JP4664995B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus that sucks a component by a component suction nozzle provided in a movable head unit, transports the sucked component, and mounts it on a substrate.

  Conventionally, as shown in Patent Document 1 below, in a component mounting apparatus that mounts components on a substrate while adsorbing components with a movable head having a plurality of nozzles for component adsorption, the components are adsorbed by the plurality of nozzles. A plurality of components are respectively imaged by a component recognition camera, and the mounting order of the plurality of components is determined based on the state of each component obtained from the imaging result.

According to the method disclosed in Patent Document 1, the mounting order is determined based on the actual state of each component sucked by a plurality of nozzles. Even if they are different, an appropriate mounting order is determined in consideration of the difference, and nozzle interference when the components are mounted on the board (nozzle interferes with the parts previously mounted on the board) is prevented. There is an advantage that you can.
JP 2006-237174 A

  However, in the configuration of the above-mentioned Patent Document 1, for example, when adjacent parts are arranged close to each other on the substrate and the separation distance between them is considerably small, even if the component is adsorbed to the nozzle, Even if the component size error is recognized by the component recognition camera and the mounting order of the components is examined based on this, depending on the size of the above-mentioned suction displacement, the interference between the nozzle and the component can be avoided only by changing the mounting order. Cannot be performed properly, and there is a risk that the components cannot be mounted properly. Therefore, in such a case, the type of the nozzle that sucks the component should be changed to another type in advance. However, in Patent Document 1, the type of nozzle is selected from such a viewpoint. There is no disclosure about this, and it has been difficult to reliably avoid interference between the nozzle and the component.

  The present invention has been made in view of the above circumstances, and by selecting an appropriate nozzle in consideration of the separation distance between adjacent components on the substrate, interference between the nozzle and the component can be reliably prevented. It is an object of the present invention to provide a component mounting apparatus that can do this.

In order to solve the above problems, the present invention provides a component mounting apparatus that sucks a component by a component suction nozzle provided in a movable head unit, transports the sucked component, and mounts it on a substrate. And determining whether or not the difference in height between adjacent components on the board is equal to or less than a predetermined value, and if the difference in height is equal to or less than a predetermined value, the separation distance between the components Based on the nozzle selection means for selecting the type of nozzle that can be used without causing interference with the component from a plurality of nozzle candidates, and between adjacent components so as not to cause interference with the nozzle the required minimum distance as the minimum required distance, and a storage means for storing for each combination of the plurality of nozzles candidates and a plurality of parts, the nozzle selecting means, the height of the components to each other adjacent The but if it is less than a predetermined value, an appropriate nozzle to adsorb one of the components thereof adjacent selected from the plurality of nozzles candidates, corresponds to the combination of the selected nozzle and said one parts The necessary minimum distance stored in the storage means is read, and it is determined whether or not the minimum value of the separation distance between the one component and the adjacent component is smaller than the necessary minimum distance read from the storage means. If it is small, the type of nozzle to be used is changed among the nozzle candidates (claim 1).

  According to the present invention, when there is a possibility of interference between the nozzle and the part because the difference in height between adjacent parts is small, the nozzle to be used is selected in advance based on the separation distance between the parts. As a result, it is possible to properly select an appropriate nozzle that does not cause interference with the components in consideration of the above-mentioned separation distance. There is an advantage that it is possible to effectively prevent the occurrence of component mounting defects caused by the above, and to effectively improve the quality and production efficiency of the substrate.

In particular, according to the present invention, a simple and reliable configuration that simply compares the required minimum distance stored in the storage means for each combination of parts and nozzles with the minimum clearance value between adjacent parts (minimum value of the separation distance). By checking the presence or absence of nozzle interference, if there is a risk of nozzle interference as a result of the comparison (that is, when the minimum clearance value is smaller than the required minimum distance), the nozzle type can be changed. There is an advantage that the quality of the substrate can be effectively improved by reliably preventing the interference.

If the minimum value of the separation distance between the components is smaller than the necessary minimum distance, no matter which nozzle is selected from the nozzle candidates, the nozzle selecting means is replaced with the component. It is preferable to perform a predetermined process for notifying the user that there is a possibility of interference ( claim 2 ).

