JP4541095B2 - Position-related data converter and component mounting board work system - Google Patents

Description

  The present invention relates to a position-related data conversion apparatus, and more particularly to data conversion by coordinate conversion.

  The position related data includes, for example, mounting position coordinate data for mounting an electronic circuit component on a component mounting board in an electronic circuit component mounting machine. At the time of component mounting, the mounting head, the component supply device, and the substrate holding device are moved relative to each other, and the electronic circuit component is taken out from the component supply device by the mounting head and mounted at the component mounting position of the component mounting board according to the mounting position coordinate data. Is done. At this time, the position error of the component mounting position caused by the holding position error of the electronic circuit component by the component holder and the holding position error of the component mounting board by the board holding device is detected, corrected, and the electronic circuit component is mounted. Although mounting on a board is performed, there still may be a shift in the mounting position of electronic circuit components. Therefore, in the electronic circuit component mounting system described in Patent Document 1 below, a mounting inspection machine is provided independently of the electronic circuit component mounting machine, the mounting accuracy is inspected, and the mounting position coordinate data is stored as necessary. It has been fixed. After mounting the electronic circuit component, the component mounting board is sent to the mounting inspection machine in the same posture, the electronic circuit component is imaged by the imaging device, the positional deviation is detected based on the imaging data, and the component mounting position data is automatically Will be fixed.

On the other hand, the mounting inspection may be performed in a state in which the component mounting board is turned upside down and the component mounting surface, which is the surface on which the electronic circuit component is mounted, faces downward. For example, a plurality of reference marks are provided on the surface of the electronic circuit component main body mounted on the component mounting board on the side opposite to the side held by the component holder, and the electronic circuit component supply device In some cases, the reference mark is picked up by the image pickup device after taking out the image from the image pickup device, and the holding position error of the electronic circuit component by the component holder is obtained, corrected, and mounted. Further, a plurality of reference marks may be provided for each of a plurality of component mounting positions on the component mounting board, and a position error of the component mounting position may be acquired by taking an image thereof, and may be corrected and mounted. In this case, if the component mounting board is transparent, by reversing the front and back, both the component mounting position and the electronic circuit component can be seen through the reference marks from the back side of the component mounting board. Based on the imaging data, the mounting position shift of the mounted electronic circuit component can be acquired.
Japanese Patent Laid-Open No. 2003-110288

However, when the mounting position deviation is acquired with the component mounting board reversed in this way, if the operator tries to correct the mounting position coordinate data based on the deviation, it is troublesome and an operation error occurs. easy. The component mounting board is set in a state where the front and back are reversed with respect to the inspection coordinate plane of the mounting inspection machine, and each mounting position shift in the X-axis and Y-axis directions is detected. The X and Y axis directions and the positive and negative directions of the inspection coordinate plane are the same as the design coordinate plane on which the mounting position coordinate data is created and the reference coordinate plane set for the electronic circuit component mounting machine. If the front and back are reversed by rotation around the Y axis, the sign of the mounting position shift in the X axis direction is opposite to that at the time of mounting, and the operator needs to correct the mounting position while considering that fact. Therefore, the work is troublesome and mistakes are likely to occur.
The present invention has been made in view of the above circumstances and has as its object to provide a position-related data conversion device that allows easy data change.

In order to solve the above-described problems, a position-related data conversion device according to the present invention has (a) an electronic circuit component mounted on a first coordinate plane having an X axis and a Y axis orthogonal to each other as coordinate axes. Storage means for storing position-related data, which is data related to the position of at least one point on the substrate constituting the electronic circuit, and (b) X orthogonal to the position-related data stored in the storage means. A coordinate conversion instruction for instructing that coordinate conversion to the second coordinate plane , in which the positive and negative directions are the same as those of the first coordinate plane, is to be performed for each of the X axis and the Y axis. parts and, (c) and the coordinate conversion specification unit coordinate conversion unit for performing a coordinate transformation to the second coordinate plane of the position-related data stored in the storage means in accordance with the coordinate conversion instruction by, (d) the second On the coordinate plane. A data changing unit for changing the data, and (e) an inverse coordinate conversion instruction for instructing that the position related data changed by the data changing unit should be converted into position related data on the first coordinate plane. instructions and parts, the type of inverse coordinate viewed contains an inverse coordinate transformation unit that performs conversion and coordinate transformation the coordinate conversion specification unit is to be performed in the coordinate conversion unit in accordance with an instruction (f) the reverse coordinate conversion specification unit The type of coordinate conversion indicated by the conversion coordinate instruction unit is the reverse of the front / back by rotation around the X axis, the reverse of the front / back by rotation around the Y axis, the forward rotation and the reverse direction Is configured to include at least two of the rotations .
The components of the position-related data conversion device such as storage means may be provided in one device, or may be provided separately in a plurality of devices. In the latter case, data is exchanged between a plurality of devices, for example, by connecting the devices by communication lines or connection lines, or by wireless communication, or data is stored in a magnetic recording medium such as a flexible disk, The position-related data conversion apparatus is configured to be performed in a state where it is recorded on various recording media such as an optical disk and a magneto-optical disk. These communication lines and the like constitute data transmission means, and are controlled by a data transmission control unit or a data acquisition unit to exchange and acquire data.
The change of the position related data by the data changing unit can be performed in various modes such as change, correction, addition, and reception of data.

According to the position-related data conversion device according to the present invention, for example, when an operator changes position-related data, it can be changed easily and with few mistakes. Since although the data changes are made on the second coordinate plane, the position related data are changed to the reverse conversion, are automatically position-related data in the first coordinate plane, the worker, the substrate is the second coordinate This is because it is only necessary to change the data as if it is on the surface, and it is not necessary to change the data on the first coordinate surface by itself.

