WO2020021657A1

WO2020021657A1 - Surface mounting machine

Info

Publication number: WO2020021657A1
Application number: PCT/JP2018/027903
Authority: WO
Inventors: 洋平岸本
Original assignee: ヤマハ発動機株式会社
Priority date: 2018-07-25
Filing date: 2018-07-25
Publication date: 2020-01-30
Also published as: KR20210003241A; KR102432607B1; CN112514553A; JPWO2020021657A1; JP6990309B2; CN112514553B

Abstract

A surface mounting machine 1 for mounting a component E on a substrate P, is provided with: a correction unit 20 including a mounting head 25 that suctions the component E and mounts the component E on the substrate P, a substrate imaging camera 19 that images the substrate P, a correction mark 35 that is given on a base 34, a glass jig 36 through which light from the substrate imaging camera 19 is transmitted, and a moving unit 37 that moves the glass jig 36 between a position overlapping the correction mark 35 and a position not overlapping the correction mark 35; a position detection unit (computation processing unit 40) that detects a first position M1 of the correction mark 35 by imaging the correction mark 35 which is in a state of not overlapping the glass jig 36 by means of the substrate imaging camera 19, and detects a second position M2 of the correction mark 35 by imaging the correction mark 35 which is in a state of overlapping the glass jig 36 by means of the substrate imaging camera 19; and a correcting unit (computation processing unit 40) that corrects positional deviation of the component E on the basis of the difference between the first position M1 and the second position M2.

Description

Surface mounting machine

技術 The technology disclosed in this specification relates to a surface mounter.

2. Description of the Related Art Conventionally, there has been known a surface mounter that corrects a positional shift of a component using a board imaging camera that captures an image of a board (for example, see Patent Document 1).
Specifically, a component mounting apparatus (corresponding to a surface mounting machine) described in Patent Document 1 carries a jig substrate made of a member such as glass into a main body device, positions the jig substrate, and recognizes a board of a work head. First, two jig board marks are measured by a camera for camera (corresponding to a board imaging camera) to confirm the position of the jig board, and then the jig board is moved to a known reference mark position A of the jig board. .

If there is no movement error in the axis of the work head if it can go directly to the position A of the reference mark, the component mounting apparatus does not correct the movement coordinates of its own axis. On the other hand, when the moving position is the position A ′ without the reference mark, the component mounting apparatus stores the X coordinate value and the Y coordinate value of the positional deviation amount between the positions AA ′ and stores the X and Y coordinate values. The component mounting position is corrected based on the X coordinate value and the Y coordinate value of the displacement amount.

JP 2006-59954 A

The component mounting apparatus described in Patent Document 1 described above corrects a component displacement caused by a movement error of the work head, and does not consider a component displacement caused by other than the work head movement error. Was.

This specification discloses a technique for correcting a component displacement caused by a tilt of an optical axis of a board imaging camera.

A surface mounter disclosed in the present specification is a surface mounter that mounts components on a substrate, the mounting head holding the components and mounting the components on the substrate, a substrate imaging camera that images the substrate, and a base mounting camera. A correction mark attached to a base, a light transmitting member that transmits light from the substrate imaging camera, and a moving unit that moves the light transmitting member between a position overlapping the correction mark and a position not overlapping the correction mark. A correction unit having the following: and the correction mark, which is not overlapped with the light transmitting member, is captured by the substrate imaging camera, and the position of the correction mark is detected as a first position, and the light transmitting member is A position detection unit that captures the correction mark in a state in which the correction mark overlaps with the substrate imaging camera and detects the position of the correction mark as a second position; And a correcting unit for correcting the positional deviation of the component based on.

When the surface mounter operates, the optical axis of the board imaging camera may be tilted due to distortion due to heat generation. When the optical axis of the board imaging camera is tilted, when the surface mounter images the board with the board imaging camera and recognizes the position of the board, there is a deviation between the board position recognized by the surface mounter and the actual board position. This causes a component displacement due to the inclination of the optical axis.
When the optical axis of the board imaging camera is inclined, the correction mark in a state where the light transmitting members are not overlapped is imaged by the board imaging camera, the position of the correction mark is detected as the first position, and the light transmitting member is When the overlapping correction mark is imaged by the substrate imaging camera and the position of the correction mark is detected as the second position, a difference occurs between the first position and the second position according to the inclination of the optical axis. Since the displacement of the component is proportional to the inclination of the optical axis of the board imaging camera, the displacement of the component is corrected based on the difference between the first position and the second position, whereby the inclination of the optical axis of the board imaging camera is corrected. Can be corrected.

(4) A recognition unit may be provided for recognizing a position of the substrate by capturing an image of the recognition mark attached to the substrate with the substrate imaging camera.

When recognizing the position of a board by imaging the recognition mark with the board imaging camera, if the optical axis of the board imaging camera is inclined, a deviation occurs between the board position recognized by the recognition unit and the actual board position, The parts are displaced. According to the surface mounter described above, when the position of the substrate is recognized by capturing the recognition mark with the substrate imaging camera, the component displacement is corrected based on the difference between the first position and the second position. Can be corrected.

The correction unit may be attached to the surface mounter.

For example, it is conceivable that the correction unit is loaded into the surface mounter by the substrate transfer device that transfers the substrate, and the first position and the second position are detected using the loaded correction unit. However, in that case, the production of the substrate must be stopped, and the productivity is reduced.
According to the above surface mounter, since the correction unit is attached to the surface mounter, the first position and the second position can be detected without stopping the production of the substrate during the production of the substrate by the surface mounter. it can. As a result, it is possible to correct the positional deviation of the parts while suppressing a decrease in productivity.

