JP2009147018A - Component mounting time simulation method, component mounting time simulation device, and component mounting machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting time simulation method that can simulate a high-precision component mounting time and improves precision of simulation of a time needed to recognize, especially, a component. <P>SOLUTION: Disclosed is the component mounting time simulation method for simulating the mounting time when a component mounting machine equipped with a recognition means for recognizing a component sucked by a suction nozzle mounts the component on a substrate, the component mounting time simulation method including: an acquisition step (S101) of acquiring a predicted recognition time corresponding to a predetermined component type by reference to an information table showing predicted recognition times as times predicted to be needed to recognize components for each component type stored in a storage means; and a simulation step (S104) of simulating a mounting time by regarding a predicted recognition time acquired in the acquisition step as a time needed to recognize a component corresponding to a component type. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a component mounting time simulation method for simulating the mounting time of a component mounter that produces a mounting substrate by mounting components on a substrate.

  In a component mounter that produces a mounting substrate by mounting components on a substrate, a component mounting time simulation is performed for the purpose of grasping in advance the time required for component mounting. Specifically, the operation until the component supplied from the component supply unit is mounted on a predetermined mounting point on the board is disassembled, the required time is calculated for each disassembled operation, and the constraints between each operation The mounting time is calculated considering the conditions. The simulation result of the component mounting time obtained in this way is used for production plan creation of the production line including the component mounting machine, verification of optimization of component mounting conditions, and the like.

  However, the component mounting time obtained by the simulation as described above may deviate from the component mounting time required for actual operation due to various factors such as a change with time.

Therefore, focusing on the fact that the mounting time of components changes with time, the simulation parameters related to each operation related to component mounting of the component mounting machine are not fixed and change according to changes over time. There has been proposed a method for improving the accuracy of the simulation by making it (see Patent Document 1).
Japanese Patent Laid-Open No. 2003-17897

  However, in the above-described conventional method, it has not been clarified how to improve the simulation accuracy with respect to the time (recognition time) necessary for recognizing the component sucked by the suction nozzle with a camera or the like. Conventionally, in the component mounting time simulation, the component recognition time is not an important factor for improving the accuracy of the simulation, and the recognition time is ignored or calculated as constant. However, recently, as the types of components mounted by component mounters increase, there are more opportunities to mount odd-shaped components such as connectors on the board, so that the conventional recognition time is ignored or component mounting is constant. If time is simulated, sufficient accuracy cannot be obtained.

  Therefore, the present invention has been made in view of such a problem, and enables a highly accurate simulation of component mounting time, in particular, a component mounting time simulation that improves the accuracy of simulation of the time required for component recognition. The purpose is to provide methods.

  In order to achieve the above object, a component mounting time simulation method according to the present invention is a component that simulates a mounting time when a component is mounted on a board by a component mounting machine that includes a recognition unit that recognizes a component sucked by a suction nozzle. Refer to a first information table that is a mounting time simulation method and shows a first expected recognition time, which is a time expected to be recognized for each part type stored in the storage means. Then, an acquisition step of acquiring the first predicted recognition time corresponding to a predetermined component type, and a simulation step of simulating the mounting time using the first predicted recognition time acquired in the acquisition step. It is characterized by including.

  As a result, it is possible to perform a highly accurate simulation of the component mounting time by using the expected recognition time stored for each component type in a component that is difficult to simulate with a uniform component recognition time. That is, the simulation is executed considering that the recognition time varies depending on the component type. Furthermore, by using the highly accurate simulation results of component mounting time obtained in this way, component mounting conditions are optimized to reduce the time required for component mounting during actual operation than before. We can expect the effect.

  The component mounting time simulation method further measures the component recognition time for each component type in the component mounter, and registers the measured time as the first expected recognition time in the first information table. Preferably a registration step is included.

  This makes it possible to actually measure the time required to recognize a component on a component mounter for a component for which it is difficult to predict the component recognition time, and to perform a component mounting time simulation using the measured time. Become. As a result, accurate component mounting time simulation based on actual values instead of theoretical values can be performed.

  The first information table further includes a recognition type number for identifying the type of algorithm for recognizing the positional deviation of the component adsorption state for each component type. In the acquisition step, the component type When the first expected recognition time corresponding to the second cannot be obtained, the recognition type number is obtained, and the second expected recognition time is indicated for each recognition type number stored in the storage means. It is preferable to obtain the second expected recognition time corresponding to the recognition type number by referring to the information table.

