CN107567275B - Method and device for placing component on substrate and component pasting/inserting machine - Google Patents
Method and device for placing component on substrate and component pasting/inserting machine Download PDFInfo
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- CN107567275B CN107567275B CN201710859970.0A CN201710859970A CN107567275B CN 107567275 B CN107567275 B CN 107567275B CN 201710859970 A CN201710859970 A CN 201710859970A CN 107567275 B CN107567275 B CN 107567275B
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Abstract
The invention provides a method and a device for placing a component on a substrate and a component pasting/inserting machine, wherein the method for placing the component on the substrate comprises the following steps: acquiring attribute information of a component placement area on a substrate, attribute information of components to be placed and position information of a component pickup device corresponding to the components to be placed, calculating total displacement and/or total time length of movement of the components to be placed corresponding to different sequences, and selecting a placement sequence with the shortest total displacement and/or total time length of movement of the components to be placed as a current placement sequence; and controlling the component picking device to pick and place the corresponding components according to the current placing sequence. The path of the component is optimized, and the efficiency of placing the component on the substrate can be improved. Therefore, the assembly efficiency of the electronic product is improved, and the production capacity is improved.
Description
Technical Field
The invention relates to the technical field of electronic assembly, in particular to a method and a device for placing a component on a substrate and a component pasting/inserting machine.
Background
At present, with the development of modern electronic components toward miniaturization, integration and high reliability, especially in the face of increasingly intense market competition, the production and manufacturing equipment of electronic products is developing toward full automation with high speed, high precision, intellectualization, multiple functions and the like.
The method comprises the steps of placing components at preset positions of a substrate to serve as an important part in production and manufacturing of electronic products, such as component mounting, component inserting and the like, improving component placing efficiency to improve production capacity and reduce production cost.
However, when the size of the substrate is large, the positions of the components to be placed are large, and the distance is long, the time of the movement of the component pickup device on the substrate has a large influence on the component placement efficiency, and in the prior art, the movement path of the component pickup device and the component placement sequence are optimized through the relative positions of the components to be placed, so that the improvement on the component placement efficiency is not obvious.
Therefore, how to improve the efficiency of placing the components on the substrate becomes an urgent problem to be solved.
Disclosure of Invention
The invention aims to improve the efficiency of placing components on a substrate.
According to a first aspect, an embodiment of the present invention provides a method for placing a component on a substrate, where the component is picked up by a component pickup device and mounted on or attached to a predetermined area of the substrate, including the following steps: acquiring attribute information of a component placement area on a substrate; acquiring attribute information of a component to be placed and position information of a component pickup device corresponding to the component to be placed; calculating the total displacement and/or the total time length of the movement of the components to be placed corresponding to different placing sequences according to the property information of the placing area, the property information of the components to be placed and the position information of the component picking device; selecting a placing sequence with the shortest total moving displacement and/or total duration of the components to be placed as a current placing sequence; and controlling the component picking device to pick the corresponding components according to the current placing sequence to place the components.
Optionally, the placement area attribute information includes: position information of the placement area; acquiring the property information of the component placement area on the substrate includes: acquiring coordinates of a positioning point of a substrate; obtaining coordinates of a component placement area; and determining the position information of the placement area according to the coordinates of the positioning point and the coordinates of the placement area.
Optionally, the placement area attribute information includes: position information of the placement area and angle information of the placement area; the attribute information of the component to be placed includes: position information of the component to be placed and angle information of the component to be placed; calculating the total displacement and/or the total duration of movement of the components to be placed corresponding to different placing sequences according to the property information of the placing areas, the property information of the components to be placed and the position information of the component picking device, wherein the total displacement and/or the total duration of movement of the components to be placed corresponding to different placing sequences comprises the following steps: determining the distance between the component to be placed and the placing area according to the position information of the placing area on the substrate and the position information of the component to be placed; confirming the rotation angle of the component during placement according to the angle information of the placement area and the angle information of the component to be placed; and calculating the total displacement and/or the total time length of the movement of the component to be placed according to the distance between the component to be placed and the placing area, the rotating angle and the position information of the component pickup device corresponding to the component to be placed.
