WO2022029879A1

WO2022029879A1 - Tape feeder test device and tape feeder test device correction method

Info

Publication number: WO2022029879A1
Application number: PCT/JP2020/029811
Authority: WO
Inventors: 和美星川; 賢司下坂; 大輔鈴木
Original assignee: 株式会社Fuji
Priority date: 2020-08-04
Filing date: 2020-08-04
Publication date: 2022-02-10
Also published as: JP7428807B2; JPWO2022029879A1

Abstract

Provided are a tape feeder test device capable of detecting a supply position by imaging a device-side mark, even when tape feeders of various sizes are mounted thereto, and a tape feeder test device correction method.　A tape feeder test device equipped with: a device main body section to which it is possible to attach a jig provided with a jig-side mark in a location which corresponds to a supply position where a component is supplied from a tape feeder; a support member which is secured to the device main body section; a device-side mark supported by the support member; and an imaging device for imaging the jig-side mark and the device-side mark.

Description

Correction method in tape feeder inspection device and tape feeder inspection device

The present disclosure relates to a tape feeder inspection device that inspects a supply position for supplying parts from a tape feeder, and a correction method in the tape feeder inspection device.

Conventionally, there is a taping device that controls the feed amount of a tape accommodating an electronic component based on the image pickup data captured by the image pickup device (for example, Patent Document 1). The taping device of Patent Document 1 is provided with a reference position mark on the upper surface of the tape feeding device for feeding the tape. The taping device measures the amount of misalignment with respect to the reference position mark in the imaging data, and controls the feed amount so as to eliminate the amount of misalignment.

Japanese Unexamined Patent Publication No. 2011-11748

By the way, the tape feeder inspection device that inspects the tape feeder that sends out the tape and supplies the electronic components detects the amount of deviation of the supply position that supplies the electronic components from the tape feeder. The tape feeder inspection device detects the amount of deviation by, for example, comparing the reference mark with the supply position of the actually mounted tape feeder. However, the size of the tape feeder attached to the tape feeder inspection device varies depending on the width of the tape and the like. Therefore, if a reference mark is provided on the feeder mounting member or the like on which the tape feeder is mounted, the tape feeder and the mark may interfere with each other depending on the size of the tape feeder to be inspected.

This disclosure has been made in view of the above circumstances, and even when tape feeders of various sizes are attached, the tape feeder inspection device and the tape feeder inspection capable of capturing the device side mark and detecting the supply position. An object of the present invention is to provide a correction method in an apparatus.

In order to solve the above problems, in the present disclosure, a jig having a jig side mark at a position corresponding to a supply position for supplying parts from a tape feeder can be attached to a device main body and the device main body. Disclosed is a tape feeder inspection device including a support member fixed to the support member, a device-side mark supported by the support member, and an image pickup device for imaging the jig-side mark and the device-side mark. Further, the content of the present disclosure is not limited to the implementation of the tape feeder inspection device, and can be implemented as a correction method in the tape feeder inspection device, for example.

According to the correction method in the tape feeder inspection device and the tape feeder inspection device of the present disclosure, the jig can be attached to the main body of the device and the jig side mark of the jig and the device side mark can be imaged. Remove the jig, attach the tape feeder to be inspected to the equipment holding part, attach the jig in advance, and image the jig side mark, and the supply position based on the position of the device side mark when the tape feeder is attached. It is possible to inspect the amount of deviation. Then, the device side mark is supported by a support member fixed to the device main body. As a result, the position of the device side mark is set to a position away from the tape feeder by the support member, so that the device side mark can be imaged and the supply position can be detected even when tape feeders of various sizes are attached. ..

It is a perspective view which shows the electronic component mounting apparatus which mounted the tape feeder. It is a top view of the tape feeder, and is the figure which shows the tip part of the tape feeder in the Y-axis direction. It is a perspective view which shows the tape feeder holding stand of the electronic component supply apparatus. It is a perspective view of a tape feeder inspection apparatus and a tape feeder. It is a perspective view which shows the state which attaches a jig to a tape feeder inspection apparatus. It is an enlarged view which shows the upper surface of the tip of a jig. It is a schematic diagram which shows the state which attached the tape feeder to the attachment member, and looked at the supply position from above. It is a schematic diagram which shows the structure of an image pickup apparatus and a support member. It is a schematic diagram which shows the state which changed the imaging direction. It is a figure which shows the image pickup area. It is a figure for demonstrating another example correction method. It is a schematic diagram which shows the structure of the support member of another example.

Hereinafter, an embodiment of the tape feeder, which is the inspection target of the tape feeder inspection apparatus of the present disclosure, will be described in detail with reference to the drawings.

(Configuration of electronic component mounting device)
First, an electronic component mounting device to which a tape feeder can be mounted will be described. FIG. 1 is a perspective view in which a part of the exterior parts of the electronic component mounting device (hereinafter, may be abbreviated as “mounting device”) 10 is removed. The mounting device 10 includes two electronic component mounting machines (hereinafter, may be abbreviated as “mounting machine”) 13 on the system base 12, and performs work of mounting electronic components on a circuit board. In the following description, the direction in which the mounting machines 13 are lined up is the X-axis direction, the direction parallel to the plane of the circuit board to be conveyed orthogonal to the X-axis direction is the Y-axis direction, and the direction orthogonal to the X- and Z-axis directions. It will be described as the Z-axis direction.