The correction unit may correct a position shift of the component by correcting a mounting coordinate of the component based on a difference between the first position and the second position.

According to the above surface mounter, the component displacement can be corrected by correcting the component mounting coordinates based on the difference between the first position and the second position.

A storage unit that stores conversion data for converting a difference between the first position and the second position into a positional deviation amount, wherein the correction unit uses the conversion data to store the first position and the The difference from the second position may be converted into the displacement amount, and the displacement of the component may be corrected based on the converted displacement amount.

According to the surface mounter described above, the difference between the two positions can be converted into a positional deviation amount by using the conversion data.

The position detection unit may repeatedly detect the first position and the second position at a predetermined timing during the production of the substrate by the surface mounter.

Since the temperature of the surface mounter when the surface mounter is producing a substrate is not always constant, the inclination of the optical axis of the substrate imaging camera also changes according to the change in the temperature of the surface mounter. For this reason, even if the first position and the second position are detected, the difference between the two positions fluctuates as time elapses, and there is a possibility that the positional deviation of the components increases.
According to the surface mounter described above, the detection of the first position and the second position is repeatedly performed at a predetermined timing during the production of the board, so that the inclination of the optical axis of the board imaging camera fluctuates during the production of the board. Can also correct the misalignment of the parts.

The invention disclosed in this specification can be realized in various forms such as an apparatus, a method, a computer program for realizing the functions of the apparatus or the method, and a recording medium on which the computer program is recorded.

FIG. 2 is a schematic view of the surface mounter according to the first embodiment as viewed from above. Front view of the head unit viewed from the front Side view of the head unit viewed from the right Schematic view of the mounting head, substrate imaging camera, and correction unit viewed from the right Block diagram showing the electrical configuration of the surface mounter Schematic diagram of substrate Schematic diagram for explaining correction of component mounting coordinates and component angles using recognition marks Schematic diagram showing the position of the mounting head with respect to the substrate imaging camera Schematic diagram showing the operation of the surface mounter (operation 1 and operation 2) Schematic diagram showing the operation of the surface mounter (operation 3 and operation 4) Schematic diagram showing the operation of the surface mounter (operation 5) Schematic diagram showing the inclination of the optical axis of the substrate imaging camera Schematic diagram showing mounting positions of components when the optical axis of the board imaging camera is not tilted Schematic diagram showing the mounting position of components when the optical axis of the board imaging camera is inclined Table showing mounting coordinates before correction and mounting coordinates after correction Schematic diagram for explaining the amount of displacement using the correction unit Schematic diagram showing first and second positions of a correction mark. Graph showing the correspondence between the difference between two positions and the amount of displacement Flow chart of position shift amount detection processing

<First embodiment>
Embodiment 1 will be described with reference to FIGS. In the following description, the left-right direction shown in FIG. 1 is referred to as an X direction, the front-rear direction is referred to as a Y direction, and the up-down direction shown in FIG. In the following description, the right side shown in FIG. 1 is referred to as an upstream side, and the left side is referred to as a downstream side. In the following description, the same constituent members may be omitted from the drawings except for some parts.

(1) Overall Configuration of Surface Mounter The overall configuration of the surface mounter 1 will be described with reference to FIG. The surface mounter 1 mounts a component E such as an electronic component on a printed board P (hereinafter simply referred to as a board P). As shown in FIG. 1, a recognition mark F (reference marks Fa1 and Fa2 and component positioning marks Fb1 and Fb2) is provided on the board P. The description of the recognition mark F will be described later.

The surface mounter 1 includes a base 14, a substrate transport device 15 for transporting the substrate P, four tape component supply devices 11 for supplying components E mounted on the substrate P, and components E supplied by the tape component supply device 11. Is mounted on the board P.
The base 14 has a rectangular shape in plan view and has a flat upper surface. In FIG. 1, a rectangular frame A indicated by a two-dot chain line indicates a work position (hereinafter, referred to as a work position A) when the component E is mounted on the board P.

(1-1) Board Transfer Apparatus The board transfer apparatus 15 carries the board P from the upstream side in the X direction to the work position A, and unloads the board P on which the component E is mounted at the work position A to the downstream side. . The substrate transfer device 15 includes a pair of

conveyor belts

15A and 15B that are driven to circulate in the X direction, and a conveyor drive motor 46 (see FIG. 5) that drives the

conveyor belts

15A and 15B. The rear conveyor belt 15A is movable in the front-rear direction, and the distance between the two

conveyor belts

15A and 15B can be adjusted according to the width of the substrate P.

(1-2) Tape Component Supply Devices The tape component supply devices 11 are arranged at two locations in the X direction on both sides of the component mounting device 12 in the X direction, for a total of four locations. A plurality of feeders 13 are attached to these tape component supply devices 11 so as to be arranged side by side in the X direction. Each of the feeders 13 is a so-called tape feeder, and includes a reel (not shown) around which a component tape containing a plurality of components E is wound, an electric tape feeding device that pulls out the component tape from the reel, and the like. The components E are supplied one by one from a component supply position provided at the end of the component mounting apparatus 12.

Here, the tape component supply device 11 will be described as an example of the component supply device, but the component supply device may be a so-called tray feeder that supplies a tray on which the component E is placed, or may supply a semiconductor wafer. May be used.