Optionally, the selecting the placement sequence with the shortest total movement displacement and/or total duration of the components to be placed includes: selecting a placement sequence with the shortest total displacement and/or total duration of component movement as a placement sequence to be determined; judging whether the total displacement and/or the total time length corresponding to the placement sequence to be determined is smaller than the total displacement and/or the total time length corresponding to the preset placement sequence; and when the total displacement and/or the total duration corresponding to the placement sequence to be determined is less than the total displacement and/or the total duration corresponding to the preset placement sequence, taking the placement sequence to be determined as the current placement sequence.
Optionally, when the placement order to be determined corresponds to the total movement displacement and/or the total duration is greater than the total displacement and/or the total duration corresponding to the preset placement order, the pre-stored placement order is taken as the current placement order.
Optionally, before acquiring the attribute information of the component placement area on the substrate, the method includes: acquiring component placement data; and determining the types and the number of the components to be placed according to the placement data.
According to a second aspect, an embodiment of the present invention provides an apparatus for placing a component on a substrate, including: the first acquisition module is used for acquiring attribute information of a component placement area on the substrate; the second acquisition module is used for acquiring the attribute information of the component to be placed and the position information of the component pickup device corresponding to the component to be placed; the calculation module is used for calculating the total displacement and/or the total duration of movement of the components to be placed corresponding to different placement sequences according to the placement area attribute information, the attribute information of the components to be placed and the position information of the component pickup device; the sequence confirmation module is used for selecting the placement sequence with the shortest total movement displacement and/or total duration of the components to be placed as the current placement sequence; and the control placement module is used for controlling the component picking device to pick and place the corresponding components according to the current placement sequence.
Optionally, the placement area attribute information includes: position information of the placement area; the first acquisition module includes: the first acquisition unit is used for acquiring coordinates of a positioning point of the substrate; the second acquisition unit is used for acquiring coordinates of the component placement area; and the position determining unit is used for determining the position of the placement area on the substrate according to the positioning point coordinates and the placement area coordinates.
Optionally, the placement area attribute information includes: position information of the placement area on the substrate and angle information of the placement area; the position information of the component to be placed includes: position information of the component to be placed and angle information of the component to be placed; the calculation module comprises: the distance determining unit is used for determining the distance between the component to be placed and the placing area according to the position information of the placing area on the substrate and the position information of the component to be placed; the angle determining unit is used for determining the rotation angle of the component during placement according to the angle information of the placement area and the angle information of the component to be placed; and the calculating unit is used for calculating the total displacement and/or the total duration of the movement of the component to be placed according to the distance between the component to be placed and the placing area, the rotating angle and the position information of the component pickup device corresponding to the component to be placed.
According to a third aspect, an embodiment of the present invention provides a component mounter/mounter, including: a component mounting/mounting machine body; a controller, comprising: at least one processor; and a memory communicatively coupled to the at least one processor; wherein the memory stores instructions executable by the at least one processor to cause the at least one processor to perform the method of placing a component on a substrate as described in any one of the above first aspects.
According to a fourth aspect, embodiments of the present invention provide a non-transitory computer readable storage medium storing computer instructions for causing a computer to perform a method for placing a component on a substrate as described in any one of the above first aspects.
According to a fifth aspect, there is provided a computer program product comprising a computer program stored on a non-transitory computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to perform a method of placing a component as described in any one of the above first aspects on a substrate.
According to the method and the device for placing the components on the substrate and the component attaching/inserting machine, provided by the embodiment of the invention, the attribute information of the components to be placed and the position information of the component picking device corresponding to the components to be placed are obtained from the attribute information of the component placing area on the substrate, the total displacement and/or the total time length of the movement of the components to be placed corresponding to different sequences are calculated, and the placing sequence with the shortest total displacement and/or total time length of the movement of the components to be placed is selected as the current placing sequence; and controlling the component picking device to pick and place the corresponding components according to the current placing sequence. The position of the component pickup device is comprehensively considered, the attribute of the placement area can be the position and/or the angle, the attribute of the component to be placed comprises the position, the angle, the pin and other information, the component placement sequence with the shortest total displacement and/or total duration is determined, the path of the component is optimized, and the efficiency of placing the component on the substrate can be improved. Therefore, the assembly efficiency of the electronic product is improved, and the production capacity is improved.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for placing a component on a substrate according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an apparatus for placing components on a substrate according to an embodiment of the invention;
fig. 3 is a schematic diagram showing a hardware configuration of a controller of a component mounter/mounter according to an embodiment of the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
An embodiment of the present invention provides a method for placing a component on a substrate, where the component is picked up by a component pickup apparatus and inserted or attached to a predetermined region of the substrate, as shown in fig. 1, the method includes the following steps:
and S10, acquiring the attribute information of the component placement area on the substrate. In this embodiment, the attribute information of the component placement region may include position information of the component placement region. In a specific embodiment, placing the component in the predetermined area of the substrate may include attaching the component to the surface of the substrate, or inserting the component onto the substrate. In this embodiment, the component may be a surface mount component, and may be a plug-in component, for example, a special-shaped component. In this embodiment, the substrate is provided with the positioning point, coordinates of the positioning point of the substrate can be obtained through the vision system, and coordinates of the component placement area are obtained according to the component placement area and the coordinates of the positioning point of the substrate. In this embodiment, the component placement region may also be provided with a positioning point alone, and the coordinates of the component placement region are calculated from the coordinates of the substrate positioning point and the coordinates of the positioning point of the component placement region. And determining the position information of the component placement area according to the coordinates of the placement area.
