CN113769919A - Method and device for spraying ink on circuit board, computer equipment and storage medium - Google Patents
Method and device for spraying ink on circuit board, computer equipment and storage medium Download PDFInfo
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- CN113769919A CN113769919A CN202111074742.5A CN202111074742A CN113769919A CN 113769919 A CN113769919 A CN 113769919A CN 202111074742 A CN202111074742 A CN 202111074742A CN 113769919 A CN113769919 A CN 113769919A
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- circuit board
- ink
- spraying
- board
- width
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/12—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to conditions of ambient medium or target, e.g. humidity, temperature position or movement of the target relative to the spray apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
Abstract
The invention discloses a method and a device for spraying ink on a circuit board, computer equipment and a storage medium. The method comprises the steps of loading circuit boards of different batches, measuring the board width of each circuit board, and reading the ink thickness required by the circuit boards; calculating the interval time and the interval between adjacent circuit boards according to the board width and the ink thickness of the circuit boards; conveying the corresponding circuit boards into the coating machine according to the interval time and the distance; and calculating the ink spraying amount of the corresponding circuit board according to the board width and the ink thickness of the circuit board, and spraying ink on two sides of the corresponding circuit board. The invention designs the interval time and the interval between the circuit boards and the ink spraying amount of each circuit board in advance aiming at the circuit boards with various board widths and various ink thicknesses; in the spraying process, the optimal spraying parameters can be automatically identified and fixed for circuit boards with different board widths and ink thicknesses, and the method has the advantage of uniform spraying of ink.
Description
Technical Field
The invention relates to the technical field of spraying processes, in particular to a method and a device for spraying ink on a circuit board, computer equipment and a storage medium.
Background
When the existing circuit board is used for electrostatic spraying and inking, because the board widths and the ink thicknesses of the circuit boards in different batches are not uniform, the current spraying process can only carry out single setting of spraying parameters according to each batch, and new spraying parameters need to be set again when each batch is replaced, so that the spraying process is relatively limited; when a plurality of batches of circuit boards with different board widths and different ink thicknesses need to be sprayed with ink together, due to the fact that the board widths and the ink thicknesses are different, the problem that ink spraying is not uniform on all parts of different circuit boards can be caused by a single set spraying parameter; and further can lead to a series of hidden troubles of the quality of the welding prevention.
Disclosure of Invention
The invention aims to provide a method and a device for spraying ink on a circuit board, computer equipment and a storage medium, and aims to solve the problem that the ink is not uniformly sprayed when the existing electrostatic ink spraying technology is used for spraying circuit boards with different board widths and different ink thicknesses.
In order to solve the technical problems, the invention aims to realize the following technical scheme: a method for spraying ink on a circuit board is provided, which comprises the following steps:
putting circuit boards of different batches on a board, measuring the board width of each circuit board, and reading the ink thickness required by the circuit boards;
calculating the interval time and the interval between adjacent circuit boards according to the board width and the ink thickness of the circuit boards;
conveying the corresponding circuit board into the coating machine according to the interval time and the interval;
and calculating the ink spraying amount of the corresponding circuit board according to the board width and the ink thickness of the circuit board, and spraying ink on two sides of the corresponding circuit board.
In addition, another object of the present invention is to provide a device for spraying ink on a circuit board, including:
the acquisition unit is used for loading circuit boards of different batches, measuring the board width of each circuit board and reading the ink thickness required by the circuit boards;
the calculating unit is used for calculating the interval time and the distance between the adjacent circuit boards according to the board width and the ink thickness of the circuit boards;
the transmission unit is used for transmitting the corresponding circuit board into the coating machine according to the interval time and the interval;
and the spraying unit is used for calculating the ink spraying amount of the corresponding circuit board according to the board width and the ink thickness of the circuit board and spraying ink on two sides of the corresponding circuit board.
In addition, an embodiment of the present invention further provides a computer device, which includes a memory, a processor, and a computer program stored on the memory and executable on the processor, and when the processor executes the computer program, the method for spraying ink on a circuit board according to the first aspect is implemented.
In addition, an embodiment of the present invention further provides a computer-readable storage medium, where the computer-readable storage medium stores a computer program, and the computer program, when executed by a processor, causes the processor to execute the method for spraying ink on a circuit board according to the first aspect.