  As a result, even if the expected recognition time for each component type is registered for only some of the component types, a highly accurate simulation can be realized for the registered component types.

  In the registration step, it is preferable that the registration is performed for a part type of a deformed part which is an irregularly shaped part.

  This makes it possible to register the expected recognition time for each component type, centering on irregularly shaped parts such as connectors, for which it is difficult to predict the recognition time of the part using a recognition algorithm, etc. A balance of improvement can be achieved.

  The present invention can also be realized as a component mounting time simulation device or a component mounting machine using steps included in such a component mounting time simulation method. Further, it can be realized as a program for causing a computer to execute the steps included in the component mounting time simulation method. Such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a communication network such as the Internet.

  According to the present invention, it is possible to improve the accuracy of simulation of component mounting time, in particular, it is possible to improve the accuracy of simulation of time required for component recognition.

Hereinafter, a component mounter according to an embodiment of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an external view showing a configuration of a component mounter in the present embodiment. A component mounter 100 shown in the figure is an example of a component mounter according to the present invention, and is characterized by having a highly accurate mounting time simulation function as will be described later. The component mounter 100 receives a circuit board (hereinafter simply referred to as a board) 20 from upstream, mounts components on the board 20, and sends the board 20 on which the components are mounted downstream. In addition, the board | substrate 20 with which components were mounted by the component mounting machine 100 is hereafter called a mounting board. In addition, the component mounting machine 100 includes an operation panel 105 for receiving an operation from an operator and displaying an operation result.

  FIG. 2 is a plan view showing a main mechanical configuration inside the component mounter 100. The component mounting machine 100 includes two mounting units 110a and 110b for mounting components on the substrate 20, and a pair of substrate transport rails 122a and 122b for transporting the substrate 20. The two mounting units 110a and 110b cooperatively mount components on the substrate 20 on the substrate transport rails 122a and 122b.

  The mounting unit 110a and the mounting unit 110b have the same configuration. That is, the mounting units 110a and 110b each include a component supply unit 115, a component recognition camera 116, and a head 112.

  In this embodiment, an example in which the head 112 is provided for each mounting unit will be described. However, a component mounter to which the present invention is applied is not limited to such a component mounter. For example, the present invention can be applied to a component mounter having only one head 112.

  Here, a detailed configuration of the mounting unit 110a will be described. The detailed configuration of the mounting unit 110b is the same as that of the mounting unit 110a, and will not be described.

  The component supply unit 115 includes an array of a plurality of component cassettes (feeders) 114 that store component tapes. The component cassettes 114 of the component supply unit 115 are arranged along the conveyance direction (X-axis direction) of the substrate 20. The component tape is, for example, a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound on a reel or the like. The parts arranged on the part tape are, for example, chip parts, specifically, 0402 chip parts, 1005 chip parts, and the like.

  The head 112 is a head called a multi-mounted head, for example, and can move freely in the X-axis direction and the Y-axis direction. Further, the head 112 can include a plurality of suction nozzles (hereinafter simply referred to as nozzles), and for example, ten components can be sucked from the component supply unit 115 and mounted on the substrate 20.

  The substrate transport rails 122a and 122b are arranged so as to be parallel to the X-axis direction. Here, the substrate transport rail 122a is fixed, and the substrate transport rail 122b moves in the Y-axis direction according to the size (width) of the substrate 20 to be transported. The board 20 carried into the component mounting machine 100 is carried along the pair of board carrying rails 122a and 122b and stopped by a stopper or the like.

  The component recognition camera 116 is used to photograph the component sucked by the head 112 and inspect the shape and suction state of the component two-dimensionally or three-dimensionally. The component recognition camera 116 is disposed near the center along the X-axis direction in the component supply unit 115.

  In the component mounting machine 100 configured in this manner, “suction” of the component supplied from the component supply unit 115 by the head 112, “imaging” and “recognition” of the suctioned component by the component recognition camera 116, and the component recognition camera A series of operations such as “movement” by the head 112 from 116 to the substrate 20 and “mounting” of the component adsorbed by the head 112 to each mounting point on the substrate 20 are repeatedly executed, so that a plurality of components can be mounted on the substrate. 20 is implemented. A group of components that are attracted to the head by a series of operations executed here or a series of operations per one time is hereinafter referred to as a task. The mounting point is a position where a component on the board 20 is to be mounted. It is possible to perform accurate simulation of component mounting time by accurately predicting such operations of “adsorption”, “imaging”, “recognition”, “movement”, and “mounting” of components. Become.