Aspects of the Invention

The following invention which is considered claimable (hereinafter referred to as "claimable invention". Claimable invention, subordinate concepts invention and the present gun invention, the preamble or another concept of the present invention In some embodiments, the invention may be included and described below. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, etc., and as long as the interpretation is followed, another aspect is added to the form of each section. In addition, an aspect in which constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

(1) storage means for storing position related data, which is data related to the position of at least one point of the coordinate conversion object on the first coordinate plane;
A coordinate conversion instruction unit for instructing that the position-related data stored in the storage means should be subjected to coordinate conversion to the second coordinate plane;
A coordinate conversion unit that performs coordinate conversion to the second coordinate plane of the position-related data stored in the storage unit according to a coordinate conversion instruction by the coordinate conversion instruction unit;
A data changing unit for changing the position related data on the second coordinate plane;
An inverse coordinate conversion instruction unit for instructing that the position related data changed by the data change unit should be inversely converted into position related data on the first coordinate plane;
A position-related data conversion device including an inverse coordinate conversion unit that performs inverse coordinate conversion in accordance with an instruction from the inverse coordinate conversion instruction unit.
(2) The position-related data conversion device according to (1), wherein the coordinate conversion instruction unit includes a conversion coordinate instruction unit that indicates a type of coordinate conversion to be performed on the position-related data stored in the storage unit.
There are various types of coordinate conversion including those described for the position-related data conversion apparatus in item (8). The coordinate conversion instructing unit may always only instruct the same coordinate conversion (for example, the front and back inversion of the coordinate conversion object), but according to the position-related data conversion apparatus of this section, Is executed, and at least one of a plurality of types of coordinate transformation is selectively executed, and the coordinate transformation of the position-related data is performed in various ways. (3) Item (1) or (2) includes a display unit that displays at least one of the position-related data coordinate-transformed by the coordinate transformation unit and the coordinate-transformed image of the coordinate transformation object. The position related data converter described.
The display unit may display the position related data stored in the storage unit.
The display unit is configured in various ways. In particular, the display unit for displaying position-related data is a numerical display that displays a number from 0 to 9 by combining seven lines (segments) into an 8-character shape and illuminating appropriate lines in addition to the display screen. It can be configured in various manners, such as a display unit that includes a unit and a plurality of lamps, and displays data by selectively lighting them.
If at least one of the position-related data and the image of the coordinate conversion object is displayed, for example, the operator can easily change the data while referring to the display. In particular, if an image of a coordinate conversion object is displayed, it is convenient because data can be changed while checking the state of the coordinate conversion object by coordinate conversion.
(4) The position related data conversion device according to (3), wherein the display unit includes a display screen.
According to the display screen, for example, a plurality of data can be displayed at a time. A large amount of data can be easily displayed by switching the screen continuously or by switching the screen unit.
(5) The coordinate conversion unit is configured so that a substantial relative position of the coordinate conversion object with respect to the origin of the first coordinate plane and a substantial relative position with respect to the origin of the second coordinate plane are before and after the coordinate conversion. The position-related data conversion device according to any one of items (1) to (4), which performs coordinate conversion so as not to change.
The position-related data conversion device in (6) is an example of the position-related data conversion device in this section.In addition, for example, the reference point set on the coordinate conversion object and the origin of the first coordinate plane An aspect in which the distance from the origin of the second coordinate plane is always constant is also an aspect of this section.
According to the position-related data conversion device of this section, for example, when an operator changes data, it can be easily performed. This is because it is not necessary to consider the change in the relative position of the coordinate conversion object with respect to the origin of the first and second coordinate planes due to the coordinate conversion. In addition, since the substantial relative position does not change, the calculation of coordinate conversion is simplified and may be performed quickly.
(6) The coordinate conversion unit performs coordinate conversion so that the reference point set on the coordinate conversion object matches the origin of the first coordinate plane and the origin of the second coordinate plane. The position-related data converter according to item 5).
For example, when the position related data stored in the storage means is created based on the reference point set on the coordinate conversion object, the position related data after the coordinate conversion also uses the reference point of the coordinate conversion object. It becomes the reference data, and the coordinate conversion is simple.
(7) The first coordinate plane and the second coordinate plane are both parallel to each other in X-axis and Y-axis, and the positive and negative directions are the same for each of the X-axis and Y-axis (1 The position-related data converter according to any one of items) to (6).
When the first and second coordinate planes are XY coordinate planes, one X-axis and the other Y-axis, one Y-axis and the other X-axis are parallel to each other, or between the X-axis and the Y-axis Are parallel to each other, it is possible to use coordinate planes of various modes such that the positive and negative directions are reversed with respect to at least one of the X-axis and Y-axis. For example, coordinate conversion is particularly simple. In addition, it is easy for the operator to change the position related data. The changed data is different from the data in the state where the coordinate conversion object is in the first coordinate plane, but the data in the state in the first coordinate plane is obtained by reverse conversion, so the operator can change the second coordinate In the plane, the data can be changed in the same way as when the coordinate conversion object is in the first coordinate plane, and the second coordinate plane is in the X-axis and Y-axis directions with respect to the first coordinate plane. This is because there is no change in the positive and negative directions, and the data can be changed on the second coordinate plane in the same manner as when the coordinate conversion object is on the first coordinate plane.
Further, in the embodiment in which this item is subordinate to the items (5) and (6), as will be described later in the section of the embodiment of the invention, the coordinate conversion is performed by simple replacement of the X coordinate and the Y coordinate or change of the sign. The coordinate transformation is very simple.
(8) The coordinate that the coordinate conversion instruction unit includes a conversion coordinate instruction unit that specifies a type of coordinate conversion to be performed on the position-related data stored in the storage unit, and can be instructed by the conversion coordinate instruction unit The position-related data described in (7), wherein the types of conversion include at least two of front / back inversion by rotation around the X axis, front / back inversion by rotation around the Y axis, forward rotation, and reverse rotation Conversion device.
(9) The position related data conversion device according to item (8), wherein the absolute value of the rotation angle is 90 degrees.
Coordinate conversion by rotation with an absolute angle value of 90 degrees is relatively simple and easy to convert.
(10) The coordinate conversion instructing unit and the inverse coordinate conversion instructing unit can respectively instruct the coordinate conversion and the inverse coordinate conversion in a plurality of types and in an overlapping manner. Position related data converter.
According to the position-related data conversion device of this section, coordinate conversion can be performed in more ways than types of coordinate conversion.
(11) The coordinate conversion type is displayed on the display unit, and the coordinate conversion instruction unit includes a coordinate conversion type selection unit that selects coordinate conversion to be executed from the displayed types of coordinate conversion. The position-related data converter according to any one of items 3) to (10).
Since the type of coordinate conversion is displayed, it is easy to specify the type. If all coordinate transformation types are displayed simultaneously, the selection is particularly easy.
(12) The position-related data conversion device according to any one of (1) to (11), wherein the coordinate conversion object is a component mounting board that forms an electronic circuit by mounting an electronic circuit component .