Each of the mounting machines 13 of the mounting device 10 mounts the mounting machine main body 19 having the beam portion 17 mounted on the frame portion 15, the transport device 21 for transporting the circuit board in the X-axis direction, and the electronic components on the circuit board. It is provided with a mounting head 23 to be mounted. The mounting machine 13 moves the mounting head 23 in the X and Y axis directions by the moving device 25 of the beam unit 17. A supply device 27 for supplying electronic components to the mounting head 23 is provided in front of the frame portion 15.

The mounting head 23 has a suction nozzle 31 that sucks electronic components, and mounts the electronic components on the circuit board fixed by the transport device 21. The suction nozzle 31 has a structure in which, for example, an electronic component is sucked and held by a negative pressure, and the held electronic component is released by supplying a slight positive pressure. The mounting head 23 of this embodiment is provided with, for example, a plurality of suction nozzles 31, and electronic components can be simultaneously sucked from each of the plurality of tape feeders 33 attached to the supply device 27 described later by the plurality of suction nozzles 31. ing. The mounting head 23 is provided with an elevating device or the like for elevating and lowering the suction nozzle 31. The mounting head 23 includes, for example, a plurality of suction nozzles 31 arranged side by side in the X-axis direction, and the plurality of suction nozzles 31 are simultaneously lowered along the Z-axis direction, and a plurality of tape feeders 33 arranged side by side in the X-axis direction. Adsorbs multiple electronic components from. The device for holding the electronic component included in the mounting head 23 is not limited to the suction nozzle 31, and may be, for example, a chuck that sandwiches and holds the electronic component. Further, the mounting head 23 may be configured to sequentially suck a plurality of suction nozzles 31 without executing simultaneous suction.

The supply device 27 is arranged at the end (front end) of the frame portion 15 in the Y-axis direction, and includes a tape feeder holding base 35 to which a plurality of tape feeders 33 can be attached and detached. The reel 37 of the tape feeder 33 is wound with a taped component 41 (see FIG. 2) in which the electronic component 39 is taped. As shown in FIG. 2, the taped component 41 includes a carrier tape 46 in which a large number of accommodating recesses 43 and feed holes 44 are formed at equal pitches, and a top cover tape 45 that covers the accommodating recess 43 in which the electronic component 39 is accommodated. And have. As shown in FIG. 3, a sprocket 49 is built in the feeder main body 47 of the tape feeder 33. The taped component 41 of the reel 37 is pulled out to the upper end surface of the feeder main body 47. The sprocket 49 is provided at the tip of the tape feeder 33, engages a protrusion formed on the outer peripheral portion with a feed hole 44 formed in the carrier tape 46, and feeds the taped component 41 in the Y-axis direction while rotating. ..

As shown in FIG. 2, a metal frame 51 is provided at the tip of the upper surface of the feeder main body 47. The frame 51 has an opening 51A formed at the upper portion of the tip in the Y-axis direction. The tip side of the top cover tape 45 is held by a peeling device (not shown) in a state of being engaged with the opening 51A, and is pulled in the direction opposite to the feeding direction according to the feeding of the taped component 41 by the sprocket 49. It is stripped from the carrier tape 46. The accommodating recess 43 is sequentially released in the opening 51A according to the feeding of the taped component 41. The tape feeder 33 opens the accommodating recess 43 at the predetermined supply position P1 so that the electronic component 39 can be taken out. The suction nozzle 31 of the mounting head 23 sucks the electronic component 39 from the accommodating recess 43 released at the supply position P1.

Further, as shown in FIG. 3, the tape feeder holding table 35 includes a slide portion 61 and an upright surface portion 63. A plurality of slide grooves 65 are formed in the slide portion 61 along the Y-axis direction. The tape feeder 33 can be slid with respect to the slide portion 61 in a state where the rail 67 provided at the lower part of the feeder main body 47 is fitted in the slide groove 65. The upright surface portion 63 is erected at the end of the slide portion 61 on the transport device 21 side in the Y-axis direction. A connector 71 and a pair of upright pins 73 are provided at the tip of the feeder main body 47. Further, the erection surface portion 63 is provided with a connector connection portion 69 connected to the connector 71 and a pair of fitting holes 75 into which a pair of erection pins 73 are inserted. The tape feeder 33 is slid and moved by the slide portion 61, the connector 71 is connected to the connector connection portion 69, the upright pin 73 is inserted into the fitting hole 75, and the tape feeder 33 is mounted on the tape feeder holding base 35. The tape feeder 33 receives a command from the mounting device 10 through the connector 71, and is in a state where the electronic component 39 can be supplied at the supply position P1.

(Configuration of tape feeder inspection device)
Next, a tape feeder inspection device for inspecting the above-mentioned tape feeder 33 will be described. FIG. 4 shows a perspective view of the tape feeder inspection device (hereinafter referred to as an inspection device) 81 of this embodiment. FIG. 5 is a perspective view showing a state in which the jig 82 is attached to the inspection device 81. As shown in FIGS. 4 and 5, the inspection device 81 includes a device main body 83, a support member 86, an image pickup device 87, and a control device 91. Further, the device main body 83 includes a feeder mounting member (hereinafter referred to as a mounting member) 85 and an image pickup device mounting member 89.

