CN107072063A - A kind of PCB solder-resisting manufacturing methods - Google Patents
A kind of PCB solder-resisting manufacturing methods Download PDFInfo
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- CN107072063A CN107072063A CN201710385986.2A CN201710385986A CN107072063A CN 107072063 A CN107072063 A CN 107072063A CN 201710385986 A CN201710385986 A CN 201710385986A CN 107072063 A CN107072063 A CN 107072063A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a kind of PCB solder-resisting manufacturing methods, comprise the following steps：S1：Pneumatic spraying technique is used in ink formation first ink layer of the PCB surface spray viscosity for 55 65dpas；The thickness of the first described ink layer is 10 15 μm；S2：Electrostatic painting process spray viscosity is used for 55 65dpas ink the second ink layer of formation in the first ink layer surface；Second ink film thickness is 70 80 μm；S3：First ink layer and the second ink layer are carried out pre-baked；S4：Development is exposed to the first ink layer and the second ink layer, then baking-curing.The inventive method need not stand after the ink layer of pneumatic spraying first, toast flow, improve the production efficiency of wiring board；Second ink film thickness of electrostatic spraying process is controlled at 75 ± 5 μm, can reduce edges of boards causes line gap only oily because the ink film thickness of electrostatic spraying second is too low, the rubescent quality problem of line angle；And the making of the instruments such as early stage half tone, nail bed is reduced, and then reduces the cost for making welding resistance.
Description
Technical field
The present invention relates to printed wiring board manufacture technology field, and in particular to a kind of PCB solder-resisting manufacturing methods.
Background technology
Wiring board outer layer plate face is mainly dispersed with a lot " pad ", fine rule " lines of turning circuit for needing to mount component
Bar ", " Wu Tongqu " of insulation function, " cable-through hole " of UNICOM's interlayer circuit.The main function of welding resistance is exactly need not outer layer
Attachment component part protected with photosensitive solder resist ink, can prevent in welding process short circuit and protection circuit not by
Exposure is oxidized corrosion in atmosphere, and realizing the means of this purpose has silk-screen printing and electrostatic painting process.In printed wiring
Plate (PCB) industry, normal common welding resistance technique is generally divided into four kinds：1) welding resistance pre-treatment --- face of screen printing first --- is pre-
Dry --- the face of screen printing second --- preliminary drying --- exposure --- development --- solidification；2) welding resistance pre-treatment --- nail bed screen printing
Two sides --- preliminary drying --- exposure --- development --- solidification；3) --- electrostatic spraying --- exposure --- shows for welding resistance pre-treatment
Shadow --- solidification；4) welding resistance pre-treatment --- pneumatic spraying --- exposure --- development --- solidification..
First two is to use silk-screen printing in above-mentioned several welding resistance techniques, and the third is to use electrostatic spraying, but silk
Wire mark brush and electrostatic spraying can not possibly accomplish ink " zero enters hole " in below 0.3mm hole substantially for plate aperture, each
There is the birth defect of itself.
Silk-screen printing：At present, the silk screen welding resistance in industry is substantially is printed using catch point net, i.e., according to the knot of plate
Structure change is having increase catch point at hole, prevents from playing ink in screen printing process herein, so as to accomplish plate face stencil and hole
It is interior without ink.But, on silk screen the size design of catch point it is improper may result in plate face have region bite (should at ink covering by
Block non-stencil in catch point) or ink enter hole (ink itself has mobility).With between the design Kong Yukong of plate, hole
Spacing between pad, between hole and lines is less and less, in order to avoid plate is bitten, the gear oil drop size design on silk screen
Also it is less and less, due to the tension variation in the mobility and screen printing process of ink, thus unavoidably there is ink
Enter hole.