The component mounting board, such as a substrate which synthetic resin has been impregnated such as epoxy resin transparent substrates and such as a glass substrate constituting the liquid crystal panel and a plasma display panel or the like, the paper or substrate such as glass cloth There is an opaque substrate. When recognizing a component mounting board from the back side with the component mounting board turned upside down, the electronic circuit components mounted on the surface of the component mounting board can be clearly recognized so that the position can be specified. If it exists, it can be said that it is transparent, and it is assumed that it is opaque when the electronic circuit component or the like cannot be recognized at all or when it cannot be identified at all.
A circuit pattern is provided on the component mounting board by printing or the like, and an electronic circuit component is mounted. The component mounting board may be one in which electronic circuit components are mounted but not yet electrically joined, or one that is electrically joined to complete the mounting of electronic circuit components, and the process between them. A semi-finished product may be used.
The electronic circuit component may be a component that is mounted on a component mounting board to form an electronic circuit, may be a single component, or may be an electronic circuit formed by mounting an electronic circuit component on a component mounting board. Good.
(13) The position related data includes mounting position related data related to a mounting position of an electronic circuit component which is mounted on a circuit pattern provided on the component mounting board and constitutes an electronic circuit, and the mounting position related data is The position-related data conversion device according to item (12), including at least one of mounting position coordinate data defining a mounting position of the electronic circuit component and mounting position deviation related data relating to a shift in the mounting position of the electronic circuit component.
The attachment position deviation related data includes, for example, at least one of attachment position deviation data and attachment position deviation elimination data for canceling the attachment position deviation.
According to the position-related data conversion device of this section, the coordinate conversion is performed on the mounting position-related data and changed.
(14) The data change unit includes a component mounting position correction unit that corrects at least one of the mounting position coordinate data and the mounting position deviation related data, and acquires mounting position correction data. Position related data converter.
The mounting position correction data may be data including design mounting position coordinate data and corrected mounting position shift related data that is corrected mounting position shift related data, and corrected mounting position coordinate data that is corrected mounting position coordinate data. Or data including correction mounting position deviation related data.
When the mounting position correction data includes the design mounting position coordinate data and the corrected mounting position deviation related data, the mounting position shift related data is corrected, and the design mounting position coordinate data and the corrected mounting position shift related data Mounting position coordinate data that can be mounted by canceling the deviation of the circuit component is obtained, and the mounting position coordinate data is indirectly corrected. In this case, when the mounting position coordinate data is corrected, the corrected mounting position deviation related data is corrected, and when correction is performed a plurality of times, the latest corrected mounting position deviation related data is corrected, and new corrected mounting position deviation related data is obtained. can get. Regardless of whether the mounting position deviation related data is the mounting position deviation data or the mounting position deviation elimination data, the latest data is updated by the correction. When the mounting position correction data includes the corrected mounting position coordinate data, the mounting position coordinate data is directly corrected, and mounting position coordinate data itself that can be mounted by canceling the deviation is obtained.
(15) In the item (14), the inverse coordinate conversion instruction unit instructs reverse conversion of the mounting position correction data, and the inverse coordinate conversion unit reversely converts the mounting position correction data according to an instruction from the inverse coordinate conversion instruction unit. The position related data converter described.
If the design mounting position coordinate data is created in a state where the component mounting board is on the first coordinate plane, the mounting position correction data is inversely converted to mount the electronic circuit component on the component mounting board. It is the data to be used, and the mounting position coordinate data which is corrected and mounted with high accuracy is obtained.
(16) The position related data conversion device according to any one of (1) to (15), wherein the data changing unit includes a data input unit for inputting data.
The data input unit may include at least one of various input devices such as a mouse, a track / ball, a pointing device such as a touch panel, and a keyboard.
(17) The position related data conversion device according to item (12),
A board holding device for holding a component mounting board;
A working head for working on the component mounting board;
A relative movement device for relatively moving the substrate holding device and the working head;
A component mounting substrate work system including the position related data conversion device, the substrate holding device, the work head, and a control device for controlling the relative movement device.
The working head includes, for example, a mounting head for mounting an electronic circuit component on a component mounting board, an application head for applying a high-viscosity fluid such as cream solder or adhesive to the component mounting board, and an electronic circuit component to the component mounting board. There are a mounting inspection head for inspecting the mounting state, a coating inspection head for inspecting the application state of the high-viscosity fluid onto the component mounting substrate, an ACF (Anisotropic Conductive Film) application head, and the like. The mounting head, for example, places electronic circuit components on a component mounting position where a highly viscous fluid is applied to the component mounting board, or places electronic circuit components on the component mounting board and pressurizes them In addition, there are those that further heat. Some ACF sticking heads stick an ACF to an electrode terminal of a glass substrate, for example.
Components other than the position-related data converter, such as the work head, constitute a component-mounting board working machine. All of the position-related data conversion devices may be provided on one component-mounting board working machine, or at least a part thereof may be provided independently of the component-mounting board working machine. When at least a part of the position-related data conversion device is provided independently for the component mounting board work machine, the independent at least part controls, for example, a production line including the component mounting board work machine. It may be provided in the overall control computer to be controlled, or may be provided separately from the overall control computer.
In the component mounting substrate work system of this section, the position related data includes work position related data which is data related to the work position of the work head, and the work position related data includes, for example, work position coordinate data and work position. Including at least one of deviation-related data. Each feature of the position-related data conversion device described in the items (13) to (16) can be used even when the mounting head is replaced with a working head and the working head is a working head other than the mounting head. According to the component mounting substrate work system described in the item, each operation and effect described in the items (1) to (16) can be obtained, and for example, data can be easily changed, and the work can be performed with high accuracy. Work system is obtained. For example, if the working head is an adhesive application head, an adhesive application system can be obtained in which the application-related data is easily changed and the application is performed with high accuracy.
(18) The position-related data conversion device according to any one of (12) to (16),
A component supply device for supplying electronic circuit components;
A board holding device for holding a component mounting board;
A mounting head for receiving the electronic circuit component from the component supply device and mounting the electronic circuit component on the component mounting board;
A relative movement device for relatively moving the component supply device, the substrate holding device, and the mounting head;
An electronic circuit component mounting system including at least the position-related data conversion device, the substrate holding device, the mounting head, and a control device for controlling the relative movement device.
According to this section, for example, it is possible to obtain an electronic circuit component mounting system in which mounting position related data can be easily changed and electronic circuit components can be mounted on a component mounting board with high accuracy.