(1-3) Component Mounting Device The component mounting device 12 is shown in FIG. 5 with a backup mechanism, a head unit 16, a head transport unit 17, two component imaging cameras 18, two board imaging cameras 19, a correction unit 20, not shown. A control unit 38, an operation unit 39, and the like are provided.

A backup mechanism (not shown) is arranged below the work position A. The backup mechanism fixes the substrate P carried into the work position A by the substrate transfer device 15 at the work position A and supports the substrate P from below.
The head unit 16 is configured to adsorb the component E supplied by the tape component supply device 11 (an example of holding) and mount the component E on the substrate P. The configuration of the head unit 16 will be described later.

(4) The head transport unit 17 transports the head unit 16 in the X direction and the Y direction within a predetermined movable range. The head transport section 17 includes a beam 21 that supports the head unit 16 so as to be able to reciprocate in the X direction, a pair of Y-axis guide rails 22 that support the beam 21 so that the beam 21 can be reciprocated in the Y direction, and An X-axis servo motor 23 for reciprocating in the direction, a Y-axis servo motor 24 for reciprocating the beam 21 in the Y direction, and the like are provided.

The two component imaging cameras 18 are provided between the two tape component supply devices 11 arranged in the X direction. The component imaging camera 18 is for capturing an image of the component E adsorbed to the mounting head 25 provided in the head unit 16 from below, and recognizing the relative position and orientation of the component E with respect to the mounting head 25.

Two board imaging cameras 19 are provided in the head unit 16. The board imaging camera 19 is for recognizing the position and inclination of the board P by taking an image of the recognition mark F attached to the board P carried into the working position A. The configuration of the board imaging camera 19 will be described later.
Here, the surface mounter 1 includes two board imaging cameras 19, but for the sake of easy understanding, the following description will be made assuming that there is only one board imaging camera 19 on the left side.

The correction unit 20 is mounted on the rear side of the substrate transfer device 15. The correction unit 20 is for correcting a displacement of the component E due to the inclination of the optical axis 19A (see FIG. 12) of the board imaging camera 19. The configuration of the correction unit 20 will be described later.

(1-3-1) Head Unit The head unit 16 will be described with reference to FIG. The head unit 16 according to the first embodiment is a so-called in-line type, and a plurality of mounting heads 25 are provided side by side in the X direction. Further, the head unit 16 is provided with a Z-axis servomotor 26 for individually moving the mounting heads 25 up and down, an R-axis servomotor 27 for rotating the mounting heads 25 around their axes, and the like.

Each mounting head 25 sucks and releases the component E, and has a nozzle shaft 28 and a suction nozzle 29 which is detachably attached to a lower end of the nozzle shaft 28. Negative pressure and positive pressure are supplied to the suction nozzle 29 from a not-shown air supply device via a nozzle shaft 28. The suction nozzle 29 sucks the component E when the negative pressure is supplied, and releases the component E when the positive pressure is supplied.

Here, the in-line type head unit 16 will be described as an example, but the head unit 16 may be, for example, a so-called rotary head in which a plurality of mounting heads 25 are arranged on a circumference.

(1-3-2) Substrate Imaging Camera The substrate imaging camera 19 will be described with reference to FIGS. As shown in FIG. 3, a flat pedestal 30 is fixed to the lower surface of the head unit 16, and the board imaging camera 19 is fixed to the upper surface of the pedestal 30.

(4) As schematically shown in FIG. 4, the board imaging camera 19 includes an area sensor 31 and an optical system 32. The area sensor 31 includes image sensors arranged in rows and columns, and the image sensor is disposed so that the image pickup surface faces forward. The optical system 32 includes a mirror 33, a light source (not shown) for irradiating a subject, a lens (not shown), and the like. The mirror 33 is arranged at a position inclined upward by 45 degrees from the front side to the rear side on the front side of the area sensor 31, and reflects a subject (the correction unit 20 in FIG. 4) located below the board imaging camera 19. The light image is made incident on the area sensor 31. The portion of the optical axis 19A of the board imaging camera 19 from the mirror 33 to the correction unit 20 is designed to be perpendicular to the base 34 of the correction unit 20.

(1-3-3) Correction Unit The correction unit 20 will be described with reference to FIGS. As shown in FIG. 1, the correction unit 20 includes a base 34, a correction mark 35 provided on the upper surface of the base 34, and a glass jig 36 (a light transmitting member) provided on the upper surface of the base 34. An example) and a moving unit 37 (see FIG. 4) for reciprocating the glass jig 36 in the X direction.

The correction mark 35 is, for example, a circular mark.
The glass jig 36 is a transparent cubic glass. The thickness of the glass jig 36 according to the present embodiment is 10 mm, and the refractive index is 1.52.
The moving section 37 is fixed to the base 34. The moving unit 37 is, for example, an air cylinder, and moves the glass jig 36 between a position overlapping the correction mark 35 and a position not overlapping when viewed from above.

The shape of the correction mark 35, the shape, thickness, refractive index, and the like of the glass jig 36 are not limited to the examples described above, and can be determined as appropriate. Further, the moving unit 37 is not limited to an air cylinder, and may be, for example, an electric motor. Further, the position where the moving section 37 is fixed is not limited to the base 34. For example, the moving unit 37 may be fixed to a frame (not shown) of the surface mounter 1.