Electrostatic spraying：Electrostatic painting process is to use spraying device special, makes electronegative painting using high-pressure electrostatic electric field
Particulate is expected along the opposite direction directed movement of electric field, and paint particles are adsorbed into a kind of spraying method in workpiece surface；Plate
Part is vertical hanging state, and ink is uniformly ejected by spray gun, the ink static electrification after atomization, so as to effectively attachment
In plate surface.In order to ensure without ink residue in panel hole, spraying equipment needs the certain exhausting amount of guarantee and wind speed.Due to
Plate is vertical hanging in electrostatic spraying process, and ink has mobility again in itself, and plate face copper lines have certain thickness, oil
Black easily vertical conductance causes lines face curing ink and lines shoulder ink is very thin does not reach customer requirement.In order to ensure that ink thickness is accorded with
Customer requirement is closed, the measure often taken is that ink is sprayed thick, so again ink in hole can be caused can not to be extracted out by exhausting, so that
Cause plug-hole；And electrostatic spraying is carried out as table copper thickness >=1OZ, due to line face and base material difference in height and ink mobility
, easily there is only oily between line, the quality problem such as line angle is rubescent in problem.
Its Patent《Wiring board welding resistance method》201110342981.4, describe a kind of new solder-resisting manufacturing methods：Resistance
Pre-welding treatment → the first ink layer of silk-screen → wiring board standing → preliminary drying → the second ink layer of electrostatic spraying → exposure imaging；Make
The parameter of first ink layer：Meshcount is 51T, ink viscosity 150dPas-180dPas, 35 μm -40 μm of thickness, ink
Viscosity is big, when carrying out silk-screen action, and easily air is mixed with ink, too high additionally, due to the first ink film thickness of formation,
Air in discharge ink needs the time longer (60min) stood and toasted, while using silk-screen before electrostatic spraying
First ink layer bottoming, can not equally ensure the quality problem of welding resistance debris.
Its Patent《A kind of table copper thickness >=1OZ PCB solder-resisting manufacturing methods》201610561879.6, describe one kind
New solder-resisting manufacturing methods：Welding resistance pre-treatment → the first ink layer of the silk-screen → wiring board standing → ink layer of electrostatic spraying second →
Exposure imaging；Make the parameter of the first ink layer：Meshcount is 77T, ink viscosity 30dPas-35dPas, the μ of thickness 10
M-15 μm, when carrying out silk-screen action, the air being easily mixed with ink in air, discharge ink needs to stand 15-20min,
Silk-screen the first ink layer bottoming is used before electrostatic spraying simultaneously, can not equally ensure the quality problem of welding resistance debris.
It is required to stand wiring board progress after the ink layer of silk-screen first in patent disclosed in above-mentioned two and discharges ink
In air, elongated the production procedure of wiring board, reduced production efficiency, and used before electrostatic spraying the ink of silk-screen first
Layer bottoming, can not equally ensure the quality problem of welding resistance debris；Need to make phase in advance in the early stage for making solder mask simultaneously
The instruments such as half tone, the nail bed answered, increase the cost of manufacture of welding resistance.
The content of the invention
The present invention is high for existing PCB solder-resisting manufacturing methods long flow path, low production efficiency, production cost, line easily occurs
Between it is only oily, the quality problem such as line angle is rubescent the method reduce standing flow, improve there is provided a kind of PCB solder-resisting manufacturing methods
The production efficiency of wiring board, reduces the quality problems such as welding resistance debris, prick, reduces scrappage, and it is only oily to solve line gap,
The rubescent quality problem of line angle；And the making of the instruments such as early stage half tone, nail bed is reduced, and then reduces welding resistance cost.
In order to solve the above-mentioned technical problem, the invention provides a kind of PCB solder-resisting manufacturing methods, comprise the following steps：
S1：Pneumatic spraying technique is used in ink formation first ink of the PCB surface spray viscosity for 55-65dpas
Layer；The thickness of the first described ink layer is 10-15 μm；
S2：Electrostatic painting process spray viscosity is used for 55-65dpas ink formation the in the first ink layer surface
Two ink layers；Second ink film thickness is 70-80 μm；
S3：First ink layer and the second ink layer are carried out pre-baked；
S4：Development is exposed to the first ink layer and the second ink layer, then baking-curing.
Preferably, in step S1, the ejection pressure of the pneumatic spraying technique is 0.25-0.35MPa, atomization air pressure
For 0.25-0.35MPa, figure air pressure is 0.25-0.35MPa.
Preferably, in step S2, the pressure of the electrostatic painting process is 0.28-0.32MPa.