  Several embodiments of the claimable invention will now be described in detail with reference to the drawings. In addition to the following examples, the claimable invention can be practiced in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

  As shown in FIG. 5, the electronic circuit component mounting machine of the electronic circuit component mounting system of the present embodiment has a chip component 92 as a liquid crystal driving circuit component on a transparent glass substrate 30 constituting the liquid crystal panel 28 (see FIG. 1). Is an electronic machine component mounting system which is a kind of a component mounting board working system, together with a mounting position related data conversion device which is an embodiment of the claimable invention. .

  The chip component 92 is a kind of electronic circuit component, and there are various components such as a flip chip shown in FIG. A plurality of chip components 92 are provided on the back surface of the main body 94 (the surface on the side mounted on the glass substrate 30 (the surface to be mounted) and the surface opposite to the side held by the mounting head described later). In the example, two reference marks 96 are provided. These reference marks 96 are opaque marks in this embodiment, and are provided symmetrically with respect to the center of the chip component 92 at positions separated from each other on the diagonal line of the main body 94, and the X axis, The distance in each direction of the Y axis is equal. Hereinafter, the reference mark 96 is referred to as a component mark 96. When the chip component 92 is a flip chip, as shown in FIG. 4, a large number of bumps 98 are provided on the back side of the main body 94, and the component mark 96 is provided in a portion outside the region where the bumps 98 are provided. ing. The bump 98 is made of, for example, gold.

  The glass substrate 30 is assembled with another glass substrate 130 (see FIG. 1), liquid crystal is enclosed between them, and an ACF tape 8 (see FIG. 5) is stuck on the electrode terminal in the electronic circuit. It is carried into the component mounting machine. The glass substrate 30 is larger than the glass substrate 130, and at least one chip component 92 is mounted on the edge of the glass substrate 30 protruding from the glass substrate 130. Each of the glass substrates 30 and 130 is provided with electrodes (not shown), and the edge of the glass substrate 30 has a number of pads (not shown) as input terminals (not shown) and input terminals (not shown) connected to each of a number of electrodes. Etc.) and the chip component 92 is joined.

  A reference mark 82 is provided on the component mounting surface of the glass substrate 30 on which the chip component 92 is mounted, as shown in FIG. The reference marks 82 are referred to as local marks. As shown in FIG. 2, a plurality of reference marks 82 are provided for each component mounting position of the glass substrate 30, and two are provided in this embodiment. These two reference marks 82 are in a state of being detached from the chip component 92 when the chip component 92 is mounted on the glass substrate 30, and are straight lines passing through the component mounting position, on the diagonal line of the mounted chip component 92. Is located symmetrically with respect to the component mounting position, and the distances in the X-axis and Y-axis directions with respect to the component mounting position are equal. In this embodiment, the reference mark 82 is opaque. Hereinafter, the reference mark 82 is referred to as a substrate mark 82.

  The ACF tape 8 is a tape made of an anisotropic conductive film, which is a kind of connecting material. In this embodiment, conductive particles, for example, particles having gold surfaces plated with nickel in a thermoplastic resin film are used. It is supposed to be mixed. At least one component mounting position is set on the glass substrate 30, and a plurality of pads are provided at each of the component mounting positions. The ACF tape 8 is continuously pasted over each pad at a plurality of adjacent component mounting positions. Attached. As shown in FIG. 5, the ACF tape 8 covers a substrate mark 82 as well as a large number of pads, and also covers a portion of the glass substrate 30 that corresponds to the component mark 96 when the chip component 92 is mounted. Affixed in state.

  As schematically shown in FIGS. 1 and 2, the electronic circuit component mounting machine includes a base 10, a substrate positioning device 12 provided on the base 10, a crimping base 14, a component mounting device 16, and a component supply device 18. And an imaging system 22, a control device 24 (see FIG. 6) for controlling these devices 12, and the like. The substrate positioning device 12 includes a table 34 and a table moving device 36 as substrate holding members. In the present embodiment, the table moving device 36 is configured such that the table 34 is divided into two directions that are orthogonal to each other in the horizontal plane, that is, the X axis direction and the Y axis direction, and the Z axis that is the vertical direction orthogonal to the X axis and Y axis directions. And a device that rotates around an axis parallel to the Z-axis direction. These X-axis and Y-axis directions are directions on the XY coordinate plane set as the reference coordinate plane for the electronic circuit component mounting machine.

  As shown in FIG. 2, the table moving device 36 includes a table X-axis direction moving device 40, a table Y-axis direction moving device 42, a table Z-axis direction moving device 44, and a table rotating device 46. The table Y-axis direction moving device 42 includes a Y-axis slider 48 provided on the base 10 so as to be movable in the Y-axis direction, and a Y-axis slider moving device that moves the Y-axis slider 48 in the Y-axis direction. The table X-axis direction moving device 40 includes an X-axis slider 50 provided on the Y-axis slider 48 so as to be movable in the X-axis direction, and an X-axis slider moving device that moves the X-axis slider 50 in the X-axis direction. . The table Z-axis direction moving device 44 includes a Z-axis slider 52 provided on the X-axis slider 50 so as to be movable in the vertical direction, and a Z-axis direction moving device that moves the Z-axis slider 52 up and down. These moving devices in the X-axis direction, the Y-axis direction, and the Z-axis direction are configured using servo motors 54, 56, and 58 (see FIG. 6) as drive sources, and each of the X-axis, Y-axis, and Z-axis movement devices. The sliders 50, 48 and 52 as moving members are moved to arbitrary positions in the respective axial directions. Servo motors 54, 56, and 58 that constitute a drive source are a kind of actuator, and are an electric rotary motor that is a kind of electric motor, and can control the rotation angle with high accuracy. A step motor may be used instead of the servo motor. A linear motor may be used as a drive source.