The embodiment of the invention discloses a method and a device for spraying ink on a circuit board, computer equipment and a storage medium. The method comprises the steps of loading circuit boards of different batches, measuring the board width of each circuit board, and reading the ink thickness required by the circuit boards; calculating the interval time and the interval between adjacent circuit boards according to the board width and the ink thickness of the circuit boards; conveying the corresponding circuit boards into the coating machine according to the interval time and the distance; and calculating the ink spraying amount of the corresponding circuit board according to the board width and the ink thickness of the circuit board, and spraying ink on two sides of the corresponding circuit board. The embodiment of the invention designs the interval time and the interval between the circuit boards and the ink spraying amount of each circuit board in advance aiming at the circuit boards with various board widths and various ink thicknesses; in the spraying process, the optimal spraying parameters can be automatically identified and fixed for circuit boards with different board widths and ink thicknesses, and the method has the advantage of uniform spraying of ink.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for ink-spraying a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic view of a sub-flow of a method for inking a circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic view of another sub-flow of a method for inking a circuit board according to an embodiment of the present invention;
FIG. 4 is a schematic view of another sub-flow of a method for inking a circuit board according to an embodiment of the present invention;
FIG. 5 is a schematic view of another sub-flow of a method for inking a circuit board according to an embodiment of the present invention;
FIG. 6 is a schematic view of another sub-flow of a method for inking a circuit board according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a robot upper plate provided in an embodiment of the present invention;
FIG. 8 is a diagram illustrating a fool-proof recognition calculation according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a computing board spacing provided by an embodiment of the present invention;
FIG. 10 is a schematic block diagram of an apparatus for inking a circuit board provided by an embodiment of the present invention;
FIG. 11 is a schematic block diagram of a computer device provided by an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Referring to fig. 1, fig. 1 is a schematic flow chart of a method for spraying ink on a circuit board according to an embodiment of the present invention;
as shown in fig. 1, the method includes steps S101 to S104.
S101, carrying out board loading on circuit boards of different batches, measuring the board width of each circuit board, and reading the ink thickness required by the circuit boards.
In the embodiment, circuit boards in different batches are sequentially placed on the coating machine, the optimal coating parameters are automatically matched by obtaining the board width and the ink thickness of each circuit board, and then the coating machine is controlled to correspondingly coat each circuit board.
In one embodiment, as shown in fig. 2, the loading different batches of circuit boards and measuring the board width of each circuit board includes:
s201, positioning and grabbing the central position of the circuit board, and conveying the circuit board to a clamping position;
s202, clamping the board edges of the circuit board, and automatically calculating the board width of the circuit board by adopting a foolproof identification algorithm.
In the embodiment, the circuit board is accurately placed at the required position within the required time by controlling the manipulator, and the board width and the required ink thickness of the circuit board can be automatically read by the spraying machine; the automatic plate width calculation fool-proof recognition algorithm can be added to the spraying machine to measure the plate width.
Specifically, as shown in fig. 7 and 8, the principle of automatically calculating the fool-proof recognition algorithm is as follows:
setting the direction of a support sucker on a grabbing end of a manipulator to be f (X, X), taking the central position D1 of the support sucker to be f (X1, Y1), and synchronously coinciding with the center D2 of a circuit board to be f (X2, Y2);
secondly, the support sucker is controlled to grab the circuit board and move to a clamping position, and the edge of the circuit board is clamped through the clamps, wherein two clamps are clamped on one circuit board;
the Y2 of the circuit board center D2 and the center of the distance S1 between the two clamps are in the same X direction; then, the movable baffle automatically moves to be close to the plate edges to be tangent, and the distance S2 between the plate edges and the center of the clamp is generated;
fourthly, the board width W1 of the circuit board can be automatically calculated to be S2 x 2+ S1; and automatically recording the board width recording data into spraying machine equipment for positioning, sensing and identifying.
S102, calculating the interval time and the interval between the adjacent circuit boards according to the board width and the ink thickness of the circuit boards.
Specifically, as shown in fig. 3, the step S102 includes:
s301, matching the interval time between the current circuit board and the next circuit board according to the board width and the ink thickness of the current circuit board based on a preset time table;
s302, obtaining the distance between the current circuit board and the next circuit board according to the interval time and the track transmission speed;
and S303, obtaining the distance between the current circuit board and the next circuit board according to the distance and the board width of the current circuit board.
In this embodiment, for the board width and the ink thickness of each circuit board, corresponding time tables are configured in advance, for example, as shown in table 1, where table 1 is a table of the interval time required for the board width of 508mm and four different ink thicknesses corresponding thereto; therefore, in the process of spraying different circuit boards, corresponding parameters in the time table can be automatically matched, the interval time between the current circuit board and the next circuit board is determined, and the distance and the interval between the current circuit board and the next circuit board are further calculated, so that the advantage of switching the spraying parameters in real time for the circuit boards with different sizes subsequently can be realized.