Preferably, it is described pre-baked including first baking 42min in 81 DEG C, 6min is then baked in 65 DEG C, finally in 14 DEG C
Roasting 6min.
Preferably, in step S4, exposure lighting level is 10-12 grades, and developing powder is 4.5-5.1m/min, developing time 65s；
Baking-curing parameter is to keep 60min at a temperature of 155 DEG C.
Preferably, step is also included before step S1：
S101：Welding resistance pre-treatment, i.e., cleaned and be roughened to pcb board face, specially using microetch or volcano ashing line
Road plate processing.
Compared with prior art, the present invention has the advantages that：
Even application after the atomization of the solder mask of low viscosity to PCB surface is first formed the by the present invention with pneumatic spraying technique
One ink layer, the pneumatic spraying technique used is made using totally-enclosed, is greatly reduced the qualities such as welding resistance debris, prick and is asked
Topic, and the first ink layer is relatively thin, only 10-15 μm, as prime coat, need not carry out standing preliminary drying after the completion of pneumatic spraying bottoming
Electrostatic spraying can be directly carried out, production procedure is optimized, improves production efficiency；Moreover, oily by the second of electrostatic spraying process
Ink film thickness is controlled at 75 ± 5 μm, and reduce edges of boards causes line gap only oily because the ink film thickness of electrostatic spraying second is too low, line angle
Rubescent quality problem.From production efficiency, method of the invention reduces multiple welding resistance, the flow of exposure；From cost angle
Seen on degree, this technique reduces the making of the instruments such as early stage half tone, nail bed, while improving personnel's efficiency, reduces flow, Ke Yiyou
Effect reduces cost and reduces product rejection.
Embodiment
In order to more fully understand the technology contents of the present invention, below in conjunction with technical side of the specific embodiment to the present invention
Case is described further and illustrated.
Embodiment 1
A kind of PCB solder-resisting manufacturing methods shown in the present embodiment, specially a kind of table copper thickness >=1OZ, actually accomplish copper
The thick PCB solder-resisting manufacturing methods at 60-80 μm, its step is as follows：
S101：Pcb board face is cleaned and roughening treatment, so that the ink of welding resistance there can be more preferable combination with pcb board
Power, prevents dropping for solder mask；Roughening uses volcano ashing wiring board, and abrasive concentration is 10%~15% (volume), and polishing scratch is wide
Spend for 10~14mm；If having made wiring board plate face clean enough and copper face sufficiently coarse the processing of wiring board before welding resistance,
The step for welding resistance pre-treatment can be omitted.
S1：Pneumatic spraying technique is used in ink formation first oil of the PCB surface even application viscosity for 55-65dpas
Layer of ink；First the faces of PCB first are carried out after solder mask is atomized with jet atomizing lance to spray the first ink layer, it is then right again
The faces of PCB second carry out the first ink layer of spraying；The thickness of first ink layer is 10-15 μm.
Pneumatic spraying is one kind of spraying method, coating is atomized and is sprayed to substrate (plastics from nozzle with compressed air
Or his material altogether) surface coating method.
In this step, the ejection pressure for the jet atomizing lance that pneumatic spraying technique is used is 0.3MPa, atomizing air
Pressure is 0.3MPa, and figure air (compressed air) pressure is 0.3MPa, and when spraying ink to pcb board, nozzle need to be applied back and forth
Then progressive forward step by step again on cloth ink to pcb board, the step of coating pcb board send speed (to be applied for 95-100mm/ steps
Cloth substrate transmits spacing, is nozzle during coating ink is progressive forward step by step, what its each step was coated with back and forth
Ink is 95-100mm)；Above-mentioned technological parameter can ensure to evenly spread on PCB surface during pneumatic spraying ink, and ink with
It is well bonded between PCB surface, ink will not fall off；Pneumatic spraying is totally-enclosed making, greatly reduces welding resistance
Standing preliminary drying need not be carried out after the completion of the quality problems such as debris, prick, and pneumatic spraying ink bottoming, production stream is optimized
Journey, improves production efficiency.