  A table 34 is provided on the Z-axis slider 52 so as to be rotatable around a vertical axis, and is rotated by a table rotating device 46. In this embodiment, the table rotating device 46 is a device that indexes and rotates the table 34 by a set angle around the vertical axis, for example, by 90 degrees. The table 34 includes an upward substrate support surface 62 and a substrate suction device (not shown). The substrate suction device includes a plurality of suction holes opened in the substrate support surface 62, and these suction holes are selectively communicated with a negative pressure source and the atmosphere via a switching valve to supply negative pressure. Thus, the liquid crystal panel 28 is adsorbed and held on the substrate support surface 62, and the liquid crystal panel 28 is opened by being connected to the atmosphere.

  As shown in FIGS. 1 and 2, the component mounting device 16 includes a mounting head 350, a mounting head moving device 352, a heating device 354, and a pressure device 356. In this embodiment, the mounting head moving device 352 includes a head Y-axis direction moving device, a head Z-axis direction moving device, and a head rotating device, each of which uses a servo motor as a drive source. In this direction, the device is moved to an arbitrary position and rotated at an arbitrary angle in both forward and reverse directions around an axis parallel to the Z-axis direction.

  The mounting head 350 is provided on a Z-axis slider that is moved in the Z-axis direction of the head Z-axis direction moving device so as to be rotatable around a rotation axis parallel to the Z-axis direction, and is protruded downward from the Z-axis slider. A main body 360 and a component holder 362 held by the head main body 360 so as to be relatively movable in the Z-axis direction are included. An air cylinder 364 is provided in the head main body 360 in a downward and non-rotatable manner, and a component holder 362 is held at the lower end portion of the piston rod so as to be relatively movable in the Z-axis direction with respect to the head main body 360. Relative rotation is impossible. The pressure of air supplied from the air source to the air cylinder 364 is controlled by a pressure reducing valve (not shown), and the chip component 92 is pressurized with a preset pressure, as will be described later.

  The component holder 362 includes a component holder 366 at the lower end protruding from the head body 360. The component holding unit 366 sucks and holds the chip component 92 with negative pressure, and is selectively communicated with the negative pressure source and the atmosphere by switching the switching valve. The component holding unit 366 is connected to a negative pressure source, adsorbs the chip component 92 when negative pressure is supplied, and opens the chip component 92 when released to the atmosphere. A heating device 354 is provided in the component holding portion 366. The heating device 354 includes a heater in this embodiment.

  As shown in FIG. 1, the component supply device 18 is provided at a position away from the substrate positioning device 12 in the Y-axis direction. In this embodiment, the component supply device 18 supplies the chip component 92 by a tray. In this embodiment, the chip component 92 is taken out of the tray by a component take-out device (not shown) and placed on a temporary table (not shown), and the mounting head 350 receives the chip component 92. The crimping table 14 is provided on the base 10 adjacent to the substrate positioning device 12 in the Y-axis direction. The crimping base 14 is a substrate support member, and in this embodiment is made of quartz glass which is a kind of transparent material, allows light transmission, is long in the X-axis direction, and has a shape viewed from the Y-axis direction. It is shaped like a letter and has a horizontal substrate support surface 370.

  In the present embodiment, the imaging system 22 includes a component imaging unit 380, a board imaging unit 382, and an imaging unit moving device 384 (see FIG. 6), as shown in FIG. The component imaging unit 380 includes a component imaging device 386 and an illumination device 388 (see FIG. 6), is located between the mounting head 350 and the crimping base 14 in the Z-axis direction, and is a chip component held by the mounting head 350. Illuminate 92 from below and take an image. The substrate imaging unit 382 includes a substrate imaging device 392 and an illumination device 394 (see FIG. 6), is positioned below the crimping table 14, and images the glass substrate 30 from below through the transparent crimping table 14. In this embodiment, the imaging devices 386 and 392 are devices that perform imaging with a CCD camera, and the illumination devices 388 and 394 are both devices that emit visible light. The imaging units 380 and 382 are integrally provided, and are moved in the X axis, Y axis, and Z axis directions by an imaging unit moving device 384 that is a common moving device. For this reason, the imaging unit moving device 384 includes moving devices in the X-axis, Y-axis, and Z-axis directions, each of which has a servo motor as a drive source, and the component imaging unit 380 and the board imaging unit 382 are placed at arbitrary positions in the respective axial directions. Move to.

  As shown in FIG. 6, the control device 24 is mainly composed of a CPU 100, a ROM 102, a RAM 104, and a mounting control computer 106 having a bus for connecting them. An input / output interface 108 is connected to the bus, and an image processing computer 110 that processes image data obtained by the imaging devices 386 and 392, imaging units 380 and 382, an input device 114, a data reading / writing device 116, and the like. Is connected. The input device 114 includes, for example, a pointing device such as a mouse and a keyboard.

  The input / output interface 108 is also connected to various actuators constituting a drive source of various devices constituting the electronic circuit component mounting machine such as the servo motor 54 and the printer 126 via the drive circuit 120, and via the control circuit 122. The display screen 124 is controlled. The portion that controls the display screen 124 and the display screen 124 of the control device 24 constitutes the display device.

  The ROM 102 and the RAM 104 store a basic operation program of the electronic circuit component mounting machine, a component mounting work program (hereinafter referred to as a component mounting program) corresponding to the glass substrate 30 to be operated, and a component mounting position related data correction operation. Various programs and data such as programs are stored. The component mounting program includes data regarding the component supply device 18 that supplies the chip component 92 and its component supply unit, coordinate data of the component mounting position that is the position where the chip component 92 should be mounted on the glass substrate 30, and the position of the substrate mark 82. Coordinate data, data defining the mounting order of electronic circuit components, data of components mounted at a component mounting position, component information of each component supplied from a PDG (part data generator) (not shown), and the like. . The mounting order is set for each of a plurality of mounting positions. When the program is executed by the basic operation program, the mounting head 350 is moved to the component extraction position by the mounting head moving device 352, the chip component 92 is extracted from the component supply device 18, and the component mounting set on the glass substrate 30 is performed. Move to position and wear.

