JP7233974B2 - Component mounting equipment and component mounting system - Google Patents

Description

The present invention relates to a component mounting apparatus and a component mounting system, and more particularly to a component mounting apparatus and a component mounting system having a head for mounting a component on a substrate.

2. Description of the Related Art Conventionally, there has been known a component mounting apparatus provided with a head for mounting a component on a substrate (see, for example, Patent Document 1).

The aforementioned Patent Document 1 discloses a component mounting apparatus (component mounting apparatus) having a suction head (head) that mounts a component supplied from a feeder onto a substrate. Further, the component mounting apparatus of Patent Document 1 includes a height sensor and a control section.

In the component mounting apparatus disclosed in Patent Literature 1, the controller moves the height sensor to the mounting position where the components are mounted on the board after mounting the components on the board by the suction head for all the components. It is configured to perform control to inspect whether or not it is mounted on the board. In the component mounting apparatus of Patent Literature 1, the control section is configured to perform control for inspecting whether or not the components are mounted on the board by means of the height sensor for all the components.

JP-A-2000-13097

However, in the component mounting apparatus of Patent Literature 1, all components to be mounted on the board are inspected to determine whether or not the component is mounted on the board. Therefore, in the component mounting apparatus of Patent Document 1, every time a component is mounted, the component is moved to the mounting position where the component is mounted on the board and the component is inspected each time, which increases the mounting work time. There is

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and aims to increase the mounting work time by reducing the number of component inspections performed by moving to a component mounting position on a substrate. It is an object of the present invention to provide a component mounting apparatus and a component mounting system that can be suppressed.

In order to achieve the above object, a component mounting apparatus according to a first aspect of the present invention comprises a head unit that holds a component and mounts the component by placing the component at a target position on a board; A first inspection is performed for inspecting whether or not there is a possibility that the mounting position when the component is mounted on the substrate is defective based on the mounting path of , and as a result of the first inspection, the mounting position is normal. In the case, the second inspection for inspecting the actual mounting position of the component is not performed, and if there is a possibility that the mounting position is defective as a result of the first inspection, the second inspection is performed.

In the component mounting apparatus according to the first aspect of the present invention, as described above, it is inspected based on the component mounting path whether or not there is a possibility that the mounting position when the component is mounted on the substrate will be defective. A control unit is provided that performs a second inspection for inspecting the actual mounting position of the component when there is a possibility that the mounting position is defective as a result of the first inspection. As a result, it is possible to perform the second inspection in which only the components, among the components to be mounted on the board, which have been determined to be defective in the component mounting position in the first inspection, are moved to the actual component mounting position and inspected. Therefore, it is possible to reduce the number of times of performing the second inspection in which the component is inspected by moving to the actual mounting position. As a result, it is possible to suppress an increase in the mounting work time by reducing the number of times of the second inspection of the component that is performed by moving to the component mounting position on the board. Also, by performing the first inspection before the second inspection, there is a possibility that the actual mounting position of the component is defective earlier than moving the component to the actual mounting position where the component is mounted on the board and performing the inspection. can be discovered that there is

The component mounting apparatus according to the first aspect of the present invention preferably further includes an imaging section for imaging the target position of the board and the periphery of the target position, and the control section determines that the mounting position is defective as a result of the first inspection. When there is a possibility, it is configured to perform control for imaging the actual mounting position of the component by the imaging unit in the second inspection. With this configuration, it is possible to reduce the number of times of the second inspection, which requires an inspection time longer than that of the first inspection, by moving the imaging unit and performing the inspection. Therefore, the imaging unit performs the second inspection. Even in such a case, it is possible to suppress an increase in mounting work time.

In the component mounting apparatus according to the first aspect of the present invention, preferably, the control unit detects that the component is positioned in the installation position inspection section provided corresponding to the height position above the upper surface position of the board. is configured to perform control to start the first inspection. With this configuration, unlike the case where the first inspection is performed at the height position of the upper surface of the substrate, the first inspection can be performed even when the component is placed on the upper surface of the substrate having warpage. As a result, since the first inspection can be performed regardless of the state of the upper surface of the board, it is possible to reliably determine the mounting position of the component when it is placed on the board by the first inspection.

In this case, preferably, the control unit is configured to perform control to perform the first inspection based on the position of the component when it passes through the installation position inspection section in the component mounting path. With this configuration, the first inspection can be performed by specifying a portion of the component mounting path where the component may have been placed on the substrate without performing the first inspection over the entire component mounting path. can be performed, the first inspection can be performed efficiently.

In the component mounting apparatus having a configuration in which the control unit starts the first inspection based on the component being positioned in the installation position inspection section, preferably, the control unit controls the portion corresponding to the defective position range in the installation position inspection section. Based on the position of the component, control is performed to determine that the mounting position of the component mounted on the substrate in the first inspection is defective. With this configuration, the defective position range is provided corresponding to the height position above the upper surface position of the substrate, so that the component is installed on the upper surface of the substrate having warpage, and the component is placed on the upper surface of the substantially flat substrate. Even if the height position of the component is positioned higher than when the component is installed, it is inspected whether there is a possibility that the mounting position when the component is installed on the substrate will be defective by the first inspection. be able to. As a result, since the first inspection can be performed regardless of the state of the upper surface of the substrate, it is possible to reliably determine whether the mounting position is defective when the device is installed on the substrate in the first inspection.

In this case, preferably, in the first inspection, the control unit determines the difference between the target horizontal position in the horizontal direction of the component when mounted at the target position and the component horizontal position in the horizontal direction of the component held by the head. Based on this, it is configured to perform control to determine whether or not the component is positioned in the portion corresponding to the defective position range in the installation position inspection section. With this configuration, in the first inspection, there is a possibility that the mounting position of the component when it is mounted on the board may be defective due to the displacement of the component horizontal position in the horizontal direction of the component held by the head with respect to the target horizontal position. It is possible to check whether there is This makes it possible to easily perform the first inspection.

In the component mounting apparatus according to the first aspect of the present invention, preferably the control section is configured to perform control to end the first inspection based on the placement of the component on the board. With this configuration, the first inspection can be performed until the component is installed on the board, so that the mounting position of the component when installed on the board can be determined more accurately by the first inspection.

In the component mounting apparatus having the configuration including the imaging unit, preferably, the control unit determines that the actual mounting position of the component is defective based on the target position and the peripheral image of the target position captured by the imaging unit in the second inspection. Based on this fact, it is configured to perform control to notify the operator and stop the mounting work. With this configuration, the operator can quickly perform recovery work on the component mounting apparatus, so that the downtime of the mounting work can be shortened.

The component mounting apparatus having the configuration including the imaging unit preferably further includes a display unit for displaying the target position imaged by the imaging unit and an image around the target position. is configured to display an image captured by the imaging unit in the second examination on the display unit so that the determination can be made. With this configuration, the operator can confirm the target position and the actual mounting position of the component by actually looking at the image displayed on the display unit, so that the operator can check whether the component is normal or defective with respect to the actual mounting position of the component. can be appropriately determined by the operator.

In the component mounting apparatus according to the first aspect, preferably, when the result of the second inspection determines that the actual mounting position of the component is defective, the control section moves the component to the actual mounting position determined to be defective. Based on this, it is configured to perform control to update the map showing the defective locations on the board. With this configuration, the map updated by the component mounting apparatus can be referred to by the working device arranged downstream of the component mounting apparatus. It is possible to appropriately change the work on the substrate in the work device arranged downstream. For example, when a defective portion is indicated on the map, it is possible to change the defective portion of the board indicated on the map so that the work device arranged downstream of the component mounting apparatus does not work on the defective portion. As a result, not only the mounting work of the component mounting apparatus, but also the work for the board in the working device arranged downstream from the component mounting apparatus can be made more efficient, thereby suppressing an increase in the work time for producing the board. can do.

A component mounting system according to a second aspect of the present invention is a component mounting system comprising the component mounting apparatus according to the first aspect, wherein the component mounting apparatus has a defect in the actual mounting position of the component as a result of the second inspection. a control unit for updating a map showing defective locations on the board based on the actual mounting position determined to be defective when it is determined to be defective.