  According to this configuration, there is an advantage that a user who has received a predetermined notification can appropriately take necessary measures such as changing the arrangement of components on the board.

The nozzle selection means preferably sets the mounting order of these components to an order that allows mounting without causing interference with the nozzle when the difference in height between adjacent components is greater than a predetermined value. ( Claim 3 ).

  According to this configuration, interference between the nozzle and the component can be prevented with a simple configuration in which the mounting order is controlled in consideration of the difference in component height. In addition, since there is no particular restriction on the type of nozzle to be used, by using an appropriate nozzle that prioritizes work efficiency etc. as this nozzle, component mounting work can be performed quickly, and board production efficiency etc. is effective. Can be improved.

  As described above, according to the component mounting apparatus of the present invention, it is possible to select an appropriate nozzle in consideration of the separation distance between adjacent components on the board, and reliably prevent interference between the nozzle and the component. be able to.

  FIG. 1 is a plan view schematically showing a component mounting apparatus according to an embodiment of the present invention. The component mounting apparatus 1 shown in the figure includes a surface mounter 2 for mounting various components on a substrate P, and data creation for creating a control program (hereinafter referred to as a mount program) for the surface mounter 2 The surface mounting machine 2 and the data creation machine 3 are electrically connected via a network line 4.

  FIG. 2 is a schematic front view showing the surface mounter 2 as a single unit. As shown in FIG. 2 and FIG. 1 above, a conveyor 12 is arranged on the base 10 of the surface mounter 2, and a printed circuit board P (hereinafter simply referred to as a board P) is provided by the conveyor 12. While being transported and stopped at a predetermined mounting work position (a position indicated by a two-dot chain line in FIG. 1), the substrate P stopped at the position is positioned and held by a clamp mechanism (not shown). In the following description, the conveyance direction of the substrate P by the conveyor 12 is the X axis direction, the direction orthogonal to the X axis on the horizontal plane is the Y axis direction, and the direction orthogonal to the X axis and the Y axis is the Z axis direction. To proceed.

  At two locations on the base 10 that sandwich the conveyor 12 from both sides in the Y direction, there are provided component supply sections 5 composed of multiple rows of tape feeders 5a for supplying components. Each tape feeder 5a has a tape in which small piece parts such as an IC, a transistor, and a capacitor are stored at a predetermined interval (supply pitch), a reel for deriving the tape, etc. As the parts in the tape are picked up by the unit 6, the tape is intermittently fed out by a reel.

  A head unit 6 for component mounting is provided above the base 10. The head unit 6 is supported so as to be movable in the X-axis direction and the Y-axis direction, and is configured to be able to move freely between the substrate P positioned at the mounting work position and the component supply unit 5. Yes.

  That is, on the base 10, a pair of fixed rails 7 extending in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed to support the head unit 6. The support member 11 is supported so as to be movable in the Y-axis direction along the fixed rail 7, and a nut portion 18 provided in the support member 11 is screwed with the ball screw shaft 8. The support member 11 is provided with a guide member 14 extending in the X-axis direction and a ball screw shaft 13 that is rotationally driven by an X-axis servo motor 15, and a nut portion that is screwed with the ball screw shaft 13. The head unit 6 having (not shown) is supported so as to be movable along the guide member 14 in the X-axis direction. Then, when the Y-axis servo motor 9 is operated and the ball screw shaft 8 is rotationally driven, the support member 11 is moved integrally with the head unit 6 in the Y-axis direction, and the X-axis servo motor 15 is operated. When the ball screw shaft 13 is rotationally driven, the head unit 6 is configured to move in the X-axis direction with respect to the support member 11.

  The head unit 6 is mounted with a plurality of mounting heads 20 for picking up components and mounting them on the substrate P. In this embodiment, the three mounting heads 20 are arranged in a row in the X-axis direction. It is mounted side by side.

  These mounting heads 20 are supported so as to be able to move in the Z-axis direction and rotate around the R-axis (nozzle center axis) with respect to the main body of the head unit 6, and use a servo motor (not shown) as a drive source. The elevating drive mechanism and the rotary drive mechanism are driven in the respective directions.

  The tip 21 of each mounting head 20 is provided with a component suction nozzle 21. Each nozzle 21 is connected to a negative pressure supply means (not shown). When a part is taken out from the tape feeder 5a, the negative pressure is supplied to the tip of the nozzle 21 from the negative pressure supply means. Adsorption is performed.

  The nozzle 21 is detachably attached to the mounting head 20 and is replaced with another nozzle 21 housed in a nozzle station 16 provided on the base 10 as necessary. It is like that. That is, the nozzle station 16 stores a plurality of types of nozzles 21 having different tip shapes and sizes, and the mounting head 20 is driven up and down while the head unit 6 is disposed above the nozzle station 16. Thus, the nozzle 21 is attached to and detached from the mounting head 20.

  On the base 10, a component recognition camera 17 is further provided for recognizing an image of the suction state of the component when the nozzle 21 of each mounting head 20 picks up the component from the component supply unit 5. . For example, as shown in FIG. 1, the component recognition cameras 17 are provided at two locations located between the conveyor 12 and the component supply units 5 on both sides thereof. When the head unit 6 passes above the component recognition cameras 17. In addition, the state of the component attracted to the tip of the nozzle 21 is picked up by the component recognition camera 17 from below.

  In the surface mounter 2 configured as described above, for example, the component mounting operation proceeds as follows.

  First, the head unit 6 moves above the component supply unit 5, and components are removed from the tape feeder 5 a by each mounting head 20. Specifically, when the predetermined mounting head 20 to which the component is to be sucked moves up and down above the predetermined tape feeder 5a, the component accommodated in the tape feeder 5a becomes the nozzle 21 of the mounting head 20. It is adsorbed by and taken out.

  When the suction of the components by all the mounting heads 20 is completed, the head unit 6 moves above the component recognition camera 17, and the components sucked by the mounting heads 20 are imaged from below by the camera 17. At the same time, the suction state of each component is examined based on the imaging result. Next, the head unit 6 moves above the printed board P, and the mounting head 20 moves up and down on each mounting point set on the upper surface of the board P, so that the components adsorbed on the head 20 are moved. It is mounted on the printed circuit board P. When a position shift (suction shift) of the suction component is recognized based on the imaging result of the component recognition camera 17, the target movement amount of the mounting head 20 when mounting the component on the board P is the above-described amount. By correcting the amount of suction displacement, the component is correctly mounted even if there is a certain amount of suction displacement.

  Next, the control system of the surface mounter 2 will be described with reference to the block diagram of FIG. As shown in this figure, the surface mounter 2 incorporates a controller 30 that comprehensively controls its operation. The controller 30 is composed of a well-known CPU, various memories, an HDD, and the like, and its main functional elements are an arithmetic processing unit 31, a storage unit 32, a motor control unit 33, an external input / output unit 34, an image processing unit. 35 etc.

  The storage unit 32 stores a mounting program (details will be described later) created by the data creator 3 and other necessary data.

  The arithmetic processing unit 31 comprehensively controls the operation of the head unit 6 and the like to perform a predetermined mounting operation based on the mounting program stored in the storage unit 32.

  The motor control unit 33 controls motors such as the X-axis and Y-axis servo motors 15 and 9, and the external input / output unit 34 is supplied from various sensors 23 provided in the surface mounter 2. It accepts signals and the like. The image processing unit 35 processes image data input from the component recognition camera 17.

  The data creation machine 3 connected to the surface mounting machine 2 as described above through the network line 4 is for creating a mounting program or the like for defining the control operation of the surface mounting machine 2. A storage unit 42 that stores information, an input unit 43 that includes a keyboard or a mouse that receives a predetermined input operation from a user, a display unit 44 that includes a liquid crystal monitor or a CRT, and a control unit 41 that controls these units. Have.

  The storage unit 42 of the data creation machine 3 stores various data including data necessary for creating the mounting program. The functional unit includes a basic data storage unit 42a and a nozzle data storage unit 42b. is doing.

  Among these, in the basic data storage unit 42a, the design data (CAD data, etc.) of the board P input from the outside by the user, the information such as the production plan, and the position of each mounting point on the board P obtained from the information. In addition, various types of information related to the type and shape of the components mounted thereon are stored.

  On the other hand, the nozzle data storage unit 42b stores various data relating to the nozzle 21 candidates (nozzle candidates) that can be used in the surface mounter 2 and the shapes of the nozzles 21 and the like, and need to be described below. Data relating to the minimum distance is stored.

  The above-mentioned minimum required distance is the minimum distance between other components previously mounted on the substrate P when the component is attracted by the nozzle 21 and mounted on the substrate P. If this is present, it indicates whether interference between the other parts and the nozzle 21 will occur. FIG. 4 is a diagram for explaining the necessary minimum distance in detail. As shown in this figure, in the case where the diameter of the tip of the nozzle 21 adsorbing a certain component p1 is larger than the component p1, between the component p1 and another component p2 adjacent thereto, Due to the small clearance, the nozzle 21 may interfere with the adjacent component p2 as shown in FIG. Therefore, in the present embodiment, the minimum distance required between the parts p1 and p2 to prevent such interference is stored in the nozzle data storage unit 42b as the minimum required distance. The minimum required distance stored in the nozzle data storage unit 42b is read out, and the minimum clearance value C between the parts p1 and p2 as shown in FIGS. 5 (a) to 5 (c) (that is, the distance between the parts p1 and p2). The control unit 41 executes processing such as comparison with the minimum distance), so that an appropriate nozzle 21 that does not cause interference with the components is selected (details of the processing). Will be described later).

  The specific value of the necessary minimum distance is not only the extent of the difference in outer diameter of the nozzle 21 from the component p1 (dimension α shown in FIG. 4), but also when the nozzle 21 sucks the component p1. It is also determined in consideration of how much the component p1 is deviated. That is, as described above, the suction of the component p1 by the nozzle 21 is not necessarily performed in a state in which the centers of the two coincide with each other, and as shown in FIG. May be performed (in FIG. 6, this amount of adsorption deviation is indicated by ε). In such a state where a certain amount of suction displacement ε exists, the relative position of the nozzle 21 is shifted by the amount of suction displacement ε, which may cause the nozzle 21 to interfere with another component p2. There is. For this reason, the necessary minimum distance is determined in consideration of the value of the adsorption deviation amount ε in addition to the value of the outer diameter difference α between the nozzle 21 and the component p1. It should be noted that it is possible to statistically determine how much the adsorption deviation occurs, for example, from the actual value of the adsorption deviation amount ε obtained in the process of actually mounting the component.

  FIG. 7 is a diagram showing data of a necessary minimum distance (hereinafter, the distance is referred to as X) stored in the nozzle data storage unit 42b, and the types of nozzle candidates (nozzle type) shown in the leftmost column of this chart A required minimum distance X made up of predetermined numerical data (unit: μm) is determined for each combination of (A to K) and the type of component (part type a to z) shown in the uppermost column. For example, according to the table of FIG. 7, the required minimum distance X when the nozzle type A and the component type a are combined is 150 μm, and the required minimum distance X when the nozzle type B and the component type a are combined is 400 μm. It turns out that it is. In this figure, the minimum required distance X being “0” indicates that mounting is possible no matter how narrow it is between other adjacent components. That is, “0” is input as the necessary minimum distance X when it is considered that the interference of the nozzle 21 clearly does not occur because the nozzle 21 is sufficiently small with respect to the component.

  Next, the control unit 41 of the data creation machine 3 will be described. The control unit 41 has a function of creating a mounting program for the surface mounter 2 based on various data stored in the storage unit 42. Specifically, as part of the process of creating the mounting program, the control unit 41 stores the minimum clearance value C (see FIG. 5) between adjacent components on the board P in the nozzle data storage unit 42b. It is determined whether or not it is smaller than the necessary minimum distance X (see FIG. 7), and the nozzle 21 is selected based on the determination result. Then, a program according to the selection result of the nozzle 21 is created as the mounting program and transmitted to the surface mounting machine 2.

  FIG. 9 is a flowchart showing specific contents of the control operation of the control unit 41. When an instruction to create a mounting program is issued in response to an input operation to the input unit 43 by the user and the flowchart of FIG. 8 starts, the control unit 41 first reads various necessary data from the storage unit 42 ( Step S1), a process of resetting the pair number i of the adjacent component on the board P (i = 1) is executed (Step S3). The adjacent component pair number i here is a serial number assigned to a combination of all components adjacent on the substrate P. Hereinafter, one of the pair of components adjacent to each other in this manner will be referred to as a component p1 and the other as a component p2 in accordance with FIG.

  Next, the control unit 41 determines the minimum clearance between the components p1 and p2 corresponding to the pair number i based on data such as the position of the mounting point on the substrate P and the shape of the component stored in the storage unit 42. A process of calculating the value C (see FIG. 5) is executed (step S5), and a process of determining whether or not the separation distance is within the predetermined value Ca is executed (step S7). The determination in step S7 is for determining whether or not the minimum clearance value C is sufficiently large to the extent that it is not necessary to check the interference between the nozzle 21 and the component. Therefore, when it is determined as NO and it is confirmed that the minimum clearance value C is larger than the predetermined value Ca, the next pair number is immediately set without performing the interference check of the nozzle 21 as described later. The process is repeated and the same process is repeated.

  On the other hand, if it is determined YES in step S7 and it is confirmed that the distance between the parts p1 and p2 is small to some extent, the difference S in the height dimension between the parts p1 and p2 shown in FIG. A process of calculating based on the shape data (design value of height dimension) of the parts p1 and p2 stored in the storage unit 42 is executed (step S9), and the difference S of height dimension (in design) The process of determining whether or not the dimensional difference is equal to or less than a predetermined value Sa is executed (step S11). Note that the predetermined value Sa here is, for example, a value obtained by adding up dimension errors in the height direction of the components p1 and p2. That is, the difference in design height dimension S between the parts p1 and p2 in the step S11 is equal to or less than the predetermined value Sa means that the design height dimensions of both parts p1 and p2 are the same, or Even if they are different, the actual height dimension of both parts p1 and p2 may be substantially the same (thus, an interference check with the nozzle 21 is necessary) depending on the error.

  Therefore, when it is determined YES in Step S11 and it is confirmed that the difference S in the height dimension between the parts p1 and p2 is small, the control unit 41 can use the nozzle 21 that can be used without causing interference with the parts. In order to select the type, nozzle selection control in step S15 is executed. Although details will be described later, in the nozzle selection control in step S15, the minimum clearance value C, which is the minimum value of the separation distance between the components p1 and p2, is compared with the necessary minimum distance X shown in FIG. Thus, the interference between the nozzle 21 and the component is checked, and processing for selecting the type of the nozzle 21 based on the result is performed. That is, in the present embodiment, the nozzle selection means of the present invention is configured by the control unit 41 that selects the types of nozzles 21 that can be used without causing interference with the components in such a procedure.

  On the other hand, when it is determined NO in step S11 and it is confirmed that the height difference S between the components p1 and p2 is larger than the predetermined value Sa, the components p1 and p2 are placed on the substrate P. If the mounting order is appropriately controlled (that is, if mounting is performed in order from the components with the lowest height), the interference of the nozzle 21 does not occur. Therefore, the processing in step S15 for selecting the nozzle 21 in consideration of the interference of the nozzle 21 is not necessary. The control unit 41 simply executes the process of step S13 to add a predetermined restriction to the component mounting order. As a result, the mounting order of components determined when the creation of the subsequent mounting program is completed (step S25) is an order in which interference between the nozzle 21 and the components does not occur, that is, a higher component after a lower component. It will be set in the order of implementation. The type of the nozzle 21 used in this case is appropriately selected in consideration of the efficiency of the mounting work.

  FIG. 10 is a subroutine showing the specific contents of the nozzle selection control shown in step S15. This nozzle selection control is executed sequentially (individually) for the paired parts p1 and p2 adjacent to each other. In the following, the nozzle 21 for picking up one of the parts p1 is selected. Will be described.

  When the nozzle selection control starts, the control unit 41 performs a process of selecting an appropriate nozzle 21 from the nozzle candidates (nozzle types A to K shown in FIG. 7) stored in the nozzle data storage unit 42b. At the same time (step S31), the minimum required distance X determined for the combination of the selected nozzle 21 and the component p1 attracted by the nozzle 21 (that is, the component in order not to cause interference with the nozzle 21) A process of reading the minimum distance required between p1 and p2 from the table data of FIG. 7 is executed (step S33).

  Next, the controller 41 determines whether or not the minimum clearance value C between the components p1 and p2 calculated in step S5 of FIG. 9 is smaller than the necessary minimum distance X read in step S33, that is, the component p1 is sucked. A process of determining whether or not the nozzle 21 that has been subjected to interference with the adjacent component p2 may interfere is executed (step S35). Then, when it is determined as YES here and it is confirmed that there is a possibility that the interference of the nozzle 21 may occur, it is determined whether there is another nozzle candidate (step S37), and it is determined as NO here. When it is confirmed that there is no other nozzle candidate, a process of inputting “1” to the NG generation flag F to record that there is a possibility of interference between the nozzle 21 and the component p2. Execute (Step S39).

  On the other hand, if it is determined YES in step S37 and it is confirmed that there are other nozzle candidates, the process of selecting an appropriate nozzle 21 from the remaining nozzle candidates is executed ( Step S41), returning to the processing after step S33, the same processing as described above is repeated for the new nozzle 21.

  In addition, when it is determined NO in Step S35 and it is confirmed that there is no possibility that the nozzle 21 interferes, the control unit 41 uses the nozzle 21 selected in the previous Step S31 for suction of the component p1. After determining that it should be the nozzle 21 (step S43), a process of inputting “0” to the NG generation flag F is executed (step S45) in order to record that the suction of the component p1 can be performed without any problem. Heretofore, the description has been given of the case of checking the interference of the nozzle 21 (that is, the interference between the nozzle 21 and the component p2) when the one component p1 of the paired components p1 and p2 is sucked. The interference of the nozzle 21 when adsorbing p2 (that is, the interference between the nozzle 21 and the component p1) is also executed by the same processing as described above. With the above processing, the subroutine of FIG. 10 is completed.

  Returning to the main flow of FIG. 9 again, the description will be continued. When the nozzle selection control in step S15 is completed as described above, the control unit 41 determines whether or not the NG generation flag F = 1, that is, the nozzle 21 may interfere with the component p1 or p2 during component mounting. A process for determining whether or not there is any is executed (step S17). If it is determined YES here and it is confirmed that there is a possibility of interference of the nozzle 21, the display unit of the data creation machine 3 is displayed. The design change such as changing the arrangement of the components p1 and p2 on the substrate P is performed by executing a process of displaying an error message indicating that the above-described interference may occur (Step S19). Is notified to the user.

  On the other hand, if it is determined NO in step S17 and it is confirmed that the component p1 can be sucked without any problem, the control unit 41 determines whether or not the component pair number i is smaller than the total number N of component pairs, that is, on the substrate P. A process is performed to determine whether or not all of the existing component pairs have been examined according to this flowchart (check on interference with the nozzle 21) (step S21). Here, YES is determined and interference with the nozzle 21 is detected. If it is confirmed that there is still a part pair to be checked, the process of incrementing the part pair number i (i = i + 1) is executed (step S23), and the process returns to the process after step S5. The same processing as described above is repeated for the new component pair.

  On the other hand, when it is determined NO in step S21 and it is confirmed that the check for all the component pairs is completed, the component 21 is picked up and mounted using the nozzle 21 selected by the processing so far. In order to carry out, a mounting program for defining operation parameters and the like of each part of the surface mounting machine 2 is created according to the selection result of the nozzle 21, and a process of transmitting this to the surface mounting machine 2 is executed (step S25).

  In the component mounting apparatus 1 that picks up a component by the component suction nozzle 21 provided in the movable head unit 6 as described above, transports the sucked component and mounts it on the substrate P, its control unit 41 Under the control, it is determined whether or not the height difference S between adjacent components on the board P is equal to or smaller than a predetermined value (step S11 in FIG. 9), and the height difference S is equal to or smaller than the predetermined value. In this case, based on the distance between the components (more specifically, the minimum clearance value C shown in FIG. 5), the type of nozzle 21 that can be used without causing interference with the component is determined as a predetermined nozzle. According to the configuration of the above-described embodiment in which the nozzle selection hand control (step S15) for selecting from candidates is executed, an appropriate nozzle 21 is selected in consideration of the separation distance between adjacent components on the substrate P. thing Can, there is an advantage that interference between the nozzle 21 and the parts can be reliably prevented.

  That is, in the above-described embodiment, when there is a possibility that interference between the nozzle 21 and the component may occur due to a small height difference S between adjacent components, the nozzle 21 to be used based on the separation distance between the components. Since the nozzle 21 is selected in advance, an appropriate nozzle 21 that does not cause interference with the component can be appropriately selected in consideration of the above-mentioned separation distance, and the nozzle 21 is used to suck and mount the component. Thus, there is an advantage that the quality of the substrate P, the production efficiency, and the like can be effectively improved by effectively preventing the occurrence of component mounting failure due to the interference of the nozzle 21.

  In particular, as in the above-described embodiment, the minimum required distance X as the minimum required distance between adjacent parts so as not to cause interference with the nozzles 21 is determined for each combination of the parts and the nozzles 21 that suck the same. The nozzle data storage unit 42b is further provided as a storage means for storing, and when the height difference S between adjacent parts is equal to or less than a predetermined value Sa, the minimum clearance value consisting of the minimum value of the separation distance between the parts It is determined whether or not C is smaller than the necessary minimum distance X stored in the nozzle data storage unit 42b (step S35 in FIG. 10), and if it is smaller, the type of the nozzle 21 to be used is changed. When the control unit 41 is configured to perform the processing (steps S37 and S41 in the figure), the interference of the nozzle 21 can be prevented with a simpler and more reliable configuration. There are advantages such as can be.

  That is, in the above configuration, a simple and reliable configuration that simply compares the required minimum distance X stored in the nozzle data storage unit 42b for each combination of the component and the nozzle 21 with the minimum clearance value C between adjacent components, The presence or absence of interference of the nozzle 21 can be checked, and the type of the nozzle 21 is changed when there is a possibility of interference of the nozzle 21 as a result of the comparison (that is, when the minimum clearance value C is smaller than the necessary minimum distance X). Thus, there is an advantage that the quality of the substrate P can be effectively improved by reliably preventing the interference of the nozzle 21.

  In the above embodiment, the minimum clearance value C between the components is smaller than the necessary minimum distance X regardless of which nozzle 21 is selected from the nozzle candidates stored in the nozzle data storage unit 42b. In such a case (in the case of YES in step S17 in FIG. 9), a predetermined error message is displayed on the display unit 44 to notify the user that the nozzle 21 may interfere with the component. The user can appropriately take necessary measures such as changing the arrangement of components on the board P by viewing the display.

  Moreover, in the said embodiment, when the difference S of the height of adjacent components is larger than predetermined value Sa (in the case of NO at step S11 of FIG. 9), the mounting order of these components is the same as the nozzle 21. Therefore, the nozzle 21 and the component are arranged with a simple configuration in which the mounting order is controlled in consideration of the height difference S of the components. There is an advantage that interference can be effectively prevented. In addition, by appropriately controlling the mounting order of components in this way, the type of nozzle 21 to be used is not particularly limited. Therefore, an appropriate nozzle 21 giving priority to the work efficiency of the surface mounter 2 and the like is used as this nozzle 21. By using this, it is possible to quickly improve the production efficiency of the substrate P by performing the component mounting operation quickly.

  In addition, the component mounting apparatus 1 demonstrated based on the said embodiment is only an example of the preferable form of this invention, The specific structure can be suitably changed in the range which does not deviate from the meaning of this invention. For example, in the above embodiment, the threshold value Sa serving as a reference when determining whether or not to perform the nozzle selection control (step S15 in FIG. 9) for selecting the type of the nozzle 21 that can be used without causing interference with the component, In other words, the threshold value Sa of the design height dimension difference S between adjacent parts (for example, parts p1 and p2 shown in FIG. 8) is added to the dimension error in the height direction of these parts p1 and p2. With this value, the nozzle selection control is performed only when the actual height dimensions of the parts p1 and p2 can be substantially the same. However, the value of the threshold value Sa is set to the dimensional error as described above. The nozzle selection control may be executed even when it is expected that a certain height dimensional difference is necessarily present between the parts p1 and p2 by making it slightly larger than the value of about. In this way, even when non-standard parts out of dimensional error are mixed, the interference of the nozzle 21 can be surely prevented, and parts with a certain height dimensional difference are particularly in the mounting order. There is an advantage that it can be appropriately mounted on the substrate P without any restriction.