  The component mounting position data included in the component mounting program is design data. In this embodiment, the component mounting position data is created with one preset point on the glass substrate 30 as a reference point. For example, the glass substrate 30 shown in FIG. 1 has two edge portions orthogonal to each other protruding outward from the glass substrate 130, and a long side mounting portion 250 and a short side that are parallel to the long side. The chip component 92 is mounted on each of the short side mounting portions 252 that are parallel to the protrusions, but one of the four apexes, for example, one of the two mounting portions 250 and 252. The apex of the long side mounting portion 250 opposite to the other short side mounting portion 252 side is a reference point, the reference point is located at the origin of the design coordinate plane which is the XY coordinate plane, and the long side is The design data is created in such an attitude that the short side is parallel to the X-axis direction, the short side is parallel to the Y-axis direction, and the coordinate values of all the component mounting positions are negative values for both the X-axis and the Y-axis. Design data is created in this posture for the mounting positions of all the chip components 92 mounted on the glass substrate 30. The reference coordinate plane set for the electronic circuit component mounting machine is such that the glass substrate 30 is supported by the table 34 and positioned in a posture in which the chip 92 is mounted on the long side mounting unit 250. The axes are set to be parallel to the X and Y axes of the design coordinate plane, and the positive and negative directions of the X and Y axes are set to be the same as the positive and negative directions of the design coordinate plane. . The design coordinate plane and the reference coordinate plane of the electronic circuit component mounting machine are such that the X-axis and the Y-axis are in a state where the glass substrate 30 is positioned in a posture in which the chip component 92 is mounted on the long-side mounting portion 250. They are parallel and their positive and negative directions match. Based on the position of the reference point in the reference coordinate plane and the mounting position coordinate data, the position of the component mounting position on the reference coordinate plane of the electronic circuit component mounting machine is obtained. The posture in which the chip component 92 is mounted on the long side mounting portion 250 in the electronic circuit component mounting machine for the glass substrate 30 is defined as a reference posture. In addition, the glass substrate on which the chip component 92 is mounted in the electronic circuit component mounting machine is one in which the chip component 92 is mounted on, for example, one side, three sides, or four sides in addition to the two sides orthogonal to each other. In this case, the reference point is set in the same manner, and the design data is created with the posture in which the coordinate values of all the component mounting positions are negative on both the X axis and the Y axis, and the long side is parallel to the X axis direction. . In these glass substrates, the posture in the state where the chip component 92 is mounted on the long side mounting portion having the reference point at the end point is the reference posture.

  This electronic circuit component mounting machine constitutes an electronic circuit assembly line for forming an electronic circuit by connecting the chip component 92 to the glass substrate 30 using the ACF tape 8 as a connecting material, although illustration is omitted. An ACF sticking machine for sticking the ACF tape 8 to the glass substrate 30 is provided on the upstream side of the electronic circuit component placement machine in the substrate transport direction, and a chip attached to the glass substrate 30 and temporarily connected to the downstream side. There is provided a bonding machine or a main pressure bonding machine that heats and pressurizes the component 92 and electrically bonds the electrodes respectively provided on the glass substrate 30 and the chip component 92. The unloading of the glass substrate 30 from the ACF tape applicator and the transport and loading into the electronic circuit component mounting machine, and the unloading of the glass substrate 30 from the electronic circuit component mounting machine and the transport and loading into the main crimping machine are respectively shown in the figure. Is carried out by a glass substrate transfer device which omits the above.

  The main crimping machine includes, for example, a substrate holding device, a heating device, and a pressure device. The pressure device sandwiches the glass substrate 30 and the chip component 92, which are temporarily bonded with the ACF tape 8 interposed therebetween, from above and below, and the chip component 92 has a pressure higher than the pressure applied by the mounting head 350 in the electronic circuit component mounting machine. The heating device heats at a higher temperature than the heating performed by the mounting head 350. By these pressurization and heating, the ACF tape 8 is affixed between the electrode of the chip component 92 and the electrode pad of the glass substrate 30, and the chip component 92 is fixed to the glass substrate 30. Both electrodes are electrically connected by conductive particles.

  Taking the case where the chip component 92 mounted on the glass substrate 30 is a flip chip (hereinafter abbreviated as “chip”), the mounting of the chip 92 on the glass substrate 30, the inspection of the mounting state, and the mounting position related data Explain the correction. In the electronic circuit component mounting machine, the liquid crystal panel 28 is carried from the ACF tape applying machine in a state where the ACF tape 8 is applied to the electrode pad of the glass substrate 30 and placed on the substrate support surface 62 of the table 34. Adsorbed and held. At this time, the liquid crystal panel 28 is held so that the long side mounting portion 250 and the short side mounting portion 252 protrude outward from the table 34 as shown in FIGS. 1 and 2. Further, the table 34 is positioned at a position where the substrate support surface 62 is higher than the substrate support surface 370 of the crimping table 14, and can move in the horizontal direction with respect to the crimping table 14.

  First, the table 34 is moved by the table moving device 36 while holding the glass substrate 30 in a posture in which the long side mounting portion 250 is parallel to the X-axis direction and positioned on the crimping table 14. One of the plurality of component mounting positions of the side mounting portion 250 is positioned above a preset crimping position (in this embodiment, the longitudinal center position of the crimping base 14 long in the X-axis direction) in the horizontal plane. It is done.

  The mounting head 350 is moved in the Y-axis direction by the mounting head moving device 352, moved to the component supply device 18, and lowered by the head Z-axis moving device, and the component holding unit 366 is placed on the temporary table. While being brought into contact with the chip 92, the chip 92 is adsorbed by supplying negative pressure. Then, the mounting head 350 is moved up by the mounting head moving device 352, moved in the Y-axis direction, moved to the crimping position, and positioned above the component mounting position positioned at the crimping position of the glass substrate 30. Be made.

