JP7129619B2 - COMPONENT MOUNTING SYSTEM, COMPONENT MOUNTING METHOD, AND CORRECTION VALUE CALCULATION DEVICE - Google Patents

Description

The present invention provides a component mounting system and component mounting method for mounting a component on a board using a feedback correction value calculated based on the positional deviation amount of the component mounted on the board, and a correction value calculation apparatus for calculating the feedback correction value. It is about.

A component mounting apparatus picks up a component supplied by a component supply device and mounts it on a board by means of a suction nozzle provided in a mounting head that moves horizontally by means of an XY beam consisting of an X-axis beam and a Y-axis beam. Conventionally, in order to improve the mounting accuracy of mounting components on a board, the mounting position deviation from the normal position of the components mounted on the board is inspected with an inspection device or the like, and feedback correction is calculated based on the amount of mounting position deviation. The value is used to correct the mounting operation of a component mounting apparatus (see Patent Document 1, for example).

In the component mounting system of Patent Document 1, an inspection device arranged downstream of the component mounting device detects the amount of mounting position deviation for each component mounted on the board, and uses the feedback correction value calculated for each component. It corrects the mounting operation in the component mounting apparatus.

JP-A-2016-58603

However, in the prior art including Patent Document 1, the mounting position deviation is fed back for each component mounted on the board, but the cause of the component mounting position deviation is the distortion of the XY beam, etc. There has been a problem that there is a large portion due to various fluctuations of elements, and there is room for further improvement in order to improve the mounting accuracy.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting system, a component mounting method, and a correction value calculating apparatus capable of accurately correcting component mounting position deviations due to the influence of apparatus fluctuations.

A component mounting system according to the present invention comprises: component mounting means for mounting a component on a board; mounting control means for controlling a mounting operation of mounting a component on the board by the component mounting means; positional deviation amount acquiring means for acquiring a positional deviation amount of a component from a normal position; and feedback for correcting the mounting operation of the component mounting means based on the positional deviation amount for each component acquired by the positional deviation amount acquiring means. correction value calculation means for calculating a correction value for each component; and component selection means for selecting the component to be used for calculating the feedback correction value, wherein the correction value calculation means The feedback correction value is calculated by excluding the positional deviation amount of the component that was not selected by the component selection means because it is large, and the mounting control means uses the feedback correction value to calculate the positional deviation of the component by the component mounting means. Correct implementation behavior.

A component mounting method according to the present invention includes a component mounting step of mounting a component on a board, a positional deviation amount acquiring step of acquiring a positional deviation amount from a normal position of the component mounted on the board in the component mounting process, and a correction value calculation step of calculating, for each component, a feedback correction value for correcting a mounting operation in the component mounting step based on the positional deviation amount of each component acquired in the deviation amount acquisition step; and calculating the feedback correction value. and a component selection step of selecting the component to be used, wherein the correction value calculation step excludes the positional deviation amount of the component that was not selected in the component selection step because the variation in the positional deviation amount is large. Then, the feedback correction value is calculated, and the mounting operation is corrected using the feedback correction value in the component mounting process.

The correction value calculation device of the present invention is a method for selecting a component that is not selected by the component selection means for the reason that the deviation amount of the component mounted on the board by the component mounting means is large from the positional deviation amount from the normal position. A correction value calculation unit for calculating a feedback correction value for correcting the mounting operation of the component mounting means by excluding the amount of positional deviation is provided.

ADVANTAGE OF THE INVENTION According to this invention, the mounting position shift of components by the influence of an apparatus fluctuation|variation can be corrected with sufficient precision.

1 is an explanatory diagram of the configuration of a component mounting system according to an embodiment of the present invention; FIG. 1 is a plan view showing the configuration of a component mounting apparatus according to one embodiment of the present invention; 1 is a partial cross-sectional view of a component mounting apparatus according to one embodiment of the present invention; FIG. 1 is an explanatory diagram of the configuration of a mounting head and a component supply section of a component mounting apparatus according to an embodiment of the present invention; 1 is a block diagram showing the configuration of a control system of a component mounting system according to one embodiment of the present invention; FIG. FIG. 4 is an explanatory diagram of the positional deviation amount of components calculated by the inspection apparatus according to the embodiment of the present invention; (a) and (b) are explanatory diagrams showing examples of shapes of components to be mounted on a board in the component mounting apparatus according to one embodiment of the present invention. (a) (b) Explanatory diagrams showing an example of the gap between the pocket of the carrier tape and the component used in the component mounting apparatus according to the embodiment of the present invention. FIG. 2 is an explanatory diagram showing an example of a correction value calculation component selection screen displayed in the component mounting system according to one embodiment of the present invention; (a) Explanatory drawing showing an example of a component mounted on a board imaged by the inspection apparatus of one embodiment of the present invention (b) Explanation showing an example of the calculated positional deviation amount and the relationship between the feedback correction value figure FIG. 1 is a flowchart of a component mounting method in a component mounting system according to one embodiment of the present invention; FIG. 2 is a flowchart of a component selection method in a management computer according to one embodiment of the present invention;