S2：Electrostatic painting process spray viscosity is used for 55-65dpas ink formation the in the first ink layer surface
Two ink layers；Second ink film thickness is 70-80 μm.
In this step, it is to be formed again using electrostatic painting process on the basis of the first ink layer for being formed in step sl
The control of ink wet-film thickness reduces edges of boards because of electrostatic spraying the second ink thickness at 70~80 μm in second ink layer, this step
Spend it is low cause line gap only oily, the rubescent quality problem of line angle.
S3：It is pre-baked to the first ink layer and the progress of the second ink layer, wherein it is pre-baked including first baking 42min in 81 DEG C, so
6min is baked in 65 DEG C afterwards, 6min is finally baked in 14 DEG C；
The step solves the first ink layer and the second ink film thickness is blocked up and influence the exposed and developed effect of welding resistance
Problem, it is ensured that the effect of exposure imaging.
S4：Development is exposed to the first ink layer and the second ink layer, then baking-curing；The step for for welding resistance
Conventional steps, it is necessary to the ink on pcb board be exposed development after form solder mask, then carry out baking-curing.In this reality
Apply in example, exposure lighting level is 10~12 grades, and developing powder is 4.5-5.1m/min, developing time 65s, baking-curing parameter be
60min is kept at a temperature of 155 DEG C.
Embodiment 2
The present embodiment provides a kind of PCB solder-resisting manufacturing methods, and this method is essentially identical with embodiment 1, and difference exists
It is specific as follows in step S101：Pcb board face is cleaned and roughening treatment, so that the ink of welding resistance can have more preferably with pcb board
Adhesion, prevent dropping for solder mask；Roughening uses acid solution or alkaline solution microetch pcb board.
In production application, some wiring boards need to carry out welding resistance in single or double, this for one side welding resistance
Situation, based on the design of the present invention, the method for being applicable to one side welding resistance is simplified on the basis of the above embodiments, is had
Body is in step sl using pneumatic spraying technique to wiring board single face spraying inking, the requirement of pneumatic spraying and the thickness of ink layer
Degree is same as Example 1.
The technical scheme provided above the embodiment of the present invention is described in detail, specific case used herein
Principle and embodiment to the embodiment of the present invention are set forth, and the explanation of above example is only applicable to help and understands this
The principle of inventive embodiments；Simultaneously for those of ordinary skill in the art, according to the embodiment of the present invention, in specific embodiment party
It will change in formula and application, in summary, this specification content should not be construed as limiting the invention.
Claims (6)
1. a kind of PCB solder-resisting manufacturing methods, it is characterised in that comprise the following steps：
S1：Pneumatic spraying technique is used in ink formation first ink layer of the PCB surface spray viscosity for 55-65dpas；Institute
The thickness for the first ink layer stated is 10-15 μm；
S2：Electrostatic painting process spray viscosity is used for the 55-65dpas oil of ink formation second in the first ink layer surface
Layer of ink；Second ink film thickness is 70-80 μm；
S3：First ink layer and the second ink layer are carried out pre-baked；
S4：Development is exposed to the first ink layer and the second ink layer, then baking-curing.
2. PCB solder-resisting manufacturing methods according to claim 1, it is characterised in that in step S1, the pneumatic spraying technique
Ejection pressure be 0.25-0.35MPa, atomization air pressure is 0.25-0.35MPa, and figure air pressure is 0.25-
0.35MPa。
3. PCB solder-resisting manufacturing methods according to claim 1, it is characterised in that in step S2, the electrostatic painting process
Pressure be 0.28-0.32MPa.
4. PCB solder-resisting manufacturing methods according to claim 1, it is characterised in that in step S3, described pre-baked including first existing
42min is baked in 81 DEG C, 6min is then baked in 65 DEG C, 6min is finally baked in 14 DEG C.
5. PCB solder-resisting manufacturing methods according to claim 1, it is characterised in that in step S4, exposure lighting level is 10-12
Level, developing powder is 4.5-5.1m/min, developing time 65s；Baking-curing parameter is to keep 60min at a temperature of 155 DEG C.