The device main body 83 has a flat plate 95 supported by the legs 93. The mounting member 85 is fixed to the upper surface of the flat plate 95 and has the same structure as the tape feeder holding base 35 (see FIG. 3), so that one tape feeder 33 can be mounted. Specifically, the mounting member 85 includes a slide groove 65 of the tape feeder holding base 35 shown in FIG. 3, a connector connection portion 69, a slide groove 97 having the same structure as each of the fitting holes 75, and a pair of connector connection portions 98. Has a fitting hole 99 of. The similar structure referred to here is not limited to a structure that completely matches, and may be a structure simplified to the extent that a member to be attached such as a rail 67 of the tape feeder 33 can be attached. The support member 86 is a member that supports the device-side mark 124 (see FIG. 8) described later. The support member 86 is fixed to, for example, the upper end of a portion (a portion corresponding to the upright surface portion 63) of the mounting member 85 where the connector connecting portion 98 and the like are provided. Details of the structure of the support member 86 and the like will be described later.

The image pickup device mounting member 89 is fixed to the flat plate 95. The image pickup apparatus 87 is supported by the image pickup apparatus attachment member 89 above the attachment member 85, and is fixed so that the image pickup direction is directed downward. The image pickup apparatus 87 can take an image of the supply position P1 of the tape feeder 33 attached to the attachment member 85. The image pickup device mounting member 89 includes a plurality of adjustment screws 101 for adjusting the image pickup position of the image pickup device 87.

The control device 91 is provided below the flat plate 95 and is connected to the image pickup device 87 via the image cable 103. The control device 91 includes, for example, a CPU, RAM, ROM, etc., and is mainly composed of a computer, and performs image processing on the image pickup data of the image pickup device 87. The control device 91 detects the supply position P1 and the like of the tape feeder 33 attached to the attachment member 85 based on the image pickup data.

As shown in FIG. 5, the jig 82 is formed by simulating a part of the tape feeder 33 (the tip portion where the upright pin 73 is provided), and can be carried by an operator by hand. ing. The jig 82 is provided with a rail (not shown) having the same structure as the rail 67 at the lower portion, and can slide and move through the slide groove 97. Further, as shown in FIG. 6, the jig 82 has a pair of upright pins 105 that can be inserted into the fitting holes 99 of the mounting member 85. A plurality of jig side marks 107 are provided on the upper surface 82A of the jig 82. The jig side mark 107 is, for example, a circular mark printed on the upper surface 82A, and is provided at a position corresponding to the supply position P1. In this embodiment, four jig side marks 107 are provided on the upper surface 82A. The four jig-side marks 107 are provided, for example, at positions corresponding to the four vertices of one square. The intersection of the lines connecting the two jig-side marks 107, that is, the intersection of the diagonal lines of the square with the four jig-side marks 107 as the vertices (center of gravity, hereinafter referred to as the reference point P2) is the reference for inspecting the supply position P1. It becomes the position of.

Specifically, FIG. 7 shows a state in which the tape feeder 33 is attached to the attachment member 85 and the supply position P1 is viewed from above, and the position of the jig side mark 107 imaged by attaching the jig 82 in advance. Are superimposed and illustrated. For example, as shown in FIG. 7, the position of the image pickup apparatus 87 is adjusted so that the reference point P2 of the four jig-side marks 107 captured and detected in advance is the center of the image pickup region 109 of the image pickup apparatus 87. Adjust with screw 101 (see FIG. 4). The control device 91 sets XY coordinates in the image pickup region 109, for example. The control device 91 stores the position of the jig 82 mark 107 imaged by the image pickup device 87 in the image pickup region 109 with the jig 82 attached in XY coordinates.

The worker removes the jig 82, attaches the tape feeder 33 to be inspected to the mounting member 85, and causes the inspection device 81 to perform the inspection. As shown in FIG. 7, the control device 91 has a position of a reference point P2 set by imaging the jig 82 in advance and a supply position P1 (for example, a reference point P2) imaged with the tape feeder 33 attached. An error in the position of the nearest accommodating recess 43) is detected, and information such as the detected error is notified as an inspection result. The method of notifying the test result is not particularly limited. For example, the control device 91 displays an error in the XY coordinates of the reference point P2 and the supply position P1 on a display unit (not shown) of the inspection device 81, a PC connected to the control device 91, or the like. The operator adjusts the tape feeder 33 based on the displayed information, and makes the positions of the supply position P1 and the reference point P2 coincide with each other in the X-axis direction and the Y-axis direction. The operator performs the same work on the plurality of tape feeders 33 to match the relative positions of the supply positions P1 of the plurality of tape feeders 33. The adjustment method for matching the supply position P1 with the reference point P2 is not particularly limited. For example, the worker may manually adjust the rotation position and rotation speed of the sprocket 49, the holding position of the taped component 41 with respect to the tape feeder 33, and the like. Alternatively, the inspection device 81 may automatically adjust the rotation position of the sprocket 49, the rotation speed of the motor of the drive source of the sprocket 49, and the like. Further, a method of storing the error of the XY coordinates of the reference point P2 and the supply position P1 and using it for the work of mounting the electronic component on the circuit board may be used. For example, the error in the inspection result may be stored in the mounting device 10 without performing individual adjustments of the tape feeder 33 including the sprocket 49. Then, when the mounting device 10 sucks the electronic component from the tape feeder 33 by the suction nozzle 31, the suction position of the electronic component may be corrected based on the error of each tape feeder 33. Alternatively, when the mounting device 10 mounts the electronic component on the circuit board, the error between the position of the electronic component sucked by the suction nozzle 31 and the mounting position of the circuit board is corrected based on the error of each tape feeder 33. You may. That is, the error for each tape feeder 33 may be adjusted by the mounting device 10 at the time of suction or mounting without adjusting the supply position P1 of the tape feeder 33. Further, the adjustment for the tape feeder 33 and the adjustment by the mounting device 10 may be used in combination.

