JP6706769B2 - Component mounting system, component mounting method, and correction value calculation device - Google Patents

Description

The present invention relates to a component mounting system and a component mounting method for mounting a component on a board using a feedback correction value calculated based on a positional deviation amount of the component mounted on the board, and a correction value calculation device for calculating a feedback correction value. It is about.

The component mounting apparatus takes out the component supplied by the component supply apparatus and mounts it on the substrate by a suction nozzle included in a mounting head that horizontally moves by an XY beam composed of an X-axis beam and a Y-axis beam. Conventionally, in order to improve the mounting accuracy of mounting components on the board, the mounting position deviation from the regular position of the parts mounted on the board is inspected with an inspection device, etc., and the feedback correction calculated based on the mounting position deviation amount. The mounting operation of the component mounting apparatus is corrected using the value (for example, refer to Patent Document 1).

In the component mounting system of Patent Document 1, a mounting apparatus displacement amount is detected for each component mounted on a board by an inspection device arranged downstream of the component mounting device, and a feedback correction value calculated for each component is used. The mounting operation in the component mounting apparatus is corrected.

JP, 2016-58603, A

However, in the related art including Patent Document 1, the mounting position deviation is fed back for each component mounted on the substrate, but the cause of the mounting position deviation of the component is the configuration of the component mounting apparatus such as the distortion of the XY beam. There is a problem in that there is room for further improvement in order to improve the mounting accuracy because the part due to various changes in the elements is large.

Therefore, an object of the present invention is to provide a component mounting system, a component mounting method, and a correction value calculation device that can accurately correct the mounting position deviation of a component due to the influence of device fluctuation.

A component mounting system according to the present invention includes a plurality of component mounting units each having a mounting head, and a component mounting apparatus that performs a mounting operation of mounting a component on a substrate by the mounting head of each component mounting unit, and a substrate by the component mounting apparatus. An inspection device that acquires the amount of positional deviation of the component mounted on the substrate, and a correction value calculation unit that calculates a feedback correction value that corrects the mounting operation based on the amount of positional deviation acquired by the inspection device. The correction value calculating means mounts the feedback correction value for each divided area from the positional deviation amount of the selected component among the components mounted in the plurality of divided areas on the board. The component mounting apparatus corrects the mounting operation by the component mounting unit using the feedback correction value.

The component mounting method of the present invention includes a component mounting step of mounting a component on a substrate by a plurality of component mounting sections having mounting heads, and a positional displacement amount for acquiring the positional displacement amount of the component mounted on the substrate in the component mounting step. The correction value calculation includes: an acquisition step; and a correction value calculation step of calculating a feedback correction value for correcting the mounting operation in the component mounting step based on the positional deviation amount acquired in the positional deviation amount acquisition step. In the step, the feedback correction value for each of the plurality of divided areas on the board is calculated for each of the component mounting units from the positional deviation amount of the selected component among the components mounted in the divided area. In the component mounting step, the mounting operation by the component mounting unit is corrected using the feedback correction value.

The correction value calculation device of the present invention is based on a positional deviation amount of a component mounted on a substrate by a component mounting device having a plurality of component mounting portions having a mounting head, and for each of the plurality of divided areas on the substrate, the divided area. A correction value calculation unit that calculates, for each component mounting unit, a feedback correction value that corrects the mounting operation of the component mounting unit based on the positional deviation amount of the selected component among the components mounted therein.

According to the present invention, it is possible to accurately correct the mounting position deviation of a component due to the influence of device variation.

Structure explanatory drawing of the component mounting system of one embodiment of this invention The top view which shows the structure of the component mounting apparatus of one embodiment of this invention. Partial sectional view of a component mounting apparatus according to an embodiment of the present invention Structure explanatory drawing of the mounting head and the component supply part of the component mounting apparatus of one embodiment of this invention Block diagram showing the configuration of the control system of the component mounting system of one embodiment of the present invention Explanatory drawing of the positional shift amount of the component calculated in the inspection apparatus of one embodiment of this invention. (A) (b) Explanatory drawing which shows the example of the shape of the component mounted on the board|substrate in the component mounting apparatus of one embodiment of this invention. (A) (b) Explanatory drawing which shows the example of the pocket of the carrier tape used in the component mounting apparatus of one embodiment of this invention, and the gap of components. Explanatory drawing which shows the example of the division area set in the component mounting system of one embodiment of this invention. Explanatory drawing of the influence on the position shift amount by the distortion of the X-axis beam in the component mounting apparatus of one embodiment of the present invention. (A) An explanatory view showing an example of a component mounted in an imaged divided area by an inspection device according to an embodiment of the present invention (b) An explanation showing a relationship between an example of a calculated positional deviation amount and a feedback correction value Figure Flow diagram of a component mounting method in the component mounting system according to an embodiment of the present invention

An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, and the like described below are examples for description, and can be appropriately changed according to the specifications of the component mounting system, the component mounting apparatus, and the inspection apparatus. In the following, corresponding elements are denoted by the same reference numerals in all the drawings, and overlapping description will be omitted. In FIG. 2 and a part to be described later, as the biaxial directions orthogonal to each other in the horizontal plane, the X direction of the substrate transport direction (left and right direction in FIG. 2) and the Y direction orthogonal to the substrate transport direction (vertical direction in FIG. 2) Is shown. In FIG. 3 and a part to be described later, the Z direction (vertical direction in FIG. 3) is shown as the height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal plane. In FIG. 4 and a part described later, the θ direction, which is the direction of rotation about the axis in the Z direction (Z axis), is shown.

First, the configuration of the component mounting system 1 will be described with reference to FIG. The component mounting system 1 has a function of mounting a component on a substrate to manufacture a mounted substrate, and includes a solder printing device M1, component mounting devices M2 and M3, and an inspection device M4. These devices are connected to the management computer 3 via the communication network 2. The number of component mounting devices M2 and M3 included in the component mounting system 1 is not limited to two, and may be one or three or more.

The solder printing apparatus M1 screen-prints cream solder for joining components on a board to be mounted. The component mounting apparatuses M2 and M3 perform the component mounting operation of transferring and mounting the component taken out from the component supply unit onto the substrate on which the cream solder for component bonding is printed by the component mounting unit 12 (see FIG. 2). The inspection device M4 inspects the mounting state of the component on the board on which the component is mounted by the component mounting devices M2 and M3, and detects the misaligned state of the component from the regular position. The management computer 3 calculates a feedback correction value Vc for correcting the mounting operation which is fed back to the component mounting apparatuses M2 and M3, based on the line management function and the inspection information including the positional deviation amount of the component acquired by the inspection apparatus M4. It also has the function to do.

Next, the configurations of the component mounting apparatuses M2 and M3 will be described with reference to FIGS. Note that FIG. 3 partially shows the AA cross section in FIG. 2. The component mounting apparatuses M2 and M3 have a function of executing a mounting operation for mounting the components supplied from the component supply unit on the board. In FIG. 2, a substrate transfer mechanism 5 is arranged in the X direction at the center of the base 4. The board transfer mechanism 5 carries in the board 6 transferred from the upstream side to the mounting work position and positions and holds it. Further, the board transport mechanism 5 carries out the board 6 on which the component mounting work is completed to the downstream side.

The component supply units 7 are arranged on both sides (front side and rear side) of the board transfer mechanism 5. A plurality of tape feeders 8 are mounted in parallel in each component supply unit 7. The tape feeder 8 pitches the carrier tape in which the pockets for housing the components are formed in the direction from the outside of the component supply unit 7 toward the substrate transport mechanism 5 (tape feeding direction), so that the mounting head of the component mounting unit 12 is mounted. Supplies the component to the component suction position where the component sucks the component.

Y-axis beams 9 provided with linear drive mechanisms are arranged at both ends in the X direction on the upper surface of the base 4 along the Y direction. To the Y-axis beam 9, two X-axis beams 10 (front side and rear side) similarly having a linear drive mechanism are coupled so as to be movable in the Y direction. The X-axis beam 10 is arranged along the X direction. A mounting head 11 is mounted on each of the two X-axis beams 10 so as to be movable in the X direction. The mounting head 11 includes a plurality of suction units 11a that can suction and hold components and can move up and down. A suction nozzle 11b (see FIG. 3) for sucking and holding a component is attached to each lower end of the suction unit 11a.

In FIG. 2, the mounting head 11 moves in the X and Y directions by driving the Y-axis beam 9 and the X-axis beam 10. As a result, the two mounting heads 11 pick up and pick up components from the component pickup positions of the tape feeders 8 arranged in the corresponding component supply units 7 by the suction nozzles 11b and pick up the substrates 6 positioned on the substrate transport mechanism 5. Attach to the mounting point of. That is, the Y-axis beam 9, the X-axis beam 10 and the mounting head 11 form a component mounting portion 12 that mounts a component on the substrate 6. As described above, the component mounting apparatuses M2 and M3 include the two component mounting portions 12 on the front side and the rear side.

A component recognition camera 13 is arranged between the component supply unit 7 and the board transport mechanism 5. When the mounting head 11 that picks up a component from the component supply unit 7 moves above the component recognition camera 13, the component recognition camera 13 images the component held by the mounting head 11 and recognizes the holding posture of the component. To do. A board recognition camera 14 is attached to the plate 10a to which the mounting head 11 is attached. The board recognition camera 14 moves integrally with the mounting head 11.

As the mounting head 11 moves, the board recognition camera 14 moves above the board 6 positioned by the board transport mechanism 5, picks up an image of a board mark (not shown) provided on the board 6, and picks up the board 6. Recognize position. Further, the board recognition camera 14 moves above the component suction position of the tape feeder 8 and recognizes the state of the carrier tape near the component suction position. In the component mounting operation on the substrate 6 by the mounting head 11, the mounting position is corrected in consideration of the component recognition result by the component recognition camera 13 and the substrate position recognition result by the substrate recognition camera 14.

As shown in FIG. 3, a carriage 15 in which a plurality of tape feeders 8 are previously mounted on a feeder base 15a is set in the component supply unit 7. The position of the carriage 15 is fixed in the component supply unit 7 by clamping the feeder base 15a with a clamp mechanism 15b against a fixed base (not shown) provided on the base 4. A trolley 15 holds a tape reel 17 that stores a carrier tape 16 holding a component D in a wound state. The carrier tape 16 pulled out from the tape reel 17 is pitch-fed by the tape feeder 8 to the component suction position by the suction nozzle 11b.

Next, the configuration of the mounting head 11 will be described with reference to FIG. The mounting head 11 includes a plurality of suction units 11a, and each suction unit 11a includes a drive mechanism. By driving the drive mechanism, the suction nozzles 11b attached to the lower ends of the suction units 11a are moved up and down (arrow b), and the suction nozzle 11b is rotated in the θ direction with the nozzle axis AN as the rotation axis (arrow c). ) Is possible.

That is, the mounting head 11 serves as a component suction unit that sucks the component D, rotates the component D in a rotation direction (θ direction) parallel to the mounting surface of the substrate 6 at a predetermined angle, and mounts the component D. The component mounting unit 12 includes a component suction unit and serves as a component mounting unit that mounts the component D on the substrate 6.

Next, the configuration of the control system of the component mounting system 1 will be described with reference to FIG. The management computer 3, the component mounting apparatuses M2 and M3, and the inspection apparatus M4 are connected via the communication network 2. The component mounting apparatuses M2 and M3 include a mounting control unit 20, a mounting storage unit 21, a component mounting unit 12, a display unit 22, an input unit 23, a recognition processing unit 24, and a communication unit 25. The mounting storage unit 21 stores the mounting data 21a and the correction value data 21b in addition to the mounting program for executing the component mounting work described above.

The mounting data 21a is data referred to when the component D is mounted on the board 6, and is the coordinates of the mounting position (regular position) of the component D on the board 6, the rotation angle of the component D when mounting, and the mounting. Information such as the type of the part D to be processed is included. The correction value data 21b includes a feedback correction value Vc transmitted from the management computer 3 described later.

The mounting control unit 20 is an arithmetic device such as a CPU, and controls each unit based on a program or data stored in the mounting storage unit 21 to perform a mounting operation of mounting the component D on the board 6 by the component mounting unit 12. Control. The recognition processing unit 24 detects the position of the board 6 by performing recognition processing on the imaging result obtained by the board recognition camera 14. Further, the recognition processing unit 24 detects the position of the component D in the state of being held by the mounting head 11 by recognizing the image pickup result by the component recognition camera 13.

Then, the mounting control unit 20 performs the mounting operation by the component mounting unit 12 based on the mounting data 21a, the correction value data 21b, the position of the board 6, the position of the component D held in the component mounting unit 12, and the feedback correction value Vc. Is corrected and the component D is mounted on the substrate 6. Further, the mounting control unit 20 mounts the component D held by the mounting head 11 (component suction unit) on the substrate 6 by rotating the component D by the rotation angle specified in the mounting data 21a. In this way, the mounting control unit 20 serves as a mounting control unit that controls the mounting operation of mounting the component D on the substrate 6 by the component mounting unit 12 (component mounting unit).

The input unit 23 is an input device such as a keyboard, a touch panel, and a mouse, and is used when inputting operation commands and data. The display unit 22 is a display device such as a liquid crystal panel, and displays various kinds of information such as various screens such as an operation screen for operation by the input unit 23. The communication unit 25 is a communication interface, and exchanges signals and data with the other component mounting apparatuses M2 and M3, the management computer 3, and the inspection apparatus M4 via the communication network 2.

In FIG. 5, the inspection device M4 includes an inspection control unit 30, an inspection storage unit 31, an inspection camera 32, a display unit 33, an input unit 34, and a communication unit 35. The inspection control unit 30 is a calculation device such as a CPU, and includes a positional deviation amount calculation unit 30a as an internal processing function. The inspection storage unit 31 is a storage device, and stores mounting data 31a, positional deviation amount data 31b, and the like. The mounting data 31a is data regarding the board 6 on which the component D is mounted, and includes the coordinates of the mounting position (regular position) of the component D on the board 6, the rotation angle of the component D when mounting, and the mounted component D. It includes information such as the type.

The input unit 34 is an input device such as a keyboard, a touch panel, and a mouse, and is used when inputting operation commands and data. The display unit 33 is a display device such as a liquid crystal panel, and displays various kinds of information such as various screens such as an operation screen for operation by the input unit 34. The communication unit 35 is a communication interface, and exchanges signals and data with the component mounting apparatuses M2 and M3 and the management computer 3 via the communication network 2.

The inspection camera 32 images the component D mounted on the board 6 from above. The position shift amount calculating unit 30a calculates the position shift amounts ΔX, ΔY, and Δθ (see FIG. 6) from the regular position N of the component D mounted on the board 6 from the image captured by the inspection camera 32. The shift amount calculation process is executed. The calculated positional deviation amounts ΔX, ΔY, and Δθ are stored in the inspection storage unit 31 as positional deviation amount data 31b and transmitted to the management computer 3 via the communication unit 35.

As described above, the inspection apparatus M4 includes the inspection camera 32 (imaging unit) that captures an image of the component D, and the positional deviation amounts ΔX, ΔY, and Δθ from the regular position N of the component D from the image captured by the inspection camera 32. And a positional deviation amount calculation unit 30a for calculating the positional deviation amount ΔX, ΔY, Δθ from the normal position N of the component D mounted on the board 6 by the component mounting unit 12 (component mounting means). It becomes a quantity acquisition means.

Here, with reference to FIG. 6, an example of the positional deviation amounts ΔX, ΔY, and Δθ of the component D mounted on the board 6 from the normal position N included in the positional deviation amount data 31b will be described. In the mounting operation by the component mounting unit 12, the component D taken out from the tape feeder 8 of the component supply unit 7 by the suction nozzle 11b of the mounting head 11 is transferred with the regular position N, which is the mounting position set on the substrate 6, as a target. It will be installed. At this time, the component center C of the component D is not always correctly aligned with the regular position N, and the displacement amount ΔX in the X direction, the displacement amount ΔY in the Y direction, the θ direction (the rotation direction parallel to the mounting surface). It is in a state of being displaced by the displacement amount Δθ.

The positional deviation amounts ΔX, ΔY, and Δθ are acquired by performing positional deviation amount calculation processing by the positional deviation amount calculation unit 30a on the result of imaging the component D mounted on the board 6 by the inspection camera 32. The positional deviation amounts ΔX, ΔY, and Δθ are acquired for each of the plurality of components D mounted on one board 6 and stored as positional deviation amount data 31b.

In FIG. 5, the management computer 3 includes a management control unit 40, a management storage unit 41, a display unit 42, an input unit 43, and a communication unit 44. The input unit 43 is an input device such as a keyboard, a touch panel, and a mouse, and is used when inputting operation commands and data. The display unit 42 is a display device such as a liquid crystal panel, and displays various kinds of information such as various screens such as an operation screen for operation by the input unit 43. The communication unit 44 is a communication interface, and exchanges signals and data with the component mounting apparatuses M2 and M3 and the inspection apparatus M4 via the communication network 2.

The management control unit 40 is an arithmetic device such as a CPU, and includes a correction value calculation unit 40a, a correction value transmission unit 40b, and a component selection unit 40c as internal processing functions. The management storage unit 41 is a storage device, and stores mounting data 41a, component information 41b, divided area information 41c, positional deviation amount data 41d, correction value data 41e, and the like.

The mounting data 41a is data that is referred to when the component D is mounted on the substrate 6, and is the coordinates of the mounting position (regular position) of the component D on the substrate 6, the rotation angle of the component D when mounting, the mounting Information such as the type of the part D to be processed is included. The component information 41b includes the shape and size of the component D mounted on the board 6, the gaps Gx and Gy (see FIG. 8) between the pocket 16b of the carrier tape 16 in which the component D is stored and the component D stored therein, and the like. Information is stored in association with the type of component D.

Here, the shape of the component D included in the component information 41b will be described with reference to FIG. FIG. 7A shows a plan view of the two kinds of parts D(1) and D(2), and FIG. 7B shows a side view thereof. The parts D(1) and D(2) are two-terminal elements such as resistors and capacitors having electrodes Db at both ends in the X direction of the main body Da. The component D(1) and the component D(2) have the same size in the X direction and the Y direction when viewed in a plan view, but the component D(1) has a wider gap between the electrodes Db. Therefore, the component D(1) has a wider suction surface Dc (the XY plane of the main body portion Da) with which the lower end of the suction nozzle 11b abuts, and is normal even when the positions of the suction nozzle 11b and the component D are deviated during component suction. There is a wide tolerance for the displacement of the adsorption position that can be adsorbed on.

Further, the step Dh between the suction surface Dc and the upper surface of the electrode Db is larger in the component D(2). Therefore, the inclination of the adsorption posture (the inclination of the component with respect to the horizontal plane) when the adsorption nozzle 11b adsorbs including the boundary between the main body portion Da and the electrode Db due to the displacement of the adsorption is larger in the component D(2). For these reasons, the component D(2) has the same size as the component D(1), but the mounting position variation (positional shift amounts ΔX, ΔY, Δθ) due to the suction variation is the component D(1). Will be larger than.

Here, the gaps Gx and Gy between the pocket 16b of the carrier tape 16 and the component D stored in the component information 41b will be described with reference to FIG. In FIG. 8A, the base tape 16a of the carrier tape 16(1) has a concave pocket 16b for accommodating the component D(3) and a sprocket for the tape feeder 8 for pitch-feeding the carrier tape 16(1). Feed holes 16c with which (not shown) engage are formed at equal intervals. A cover tape 16d is attached to the upper surface of the pocket 16b accommodating the component D(3).

Gaps Gx1 and Gx2 are formed in the X direction and gaps Gy1 and Gy2 are formed in the Y direction between the component D(3) housed in the pocket 16b and the inner wall of the pocket 16b. Due to these gaps G, the component D(3) moves irregularly in the pocket 16b during pitch feed, and the suction position when the suction nozzle 11b sucks the component D(3) varies. Therefore, the mounting position when mounting the component D(3) on the substrate 6 varies.

In FIG. 8B, the pocket 16b of the carrier tape 16(2) accommodates the component D(4) having the same size as the component D(3). Gaps Gx3 and Gx4 are formed in the X direction and gaps Gy3 and Gy4 are formed in the Y direction between the component D(4) and the inner wall of the pocket 16b. The pocket 16b of the carrier tape 16(2) is larger than the pocket 16b of the carrier tape 16(1), and the gap G(Gx3+Gx4, Gy3+Gy4) generated in the carrier tape 16(2) is generated in the carrier tape 16(1). It is larger than the gap G (Gx1+Gx2, Gy1+Gy2). Therefore, although the size of the component D(4) is the same as that of the component D(3), the variation in the mounting position when mounted on the substrate 6 is larger than that of the component D(3).

In FIG. 5, the divided area information 41c includes information about the divided area R, which is the target range when calculating the feedback correction value Vc described later. A plurality of divided areas R are set on the substrate 6.

Here, an example of the divided area R provided on the substrate 6 will be described with reference to FIG. 9. In this example, a total of 16 divided areas R11 to R44 are set by dividing the rectangular substrate 6 into four equal parts in the X direction and four equal parts in the Y direction. The divided area R is set for each board type and stored in the divided area information 41c in consideration of the size of the board 6, the mounting accuracy, and the like. The divided area R may be set uniformly depending on the mounting work position of the board transfer mechanism 5 without depending on the board type.

In FIG. 5, as the positional deviation amount data 41d, positional deviation amount data 31b including positional deviation amounts ΔX, ΔY, Δθ continuously acquired by the inspection device M4 during the production of the mounting board is sequentially obtained from the inspection device M4. Sent and stored. That is, the management storage unit 41 that stores the positional deviation amount data 41d serves as a positional deviation amount storage unit that continuously stores the positional deviation amounts ΔX, ΔY, and Δθ during production.

The correction value calculation unit 40a detects the positional deviation in the X direction from the regular position N of the component D mounted on the board 6 which is acquired by the inspection device M4 (positional deviation amount acquisition means) and stored in the positional deviation amount data 41d. A feedback correction value Vc for correcting the mounting operation of the component mounting unit 12 (component mounting means) is calculated based on the amount ΔX and the positional displacement amount ΔY in the Y direction (hereinafter, simply referred to as “positional displacement amounts ΔX, ΔY”). .. The correction value calculation unit 40a calculates, for each of the plurality of divided areas R on the board 6, the feedback correction value Vc from the positional deviation amounts ΔX and ΔY of the component D mounted in the divided area R. The significance of calculating the feedback correction value Vc for each divided area R will be described later.

Further, the correction value calculation unit 40a calculates the feedback correction value Vc by statistical processing every time a predetermined number of positional deviation amounts ΔX and ΔY are collected for each divided area R. As the statistical processing, for example, calculation of an average value of a predetermined number of positional deviation amounts ΔX and ΔY excluding outliers is used. The predetermined number at that time is determined based on the allowable error of the feedback correction value Vc calculated by the statistical processing. Thereby, the feedback correction value Vc with appropriate accuracy can be calculated.

Further, the correction value calculation unit 40a uses the positional deviation amounts ΔX and ΔY of the component D mounted on the substrate 6 at a specific one rotation angle by the mounting head 11 (component suction unit). Then, the feedback correction value Vc is calculated. When the suction nozzle 11b mounted on the mounting head 11 is rotated in the θ direction and the component D sucked by the suction nozzle 11b is rotated, due to the mounting condition of the suction nozzle 11b and the distortion of the suction nozzle 11b itself, The center C may move. Even in such a case, by using the positional deviation amounts ΔX and ΔY of the components D having the same rotation angle, the influence of the positional deviation caused by the rotation of the suction nozzle 11b is removed, and the feedback correction value Vc is accurately calculated. be able to.

Further, the correction value calculation unit 40a calculates the feedback correction value Vc for each of the positional deviation amounts ΔX and ΔY of the component D mounted on the board 6 by the predetermined component mounting unit 12 (component mounting means). The significance of calculating the feedback correction value Vc for each component mounting unit 12 that mounts the component D will be described later. The feedback correction value Vc calculated by the correction value calculation unit 40a is stored in the management storage unit 41 as correction value data 41e.

The feedback correction value Vc calculated for each divided area R and for each component mounting unit 12 is used for correcting the mounting operation of all the components D mounted by the component mounting unit 12 in the divided area R. The correction value transmission unit 40b associates the feedback correction value Vc corresponding to the component D mounted on the board 6 and transmits the feedback correction value Vc to the component mounting apparatuses M2 and M3 that mount the component D. The transmitted feedback correction value Vc is stored as the correction value data 21b in the mounting storage unit 21 of the component mounting apparatus M2, M3. As a result, the mounting position deviation of the component D can be accurately corrected.

Here, the significance of calculating the feedback correction value Vc for each component mounting unit 12 and for each divided area R will be described with reference to FIG. 10. The Y-axis beam 9 and the X-axis beam 10 are deformed (thermal deformation) over time due to heat generated by the linear drive mechanism and the like in the process of continuously performing the mounting operation. The degree of thermal deformation differs for each Y-axis beam 9 and each X-axis beam 10. FIG. 10 shows an example in which the X-axis beam 10 is curved (deformed) inward (upward in the drawing) from the normal position to the component mounting apparatuses M2, M3 from the left side of the drawing to the right side of the drawing due to thermal deformation. There is.

FIG. 10 shows the trajectory of the suction nozzle 11b mounted on the mounting head 11 that moves in the X direction on the X-axis beam 10. A locus 11c indicated by a one-dot chain line indicates the position of the suction nozzle 11b when the X-axis beam 10 is not thermally deformed. A locus 11d indicated by a solid line indicates the position of the suction nozzle 11b when the X-axis beam 10 is thermally deformed.

It is assumed that the mounting operation of the mounting head 11 is controlled by the suction nozzle 11b so that the component D is mounted at three regular positions N(1), N(2), and N(3) on the substrate 6. .. When the X-axis beam 10 is not thermally deformed, the normal positions N(1), N(2), and N(3), which are mounting positions, are on the locus 11c. However, due to the thermal deformation of the X-axis beam 10, the position of the component D mounted on the substrate 6 becomes the component centers C(1), C(2), and C(3) and is on the locus 11d.

In FIG. 10, since the thermal deformation of the X-axis beam 10 is small at the position on the left side of the drawing, the positional deviation amounts ΔX and ΔY of the component center C(1) from the normal position N(1) are small. On the other hand, since the thermal deformation of the X-axis beam 10 increases as it goes to the right side of the drawing, the component center C(2) is displaced from the normal position N(2) by the arrow d(2), and the component center C(3) is The position is displaced from the normal position N(3) by the arrow d(3). That is, as the thermal deformation of the X-axis beam 10 increases, the component center C(1), the component center C(2), and the component center C(3) increase in the positional deviation amounts ΔX and ΔY.

In this way, when the positional deviation amounts ΔX and ΔY are different depending on the position on the board 6, if one feedback correction value Vc is calculated for the entire board 6 to correct the mounting operation, the positional deviation depends on the position on the board 6. It may not be corrected properly. Even in such a case, by correcting the mounting operation by calculating the feedback correction value Vc for each of the divided areas R obtained by dividing the board 6 into a plurality of areas, it is possible to accurately correct the mounting position deviation of the component D due to the influence of the device variation. can do. Further, since the influence of the device variation differs for each component mounting unit 12, by calculating the feedback correction value Vc for each component mounting unit 12 to correct the mounting operation, the mounting position shift of the component D due to the influence of the device variation is caused. Can be accurately corrected.

In FIG. 5, the component selection unit 40c calculates the feedback correction value Vc based on the target mounting accuracy, which is either the shape of the component D or the size of the component D included in the mounting data 41a or the component information 41b. Select the part D to be used. For example, when selecting the component D, the component selection unit 40c selects the component D(2) shown in FIG. 7 and the component D(4) shown in FIG. 8 in which the mounting position has a large variation when mounted on the board 6. Exclude from the target. As a result, the mounting position deviation of the component D can be accurately corrected. As described above, the component selection unit 40c serves as a component selection unit that selects the component D to be used for calculating the feedback correction value Vc, and the correction value calculation unit 40a causes the displacement amount ΔX of the component D selected by the component selection unit. , ΔY to calculate the feedback correction value Vc.

Here, a specific example of calculation of the feedback correction value Vc by the correction value calculation unit 40a will be described with reference to FIG. FIG. 11A shows a divided area R23 provided on the substrate 6. In the divided area R23, ten parts D1* to D5*, D6 to D10 (indicated by solid lines) mounted on the board 6 and their parts centers C1 to C10 (indicated by black circles, C6 to C10 are omitted). ), the normal positions N1 to N10 (displayed by white circles, N6 to N10 are not shown) that are mounting targets, and the position of the component D (displayed by a broken line) when mounted at the normal position N are displayed.

The eight components D1* to D5* and D6 to D8 are mounted on the board 6 by the same component mounting unit 12 (for example, the front side component mounting unit 12 of the component mounting apparatus M2). Among these, the components D6 and D7 whose rotation angles when mounted on the board 6 are different from the components D1* to D5* are excluded from the calculation target of the feedback correction value Vc. The component D8 having a shape in which the mounting variation tends to be large is excluded from the calculation target of the feedback correction value Vc by the component selection unit 40c. The components D9 and D10 mounted on the board 6 by the component mounting unit 12 (for example, the component mounting unit 12 of the component mounting apparatus M3) different from the component mounting unit 12 that mounts the components D1* to D5* also have the feedback correction value Vc. Excluded from the calculation target.

That is, the correction value calculation unit 40a, among the plurality of components D1* to D5* and D6 to D10 mounted in the divided area R23, the component D1 mounted on the substrate 6 by the same component mounting unit 12 at the same rotation angle. The feedback correction value Vc is calculated from the positional deviation amounts ΔX and ΔY of * to D5*. In FIG. 11B, the positional deviation amounts ΔX and ΔY of the components D1* to D5* acquired by the inspection device M4 are shown in an XY graph. The correction value calculation unit 40a statistically processes the positional deviation amounts ΔX and ΔY of the components D1* to D5* (in this case, calculates the average value) to obtain a feedback correction value Vcx in the X direction and a feedback correction value Vcy in the Y direction. Are calculated respectively.

As described above, the correction value calculation unit 40a causes the component D mounted on the substrate 6 on the substrate 6 based on the positional deviation amounts ΔX and ΔY from the normal position N of the component D mounted on the substrate 6 by the component mounting means (component mounting unit 12). For each of the plurality of divided areas R, the correction value calculation unit calculates a feedback correction value Vc for correcting the mounting operation of the component mounting unit from the positional deviation amounts ΔX and ΔY of the component D mounted in the divided area R.

The management computer 3 including the correction value calculation unit 40a serves as a correction value calculation device. The correction value calculation device is not limited to the component mounting devices M2 and M3, the inspection device M4, and the management computer 3 connected to the communication network 2. The correction value calculation device may be any computer that includes the correction value calculation unit 40a, and may not be connected to the component mounting devices M2 and M3 and the inspection device M4.

Next, a component mounting method for correcting the mounting operation using the feedback correction value Vc calculated from the positional deviation amounts ΔX and ΔY of the component D will be described along the flow of FIG. First, the component selection unit 40c (component selection means) selects the component D used to calculate the feedback correction value Vc (ST1: component selection step). Next, the mounting control unit 20 corrects the mounting operation using the feedback correction value Vc of the divided area R in which the component D is mounted based on the mounting data 21a and the correction value data 21b, and mounts the component D on the board 6. (ST2: component mounting process). At that time, the mounting control unit 20 rotates the picked-up component D on the substrate 6 at a predetermined angle in a rotation direction parallel to the mounting surface of the substrate 6 based on the mounting data 21a, as necessary.

Next, the inspection camera 32 (imaging unit) captures an image of the component D mounted on the board 6 by the component mounting apparatuses M2 and M3 and conveyed to the inspection apparatus M4 (ST3: imaging step). Next, the positional deviation amount calculation unit 30a calculates positional deviation amounts ΔX and ΔY from the regular position N of the component D from the image captured in the imaging step (ST3) (ST4: positional deviation amount calculation step). As described above, in the imaging step (ST3) and the positional deviation amount calculating step (ST4), the positional deviation amounts ΔX and ΔY of the component D mounted on the substrate 6 in the component mounting step (ST2) from the normal position N are acquired. The positional shift amount acquisition step (ST10) is performed.

In FIG. 12, the management storage unit 41 then continuously stores the positional deviation amounts ΔX and ΔY transmitted from the inspection device M4 (positional deviation amount acquisition means) during production (ST5: positional deviation amount storage step). Next, the correction value calculation unit 40a determines whether or not a predetermined number of positional deviation amounts ΔX and ΔY have been collected for each divided area R and each component mounting unit 12 (ST6: calculation propriety determination step).

When the predetermined number of positional deviation amounts ΔX and ΔY are collected (Yes in ST6), the correction value calculation unit 40a determines the positional deviation amounts ΔX and ΔY on the substrate 6 based on the positional deviation amounts ΔX and ΔY acquired in the positional deviation amount acquisition step (ST10). The mounting operation in the component mounting step (ST2) is corrected from the positional deviation amounts ΔX and ΔY of the component D mounted in the divided area R for each of the plurality of divided areas R and the component mounting unit 12 that mounts the component D. The feedback correction value Vc is calculated (ST7: correction value calculation step). That is, in the correction value calculation step (ST7), the feedback correction value Vc is calculated every time a predetermined number of positional deviation amounts ΔX and ΔY are collected for each divided area R.

Further, in the correction value calculation step (ST7), the feedback correction value Vc is calculated using the positional deviation amounts ΔX and ΔY of the component D mounted at one specific rotation angle among the components D mounted on the substrate 6. To be done. Further, in the correction value calculating step (ST7), the feedback correction value Vc is calculated from the positional deviation amounts ΔX and ΔY of the component D selected in the component selecting step (ST1).

In FIG. 12, the correction value transmission unit 40b then associates the feedback correction value Vc corresponding to the component D mounted on the board 6 and transmits it to the component mounting apparatuses M2 and M3 that mount the component D (ST8: Correction value transmission process). When the feedback correction value Vc is transmitted, the process returns to the component mounting step (ST2), and the component D is mounted on the substrate 6 based on the feedback correction value Vc included in the correction value data 21b newly transmitted and stored. . When it is determined in the calculation propriety determination step (ST6) that the predetermined number of positional deviation amounts ΔX and ΔY are not gathered (No), the feedback correction value Vc is not calculated and the process returns to the component mounting step (ST2), The component D is mounted on the substrate 6 based on the stored correction value data 21b.

As described above, in the component mounting system 1, the positional deviation amounts ΔX and ΔY are acquired during the production of the mounting board, and the mounting operation is corrected based on the feedback correction value Vc calculated during the production. That is, the inspection device M4 (positional deviation amount acquisition means) acquires the positional deviation amounts ΔX and ΔY in the positional deviation amount acquisition step (ST10) during production, and the correction values in the correction value calculation step (ST7) during production. The calculation unit 40a (correction value calculation means) calculates the feedback correction value Vc.

As described above, the component mounting system 1 according to the present exemplary embodiment includes the component mounting unit (component mounting unit 12) for mounting the component D on the board 6 and the mounting control unit (mounting) for controlling the mounting operation by the component mounting unit. The control unit 20), the positional deviation amount acquisition means (inspection device M4) for acquiring the positional deviation amounts ΔX, ΔY of the component D mounted on the board 6, and the mounting operation based on the acquired positional deviation amounts ΔX, ΔY. Correction value calculation means (correction value calculation section 40a) for calculating a feedback correction value Vc for correcting

Then, the correction value calculation means calculates, for each of the plurality of divided areas R on the board 6, the feedback correction value Vc from the positional deviation amounts ΔX and ΔY of the components D mounted in the divided area R, and the mounting control means , The mounting operation by the component mounting means is corrected using the feedback correction value Vc of the divided area R in which the component D is mounted. As a result, it is possible to accurately correct the mounting position deviation of the component D due to the influence of the device variation such as thermal deformation.

In addition, in the component mounting system 1, the position shift amount acquisition means is not limited to the inspection device M4. For example, the positional deviation amount acquisition means may be configured by the component mounting apparatuses M2 and M3 including the inspection camera 32 and the positional deviation amount calculation unit 30a. Further, the correction value calculation means is not limited to the correction value calculation unit 40a included in the management computer 3. For example, the correction value calculation means may be configured such that the component mounting apparatuses M2 and M3 include the correction value calculation unit 40a.

INDUSTRIAL APPLICABILITY The component mounting system, the component mounting method, and the correction value calculation device of the present invention have the effect of being able to accurately correct the mounting position deviation of a component due to the influence of device fluctuation, and are useful in the field of mounting a component on a board. Is.

1 Component mounting system 3 Management computer (correction value calculation device)
6 board 11 mounting head (component suction part)
12 component mounting section 32 inspection camera (imaging section)
D component M2, M3 component mounting device M4 inspection device N regular position R division area ΔX, ΔY displacement amount

Claims (15)

A component mounting apparatus having a plurality of component mounting sections having mounting heads, each of which mounts a component on a substrate by the mounting head of the component mounting section;
An inspection device that acquires a positional deviation amount of a component mounted on a board by the component mounting device,
Correction value calculating means for calculating a feedback correction value for correcting the mounting operation based on the positional deviation amount acquired by the inspection device,
The correction value calculation means calculates the feedback correction value for each divided area from the positional deviation amount of the selected component among the components mounted in a plurality of divided areas on the board. Calculated for each
The component mounting system, wherein the component mounting apparatus corrects the mounting operation by the component mounting unit using the feedback correction value. The component mounting system according to claim 1, wherein the inspection device includes an imaging unit that images the component, and a displacement amount calculation unit that calculates the displacement amount from an image captured by the imaging unit. The component mounting system according to claim 1, wherein the inspection device acquires the positional deviation amount during production, and the correction value calculation unit calculates the feedback correction value during production. The component mounting unit includes a component adsorption unit that adsorbs the component, rotates the component at a predetermined angle, and mounts the component on a substrate,
The correction value calculation means calculates the feedback correction value using the positional deviation amount of the component mounted on the board at a specific one rotation angle by the component suction unit. The component mounting system according to any one of claims 1 to 3. Further comprising a position shift amount storage unit for continuously storing the position shift amount during production,
The component mounting system according to claim 1, wherein the correction value calculation unit calculates the feedback correction value every time a predetermined number of the positional deviation amounts are collected for each of the divided areas. The component mounting system according to claim 1, further comprising a component selection unit that selects the component used to calculate the feedback correction value. A component mounting step of mounting a component on a substrate by a plurality of component mounting units having a mounting head,
A positional deviation amount acquiring step of acquiring a positional deviation amount of the component mounted on the board in the component mounting step,
A correction value calculating step of calculating a feedback correction value for correcting the mounting operation in the component mounting step, based on the positional deviation amount acquired in the positional deviation amount acquiring step,
In the correction value calculation step, the feedback correction value for each of the plurality of divided areas on the board is calculated based on the positional deviation amount of the selected component among the components mounted in the divided area. Calculated for each
A component mounting method, wherein in the component mounting step, a mounting operation by the component mounting unit is corrected using the feedback correction value. The component according to claim 7, wherein the misregistration amount acquisition step includes an imaging step of imaging the part, and a misregistration amount calculation step of calculating the misregistration amount from an image imaged in the imaging step. How to implement. 9. The component mounting method according to claim 7, wherein the positional deviation amount is acquired in the positional deviation amount acquiring step during production, and the feedback correction value is calculated in the correction value calculating step during production. In the component mounting step, the component suction portion that has suctioned the component is mounted by rotating it at a predetermined angle,
8. The feedback correction value is calculated in the correction value calculation step using the positional deviation amount of the component mounted at a specific one rotation angle among the components mounted on the board. 10. The component mounting method according to any one of 1 to 9. The method further includes a positional deviation amount storing step of continuously storing the positional deviation amount during production,
The component mounting method according to claim 7, wherein in the correction value calculation step, the feedback correction value is calculated every time a predetermined number of the positional deviation amounts are collected for each of the divided areas. The component mounting method according to claim 7, further comprising a component selecting step of selecting the component used for calculating the feedback correction value. Based on the positional displacement amount of the component mounted on the substrate by the component mounting apparatus having a plurality of component mounting units having mounting heads, for each of the plurality of divided areas on the substrate, among the components mounted in the divided area A correction value calculation device comprising: a correction value calculation unit that calculates, for each component mounting unit, a feedback correction value that corrects a mounting operation of the component mounting unit from the amount of positional displacement of the selected component. The correction value calculation unit calculates the feedback correction value using the positional deviation amount of the component mounted at a specific one rotation angle among the components mounted on the board. The correction value calculation device described. 15. The correction value calculation device according to claim 13, wherein the correction value calculation unit calculates the feedback correction value each time a predetermined number of the positional deviation amounts are collected for each of the divided areas.

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