And S20, acquiring attribute information of the component to be placed and position information of a component pickup device corresponding to the component to be placed. In this embodiment, the component pickup device can be a plurality of, also can be one, for improving component placement efficiency, in this embodiment, the component pickup device is a plurality of, and the component pickup device can be the suction head for absorb the component, also can be the chuck for press from both sides and get the component. A plurality of components and parts pickup apparatus distribution position are different, and different components and parts pickup apparatus correspond can correspond the difference and wait to place components and parts, and different components and parts pickup apparatus also can correspond the same components and parts of waiting to place, and same components and parts pickup apparatus can correspond the difference and wait to place components and parts, can be according to the position of specific feeder to and the components and parts kind that the feeder bore is confirmed, in specific embodiment, can acquire the positional information who waits to place components and parts through vision system, angle information, pin information etc.. In this embodiment, the position of the component pickup apparatus closest to the component to be placed may be determined according to the placement position of the component to be placed.
And S30, calculating the total displacement and/or the total time length of the movement of the components to be placed corresponding to different placing sequences according to the property information of the placing areas, the property information of the components to be placed and the position information of the component picking device. In a specific embodiment, the component placement process includes moving the component pickup device from the initial position to a position above the component to be placed, picking the component to be placed, placing the component to be placed in the component placement area, and returning the component pickup device to the initial position. In this embodiment, the component pickup device may be configured to start from the initial position, place all the components to be placed at the preset positions corresponding to the initial position, and return to the placement flow at the initial position, where the component placement device passes through the total displacement. Since the average speed of the component pickup device is a predetermined speed, after the total displacement is obtained, the total duration in the placing process can be obtained according to the total displacement and the average speed. In this embodiment, the influence factors on the total displacement and/or the total duration may be multiple, and generally, the total displacement and/or the total duration may be calculated according to the distance between the to-be-placed component and the placement area, the rotation angle, and the position of the component pickup device corresponding to the to-be-placed component, and specifically, the distance between the to-be-placed component and the placement area is determined according to the position of the placement area on the substrate and the position of the to-be-placed component; and confirming the rotation angle of the component during placement according to the angle of the placement area and the angle of the component to be placed. In this embodiment, the total displacement and/or the total duration of movement of the component pickup device may be calculated, and the total displacement and/or the total duration of movement of the component to be placed may also be calculated, specifically, in an embodiment, since the component pickup device needs to place the component to be placed at a specified position of the substrate, the factor affecting the total displacement and/or the total duration may include the position of the placement area; because the component pickup device needs to pick up the component at the position of the component to be placed, the factors influencing the total displacement and/or the total duration can include the position of the placement area; the component pickup device needs to move from the initial position to the position of the component to be placed when picking up the component, and the factor affecting the total displacement and/or the total duration may include the position of the component pickup device. In another embodiment the component pickup device is moved between a position of the component to be placed and a position of the placement area, the position of the component to be placed and the position of the component pickup device having an influence on the total displacement and/or the total duration. In this embodiment, when placing the component and being special-shaped element, and/or placing regional presenting certain angle, and/or waiting to place the components and parts and have certain angle in the feeder, need adjust its angle to will wait to place the more accurate placing of components and parts and placing the region, the total duration can also include angle adjustment time.