Here, while inspecting while replacing the plurality of tape feeders 33 with the mounting member 85, there is a possibility that the position of the jig side mark 107 once imaged and stored may be displaced. For example, when heat is generated in the image pickup device 87 due to the image pickup operation, the position (imaging direction) of the image pickup device 87 is displaced, and the position of the stored jig side mark 107 is relatively displaced with respect to the tape feeder 33 to be inspected. There is a possibility that it will end up. Therefore, in the inspection device 81 of this embodiment, in addition to the jig side mark 107, the device side mark 124 supported by the support member 86 is used.

More specifically, as shown in FIG. 8, the image pickup apparatus 87 includes a camera housing 111 and a reflection housing 113. The camera housing 111 includes an image sensor 115 and a lens 117. The substrate 116 on which the image sensor 115 is mounted is fixed in the camera housing 111. The image pickup device 115 is, for example, an image pickup device such as a CCD or CMOS. The lens 117 is fixed to the camera housing 111 so that the image pickup center of the image pickup element 115 and the center of the lens coincide with each other.

The reflective housing 113 is attached to the camera housing 111 and has a first prism 119. The first prism 119 is an example of the image pickup reflective member of the present disclosure, and the relative position and angle with respect to the image pickup element 115 are fixed by the reflection housing 113. The first prism 119 is fixed by the reflection housing 113 after adjusting the reflection angle. For example, the image pickup direction of the image pickup element 115 is bent by 90 degrees, and the reflection angle is adjusted so that the image pickup direction of the image pickup element 115 faces the mounting member 85 (jig 82 or tape feeder 33). The image pickup apparatus 87 bends the image pickup direction by 90 degrees by the first prism 119, and takes an image of the jig 82 and the tape feeder 33 attached to the attachment member 85. The image pickup reflecting member that changes the image pickup direction of the image pickup element 115 is not limited to the prism, and may be another reflection member such as a member whose surface is processed by a mirror or a reflection film.

The image pickup device mounting member 89 has, for example, a base 121, a first bracket 122, and a second bracket 123. The base portion 121 is formed of, for example, a metal, a resin, or the like, and the base end portion is fixed to a flat plate 95 (see FIG. 4). A second bracket 123 is attached to the base 121 with the first bracket 122 interposed therebetween. The first bracket 122 is, for example, a member made of a resin material. The second bracket 123 is, for example, a metal member made of aluminum. The camera housing 111 is fixed to the second bracket 123 with bolts or the like.

Further, the support member 86 is formed by bending a plate-shaped member, for example, and the base end portion is fixed to the mounting member 85 and extends from the mounting member 85. The support member 86 is made of, for example, a metal or a resin. A set of device-side marks 124 and a second prism 125 are attached to the tip of the support member 86. The device-side mark 124 is, for example, a circular member. The device-side mark 124 is arranged outside the image pickup range 127 reflected by the first prism 119, and is an image pickup element via a second prism 125 arranged in the image pickup range 127 reflected by the first prism 119. It is designed to be reflected in 115. The support member 86 supports the device-side mark 124 and the second prism 125 at positions that do not interfere with the jig 82 and the tape feeder 33 attached to the mounting member 85. For example, the support member 86 supports the device-side mark 124 and the second prism 125 above the mounting member 85. As a result, even if the width of the tape feeder 33 to be inspected (tape width of the taped component 41) becomes large, the device side mark 124 and the second prism 125 are supported without interfering with the tape feeder 33 to be inspected. It can be reflected. The second prism 125 is an example of the mark reflective member of the present disclosure. The mark reflective member is not limited to the prism, and may be another reflective member such as a mirror or a member whose surface is processed with a reflective film.

Further, the first distance L1 between the device-side mark 124 and the second prism 125 becomes equal to the second distance L2 between the jig 82 or the tape feeder 33 attached to the mounting member 85 and the second prism 125. ing. More specifically, for example, the upper surface 82A of the jig 82 has a plane along the X-axis direction and the Y-axis direction, and the jig side mark 107 is provided on the plane. The second prism 125 is arranged in the imaging range 127 reflected by the first prism 119, and the device-side mark 124 is located at a position separated from the second prism 125 by the first distance L1 along the Y-axis direction (imaging range 127). It is located at a position away from the outside of. The first distance L1 is, for example, a straight line distance along the Y-axis direction connecting the center of the circular device-side mark 124 and the center of the reflection surface of the second prism 125. The second distance L2 is, for example, the distance between the center of the reflecting surface of the second prism 125 and the upper surface 82A, and is a straight line distance along the Z-axis direction. The second distance L2 is the distance between the center of the reflective surface of the second prism 125 and the upper surface near the supply position P1 of the tape feeder 33 attached to the attachment member 85. In other words, the second distance L2 is the length of the perpendicular line drawn from the second prism 125 to the upper surface of the jig 82 or the tape feeder 33. In this way, the first distance L1 and the second distance L2 are set to the same distance, the device side mark 124 is reflected and reflected on the image pickup element 115, so that the upper surface (upper surface 82A, etc.) of the jig 82 or the tape feeder 33 is reflected. ), That is, the image can be taken as if the device-side mark 124 is arranged on the same plane as the jig-side mark 107 and the upper surface of the carrier tape 46.