  FIG. 3 is a diagram for explaining component recognition by the component recognition camera 116, which is an operation to be improved in accuracy in the component mounting time simulation according to the present invention. The component recognition camera 116 includes a 2D camera that captures a two-dimensional image and a 3D camera that can also detect height information. Note that the component recognition camera 116 on which only one of the 2D camera or the 3D camera is mounted may be used. As shown in the drawing, when the head 112 moves on the component recognition camera 116, the component recognition camera 116 images the component using the 2D camera or the 3D camera. Here, since the recognition scanning speed (speed at which the head 112 moves above the component recognition camera 116) depends on the camera to be imaged, it is possible to simulate the time required for imaging the component relatively easily. In the present embodiment, a case will be described in which the component recognition camera 116 images a component when the head 112 moves on the component recognition camera 116 at a constant speed. However, component mounting to which the present invention is applied is described. The machine is not limited to such a component mounting machine. For example, when the head 112 pauses on the component recognition camera 116, the component recognition camera 116 may image the component.

  By analyzing the shape of the component from the image thus captured, it is confirmed whether the sucked component is the component to be mounted or not. In addition, by analyzing the difference between the position of the component sucked by the nozzle 140 and the position that should have been sucked from the captured image, the necessity of correction when mounting the component on the substrate 20 The amount to be corrected is calculated. Such image analysis, component confirmation, calculation of the correction amount at the time of mounting, etc. are referred to as component recognition. The component recognition can be executed in parallel with the head 112 moving from the component recognition camera 116 to the mounting point on the substrate 20 after imaging, and both the component recognition and the movement to the mounting point are completed. By doing so, it becomes possible to mount components. In addition, the order of the recognized parts is the same as the order of the picked-up parts.

  The time required for recognition of this component (recognition time) is almost the same time if a recognition type number, which is a number for determining a recognition algorithm, is determined for a chip component of 1005 shape or the like. Here, the recognition algorithm refers to an algorithm or the like for recognizing the shape of the picked-up component and recognizing the positional deviation of the picked-up state of the component in accordance with the type of camera to be imaged and the image pickup condition (lighting etc.) Say. However, with special parts called odd-shaped parts, the recognition time is different even if the recognition type number is the same. Here, the irregular shaped parts are irregularly shaped parts that are not general-purpose parts, and are, for example, a connector, a BGA (Ball Grid Array), a capacitor, and the like as shown in FIG. In such a deformed part, when a simulation is performed using a uniform expected recognition time set for each recognition type number, there is an error between the mounting time obtained by the simulation and the mounting time required for actual operation. There is a tendency to grow. Therefore, in the present embodiment, as will be described later, in a part having a different recognition time even if the recognition type number is the same as a deformed part, the expected recognition time corresponding to the part type instead of the recognition type number By using, simulation accuracy can be improved.

  FIG. 4 is a diagram illustrating an example of a typical deformed part. The deformed parts as shown here have the same recognition type number, and are recognized by using the same algorithm called deformed complex recognition. In general, simulation is often performed with the expected recognition time being uniformly about 100 ms.

  FIG. 4A is an example of the irregular connector. A connector is a connection component used when connecting cables, cables and boards, and boards. As shown in the figure, it is difficult to predict the recognition time in advance in the case of a deformed connector having two terminals or different lengths depending on the terminal. Depending on conditions, the recognition time required for actual operation is about 200 ms, which may take longer than expected.

  FIG. 4B is an example of a variant BGA. BGA is a component in which terminals are arranged in a matrix. As shown in the figure, it is difficult to predict the recognition time in advance in the case of a deformed BGA in which the terminal interval is not constant or the terminal omission cannot be patterned. Depending on conditions, the recognition time required for actual operation is about 950 ms, which may take longer than expected.

  FIG. 4C is an example of a deformed electrolytic capacitor. As shown in the figure, when the end of the cylindrical main body is provided with a shallow dish-shaped bottom, it is difficult to predict the recognition time in advance. Depending on the conditions, the recognition time required for actual operation is about 50 ms, and the recognition may be completed in a shorter time than expected.