And S40, selecting the placement sequence with the shortest total displacement and/or total duration of the movement of the components to be placed as the current placement sequence. In this embodiment, by calculating the total displacement and/or the total time length corresponding to different placement orders, the placement order in which the total displacement and/or the total time length is the shortest may be selected as the current placement order of the components. In this embodiment, the calculated placement order may also be used as a placement order to be determined, and may be compared with a total displacement and/or a total duration corresponding to a pre-stored placement order, in this embodiment, the pre-stored placement order may be an order in which a placement operation is performed last time, or may be a placement order set by a worker according to experience, and whether the total displacement and/or the total duration corresponding to the placement order to be determined is smaller than the total displacement and/or the total duration corresponding to the pre-set placement order is determined; and when the total displacement and/or the total time length corresponding to the placement sequence to be determined are/is smaller than the total displacement and/or the total time length corresponding to the preset placement sequence, taking the placement sequence to be determined as the current placement sequence, and when the total displacement and/or the total time length corresponding to the placement sequence to be determined are/is larger than the total displacement and/or the total time length corresponding to the preset placement sequence, placing the components by adopting the preset placement sequence.
And S50, controlling the component picking device to pick and place the corresponding components according to the current placing sequence.
Acquiring attribute information of components to be placed of attribute information of component placement areas on a substrate and position information of component pickup devices corresponding to the components to be placed, calculating total displacement and/or total time length of movement of the components to be placed corresponding to different sequences, and selecting a placement sequence with the shortest total displacement and/or total time length of movement of the components to be placed as a current placement sequence; and controlling the component picking device to pick and place the corresponding components according to the current placing sequence. The position of the component pickup device is comprehensively considered, the attribute of the placement area can be the position and/or the angle, the attribute of the component to be placed comprises the position, the angle, the pin and other information, the component placement sequence with the shortest total displacement and/or total duration is determined, the path of the component is optimized, and the efficiency of placing the component on the substrate can be improved. Therefore, the assembly efficiency of the electronic product is improved, and the production capacity is improved.
Because the demand of actual production technology, the kind and the quantity that the same base plate probably needs the components and parts of waiting to place are different, for improving and placing efficiency, in optional embodiment, before obtaining the regional attribute information is placed to the components and parts on the base plate, can confirm the kind and the quantity that wait to place the components and parts according to actual production technology demand earlier, specifically, obtain the components and parts and place data, in this embodiment, the components and parts are placed data and can be for the technological demand of production, can include the kind of the components and parts that production needs, quantity, place data such as position. The type and the quantity of the components to be placed are determined according to the placement data, in the embodiment, the components to be placed which are not used temporarily can be shielded according to the placement data, and the actual value of the components to be placed is not actually shielded and marked for processing.
In an optional embodiment, the components to be placed can be detected through a vision system, unqualified components are subjected to material throwing treatment, and are picked up again and placed. The quality of the product can be ensured. The placing efficiency is improved.
An embodiment of the present invention further provides a device for placing a component on a substrate, as shown in fig. 2, the device includes: a first obtaining module 100, configured to obtain attribute information of a component placement area on a substrate; the second obtaining module 200 is configured to obtain attribute information of the component to be placed and position information of a component pickup device corresponding to the component to be placed; the calculation module 300 is configured to calculate total displacement and/or total duration of movement of the components to be placed corresponding to different placement sequences according to the placement area attribute information, the attribute information of the components to be placed, and the position information of the component pickup device; the sequence confirmation module 400 is configured to select a placement sequence in which the total movement displacement and/or the total duration of the components to be placed are/is shortest as a current placement sequence; and the control placing module 500 is used for controlling the component picking device to pick and place the corresponding components according to the current placing sequence.
In an alternative embodiment, the placement area attribute information includes: position information of the placement area; the first acquisition module includes: the first acquisition unit is used for acquiring coordinates of a positioning point of the substrate; the second acquisition unit is used for acquiring coordinates of the component placement area; and the position determining unit is used for determining the position of the placement area on the substrate according to the positioning point coordinates and the placement area coordinates.