(2) Electrical Configuration of Component Mounting Apparatus As shown in FIG. 5, the component mounting apparatus 12 includes a control unit 38 and an operation unit 39. The control unit 38 includes an arithmetic processing unit 40 (an example of a position detection unit, a correction unit, and a recognition unit), a motor control unit 41, a storage unit 42, an image processing unit 43, an external input / output unit 44, a feeder communication unit 45, and the like. I have.

The arithmetic processing unit 40 includes a CPU, a ROM, a RAM, and the like, and controls each unit of the surface mounter 1 by executing a control program stored in the ROM. The arithmetic processing unit 40 may include an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array) in place of or in addition to the CPU.

The motor control unit 41 rotates each motor such as the X-axis servomotor 23, the Y-axis servomotor 24, the Z-axis servomotor 26, the R-axis servomotor 27, and the conveyor drive motor 46 under the control of the arithmetic processing unit 40.
The storage unit 42 stores various data. Various types of data include information on the type and the number of boards P to be produced, information on the mounting coordinates 63 of the component E (see FIG. 14), information on the mounting angle of the component E, information on the mounting order of the component E, The XY coordinates of the recognition mark F attached to P, relative position information of the mounting head 25 with respect to the board imaging camera 19, and the like are included. The XY coordinates of the recognition mark F and the relative position information of the mounting head 25 with respect to the board imaging camera 19 will be described later.

The image processing unit 43 is configured to capture an image signal output from the component imaging camera 18 or the board imaging camera 19, and generates a digital image based on the output image signal.
The external input / output unit 44 is a so-called interface, and is configured to receive detection signals output from various sensors 47 provided on the main body of the component mounting apparatus 12. The external input / output unit 44 is configured to perform operation control on various actuators 48 (including the moving unit 37 of the correction unit 20) based on a control signal output from the arithmetic processing unit 40.

The feeder communication unit 45 is connected to the feeder 13 and controls the feeder 13 in an integrated manner.
The operation unit 39 includes a display device such as a liquid crystal display, and an input device such as a touch panel, a keyboard, and a mouse. The operator can operate the operation unit 39 to perform various settings and the like.

(3) Recognition Mark The recognition mark F (so-called fiducial mark) attached to the substrate P will be described with reference to FIG. A reference mark Fa (Fa1 and Fa2) and a component positioning mark Fb (Fb1 and Fb2) are provided as recognition marks F on the substrate P. The reference mark Fa is a circular mark, and is attached to the upper right and lower left of the substrate P in this embodiment. The component positioning mark Fb is also a circular mark, and is attached near the mounting position 50 of the component E requiring high mounting accuracy (upper right and lower left in the present embodiment).

Ｘ An XY coordinate system (hereinafter, referred to as “XY coordinate system of substrate P”) having the origin at one of the four corners (upper right corner S1 in the present embodiment) is set on substrate P. The storage section 42 stores the XY coordinates of the recognition mark F and the mounting coordinates of the component E in the XY coordinate system of the board P.

作業 As shown in FIG. 7, the work position A described above is set in the transfer path G of the substrate P. An XY coordinate system (hereinafter, referred to as an “XY coordinate system of the head unit 16”) that defines the position of the head unit 16 is set in the surface mounter 1, and the four corners of the working position A are stored in the storage unit 42. One of the corners (upper right corner in the present embodiment) is stored in the XY coordinate system of the head unit 16 as the substrate origin S2.

(4) If there is a position error or an angle error in the substrate P fixed at the work position A, the position of the upper right corner S1 of the substrate P does not match the substrate origin S2. For this reason, when the component E is mounted with the substrate origin S2 of the work position A regarded as the origin S1 of the XY coordinate system of the substrate P, a positional deviation or an angular deviation of the component E occurs. For this reason, the control unit 38 detects a position error and an angle error of the substrate P based on the recognition mark F, and corrects the mounting coordinates and the mounting angle of the component E based on the detected position error and angle error. Since the correction procedure is substantially the same for the reference mark Fa and the component positioning mark Fb, the description will be made using the reference mark Fa as an example.

First, the control unit 38 captures an image of each reference mark Fa by the board imaging camera 19, and the XY coordinates (Xf1 ′, Yf1 ′) and (Xf2) of the center point of each reference mark Fa in the XY coordinate system whose origin is the board origin S2. ', Yf2').
When the upper right reference mark Fa1 is used as a reference, for example, the control unit 38 determines the XY coordinates (Xf1, Yf1) of the reference mark Fa1 stored in the storage unit 42 and the reference mark recognized by the board imaging camera 19. The difference (ΔX, ΔY) between the XY coordinates (Xf1 ′, Xy1 ′) of Fa1 is defined as the position error of the substrate P. Then, the control unit 38 temporarily corrects the mounting coordinates of each component according to the position error (ΔX, ΔY).

Then, the control unit 38 sets a straight line passing through the XY coordinates (Xf1, Yf1) of the reference mark Fa1 stored in the storage unit 42 and the XY coordinates (Xf2, Yf2) of the reference mark Fa2 stored in the storage unit 42. And a straight line passing through the XY coordinates (Xf1 ′, Yf1 ′) of the reference mark Fa1 recognized by the board imaging camera 19 and the XY coordinates (Xf2 ′, Yf2 ′) of the reference mark Fa2 recognized by the board imaging camera 19. The angle error Δθ of the substrate P is obtained from the difference from the inclination.
The control unit 38 corrects the provisionally corrected mounting coordinates of each component E by rotating the mounting coordinates of each component E around the reference mark Fa1 by the angle error Δθ, and also changes the mounting angle of each component E to the angle error Δθ. Correct by the minute.