  In the above-described irregularly shaped parts, prior to actual mounting of the parts, there is often a work called teaching of trying to recognize the parts using an actual machine and acquiring parameters necessary for the recognition.

  FIG. 5 is a block diagram showing a functional configuration of a component mounter 100 having a component mounting time simulation function according to the present invention. The component mounter 100 includes a mechanism unit 150, a control unit 151, a display unit 152, an input unit 153, a storage unit 154, a registration unit 155, an acquisition unit 156, a simulation unit 157, and a communication unit 158.

  The mechanism unit 150 is a set of mechanism components such as the head 112, the component supply unit 115, and the component recognition camera 116 shown in FIG.

  The control unit 151 includes, for example, a memory storing a control program, a microcomputer, and the like, and the control program controls the mechanism unit 150 in accordance with a preset mounting condition, so that the components are sequentially supplied to the board 20 that is sequentially loaded. Is mounted and the mounting board is carried downstream.

  The display unit 152 includes, for example, the operation panel 105 and the liquid crystal display shown in FIG. 1, displays data stored in the storage unit 154 and the like, and displays the result of simulation executed by the simulation unit 157. To do.

  The input unit 153 includes, for example, the operation panel 105 and a keyboard shown in FIG. 1, and receives an instruction to start teaching a part from the operator. The operation result received by the input unit 153 is notified to the control unit 151, the registration unit 155, and the like.

  The storage unit 154 includes, for example, a readable / writable memory, and is an example of a storage unit that stores the component library 154a, the recognition type data 154b, the mounting point data 154c, and the mounting condition data 154d. Details of each data will be described later.

  The registration unit 155 is a processing unit realized by, for example, a memory or a microcomputer, and is an example of a registration unit that registers the expected recognition time in the component library 154a. The registration unit 155 displays the component recognition time measured by the component recognition operation performed by the mechanism unit 150 and the control unit 151 according to the instruction received by the input unit 153 or the component recognition time specified by the operator. The acquired component recognition time is registered in the component library 154a as the expected recognition time.

  The acquisition unit 156 is a processing unit realized by, for example, a memory or a microcomputer, and is an example of an acquisition unit that acquires the expected recognition time from the component library 154a or the recognition type data 154b.

  The simulation unit 157 is a processing unit realized by, for example, a memory or a microcomputer, and is an example of a simulation unit that simulates a component mounting time based on the mounting condition data 154d and the like. The simulation unit 157 performs a simulation of the mounting time using the expected recognition time acquired by the acquisition unit 156.

  The communication unit 158 is a processing unit that communicates with other information terminals and the like. For example, the mounting point data 154c, the mounting condition data 154d, and the like are acquired from a device that determines the mounting conditions, and the storage unit 154 stores them. To store.

  FIG. 6 is a diagram illustrating an example of the component library 154a illustrated in FIG. The component library 154a is an example of an information table in which an expected recognition time and a recognition type number are shown for each component type, and collects unique information for each of all the component types that can be handled by the component mounter 100. Library. As shown in the figure, the part size in the part type (part name), the recognition type number for identifying the type of algorithm for recognizing the misalignment of the part suction state, and the part recognition as shown in FIG. It consists of an expected recognition time which is expected to be required for the above and other constraint information. For example, it is shown that the expected recognition time of a component whose component type is 4TR is 150 ms, and the recognition type number is RX. Note that the expected recognition time may not be registered because the expected recognition time can be specified from the recognition algorithm (recognition type number), such as a component type such as 0603CR in the figure. Even if the predicted recognition time can be specified from the recognition algorithm (recognition type number), the predicted recognition time may be registered in the component library 154a.

  FIG. 7 is a diagram illustrating an example of the recognition type data 154b illustrated in FIG. This recognition type data 154b is an example of an information table in which an expected recognition time is shown for each recognition type number. As shown in the figure, the recognition type data 154b is a two-dimensional, three-dimensional, or the like used for imaging a component at the recognition type number. It consists of a camera type that is a type of camera, an expected recognition time that is expected to be required for component recognition as shown in FIG. By referring to the recognition type data 154b, it is possible to specify the expected recognition time of a component type whose expected recognition time is not registered in the component library 154a.