Therefore, in this embodiment, the second prism 125 is arranged at the same distance from both the device side mark 124 and the jig 82. The device-side mark 124 reflected by the second prism 125 and reflected on the image pickup device 87 is projected as if it were on the upper surface 82A of the jig 82. Then, by matching the first and second distances L1 and L2, when the image pickup device 87 is focused on the jig 82 or the tape feeder 33, the device side mark 124 is also in focus (focused). Will be. As a result, the position, shape, and the like of the device-side mark 124 can be accurately detected based on the imaging data, and the accuracy of correction of the reference point P2, which will be described later, can be improved.

Here, for example, when energization of the image sensor 115 or the substrate 116 is started, heat is generated from the periphery of the image sensor 115, and the temperature inside the camera housing 111 eventually rises. For example, as shown in FIG. 9, the temperature rise of the image sensor 115 and the camera housing 111 causes the first bracket 122, the second bracket 123, and the like to expand, and the image pickup direction of the image pickup device 87 changes. The image pickup direction of the image pickup apparatus 87 is tilted downward in the Z direction (see the arrow in FIG. 9). The change in the image pickup direction due to the temperature rise is gradual, and the image pickup element 115 or the like is saturated in about one hour after the energization is started. As the imaging direction changes, the position of the jig side mark 107 set in the imaging area 109 deviates from the position where the jig 82 is initially attached and imaged with the passage of time. As a result, an error occurs in the detection accuracy of the supply position P1 based on the jig side mark 107. For example, if the position of the initially set jig side mark 107 shifts with the passage of time, the supply position P1 of the tape feeder 33 inspected and adjusted in order is adjusted to a position shifted from each other. As a result, even if the plurality of adjusted tape feeders 33 are mounted on the mounting device 10, the supply positions P1 are deviated from each other, so that simultaneous suction by the mounting head 23 becomes difficult.

On the other hand, if, for example, waiting until the change in the imaging direction is saturated, the inspection start time will be delayed. Further, if the jig 82 is attached and the jig side mark 107 is re-imaged every time the tape feeder 33 is imaged, the inspection time becomes long. Further, if an attempt is made to prepare a member, a structure, and an inspection environment that eliminate the temperature change of the image pickup apparatus 87, the manufacturing cost and the like increase.

Therefore, as shown in FIG. 8, the support member 86 is fixed to the mounting member 85 away from the image pickup device 87, and is less susceptible to the heat of the image pickup device 87. In the inspection device 81 of the present embodiment, the device side mark 124 is supported by the support member 86 at a position where the displacement of the position does not occur due to the heat generated by the image pickup device 87, or even if the displacement is small, the device side mark 124 is supported by the support member 86. The jig side mark 107 and the supply position P1 are detected with the side mark 124 as a reference.

FIG. 10 shows the state of the device side mark 124 and the supply position P1 imaged in the image pickup area 109. It should be noted that FIG. 10 shows the results of two imagings in one figure. Further, the reference point P2 is not actually imaged, but is shown in the figure for the sake of clarity. Further, in FIG. 10, in order to make the explanation easy to understand, the size of the member and the like are changed from the actual size. Further, in the following description, the device-side mark 124 and the detected reference point P2 imaged when the jig 82 is mounted will be referred to as the device-side mark 124A and the reference point P2A. Further, the device-side mark 124 and the detected reference point P2 imaged by attaching the tape feeder 33 to be inspected after removing the jig 82 will be referred to as the device-side mark 124B and the reference point P2B. Further, when the device-side marks 124A and 124B are generically referred to, they will be referred to as the device-side marks 124. The same applies to the reference point P2.

The device side mark 124 is supported by the support member 86 so as to be imaged at the end portion in the Y-axis direction, for example. The worker adjusts the position of the image pickup apparatus 87 in the image pickup of the jig 82. In the image pickup of the jig 82, for example, the device side mark 124A is imaged at the end portion in the Y-axis direction. Further, the reference point P2A is detected in the center of the imaging region 109 based on the four jig side marks 107 of the jig 82 (see FIG. 7). As shown in FIG. 10, the control device 91 of the inspection device 81 sets, for example, the XY coordinates along the X and Y axis directions in the image pickup region 109, and stores the XY coordinates of the device side mark 124A and the reference point P2A. .. The coordinates of the device-side mark 124A are (mxA, myA), and the coordinates of the reference point P2A are (jmxA, jmyA).

The control device 91 calculates, for example, the amount of deviation of the reference point P2A with respect to the device-side mark 124A as an offset amount (Δx, Δy). The offset amount (Δx, Δy) is expressed by the following equation.
(Δx, Δy) = (jmxA, jmyA)-(mxA, myA)
The control device 91 stores the calculated offset amount (Δx, Δy).

Next, the worker removes the jig 82, attaches the tape feeder 33, and performs imaging. In the image pickup of the tape feeder 33, the image pickup direction of the image pickup apparatus 87 changes due to the heat generation of the image pickup apparatus 87 described above. The device-side mark 124B is displaced in the imaging region 109 by the amount of change in the imaging direction. The control device 91 deviates from the coordinates (mxB, myB) of the device side mark 124B detected in the imaging of the tape feeder 33 by the offset amount calculated at the time of imaging of the jig 82, and the coordinates (jmxB, jmyB) of the reference point P2B. ). The coordinates of the reference point P2B can be calculated by the following equation.
(JmxB, jmyB) = (mxB, myB) + (Δx, Δy)
As a result, the reference point P2 can be corrected based on the amount of deviation of the device-side mark 124 in the imaging region 109, and the reference point P2B can be set in consideration of the change in the imaging direction.

Then, the control device 91 detects the position of the supply position P1 of the tape feeder 33 to be inspected based on the coordinates (jmxB, jmyB) of the corrected reference point P2B. The supply position P1 is, for example, the central position of the accommodation recess 43 closest to the coordinates (jmxB, jmyB) of the reference point P2B among the plurality of accommodation recesses 43. The control device 91 calculates, for example, an error (Δx2, Δy2) between the coordinates of the reference point P2B (jmxB, jmyB) and the coordinates of the supply position P1 as an error to be corrected. The control device 91 notifies the display screen or the like of the error to be corrected. The worker confirms the display screen and adjusts the supply position P1 of the tape feeder 33 to be inspected.

The control device 91 also detects the position of the device side mark 124B and the reference point P2B for each inspection even after the tape feeder 33 to be inspected is replaced, and detects an error in the supply position P1. As a result, even if the image pickup direction of the image pickup apparatus 87 changes, the change is corrected, and the device side mark 124A and the reference point P2A at the time of mounting the jig 82 are used as absolute references, and a plurality of tape feeders 33 are used. Can be uniformly inspected. As a result, the supply positions P1 of the plurality of tape feeders 33 can be adjusted to the same position, and simultaneous suction by the mounting head 23 can be performed with high accuracy.

The above-mentioned correction method is an example. For example, as shown in FIG. 11, the amount of deviation between the device-side mark 124A and the device-side mark 124B may be detected as an offset amount (Δx, Δy), and the reference points P2A and P2B may be corrected. More specifically, the control device 91 stores the coordinates (mxA, myA) of the device side mark 124A detected at the time of imaging of the jig 82, and the coordinates (mxA, myA) of the device side mark 124A and the tape feeder 33. The offset amount (Δx, Δy) is detected by calculating the difference in the coordinates (mxB, myB) of the device-side mark 124B detected at the time of imaging. The XY coordinates of the device-side mark 124 and the reference point P2 are similarly displaced according to the change in the imaging direction. Therefore, the coordinates of the reference point P2B (jmxB, jmyB) are offset from the coordinates of the reference point P2A (jmxA, jmyA) by an offset amount (Δx, Δy). In this case, the control device 91 can calculate the reference point P2B by the following equation.
(JmxB, jmyB) = (jmxA, jmyA) + (Δx, Δy)
Also in this case, the control device 91 can detect the supply position P1 based on the corrected reference point P2B.

Therefore, the control device 91 of the present embodiment detects the supply position P1 based on the position of the jig side mark 107 imaged in advance by attaching the jig 82. At that time, the control device 91 has a misalignment (offset amount (Δx, Δy) between the device-side mark 124A when the jig 82 is attached and the image is taken and the device-side mark 124B when the tape feeder 33 is attached and the image is taken. )) Make corrections based on.

According to this, it is possible to perform correction based on the device side marks 124A and 124B. Then, the device-side mark 124 is arranged at a position where the image pickup device 87 can take an image via the second prism 125. As a result, the device-side mark 124 can be moved / arranged within a range where the second prism 125 can be reflected and imaged. The degree of freedom in the position where the device-side mark 124 can be arranged is increased. Therefore, even when tape feeders 33 of various sizes are attached, the device-side mark 124 can be imaged to detect the supply position P1.

Further, the support member 86 of this embodiment is fixed to the mounting member 85 to which the tape feeder 33 is slid and mounted. The device-side mark 124 is fixed to the device main body 83 via the support member 86. As a result, the device-side mark 124 can be stably fixed at a position away from the mounting member 85. Further, by attaching the support member 86 to the mounting member 85 and separating it from the image pickup device 87, it is possible to reduce the thermal change of the support member 86 due to the heat generated by the image pickup device 87 and suppress the occurrence of misalignment of the mark 124 on the device side. ..

The mounting position, mounting member, etc. of the support member 86 shown in FIG. 8 are examples. For example, as shown in FIG. 12, the support member 86 may be attached to the base 121 of the image pickup device mounting member 89. As a result, the second prism 125 and the device-side mark 124 can be stably fixed at a position farther from the image pickup device mounting member 89.

Further, in the embodiment shown in FIG. 8, the inspection device 81 includes a set of the second prism 125 and the device side mark 124. On the other hand, as shown in FIG. 12, a plurality of sets (for example, two sets) of the second prism 125 and the device side mark 124 may be provided. The inspection device 81 may image a plurality of device-side marks 124 in one imaging region 109 and perform correction of the reference point P2 based on the plurality of device-side marks 124. For example, as shown by a broken line circle in FIG. 8, the inspection device 81 detects two device-side marks 124C provided at both ends in the Y-axis direction, and is a midpoint of a straight line connecting the two device-side marks 124C. The reference point P2B at the time of imaging of the tape feeder 33 may be detected based on the offset amount from the device-side mark 124D in the device to the reference point P2A. Further, the plurality of device-side marks 124 may be supported by the support member 86 (see FIG. 12) supported by the image pickup device mounting member 89 and the support member 86 (see FIG. 8) supported by the mounting member 85, respectively.