TABLE 1
| Width of board | 508 | 508 | 508 | 508 |
| Thickness of ink | 25 | 30 | 35 | 40 |
| Interval of time | 8.5 | 10.0 | 11.2 | 14.4 |
Specifically, as shown in fig. 9, a specific scenario application is described:
the interval time T between the plate width W2 and the plate width W1 is (the interval time of the plate width W1 + the interval time of the plate interval S4);
secondly, as shown in the above table 1, if the board width W1 is 508mm and the ink thickness is 25um, the matched interval time is 8.5S, and so on, different board widths and ink thicknesses correspond to different interval times;
thirdly, if the board width W1 of the current circuit board is 508mm, the ink thickness is 25um, and the interval time is 8.5S, the distance L between the current circuit board and the next circuit board is equal to the interval time T multiplied by the track running speed A;
distance L-plate width W.
In the scene application, based on the board width W1 and the ink thickness 25um, the interval time can be automatically recognized to be 8.5S, the distance L of the whole interval can be obtained, the distance L is subtracted by the board width W1 to calculate the interval S4, and the like, and when the board width is W2, the board interval S3 can be automatically calculated.
S103, conveying the corresponding circuit board into the coating machine according to the interval time and the interval.
In this embodiment, the circuit board is accurately conveyed according to the interval time and the interval between the current circuit board and the next circuit board, and the efficiency of ink spraying can be improved.
And S104, calculating the ink spraying amount of the corresponding circuit board according to the board width and the ink thickness of the circuit board, and spraying ink on two sides of the corresponding circuit board.
Specifically, as shown in fig. 4, the step S104 includes:
s401, matching corresponding ink spraying amount according to the board width and the ink thickness of the current circuit board based on a preset ink spraying table;
and S402, spraying the two sides of the current circuit board for multiple times according to the matched ink spraying amount.
In this embodiment, after the circuit board enters the spraying machine, the current circuit board is automatically matched with the corresponding parameters in the preset ink spraying table according to the board width and the ink thickness of the current circuit board, so as to obtain the optimal ink spraying amount of the current circuit board, and multiple spraying is performed on two sides of the current circuit board through the spray heads based on the obtained optimal ink spraying amount of the current circuit board.
In one embodiment, as shown in fig. 5, the step S402 includes:
s501, uniformly distributing the matched ink spraying amount to two groups of spraying devices on two sides, wherein each group of spraying device comprises a plurality of nozzles distributed side by side, and the nozzles on two sides are symmetrically distributed;
and S502, controlling each spray head in each group of spray coating devices to spray ink with a preset proportion on the current circuit board.
The printing ink spraying mode of this embodiment is optimized for the pulse spraying by traditional once spouting, specifically has adopted two sets of spraying device, and 5 shower nozzles of every group, both sides symmetric distribution about, and about the printing ink volume of both sides spraying unanimous to ensure the spraying homogeneity.
When the circuit board enters the spraying machine and passes through 10 nozzles, the nozzles are automatically sprayed, when the center of the center nozzle of the circuit board corresponds to the center of the center nozzle, the corresponding nozzles are automatically controlled to spray ink with a preset proportion, and after the circuit board passes through the center nozzle, the nozzles are automatically closed, so that the traditional mode that the nozzles are always in a running state only when the circuit board is started is replaced by the method; in the embodiment, after the ink spraying amount is distributed to the corresponding spray heads according to the preset proportion, the multiple pulse spraying mode is adopted through the multiple spray heads, so that the ink thickness uniformity of the sprayed circuit board is better.
In one embodiment, as shown in fig. 6, the step S502 includes:
s601, controlling a first spray head in each group of spray coating devices to pre-spray the current circuit board so as to enable the circuit board to have a conductive function;
and S602, controlling the second spray head to the fifth spray head in each group of spray coating devices to spray ink to the circuit board according to the gradually increased preset proportion.
This embodiment takes a specific scenario as an example; table 3 shows ink spraying tables corresponding to four ink thicknesses, in which the plate width is 508mm and the plate length is 622 mm.
TABLE 3
Based on the ink spraying parameters in table 3, 1 to 5 nozzles are a group of spraying devices, and 6 to 10 nozzles are another group of symmetrical spraying devices; wherein 1 shower nozzle and 6 shower nozzles are spouting in advance, mainly play electrically conductive effect, and 2 shower nozzles to 5 shower nozzles and 7 shower nozzles to 10 shower nozzles can increase gradually 10% thick proportion of printing ink in proper order to ensure whole printing ink thickness uniformity.