  FIG. 8 is a diagram illustrating an example of the mounting point data 154c illustrated in FIG. The mounting point data 154c is data acquired by the communication unit 158 from a device or the like that determines mounting conditions, and indicates information regarding mounting points of all components to be mounted on the board 20. One mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, control data φi, and a mounting angle θi. Here, the component type corresponds to the component name in the component library 154a (see FIG. 6), the X coordinate and the Y coordinate are the coordinates of the mounting point, and the control data φi includes constraint information related to the mounting of the component, for example, The types of nozzles 140 that can be used, the maximum movement acceleration of the head 112, and the like are shown. The mounting angle θi indicates an angle at which the nozzle 140 that sucks the component of the component type ci should rotate.

  FIG. 9 is a diagram illustrating an example of the mounting condition data 154d illustrated in FIG. The mounting condition data 154d is data acquired from a device or the like that determines the mounting conditions by the communication unit 158. The arrangement of the component cassettes 114 (component arrangement) in the component supply unit 115, the mounting order of each task of the head 112, and the like. Indicates. For example, the mounting condition data 154d indicates that the component supply unit A has the component type c1 in the A1th and the component type c2 in the A2th from one side in the X-axis direction as the component arrangement. Indicates that there is a part type c1 at the B1th from one side in the X-axis direction, and a part type c2 at the B2th. The mounting condition data 154d indicates that the task of the task number Ta1 including the components of the component types c1 to c4 is mounted on the mounting points p1 to p4 as the mounting order of the head A, and then the components of the component types c9 to c12 are mounted. The task with the task number Ta2 is attached to the mounting points p5 to p8, and then the task with the task number Ta3 including the parts of the component types c17 to c20 is attached to the mounting points p9 to p12. Since the mounting order of the head B is the same as that of the head A, description thereof is omitted.

  Next, the basic operation of the component mounter 100 in the present embodiment configured as described above will be described.

  FIG. 10 is a flowchart showing a processing procedure related to the simulation of the component mounting time by the component mounting machine 100.

  First, the acquiring unit 156 acquires the expected recognition time set for each component type by referring to the component library 154a (S101). Here, if the expected recognition time cannot be acquired because the expected recognition time is not registered in the part library 154a (No in S102), the acquisition unit 156 recognizes the part type from the part library 154a. By acquiring the type number and referring to the recognized type data 154b, the expected recognition time corresponding to the acquired recognized type number is acquired (S103). On the other hand, if the expected recognition time has been acquired (Yes in S102), the process proceeds to step S104 without performing the process in step S103.

  And the simulation part 157 performs the simulation of the mounting time of components using the prediction recognition time acquired by step S101 or step S103 (S104).

  Finally, the simulation unit 157 displays the mounting time obtained by the simulation on the display unit 152 (S105) and ends.

  In the mounting time simulation in step S104, the expected recognition time of the component type included in one task is acquired in the processing in steps S101 to S103, and “suction”, “imaging”, “recognition”, “ Each time required for operations such as “movement” and “mounting” is calculated, taking into consideration the constraint conditions such as the imaging order and mounting order of the components in the task indicated in the mechanical constraint conditions and the mounting condition data 154d Integration time is required by integrating. For example, in the task of mounting a single component on the board 20, the times of “suction”, “imaging”, “recognition”, “movement” and “mounting” are calculated as 100 ms, 100 ms, 50 ms, 100 ms and 100 ms, respectively. In this case, the time required for executing this task is 400 ms. Here, the sum of the time required for each operation is not 450 ms. Since the operations of “recognition” and “movement” can be executed in parallel, the larger of the time required for “recognition” and “movement” This is because the summation may be performed considering only the time. Such operations that can be executed concurrently are also present in the relationship between tasks with different mounting units. That is, when there is one task to be executed in each of the mounting units 110a and 110b for mounting components on the same board 20, the simple total of the time required for each task does not become the mounting time. For example, when the mounting unit 110a is performing “mounting” of a component, the mounting unit 110b can perform “suction” and “recognition” of the component.

  FIG. 11 is a diagram showing an example in which the accuracy of the simulation of the component mounting time is improved by the processing procedure shown in FIG. In the figure, in one task of “adsorption” of four parts, “imaging” and “recognition” of the adsorbed parts, and “movement” and “installation” of the adsorbed parts to each mounting point of the substrate 20. The time required for each operation is shown by a bar graph. In this figure, the task to be simulated is a task for mounting a deformed part as shown in FIG.