In an alternative embodiment, the placement area attribute information includes: position information of the placement area on the substrate and angle information of the placement area; the position information of the component to be placed includes: position information of the component to be placed and angle information of the component to be placed; the calculation module comprises: the distance determining unit is used for determining the distance between the component to be placed and the placing area according to the position information of the placing area on the substrate and the position information of the component to be placed; the angle determining unit is used for determining the rotation angle of the component during placement according to the angle information of the placement area and the angle information of the component to be placed; and the calculating unit is used for calculating the total displacement and/or the total duration of the movement of the component to be placed according to the distance between the component to be placed and the placing area, the rotating angle and the position information of the component pickup device corresponding to the component to be placed.
In an alternative embodiment, the sequence confirmation module comprises: the selection unit is used for selecting the placement sequence with the shortest total displacement and/or total duration of component movement as the placement sequence to be determined; the judging unit is used for judging whether the total displacement and/or the total time length corresponding to the placement sequence to be determined is smaller than the total displacement and/or the total time length corresponding to the preset placement sequence; the first determining unit is used for taking the placement sequence to be determined as the current placement sequence when the total displacement and/or the total duration corresponding to the placement sequence to be determined is less than the total displacement and/or the total duration corresponding to the preset placement sequence; and the second determining unit is used for taking the pre-stored placing sequence as the current placing sequence when the to-be-determined placing sequence corresponds to the total movement displacement and/or the total time length is greater than the total displacement and/or the total time length corresponding to the preset placing sequence.
In an optional embodiment, the apparatus for placing a component on a substrate further includes: the third acquisition module is used for acquiring component placement data; and the determining module is used for determining the types and the quantity of the components to be placed according to the placing data.
The embodiment of the invention also provides a component attaching/inserting machine which comprises a component attaching/inserting machine body and a controller.
Fig. 3 is a schematic diagram of a hardware structure of a controller of a component mounter/mounter according to an embodiment of the present invention, and as shown in fig. 3, the controller includes one or more processors 310 and a memory 320, where one processor 310 is taken as an example in fig. 3.
The controller may further include: an input device 330 and an output device 340.
The processor 310, the memory 320, the input device 330, and the output device 340 may be connected by a bus or other means, such as the bus connection in fig. 3.
The memory 320 is a non-transitory computer readable storage medium, and can be used to store non-transitory software programs, non-transitory computer executable programs, and modules, such as program instructions/modules corresponding to the method for placing components on a substrate in the embodiments of the present application. The processor 310 executes various functional applications of the server and data processing by running the non-transitory software programs, instructions and modules stored in the memory 320, so as to implement the method for placing the components on the substrate according to the above-described method embodiments.
The memory 320 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created according to use of a processing device operated by XXX, and the like. Further, the memory 320 may include high speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, memory 320 may optionally include memory located remotely from processor 310, which may be connected to devices having components disposed on a substrate via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The input device 330 may receive input numeric or character information and generate key signal inputs related to user settings and function control of the processing device of XXX. The output device 340 may include a display device such as a display screen.
The one or more modules are stored in the memory 320 and, when executed by the one or more processors 310, perform the method shown in fig. 1.
The product can execute the method provided by the embodiment of the invention, and has corresponding functional modules and beneficial effects of the execution method. For details of the technique not described in detail in the embodiment, reference may be made to the related description in the embodiment shown in fig. 1.
The embodiment of the invention also provides a non-transitory computer storage medium, wherein the computer storage medium stores computer executable instructions which can execute the method for placing the component on the substrate in any method embodiment. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a Flash Memory (Flash Memory), a hard disk (hard disk Drive, abbreviated as HDD), a Solid State Drive (SSD), or the like; the storage medium may also comprise a combination of memories of the kind described above.
Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope defined by the appended claims.
Claims (9)
1. A method for placing a component on a substrate, the component being picked up by a component pickup apparatus and being mounted on or attached to a predetermined area of the substrate, the method comprising:
acquiring attribute information of a component placement area on the substrate;
acquiring attribute information of a component to be placed and position information of a component pickup device corresponding to the component to be placed;
calculating the total displacement and/or the total duration of movement of the components to be placed corresponding to different placing sequences according to the property information of the placing area, the property information of the components to be placed and the position information of the component picking device;
selecting the placement sequence with the shortest total movement displacement and/or total duration of the components to be placed as the current placement sequence;
controlling the component picking device to pick and place the corresponding components according to the current placing sequence;
the placement area attribute information includes: position information of the placement area and angle information of the placement area;
the attribute information of the component to be placed comprises: position information of the component to be placed and angle information of the component to be placed;
the calculating the total displacement and/or the total duration of the movement of the components to be placed corresponding to different placing sequences according to the property information of the placing areas, the property information of the components to be placed and the position information of the component picking device comprises:
determining the distance between the component to be placed and the placement area according to the position information of the placement area on the substrate and the position information of the component to be placed;
confirming the rotation angle of the component during placement according to the angle information of the placement area and the angle information of the component to be placed;
and calculating the total displacement and/or the total duration of the movement of the component to be placed according to the distance between the component to be placed and the placing area, the rotation angle and the position information of the component pickup device corresponding to the component to be placed.
