 | The preparation method and device of a kind of printed circuit board |
| CN109413868A (en) * | 2018-12-12 | 2019-03-01 | 东莞市若美电子科技有限公司 | Power panel low pressure spray manufacture craft |
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| CN109413868A (en) * | 2018-12-12 | 2019-03-01 | 东莞市若美电子科技有限公司 | Power panel low pressure spray manufacture craft |
| CN114364150A (en) * | 2021-11-19 | 2022-04-15 | 清远市富盈电子有限公司 | Processing technology of solder resist ink for thick copper surface |
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| CN103458621B (en) | 2017-08-08 |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |