JP7441144B2 - Component mounting system and component mounting system group determination method - Google Patents

Description

The present invention relates to a component mounting system and a method for determining a group of component mounting systems, and more particularly, to a component mounting system and a group of component mounting systems that plan arrangements for arranging a component supply section in a component mounting apparatus for multiple types of boards. Regarding the decision method.

2. Description of the Related Art Conventionally, there has been known a component mounting system that plans arrangements for arranging a component supply section in a component mounting apparatus for a plurality of types of boards (for example, see Patent Document 1).

The above Patent Document 1 discloses a component mounting system including a component mounting apparatus and a management computer. The management computer is configured to plan a setup for arranging a tape feeder (component supply section) in a component mounting apparatus for a plurality of types of boards. At this time, the management computer is configured to determine a common setup group that shortens the total production time of the board. Specifically, the management computer sequentially calculates the total production time of the boards while sequentially changing the combinations of all the boards to be evaluated for grouping, and then determines a common setup group that shortens the total production time of the boards. It is configured as follows.

Japanese Patent Application Publication No. 2018-116990

However, in the component mounting system described in Patent Document 1, the total board production time is sequentially calculated while sequentially changing the combinations of all the boards whose grouping is to be evaluated, and then the total board production time is shortened. Determine common setup groups. That is, unless all possible board combinations are considered, a common setup group that reduces the total board production time cannot be determined. In this case, there is a disadvantage that processing time for evaluating grouping increases. For this reason, there is a problem in that it is difficult to determine a common setup group that reduces the total production time of boards while reducing the processing time for evaluating grouping.

This invention was made to solve the above-mentioned problems, and one object of the invention is to effectively reduce the processing time for evaluating grouping while reducing the total production time of the board. It is an object of the present invention to provide a component mounting system and a group determination method for a component mounting system that can determine a common setup group to be shortened.

The component mounting system according to the first to fourth aspects of the present invention includes a component mounting apparatus that mounts components supplied from a component supply section on a board, and a component mounting system that mounts components supplied from a component supply section on a board. a control unit that plans arrangement setup; the control unit obtains a common rate of parts for a combination of multiple types of boards, and calculates the total production time of the board based on the common rate of parts. The method is configured to determine a common setup group to be shortened.

In the component mounting system according to the first to fourth aspects of the present invention, as described above, the control unit acquires a common rate of components for a combination of multiple types of boards, and also acquires a common rate of components based on the common rate of components. The configuration is configured to determine a common setup group that shortens the total production time of the board. Thereby, it is possible to determine a common setup group that reduces the total production time of boards while effectively reducing the number of board combination candidates for which grouping is to be evaluated based on the common rate of parts. As a result, a common setup group that reduces the total production time of boards can be determined without considering all possible board combinations. Thereby, it is possible to determine a common setup group that reduces the total production time of the substrate while effectively reducing the processing time for evaluating grouping.

In the component mounting system according to the first aspect , the control unit is configured to sequentially evaluate whether or not it is possible to determine a combination of boards as a common setup group in descending order of component commonality. ing. With this configuration, candidates for board combinations can be sequentially evaluated in the order of board combinations that are most likely to shorten the total board production time, that is, in descending order of component commonality. As a result, the number of board combination candidates to be evaluated for grouping can be more effectively reduced.

In the component mounting system according to the first aspect, the control unit sequentially evaluates whether or not it is possible to determine a combination of boards as a common setup group in descending order of component commonality, and selects a predetermined board. When a combination of boards is determined as a common setup group, the board combinations having a lower component commonality rate than a predetermined board combination are not evaluated. With this configuration, a combination of boards with a lower component commonality rate than a predetermined combination of boards is not evaluated, so the processing time for evaluating grouping can be reduced accordingly. As a result, it is possible to determine a common setup group that reduces the total production time of substrates while more effectively reducing the processing time for evaluating grouping.

In the component mounting system according to the first aspect, the control unit is capable of arranging the component supply unit in the component mounting apparatus for a combination of boards having a lower component commonality ratio than a predetermined combination of boards. The configuration is such that evaluations including evaluation of whether or not there is a problem and evaluation of whether or not it is possible to shorten the total production time of the board are not performed. With this configuration, it is possible to evaluate whether it is possible to arrange the component supply section in the component mounting apparatus and to evaluate whether it is possible to shorten the total production time of the board. Therefore, the processing time for evaluating grouping can be definitely reduced.

In the component mounting system according to the second aspect , the control unit is configured to control a board whose combination of boards exceeds the production number of boards or the production time of the boards obtained by multiplying the production number of boards by the cycle time. , the configuration is such that it is not evaluated whether or not the combination of boards can be determined as a common setup group. Here, for boards with a large number of boards to be produced or a long board production time, the deterioration of cycle time due to common setup is significant, so it is difficult to expect shortening of the total board production time even if they are combined. Therefore, with the above configuration, grouping can be evaluated for combinations of boards where the number of boards produced or the production time of boards is large, and it is difficult to expect a reduction in the total production time of boards even if they are combined. There can be no. As a result, processing time for evaluating grouping can be effectively reduced.

In this case, preferably, if the combination of boards includes types of boards whose common rate of parts exceeds the second reference value, the control unit is configured to The configuration is configured to evaluate whether or not it is possible to determine the combination as a common setup group. Here, even if the number of boards produced or the production time of boards is large, if the common rate of parts is high, the effect of deterioration of cycle time due to common setup is small, so even if the boards are combined, The total production time can be expected to be reduced. Therefore, with the above configuration, even if the number of boards produced or the production time of boards is large, grouping can be evaluated for combinations of boards that can be expected to shorten the total production time of boards. can. As a result, it is possible to effectively determine a common setup group that reduces the total production time of the substrate while effectively reducing the processing time for evaluating grouping.

In the component mounting system according to the third aspect , the control unit evaluates whether or not it is possible to arrange the component supply unit in the component mounting apparatus for the combination of boards, and also determines whether the component supply unit can be arranged in the component mounting apparatus. If the number of component supply sections exceeds the number of component supply sections that can be placed in the component mounting equipment, by changing the arrangement of some of the component supply sections through setup changes, is configured to further evaluate whether it is possible to place the . With this configuration, it is possible to reduce setup work and increase the degree of freedom in combining substrates that can be determined as a common setup group. As a result, it is possible to more effectively determine a common setup group that reduces the total production time of the board.

In the component mounting system according to the fourth aspect , the control unit is configured to determine the common setup group while fixing the arrangement of the component supply units in the component mounting apparatus specified in advance. With this configuration, it is possible to determine a common setup group while fixing the arrangement of frequently used parts supply units throughout a plurality of production plans. As a result, long-term setup work over multiple production plans can be reduced. This makes it possible to shorten the total production time of boards in multiple production plans.

A group determination method for a component mounting system according to fifth to eighth aspects of the present invention includes a component supply unit arranged in a component mounting apparatus that mounts components supplied from a component supply unit on a plurality of types of boards. The step of planning the setup includes a step of obtaining a common rate of parts for a combination of multiple types of boards, and a step of calculating the total production time of the board based on the common rate of parts. determining a common setup group that shortens the process.

In the group determination method for a component mounting system according to the fifth to eighth aspects of the present invention, as described above, the steps include obtaining a common rate of components for a combination of multiple types of boards; based on the method, determining a common setup group that shortens the total production time of the board. Thereby, it is possible to determine a common setup group that reduces the total production time of boards while effectively reducing the number of board combination candidates for which grouping is to be evaluated based on the common rate of parts. As a result, a common setup group that reduces the total production time of boards can be determined without considering all possible board combinations. As a result, it is possible to provide a group determination method for a component mounting system that can determine a common setup group that reduces the total board production time while effectively reducing the processing time for evaluating grouping. .

In the group determination method for a component mounting system according to the fifth aspect, preferably, in the step of determining a common setup group, combinations of boards can be determined as a common setup group in descending order of component commonality. This includes the step of sequentially evaluating whether or not. With this configuration, candidates for board combinations can be sequentially evaluated in the order of board combinations that are most likely to shorten the total board production time, that is, in descending order of component commonality. As a result, the number of board combination candidates to be evaluated for grouping can be more effectively reduced.

In the group determination method for a component mounting system according to the fifth aspect, preferably, in the step of determining a common setup group, combinations of boards can be determined as a common setup group in descending order of component commonality. If a predetermined combination of boards is determined as a common setup group, the method includes a step of not evaluating a combination of boards having a lower component commonality rate than the predetermined combination of boards. With this configuration, a combination of boards with a lower component commonality rate than a predetermined combination of boards is not evaluated, so the processing time for evaluating grouping can be reduced accordingly. As a result, it is possible to determine a common setup group that reduces the total production time of substrates while more effectively reducing the processing time for evaluating grouping.
In the group determination method for a component mounting system according to the sixth aspect, in the step of determining the common setup group, the combination of boards is based on the production number of the boards, or the production number of the boards multiplied by a cycle time. a step of not evaluating whether or not the combination of boards can be determined as the common setup group when the board types include the board production time exceeding a first reference value; including.
In the group determination method for a component mounting system according to the seventh aspect, the step of determining the common setup group may include arranging the component supply unit in the component mounting apparatus for the combination of boards. and if the number of component supply units exceeds the number of component supply units that can be arranged in the component mounting apparatus, change the arrangement of some of the component supply units by resetting. The method further includes the step of further evaluating whether or not it is possible to arrange the component supply section in the component mounting apparatus for the combination of the boards.
In the group determination method for a component mounting system according to the eighth aspect, in the step of determining the common setup group, the common setup group is including the step of determining.

According to the present invention, as described above, a component mounting system and component are capable of determining a common setup group that reduces the total production time of a board while effectively reducing the processing time for evaluating grouping. A method for determining groups of implemented systems can be provided.

FIG. 1 is a schematic diagram showing a component mounting system according to a first embodiment. FIG. 1 is a schematic plan view showing a component mounting apparatus according to a first embodiment. FIG. 1 is a block diagram showing a production control device according to a first embodiment. 7 is a flowchart for explaining common setup group determination processing according to the first embodiment. FIG. 1 is a first diagram for explaining an example of common setup group determination according to the first embodiment. FIG. 2 is a second diagram for explaining an example of common setup group determination according to the first embodiment. FIG. 3 is a third diagram for explaining an example of common setup group determination according to the first embodiment. FIG. 2 is a block diagram showing a production control device according to a second embodiment. It is a flow chart for explaining common setup group decision processing by a 2nd embodiment. FIG. 7 is a schematic diagram for explaining the arrangement of components when the combination of boards according to the second embodiment includes a board whose production quantity is large. FIG. 3 is a block diagram showing a production control device according to a third embodiment. 13 is a flowchart for explaining common setup group determination processing according to the third embodiment. FIG. 7 is a schematic diagram for explaining a common setup group that changes the arrangement of some component supply units according to the third embodiment. FIG. 3 is a block diagram showing a production control device according to a fourth embodiment. It is a schematic diagram for explaining the state where arrangement|positioning of some component supply parts is fixed by 4th Embodiment.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments embodying the present invention will be described based on the drawings.

[First embodiment]
First, with reference to FIG. 1, the configuration of a component mounting system 100 according to a first embodiment will be described.

(Component mounting system configuration)
The component mounting system 100 is a system that mounts components (electronic components) E such as ICs, transistors, capacitors, and resistors on a substrate P such as a printed circuit board to produce a substrate P on which the components E are mounted.

As shown in FIG. 1, the component mounting system 100 includes a mounting line 200 for producing boards P, and a production control device 300 for managing the production of boards P.

The mounting line 200 includes a printing device 200a, a component mounting device 200b, a pre-reflow inspection device 200c, a reflow oven 200d, and a post-reflow inspection device 200e. Note that the device configuration of the mounting line 200 is an example, and is not limited to the device configuration shown in FIG. 1.

In the mounting line 200, a printing device 200a, a component mounting device 200b, a pre-reflow inspection device 200c, a reflow oven 200d, and a post-reflow inspection device 200e are arranged in this order from the upstream side to the downstream side. It is located in Further, a delivery conveyor (not shown) is arranged between each device to convey and deliver the substrate P between the devices. The delivery conveyor transports the substrate P in the substrate transport direction (X direction) and delivers it from the upstream device to the downstream device.

The printing device 200a performs a printing operation of screen printing a bonding material such as solder on the substrate P as a production operation of the substrate P. The component mounting apparatus 200b performs a mounting operation for mounting the component E on the substrate P that has been printed by the printing apparatus 200a, as a production operation for the substrate P. The pre-reflow inspection apparatus 200c performs an inspection operation of inspecting the substrate P on which the component mounting apparatus 200b has mounted the board P, as an inspection operation of the board P. The reflow furnace 200d joins the component E to the board P, which has been inspected by the pre-reflow inspection device 200c, by melting and solidifying the bonding material printed on the board P as part of the production work of the board P. Perform reflow work. The post-reflow inspection apparatus 200e performs an inspection operation for inspecting the substrate P that has been subjected to the reflow operation using the reflow oven 200d.

(Configuration of component mounting equipment)
Next, with reference to FIG. 2, the configuration of the component mounting apparatus 200b will be described. In the following description, the direction along the substrate transport direction is referred to as the X direction, the direction perpendicular to the X direction in the horizontal plane is referred to as the Y direction, and the vertical direction perpendicular to the X direction and the Y direction is referred to as the Z direction.

As shown in FIG. 2, the component mounting apparatus 200b includes a base 201, a transport section 202, a head unit 203, a head horizontal movement mechanism section 204, a component imaging section 205, a board imaging section 206, and a control section. 207 and a communication section 208.

The base 201 is a base on which each component is placed in the component mounting apparatus 200b. On the base 201, a transport section 202, a rail section 242, and a component imaging section 205 are provided. Furthermore, a control section 207 is provided within the base 201. Furthermore, the base 201 is provided with a plurality (four) of setting sections 211 for setting a cart 220 on which a component supply section 210 for supplying the component E can be placed. Specifically, the base 201 is provided with two set parts 211 on both sides of the Y direction (Y1 direction side and Y2 direction side).

The component supply unit 210 is a device that supplies components E to be mounted on the board P. Specifically, the component supply section 210 includes a tape feeder that supplies the component E by feeding a component supply tape (not shown) that stores the component E. The component supply section 210 is configured to intermittently feed the component supply tape in accordance with the component holding operation by the head unit 203. Further, the component supply section 210 is configured to be set in the setting section 211 in a state where a plurality of component supply sections 210 are arranged side by side on a trolley 220.

The transport section 202 is configured to carry in a board P before mounting, transport it in the board transport direction (X direction), and transport the board P after mounting. Further, the transport section 202 is configured to transport the loaded substrate P to the substrate fixing position Pa, and to fix it at the substrate fixing position Pa by a substrate fixing mechanism (not shown). Further, the conveyance section 202 includes a pair of conveyance belts 221. The transport unit 202 is configured to transport the substrate P in the substrate transport direction with a pair of transport belts 221 supporting both ends of the substrate P in the width direction (Y direction) from below (Z2 direction side). has been done.

The head unit 203 is a head unit for mounting components. The head unit 203 mounts the component E on the board P fixed at the board fixing position Pa. The head unit 203 includes a plurality (five) of heads (mounting heads) 231. A nozzle (not shown) for holding (adsorbing) the component E is attached to the tip of the head 231. The head 231 is configured to be able to hold (adsorb) the component E in the nozzle using negative pressure supplied from a negative pressure supply section (not shown). Further, the head 231 moves in the vertical direction between a lowered position for holding the component E or for mounting the held component E, and an elevated position for transporting the held component E to the board P. It is configured to be movable.

The head horizontal movement mechanism section 204 is configured to move the head unit 203 in the horizontal direction (X direction and Y direction). The head horizontal movement mechanism section 204 includes a support section 241 that supports the head unit 203 so as to be movable in the X direction, and a rail section 242 that supports the support section 241 so as to be movable in the Y direction. The support portion 241 includes a ball screw shaft 241a extending in the X direction and an X-axis motor 241b that rotates the ball screw shaft 241a. The head unit 203 is provided with a ball nut (not shown) that engages with the ball screw shaft 241a of the support portion 241. The head unit 203 is configured to be movable in the substrate transport direction along the support portion 241 together with a ball nut that engages with the ball screw shaft 241a by rotating the ball screw shaft 241a by the X-axis motor 241b. .

The rail section 242 includes a pair of guide rails 242a that support both ends of the support section 241 in the X direction movably in the Y direction, a ball screw shaft 242b extending in the Y direction, and a Y-axis motor that rotates the ball screw shaft 242b. 242c. The support portion 241 is provided with a ball nut (not shown) that engages with the ball screw shaft 242b of the rail portion 242. When the ball screw shaft 242b is rotated by the Y-axis motor 242c, the support portion 241 is movable in the Y direction along with the ball nut that engages with the ball screw shaft 242b along the pair of guide rails 242a of the rail portion 242. It is composed of

The head unit 203 is configured to be movable horizontally on the base 201 by the support section 241 and the rail section 242 of the head horizontal movement mechanism section 204. Thereby, the head 231 of the head unit 203 can move above the component supply section 210 and hold (adsorb) the component E supplied from the component supply section 210. Further, the head 231 of the head unit 203 can move above the substrate P fixed at the substrate fixing position Pa and mount the held (adsorbed) component E onto the substrate P.

The component imaging unit 205 is a camera for component recognition. The component imaging unit 205 images the component E held (adsorbed) by the nozzle of the head 231 while the component E is being transported to the substrate P by the head 231 of the head unit 203 . The component imaging unit 205 is fixed on the upper surface of the base 201, and images the component E held (adsorbed) by the nozzle of the head 231 from the lower side (Z2 direction side) of the component E. Based on the captured image of the component E by the component imaging unit 205, the control unit 207 acquires (recognizes) the holding state of the component E (rotation posture and holding position with respect to the head 231).

The board imaging unit 206 is a camera for board recognition. Before the head 231 of the head unit 203 starts mounting the component E on the board P, the board imaging unit 206 detects a position recognition mark (fiber) attached to the top surface of the board P fixed at the board fixing position Pa. Dual mark) F is imaged from above. The position recognition mark F is a mark for recognizing the position of the substrate P. Based on the captured image of the position recognition mark F by the board imaging unit 206, the control unit 207 acquires (recognizes) the accurate position and orientation of the board P fixed at the board fixing position Pa. Further, the substrate imaging section 206 is attached to the head unit 203. The substrate imaging section 206 is configured to be movable in the horizontal direction together with the head unit 203.

The control unit 207 is a control circuit that controls the operation of the component mounting apparatus 200b. The control unit 207 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The control unit 207 controls the transport unit 202, the component supply unit 210, the X-axis motor 241b, the Y-axis motor 242c, etc. based on the production program, and causes the head unit 203 to mount the component E on the board P. It is configured to control the production of substrates P.

The communication unit 208 is an interface for communicating information. The communication unit 208 communicates between the component mounting device 200b and other devices of the component mounting system 100 (printing device 200a, pre-reflow inspection device 200c, reflow oven 200d, post-reflow inspection device 200e, production control device 300). connect possible.

(Configuration of production control device)
Next, the configuration of the production control device 300 will be described with reference to FIG. 3.

As shown in FIG. 3, the production control device 300 is a device that plans the setup for arranging the component supply unit 210 in the component mounting device 200b (that is, arranging the component E) for a plurality of types of boards P. . The production management device 300 is, for example, a personal computer configured to be able to perform various calculations.

The production management device 300 includes an operation section 301, a display section 302, a communication section 303, a storage section 304, and a control section 305.

The operation unit 301 includes input units such as a mouse and a keyboard, and is configured to accept operations by a user. The display unit 302 includes, for example, a liquid crystal monitor, and displays information such as calculation results for setup. The communication unit 303 is an interface for communicating information. The communication unit 303 communicates between the production control device 300 and other devices of the component mounting system 100 (printing device 200a, component mounting device 200b, pre-reflow inspection device 200c, reflow oven 200d, and post-reflow inspection device 200e). connect possible.

The storage unit 304 is a storage medium including, for example, a flash memory, and is configured to be able to store information. The storage unit 304 stores setup data 310, which is a setup calculation result, and the like. The control unit 305 is a control circuit that controls the operation of the production management device 300. The control unit 305 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory).

The control unit 305 is configured to plan the setup for arranging the component supply unit 210 (that is, arranging the component E) on the component mounting apparatus 200b for a plurality of types of boards P. The control unit 305 is configured to create setup data 310 for a plurality of types of boards P, including information on the arrangement position of the component supply unit 210 in the component mounting apparatus 200b. Based on the setup data 310, the operator performs setup work to arrange the component supply section 210 on the component mounting apparatus 200b prior to producing the board P.

Further, the control unit 305 is configured to create a common setup group when it is possible to create a common setup group in which the arrangement of the component supply units 210 in the component mounting apparatus 200b is common for a combination of multiple types of boards P. has been done. By creating a common setup group, it is possible to reduce the setup work of arranging the component supply unit 210 in the component mounting apparatus 200b with respect to the boards P included in the common setup group.

Here, in the present embodiment, the control unit 305 acquires the common rate of the component E for a combination of multiple types of boards P, and based on the common rate of the component E, the control unit 305 calculates the total production time of the board P. The method is configured to determine a common setup group to be shortened. Specifically, the control unit 305 is configured to sequentially evaluate whether or not it is possible to determine a combination of boards P as a common setup group in descending order of the common rate of parts E.

Furthermore, in the present embodiment, the control unit 305 sequentially evaluates whether or not it is possible to determine a combination of boards P as a common setup group in descending order of the common rate of components E, and When a combination is determined as a common setup group, the combination of boards P that has a lower commonality rate of parts E than a predetermined combination of boards P is configured not to be evaluated. Specifically, the control unit 305 can arrange the component E supply unit in the component E mounting apparatus for a combination of substrates P in which the common rate of components E is smaller than a predetermined combination of substrates P. The configuration is such that evaluations including evaluation as to whether or not it is possible to shorten the total production time of the board P are not performed.

(Common setup group determination process)
Next, with reference to FIG. 4, a common setup group determination process by the production management apparatus 300 of the first embodiment will be described based on a flowchart. Note that each process in the flowchart is performed by the control unit 305.

As shown in FIG. 4, first, in step S101, a combination of substrates P is created or updated. Specifically, in the first step S101, a new combination of substrates P is created. Moreover, in step S101 from the second time onward, the combination of substrates P is updated.

Then, in step S102, the common rate of the components E for each board P combination is obtained (calculated). The common rate of the component E is the rate at which the same component E is used between different types of substrates P. For example, consider a combination of a type A substrate P and a type B substrate P. In this case, the common rate of parts E is the number of parts E that are common between board P of type A and board P of type B, and the total number of parts E used on board P of type A and board P of type B. It can be calculated by dividing by (number of common parts/total number of parts).

Further, in step S102, the calculation result of the common ratio of the components E for each combination of boards P is stored in the storage unit 304. In the second and subsequent steps S102, calculations that overlap with the calculation results of the common ratio of the parts E stored in the storage unit 304 are not performed. Thereby, it is possible to reduce the calculation time of the common rate of the component E in step S102 from the second time onwards.

Then, in step S103, the combinations of substrates P are sorted in descending order of the commonality of components E.

Then, in step S104, it is detected whether there is a combination of substrates P that has not been evaluated yet. If it is detected that there is a combination of substrates P that has not been evaluated, the process advances to step S105.

Then, in step S105, among the unevaluated combinations of substrates P, the combination of substrates P with the highest common rate of components E is set as the combination of substrates P to be evaluated.

Then, in step S106, it is evaluated whether it is possible to arrange the component supply section 210 in the component mounting apparatus 200b. In step S106, the number of component supply units 210 that can be placed in the component mounting apparatus 200b (the number that can be placed) is compared with the number of component supply units 210 that are used in the combination of the board P to be evaluated (the number of used parts). .

When the number of used component supply units 210 exceeds the number of component supply units 210 that can be arranged, it is detected that the component supply units 210 cannot be arranged in the component mounting apparatus 200b. That is, it is determined that the combination of boards P to be evaluated cannot be determined as a common setup group. Then, the process proceeds to step S104, and it is detected whether there are any other combinations of substrates P that have not been evaluated.

Further, when the number of component supply units 210 in use does not exceed the number of component supply units 210 that can be arranged, it is detected that the component supply units 210 can be arranged in the component mounting apparatus 200b. Then, the process advances to step S107.

Then, in step S107, it is evaluated whether it is possible to shorten the total production time of the board P. In step S107, the total production time (first total production time) of the boards P when the combination of boards P to be evaluated is not in a common setup group, and the board when the combination of boards P to be evaluated is in a common setup group. The total production time of P (second total production time) is compared.

If the second total production time exceeds the first total production time, it is detected that the total production time of the substrate P cannot be shortened. That is, it is determined that the combination of boards P to be evaluated cannot be determined as a common setup group. Then, the process proceeds to step S104, and it is detected whether there are any other combinations of substrates P that have not been evaluated.

Further, if the second total production time does not exceed the first total production time, it is detected that the total production time of the substrate P can be shortened. Then, the process advances to step S108.

Note that the total production time of the substrate P is the total production time of multiple types of substrates P. Specifically, the total production time of the board P is the production time of the board P, which is the production number of the board P multiplied by the cycle time (production time per board), and the setup time required for the setup work of the board P. Contains. The setup time includes an internal setup time required for setup work in the component mounting apparatus 200b and an external setup time required for setup work outside the component mounting apparatus 200b. The internal setup time includes the time required to replace the trolley 220, the waiting time for external setup, and the like. Note that the waiting time for external setup may be 0. The external setup time includes the time required to pick up the parts E, the time required to set the parts E in the parts supply section 210, the time required to set the parts supply section 210 on the trolley 220, and the like.

Further, in step S107, the calculation results of the cycle time of each board P, the production time of each board P, and the setup time are stored in the storage unit 304. In the second and subsequent steps S107, calculations that overlap with the calculation results of the cycle time of each board P, the production time of each board P, and the setup time stored in the storage unit 304 are not performed. Thereby, in step S107 from the second time onward, it is possible to reduce the cycle time of each board P, the production time of each board P, and the calculation time of setup time.

Then, in step S108, the combination of substrates P to be evaluated is determined as a common setup group.

Then, the process proceeds to step S101, where the combination of substrates P is updated with a predetermined combination of substrates P determined as a common setup group. Then, the processes of steps S101 to S108 are repeated as appropriate.

Thereafter, when there are no combinations of substrates P that can be included in a common setup group, it is detected in step S104 that there is no combination of substrates P that has not been evaluated. Then, the common setup group determination process ends.

Next, an example of the common setup group determination process in FIG. 4 will be described with reference to FIGS. 5 to 7. Here, an example of planning setup for five types of substrates P, A, B, C, D, and E will be described.

As shown in FIG. 5, first, in step S101, combinations of ten substrates P: AB, AC, AD, AE, BC, BD, BE, CD, CE, and DE are created. Then, in step S102, the common rate of the components E for the combination of the 10 boards P is obtained. Specifically, the common rate of component E in the combination of AB board P is 50%, the common rate of component E in the combination of AC board P is 60%, and the common rate of component E in the combination of AD board P is 50%. 70%, the common rate of component E in the combination of board P in AE is 80%, the common rate in component E in the combination of board P in BC is 40%, the common rate of component E in the combination of board P in BD is 30%. , the common rate of component E in the combination of board P in BE is 20%, the common rate in component E in the combination of board P in CD is 75%, the common rate of component E in the combination of board P in CE is 65%, DE The common rate of parts E in the combination of boards P is 55%.

Then, in step S103, the combinations of the ten boards P are sorted in descending order of the common rate of the parts E. Specifically, AE (80%), CD (75%), AD (70%), CE (65%), AC (60%), DE (55%), AB (50%), BC (40%). %), BD (30%), and BE (20%).

Then, in step S104, since all of the ten combinations of substrates P have not been evaluated, it is detected that there is a combination of substrates P that has not been evaluated.

Then, in step S105, the combination of boards P with AE (80%), which has the highest commonality rate of components E, is set as the combination of boards P to be evaluated.

Then, in step S106, it is detected that it is possible to arrange the component supply section 210 in the component mounting apparatus 200b, and in step S107, it is detected that the total production time of the board P can be shortened. Suppose that it is detected.

In this case, the process advances to step S108, and the combination of AE substrates P is determined as a common setup group.

Then, the process advances to step S101, and the second evaluation is started. In this case, for the combination of boards P of AB, AC, AD, BC, BD, BE, CD, CE, and DE, which have a lower commonality rate of components E than the combination of boards P of AE, the component mounting apparatus 200b An evaluation of whether it is possible to arrange the component supply section 210 (step S106) and an evaluation of whether it is possible to shorten the total production time of the board P (step S107) are performed. do not have.

In the second evaluation, as shown in FIG. 6, first, in step S101, the combination of substrates P in the AE is determined as a common setup group, and the combination of substrates P is updated. That is, six combinations of substrates P, AEB, AEC, AED, BC, BD, and CD, are created. Then, in step S102, the common rate of the component E of the combination of six boards P is obtained. Specifically, the common rate of component E in the combination of AEB's board P is 55%, the common rate of component E in the combination of AEC's board P is 65%, and the common rate of component E in the combination of AED's board P is 55%. 80%, the common rate of component E in the combination of BC board P is 40%, the common rate of component E in the combination of BD board P is 30%, the common rate of component E in the combination of CD board P is 75%. It is. At this time, the calculation of the common rate of the component E for the combination of the boards P of BC, BD, and CD is not performed because it overlaps with the calculation at the time of the first evaluation. For the common rate of these parts E, the calculation results stored in the storage unit 304 at the time of the first evaluation are used.

Then, in step S103, the combinations of the six boards P are sorted in descending order of the commonality of the parts E. Specifically, the combinations of six substrates P are arranged in the following order: AED (80%), CD (75%), AEC (65%), AEB (55%), BC (40%), and BD (30%). are sorted.

Then, in step S104, since all of the six combinations of substrates P have not been evaluated, it is detected that there is a combination of substrates P that has not been evaluated.

Then, in step S105, the combination of boards P of the AED (80%) with the highest commonality rate of components E is set as the combination of boards P to be evaluated.

Assume that it is detected in step S106 that the component supply unit 210 cannot be placed in the component mounting apparatus 200b.

In this case, the process advances to step S105 via step S104, and the combination of boards P of CD (75%) with the next highest commonality rate of component E is set as the combination of boards P to be evaluated.

Then, in step S106, it is detected that it is possible to arrange the component supply section 210 in the component mounting apparatus 200b, and in step S107, it is detected that the total production time of the board P can be shortened. Suppose that it is detected.

In this case, the process advances to step S108, and the combination of CD substrates P is determined as a common setup group.

Then, the process advances to step S101, and the third evaluation is started. In this case, the component supply section 210 may be arranged in the component mounting apparatus 200b for the combination of AEB, AEC, BC, and BD boards P for which the common rate of components E is lower than that of the combination of CD boards P. Evaluation as to whether it is possible (step S106) and evaluation as to whether it is possible to shorten the total production time of the board P (step S107) are not performed.

In the third evaluation, as shown in FIG. 7, first, in step S101, the combination of substrates P is updated with the combination of substrates P for AE and CD determined as a common setup group. That is, a combination of three substrates P, AEB, AECD, and BCD, is created. Then, in step S102, the common rate of the parts E for the combination of the three boards P is obtained. Specifically, the common rate of component E in the combination of AEB's board P is 55%, the common rate of component E in the combination of AECD's board P is 70%, and the common rate of component E in the combination of BCD's board P is 55%. It is 45%. At this time, the calculation of the common rate of the component E for the combination of the AEB board P is not performed because it overlaps with the calculation for the second evaluation. For the common rate of these parts E, the calculation results stored in the storage unit 304 at the time of the second evaluation are used.

Then, in step S103, the combinations of the three boards P are sorted in descending order of the commonality of the parts E. Specifically, the combinations of three substrates P are sorted in the order of AECD (70%), AEB (55%), and BCD (45%).

Then, in step S104, since all three combinations of substrates P have not been evaluated, it is detected that there is a combination of substrates P that has not been evaluated.

Then, in step S105, the combination of boards P of AECD (70%) with the highest commonality rate of components E is set as the combination of boards P to be evaluated.

Assume that it is detected in step S106 that the component supply unit 210 cannot be placed in the component mounting apparatus 200b.

In this case, the process advances to step S105 via step S104, and the combination of AEB (55%) boards P with the next highest commonality rate of component E is set as the combination of boards P to be evaluated.

Assume that it is detected in step S106 that the component supply unit 210 cannot be placed in the component mounting apparatus 200b.

In this case, the process advances to step S105 via step S104, and the combination of BCD (45%) boards P with the next highest commonality rate of component E is set as the combination of boards P to be evaluated.

Assume that it is detected in step S106 that the component supply unit 210 cannot be placed in the component mounting apparatus 200b.

In this case, in step S104, it is detected that there is no combination of substrates P that has not been evaluated. Then, the common setup group determination process ends with the combination of the boards P of AE and CD being determined as a common setup group, and the board P of B being determined as a normal setup group.

(Effects of the first embodiment)
In the first embodiment, the following effects can be obtained.

In the first embodiment, as described above, the control unit 305 acquires the common rate of the parts E for combinations of multiple types of boards P, and based on the common rate of the parts E, controls the control unit 305 to Configure to determine common setup groups that reduce production time. Thereby, based on the common rate of the parts E, it is possible to determine a common setup group that reduces the total production time of the boards P while effectively reducing the number of combination candidates of the boards P for which grouping is to be evaluated. As a result, a common setup group that shortens the total production time of substrates P can be determined without considering all possible combinations of substrates P. Thereby, it is possible to determine a common setup group that reduces the total production time of the substrates P while effectively reducing the processing time for evaluating grouping.

Furthermore, in the first embodiment, as described above, the control unit 305 sequentially evaluates whether or not it is possible to determine the combination of boards P as a common setup group in descending order of the common rate of components E. It is configured as follows. Thereby, candidate combinations of substrates P can be sequentially evaluated in the order of the combinations of substrates P that are most likely to shorten the total production time of the substrates P, which is the order of the highest commonality rate of the components E. As a result, the number of candidate combinations of substrates P for which grouping is to be evaluated can be more effectively reduced.

Further, in the first embodiment, as described above, the control unit 305 sequentially evaluates whether or not it is possible to determine the combination of boards P as a common setup group in descending order of the common rate of components E. , when a predetermined combination of substrates P is determined as a common setup group, the combination of substrates P having a lower common rate of components E than the predetermined combination of substrates P is configured not to be evaluated. As a result, a combination of substrates P having a lower commonality rate of components E than a predetermined combination of substrates P is not evaluated, so that the processing time for evaluating grouping can be reduced accordingly. As a result, it is possible to determine a common setup group that reduces the total production time of the substrates P while more effectively reducing the processing time for evaluating grouping.

Further, in the first embodiment, as described above, the control unit 305 controls the component supply unit 210 in the component mounting apparatus 200b for a combination of substrates P having a smaller common rate of components E than a predetermined combination of substrates P. The configuration is such that evaluations including evaluations as to whether it is possible to arrange the board P and evaluations as to whether the total production time of the board P can be shortened are not performed. As a result, evaluation of whether it is possible to arrange the component supply section 210 in the component mounting apparatus 200b and evaluation of whether it is possible to shorten the total production time of the board P are not performed. Therefore, the processing time for evaluating grouping can be reduced accordingly.

[Second embodiment]
Next, a second embodiment will be described with reference to FIGS. 8 to 10. In this second embodiment, in addition to the configuration of the first embodiment, an example will be described in which grouping is not evaluated when a combination of boards includes predetermined types of boards. Note that the same configurations as those in the first embodiment are shown with the same reference numerals in the drawings, and their explanations will be omitted.

(Configuration of production control device)
As shown in FIG. 8, the production management apparatus 300a according to the second embodiment differs from the production management apparatus 300 according to the first embodiment in that it includes a control section 305a.

In the second embodiment, the control unit 305a is configured not to determine substrates P with a large production volume as a common setup group. Specifically, the control unit 305a controls the control unit 305a to determine whether or not the combination of substrates P exceeds the production number of the substrates P or the production time of the substrates P, which is obtained by multiplying the production number of the substrates P by the cycle time, of the substrates P. When the types include each other, the configuration is such that the combination of boards P is not evaluated as to whether or not it can be determined as a common setup group. Note that the first reference value can be determined in advance through experiments or the like.

In addition, when the combination of boards P includes types of boards P in which the common rate of components E exceeds the second reference value, the control unit 305a controls the , and is configured to evaluate whether or not a combination of substrates P can be determined as a common setup group. Note that the second reference value can be determined in advance through experiments or the like.

(Common setup group determination process)
Next, with reference to FIG. 9, a common setup group determination process by the production management apparatus 300a of the second embodiment will be described based on a flowchart. Note that each process in the flowchart is performed by the control unit 305a. Further, the same processes as in the first embodiment are shown with the same reference numerals in the drawings, and their explanations will be omitted.

As shown in FIG. 9, in step S201, it is evaluated whether the common rate of the components E in the combination of the boards P to be evaluated exceeds the second reference value. In step S201, for example, if the combination of boards P to be evaluated includes boards P with variations that differ only in a few parts E, it is detected that the common rate of parts E exceeds the second reference value. Ru. If it is detected that the common rate of the parts E in the combination of the boards P to be evaluated exceeds the second reference value, step S202 is skipped and the process proceeds to step S106. Then, an evaluation (steps S106, S107) is performed to determine whether or not the combination of boards P to be evaluated can be determined as a common setup group.

Further, if it is detected that the common rate of the components E in the combination of the boards P to be evaluated does not exceed the second reference value, the process proceeds to step S202.

Then, in step S202, it is evaluated whether the combination of substrates P to be evaluated includes substrates P whose production number exceeds the first reference value. If it is detected that the combination of substrates P to be evaluated includes substrates P whose production number exceeds the first reference value, the process proceeds to step S104. In this case, the evaluation (steps S106 and S107) of whether or not the combination of boards P to be evaluated can be determined as a common setup group is not performed.

Further, if it is detected that the combination of substrates P to be evaluated does not include any substrates P whose production number exceeds the first reference value, the process proceeds to step S106. Then, it is evaluated (steps S106 and S107) whether or not the combination of boards P to be evaluated can be determined as a common setup group.

Note that in step S202, it may be evaluated whether the combination of substrates P includes substrates P whose production time exceeds the first reference value.

Further, as shown in FIG. 10, if the combination of substrates P includes a predetermined substrate P that exceeds the production number of substrates P or the production time of substrates P exceeds the first reference value, the predetermined substrate P (FIG. 10 Now, the arrangement of the component supply section 210 in the component mounting apparatus 200b is determined, giving priority to the cycle time of the type A board P). That is, after the optimal arrangement of the component supply unit 210 in the component mounting apparatus 200b for a predetermined board P is determined, the arrangement of the component supply unit 210 in the component mounting apparatus 200b for a predetermined board P is determined, and then the arrangement of the component supply unit 210 in the component mounting apparatus 200b for a predetermined board P is determined. The arrangement of component supply section 210 in component mounting apparatus 200b is determined. According to the arrangement conditions of the component supply section 210, it is possible to optimize the arrangement of a predetermined board P whose production volume is large, so that the total production time of the board P can be easily expected to be shortened. It is possible to evaluate whether it is possible to shorten the time (step S107). This is particularly effective in the configuration of this embodiment, in which substrates P with a large production volume can be distributed to separate common setup groups through the process of step S202.

Note that the other configurations of the second embodiment are the same as those of the first embodiment.

(Effects of the second embodiment)
In the second embodiment, the following effects can be obtained.

In the second embodiment, as described above, the control unit 305a determines that the combination of substrates P is based on the production number of substrates P, or the production time of substrates P obtained by multiplying the production number of substrates P by the cycle time, based on the first standard. When the types of substrates P exceed the value, it is configured not to evaluate whether or not the combination of substrates P can be determined as a common setup group. Here, if the number of boards P produced or the production time of boards P is large, the deterioration of cycle time due to common setup will be large, so even if they are combined, the total production time of boards P will be shortened. It is difficult to predict. Therefore, with the above configuration, grouping is possible for combinations of boards P where the production number of boards P or the production time of boards P is large, and it is difficult to expect a reduction in the total production time of boards P even if they are combined. evaluation may not be performed. As a result, processing time for evaluating grouping can be effectively reduced.

In addition, in the second embodiment, as described above, when the combination of boards P includes types of boards P in which the common rate of components E exceeds the second reference value, the control unit 305a controls the production number of boards P. Alternatively, regardless of the production time of the substrates P, it is configured to evaluate whether or not a combination of substrates P can be determined as a common setup group. Here, even if the number of boards P produced or the production time of boards P is large, if the common rate of parts E is high, the effect of deterioration of cycle time due to common setup is small. Even when combined, the total production time of the board P can be expected to be shortened. Therefore, with the above configuration, even if the production number of boards P or the production time of boards P is large, the grouping evaluation can be performed for combinations of boards P that can reduce the total production time of boards P. It can be performed. As a result, it is possible to effectively determine a common setup group that shortens the total production time of the substrates P while effectively reducing the processing time for evaluating grouping.

Note that other effects of the second embodiment are similar to those of the first embodiment.

[Third embodiment]
Next, a third embodiment will be described with reference to FIGS. 11 to 13. In this third embodiment, in addition to the configuration of the first embodiment, an example will be described in which the arrangement of some component supply units is changed by changing setups. Note that the same configurations as those in the first embodiment are shown with the same reference numerals in the drawings, and their explanations will be omitted.

(Configuration of production control device)
As shown in FIG. 11, the production management apparatus 300b according to the third embodiment differs from the production management apparatus 300 according to the first embodiment in that it includes a control section 305b.

In the third embodiment, the control unit 305b evaluates whether or not it is possible to arrange the component supply units 210 in the component mounting apparatus 200b for the combination of boards P, and also determines the number of component supply units 210. exceeds the number of component supply sections 210 that can be arranged in the component mounting apparatus 200b, by changing the arrangement of some of the component supply sections 210 through setup changes, the number of component supply sections 210 that can be arranged in the component mounting apparatus 200b is The configuration is configured to further evaluate whether it is possible to arrange the component supply unit 210 at the location.

At this time, the control section 305b can arrange the component supply section 210 in the component mounting apparatus 200b for the combination of boards P by changing the arrangement of the component supply section 210 in units of carts 220 by changing the setup. It is configured to evaluate whether or not. In addition, when the component supply unit 210 cannot be arranged in the component mounting apparatus 200b, the control unit 305b controls the component supply unit 210 to be supplied in the component mounting apparatus 200b until the number of carts 220 to be changed (replaced) due to setup change reaches the upper limit. The configuration is configured to repeatedly evaluate whether or not it is possible to arrange the section 210. Note that the upper limit value can be a fixed value or a value manually input by the user. The upper limit value can be, for example, a value obtained by subtracting 1 from the number of carts 220 that can be set on the mounting line 200.