6. PCB solder-resisting manufacturing methods according to claim 1, it is characterised in that also include step before step S1：
S101：Welding resistance pre-treatment, is specially handled using microetch or volcano ashing wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710385986.2A CN107072063A (en) | 2017-05-26 | 2017-05-26 | A kind of PCB solder-resisting manufacturing methods |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710385986.2A CN107072063A (en) | 2017-05-26 | 2017-05-26 | A kind of PCB solder-resisting manufacturing methods |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108337808A (en) * | 2018-02-05 | 2018-07-27 | 江西景旺精密电路有限公司 | A kind of PCB anti-welding production line automatically |
| CN109413868A (en) * | 2018-12-12 | 2019-03-01 | 东莞市若美电子科技有限公司 | Power panel low pressure spray manufacture craft |
| CN111263532A (en) * | 2020-01-21 | 2020-06-09 | 李荣根 | Vertical dip-coating method for PCB (printed circuit board) |
| CN111867271A (en) * | 2020-07-21 | 2020-10-30 | 大连崇达电路有限公司 | Method for manufacturing variegated ink solder mask of thick copper plate |
| CN112040655A (en) * | 2020-09-04 | 2020-12-04 | 健鼎（湖北）电子有限公司 | Manufacturing method of printed circuit board |
| CN113068315A (en) * | 2021-02-26 | 2021-07-02 | 沪士电子股份有限公司 | Method for manufacturing circuit board capable of preventing small-hole and non-hole-blocking ink inlet hole |
| CN113411986A (en) * | 2021-05-18 | 2021-09-17 | 奥士康科技股份有限公司 | Method for improving false exposure of spider feet of PCB (printed circuit board) |
| CN113769919A (en) * | 2021-09-14 | 2021-12-10 | 江西景旺精密电路有限公司 | Method and device for spraying ink on circuit board, computer equipment and storage medium |
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| CN107027244A (en) * | 2016-01-29 | 2017-08-08 | 无锡深南电路有限公司 | A kind of preparation method of super thick copper circuit board |
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| CN101068452A (en) * | 2007-05-15 | 2007-11-07 | 杭州裕兴层压板材有限公司 | Aluminium-based copper foil clad laminated board and producing technology |
| CN102162993A (en) * | 2009-12-24 | 2011-08-24 | 株式会社田村制作所 | White solder mask composition for spraying |
| CN103458621A (en) * | 2012-05-28 | 2013-12-18 | 深南电路有限公司 | Spraying method for thick copper circuit board |
| CN107027244A (en) * | 2016-01-29 | 2017-08-08 | 无锡深南电路有限公司 | A kind of preparation method of super thick copper circuit board |
| CN106211615A (en) * | 2016-07-14 | 2016-12-07 | 江门崇达电路技术有限公司 | A kind of PCB solder-resisting manufacturing methods of table copper thickness >=1oz |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108337808A (en) * | 2018-02-05 | 2018-07-27 | 江西景旺精密电路有限公司 | A kind of PCB anti-welding production line automatically |
| CN109413868A (en) * | 2018-12-12 | 2019-03-01 | 东莞市若美电子科技有限公司 | Power panel low pressure spray manufacture craft |
| CN111263532A (en) * | 2020-01-21 | 2020-06-09 | 李荣根 | Vertical dip-coating method for PCB (printed circuit board) |
| CN111867271A (en) * | 2020-07-21 | 2020-10-30 | 大连崇达电路有限公司 | Method for manufacturing variegated ink solder mask of thick copper plate |
| CN112040655A (en) * | 2020-09-04 | 2020-12-04 | 健鼎（湖北）电子有限公司 | Manufacturing method of printed circuit board |
| CN113068315A (en) * | 2021-02-26 | 2021-07-02 | 沪士电子股份有限公司 | Method for manufacturing circuit board capable of preventing small-hole and non-hole-blocking ink inlet hole |
| CN113411986A (en) * | 2021-05-18 | 2021-09-17 | 奥士康科技股份有限公司 | Method for improving false exposure of spider feet of PCB (printed circuit board) |
| CN113769919A (en) * | 2021-09-14 | 2021-12-10 | 江西景旺精密电路有限公司 | Method and device for spraying ink on circuit board, computer equipment and storage medium |
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