Here, the case where the reference mark Fa is attached only to the upper right and the lower left of the substrate P has been described as an example, but this is an example. The reference marks Fa may be provided at four corners of the substrate P, for example. The same applies to the component positioning mark Fb. The correction of the mounting coordinates and the mounting angle of the component E using the recognition mark F described above is an example. The correction of the mounting coordinates and the mounting angle of the component E using the recognition mark F is not limited to the example described above.

(4) Relative Position Information of the Mounting Head with respect to the Board Imaging Camera With reference to FIG. The relative position information is the XY coordinates of each mounting head 25 with the origin of the board imaging camera 19. The control unit 38 images the recognition mark F with the board imaging camera 19 to recognize the position of the board imaging camera 19 with respect to the board P, and determines the position of each mounting head 25 with respect to the board P from the relative position of each mounting head 25 with respect to the board P camera. Judge the position.

As described above, the surface mounter 1 actually includes two board imaging cameras 19 as described above. Therefore, the four mounting heads 25 on the left side may store the relative positions with respect to the substrate imaging camera 19 on the left side, and the four mounting heads 25 on the right side may store the relative positions with respect to the substrate imaging camera 19 on the right side.

(5) Operation of Surface Mounter The operation of the surface mounter 1 will be described with reference to FIGS. The + symbol 50 attached to the upper surface of the substrate P shown in FIGS. 9 to 11 indicates the mounting position of the component E.
The surface mounter 1 mounts the component E on the substrate P by repeating operation 1 to operation 5 described below as one sequence and repeating this sequence. As described above, the board P may be provided with the component positioning mark Fb, but the reference mark Fa will be described as an example here.

(Operation 1) Component Suction As shown in FIG. 9, the control unit 38 moves the head unit 16 above the tape component supply device 11 and lowers each mounting head 25 to suck the component E.

(Operation 2) Component Recognition As shown in FIG. 9, the control unit 38 conveys the head unit 16 in the X direction and passes the head unit 16 above the component imaging camera 18. The component imaging camera 18 includes a line sensor extending in the Y direction, and images the component E adsorbed by the mounting head 25 passing above in time series to generate image data of the component E. The control unit 38 analyzes the generated image data and recognizes the relative position of the component E with respect to the mounting head 25, the rotation angle of the component E around the axis of the mounting head 25, and the like.

(Operation 3) Imaging of Reference Mark at Lower Left As shown in FIG. 10, the control unit 38 moves the board imaging camera 19 above the reference mark Fa2 at the lower left to capture an image of the reference mark Fa2.

(Operation 4) Imaging of Reference Mark at Lower Right As shown in FIG. 10, the controller 38 moves the board imaging camera 19 above the reference mark Fa1 at the upper right to capture an image of the reference mark Fa1. Then, the control unit 38 detects a position error and an angle error of the board P based on the positions of the captured reference marks Fa1 and Fa2, and corrects the mounting coordinates and the mounting angle of each component E.

(Operation 5) Mounting of Component As shown in FIG. 11, the control unit 38 moves the mounting head 25 to a position indicated by the mounting coordinates of the component E, lowers the mounting head 25, and mounts the component E.

(6) Correction of component displacement caused by inclination of optical axis of substrate imaging camera Referring to FIGS. 12 to 18, correction of component displacement of component E caused by inclination of optical axis 19A of substrate imaging camera 19. Will be described. Although the optical axis 19A of the board imaging camera 19 is refracted by being reflected by the mirror 33 (see FIG. 4), the optical axis 19A of the board imaging camera 19 is shown by a straight line in FIGS. 12 and 15 for convenience. ing. The correction of the displacement of the component E is performed in both the X direction and the Y direction. However, since the correction method is substantially the same, the X direction will be described here as an example.

FIG. 12 shows a case where the optical axis 19A of the board imaging camera 19 is inclined. The position of the substrate imaging camera 19 shown in FIG. 12 is such that when the substrate imaging camera 19 images the reference mark Fa1 and generates image data, the center point of the reference mark Fa1 on the image represented by the image data is This is a position adjusted to match the center point.

As described above, the optical axis 19A of the board imaging camera 19 is designed to be perpendicular to the board P. However, when the surface mounter 1 operates, the heat generated by the Z-axis servo motor 26, the R-axis servo motor 27, etc. As a result, the head unit 16 may be distorted, and the optical axis 19A may be inclined as shown in FIG. If the optical axis 19A of the board imaging camera 19 is tilted, a deviation occurs between the position of the reference mark Fa1 recognized by the control unit 38 and the actual position of the reference mark Fa1.

Specifically, when the board imaging camera 19 is at the position P2, the control unit 38 recognizes that the position of the reference mark Fa1 is the position P2 because the center point of the reference mark Fa1 matches the center point of the image. I do. However, since the actual position of the reference mark Fa1 is the position P1, a deviation occurs between the position of the reference mark Fa1 recognized by the control unit 38 and the actual position of the reference mark Fa1.

ＤdX_c shown in FIG. 12 indicates the amount of the positional deviation. Although described in detail later, when the position P2 of the reference mark Fa1 recognized by the control unit 38 is shifted to the right from the position P1 of the actual reference mark Fa1, dX_c is a negative value.