(Common setup group determination process)
Next, with reference to FIG. 12, a common setup group determination process by the production management apparatus 300b of the third embodiment will be described based on a flowchart. Note that each process in the flowchart is performed by the control unit 305b. Further, the same processes as in the first embodiment are shown with the same reference numerals in the drawings, and their explanations will be omitted.

As shown in FIG. 12, in step S106, if the number of component supply units 210 used in the combination of boards P to be evaluated exceeds the number of component supply units 210 that can be arranged in the component mounting apparatus 200b, the component mounting It is detected that the component supply unit 210 cannot be placed in the device 200b. Then, the process advances to step S301.

Then, in step S301, the number of carts 220 to be replaced (changed) is increased by one.

Then, in step S302, it is detected whether the number of carts 220 to be replaced has reached the upper limit. If it is detected that the number of carts 220 to be replaced has not reached the upper limit, the process advances to step S106.

Then, in step S106, it is re-evaluated whether or not it is possible to arrange the component supply section 210 in the component mounting apparatus 200b with the number of carts 220 to be replaced increased. For example, in step S106 of the first re-evaluation (step S106 via step S301 only once), by changing the arrangement of the component supply unit 210 by changing the setup of one trolley 220, the evaluation target board P It is evaluated whether or not it is possible to arrange the component supply section 210 in the component mounting apparatus 200b for the combination of .

If it is detected in step S106 of the first reevaluation that the component supply unit 210 cannot be placed in the component mounting apparatus 200b, the process returns to step S301. Then, in step S301, the number of carts 220 to be replaced (changed) is increased by one, and the number becomes two. Then, the process advances to step S302.

Then, in step S302, it is detected that the number of carts 220 to be replaced has reached the upper limit, or in step S106, it is detected that it is possible to arrange the component supply unit 210 in the component mounting apparatus 200b. The processes of steps S106, S301, and S302 are repeated until it is detected.

If it is detected in step S302 that the number of carts 220 to be replaced has reached the upper limit, the process proceeds to step S104, where it is detected whether there are any other combinations of substrates P that have not been evaluated. Further, if it is detected in step S106 that it is possible to arrange the component supply unit 210 in the component mounting apparatus 200b, the process proceeds to step S107 and determines whether it is possible to shorten the total production time of the board P. It is evaluated whether or not.

Next, with reference to FIG. 13, an example of a common setup group in which the arrangement of some component supply units 210 is changed by setup change will be described. Here, an example will be described in which the combination of AB and board P is determined as a common setup group in which the arrangement of the component supply section 210 is changed by changing the setup of one trolley 220.

As shown in FIG. 13, the number of component supply units 210 used in the combination of AB boards P exceeds the number of component supply units 210 that can be arranged in the component mounting apparatus 200b. By changing the setup of one trolley 220, the combination of AB substrates P is determined as a common setup group. In this case, when switching from production of type A to type B of substrates P, only one trolley 220 is changed due to setup change. In this case, the number of parts supply units 210 used and the replacement parts (changed parts) of the trolley 220 are smaller for the type A board P and the type B board P than if they were determined as separate setup groups. Therefore, it is possible to reduce setup work. Note that if the arrangement of the component supply unit 210 is not changed due to setup change, the combination of AB boards P cannot be determined as a common setup group.

Note that the other configurations of the third embodiment are the same as those of the first embodiment.

(Effects of the third embodiment)
In the third embodiment, the following effects can be obtained.

In the third embodiment, as described above, the control unit 305b evaluates whether or not it is possible to arrange the component supply unit 210 in the component mounting apparatus 200b for a combination of boards P, and also If the number of supply units 210 exceeds the number of component supply units 210 that can be arranged in the component mounting apparatus 200b, the arrangement of some of the component supply units 210 may be changed by changing the setup to accommodate the combination of boards P. , is configured to further evaluate whether or not it is possible to arrange the component supply section 210 in the component mounting apparatus 200b. Thereby, the degree of freedom in combinations of substrates P that can be determined as a common setup group can be increased while reducing the setup work. As a result, a common setup group that reduces the total production time of the substrate P can be determined more effectively.

Note that other effects of the third embodiment are similar to those of the first embodiment.

[Fourth embodiment]
Next, a fourth embodiment will be described with reference to FIGS. 14 and 15. In this fourth embodiment, in addition to the configuration of the first embodiment, an example will be described in which the arrangement of the component supply section in the component mounting apparatus is fixed. Note that the same configurations as those in the first embodiment are shown with the same reference numerals in the drawings, and their explanations will be omitted.

(Configuration of production control device)
As shown in FIG. 14, the production management apparatus 300c according to the fourth embodiment differs from the production management apparatus 300 according to the first embodiment in that it includes a control section 305c.

As shown in FIG. 15, in the fourth embodiment, the control unit 305c is configured to determine the common setup group while fixing the arrangement of the component supply unit 210 in the component mounting apparatus 200b specified in advance. There is. Specifically, the control unit 305c arranges a pre-designated component supply unit 210 at a designated fixed position, and arranges a component supply unit 210 other than the pre-specified component supply unit 210 at a designated fixed position. The configuration is configured to determine a common setup group on the condition that the setup group is placed at a location other than the location where the setup group is located. Note that the fixed position may be a position for each component supply section 210 or a position for each trolley 220. Further, in FIG. 15, for convenience, an example in which the fixed position is a position of 220 carts is illustrated.

The control unit 305c is configured to determine a common setup group for all types of substrates P under the above conditions. Alternatively, the control unit 305c is configured to determine a common setup group for some types of substrates P under the above conditions.

The component supply unit 210 whose arrangement is fixed can be manually set by the user. The user fixes the arrangement of both the component supply unit 210 used for the board P produced in the most recent production plan and the component supply unit 210 used in the board P produced in the production plan after the most recent production plan. It can be set as the component supply section 210. For example, in a state where the parts supply unit 210 used for the board P produced in the latest production plan and the parts supply unit 210 used for the board P produced in the production plan after the most recent production plan are mixed, The component supply unit 210 whose arrangement is fixed is set. That is, the component supply section 210 whose arrangement is fixed may include a component supply section 210 that is not used in the board P produced in the latest production plan.

Note that the other configurations of the fourth embodiment are the same as those of the first embodiment.

(Effects of the fourth embodiment)
In the fourth embodiment, the following effects can be obtained.

In the fourth embodiment, as described above, the control unit 305c is configured to determine the common setup group while fixing the arrangement of the component supply unit 210 in the component mounting apparatus 200b specified in advance. This makes it possible to determine a common setup group while fixing the arrangement of parts supply units 210 that are frequently used throughout a plurality of production plans. As a result, long-term setup work over multiple production plans can be reduced. This makes it possible to shorten the total production time of boards in multiple production plans.

Note that other effects of the fourth embodiment are similar to those of the first embodiment.

[Modified example]
Note that the embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims rather than the description of the embodiments described above, and further includes all changes (modifications) within the meaning and scope equivalent to the claims.

For example, in the present invention, mutually applicable configurations among the configurations described in the first to fourth embodiments may be combined.

Furthermore, in the first to fourth embodiments described above, an example was shown in which the production control device is provided with the control section of the present invention, but the present invention is not limited to this. In the present invention, the control unit of the present invention may be provided in a device other than the production control device, such as a component mounting device.

In addition, in the second embodiment, if the combination of boards includes types of boards whose common rate of parts exceeds the second reference value, regardless of the number of boards produced or the production time of boards, Although an example is shown in which the combinations are evaluated, the present invention is not limited to this. In the present invention, it is not necessary to evaluate whether or not a combination of boards includes types of boards whose common rate of parts exceeds the second reference value. In other words, if a combination of boards includes types of boards whose production quantity or board production time exceeds the first reference value, the combination of boards is always determined as a common setup group. It is also possible not to evaluate whether or not it is possible.

Further, in the third embodiment, an example is shown in which the arrangement of the component supply section is changed by set-up for each trolley during re-evaluation, but the present invention is not limited to this. In the present invention, during re-evaluation, the arrangement of the component supply sections may be changed by setup change for each component supply section.

Further, in the above embodiment, for convenience of explanation, the processing operation of the control unit is explained using a flow-driven flowchart in which the processing is performed sequentially along the processing flow, but the present invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven processing in which processing is executed on an event-by-event basis. In this case, it may be completely event-driven, or it may be a combination of event-driven and flow-driven.

100 component mounting system 200b component mounting apparatus 210 component supply section 305, 305a, 305b, 305c control section E component P board

Claims (10)

a component mounting device that mounts components supplied from the component supply unit onto a board;
a control unit that plans a setup for arranging the component supply unit in the component mounting apparatus for a plurality of types of the boards;
The control unit obtains a common rate of the parts for combinations of a plurality of types of the boards, and determines a common setup group that shortens the total production time of the boards based on the common rate of the parts. It is configured as follows.
The control unit sequentially evaluates whether or not it is possible to determine the combinations of the boards as the common setup group in descending order of the common rate of the parts, and determines whether a predetermined combination of the boards can be determined as the common setup group. , the component mounting system is configured not to evaluate a combination of the substrates in which the common rate of the components is lower than that of the predetermined combination of the substrates . The control unit evaluates whether or not it is possible to arrange the component supply unit in the component mounting apparatus for a combination of boards in which the common rate of the components is smaller than a predetermined combination of boards. 2. The component mounting system according to claim 1 , wherein the component mounting system is configured not to perform evaluation including: and evaluation as to whether or not the total production time of the board can be shortened. a component mounting device that mounts components supplied from the component supply unit onto a board;
a control unit that plans a setup for arranging the component supply unit in the component mounting apparatus for a plurality of types of the boards;
The control unit obtains a common rate of the parts for combinations of a plurality of types of the boards, and determines a common setup group that shortens the total production time of the boards based on the common rate of the parts. It is configured as follows.
When the combination of the substrates includes types of substrates whose production time of the substrates, which is the production number of the substrates or the production number of the substrates multiplied by the cycle time, exceeds a first reference value, . A component mounting system configured to not evaluate whether or not the combination of boards can be determined as the common setup group. If the combination of the boards includes types of boards in which the common rate of the parts exceeds a second reference value, the control unit may control the board combination, regardless of the number of boards produced or the production time of the boards. 4. The component mounting system according to claim 3 , wherein the component mounting system is configured to evaluate whether or not a combination of boards can be determined as the common setup group. a component mounting device that mounts components supplied from the component supply unit onto a board;
a control unit that plans a setup for arranging the component supply unit in the component mounting apparatus for a plurality of types of the boards;
The control unit obtains a common rate of the parts for combinations of a plurality of types of the boards, and determines a common setup group that shortens the total production time of the boards based on the common rate of the parts. It is configured as follows.
The control unit evaluates whether or not it is possible to arrange the component supply units in the component mounting apparatus with respect to the combination of boards, and determines whether the number of component supply units can be arranged in the component mounting apparatus. If the number of the component supply sections that can be arranged exceeds the number, the arrangement of some of the component supply sections can be changed by setup change, so that the component supply sections can be arranged in the component mounting apparatus for the combination of the boards. A component mounting system configured to further evaluate whether placement is possible. a component mounting device that mounts components supplied from the component supply unit onto a board;
a control unit that plans a setup for arranging the component supply unit in the component mounting apparatus for a plurality of types of the boards;
The control unit obtains a common rate of the parts for combinations of a plurality of types of the boards, and determines a common setup group that shortens the total production time of the boards based on the common rate of the parts. It is configured as follows.
The component mounting system, wherein the control unit is configured to determine the common setup group while fixing the arrangement of the component supply unit in the component mounting apparatus specified in advance. a step of planning a setup for arranging the component supply unit in a component mounting apparatus that mounts components supplied from the component supply unit onto the board for a plurality of types of boards;
The step of planning the setup includes:
obtaining a common rate of the parts for combinations of a plurality of types of the boards;
determining a common setup group that reduces the total production time of the board based on the common rate of the parts ,
The step of determining the common setup group includes sequentially evaluating whether or not it is possible to determine the combinations of the boards as the common setup group in descending order of the common rate of the parts, and selecting a predetermined combination of the boards. is determined as the common setup group, the method includes the step of not evaluating a combination of boards in which the common rate of the parts is lower than a predetermined combination of boards . a step of planning a setup for arranging the component supply unit in a component mounting apparatus that mounts components supplied from the component supply unit onto the board for a plurality of types of boards;
The step of planning the setup includes:
obtaining a common rate of the parts for combinations of a plurality of types of the boards;
determining a common setup group that reduces the total production time of the board based on the common rate of the parts,
The step of determining the common setup group includes determining whether the combination of the substrates exceeds the production number of the substrates, or the production time of the substrates obtained by multiplying the production number of the substrates by the cycle time of the substrates. A group determination method for a component mounting system , including the step of not evaluating whether or not the combination of boards can be determined as the common setup group when the combination of boards includes each other . a step of planning a setup for arranging the component supply unit in a component mounting apparatus that mounts components supplied from the component supply unit onto the board for a plurality of types of boards;
The step of planning the setup includes:
obtaining a common rate of the parts for combinations of a plurality of types of the boards;
determining a common setup group that reduces the total production time of the board based on the common rate of the parts,
The step of determining the common setup group includes evaluating whether or not it is possible to arrange the component supply units in the component mounting apparatus for the combination of boards, and determining whether the number of component supply units is If the number of the component supply sections that can be arranged in the component mounting apparatus is exceeded, by changing the arrangement of some of the component supply sections through setup change, the number of component supply sections that can be arranged in the component mounting apparatus is changed for the combination of boards. A group determining method for a component mounting system, including the step of further evaluating whether or not it is possible to arrange the component supply section. a step of planning a setup for arranging the component supply unit in a component mounting apparatus that mounts components supplied from the component supply unit onto the board for a plurality of types of boards;
The step of planning the setup includes:
obtaining a common rate of the parts for combinations of a plurality of types of the boards;
determining a common setup group that reduces the total production time of the board based on the common rate of the parts,
A group determining method for a component mounting system, wherein the step of determining the common setup group includes determining the common setup group while fixing the arrangement of the component supply section in the component mounting apparatus specified in advance.

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