In the component mounting system according to the second aspect of the present invention, as described above, it is inspected based on the component mounting path whether or not there is a possibility that the mounting position when the component is mounted on the substrate will be defective. A component mounting apparatus having a control unit for performing a second inspection for inspecting an actual mounting position of a component when there is a possibility that the mounting position is defective as a result of the first inspection. Then, the control unit is configured to update the map showing the defective locations of the board based on the actual mounting position determined to be defective in the result of the second inspection. As a result, it is possible to perform the second inspection only on the components to be mounted on the substrate that are determined to be defective in the component mounting position in the first inspection. It is possible to reduce the number of times the second inspection is performed. As a result, it is possible to obtain a component mounting system capable of suppressing an increase in mounting work time by reducing the number of times the component is moved to the component mounting position on the substrate and subjected to the second inspection. Further, since the map updated by the component mounting apparatus can be referred to by the work apparatus arranged downstream of the component mounting apparatus, the work apparatus arranged downstream of the component mounting apparatus can be arranged according to the defective portion shown in the map. It is possible to appropriately change the work on the substrate in the working device that For example, when a defective portion is indicated on the map, it is possible to change the defective portion of the board indicated on the map so that the work device arranged downstream of the component mounting apparatus does not work on the defective portion. As a result, not only the mounting work of the component mounting apparatus, but also the work for the board in the working device arranged downstream from the component mounting apparatus can be made efficient, so that the increase in the work time for producing the board can be suppressed. It is possible to obtain a component mounting system capable of

The component mounting system according to the second aspect preferably further comprises a server connected to the control unit of the component mounting apparatus via a network and controlling acquisition of the map updated by the control unit of the component mounting apparatus. With this configuration, maps can be collectively managed by the server, so the convenience of submaps can be improved.

According to the present invention, as described above, it is possible to suppress an increase in the mounting work time by reducing the number of component inspections performed by moving to the component mounting position on the board.

1 is a plan view showing an outline of a component mounting apparatus according to first to third embodiments; FIG. 1 is a side view showing an outline of a component mounting apparatus according to first to third embodiments; FIG. 1 is a block diagram showing a control configuration of a component mounting apparatus according to first to third embodiments; FIG. FIG. 4 is a plan view showing movement of an electronic component held by a mounting head in the component mounting apparatus according to the first embodiment from a suction position to a predetermined position on the substrate; FIG. 5 is an enlarged view of the Z portion of FIG. 4; FIG. 4 is a schematic diagram showing a first inspection process performed in the component mounting apparatus according to the first embodiment; FIG. 4 is a schematic diagram showing a first inspection section of a first inspection process performed in the component mounting apparatus according to the first embodiment; FIG. 5 is a schematic diagram showing a second inspection interval of the first inspection process performed in the component mounting apparatus according to the first embodiment; FIG. 4 is a schematic diagram showing a second inspection process performed in the component mounting apparatus according to the first embodiment; FIG. 3 is a schematic diagram showing an image of a predetermined portion of a board captured by a board recognition camera of the component mounting apparatus according to the first embodiment; FIG. 2 is a schematic diagram showing a case where an electronic component is mounted on a board by a first route as an example in the component mounting apparatus according to the first embodiment; FIG. 4 is a schematic diagram showing a case where an electronic component is mounted on a board by a second route as an example in the component mounting apparatus according to the first embodiment; FIG. 4 is a schematic diagram showing a case where an electronic component is mounted on a board by a third route as an example in the component mounting apparatus according to the first embodiment; FIG. 4 is a schematic diagram showing a case where an electronic component is mounted on a board by a fourth route as an example in the component mounting apparatus according to the first embodiment; 4 is a flow chart showing mounting processing performed in the control unit of the component mounting apparatus according to the first embodiment; 4 is a flowchart showing mounting processing performed by a control unit of the component mounting apparatus according to the first embodiment; 10 is a flow chart showing mounting processing performed by a control unit of the component mounting apparatus according to the second embodiment; FIG. 11 is a block diagram showing a component mounting system according to a third embodiment; FIG. FIG. 19A is a schematic diagram showing a state in which the updated submap is transmitted to the server in the printing apparatus. FIG. 19B is a schematic diagram showing a state in which a submap is acquired from a server and referred to in the component mounting apparatus. FIG. 19C is a schematic diagram showing a state in which the updated submap is transmitted to the server in the component mounting apparatus. 10 is a flow chart showing mounting processing performed by a control unit of a component mounting apparatus according to a third embodiment;

Embodiments embodying the present invention will be described below with reference to the drawings.

[First embodiment]
The configuration of a component mounting apparatus 1 according to the first embodiment will be described with reference to FIGS. 1 to 14. FIG.

As shown in FIG. 1, the component mounting apparatus 1 is configured to mount electronic components E such as ICs, transistors, capacitors and resistors on a substrate B such as a printed circuit board. Note that the electronic component E is an example of the "component" in the scope of claims.

Here, in the component mounting apparatus 1, the transport direction in which the board B is transported is the X1 direction, the direction opposite to the transport direction in which the board B is transported is the X2 direction, and the direction orthogonal to the X direction in the horizontal direction is the Y direction. . Further, in the component mounting apparatus 1, the vertical direction orthogonal to the X direction and the Y direction is defined as the Z direction.

The component mounting apparatus 1 includes a base 2, a feeder placement section 3, a board transfer section 4, a head unit 5, a support section 6, a rail section 7, a component recognition camera 8, a board recognition camera 9, A display unit 10 and a control unit 11 are provided. Note that the substrate recognition camera 9 is an example of the "imaging unit" in the scope of claims.

(base)
The base 2 is a base on which components are arranged in the component mounting apparatus 1 . A board transfer section 4, a rail section 7, and a component recognition camera 8 are provided on the base 2 as constituent elements. Further, a control unit 11 is provided inside the base 2 . Further, the base 2 is provided with feeder arrangement portions 3 on which a plurality of tape feeders 12 can be arranged on both sides in the Y direction (the Y1 direction side and the Y2 direction side).

(tape feeder)
The tape feeder 12 is a device that supplies the electronic components E mounted on the substrate B. As shown in FIG. The tape feeder 12 holds a reel (not shown) wound with a tape holding a plurality of electronic components E at predetermined intervals. Further, the tape feeder 12 is configured to rotate the held reel and feed the tape according to the component holding operation for taking out the electronic component E by the head unit 5 . The tape feeder 12 is configured to feed the electronic component E from the leading end (suction position A) on the working position W side by feeding the tape.

(substrate transfer section)
The board transfer section 4 is configured to load the board B from the outside of the component mounting apparatus 1 and transfer the board B in the transfer direction (X1 direction). The substrate transfer section 4 includes a pair of conveyor sections 41 and a drive motor 42 for rotating the pair of conveyor sections 41 . Each of the pair of conveyor sections 41 has a pulley (not shown) and a loop-shaped conveying belt looped around the pulley. The control unit 11 is configured to control the transport speed of the substrate B placed on the pair of conveyor units 41 by controlling the drive motor 42 .

(head unit)
The head unit 5 is a head unit 5 for component mounting, and is configured to mount an electronic component E on a substrate B fixed at a working position W, as shown in FIG. Specifically, the head unit 5 holds the electronic component E, and installs the electronic component E at the target mounting position C (see FIG. 5) of the substrate B, thereby mounting the electronic component E on a plurality of (four) head units. mounting head 51. The mounting head 51 is an example of the "head" in the claims.

Each of the plurality of mounting heads 51 is connected to a pressure generator (not shown), and is configured to be able to hold (adsorb) the electronic component E to the nozzle attached to the tip by the negative pressure generated by the pressure generator. It is Further, each of the plurality of mounting heads 51 is configured to be able to mount the electronic component E on the substrate B by switching the negative pressure generated by the pressure generating device to positive pressure.

Each of the plurality of mounting heads 51 is configured to be movable in the Z direction (vertical direction) by a Z-axis motor 52 . Moreover, each of the plurality of mounting heads 51 is configured to be rotatable around the rotation axis by an R-axis motor 53 (see FIG. 3). Here, each of the plurality of mounting heads 51 has a spring that suppresses the load generated when the electronic component E contacts the board B so that the timing at which the electronic component E contacts the board B can be accurately detected. not. In addition, each of the plurality of mounting heads 51 may have a spring that suppresses a load generated when the electronic component E contacts the substrate B. FIG.

(support part)
As shown in FIG. 1, the support section 6 is configured to support the head unit 5 so as to be movable in the transport direction (X1 direction) and in the direction opposite to the transport direction (X2 direction). Specifically, the support section 6 includes a ball screw shaft 61 extending in the transport direction and an X-axis motor 62 that rotates the ball screw shaft 61 . The head unit 5 is provided with a ball nut (not shown) that engages with the ball screw shaft 61 of the support portion 6 . When the ball screw shaft 61 is rotated by the X-axis motor 62 , the head unit 5 is configured to be movable in the transport direction together with the ball nut that engages with the ball screw shaft 61 .