  FIG. 11A is a graph showing the time required for task execution when the component mounting time is simulated by the conventional method, that is, when the expected recognition time for irregularly shaped components is simulated. First, the head 112 sucks the odd-shaped parts c1, c2, c3, and c4 from the parts supply unit 115. The time required for this “adsorption” is simulated based on information obtained from the mounting condition data 154d and the like, starts at time t0, and ends at time t1.

  Next, when the “suction” is completed, the head 112 passes over the component recognition camera 116 at a constant speed while holding the suctioned component. During the passage, the component recognition camera 116 images the component. The time required for this “imaging” is simulated using the recognition scan speed corresponding to the camera type specified by referring to the component library 154a, the recognition type data 154b, etc., and at the time t1 when the “suction” is completed. Start and end at time t2.

  When the “imaging” is completed, the component recognition camera 116 recognizes the components in the order of the captured components from the captured image, that is, the odd-shaped components c1, c2, c3, and c4. The time required for this “recognition” has been conventionally simulated using the expected recognition time corresponding to the part recognition number, that is, the same expected recognition time for the deformed parts c1, c2, c3, and c4, and the time when “imaging” is completed. It starts at t2 and ends at time t4.

  On the other hand, when the “imaging” is completed, the head 112 sequentially moves to the mounting point on the board 20 of the component to be mounted in parallel with the “recognition” operation. Then, the head 112 is mounted on the mounting points on the board 20 in order from the component for which “movement” is completed and “recognition” is completed. That is, the head 112 first moves to the mounting point of the deformed component c1, and after the “recognition” of the deformed component c1 is completed, the deformed component c1 is mounted on the mounting point. Next, when the mounting of the deformed component c1 is completed, the head 112 moves to the mounting point of the deformed component c2, and after the “recognition” of the deformed component c2 is completed, the head 112 mounts the deformed component c2 on the mounting point. Subsequently, with respect to the odd-shaped parts c3 and c4, the head 112 sequentially performs “move” and “mounting” similarly to the odd-shaped parts c1 and c2. As a result, the odd-shaped parts c1, c2, c3, c4 are mounted on the board 20, and the task is completed. Here, the time required for “move” is simulated so as to move at a maximum speed or less corresponding to the sucked parts obtained from the part library 154a or the like. In addition, the time required for “mounting” is simulated using an estimated mounting time corresponding to a component to be mounted. As shown in the figure, “movement” and “mounting” by the head 112 start at time t2 when “imaging” ends, and end at time t5. Focusing on the deformed part c1, “recognition” and “movement” both start at time t2 when “imaging” ends, and end at time t3. Then, the “mounting” of the deformed part c1 starts at time t3 when both “recognition” and “movement” are completed.

  In the simulation with the uniform recognition time of the deformed part as described above, when the recognition time required during actual operation is not uniform, that is, as shown in the figure, the recognition time of the deformed part c1 is the recognition time of other parts. If it is longer and ends at time t3 ′ instead of time t3, an error in recognition time occurs between the simulation and the actual time.

  FIG. 11B is a graph showing the time required for task execution when simulation is performed according to the processing procedure shown in FIG. 10, that is, when simulation is performed by setting the expected recognition time for deformed parts for each part type. It is. “Suction” and “imaging” are the same as in FIG.

  As shown in the figure, since the simulation is performed using the expected recognition time determined for each part type instead of the uniformly set expected recognition time, the recognition time of the deformed part c1 is longer than the other shaped parts. Simulation is also possible. As a result, the time at which “recognition” of the deformed part c1 ends is time t3 ′, and a result equal to or close to the time required for actual operation is obtained.

  Since “attachment” can be started by the end of “recognition”, the start time is from time t3 to time t3 ′. Due to the delay of the “mounting” start time, the “moving” and “mounting” start time and end time of the subsequent deformed parts c2, c3, and c4 are delayed. As a result, the task end time is also changed from time t5 obtained in FIG. 11A to time t5 '.

  From the above, if the simulation is performed using the same estimated recognition time for all the deformed parts as in the past, the simulation is performed for the deformed part (the deformed part c1 in the figure) whose recognition time required for actual operation is different from other deformed parts. An error in recognition time occurs between Then, it can be seen that the error generated in the recognition also affects the simulation of the subsequent operation, and as a result, an error occurs in the entire mounting time. On the other hand, simulation using the expected recognition time set for each component type can suppress the occurrence of recognition time errors even if the recognition time is different from other irregular parts. The accuracy of simulation can be increased.