When the above-described position shift (position shift amount dX_c) occurs, the position of the board P recognized by the control unit 38 is shifted from the actual position of the board P, so that the position where the component E is actually mounted is changed. E is shifted to the right from the position where E is to be mounted by | dX_c |. Hereinafter, description will be made with reference to FIGS. 13A and 13B.

FIG. 13A shows a case where the optical axis 19A of the board imaging camera 19 is not tilted (that is, a case where the above-described displacement has not occurred). In FIG. 13A, a position P3 is a position where the component E is to be mounted on the board P. Here, it is assumed that the mounting coordinates of the component E have been corrected to X1 by the correction using the recognition mark F described above. If the above-described positional deviation does not occur, when the control unit 38 moves the mounting head 25 to X1, the mounting head 25 is located above the position P3, and thus the component E can be mounted at the position P3.

FIG. 13B shows a case where the optical axis of the board imaging camera is inclined (that is, a case where the above-described positional shift occurs). If the above-described positional shift occurs, the position P3 is shifted to the left from X1 by | dX_c |. For this reason, when the control unit 38 moves the mounting head 25 to X1, the mounting head 25 itself descends almost downward without inclination, so that the component E is located at the position P4 shifted rightward from the position P3 by | dX_c |. Will be implemented.

(4) In the case where the above-described positional deviation has occurred, when the positional deviation amount dX_c, which is a negative value, is subtracted from the mounting coordinate X1 of the component E, the mounting coordinate of the component E becomes X2 (= X1 + | dX_c |). For this reason, the control unit 38 moves the mounting head 25 to the position shifted to the left by | dX_c | from X1, and can mount the component E at the position P3.

Therefore, as will be described in detail later, the control unit 38 detects the amount of displacement (dX_c, dY_c) using the correction unit 20 in order to correct the displacement of the component E. dY_c is a displacement amount in the Y direction. Then, as shown in FIG. 14, the control unit 38 corrects the mounting coordinates of each component E by subtracting the positional deviation amounts (dX_c, dY_c) from the mounting coordinates of each component E.

Here, the mounting coordinates are corrected by subtracting the positional deviation amount dX_c from the mounting coordinates before correction. However, if the positive and negative definitions of the positional deviation amount dX_c are reversed, the positional deviation amount dX_c is added to the mounting coordinate of the component E. May be added to correct the mounting coordinates. The positive / negative definition of the displacement amount dX_c will be described later. The same applies to the displacement amount dY_c.

(6-1) Detection of Position Displacement Using Correction Unit The detection of the position displacement (dX_c, dY_c) using the correction unit 20 will be described with reference to FIGS. Here, the displacement amount dX_c will be described as an example.

The position of the board imaging camera 19 shown in FIG. 15 is set when the correction mark 35 is imaged by the board imaging camera 19 to generate image data in a state where the glass jig 36 does not overlap the correction mark 35. Is a position adjusted so that the center point of the correction mark 35 on the image represented by the symbol coincides with the center point of the image. This adjustment is performed by the processing of S101 to S105 described later. The dotted line 19A_1 indicates the optical axis 19A of the board imaging camera 19 at that time.

In FIG. 15, a dotted line 19A_2 indicates the optical axis 19A when the glass jig 36 is moved to a position overlapping the correction mark 35 without changing the position of the substrate imaging camera 19. When the glass jig 36 is overlaid on the correction mark 35, the optical axis 19A is refracted according to the refractive index (here, 1.52) of the glass jig 36.
For this reason, as shown in FIG. 16, when the correction mark 35 is imaged in this state, the correction mark 35 is imaged at a position shifted from the center of the image 55. Here, the position M1 in FIG. 16 is the center point of the image 55. The position M1 is an example of a first position of the correction mark 35. The position M2 is the center point of the correction mark 35 on the image 55. The position M2 is an example of a second position of the correction mark 35.

The control unit 38 detects the center point of the correction mark 35 (that is, the second position M2) from the image 55, and detects the distance dX_g from the detected position to the center point of the image 55 (that is, the first position M1). That is, the control unit 38 determines the position of the correction mark 35 detected when the glass jig 36 does not overlap with the first position M1 and the correction mark 35 detected when the glass jig 36 does not overlap. The difference dX_g from the second position M2, which is the position, is detected.

Here, in the present embodiment, when the center point of the correction mark 35 detected in a state where the glass jig 36 is overlapped is located on the right side of the center point of the image, the difference dX_g becomes a negative value, When it is located on the left side, dX_g has a positive value. When the optical axis 19A of the board imaging camera 19 is inclined leftward downward as shown in FIG. 12 described above, the center point of the correction mark 35 detected when the glass jig 36 is overlapped is the image point. , The difference dX_g becomes a negative value.

FIG. 17 shows the correspondence between the difference dX_g and the absolute value of the displacement amount dX_c (hereinafter, referred to as the displacement amount | dX_c |) when the thickness of the glass is 10 mm and the refractive index is 1.52. It is a graph. Here, the correspondence between the difference dX_g and the absolute value of the displacement amount dX_c differs depending on the thickness and the refractive index of the glass. Therefore, if the thickness or refractive index of the glass is different from the above-described example (thickness is 10 mm and refractive index is 1.52), a graph corresponding to the difference is used.