(Rail part)
The pair of rail portions 7 are configured to support the support portion 6 so as to be movable in the Y direction. Specifically, the rail portion 7 includes a ball screw shaft 71 extending in the Y direction and a Y-axis motor 72 that rotates the ball screw shaft 71 . The support portion 6 is provided with a ball nut (not shown) that engages with the ball screw shaft 71 of the rail portion 7 . When the ball screw shaft 71 is rotated by the Y-axis motor 72 , the support portion 6 is configured to be movable in the Y direction together with the ball nut that engages with the ball screw shaft 71 .

With such a configuration, the head unit 5 is configured to be movable on the base 2 in the horizontal plane (in the X direction and the Y direction). As a result, the head unit 5 moves above the substrate B fixed at the working position W, and the electronic component E held by the mounting head 51 is placed on the substrate where the target mounting position C (see FIG. 5) is set. It can be mounted at a predetermined position B1 (see FIG. 5: component mounting position) on B.

Here, the target mounting position C is the target horizontal position C1 (see FIG. 5) in the XY (horizontal) direction at the center of the predetermined position B1 in plan view, and the position of the substrate B on the Z1 direction side (upward direction side). (target height position C2 (see FIG. 6)). Further, the target height position C2 indicates the vicinity of the height position of the upper end of the electronic component E based on the upper surface position B2 of the board B set according to the height of the electronic component E mounted on the board B. . The target mounting position C is an example of the "target position" in the scope of claims.

(Component recognition camera)
The component recognition camera 8 is a camera for capturing an image of the electronic component E held (adsorbed) by the mounting head 51 prior to mounting the electronic component E on the board B, as shown in FIG. The component recognition camera 8 is fixed on the base 2 and configured to capture an image of the electronic component E held (adsorbed) by the mounting head 51 from below the electronic component E (Z2 direction).

(PCB recognition camera)
The board recognition camera 9 is attached to the head unit 5, and prior to mounting the electronic component E on the board B, the FI mark (fiducial mark) (not shown) attached to the upper surface of the board B is ) is a camera for capturing a mark. The FI mark is a mark for confirming the position of the substrate B. FIG.

Further, the board recognition camera 9 is configured to capture an image of the target mounting position C and the surroundings of the target mounting position C of the board B. FIG. Note that the periphery of the target mounting position C indicates an area in the vicinity of the predetermined location B1 including the predetermined location B1 on the substrate B (see FIG. 5).

(Display part)
The display unit 10 is configured to notify the operator of information regarding the electronic component E mounted on the board B, and the like. That is, the display unit 10 has a function of displaying the peripheral image M (see FIG. 10) captured by the board recognition camera 9. FIG. Specifically, the display unit 10 is composed of a liquid crystal display or the like, and is configured to display information transmitted from the control unit 11 on a screen.

(control part)
The control unit 11 is a control circuit that controls the operation of the component mounting apparatus 1, including a CPU 11a (Central Processing Unit), a storage unit 11b, and the like, as shown in FIG. The control section 11 is electrically connected to the tape feeder 12 , the board transfer section 4 , the head unit 5 , the component recognition camera 8 , the board recognition camera 9 , the X-axis motor 62 , the Y-axis motor 72 and the display section 10 .

Based on the mounting process of the electronic component E including the first inspection process (first inspection P1) and the second inspection process (second inspection P2) for inspecting the electronic component E mounted on the board B, the storage unit 11b stores An implementation program P is stored. Further, the storage unit 11b stores inspection data K including information for performing the first inspection P1 and the second inspection P2.

(examination data)
The inspection data K includes a target mounting position C, a target horizontal position C1, a target height position C2, a component center position D, a component horizontal position D1, a head height position D2, a defective position range F, a normal position range N, and an installation position inspection. It has a section S, a mounting position V (assumed mounting position), failure prediction information T, a peripheral image M, and an actual mounting position R. Target mounting position C, target horizontal position C1, target height position C2, component center position D, component horizontal position D1, head height position D2, defective position range F, normal position range N, installation position inspection section S , the mounting position V, the failure prediction information T, the peripheral image M, and the actual mounting position R will be described in relation to the mounting process of the electronic component E. FIG. Note that the component center position D is an example of "the position of the component when passing through the installation position inspection section" in the scope of claims. The mounting position V is an example of "the mounting position when the component is mounted on the substrate" in the scope of claims. Also, the actual mounting position R is an example of the "actual mounting position" in the claims.

As shown in FIG. 4, the electronic component E is mounted on the board B by executing the mounting process in the component mounting apparatus 1 . The mounting process includes a suction process, a component recognition process, a mounting process including a first inspection process, and a second inspection process.

The suction process is a process of causing the mounting head 51 to generate a negative pressure to hold the electronic component E placed at the suction position A of the tape feeder 12 . In the component recognition process, the electronic component E held by the mounting head 51 is imaged by the component recognition camera 8, and the posture of the electronic component E and the center position in the XY direction (horizontal direction) are recognized (obtained) by the control unit 11. It is a process to let Here, the center position in the XY direction (horizontal direction) of the electronic component E acquired in the component recognition process is the component center position D (see FIG. 5).

As shown in FIG. 5, the component center position D is defined as the component horizontal position D1 in the XY (horizontal) direction and the Z2 direction side of the mounting head 51 at the center of the electronic component E held by the mounting head 51 in plan view. (downward side) and the lower end position. The lower end position of the mounting head 51 in the Z2 direction (downward direction) indicates the head height position D2 (see FIG. 6). The coordinates of the component center position D change as the mounting head 51 moves.

As shown in FIGS. 4 and 6, the mounting process is a process of recognizing the component center position D in the component recognition process and then placing the electronic component E at a predetermined location B1 on the board B using the mounting head 51 . That is, in the mounting process, the electronic component E held by the mounting head 51 positioned on the Z1 direction side (upward side) of the component recognition camera 8 is moved to a predetermined position B1 on the board B, and the electronic component E is held. is released and placed on the substrate B.

Here, "placement" indicates that the electronic component E is placed on the substrate B by releasing the electronic component E from the mounting head 51 that is held by the mounting head 51 .

5 and 6, in the mounting process, the electronic component E held by the mounting head 51 is moved so that the component center position D and the target mounting position C at the predetermined location B1 of the board B are aligned. It is a process to let That is, the mounting process is a process of moving the electronic component E held by the mounting head 51 in the XY and Z directions.

Here, the movement of the electronic component E held by the mounting head 51 in the XY directions is set by the XY movement time based on the difference between the component horizontal position D1 of the component center position D and the target horizontal position C1 of the target mounting position C. ing. Further, the movement of the electronic component E held by the mounting head 51 in the Z direction is set by the Z movement time based on the difference between the head height position D2 of the component center position D and the target height position C2 of the target mounting position C. It is Also, the descent start position (see FIG. 4) at which the electronic component E held by the mounting head 51 starts to be lowered is set by the XY movement time and the Z movement time. As a result, the electronic component E held by the mounting head 51 moves from the component center position D obtained in the component recognition process to the target mounting position C according to the XY movement time, Z movement time, and descent start position. . Here, the path along which the electronic component E held by the mounting head 51 moves is defined as a mounting path U (moving path).

The arrival of the electronic component E held by the mounting head 51 at the target mounting position C is detected by measuring a change in the current value supplied to the Z-axis motor 52 or a change in the load applied to the mounting head 51. there is

The first inspection process is a process of virtually inspecting positional deviation between the component center position D of the electronic component E and the target mounting position C of the predetermined location B1. That is, the first inspection P1 is an inspection for determining whether or not there is a possibility that the mounting position of the electronic component E when it is mounted on the substrate B will be defective based on the mounting path U of the electronic component E. . It should be noted that the term "virtual" refers to processing performed using the numerical data of the inspection data K stored in the storage unit 11b by the control unit 11. FIG.

The first inspection process is a process in which the electronic component E placed on the board B is not actually recognized by the board recognition camera 9 . Specifically, the first inspection process is a process of virtually inspecting the positional deviation using the normal position range N, the defective position range F, the installation position inspection section S, and the mounting position V. FIG. That is, the first inspection process is a process of virtually inspecting in which of the normal position range N and the defective position range F the component center position D of the electronic component E is located.

Here, the normal position range N indicates the range in which the positional deviation between the component center position D and the target mounting position C is allowed when the electronic component E is actually installed on the predetermined position B1 of the board B. Numeric range. That is, the normal position range N indicates a range in which the positional deviation between the component center position D and the target mounting position C is within the threshold value when the electronic component E is actually installed on the predetermined position B1 of the board B. . Note that normal means a state in which the component center position D is positioned within the normal position range N.

The defective position range F is a numerical range indicating a range in which positional deviation between the component center position D and the target mounting position C is not allowed when the electronic component E is actually installed on the predetermined location B1 of the board B. . That is, the defective position range F indicates the range in which the positional deviation between the component center position D and the target mounting position C is outside the threshold when the electronic component E is actually installed on the predetermined position B1 of the board B. . It should be noted that "abnormality" means a state in which the component center position D is positioned within the defective position range F.

The installation position inspection section S is a numerical range indicating the range in the Z direction (vertical direction) where the component center position D is located in a state where the electronic component E may be installed on the board B. The state in which the electronic component E may be installed on the substrate B means the state in which the electronic component E is installed on the upper surface of the substrate B that is substantially flat, or the state in which the electronic component E is installed on the upper surface of the substrate B that has a warp or the like. Indicates whether E is installed.

Specifically, the installation position inspection section S is provided so as to correspond to the height position Up in the Z1 direction (upward direction) from the upper surface position B2 of the substrate B. As shown in FIG. Here, the height position Up of the installation position inspection section S is set by the maximum height position of the assumed component center position D in a state where the electronic component E may be installed on the board B.

The installation position inspection section S is a section obtained by combining the first inspection section S1 and the second inspection section S2. The first inspection section S1 and the second inspection section S2 are continuous sections in the Z direction. The second inspection section S2 is set on the Z1 direction side (upward direction side) of the first inspection section S1.

As shown in FIG. 7, the first inspection section S1 is a state in which the electronic component E is installed on the upper surface of the substrate B which is substantially flat (ideal) as a state in which the electronic component E may be installed on the substrate B. , is a numerical range indicating a range corresponding to the upper surface of the substrate B and the height position of the electronic component E (target height position C2). Here, the height position of the first inspection section S1 is set based on the assumed maximum height position of the electronic component E in a state where the electronic component E may be placed on the substantially flat board B. A normal position range N and a defective position range F are set in the first inspection section S1.

As shown in FIG. 8, the second inspection section S2 is a state in which the electronic component E is installed on the upper surface of the substrate B, which may be warped as a state in which the electronic component E may be installed on the substrate B. It is a numerical range showing the range corresponding to the height position of one inspection section S1 and the height position of the electronic component E. FIG. Here, the height position of the second inspection section S2 is set based on the assumed maximum height position of the electronic component E in a state where the electronic component E may be installed on the board B having warpage. The same normal position range N and defective position range F as in the first inspection section S1 are set in the second inspection section S2.

As shown in FIG. 6, the mounting position V indicates the component center position D of the electronic component E in a state where the electronic component E may be mounted on the substrate B. As shown in FIG. That is, the mounting position V indicates the coordinates of the installation position inspection section S of the mounting route U. FIG. The mounting position V changes as the component center position D held by the mounting head 51 in the installation position inspection section S moves.

The first inspection process is a process of storing failure prediction information T in the storage unit 11b when the mounting position V is located in the failure position range F. FIG. Here, the defect prediction information T is data indicating that the mounting position of the electronic component E may be defective.

The second inspection process, as shown in FIGS. 9 and 10, is a process of actually inspecting the positional deviation between the component center position D of the electronic component E and the target mounting position C of the predetermined location B1. In other words, the second inspection process indicates the process of inspecting the actual mounting position R of the electronic component E. FIG.

The second inspection process is a process in which an image is captured by the board recognition camera 9 arranged on the Z1 direction side (upward side) of the predetermined portion B1 of the board B. FIG. The second inspection process is a process of inspecting positional deviation between the component center position D on the peripheral image M actually captured by the board recognition camera 9 and the target mounting position C on the peripheral image M. FIG. As described above, the second inspection process is a process of inspecting whether the component center position D of the electronic component E is located in either the normal position range N or the defective position range F on the peripheral image M.

Here, the peripheral image M indicates image data obtained by imaging an area in the vicinity of a predetermined location B1 including a predetermined location B1 (land) on the substrate B, as shown in FIG. Further, the actual mounting position R indicates the component center position D on the peripheral image M. As shown in FIG.

(Implementation program)
The implementation program P will be described with reference to FIGS. 9 to 14. FIG. In the description of the implementation program P, the first inspection process is abbreviated as a first inspection P1 and the second inspection process as a second inspection P2. Although FIGS. 11 to 14 show the first to fourth paths, respectively, the implementation program P will be described below with reference to the first path in FIG.

As shown in FIG. 11, the control unit 11 of the present embodiment executes the mounting program P to check whether or not the mounting position V may become defective based on the mounting path U. The configuration is such that the inspection P1 is performed, and the second inspection P2 is performed when there is a possibility that the mounting position V is defective as a result of the first inspection P1. That is, the control unit 11 is configured to perform control to inspect the actual mounting position R when the mounting position V is determined to be defective in the first inspection P1.

In this manner, the control unit 11 selects the second inspection P2 for inspecting the actual mounting position R of the electronic component E by moving the board recognition camera 9 based on the inspection result of the first inspection P1 performed as a preliminary inspection. It is configured to perform control that is performed systematically. Specifically, when the mounting position V is found to be defective as a result of the first inspection P1, the control unit 11 controls the board recognition camera 9 to recognize the actual mounting position R of the electronic component E in the second inspection P2. is configured to do

The control unit 11 is configured to perform control to start the first inspection P1 based on the fact that the electronic component E is positioned in the installation position inspection section S. In other words, the control unit 11 is configured to perform control to start the first inspection P1 based on the timing at which the electronic component E is assumed to be installed on the board B. Specifically, the control unit 11 is configured to perform control to start the first inspection P1 based on the fact that the component center position D (reference portion) of the electronic component E is positioned in the second inspection section S2. there is

After starting the first inspection P1, the control unit 11 is configured to inspect one by one whether or not the positional deviation between the mounting position V and the target mounting position C of the predetermined portion B1 is within a threshold value. That is, the control unit 11 performs control to perform the first inspection P1 based on the position (component center position D) of the electronic component E when passing through the installation position inspection section S in the mounting route U of the electronic component E. is configured as Specifically, after starting the first inspection P1, the control unit 11 controls to inspect one by one whether or not the mounting path U of the electronic component E enters the defective position range F in the installation position inspection section S. configured to do so.

Based on the position of the electronic component E in the portion corresponding to the defective position range F in the installation position inspection section S, the control unit 11 determines the mounting position when the electronic component E is mounted on the board B in the first inspection P1. It is configured to perform control for judging V to be defective. That is, after starting the first inspection P1, the control unit 11 determines that the positional deviation between the mounting position V and the target mounting position C of the predetermined location B1 is outside the threshold. It is configured to perform control to determine that the mounting position V of the component E is defective.

Specifically, in the first inspection P1, the control unit 11 determines the installation position based on the difference between the target horizontal position C1 (see FIG. 5) and the component horizontal position D1 (see FIG. 5) at the component center position D. It is configured to perform control to determine whether or not the electronic component E is positioned in the portion corresponding to the defective position range F in the inspection section S. Then, the control unit 11 is configured to perform control to store the failure prediction information T in the storage unit 11b based on the fact that the electronic component E is positioned in the portion corresponding to the failure position range F in the installation position inspection section S. It is Also, the difference between the coordinates of the target horizontal position C1 and the coordinates of the component horizontal position D1 at the component center position D is the positional deviation between the mounting position V and the target mounting position C of the predetermined location B1.

The control unit 11 is configured to perform control to end the first inspection P1 when the electronic component E is placed on the board B. As shown in FIG. Here, the position of the electronic component E at the target mounting position C of the board B means that the height position in the Z direction (vertical direction) of the component center position D of the electronic component E is the target height position C2 of the target mounting position C. indicates that it is located in That is, the first inspection P1 is performed from when the electronic component E is located in the installation position inspection section S to when the component center position D of the electronic component E is located in the target mounting position C.

As shown in FIGS. 9 and 10, the control unit 11 performs control to perform the second inspection P2 after the first inspection P1 is completed, based on the fact that the failure prediction information T is stored in the storage unit 11b. is configured to That is, in the second inspection P2, the mounting position V is in the defective position range F ( outside the threshold). Further, the control unit 11 is configured to perform control to perform the suction process after the end of the first inspection P1 based on the fact that the failure prediction information T is not stored in the storage unit 11b.

The control unit 11 performs control to determine whether or not the actual mounting position R is positioned within the defective position range F based on the peripheral image M of the predetermined location B1 corresponding to the electronic component E determined to be defective in the first inspection P1. is configured to do

Specifically, the control unit 11 is configured to perform control for obtaining a peripheral image M by causing the substrate recognition camera 9 to image a predetermined location B1 corresponding to the electronic component E determined to be defective in the first inspection P1. It is The control unit 11 is configured to perform control for inspecting the positional deviation between the actual mounting position R on the peripheral image M and the target mounting position C on the peripheral image M. FIG. That is, the control unit 11 is configured to perform control to inspect whether the actual mounting position R is located in either the normal position range N or the defective position range F on the peripheral image M.

In this way, the control unit 11 is configured to actually inspect the positional deviation between the component center position D of the electronic component E and the target mounting position C of the predetermined location B1 in the second inspection P2. .

Here, the control unit 11 determines that the actual mounting position R of the electronic component E is defective based on the peripheral image M of the target mounting position C captured by the board recognition camera 9 in the second inspection P2. It is configured to perform control to notify to and stop the mounting work. In other words, the control unit 11 is configured to perform control to display the peripheral image M and a message to the effect that it is defective on the display unit 10 in order to notify the operator of the defect. Furthermore, the control unit 11 is configured to perform control to temporarily stop the mounting process. Then, after the operator registers the predetermined location B1 of the board B where the actual mounting position R is determined to be defective, the electronic component E mounted at the predetermined location B1 is removed, and the electronic component E is moved to the actual mounting position R. perform recovery work such as correcting

The control unit 11 is configured to perform control to perform the second inspection P2 on the electronic component E determined to be defective by the first inspection P1 every time the electronic component E is mounted on the board B. Note that the control unit 11 is configured to perform control to perform the second inspection P2 on the electronic components E determined to be defective by the first inspection P1 after all the electronic components E are mounted on the board B. may

<First route>
The first inspection P1 and the second inspection P2 in the mounting program P will be described by taking as an example the case where the component center position D of the electronic component E held by the mounting head 51 moves along the first path shown in FIG. 11 as the mounting path U. explain. Note that the mounting path U shown in FIG. 6 is shown as an ideal path.

As shown in FIG. 11, the first path is the mounting path U when the mounting head 51 is positioned on the Y2 direction side of the ideal path due to the slower moving speed of the mounting head 51 than expected. On the first path, the mounting position V is located in the defective position range F of the second inspection section S2, so the control unit 11 determines that the mounting position V is defective in the first inspection P1. In the first route, the second inspection P2 is performed because the mounting position V is determined to be defective in the first inspection P1. In the first path, the actual mounting position R is located in the defective position range F of the first inspection section S1, so the controller 11 determines that the actual mounting position R is defective in the second inspection P2.

Thus, in the first route, the inspection result of the first inspection P1 and the inspection result of the second inspection P2 match. In this case, the correct judgment is made based on the inspection result of the first inspection P1 without actually inspecting the predetermined portion B1 of the board B. FIG.

<Second route>
The first inspection P1 and the second inspection P2 in the mounting program P will be described by taking as an example the case where the component center position D of the electronic component E held by the mounting head 51 moves along the second path shown in FIG. 12 as the mounting path U. explain. Note that the mounting path U shown in FIG. 6 is shown as an ideal path.

As shown in FIG. 12, the second path is the mounting path U when the mounting head 51 is positioned on the Y2 direction side of the ideal path due to the slower moving speed of the mounting head 51 than expected. On the second path, the mounting position V is located in the defective position range F of the second inspection section S2, so the control unit 11 determines that the mounting position V is defective in the first inspection P1. In the second route, the second inspection P2 is performed because the mounting position V is determined to be defective in the first inspection P1. Since the actual mounting position R is located in the normal position range N of the first inspection section S1 on the second path, the control unit 11 determines that the actual mounting position R is normal in the second inspection P2.

Thus, in the second route, the inspection result of the first inspection P1 and the inspection result of the second inspection P2 are different. In this case, the inspection result of the first inspection P1 is corrected to a correct judgment based on the inspection result of the second inspection P2.

<Third route>
The first inspection P1 and the second inspection P2 in the mounting program P will be described by taking as an example the case where the component center position D of the electronic component E held by the mounting head 51 moves along the third path shown in FIG. 13 as the mounting path U. explain. Note that the mounting path U shown in FIG. 6 is shown as an ideal path.

As shown in FIG. 13, the third path is a mounting path U that overshoots the ideal path in the Y1 direction. Also, the third path meanders due to overshoot. On the third path, the mounting position V is located in the defective position range F of the second inspection section S2, so the control unit 11 determines that the mounting position V is defective in the first inspection P1. In the third route, the second inspection P2 is performed because the mounting position V is determined to be defective in the first inspection P1. On the third path, the actual mounting position R is located in the defective position range F of the first inspection section S1, so the controller 11 determines that the actual mounting position R is defective in the second inspection P2.

Thus, in the first route, the inspection result of the first inspection P1 and the inspection result of the second inspection P2 match. In this case, the correct judgment is made based on the inspection result of the first inspection P1 without actually inspecting the predetermined portion B1 of the board B. FIG.

<Fourth route>
The first inspection P1 and the second inspection P2 in the mounting program P will be described by taking as an example the case where the component center position D of the electronic component E held by the mounting head 51 moves along the fourth path shown in FIG. 14 as the mounting path U. explain. Note that the mounting path U shown in FIG. 6 is shown as an ideal path.

As shown in FIG. 14, the fourth path is the mounting path U located on the Y2 direction side of the ideal path. On the fourth path, the mounting position V is positioned within the normal position range N of the second inspection section S2, so the control unit 11 determines that the mounting position V is normal in the first inspection P1. In the fourth route, the second inspection P2 is not performed because the mounting position V was determined to be normal in the first inspection P1.

As described above, in the fourth route, only the first inspection P1 is performed and the second inspection P2 is not performed, but a correct judgment is made based on the inspection result of the first inspection P1.

(implementation processing)
The mounting process will be described below with reference to FIG. The mounting process is a process of mounting the electronic component E on the board B fixed at the work position W. FIG. The mounting process is performed by executing the mounting program P by the control unit 11 .

In step S<b>1 , the electronic component E is picked up by the mounting head 51 . That is, the adsorption process is performed by the control unit 11 . In step S2, the component recognition camera 8 captures an image of the electronic component E that has been picked up. That is, the control unit 11 performs recognition processing. In step S3, mounting processing is performed. The mounting process will be described later in detail.

In step S4, it is determined whether or not the mounting position V is defective. If the mounting position V is defective, the process proceeds to step S5, and if the mounting position V is normal, the process proceeds to step S9.

In step S<b>5 , the board recognition camera 9 is moved to a predetermined position B<b>1 on the board B by the rail part 7 and the support part 6 . In step S6, the substrate recognition camera 9 captures an image of a predetermined portion B1 of the substrate B. As shown in FIG. That is, the control unit 11 acquires the peripheral image M by capturing the image of the target mounting position C of the predetermined location B1 and the periphery of the predetermined location B1 with the substrate recognition camera 9 . In step S7, it is determined whether or not the displacement of the electronic component E on the peripheral image M is within a threshold value. That is, the control unit 11 determines whether or not the actual mounting position R of the electronic component E on the peripheral image M is positioned within the defective position range F on the peripheral image M. If it is within the positional deviation threshold value of the electronic component E on the peripheral image M, the process proceeds to step S8, an error is output to the display unit 10, and the mounting process is terminated. If there is no positional deviation of the electronic component E on the peripheral image M, the process proceeds to step S8, an error is output to the display unit 10, and the mounting process ends.

At step S9, it is determined whether or not the mounting of all the electronic components E has been completed. If the mounting has been completed, the mounting process is terminated. If the mounting of all the electronic components E has not been completed, the process returns to step S1.

(Mounting process)
The mounting process will be described below with reference to FIG. The mounting process is a process of mounting the electronic component E in accordance with the target mounting position C of the predetermined portion B1 of the board B. FIG. The mounting process is performed by executing the mounting program P by the control unit 11 .

In step S31, the electronic component E is moved in the XY direction (horizontal direction) by the rail portion 7 and the support portion 6. As shown in FIG. In step S32, it is determined whether or not the electronic component E has moved to the lowering start position. That is, it is determined whether or not the component center position D of the electronic component E has reached the lowering start position. If the electronic component E is positioned at the lowering start position, the process proceeds to step S33, and if the electronic component E has not moved to the lowering start position, the process returns to step S31. In step S<b>33 , the electronic component E is moved in the XYZ directions (horizontal and vertical directions) toward the target mounting position C by the Z-axis motor 52 , the rail portion 7 and the support portion 6 .

In step S34, it is determined whether or not the electronic component E has moved into the installation position inspection section S. That is, it is determined whether or not the component center position D of the electronic component E is positioned (reached) in the installation position inspection section S. If the electronic component E is located in the installation position inspection section S, the process proceeds to step S35, and if the electronic component E is not located in the installation position inspection section S, the process returns to step S33.

In step S35, it is determined whether or not the component center position D of the electronic component E is within the defect position range F. That is, it is determined whether or not the positional deviation between the mounting position V and the target mounting position C is outside the threshold value. When the component center position D of the electronic component E is within the defect position range F, the process proceeds to step S36.

In step S39, the mounting position V is stored as defective. That is, after the mounting position V determined to be defective is stored in the storage unit 11b as the defect prediction information T by the control unit 11, the process proceeds to step S36.

In step S36, it is determined whether or not the component center position D of the electronic component E has reached (is positioned at) the target mounting position C. As shown in FIG. If the component center position D of the electronic component E has reached the target mounting position C, the process proceeds to step S37.If the component center position D of the electronic component E has not reached the target mounting position C, the process returns to step S35.

The electronic component E is mounted on the substrate B in step S37. That is, the electronic component E held by the mounting head 51 is placed on the substrate B by switching the negative pressure of the mounting head 51 to the positive pressure. In step S38, after the mounting head 51 is raised, the mounting process is terminated. Then, the process proceeds to step S4 of the mounting process.

(Effect of the first embodiment)
The following effects can be obtained in the first embodiment.

In the first embodiment, as described above, as a result of the first inspection P1 for inspecting whether or not the mounting position V is likely to be defective based on the mounting path U, the component mounting apparatus 1 determines that the mounting position V A control unit 11 is provided to perform a second inspection P2 for inspecting the actual mounting position R of the electronic component E when there is a possibility that the electronic component E is defective. As a result, of the electronic components E mounted on the board B, only the electronic components E whose mounting position V is determined to be defective in the first inspection P1 are moved to the actual mounting position R of the electronic component E. Since the second inspection P2 is performed by moving to the actual mounting position R of the electronic component E, the number of times the second inspection P2 is performed can be reduced. As a result, by reducing the number of times the electronic component E is subjected to the second inspection P2 while moving to the predetermined location B1 of the board B, an increase in mounting work time can be suppressed. Further, by performing the first inspection P1 before the second inspection P2, the actual mounting position of the electronic component E can be detected earlier than the inspection by moving the electronic component E to the actual mounting position R mounted on the board B. It can be discovered that R can be bad.

Further, in the first embodiment, as described above, the controller 11 controls the actual mounting of the electronic component E in the second inspection P2 when there is a possibility that the mounting position V may be defective as a result of the first inspection P1. It is configured to perform control to image the position R with the substrate recognition camera 9 . As a result, the number of times of the second inspection P2, which requires more inspection time than the first inspection P1, can be reduced by the amount of inspection performed by moving the board recognition camera 9, so the second inspection by the board recognition camera 9 can be performed. Even when performing P2, it is possible to suppress an increase in mounting work time.

Further, in the first embodiment, the control unit 11 is configured to perform control to start the first inspection P1 based on the fact that the electronic component E is positioned in the installation position inspection section S, as described above. Accordingly, unlike the case where the first inspection P1 is performed at the upper surface position B2 of the substrate, the first inspection P1 can be performed even when the electronic component E is placed on the upper surface of the substrate B having warpage. As a result, since the first inspection P1 can be performed regardless of the state of the upper surface of the board B, the mounting position V when installed on the board B can be reliably determined by the first inspection P1.

Further, in the first embodiment, as described above, the controller 11 performs the first inspection P1 based on the position of the electronic component E when it passes through the installation position inspection section S in the mounting route U of the electronic component E. configured to perform control. As a result, without performing the first inspection P1 over the entire mounting route U of the electronic component E, the portion of the mounting route U of the electronic component E where there is a possibility that the electronic component E was installed on the board B can be specified. Since the first inspection P1 can be performed, the first inspection P1 can be efficiently performed.

Further, in the first embodiment, as described above, the controller 11 controls the electronic component E in the first inspection P1 based on the position of the electronic component E in the portion corresponding to the defective position range F in the installation position inspection section S. It is configured to perform control to determine that the mounting position V of the component E is defective. As a result, the defective position range F is provided so as to correspond to the height position Up in the Z1 direction (upward direction) from the upper surface position B2 of the substrate B, so that the electronic component E is installed on the upper surface of the substrate B having warpage. , even if the height position of the electronic component is positioned in the Z1 direction (upper) than when the electronic component is placed on the upper surface of the substantially flat board B, the electronic component E is placed on the board B by the first inspection P1. It is possible to inspect whether or not there is a possibility that the mounting position V at the time of mounting is defective. As a result, since the first inspection P1 can be performed regardless of the state of the upper surface of the board B, it is possible to reliably determine the defect of the mounting position V when installed on the board B in the first inspection P1. .

In the first embodiment, as described above, the controller 11 controls the defective position range in the installation position inspection section S based on the difference between the target horizontal position C1 and the component horizontal position D1 in the first inspection P1. It is configured to perform control to determine whether or not the electronic component E is positioned at the portion corresponding to F. As a result, in the first inspection P1, it is determined whether or not there is a possibility that the mounting position V when the electronic component E is mounted on the board B becomes defective due to the displacement of the component horizontal position D1 with respect to the target horizontal position C1. can be inspected. As a result, the first inspection P1 can be easily performed.

Further, in the first embodiment, as described above, the control unit 11 is configured to perform control to end the first inspection P1 based on the placement of the electronic component E on the substrate B. FIG. As a result, the first inspection P1 can be performed until the electronic component E is installed on the board B, so that the mounting position V when the electronic component E is installed on the board B can be more accurately determined by the first inspection P1. It can be carried out.

Further, in the first embodiment, as described above, the control unit 11 notifies the operator based on the fact that the actual mounting position R of the electronic component E is determined to be defective by the peripheral image M in the second inspection P2. It is configured to perform control to stop the mounting work as well. As a result, the operator can quickly perform recovery work on the component mounting apparatus 1, so that the stop time of the mounting work can be shortened.

[Second embodiment]
Next, a component mounting apparatus 201 according to a second embodiment will be described with reference to FIGS. 1 to 3 and 16. FIG. The component mounting apparatus 201 of the second embodiment is different from the component mounting apparatus 1 of the first embodiment in which the controller 11 determines whether or not the actual mounting position R is located within the defective position range F. is configured to determine whether or not the actual mounting position R is located in the defective position range F by means of. In addition, in 2nd Embodiment, the same code|symbol is attached|subjected regarding the structure similar to the said 1st Embodiment, and description is abbreviate|omitted.

As shown in FIGS. 1 to 3, the component mounting apparatus 201 includes a base 2, a feeder placement section 3, a substrate transfer section 4, a head unit 5, a support section 6, a rail section 7, a component recognition A camera 8 , a board recognition camera 9 , a display section 10 and a control section 211 are provided. Note that the substrate recognition camera 9 is an example of the "imaging unit" in the scope of claims.

(control part)
The control unit 211 is a control circuit that controls the operation of the component mounting apparatus 201, including a CPU 11a (Central Processing Unit), a storage unit 11b, and the like, as shown in FIG. The control unit 211 controls the tape feeder 12 , substrate transport unit 4 , head unit 5 , support unit 6 , rail unit 7 , component recognition camera 8 , substrate recognition camera 9 , X-axis motor 62 , Y-axis motor 72 and display unit 10 . electrically connected.

Based on the mounting process of the electronic component E including the first inspection process (first inspection P1) and the second inspection process (second inspection P2) for inspecting the electronic component E mounted on the board B, the storage unit 11b stores An implementation program P is stored. Further, the storage unit 11b stores inspection data K including information for performing the first inspection P1 and the second inspection P2.

(Implementation program)
By executing the mounting program P, the control unit 211 performs the first inspection P1, and if the result of the first inspection P1 indicates that the mounting position may be defective, the second inspection P2 is performed. It is configured.

The control unit 211 is configured to perform control to perform the second inspection P2 after the end of the first inspection P1 based on the fact that the failure prediction information T is stored in the storage unit 11b.

The control unit 211 of the second embodiment displays a peripheral image of the target mounting position C captured by the board recognition camera 9 in the second inspection P2 on the display unit 10 so that the operator can determine the actual mounting position R of the electronic component E. It is configured to perform control to display M. That is, the operator, not the control unit 211, determines whether or not the actual mounting position R is located in the defective position range F. Other configurations of the second embodiment are the same as those of the first embodiment.

(implementation processing)
The mounting process will be described below with reference to FIG. The mounting process is a process of mounting the electronic component E on the board B fixed at the work position W. FIG. The mounting process is performed by executing the mounting program P by the control unit 211 . Note that steps S1 to S6 and step S9 are each the same as the mounting process of the first embodiment, so description thereof will be omitted.

In step 207, the peripheral image M of the predetermined portion B1 of the substrate B is displayed on the display section 10. FIG. Specifically, the peripheral image M of the predetermined location B1 of the board B includes the target mounting position C of the predetermined location B1 of the board B and the surroundings of the target mounting position C. FIG. At step 208, it is determined whether or not the operator has given an instruction that the electronic component E is out of position. That is, when the operator determines that the actual mounting position R is located within the defective position range F and gives an instruction that there is a positional deviation of the electronic component E, the process proceeds to step S9. Further, when the operator determines that the actual mounting position R is within the normal position range N and the operator instructs that there is no positional deviation of the electronic component E, the mounting process ends.

(Effect of Second Embodiment)
Effects of the second embodiment will be described.

In the second embodiment, as described above, the component mounting apparatus 201 inspects the actual mounting position R of the electronic component E when there is a possibility that the mounting position V is defective as a result of the first inspection P1. A control unit 211 is provided to perform the second inspection P2. As a result, the number of times the second inspection P2 of the electronic component E is performed while moving to the predetermined location B1 of the board B is reduced, thereby suppressing an increase in mounting work time.

Further, in the second embodiment, as described above, the control unit 211 displays the surrounding image M on the display unit 10 in the second inspection P2 so that the operator can determine the actual mounting position R of the electronic component E. Configure to control. As a result, the operator can confirm the target mounting position C and the actual mounting position R of the electronic component E by actually looking at the peripheral image M displayed on the display unit 10, so that the actual mounting position of the electronic component E can be confirmed. The operator can appropriately determine whether R is normal or defective. Other effects of the second embodiment are the same as those of the first embodiment.

[Third Embodiment]
Next, a component mounting system 300 including a component mounting apparatus 301 of the third embodiment will be described with reference to FIGS. 1 to 3, 18 and 19. FIG. The component mounting apparatus 301 of the third embodiment differs from the component mounting apparatus 1 of the first embodiment in that the controller 11 only determines whether or not the actual mounting position R is located within the defective position range F. When it is determined that the actual mounting position R is located in the defective position range F, the control unit 311 is configured to update the sub map data H (hereinafter referred to as the sub map H). In addition, in 3rd Embodiment, the same code|symbol is attached|subjected regarding the structure similar to the said 1st Embodiment, and description is abbreviate|omitted.

As shown in FIG. 18, the component mounting system 300 mounts electronic components E such as ICs, transistors, capacitors, and resistors on a board B such as a printed circuit board to produce the board B on which the electronic components E are mounted. System. Specifically, the component mounting system 300 is used as a system for mounting an electronic component E on a split board as a board B or the like.

The component mounting system 300 includes a printing device 302 , a component mounting device 301 , a pre-reflow inspection device 303 , a reflow furnace 304 , a post-reflow inspection device 305 , and a server 306 . The printing device 302, the component mounting device 301, the reflow furnace 304, and the post-reflow inspection device 305 are arranged in this order from upstream to downstream.

The printing apparatus 302 performs a printing operation of screen-printing a joining material such as solder onto the substrate B as a production operation of the substrate B. FIG. The component mounting apparatus 301 performs the mounting work of mounting the electronic component E on the board B printed by the printing device 302 as the board B production work. The pre-reflow inspection device 303 performs inspection work for inspecting the board B on which the component mounting work has been performed by the component mounting device 301 as the inspection work for the board B. FIG. The reflow furnace 304 performs a reflow operation for bonding the electronic component E to the substrate B by melting and solidifying the bonding material printed on the substrate B as the substrate B production operation. The post-reflow inspection device 305 performs an inspection operation of inspecting the substrate B on which the reflow operation has been performed by the reflow furnace 304 as the inspection operation of the substrate B. FIG.

Server 306 is configured to manage submap-H. That is, the server 306 at least either transmits or receives the submap H to each of the printing device 302, the component mounting device 301, the pre-reflow inspection device 303, the reflow furnace 304, and the post-reflow inspection device 305. configured to control. Note that the submap H is an example of a "map" in the scope of claims.

Specifically, the server 306 includes a CPU, a storage unit, and the like, although not shown. The server 306 is communicably connected to the printer 302, the component mounting apparatus 301, the pre-reflow inspection apparatus 303, the reflow oven 304, and the post-reflow inspection apparatus 305 via a network.

The submap H is composed of data recording the work results of a predetermined portion B1 of the board B such as a split board. Specifically, the submap H is data recording the inspection results after each operation of the printing apparatus 302, the component mounting apparatus 301, the pre-reflow inspection apparatus 303, the reflow oven 304, and the post-reflow inspection apparatus 305. FIG.

Here, the server 306 is connected to the control unit 311 of the component mounting apparatus 301 via a network, and is configured to perform control to acquire the updated submap H in the control unit 311 of the component mounting apparatus 301. . The server 306 controls not only the control unit 311 of the component mounting apparatus 301, but also the control units 311 of the printing apparatus 302, the component mounting apparatus 301, the pre-reflow inspection apparatus 303, the reflow furnace 304, and the post-reflow inspection apparatus 305. is connected via a network, and the updated submap H is obtained in each of the control units 311 of the printing device 302, the component mounting device 301, the pre-reflow inspection device 303, the reflow furnace 304, and the post-reflow inspection device 305. configured to control.

19(A) to 19(C), inspection results after work of printing device 302, component mounting device 301, pre-reflow inspection device 303, reflow furnace 304, and post-reflow inspection device 305. to the submap H will be described. A method of recording the inspection result after work on the submap H will be described by exemplifying the printing apparatus 302 and the component mounting apparatus 301 . Regarding the recording of the inspection results after the work, 1 is judged to be good, 2 is judged to be defective before the process, and 5 is judged to be defective.

As shown in FIG. 19A, based on the inspection results after work in the printing device 302, the numerical data corresponding to the predetermined location B1 of the substrate B determined to be defective in the submap H is 5. is updated to numerical data. The submap H updated in the printing device 302 is then sent to the server 306 . At this time, in the server 306, the numerical data of 5 of the submap H acquired from the printing device 302 is updated to the numerical data of 2. FIG.

As shown in FIG. 19B, submap H updated by server 306 is transmitted from server 306 to component mounting apparatus 301 . Then, as shown in FIG. 19(C), based on the inspection result after work in the component mounting apparatus 301, numerical data corresponding to the predetermined location B1 of the substrate B determined to be defective is displayed on the submap H. is updated to numerical data of 5. The submap H updated in the printing device 302 is then sent to the server 306 . The above operations are performed by the server 306, the printer 302, the component mounting apparatus 301, the pre-reflow inspection apparatus 303, the reflow oven 304, and the post-reflow inspection apparatus 305 as needed.

As shown in FIGS. 1 to 3, a component mounting apparatus 301 of the third embodiment includes a base 2, a feeder placement section 3, a board transfer section 4, a head unit 5, a support section 6, a rail section 7 , a component recognition camera 8 , a board recognition camera 9 , a display section 10 and a control section 311 . Note that the substrate recognition camera 9 is an example of the "imaging unit" in the scope of claims.

(control part)
The control unit 311 is a control circuit that controls the operation of the component mounting apparatus 301, including a CPU 11a (Central Processing Unit), a storage unit 11b, and the like, as shown in FIG. The control unit 311 controls the tape feeder 12 , substrate transport unit 4 , head unit 5 , support unit 6 , rail unit 7 , component recognition camera 8 , substrate recognition camera 9 , X-axis motor 62 , Y-axis motor 72 and display unit 10 . electrically connected.

The storage unit 11b stores a mounting program P based on the mounting process of the electronic component E including the first inspection process and the second inspection process for inspecting the electronic component E mounted on the board B. FIG. Further, the storage unit 11b stores inspection data K including information for performing the first inspection P1 and the second inspection P2.

(Implementation program)
By executing the mounting program P, the control unit 311 performs the first inspection P1, and if the result of the first inspection P1 indicates that the mounting position may be defective, the second inspection P2 is performed. It is configured.

The control unit 311 is configured to perform control to perform the second inspection P2 after the end of the first inspection P1 based on the fact that the failure prediction information T is stored in the storage unit 11b.

When it is determined that the actual mounting position R of the electronic component E is defective in the result of the second inspection P2, the control unit 311 of the third embodiment controls the board B based on the actual mounting position R determined to be defective. It is configured to perform control to update the submap H indicating the defective portion of the . Further, it is preferable that the control unit 311 is configured to perform control to determine whether or not to mount the electronic component E on the predetermined location B1 of the board B based on the submap H obtained from the server 306. . That is, the control unit 311 is configured to perform control so that the electronic component E is not mounted on the predetermined location B1 of the substrate B where the defect occurred in the previous process, based on the reference to the submap H obtained from the server 306. may be Other configurations of the third embodiment are the same as those of the first embodiment.

(implementation processing)
The mounting process will be described below with reference to FIG. The mounting process is a process of mounting the electronic component E on the board B fixed at the work position W. FIG. The mounting process is performed by executing the mounting program P by the control unit 311 . Note that steps S1 to S7 and step S9 are each the same as the mounting process of the first embodiment, so description thereof will be omitted.

In step S300, the submap H is referenced by the control unit 311. FIG. That is, the control unit 311 checks whether or not the submap H obtained from the server 306 is determined to be defective. At step 308, the submap H is updated based on the inspection results of the second inspection P2 of step S7. That is, if the inspection result of the second inspection P2 in step S7 is unsatisfactory, the submap H is updated. In step 309, after the updated submap H is transmitted to the server 306 by the control unit 311, the mounting process ends.

(Effect of the third embodiment)
Effects of the third embodiment will be described.

In the third embodiment, as described above, as a result of the first inspection P1, when there is a possibility that the mounting position of the component mounting system 300 is defective, the second inspection P2 inspects the actual mounting position R of the component. A component mounting apparatus 301 having a control unit 311 for performing is provided. Accordingly, by reducing the number of times the electronic component E is subjected to the second inspection P2 by moving to the predetermined location B1 of the board B, an increase in mounting work time can be suppressed.

Further, in the third embodiment, as described above, the control unit 311 controls the submap H indicating the defective locations of the board B based on the actual mounting position R determined to be defective in the result of the second inspection P2. to update. As a result, the submap H updated in the component mounting apparatus 301 can be referred to by the work device arranged downstream of the component mounting apparatus 301, so that the component mounting operation can be performed according to the defective portion shown in the submap H. It is possible to appropriately change the work on the substrate B in the work device arranged downstream of the device 301 . For example, when the submap H indicates a defective portion, a working device (reflow furnace 304 or the like) arranged downstream of the component mounting apparatus 301 with respect to the defective portion of the board B indicated on the submap H You can change it so that it doesn't work. As a result, not only the mounting work of the component mounting apparatus 301, but also the work for the board B in the working device arranged downstream from the component mounting apparatus 301 can be made efficient, so that the work time for producing the board B increases. It is possible to obtain the component mounting system 300 capable of suppressing the mounting.

Further, in the third embodiment, as described above, the component mounting system 300 is connected to the control unit 311 of the component mounting apparatus 301 via the network, and the submap H updated by the control unit 311 of the component mounting apparatus 301 is updated. is provided. As a result, the server 306 can collectively manage the submap H, so that the convenience of the submap H can be improved. Other effects of the third embodiment are the same as those of the first embodiment.

[Modification]
It should be noted that the embodiments disclosed this time should be considered as examples and not restrictive in all respects. The scope of the present invention is indicated by the scope of the claims rather than the description of the above-described embodiments, and includes all modifications (modifications) within the meaning and scope equivalent to the scope of the claims.

For example, in the above-described first to third embodiments, the control unit 11 (211, 311) controls the component center position D (component Although an example is shown in which control is performed to perform the first inspection P1 based on the position of the first inspection P1, the present invention is not limited to this. In the present invention, the control unit may be configured to perform control to perform the first inspection P1 based on the position of the end of the component mounting path.

In the third embodiment, the server 306 transmits and receives the submap H to and from each of the component mounting apparatus 301, the printing apparatus 302, the pre-reflow inspection apparatus 303, the reflow furnace 304, and the post-reflow inspection apparatus 305. Although an example configured to perform control to be performed has been shown, the present invention is not limited to this. For example, the component mounting apparatus, printing apparatus, reflow oven, and post-reflow inspection apparatus may each be configured to directly transmit and receive submaps.

Further, in the first to third embodiments, the electronic component E (component) held by the mounting head 51 (head) is acquired in the component recognition process according to the XY movement time, the Z movement time, and the descent start position. Although an example has been shown in which the component is moved from the part center position D to the target mounting position C (target position), the present invention is not limited to this. For example, the part held by the head may be moved from the part center position acquired in the part recognition process to the target position according to the coordinates of the part center position and the coordinates of the target position.

Further, in the first to third embodiments, the installation position inspection section S is a section including the first inspection section S1 and the second inspection section S2, but the present invention is not limited to this. do not have. For example, the installation position inspection section may be only the first inspection section.

In the first to third embodiments, the component center position D is represented by the component horizontal position D1 and the head height position D2. However, the present invention is not limited to this. . For example, the component center position may be coordinates represented by the component horizontal position and the lower end position of the electronic component held by the mounting head. In this case, the target height position of the target mounting position is not the vicinity of the height position of the upper end of the electronic component with respect to the upper surface of the board, but the height position of the upper surface of the board.

Further, in the first to third embodiments, for convenience of explanation, the control processing of the control unit 11 (211, 311) is explained using a flow-driven flowchart in which processing is performed in order along the processing flow. , the present invention is not limited to this. In the present invention, the control processing of the control unit may be performed by event-driven processing that executes processing on an event-by-event basis. In this case, it may be completely event-driven, or a combination of event-driven and flow-driven.

Reference Signs List 1, 201, 301 Component mounting device 5 Head unit 9 Board recognition camera (imaging unit)
10 display unit 11, 211, 311 control unit 51 head (mounting head)
300 component mounting system 305 server B substrate B2 (substrate) upper surface position C target mounting position (target position)
C1 Target horizontal position D Part center position (part position when passing through the installation position inspection section)
D1 Component horizontal position E Electronic component (component)
F Defective position range H Submap (map)
M Peripheral image P1 First inspection P2 Second inspection R Actual mounting position (actual mounting position)
S Installation position inspection section U Mounting path Up Height position V Mounting position (mounting position when installed on the board)

Claims (12)

a head unit that includes a head that holds a component and mounts the component by placing the component at a target position on a substrate;
performing a first inspection for inspecting whether or not there is a possibility that the mounting position of the component when the component is mounted on the board may be defective based on the mounting path of the component, and as a result of the first inspection, When the mounting position is normal, the second inspection for inspecting the actual mounting position of the component is not performed. A component mounting apparatus, comprising: a control unit that performs inspection. further comprising an imaging unit for imaging the target position of the substrate and the periphery of the target position;
When the mounting position is likely to be defective as a result of the first inspection, the control unit controls the imaging unit to image the actual mounting position of the component in the second inspection. 2. The component mounting apparatus according to claim 1, wherein: The control unit performs control to start the first inspection based on the component being positioned in an installation position inspection section provided corresponding to a height position above the upper surface position of the substrate. 3. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is configured as follows. 4. The control unit according to claim 3, wherein the control unit is configured to perform control to perform the first inspection based on the position of the component when passing through the installation position inspection section in the mounting route of the component. Component mounter as described. The control unit considers the mounting position of the component mounted on the board to be defective in the first inspection based on the fact that the component is positioned in a portion corresponding to the defective position range in the installation position inspection section. 5. The component mounting apparatus according to claim 3, configured to perform determination control. In the first inspection, the control unit determines a difference between a target horizontal position in the horizontal direction of the component when mounted at the target position and a component horizontal position in the horizontal direction of the component held by the head. 6. The component mounting apparatus according to claim 5, wherein the component mounting apparatus according to claim 5 is configured to determine whether or not the component is positioned in the portion corresponding to the defective position range in the installation position inspection section. The component according to any one of claims 1 to 6, wherein the control unit is configured to perform control to end the first inspection based on the component being installed on the board. mounting equipment. The control unit notifies an operator based on the determination that the actual mounting position of the component is defective based on the target position and the surrounding image of the target position captured by the imaging unit in the second inspection. 3. The component mounting apparatus according to claim 2, wherein the component mounting apparatus is configured to perform control to stop the mounting work as well as to stop the mounting work. further comprising a display unit that displays the target position captured by the imaging unit and a peripheral image of the target position;
The control unit is configured to perform control to display the image captured by the imaging unit in the second inspection on the display unit so that an operator can determine the actual mounting position of the component. 3. The component mounting apparatus according to claim 2, wherein When the actual mounting position of the component is determined to be defective as a result of the second inspection, the control unit determines the defective portion of the board based on the actual mounting position determined to be defective. 10. The component mounting apparatus according to any one of claims 1 to 9, configured to perform control for updating the indicated map. A component mounting system comprising the component mounting apparatus according to any one of claims 1 to 9,
The component mounting device is
When the actual mounting position of the component is determined to be defective as a result of the second inspection, updating a map indicating defective locations on the board based on the actual mounting position determined to be defective. A component mounting system including the control unit that performs control. 12. The component mounting system according to claim 11, further comprising a server connected to said control unit of said component mounting apparatus via a network and performing control for obtaining said map updated by said control unit of said component mounting apparatus. .

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