  Moreover, in the said embodiment, when the height dimension difference S of adjacent components is larger than predetermined value Sa, the nozzle 21 and components are set by setting a mounting order so that it mounts in order from a component with a low height. Even if it is mounted from a high part, for example, by appropriately controlling the movement path of the nozzle 21 when mounting the part in consideration of the detailed three-dimensional shape of the part, etc. If it is possible to avoid the interference, it is possible to avoid the interference between the nozzle 21 and the component without necessarily mounting the components in the above order.

  Moreover, although the said embodiment demonstrated the example in which the surface mounting machine 2 and the data preparation machine 3 which comprise the component mounting apparatus 1 were provided separately, the structure of this invention is the said surface mounting machine 2 and data preparation. The present invention can also be suitably applied to the component mounting apparatus 1 in which the machine 3 is integrally provided.

It is a top view which shows schematic structure of the component mounting apparatus concerning one Embodiment of this invention. It is a schematic front view of a surface mounter. It is a block diagram which shows the control system of the said component mounting apparatus. (A) (b) is a figure for demonstrating the required minimum distance of adjacent components. (A)-(c) is a figure for demonstrating the minimum clearance value of adjacent components. It is a figure for demonstrating interference with the nozzle and components resulting from the adsorption | suction shift | offset | difference of components. It is a figure which shows the data of the required minimum distance memorize | stored in the said nozzle data storage part 42b. It is a figure for demonstrating the difference of the height dimension of adjacent components. It is a flowchart which shows the specific content of control operation of a data preparation machine. It is a subroutine which shows the specific content of the nozzle selection control performed in the flowchart of FIG.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 6 Head unit 21 Nozzle 41 Control part (nozzle selection means)
42b Nozzle data storage section (storage means)
S (Difference between parts) C Minimum clearance (Minimum clearance between parts)
X Required minimum distance

Claims (3)

A component mounting apparatus that sucks a component by a component suction nozzle provided in a movable head unit, transports the sucked component and mounts it on a substrate,
It is determined whether or not the difference in height between adjacent components on the board is less than or equal to a predetermined value, and when the difference in height is less than or equal to a predetermined value, based on the separation distance between the components, Nozzle selection means for selecting from a plurality of nozzle candidates the types of nozzles that can be used without causing interference with parts,
Storage means for storing a necessary minimum distance as a minimum necessary distance between adjacent parts so as not to cause interference with the nozzle for each combination of the plurality of nozzle candidates and a plurality of parts. Prepared,
The nozzle selection means selects an appropriate nozzle that adsorbs one of the adjacent parts from the plurality of nozzle candidates when the difference in height between adjacent parts is a predetermined value or less, and selects the selected nozzle. The necessary minimum distance stored in the storage means is read in correspondence with the combination of the nozzle and the one part, and the minimum value of the separation distance between the one part and the adjacent part is the storage means. A component mounting apparatus characterized in that it is determined whether or not the distance is smaller than the necessary minimum distance read from the above , and if it is smaller, the type of nozzle to be used is changed among the nozzle candidates . The component mounting apparatus according to claim 1,
If the minimum value of the separation distance between the components is smaller than the necessary minimum distance, no matter which nozzle is selected from the nozzle candidates, the nozzle selecting means is replaced with the component. A component mounting apparatus that performs a predetermined process for notifying a user that there is a possibility of interference. In the component mounting apparatus according to claim 1 or 2,
The nozzle selecting means sets the mounting order of these parts in a mountable order without causing interference with the nozzle when the difference in height between adjacent parts is greater than a predetermined value. A component mounting device.

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