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be changed as appropriate according to the specifications of the component mounting system, the component mounting apparatus, and the inspection apparatus. In the following, the same reference numerals are given to the corresponding elements in all the drawings, and redundant explanations are omitted. In FIG. 2 and a part described later, the two axial directions orthogonal to each other in the horizontal plane are the X direction (horizontal direction in FIG. 2) of the substrate transport direction and the Y direction (vertical direction in FIG. 2) orthogonal to the substrate transport direction. is shown. In FIG. 3 and a part described later, the Z direction (vertical direction in FIG. 3) is shown as the height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal plane. In FIG. 4 and a part described later, the θ direction, which is the direction of rotation about the Z-direction axis (Z-axis), is shown.

First, the configuration of a component mounting system 1 will be described with reference to FIG. The component mounting system 1 has a function of mounting components on a board to manufacture a mounted board, and includes a solder printing machine M1, component mounting machines M2 and M3, and an inspection machine M4. These devices are connected to a management computer 3 via a communication network 2 . The number of the component mounting apparatuses M2 and M3 included in the component mounting system 1 is not limited to two, and may be one or three or more.

The solder printing device M1 screen-prints cream solder for joining components onto a substrate to be mounted. The component mounting apparatuses M2 and M3 carry out a component mounting operation of transporting and mounting the component taken out from the component supplying section onto the board on which cream solder for component bonding is printed by the component mounting section 12 (see FIG. 2). The inspection device M4 inspects the mounting state of the components on the board on which the components are mounted by the component mounting devices M2 and M3, and detects the deviation of the components from the normal positions. The management computer 3 calculates a feedback correction value Vc for correcting the mounting operation to be fed back to the component mounting apparatuses M2 and M3 based on the line management function and the inspection information including the positional deviation amount of the component acquired by the inspection apparatus M4. It also has the function to

Next, configurations of the component mounting apparatuses M2 and M3 will be described with reference to FIGS. 2 and 3. FIG. 3 partially shows the AA cross section in FIG. The component mounting apparatuses M2 and M3 have a function of performing a mounting operation of mounting the component supplied from the component supply section onto the board. In FIG. 2, a substrate transfer mechanism 5 is arranged in the X direction at the center of the base 4 . The substrate transport mechanism 5 carries the substrate 6 transported from the upstream side into the mounting work position and positions and holds it. Further, the board transfer mechanism 5 carries out the board 6 on which the component mounting work is completed to the downstream side.

Component supply units 7 are arranged on both sides (front side and rear side) of the substrate transfer mechanism 5 . A plurality of tape feeders 8 are mounted in parallel on each component supply section 7 . The tape feeder 8 pitch-feeds the carrier tape, in which pockets for storing components are formed, from the outside of the component supply section 7 in the direction toward the substrate transport mechanism 5 (tape feeding direction), thereby feeding the mounting head of the component mounting section 12 . supplies the parts to the parts pick-up position where the picks up the parts.

A Y-axis beam 9 having a linear drive mechanism is arranged along the Y direction at both ends in the X direction on the upper surface of the base 4 . Two (front side, rear side) X-axis beams 10 similarly equipped with linear driving mechanisms are coupled to the Y-axis beam 9 so as to be movable in the Y direction. The X-axis beam 10 is arranged along the X direction. A mounting head 11 is attached to each of the two X-axis beams 10 so as to be movable in the X direction. The mounting head 11 includes a plurality of suction units 11a that can lift and hold components by suction. A suction nozzle 11b (see FIG. 3) for sucking and holding a component is attached to the lower end of each suction unit 11a.

In FIG. 2, by driving the Y-axis beam 9 and the X-axis beam 10, the mounting head 11 moves in the X direction and the Y direction. As a result, the two mounting heads 11 pick up the components from the component pick-up positions of the tape feeders 8 arranged in the corresponding component supply units 7 by using the pick-up nozzles 11b, picking up the components, and picking up the board 6 positioned on the board conveying mechanism 5. Mounted on the mounting point of That is, the Y-axis beam 9 , the X-axis beam 10 and the mounting head 11 constitute a component mounting section 12 that mounts components on the substrate 6 . Thus, the component mounting apparatuses M2 and M3 are provided with two component mounting units 12 on the front side and the rear side.

A component recognition camera 13 is arranged between the component supply section 7 and the board transfer mechanism 5 . When the mounting head 11 picking up the component from the component supply unit 7 moves above the component recognition camera 13, the component recognition camera 13 images the component held by the mounting head 11 and recognizes the holding posture of the component. do. A substrate recognition camera 14 is attached to the plate 10a to which the mounting head 11 is attached. The board recognition camera 14 moves integrally with the mounting head 11 .

As the mounting head 11 moves, the board recognition camera 14 moves above the board 6 positioned on the board transport mechanism 5 and picks up a board mark (not shown) provided on the board 6 to detect the board 6. Recognize your location. Also, the substrate recognition camera 14 moves above the component pick-up position of the tape feeder 8 and recognizes the state of the carrier tape near the component pick-up position. In the component mounting operation on the board 6 by the mounting head 11, the component recognition result by the component recognition camera 13 and the board position recognition result by the board recognition camera 14 are taken into consideration to correct the mounting position.

As shown in FIG. 3, a carriage 15 having a plurality of tape feeders 8 preliminarily mounted on a feeder base 15a is set in the component supply section 7. As shown in FIG. The position of the carriage 15 is fixed in the component supply unit 7 by clamping the feeder base 15a to a fixed base (not shown) provided on the base 4 by a clamping mechanism 15b. The carriage 15 holds a tape reel 17 that accommodates a carrier tape 16 holding a component D in a wound state. The carrier tape 16 pulled out from the tape reel 17 is pitch-fed by the tape feeder 8 to a component suction position by the suction nozzle 11b.

Next, referring to FIG. 4, the configuration of the mounting head 11 will be described. The mounting head 11 has a plurality of suction units 11a, and each suction unit 11a has a drive mechanism. By driving the driving mechanism, the suction nozzles 11b attached to the lower ends of the suction units 11a are moved up and down (arrow b), and the suction nozzles 11b are rotated in the θ direction around the nozzle axis AN as the rotation axis (arrow c). ) is possible.

That is, the mounting head 11 serves as a component suction unit for mounting the component D by sucking the component D and rotating the component D at a predetermined angle in a rotational direction (θ direction) parallel to the mounting surface of the substrate 6 . The component mounting section 12 includes a component suction section and serves as component mounting means for mounting the component D on the board 6 .

Next, the configuration of the control system of the component mounting system 1 will be described with reference to FIG. Management computer 3 , component mounting apparatuses M 2 and M 3 and inspection apparatus M 4 are connected via communication network 2 . The component mounting apparatuses M2 and M3 each include a mounting control section 20, a mounting storage section 21, a component mounting section 12, a display section 22, a mounting input section 23, a recognition processing section 24, and a communication section 25. The mounting storage unit 21 stores mounting data 21a and correction value data 21b in addition to the mounting program for executing the component mounting work described above.

The mounting data 21a includes data to be referenced when the component D is mounted on the board 6, and includes the coordinates of the mounting position (regular position) of the component D on the board 6, the rotation angle of the component D when mounting, the mounting It contains information such as the type of part D to be used. The correction value data 21b includes a feedback correction value Vc transmitted from the management computer 3, which will be described later.

The mounting control unit 20 is an arithmetic unit such as a CPU, and controls each unit based on the programs and data stored in the mounting storage unit 21 to allow the component mounting unit 12 to mount the component D on the substrate 6 . Control. The recognition processing unit 24 detects the position of the substrate 6 by recognizing the imaging result of the substrate recognition camera 14 . Further, the recognition processing unit 24 detects the position of the component D while it is being held by the mounting head 11 by performing recognition processing on the imaging result of the component recognition camera 13 .

Then, the mounting control unit 20 controls the mounting operation of the component mounting unit 12 based on the mounting data 21a, the correction value data 21b, the position of the board 6, the position of the component D held in the component mounting unit 12, and the feedback correction value Vc. is corrected, and the component D is mounted on the substrate 6. Further, the mounting control unit 20 rotates the component D held by the mounting head 11 (component suction unit) by the rotation angle specified in the mounting data 21a and mounts it on the board 6 . Thus, the mounting control section 20 serves as mounting control means for controlling the mounting operation of mounting the component D on the board 6 by the component mounting section 12 (component mounting means).

The on-board input unit 23 is an input device such as a keyboard, a touch panel, and a mouse, and is used for inputting operation commands and data. The display unit 22 is a display device such as a liquid crystal panel, and displays various information such as various screens such as an operation screen for operation by the mounting input unit 23 . The communication unit 25 is a communication interface, and exchanges signals and data with other component mounting apparatuses M2 and M3, the management computer 3, and the inspection apparatus M4 via the communication network 2. FIG.

5, the inspection apparatus M4 includes an inspection control section 30, an inspection storage section 31, an inspection camera 32, a display section 33, an inspection input section 34, and a communication section . The inspection control unit 30 is an arithmetic device such as a CPU, and has a positional deviation amount calculation unit 30a as an internal processing function. The inspection storage unit 31 is a storage device, and stores mounting data 31a, positional deviation amount data 31b, and the like. The mounting data 31a is data relating to the board 6 on which the component D is mounted, and includes the coordinates of the mounting position (regular position) of the component D on the board 6, the rotation angle of the component D when mounted, the mounted component D It contains information such as the type of

The examination input unit 34 is an input device such as a keyboard, touch panel, mouse, etc., and is used for inputting operation commands and data. The display unit 33 is a display device such as a liquid crystal panel, and displays various information such as various screens such as an operation screen for operation by the examination input unit 34 . A communication unit 35 is a communication interface, and exchanges signals and data with the component mounting apparatuses M2 and M3 and the management computer 3 via the communication network 2 .

The inspection camera 32 images the component D mounted on the board 6 from above. The positional deviation amount calculator 30a calculates the positional deviation amounts ΔX, ΔY, and Δθ (see FIG. 6) of the component D mounted on the board 6 from the normal position N from the image captured by the inspection camera 32. A deviation amount calculation process is executed. The calculated positional deviation amounts ΔX, ΔY, and Δθ are stored in the inspection storage section 31 as the positional deviation amount data 31b and are transmitted to the management computer 3 via the communication section 35 .

In this way, the inspection apparatus M4 includes the inspection camera 32 (imaging unit) that captures the image of the component D, and the positional deviation amounts ΔX, ΔY, and Δθ of the component D from the normal position N from the image captured by the inspection camera 32. positional deviation calculating unit 30a for calculating the positional deviation amount ΔX, ΔY, Δθ from the normal position N of the component D mounted on the board 6 by the component mounting unit 12 (component mounting means). It becomes a quantity acquisition means.

Here, an example of the positional deviation amounts ΔX, ΔY, and Δθ of the component D mounted on the board 6 from the normal position N, which are included in the positional deviation amount data 31b, will be described with reference to FIG. In the mounting operation by the component mounting section 12, the component D picked up by the suction nozzle 11b of the mounting head 11 from the tape feeder 8 of the component supply section 7 is transferred to the normal position N which is the mounting position set on the substrate 6 as a target. to be installed. At this time, the component center C of the component D does not necessarily coincide with the normal position N, and there is a positional deviation amount ΔX in the X direction, a positional deviation amount ΔY in the Y direction, and a θ direction (rotational direction parallel to the mounting surface). is shifted by a positional shift amount Δθ.

These positional deviation amounts ΔX, ΔY, and Δθ are acquired by performing positional deviation amount calculation processing by the positional deviation amount calculation section 30a on the result of imaging the component D mounted on the board 6 by the inspection camera 32. FIG. The positional deviation amounts ΔX, ΔY, and Δθ are acquired for each of the plurality of components D mounted on one board 6 and stored as the positional deviation amount data 31b.

5, the management computer 3 includes a management control section 40, a management storage section 41, a display section 42, a management input section 43, and a communication section 44. FIG. The management input unit 43 is an input device such as a keyboard, touch panel, mouse, etc., and is used for inputting operation commands and data. The display unit 42 is a display device such as a liquid crystal panel, and displays various information such as various screens such as an operation screen for operation by the management input unit 43 . The communication unit 44 is a communication interface, and exchanges signals and data with the component mounting apparatuses M2 and M3 and the inspection apparatus M4 via the communication network 2 .

The management control unit 40 is an arithmetic unit such as a CPU, and has a correction value calculation unit 40a, a correction value transmission unit 40b, a component selection unit 40c, and a selection support unit 40d as internal processing functions. The management storage unit 41 is a storage device, and stores mounting data 41a, component information 41b, misalignment amount data 41c, correction value data 41d, and the like.

The mounting data 41a includes data referred to when the component D is mounted on the board 6, and includes the coordinates of the mounting position (regular position) of the component D on the board 6, the rotation angle of the component D when mounting, the mounting It contains information such as the type of part D to be used. The component information 41b includes information such as the shape and size of the component D to be mounted on the substrate 6, gaps Gx and Gy (see FIG. 8) between the pocket 16b of the carrier tape 16 in which the component D is stored and the component D to be stored. Information is stored in association with the type of part D.

Here, the shape of the component D included in the component information 41b will be described with reference to FIG. FIG. 7(a) shows a plan view of two kinds of parts D(1) and D(2), and FIG. 7(b) shows a side view thereof. The component D(1) and the component D(2) are two-terminal elements such as resistors and capacitors having electrodes Db at both ends of the body portion Da in the X direction. The component D(1) and the component D(2) have the same size in the X direction and the Y direction when viewed from above, but the component D(1) has a wider shape between the electrodes Db. Therefore, the part D(1) has a wider suction surface Dc (the XY plane of the main body portion Da) with which the lower end of the suction nozzle 11b abuts. The allowable range for the deviation of the adsorption position that can be adsorbed to is wide.