Specifically, based on the parameter standards of 508mm plate width and 622mm plate length in Table 3; other dimensions are calculated as: assuming that the ink thickness is 25um, the plate width is 565mm, and the plate length is 622mm, 2 heads or 7 heads are 82 (((W2 is 565mm) × L1)/((W1 is 508mm) × L1)), and so on, the corresponding amount of the heads can be derived, so the formula of the corresponding amount of the heads is f (q) ═ Qi (((Wi 565mm) × L1)/((W1 is 508mm) × L1)), i represents the order of the heads, and when the plate width changes, the plate width Wi can be automatically identified according to the actual plate width. And synchronously, when the thickness of the ink is changed, automatically identifying and matching the corresponding Qi and the spray head.
In an embodiment, the preset ratio of the ink sprayed by the second spray head is as follows: 5% -15%;
the preset proportion of the third spray head for spraying the ink is as follows: 15% -25%;
the preset proportion of the fourth spray head for spraying the ink is as follows: 25% -35%;
the fifth spray head sprays the ink according to the preset proportion: 35 to 45 percent.
The embodiment is a preset proportion of the ink sprayed by the nozzles in the group of spraying devices, and the spraying operation is carried out based on the proportion range, so that the obtained circuit board has good ink uniformity.
The embodiment of the invention also provides a circuit board ink spraying device which is used for executing any embodiment of the circuit board ink spraying method. Specifically, referring to fig. 10, fig. 10 is a schematic block diagram of an apparatus for inking a circuit board according to an embodiment of the present invention.
As shown in fig. 10, the apparatus 1000 for inking a circuit board includes: an acquisition unit 1001, a calculation unit 1002, a conveyance unit 1003, and a spraying unit 1004.
An obtaining unit 1001 for mounting circuit boards of different batches and measuring the board width of each circuit board, and reading the ink thickness required by the circuit boards;
the calculating unit 1002 is used for calculating the interval time and the distance between the adjacent circuit boards according to the board width and the ink thickness of the circuit boards;
the transmission unit 1003 is used for transmitting the corresponding circuit board into the coating machine according to the interval time and the interval;
and the spraying unit 1004 is used for calculating the ink spraying amount of the corresponding circuit board according to the board width and the ink thickness of the circuit board and spraying ink on two sides of the corresponding circuit board.
The device designs the interval time and the interval between circuit boards and the ink spraying amount of each circuit board in advance aiming at the circuit boards with various board widths and various ink thicknesses; in the spraying process, the optimal spraying parameters can be automatically identified and fixed for circuit boards with different board widths and ink thicknesses, and the method has the advantage of uniform spraying of ink.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
The above-described means for inking the circuit board may be implemented in the form of a computer program which can be run on a computer device as shown in fig. 11.
Referring to fig. 11, fig. 11 is a schematic block diagram of a computer device according to an embodiment of the present invention. The computer device 1100 is a server, and the server may be an independent server or a server cluster including a plurality of servers.
Referring to fig. 11, the computer device 1100 includes a processor 1102, memory and network interface 1105 connected by a system bus 1101, where the memory may include non-volatile storage media 1103 and internal memory 1104.
The non-volatile storage medium 1103 may store an operating system 11031 and computer programs 11032. The computer programs 11032, when executed, may cause the processor 1102 to perform a method of inking a circuit board.
The processor 1102 is configured to provide computing and control capabilities that support the operation of the overall computing device 1100.
The internal memory 1104 provides an environment for running the computer program 11032 in the non-volatile storage medium 1103, and when the computer program 11032 is executed by the processor 1102, the processor 1102 may be enabled to execute a method for inking the circuit board.
The network interface 1105 is used for network communications, such as to provide for the transmission of data information. Those skilled in the art will appreciate that the configuration shown in fig. 11 is a block diagram of only a portion of the configuration associated with aspects of the present invention and is not intended to limit the computing device 1100 to which aspects of the present invention may be applied, and that a particular computing device 1100 may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
Those skilled in the art will appreciate that the embodiment of a computer device illustrated in fig. 11 does not constitute a limitation on the specific construction of the computer device, and that in other embodiments a computer device may include more or fewer components than those illustrated, or some components may be combined, or a different arrangement of components. For example, in some embodiments, the computer device may only include a memory and a processor, and in such embodiments, the structures and functions of the memory and the processor are consistent with those of the embodiment shown in fig. 11, and are not described herein again.
It should be appreciated that in embodiments of the present invention, the Processor 1102 may be a Central Processing Unit (CPU), and the Processor 1102 may also be other general purpose processors, Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) or other Programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Wherein a general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
In another embodiment of the invention, a computer-readable storage medium is provided. The computer readable storage medium may be a non-volatile computer readable storage medium. The computer readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the method of inking a circuit board of an embodiment of the invention.