差 As shown in FIG. 17, the difference dX_g is directly proportional to the displacement | dX_c |. The storage unit 42 stores data representing the graph shown in FIG. 17 (for example, a linear function for obtaining the positional deviation amount | dX_c | from the difference dX_g). The data is an example of conversion data. The control unit 38 detects the displacement | dX_c | by specifying the displacement | dX_c | corresponding to the difference dX_g from the data. For example, if the difference dX_g is 1.0 μm, the detected positional deviation amount | dX_c | is approximately 28 μm.

(6-2) Position Shift Amount Detection Processing With reference to FIG. 18, a position shift amount detection processing executed by the control unit 38 to detect the above-described position shift amount will be described. This process is executed before starting the production of the substrate P, and is also executed at intervals of 10 minutes (an example of a predetermined timing) during the production of the substrate P. Note that the 10-minute interval is an example, and the timing at which the positional deviation amount detection processing is executed can be determined as appropriate.

In S101, the control unit 38 moves the board imaging camera 19 above the correction mark 35 of the correction unit 20.
In S102, the control unit 38 images the correction mark 35 by the board imaging camera 19 in a state where the glass jig 36 of the correction unit 20 does not overlap the correction mark 35.

In S103, the control unit 38 detects the center point of the correction mark 35 on the image captured in S102, and obtains the difference (dX, dY) between the center point of the image and the center point of the correction mark 35.
In S104, the control unit 38 determines whether dX and dY are both 0 (or less than a predetermined threshold) (in other words, whether the center point of the correction mark 35 on the image matches the center point of the image) Is determined, and if at least one is not 0, the process proceeds to S105, and if both are 0, the process proceeds to S106.

In S105, the control unit 38 moves the head unit 16 by dX in the X direction and by dY in the Y direction. After moving the head unit 16, the control unit 38 returns to S102 and repeats the processing.
In S106, the control unit 38 moves the glass jig 36 to a position overlapping the correction mark 35.

In S107, the control unit 38 captures an image of the correction mark 35 with the substrate imaging camera 19 in a state where the glass jig 36 overlaps the correction mark 35.
In S108, the control unit 38 detects the center point of the correction mark 35 on the image captured in S107, and detects the distance (dX_g, dY_g) from the center point of the image to the center point of the correction mark 35. In other words, the control unit 38 detects a difference (dX_g, dY_g) between the first position M1 and the second position M2 in the X direction and the Y direction.

In S109, the control unit 38 detects the positional deviation amount dX_c corresponding to the difference dX_g and the positional deviation amount dY_c corresponding to the difference dY_g using the data representing the graph shown in FIG. 17 described above.

When the control unit 38 detects the positional deviation amount by the above-described positional deviation amount detection processing, the control unit 38 corrects the mounting coordinates of the component E using the positional deviation amount until the next positional deviation amount detection processing is executed. Then, when the control unit 38 next executes the positional deviation amount detection processing, the mounting coordinates of the component E mounted thereafter are corrected using the positional deviation amount detected next.

(7) Effects of the Embodiment According to the surface mounter 1 according to the first embodiment, the position of the correction mark 35 is determined by imaging the correction mark 35 with the glass jig 36 not overlapping with the substrate imaging camera 19. The position of the correction mark 35 is detected as the second position M2 by detecting the position of the correction mark 35 with the glass jig 36 being overlapped with the substrate imaging camera 19 and detecting the position of the correction mark 35 as the second position M2. The displacement of the component E is corrected based on the difference (dX_g, dY_g) between the component E and the second position M2, so that the displacement of the component E due to the inclination of the optical axis 19A of the board imaging camera 19 can be corrected.

According to the surface mounter 1, when the position of the substrate P is recognized by imaging the recognition mark F with the substrate imaging camera 19, the positional displacement of the component E is determined based on the difference between the first position M1 and the second position M2. Since the correction is performed, the positional deviation of the component E can be corrected.

According to the surface mounter 1, since the correction unit 20 is attached to the surface mounter 1, the first position M1 and the second position M1 can be set without stopping the production of the substrate P during the production of the substrate P by the surface mounter 1. The position M2 can be detected. This makes it possible to correct the displacement of the component E while suppressing a decrease in productivity.

According to the surface mounter 1, by correcting the mounting coordinates of the component E based on the difference between the first position M1 and the second position M2, the positional deviation of the component E can be corrected.

According to the surface mounter 1, the difference (dX_g, dY_g) between the first position M1 and the second position M2 can be converted into the displacement amount (dX_c, dY_c) by using the data representing the graph shown in FIG.

According to the surface mounter 1, the position shift amount detection processing is executed at intervals of 10 minutes during the production of the board P. Therefore, even if the inclination of the optical axis 19A of the board imaging camera 19 changes during the production of the board P, the component E Can be corrected.

<Other embodiments>
The technology disclosed in the present specification is not limited to the embodiments described in the above description and the drawings. For example, the following embodiments are also included in the technical scope disclosed in the present specification.