Further, the step Dh between the attraction surface Dc and the upper surface of the electrode Db is larger in the part D(2). Therefore, when the suction nozzle 11b picks up including the boundary between the body portion Da and the electrode Db due to the suction displacement, the inclination of the suction posture (the inclination of the component with respect to the horizontal plane) is greater for the component D(2). For these reasons, the component D(2) has the same size as the component D(1), but the mounting position variations (positional deviation amounts ΔX, ΔY, Δθ) caused by the adsorption variation are different from those of the component D(1). be larger than

Here, referring to FIG. 8, the gaps Gx and Gy between the pocket 16b of the carrier tape 16 included in the component information 41b and the stored component D will be described. In FIG. 8(a), the base tape 16a of the carrier tape 16(1) has a recessed pocket 16b for storing the component D(3) and a sprocket of the tape feeder 8 for pitch-feeding the carrier tape 16(1). Feed holes 16c engaged with (not shown) are formed at regular intervals. A cover tape 16d is attached to the upper surface of the pocket 16b containing the component D(3).

Gaps Gx1 and Gx2 in the X direction and gaps Gy1 and Gy2 in the Y direction are generated between the component D(3) stored in the pocket 16b and the inner wall of the pocket 16b. Due to these gaps G, the part D(3) moves irregularly in the pocket 16b during pitch feeding, and the picking position when the picking nozzle 11b picks up the part D(3) varies. Therefore, the mounting position when mounting the component D(3) on the substrate 6 varies.

In FIG. 8B, the pocket 16b of the carrier tape 16(2) contains a component D(4) having the same size as the component D(3). Gaps Gx3 and Gx4 in the X direction and gaps Gy3 and Gy4 in the Y direction are generated between the component D(4) and the inner wall of the pocket 16b. The pocket 16b of the carrier tape 16(2) is larger than the pocket 16b of the carrier tape 16(1), and the gap G (Gx3+Gx4, Gy3+Gy4) generated in the carrier tape 16(2) is generated in the carrier tape 16(1). It is larger than the gap G (Gx1+Gx2, Gy1+Gy2). Therefore, the component D(4) has the same size as the component D(3), but the variation in the mounting position when mounted on the substrate 6 is greater than that of the component D(3).

In FIG. 5, the positional deviation amount data 41c includes the positional deviation amount data 31b including the positional deviation amounts ΔX, ΔY, and Δθ continuously acquired by the inspection device M4 during the production of the mounting substrate. Sent and stored. That is, the management storage unit 41 that stores the positional deviation amount data 41c serves as a positional deviation amount storage unit that continuously stores the positional deviation amounts ΔX, ΔY, and Δθ during production.

The correction value calculator 40a calculates the positional deviation in the X direction from the normal position N of the component D mounted on the board 6, which is acquired by the inspection apparatus M4 (positional deviation amount acquiring means) and stored in the positional deviation amount data 41c. A feedback correction value Vc for correcting the mounting operation of the component mounting section 12 (component mounting means) is calculated based on the amount ΔX and the amount of positional deviation ΔY in the Y direction (hereinafter simply referred to as “positional deviation amounts ΔX, ΔY”). .

Further, the correction value calculator 40a calculates the feedback correction value Vc by statistical processing. As the statistical processing, for example, calculation of an average value of a predetermined number of positional deviation amounts ΔX and ΔY excluding outliers is used. The predetermined number at that time is determined based on the allowable error of the feedback correction value Vc calculated by statistical processing. This makes it possible to calculate the feedback correction value Vc with appropriate accuracy. The feedback correction value Vc calculated by the correction value calculation section 40a is stored in the management storage section 41 as correction value data 41d.

The calculated feedback correction value Vc is used to correct the mounting operation of the component D mounted by the component mounting section 12 . The correction value transmission unit 40b associates the feedback correction value Vc corresponding to the component D to be mounted on the board 6, and transmits it to the component mounting apparatuses M2 and M3 that mount the component D. FIG. The transmitted feedback correction value Vc is stored as correction value data 21b in the mounting storage section 21 of the component mounting apparatuses M2 and M3. As a result, it is possible to accurately correct the mounting position deviation of the component D. FIG.

In FIG. 5, the component selection unit 40c calculates the feedback correction value Vc based on either the shape or the size of the component D included in the mounting data 41a and the component information 41b, or the target mounting accuracy. Select the part D to be used. Then, the correction value calculator 40a calculates the feedback correction value Vc from the positional deviation amounts ΔX and ΔY of the component D selected by the component selector 40c. For example, when selecting the component D, the component selection unit 40c selects the component D(2) shown in FIG. 7 and the component D(4) shown in FIG. Exclude from coverage. As a result, it is possible to accurately correct the mounting position deviation of the component D. FIG.

In this way, the management computer 3 having the component selection unit 40c serves as component selection means for selecting the component D used for calculating the feedback correction value Vc, and the correction value calculation unit 40a (correction value calculation means) serves as component selection means. A feedback correction value Vc is calculated from the positional deviation amounts ΔX and ΔY of the component D selected by . In the component mounting apparatuses M2 and M3, the mounting control section 20 (mounting control means) corrects the mounting operation by the component mounting section 12 (component mounting means) using the feedback correction value Vc.

In FIG. 5, the selection support unit 40d supports the operator to operate the management input unit 43 to select the component D to be used for calculating the feedback correction value Vc. Specifically, based on the mounting data 41a and the component information 41b, the selection support unit 40d supports the selection operation by the worker of the component D to be used for calculating the feedback correction value Vc in the mounting board to be produced. A correction value calculation component selection screen including information on the type of component D is displayed on the display unit 42 .

Then, the selection support unit 40d selects the component D to be used for calculation based on the information input from the correction value calculation component selection screen by the operator operating the management input unit 43. FIG. That is, the management computer 3 (component selection means) has a management input section 43 (input section) that allows the operator to select whether or not each type of component D is used for calculating the feedback correction value Vc. As a result, the operator can select the component D to be used for calculating the feedback correction value Vc, exclude the component D with large mounting variations from the target of use, and accurately correct the mounting position deviation of the component D. can be done.

Here, an example of the correction value calculation component selection screen 42a displayed on the display unit 42 will be described with reference to FIG. "Correction value calculation component selection" is displayed as the title 50 above the correction value calculation component selection screen 42a. The "board name" column 51 displays information for specifying the mounting board. Information specifying the type of the component D is displayed in the “component name” column 52 . The "size" column 53 displays the size of the component D (0402 component, 0603 component, etc.). In the "variation" column 54, the ease of variation ( The variation width of the positional deviation amounts ΔX and ΔY) is displayed in three stages of large, medium, and small.

The "used number" column 55 displays the number of the component D mounted on the mounted board to be produced. In the "selection" column 56, "o" indicates whether the component D is selected as the component D to be used for calculating the feedback correction value Vc, and "-" indicates whether the component D is not selected. Each piece of information displayed on the correction value calculation component selection screen 42a is sorted in descending order in the "variation" column 54. FIG. The operator operates the management input unit 43 in consideration of the displayed information of each component D, and inputs a selection “o” or non-selection “-” in the “selection” column 56 .

Here, a specific example of calculation of the feedback correction value Vc by the correction value calculator 40a will be described with reference to FIG. FIG. 10(a) shows 10 components D1* to D6* and D7 to D10 (indicated by solid lines) mounted on the substrate 6, and the component centers C1 to C10 (indicated by black circles, C7 to C10 being symbols). ), normal positions N1 to N10 (represented by white circles, symbols of N7 to N10 are omitted) that are mounting targets, and the position of the component D when it is mounted at the normal position N (represented by a dashed line).

The six components D1* to D6* are selected by the component selection means (the component selection unit 40c or the selection support unit 40d) as the components D used for calculating the feedback correction value Vc, and the four components tend to have large mounting variations. are excluded from the calculation target of the feedback correction value Vc. That is, in this example, the correction value calculator 40a calculates the feedback correction value Vc from the positional deviation amounts ΔX and ΔY of the components D1* to D6* mounted on the board 6. FIG.

In FIG. 12(b), the positional deviation amounts ΔX and ΔY of the component D1* acquired by the inspection device M4 are shown in an XY graph. The correction value calculator 40a statistically processes (here, calculates the average value) the positional deviation amounts ΔX and ΔY of the component D1* to calculate the feedback correction value Vcx in the X direction and the feedback correction value Vcy in the Y direction. do.

Further, the correction value calculation unit 40a calculates the components D7 to D7 excluded from the calculation target based on the suction nozzle 11b and the component mounting unit 12 for mounting the component D, the mounting position, the rotation angle, the shape and size of the component D, and the like. A feedback correction value Vc of D10 is calculated (appropriated). For example, the component D7 is the component D4* whose mounting position is close, the component D8 is the component D6* which has the same rotation angle, the component D9 is the component D1* which is mounted by the same suction nozzle 11b, and the component D10 is the component D5 which has the same size. The * feedback correction values Vc are used as the respective feedback correction values Vc. The feedback correction values Vc of the components D7 to D10 excluded from the calculation target may be calculated by statistically processing or interpolating the feedback correction values Vc of the selected components D1* to D6*.

As described above, the correction value calculation unit 40a calculates the positional deviation amounts ΔX and ΔY of the component D mounted on the board 6 from the normal position N by the component mounting means (component mounting unit 12). A correction value calculation means for calculating a feedback correction value Vc for correcting the mounting operation of the component mounting means based on the positional deviation amounts .DELTA.X and .DELTA.Y of D.

Also, the management computer 3 having the correction value calculator 40a serves as a correction value calculator. The correction value calculation device and component selection means are not limited to the management computer 3 connected to the component mounting devices M2 and M3, the inspection device M4 and the communication network 2. FIG. The correction value calculation device may be a computer including the correction value calculation section 40a, and may not be connected to the component mounting devices M2 and M3 and the inspection device M4.