  FIG. 12 is a diagram for explaining the effect of the component mounting time simulation result on the optimization of the component mounting conditions.

  FIG. 12A is a graph similar to FIG. 11B, and is a graph showing the time required for task execution when a simulation is performed according to the processing procedure shown in FIG. 10. As shown in the figure, when component mounting is executed under the simulated mounting conditions, the head 112 that has finished “moving” the deformed component c1 to the mounting point on the substrate 20 at time t3 is displayed on the head of the deformed component c1. It can be seen that it is necessary to wait on the substrate 20 until time t3 ′ at which “recognition” ends. Such a waiting time of the head 112 can be grasped before mounting for the first time by performing a highly accurate simulation as shown in FIG. The mounting time can be reduced by optimizing the mounting conditions so as to reduce the waiting time of the head 112.

  FIG. 12B is a graph showing an example in which the mounting time is shortened by optimizing the mounting conditions. As shown in the figure, from the time t3 to the time t3 ′ by changing the order of the components that execute “recognition”, that is, by changing the mounting condition so that the recognition of c1 having a long recognition time is performed last. The waiting time of the generated head 112 does not occur. Then, the final task end time can be advanced from time t5 'to time t5 ".

  As described above, by improving the accuracy of the simulation of the component mounting time, the effect of optimizing the component mounting conditions can be enhanced.

  In order to enable such a highly accurate simulation, it is assumed that the accuracy of the expected recognition time registered for each component type is high. However, it is difficult for the odd-shaped part as shown in FIG. 4 to specify the recognition time in advance from information such as part dimensions, the number and color of leads, and lead pitch dimensions. Therefore, it is desirable to measure the recognition time when teaching with an actual machine and use the measured recognition time as the expected recognition time for each component type.

  FIG. 13 is a flowchart showing a processing procedure related to registration of the recognition time for each component type actually measured by the component mounter 100.

  First, when receiving a start instruction from the input unit 153 or the like, the control unit 151 controls the head 112 to cause suction of a component instructed from the component supply unit 115 (S201). Next, the control unit 151 moves the head 112 that sucks the component above the component recognition camera 116, and causes the component recognition camera 116 to capture and recognize the sucked component (S202). Then, the registration unit 155 measures the time required for recognition and registers the measured time in the component library 154a stored in the storage unit 154 as the expected recognition time of the corresponding component type. In addition, the registration unit 155 displays the measured time on the display unit 152 (S203).

  By the above processing, as shown in FIG. 14, for example, when the operator presses the teaching button and instructs to start measurement of the recognition time of the component, the recognition of the component is actually executed, and the time required for the recognition is It is measured. The measured recognition time is displayed on the screen and is stored in the component library 154a as the expected recognition time.

  In this way, by registering the recognition time of parts actually measured in the actual machine in the information table as the expected recognition time for each part type, predictive recognition is possible even for odd-shaped parts that are difficult to predict in advance. It becomes possible to increase the accuracy of time.

  As described above, according to the present embodiment, in a part such as a deformed part for which it is difficult to uniformly predict the part recognition time, the part recognition time actually measured by the part mounting machine is used. By performing the mounting time simulation, it is possible to perform a highly accurate component mounting time simulation. Furthermore, by using the highly accurate simulation results of component mounting time obtained in this way, component mounting conditions can be optimized to reduce mounting time required for actual operation than before. It becomes.

  As described above, the component mounter according to the present invention has been described based on the embodiment, but the present invention is not limited to the present embodiment. Unless it deviates from the meaning of this invention, the form which carried out the various deformation | transformation which those skilled in the art can think to this embodiment, and the structure constructed | assembled combining the component in different embodiment is also contained in the scope of the present invention. .

  For example, in the present embodiment, the component mounter performs the simulation of the component mounting time, but the component mounting time simulation device may perform the simulation. In this case, the component mounting time simulation apparatus is connected to the component mounter via a network, and includes the storage unit 154, the acquisition unit 156, and the simulation unit 157 illustrated in FIG. The storage unit 154 provided in the component mounting machine stores a component library 154a, recognition type data 154b, mounting point data 154c, and mounting condition data 154d. In addition, the registration unit 155 included in the component mounter registers the component recognition time in the component library 154a stored in the storage unit 154 included in the component mounting time simulation apparatus via the network.