2. The method for placing a component on a substrate according to claim 1,
the placement area attribute information includes: position information of the placement area;
the acquiring of the attribute information of the component placement area on the substrate includes:
acquiring coordinates of a positioning point of a substrate;
obtaining coordinates of a component placement area;
and determining the position information of the placement area according to the positioning point coordinates and the placement area coordinates.
3. The method for placing the components on the substrate according to claim 1, wherein the selecting the placement sequence in which the total displacement and/or the total duration of movement of the components to be placed is the shortest comprises:
selecting the placement sequence with the shortest total displacement and/or total duration of the movement of the components as the placement sequence to be determined;
judging whether the total displacement and/or the total time length corresponding to the placement sequence to be determined is smaller than the total displacement and/or the total time length corresponding to a preset placement sequence;
and when the total displacement and/or the total duration corresponding to the placement sequence to be determined is less than the total displacement and/or the total duration corresponding to the preset placement sequence, taking the placement sequence to be determined as the current placement sequence.
4. A method for placing components on a substrate according to claim 3, wherein when the placement order to be determined corresponds to a total movement displacement and/or a total length of time greater than a total displacement and/or a total length of time corresponding to the preset placement order, the preset placement order is taken as the current placement order.
5. The method for placing a component on a substrate according to any one of claims 1 to 4, wherein before the acquiring of the component placement region attribute information on the substrate, the method comprises:
acquiring the component placement data;
and determining the types and the number of the components to be placed according to the placement data.
6. A device for placing a component on a substrate is characterized by comprising:
the first acquisition module is used for acquiring attribute information of a component placement area on the substrate;
the second acquisition module is used for acquiring attribute information of the component to be placed and position information of a component pickup device corresponding to the component to be placed;
the calculation module is used for calculating the total displacement and/or the total duration of movement of the components to be placed corresponding to different placement sequences according to the placement area attribute information, the attribute information of the components to be placed and the position information of the component pickup device;
the sequence confirmation module is used for selecting the placement sequence with the shortest total movement displacement and/or total duration of the components to be placed as the current placement sequence;
the control placement module is used for controlling the component picking device to pick and place the corresponding components according to the current placement sequence;
the placement area attribute information includes: position information of a placement area on the substrate and angle information of the placement area;
the attribute information of the component to be placed comprises: position information of the component to be placed and angle information of the component to be placed;
the calculation module comprises:
the distance determining unit is used for determining the distance between the component to be placed and the placing area according to the position information of the placing area on the substrate and the position information of the component to be placed;
the angle determining unit is used for determining the rotation angle of the component when the component is placed according to the angle information of the placing area and the angle information of the component to be placed;
and the calculating unit is used for calculating the total displacement and/or the total duration of the movement of the component to be placed according to the distance between the component to be placed and the placing area, the rotating angle and the position information of the component picking device corresponding to the component to be placed.
7. The device for placing a component on a substrate according to claim 6,
the first obtaining module comprises:
the first acquisition unit is used for acquiring coordinates of a positioning point of the substrate;
the second acquisition unit is used for acquiring coordinates of the component placement area;
and the position determining unit is used for determining the position of the placing area on the substrate according to the positioning point coordinates and the placing area coordinates.
8. A component attaching/inserting machine is characterized by comprising:
a component mounting/mounting machine body;
a controller, comprising: at least one processor; and a memory communicatively coupled to the at least one processor; wherein the memory stores instructions executable by the at least one processor to cause the at least one processor to perform a method of placing a component on a substrate according to any one of claims 1-5.
9. A non-transitory computer readable storage medium storing computer instructions for causing a computer to perform a method of placing a component according to any one of claims 1 to 5 on a substrate.
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