Next, along the flow of FIGS. 11 and 12, a component mounting method for correcting the mounting operation using the feedback correction value Vc calculated from the positional deviation amounts ΔX and ΔY of the component D will be described. In FIG. 11, first, the management computer 3 (component selection means) selects a component D to be used for calculating the feedback correction value Vc (ST1: component selection step).

Here, with reference to FIG. 12, the details of the component selection step (ST1), that is, the component selection method will be described. First, the component selection unit 40c determines whether or not the operator selects the component D in accordance with a program or an instruction input from the management input unit 43 (ST11). When the operator inputs (Yes in ST11), the selection support unit 40d displays the correction value calculation component selection screen 42a on the display unit 42, and the operator selects the target components from the management input unit 43 (input unit). D is selected (ST12: input step). That is, the component selection step (ST1) includes an input step (ST12) in which the operator can select whether or not each type of component D is used for calculating the feedback correction value Vc.

If the operator does not enter (No in ST11), the component selection unit 40c automatically selects the component D to be used for calculating the feedback correction value Vc (ST13: automatic selection step). That is, in the component selection step (ST1), the component D to be used for calculating the feedback correction value Vc is selected based on either the shape of the component D or the size of the component D. FIG. In the input step (ST12) or the automatic selection step (ST13), when the component D used for calculating the feedback correction value Vc is selected, the component selection step (ST1) ends.

In FIG. 11, the mounting control unit 20 then corrects the mounting operation using the feedback correction value Vc based on the mounting data 21a and the correction value data 21b, and mounts the component D on the board 6 (ST2: component mounting process).

Next, the inspection camera 32 (imaging unit) images the component D on the board 6 that has been mounted by the component mounting apparatuses M2 and M3 and transported to the inspection apparatus M4 (ST3: imaging step). Next, the positional deviation amount calculation unit 30a calculates the positional deviation amounts ΔX and ΔY of the component D from the normal position N from the image captured in the imaging step (ST3) (ST4: positional deviation amount calculation step). In this manner, the imaging process (ST3) and the positional deviation amount calculation process (ST4) acquire the positional deviation amounts ΔX and ΔY from the normal position N of the component D mounted on the board 6 in the component mounting step (ST2). It becomes a positional deviation amount acquisition step (ST10).

In FIG. 11, the management storage unit 41 then continuously stores the positional deviation amounts ΔX and ΔY transmitted from the inspection device M4 (positional deviation amount acquiring means) during production (ST5: positional deviation amount storing step). Next, based on the positional deviation amounts ΔX and ΔY acquired in the positional deviation amount acquisition step (ST10), the correction value calculator 40a calculates the following from the positional deviation amounts ΔX and ΔY of the component D selected in the component selection step (ST1): A feedback correction value Vc for correcting the mounting operation in the component mounting process (ST2) is calculated (ST6: correction value calculation process).

In FIG. 11, the correction value transmission unit 40b then associates the feedback correction value Vc corresponding to the component D to be mounted on the board 6 and transmits it to the component mounting apparatuses M2 and M3 that mount the component D (ST7: correction value transmission step). When the feedback correction value Vc is transmitted, the process returns to the component mounting step (ST2), and the component D is mounted on the board 6 based on the feedback correction value Vc included in the newly transmitted and stored correction value data 21b. .

In this manner, in the component mounting system 1, the positional deviation amounts ΔX and ΔY are acquired during production of the mounting board, and the mounting operation is corrected based on the feedback correction value Vc calculated during production. That is, during production, the inspection apparatus M4 (positional deviation amount acquisition means) acquires the positional deviation amounts ΔX and ΔY in the positional deviation amount acquisition step (ST10). The calculator 40a (correction value calculator) calculates the feedback correction value Vc.

As described above, the component mounting system 1 of the present embodiment includes component mounting means (the component mounting unit 12) that mounts the component D on the substrate 6, and mounting control means (mounting control means) that controls the mounting operation of the component mounting means. a control unit 20), a positional deviation amount acquiring means (inspection device M4) for acquiring the positional deviation amounts ΔX and ΔY of the component D mounted on the board 6, and a mounting operation based on the acquired positional deviation amounts ΔX and ΔY. correction value calculation means (correction value calculation section 40a) for calculating a feedback correction value Vc for correcting the feedback correction value Vc, and a component selection means (component selection section 40c) for selecting a component D used for calculating the feedback correction value Vc. .

Then, the correction value calculation means calculates a feedback correction value Vc from the positional deviation amounts ΔX and ΔY of the component D selected by the component selection means, and the mounting control means uses the feedback correction value Vc to perform mounting by the component mounting means. correcting the action. As a result, it is possible to accurately correct the deviation in the mounting position of the component D due to the influence of the fluctuation of the apparatus.

In the component mounting system 1, the positional deviation amount acquisition means is not limited to the inspection device M4. For example, the positional deviation amount acquisition means may be composed of the component mounting apparatuses M2 and M3 each having the inspection camera 32 and the positional deviation amount calculation section 30a. Further, the correction value calculation means is not limited to the correction value calculation section 40a provided in the management computer 3. FIG. For example, the correction value calculation means may be configured such that the component mounting apparatuses M2 and M3 are provided with the correction value calculation section 40a.

INDUSTRIAL APPLICABILITY The component mounting system, the component mounting method, and the correction value calculation device of the present invention have the effect of being able to accurately correct component mounting position deviations due to the effects of device fluctuations, and are useful in the field of component mounting on substrates. is.

1 component mounting system 3 management computer (correction value calculation device, component selection means)
6 substrate 12 component mounting section (component mounting means)
32 inspection camera (imaging unit)
43 Management input unit (input unit)
D part M4 inspection device (positional deviation amount acquisition means)
N Normal position ΔX, ΔY Position deviation amount

Claims (15)

component mounting means for mounting components on a substrate;
mounting control means for controlling a mounting operation of mounting a component on a substrate by the component mounting means;
positional deviation amount acquisition means for acquiring a positional deviation amount from a normal position of the component mounted on the board by the component mounting means;
correction value calculation means for calculating, for each component, a feedback correction value for correcting the mounting operation of the component mounting means based on the positional deviation amount of each component acquired by the positional deviation amount acquisition means;
component selection means for selecting the component to be used for calculating the feedback correction value;
The correction value calculation means calculates the feedback correction value by excluding a positional deviation amount of a component that was not selected by the component selection means due to a large variation in the positional deviation amount;
The component mounting system, wherein the mounting control means corrects the mounting operation by the component mounting means using the feedback correction value. 2. The correction value calculating means calculates the feedback correction value of the non-selected component from the positional deviation amount of the selected component, or uses the feedback correction value of the selected component. A component mounting system as described. wherein the positional deviation amount acquisition means comprises an imaging section that captures an image of the part, and a positional deviation amount calculation section that calculates an amount of positional deviation from the normal position of the part based on the image captured by the imaging section. 3. A component mounting system according to item 1 or 2. 4. The component mounting according to claim 1, wherein said positional deviation amount acquisition means acquires said positional deviation amount during production, and said correction value calculation means calculates said feedback correction value during production. system. 5. The component mounting system according to any one of claims 1 to 4, wherein said component selection means includes an input unit that enables a worker to select whether or not to use each type of said component for calculating said feedback correction value. . 5. The component selection means according to any one of claims 1 to 4, wherein the component selection means comprises a component selection unit that selects the component to be used for calculating the feedback correction value based on either the shape of the component or the size of the component. The component mounting system described in . a component mounting process for mounting components on a substrate;
a positional deviation amount acquiring step of acquiring a positional deviation amount from a normal position of the component mounted on the board in the component mounting step;
a correction value calculation step of calculating, for each component, a feedback correction value for correcting the mounting operation in the component mounting step based on the positional deviation amount of each component obtained in the positional deviation amount obtaining step;
a component selection step of selecting the component to be used for calculating the feedback correction value,
In the correction value calculation step, the feedback correction value is calculated by excluding the positional displacement amount of the component that was not selected in the component selection step because the variation in the positional displacement amount is large;
A component mounting method, wherein in the component mounting step, a mounting operation is corrected using the feedback correction value. 8. In the correction value calculating step, the feedback correction value of the non-selected component is calculated from the positional deviation amount of the selected component, or the feedback correction value of the selected component is used. The component mounting method described in . 3. The positional deviation amount acquiring step includes an imaging step of imaging the component, and a positional deviation amount calculating step of calculating an amount of positional deviation from the normal position of the component from the image captured in the imaging step. 9. The component mounting method according to 7 or 8. 10. The part according to any one of claims 7 to 9, wherein the positional deviation amount is obtained in the positional deviation amount obtaining step during production, and the feedback correction value is calculated in the correction value calculating step during production. How to implement. 11. The component mounting method according to any one of claims 7 to 10, wherein said component selection step includes an input step in which an operator can select whether or not each type of said component is used for calculating said feedback correction value. . 11. The part according to any one of claims 7 to 10, wherein in said part selection step, said part used for calculating said feedback correction value is selected based on either the shape of said part or the size of said part. How to implement. Of the positional deviation amounts of the components mounted on the board by the component mounting means from the normal positions, the positional deviation amounts of the components that were not selected by the component selection means due to large variations in the positional deviation amounts are excluded. A correction value calculation device comprising a correction value calculation unit for calculating a feedback correction value for correcting a mounting operation of a component mounting means. 14. The correction value calculation device according to claim 13, further comprising an input unit that allows an operator to select whether or not to use each type of component for calculating the feedback correction value. 14. The correction value calculation device according to claim 13, further comprising a selection control unit that selects the part to be used in calculating the feedback correction value based on either the shape of the part or the size of the part.

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