(1) In the above-described embodiment, a case has been described as an example in which the positional deviation of the component E is corrected by subtracting the positional deviation amount (dX_c, dY_c) from the mounting coordinates of the component E. However, the positional deviation of the component E is corrected. The method is not limited to this.
For example, the displacement of the component E may be corrected by correcting the relative position information of the mounting head 25 with respect to the board imaging camera 19. Specifically, for example, in the case of the example shown in FIG. 13B described above, if | dX_c | is subtracted from the relative position information of the mounting head 25 with respect to the board imaging camera 19, the control unit 38 moves the mounting head 25 to X1. , | DX_c | is reduced by | dX_c | more than before the subtraction. Therefore, the mounting head 25 is located above the position P3, and the component E can be mounted at the position P3.
For example, in the case of the example shown in FIG. 13B described above, the substrate origin S2 may be moved to the left by | dX_c |. By doing so, the control unit 38 moves the mounting head 25 to a position separated by X1 to the left from the substrate origin S2 moved to the left by | dX_c |, so that the mounting head 25 is positioned above the position P3. I do. Thus, the component E can be mounted at the position P3.

(2) In the above embodiment, the case where the correction unit 20 is attached to the surface mounter 1 is described as an example, but the correction unit 20 may not be attached to the surface mounter 1. Specifically, for example, the correction unit 20 is loaded into the surface mounter 1 by the substrate transfer device 15, and the difference (dX_g, dY_g) between the first position M1 and the second position M2 is determined using the loaded correction unit 20. ) May be detected. In this manner, even in an existing surface mounter to which the correction unit 20 is not attached, it is possible to correct the component displacement caused by the inclination of the optical axis of the board imaging camera 19.

(3) In the above-described embodiment, an example has been described in which the displacement detection processing is executed before the production of the substrate P is started, and is executed at intervals of 10 minutes during the production of the substrate P. However, the timing for executing the positional deviation amount detection processing is not limited to this, and can be determined as appropriate. For example, it may be executed each time a predetermined number of boards P are produced, or each time a predetermined number of components E are mounted.

(4) In the above embodiment, after capturing the correction mark 35 in a state where the glass jig 36 does not overlap, the glass jig 36 is moved to a position overlapping the correction mark 35 while the position of the substrate imaging camera 19 is fixed. The case where the difference is detected between the first position M <b> 1 and the second position M <b> 2 by moving the glass jig 36 and capturing the correction mark 35 in the state where the glass jig 36 overlaps has been described as an example.
On the other hand, after imaging the correction mark 35 where the glass jig 36 does not overlap, the substrate imaging camera 19 images the correction mark 35 while the glass jig 36 overlaps the correction mark 35. Image, and the position of the board imaging camera 19 may be adjusted such that the center point of the correction mark 35 on the image coincides with the center point of the image. Then, the position of the substrate imaging camera 19 when the correction mark 35 is imaged when the glass jig 36 is not overlapped, and the substrate imaging when the correction mark 35 is imaged when the glass jig 36 is overlapped. The difference between the position of the camera 19 and the first position M1 may be determined as the difference between the first position M1 and the second position M2.

(5) In the above embodiment, the mounting head 25 that holds the component E by sucking the component E has been described as an example. However, the mounting head 25 may be configured to hold the component E by so-called chucking.

DESCRIPTION OF SYMBOLS 1 ... Surface mounting machine, 19 ... Substrate imaging camera, 20 ... Correction unit, 25 ... Mounting head, 34 ... Base, 35 ... Correction mark, 36 ... Glass jig (an example of a light transmission member), 37 ... Move Unit, 40: arithmetic processing unit (an example of a position detecting unit, a correcting unit, and a recognizing unit); 42, a storage unit; M1, a center point of the correcting mark 35 (an example of a first position); M2, a correcting mark 35 center point (an example of a second position), 63 ... mounting coordinates, E ... parts, Fa1, Fa2 ... reference marks (examples of recognition marks), Fb1, Fb2 ... parts positioning marks (examples of recognition marks), dX_g ... Difference between first position and second position (X direction), dY_g: Difference between first position and second position (Y direction), dX_c: Displacement amount (X direction), dY_c: Displacement amount (Y direction) ), P ... substrate

Claims

A surface mounter for mounting components on a substrate,
A mounting head that holds the component and mounts it on the board;
A board imaging camera for imaging the board,
A correction mark attached to a base, a light transmitting member that transmits light from the substrate imaging camera, and a movement that moves the light transmitting member between a position overlapping the correction mark and a position not overlapping the correction mark. A correction unit having
The correction mark in a state not overlapping with the light transmitting member is imaged by the substrate imaging camera to detect a position of the correction mark as a first position, and the correction in a state where the light transmitting member overlaps is performed. A position detection unit that captures a mark for use with the substrate imaging camera and detects the position of the correction mark as a second position;
A correction unit configured to correct a position shift of the component based on a difference between the first position and the second position;
A surface mounting machine provided with.
The surface mounting machine according to claim 1,
A surface mounter, comprising: a recognition unit that recognizes a position of the substrate by imaging a recognition mark attached to the substrate with the substrate imaging camera.
The surface mounting machine according to claim 1 or claim 2,
The surface mounter, wherein the correction unit is attached to the surface mounter.
The surface mounter according to any one of claims 1 to 3, wherein
The surface mounter, wherein the correction unit corrects a displacement of the component by correcting mounting coordinates of the component based on a difference between the first position and the second position.
The surface mounter according to any one of claims 1 to 4, wherein
A storage unit that stores conversion data for converting a difference between the first position and the second position into a positional deviation amount;
The correction unit converts the difference between the first position and the second position into the positional shift amount using the conversion data, and corrects the positional shift of the component based on the converted positional shift amount. , Surface mounter.
The surface mounter according to any one of claims 1 to 5, wherein
The surface mounter, wherein the position detector repeatedly detects the first position and the second position at a predetermined timing during the production of the substrate by the surface mounter.