  After the glass substrate 30 and the chip 92 are moved, the component mark 96 and the substrate mark 82 are imaged. At the time of imaging, the component imaging unit 380 and the board imaging unit 382 are moved from the retracted position to the imaging position by the imaging unit moving device 384. The imaging position is a position where the component imaging unit 380 is positioned below the chip 92 held by the component holder 362 and images the component mark 96, and the substrate imaging unit 382 is the component mounting position of the glass substrate 30. This is a position where the board mark 82 is imaged. The component imaging unit 380 is moved in the X-axis and Y-axis directions by the imaging unit moving device 384 so as to capture the two component marks 96 provided on the chip 92 one by one and in the vertical direction. The part mark 96 is moved and focused. Similarly, the board image pickup unit 382 is moved by the image pickup unit moving device 384 and picks up images of the two board marks 82 that are focused and provided at the component mounting position one by one. The position (height) of the glass substrate 30 in the Z-axis direction is also adjusted by raising and lowering the table 34 as necessary. The substrate imaging unit 382 is disposed below the crimping table 14, but the crimping table 14 is transparent, and the substrate mark 82 can be imaged through the transparent crimping table 14 and the transparent glass substrate 30. After imaging, the imaging units 380 and 382 are retracted to the retracted position. The retracted position is, for example, a position that is away from the crimping position in the X-axis and Y-axis directions and does not hinder chip mounting by the mounting head 350.

  Based on the imaging data of the marks 82 and 96, a horizontal position error that is a position error between the chip 92 and the glass substrate 30 in the X-axis and Y-axis directions and a rotational position error that is a position error about the Z-axis are obtained. While obtaining each position of the two board marks 82, obtaining an average position thereof, obtaining each position of the two component marks 96, obtaining an average position thereof, and obtaining a deviation of the mean positions, thereby obtaining a horizontal position. A position error is obtained. Further, a straight line passing through the centers of the two board marks 82 and a straight line passing through the centers of the two component marks 96 are obtained, and a rotational position error is obtained by obtaining a deviation in the rotation direction of the straight lines. .

  The horizontal position error between the chip 92 and the glass substrate 30 is corrected by moving the table 34 by the table moving device 36 and correcting each position of the X axis and Y axis of the glass substrate 30 so that the horizontal position error is canceled. Is done. The positional deviation in the X-axis and Y-axis directions between the chip 92 and the glass substrate 30 caused by the correction of the rotational position error is also corrected. Further, the rotational position error between the chip 92 and the glass substrate 30 is corrected and canceled by rotating the mounting head 350 around the Z axis by the head rotating device, and the positions of the chip 92 and the glass substrate 30 are matched. In this state, the table 34 is lowered, the substrate support surface 62 is positioned in the same horizontal plane as the substrate support surface 370, and the long side mounting portion 250 of the glass substrate 30 is placed on the crimping table 14. Then, the mounting head 350 is lowered by the head Z-axis moving device, and the chip 92 is placed on the glass substrate 30. As shown in FIG. 5, the chip 92 is mounted on the glass substrate 30 in such a posture that the two component marks 96 are close to the substrate mark 82. At this time, the component holder 362 is lowered to the lower end position with respect to the head main body 360 by the air cylinder 364, and the Z-axis slider is further lowered from the state where the chip 92 is brought into contact with the glass substrate 30. The chip 92 is pressure-bonded to the glass substrate 30. This lowering of the Z-axis slider is permitted by the relative movement of the head main body 360 and the component holder 362, and accordingly, the pressure in the pressure chamber of the air cylinder 364 increases. The component holder 362 moves backward with respect to the head main body 360, and the chip 92 is pressed against the glass substrate 30 with a preset pressure. Further, the chip 92 is heated by a heating device 354 provided in the component holding unit, and the ACF tape 8 is pressurized and heated, and the chip 92 is temporarily bonded to the glass substrate 30. In the present embodiment, the head Z-axis moving device and the air cylinder 364 constitute a pressurizing device 356.

  After the chip 92 is mounted, the mounting head 350 opens the chip 92 and is raised and separated from the chip 92. Further, the table 350 is raised and the glass substrate 30 is separated from the crimping table 14. When a plurality of chips 92 are mounted on the long side mounting portion 250 of the glass substrate 30, the glass substrate 30 is moved by moving the table 34, and the component mounting position where the chip 92 is mounted next is the crimping position. After being moved upward, the imaging of the marks 82 and 96 and the correction of the position error are performed, the table 34 is lowered, and the long side mounting portion 250 is placed on the substrate support surface 370 of the crimping table 14. The chip 92 is mounted.

  When all of the planned chips 92 are mounted on the long side mounting portion 250, the table 350 is raised and the glass substrate 30 is separated from the crimping table 14, and the glass substrate 30 is turned 90 degrees clockwise (the glass substrate 30). (The clockwise direction when viewed from above), and the short side mounting portion 252 has a longitudinal direction parallel to the X-axis direction of the reference coordinate of the electronic circuit component mounting machine. Then, the chip 92 is mounted on the short side mounting portion 252 in the same manner as the mounting of the chip 92 on the long side mounting portion 250. The design mounting position coordinate data of the design data is data in a state where the glass substrate 30 is in the reference posture, and the mounting position coordinate data is coordinate-converted when the chip 92 is mounted on the short side mounting portion 252.

  If the chips 92 are mounted and provisionally bonded to all the component mounting positions of the glass substrate 30, the table 34 is raised by the table moving device 36 to separate the glass substrate 30 from the crimping table 14 and horizontally. The liquid crystal panel 28 is moved to a carry-out position for carrying it out to the main crimping machine. Then, the liquid crystal panel 28 is carried out to the main crimping machine, where the chip 92 and the ACF tape 8 are heated and pressurized in the main crimping machine, and the bumps 98 are electrically joined to the pads via the conductive particles in the ACF tape 8. The

  The mounting state of the chip 92 thus bonded to the glass substrate 30 is inspected by the component mounting inspection machine 150 (see FIG. 7). In this embodiment, the inspection is performed in a state where the main heating and the main pressing by the main bonding machine are completed and the chip 92 is electrically bonded to the glass substrate 30 and fixed. 82 and the component mark 96 are imaged simultaneously. If the chip 92 is temporarily bonded to the glass substrate 30 via the ACF tape 8 and there is no fear that the chip 92 is displaced in the temporarily fixed state, the inspection may be performed in the temporarily fixed state.