The storage medium is an entity and non-transitory storage medium, and may be various entity storage media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-only memory (ROM), a magnetic disk, or an optical disk.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described apparatuses, devices and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A method for spraying ink on a circuit board is characterized by comprising the following steps:
putting circuit boards of different batches on a board, measuring the board width of each circuit board, and reading the ink thickness required by the circuit boards;
calculating the interval time and the interval between adjacent circuit boards according to the board width and the ink thickness of the circuit boards;
conveying the corresponding circuit board into the coating machine according to the interval time and the interval;
and calculating the ink spraying amount of the corresponding circuit board according to the board width and the ink thickness of the circuit board, and spraying ink on two sides of the corresponding circuit board.
2. The method of inking circuit boards of claim 1, wherein said loading different batches of circuit boards and measuring the board width of each circuit board comprises:
positioning and grabbing the central position of the circuit board, and conveying the circuit board to a clamping position;
and clamping the board edges of the circuit board, and automatically calculating the board width of the circuit board by adopting a foolproof identification algorithm.
3. The method of inking a circuit board according to claim 1, wherein said calculating the spacing time and pitch between adjacent circuit boards from the board width and ink thickness of said circuit boards comprises:
matching the interval time between the current circuit board and the next circuit board according to the board width and the ink thickness of the current circuit board based on a preset time table;
obtaining the distance between the current circuit board and the next circuit board according to the interval time and the track transmission speed;
and obtaining the distance between the current circuit board and the next circuit board according to the distance and the board width of the current circuit board.
4. The method for spraying ink on the circuit board according to claim 1, wherein the step of calculating the ink spraying amount of the corresponding circuit board according to the board width and the ink thickness of the circuit board and spraying ink on two sides of the corresponding circuit board comprises the following steps:
matching corresponding ink spraying amount according to the board width and the ink thickness of the current circuit board based on a preset ink spraying table;
and spraying the two sides of the current circuit board for multiple times according to the matched ink spraying amount.
5. The method for spraying ink on the circuit board according to claim 4, wherein the step of spraying the two sides of the current circuit board for a plurality of times according to the matched ink spraying amount comprises the following steps:
the matched ink spraying amount is evenly distributed to two groups of spraying devices on two sides, wherein each group of spraying device comprises a plurality of nozzles which are distributed side by side, and the nozzles on two sides are symmetrically distributed;
and controlling each spray nozzle in each group of spray coating devices to spray ink with preset proportion on the current circuit board.
6. The method for inking a circuit board according to claim 5, wherein the controlling each nozzle in each group of nozzles to apply a predetermined ratio of ink to the current circuit board comprises:
controlling a first spray head in each group of spray coating devices to pre-spray the current circuit board so as to enable the circuit board to have a conductive function;
and controlling the second spray head to the fifth spray head in each group of spray coating devices to spray ink on the circuit board according to the gradually increased preset proportion.
7. The method of inking a circuit board of claim 6, comprising:
the preset proportion of the second spray head for spraying the ink is as follows: 5% -15%;
the preset proportion of the third spray head for spraying the ink is as follows: 15% -25%;
the preset proportion of the fourth spray head for spraying the ink is as follows: 25% -35%;
the fifth spray head sprays the ink according to the preset proportion: 35 to 45 percent.
8. The utility model provides a device of circuit board spraying ink which characterized in that includes:
the acquisition unit is used for loading circuit boards of different batches, measuring the board width of each circuit board and reading the ink thickness required by the circuit boards;
the calculating unit is used for calculating the interval time and the distance between the adjacent circuit boards according to the board width and the ink thickness of the circuit boards;
the transmission unit is used for transmitting the corresponding circuit board into the coating machine according to the interval time and the interval;
and the spraying unit is used for calculating the ink spraying amount of the corresponding circuit board according to the board width and the ink thickness of the circuit board and spraying ink on two sides of the corresponding circuit board.
9. A computer device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor when executing the computer program implements the method of inking a wiring board as claimed in any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that the computer-readable storage medium stores a computer program which, when executed by a processor, causes the processor to perform the method of inking a wiring board according to any one of claims 1 to 7.
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| CN202111074742.5A CN113769919B (en) | 2021-09-14 | 2021-09-14 | Method and device for spraying ink on circuit board, computer equipment and storage medium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114261227A (en) * | 2022-01-05 | 2022-04-01 | 江西景旺精密电路有限公司 | Method for reducing thickness of printing ink in jet printing process |
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