Further, the image pickup apparatus 87 of this embodiment is arranged at a position where the jig side mark 107 is imaged via the first prism 119. According to this, the image pickup apparatus 87 can be arranged at a position where the jig side mark 107 reflected by the first prism 119 can be imaged. The degree of freedom in the position where the image pickup device 87 can be arranged is increased. As a result, it becomes possible to reduce the size of the inspection device 81.

Here, the control device 91 is within the imaging region 109, for example, an error (Δx2, Δy2) between the coordinates (jmxB, jmyB) of the reference point P2B and the coordinates of the supply position P1, an offset amount (Δx, Δy), and the like. The distance between the two points in the above is calculated by multiplying the difference in coordinate positions by the size 131 of one pixel (pixel). In this case, the size 131 is, for example, the length of one pixel along the X-axis direction or the Y-axis direction. On the other hand, as shown in FIG. 9, when the imaging direction of the imaging device 87 changes, the second imaging distance SL2 from the imaging device 87 to the jig 82 (or the tape feeder 33) changes the imaging before the change shown in FIG. It fluctuates as compared with the first imaging distance SL1 from the device 87 to the jig 82. As the imaging distance fluctuates, the object to be imaged is enlarged or reduced, and the size 131 of one pixel with respect to the object to be imaged fluctuates. For example, when the second imaging distance SL2 is shorter than the first imaging distance SL1, the imaging object such as the accommodating recess 43 and the supply position P1 is enlarged, and the size 131 of one pixel becomes the imaging object. On the other hand, it becomes relatively large. Therefore, the size 131 of one pixel is processed as being larger than that at the time of imaging of the jig 82 of FIG. For example, even if Δx is 100 pixels when the jig 82 is imaged, the size 131 becomes relatively large when the tape feeder 33 is imaged, so that Δx is less than 100 pixels. As a result, an error occurs in the calculation of the distance between two points in the imaging region 109.

Therefore, the control device 91 of the present embodiment corrects the size 131 of one pixel, that is, the resolution of the image pickup device 87, based on the difference between the first image pickup distance SL1 and the second image pickup distance SL2. The control device 91 detects, for example, the difference between the first imaging distance SL1 and the second imaging distance SL2 based on the offset amount (Δx, Δy) detected by imaging the tape feeder 33. For example, the inspection device 81 may have data in which the offset amount is associated with the difference between the first imaging distance SL1 and the second imaging distance SL2 in advance, and may be searched from the data. Alternatively, the inspection device 81 may calculate the difference in imaging distance based on the offset amount. The control device 91 corrects the size 131 to be larger (or smaller) based on the detected difference in imaging distance (SL1-SL2). For example, the control device 91 corrects the size 131 to be smaller (decreased according to the enlargement ratio) as the imaging distance becomes shorter. As a result, the difference in resolution due to the imaging distance can be corrected, and the distance between two points can be calculated more accurately. The method of detecting the difference in the imaging distance is not limited to the method using the offset amount described above. For example, the image pickup apparatus 87 may include a distance sensor capable of measuring the imaging distance, and may correct the size 131 based on the result of the distance sensor.

Therefore, the control device 91 of the present embodiment has the first imaging distance SL1 from the imaging device 87 to the jig 82 in the imaging of the jig 82 based on the deviation amount (offset amount) of the positions of the device side marks 124A and 124B. And the difference from the second imaging distance SL2 from the image pickup device 87 to the tape feeder 33 in the image pickup of the tape feeder 33 is detected, and the resolution of the image pickup device 87 in the image pickup of the tape feeder 33 is set based on the detected difference. ..

When the imaging position, angle, etc. of the imaging device 87 change due to heat generation of the imaging device 87, the imaging distance changes. As the imaging distance changes, the resolution at the time of imaging changes, and the ratio of the size 131 of one pixel (pixel) to the imaged object changes. As a result, when the distance between marks and positions is calculated based on the number of pixels, the imaging distance changes, and the calculation accuracy of the distance decreases. Therefore, the difference between the first and second imaging distances SL1 and SL2 is detected based on the deviation (offset amount) of the device-side mark 124A at the time of two imaging, and the resolution (size 131, etc.) is determined based on the difference. Set. As a result, the ratio of the pixel size 131 to the image pickup object can be adjusted according to the change in the image pickup distance, and the calculation accuracy of the distance between marks and the like can be improved.

The control device 91 does not have to adjust the size 131 for each pixel. For example, the control device 91 may increase or decrease the correction amount according to the number of pixels between the two points to correct the calculated distance. For example, even if the correction amount per pixel is determined based on the first and second imaging distances SL1 and SL2, the number of pixels between the two points is multiplied by the correction amount per pixel, and the distance correction is executed. good.

Incidentally, in the above embodiment, the electronic component 39 is an example of a component. The first prism 119 is an example of a reflection member for imaging. The second prism 125 is an example of a mark reflecting member.