  The present invention is a component mounting machine that simulates the mounting time of a component mounting machine that produces a mounting board by mounting components on the board, and in particular, the accuracy of simulation of the time required for recognizing the part sucked by the suction nozzle As a component mounter that can improve the performance, for example, it can be used as a production line monitoring computer positioned above each component mounter, a computer mounted in each component mounter, or the like.

It is an external view which shows the structure of the component mounting machine which concerns on embodiment of this invention. It is a top view which shows the main mechanical structures inside a component mounting machine. It is a figure for demonstrating recognition of the components by a components recognition camera. (A), (b) and (c) is a figure which shows an example of a typical deformed component. It is a block diagram which shows the function structure of a component mounting machine. It is a figure which shows an example of a component library. It is a figure which shows an example of recognition classification data. It is a figure which shows an example of mounting point data. It is a figure which shows an example of mounting condition data. It is the flowchart which showed the process procedure in connection with the simulation of component mounting time. (A) And (b) is a figure which shows an example in which the precision of the simulation of component mounting time improves. (A) And (b) is a figure for demonstrating the influence which the simulation result of component mounting time has on optimization of component mounting conditions. It is the flowchart which showed the process procedure in connection with registration of recognition time. It is a figure which shows an example of the screen in connection with registration of recognition time.

Explanation of symbols

20 substrate 100 component mounting machine 105 operation panel 110a, 110b mounting unit 112 head 114 component cassette 115 component supply unit 116 component recognition camera 122a, 122b substrate transport rail 140 nozzle 150 mechanism unit 151 control unit 152 display unit 153 input unit 154 storage unit 154a Component library 154b Recognition type data 154c Mounting point data 154d Mounting condition data 155 Registration unit 156 Acquisition unit 157 Simulation unit 158 Communication unit

Claims (7)

A component mounting time simulation method for simulating a mounting time when a component is mounted on a substrate by a component mounting machine provided with a recognition means for recognizing a component sucked by a suction nozzle,
Corresponding to a predetermined part type by referring to the first information table in which the first expected recognition time, which is the time expected to be recognized for the part, is stored for each part type stored in the storage means Obtaining the first expected recognition time to obtain,
And a simulation step of simulating the mounting time using the first expected recognition time acquired in the acquisition step. The component mounting time simulation method further includes:
The registration step of measuring the component recognition time for each component type in the component mounter and registering the measured time as the first expected recognition time in the first information table is included. The component mounting time simulation method described. The first information table further shows a recognition type number for identifying the type of algorithm for recognizing the positional deviation of the component suction state for each component type,
In the acquisition step, when the first predicted recognition time corresponding to the component type cannot be acquired, the recognition type number is acquired, and a second predicted recognition is performed for each of the recognition type numbers stored in the storage unit. The component mounting time simulation method according to claim 2, wherein the second expected recognition time corresponding to the recognition type number is acquired by referring to the second information table indicating the time. The component mounting time simulation method according to claim 2, wherein in the registration step, the registration is performed with respect to a component type of a deformed component which is a component having an irregular shape. A component mounting time simulation device for simulating a mounting time when a component is mounted on a substrate by a component mounting machine provided with a recognition means for recognizing the component sucked by the suction nozzle,
Storage means for storing an information table indicating an expected recognition time, which is an expected time required for recognition of a component, for each component type;
Obtaining means for obtaining the expected recognition time corresponding to a predetermined component type by referring to the information table stored in the storage means;
A component mounting time simulation apparatus comprising: simulation means for simulating the mounting time using the expected recognition time acquired by the acquisition means. A component mounter for mounting components on a board,
A component mounting machine comprising the component mounting time simulation device according to claim 5. A program for simulating the mounting time when a component is mounted on a board by a component mounting machine provided with a recognition means for recognizing the component sucked by the suction nozzle,
For each part type stored in the storage means, the first prediction corresponding to a predetermined part type is made by referring to an information table in which an expected recognition time, which is an expected time required for part recognition, is referred to. An acquisition step for acquiring a recognition time;
A program causing a computer to execute a simulation step of simulating the mounting time using the expected recognition time acquired in the acquisition step.

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