As described above, according to the above-mentioned embodiment, the following effects are obtained.
In one embodiment of the present embodiment, the inspection device 81 images the device-side mark 124 supported by the support member 86 and the jig-side mark 107 of the jig 82 attached to the support member 86 by the image pickup device 87. .. As a result, the device-side mark 124 is fixed to the device main body 83 and is arranged above the tape feeder 33, for example. By setting the position of the device-side mark 124 to a position away from the tape feeder 33 by the support member 86, even when tape feeders 33 of various sizes are mounted, the device-side mark 124 is imaged and the supply position P1. Can be detected.

It should be noted that the present disclosure is not limited to the above embodiment, and can be carried out in various embodiments with various changes and improvements based on the knowledge of those skilled in the art.
For example, in the above embodiment, the image pickup apparatus 87 has taken an image of the jig side mark 107 or the like reflected by the first prism 119, but the present invention is not limited to this. For example, the image pickup apparatus 87 may take an image of the jig 82 or the tape feeder 33 without going through the first prism 119 or the like. For example, the image pickup device 87 may be installed so that the orthogonal direction of the upper surface 82A is the image pickup direction.
Further, in the above embodiment, the first distance L1 and the second distance L2 are matched, but the first distance L1 and the second distance L2 do not have to be the same distance. For example, the first distance L1 and the second distance L2 may be changed within the depth of field (range of focus) of the image pickup apparatus 87.
Further, the component of the present disclosure is not limited to the electronic component 39, and may be another component.
The jig side mark 107 is not limited to four, and may be one or a plurality of other marks.

Further, in the above embodiment, the image pickup apparatus 87 images the apparatus side mark 124 reflected by the first prism 119 and the second prism 125, but the present invention is not limited to this. For example, the device-side mark 124 may be provided at the position of the second prism 125 in FIG. Then, the image pickup apparatus 87 may reflect the apparatus side mark 124 only by the first prism 119 to take an image. In this case, the inspection device 81 does not have to include the second prism 125.
The control device 91 has executed the correction of the reference point P2 based on the offset amount (Δx, Δy), but it is not necessary to execute the correction. For example, the worker may manually calculate the offset amount of the device side marks 124A and 124B and set the reference point P2B.

33 Tape feeder, 39 Electronic parts (parts), 81 Inspection device (tape feeder inspection device), 83 Device body, 85 Feeder mounting member, 86 Support member, 89 Imaging device mounting member, 91 Control device, 107 Jig side mark , 119 1st prism (reflection member for imaging), 124, 124A, 124B device side mark, 125 2nd prism (reflection member for marking), P1 supply position, SL1 first imaging distance, SL2 second imaging distance.

Claims

A jig with a jig side mark at a position corresponding to the supply position where parts are supplied from the tape feeder can be attached to the main body of the device.
A support member fixed to the main body of the device and
The device side mark supported by the support member and
An image pickup device that captures the jig side mark and the device side mark, and
A tape feeder inspection device equipped with.
A mark reflecting member that reflects the device-side mark and causes the image pickup device to take an image.
When the supply position of the tape feeder attached to the main body of the device is detected based on the position of the mark on the jig side previously imaged by the image pickup device by attaching the jig to the main body of the device, the above-mentioned cure is performed. Positions of the device side mark when the tool is attached to the device main body and imaged by the image pickup device and the device side mark when the tape feeder is attached to the device body and imaged by the image pickup device. A control device that corrects based on the deviation, and
The tape feeder inspection apparatus according to claim 1.
The first distance between the device-side mark and the mark reflective member is
The tape feeder inspection device according to claim 2, which is equal to the second distance between the mark reflecting member and the jig.
The control device is
The device side mark when the jig is attached to the device main body and imaged by the image pickup device, and the device side mark when the tape feeder is attached to the device body and imaged by the image pickup device. Difference between the first imaging distance from the imaging device to the jig in the imaging of the jig and the second imaging distance from the imaging device to the tape feeder in the imaging of the tape feeder based on the positional deviation. The tape feeder inspection device according to claim 2 or 3, wherein the resolution of the image pickup device in the imaging of the tape feeder is set based on the detected difference.
The main body of the device is
A feeder mounting member for sliding and mounting the tape feeder is provided.
The support member is
The tape feeder inspection device according to any one of claims 1 to 4, which is fixed to the feeder mounting member.
The main body of the device is
An image pickup device mounting member for mounting the image pickup device is provided.
The support member is
The tape feeder inspection device according to any one of claims 1 to 4, which is fixed to the image pickup device mounting member.
Equipped with a reflective member for imaging
The image pickup device
The tape feeder inspection device according to any one of claims 1 to 6, which is arranged at a position where the jig side mark is imaged via the image pickup reflective member.
The image pickup device, the mark reflection member, the device side mark imaged by the image pickup device via the mark reflection member, and the jig side mark are provided at positions corresponding to the supply positions where parts are supplied from the tape feeder. It is a correction method in a tape feeder inspection device including a device main body to which the jig can be attached.
When the supply position of the tape feeder attached to the device main body is detected based on the position of the jig side mark previously imaged by the image pickup device by attaching the jig to the device main body, the cure is performed. Positions of the device side mark when the tool is attached to the device main body and imaged by the image pickup device and the device side mark when the tape feeder is attached to the device body and imaged by the image pickup device. A correction method in a tape feeder inspection device that corrects based on deviation.