  As described above, when the chip 92 is mounted on the glass substrate 30, the horizontal position error and the rotational position error between the chip 92 and the glass substrate 30 held by the mounting head 350 are corrected. May occur. This mounting position shift is not a shift that occurs individually on the chip 92 and the glass substrate 30, such as a holding position error of the chip 92 by the mounting head 350 and a holding position error of the glass substrate 30 by the table 34. Due to common causes of different chips 92 and glass substrate 30, such as positioning errors of the imaging units 380 and 382 due to thermal expansion of components of the apparatus 384, thermal expansion of the ball screw of the table moving device 36 and the mounting head moving device 352, etc. It is considered that this is a deviation. Therefore, after the chip 92 is mounted, the component mounting state is inspected, and the mounting position coordinate data is changed based on the inspection result.

  The component mounting inspection machine 150 will be described with reference to FIGS. The component mounting inspection machine 150 is provided independently of the electronic circuit component mounting machine. However, in the present embodiment, the entire component mounting inspection machine 150 is provided so as to be movable, and the chip 92 is mounted on the glass substrate 30 on which mounting inspection is performed. The electronic circuit component mounting machine can be moved to a position close to the electronic circuit component mounting machine. In this embodiment, the component mounting inspection machine 150 is an optical digitizer, and as shown in FIG. 7, an inspection table 152, a mounting inspection head (hereinafter abbreviated as an inspection head) 154, and inspection head movement. A device 156, an input device 158, a display device 160 (see FIG. 12) and a control device 162 (see FIG. 9) are included.

  The inspection table 152 has a shape and dimensions that allow a plurality of types of glass substrates 30 of different sizes to be set in either a portrait orientation or a landscape orientation. The glass substrate 30 is placed horizontally on the examination table 152, In addition, two sides orthogonal to each other at the reference point are fixed by a fixing device (not shown) in a posture parallel to the X axis and the Y axis of the inspection coordinate plane. The inspection head moving device 156 moves the inspection head 154 in a direction parallel to the X axis and the Y axis which are parallel to the inspection table 152 and are orthogonal to each other in the horizontal inspection coordinate plane. Therefore, the inspection head moving device 156 includes an X-axis moving device and a Y-axis moving device, as schematically shown in FIG. The X axis moving device includes an X axis slide 170 and an X axis slide moving device, and the Y axis moving device includes a Y axis slide 172 and a Y axis slide moving device. Each of the X-axis slide moving device and the Y-axis slide moving device is driven by an X-axis slide moving motor 176 and a Y-axis slide moving motor 178 (see FIG. 9), and includes a ball screw and a nut. And the Y-axis slide 172 are moved to arbitrary positions in the X-axis direction and the Y-axis direction, respectively.

The inspection head 154 is moved to an arbitrary position in the inspection coordinate plane by the inspection head moving device 156, and images the chip 92 mounted on the glass substrate 30 set on the inspection table 152 from above.
As shown in FIG. 8, the inspection head 154 includes an inspection imaging device 400, an illumination device 402, and a light guide device 404, and is provided on a box-shaped frame 410. In the present embodiment, the inspection imaging apparatus 400 performs imaging with a CCD camera, and the optical axis is provided horizontally. This CCD camera is supposed to be sensitive to visible light and near-infrared light having a long wavelength. The illumination device 402 includes a visible light source 412 and a near-infrared light source 414, and the light guide device 404 includes a prism 416 and a half mirror 418.

  The prism 416 causes the image forming light, which is reflected light from the imaging target, such as the substrate mark 82 and the component mark 96 to be horizontally bent by 90 degrees and enter the imaging apparatus 400. A half mirror 418 is provided in the middle of the optical path, and the visible light irradiated by the visible light source 412 is bent 90 degrees by each of the half mirror 418 and the prism 416 and is irradiated to the imaging object. The near-infrared light source 414 is provided so as to irradiate near-infrared light on the frame 410 along with the prism 416 and obliquely downward from the side of the prism 416.

  As shown in FIG. 9, the control device 162 is mainly configured by a CPU 200, a ROM 202, a RAM 204, and a computer (hereinafter referred to as an inspection computer) 210 including a bus connecting them. An input / output interface 212 is connected to the bus, and an image processing computer 218 that processes image data obtained by imaging of the inspection imaging device 400, an inspection imaging device 400, an illumination device 402, an input device 158, and data reading / writing. A device 220 is connected. The input device 158 is configured in the same manner as the input device 114 and has a function of performing inching operations on the X-axis slide movement motor 176 and the Y-axis slide movement motor 178, respectively. A motor operating device or an inspection head moving operation device is provided. An X-axis slide movement motor 176 and a Y-axis slide movement motor 178 are also connected to the input / output interface 212 via a drive circuit 226, and the display screen 232 is controlled via a control circuit 230. ing. The part that controls the display screen 232 and the display screen 232 of the control device 162 constitutes the display device 160. In the present embodiment, the motors 176 and 178 are constituted by servo motors.

  At the time of mounting inspection of the chip 92, the mounting inspection machine 150 is close to the electronic circuit component mounting machine. Here, the operator can easily display both the display screen 124 of the electronic circuit component mounting machine and the display screen 232 of the mounting inspection machine 150. It is located at a position where it can be compared. Then, the glass substrate 30 is set on the inspection table 152. The inspection table 152 has a plurality of inspection postures such as the glass substrate 30, for example, a horizontally long posture, a right turning posture, and a left turning posture, and a component mounting surface upward posture with the component mounting surface facing upward. It can be set in any of six postures by a combination with the component already mounted surface downward orientation with the component already mounted surface facing downward.

  As shown by a two-dot chain line in FIG. 10, the landscape orientation of the glass substrate 30 is an orientation in which the length direction is parallel to the X axis of the inspection coordinate plane. When the inspection board 152 and the fixing device are set with the glass substrate 30 in the horizontally long posture and the component already mounted surface in the upward posture, the directions of the X and Y axes and the positive and negative directions of the design coordinate plane are: The glass substrate 30 is configured such that the glass substrate 30 is set so as to be the same as the X-axis and Y-axis directions and the positive and negative directions of the inspection coordinate plane, and is set on the inspection table 152 in a horizontally long and upward posture. The posture 30 is the same as the reference posture, and is the same as the posture when the chip 92 is mounted on the long side mounting portion 250. When the glass substrate 30 positioned in the data design posture on the design coordinate plane is placed on the inspection table 152, the X and Y axes of the design coordinate plane and the X and Y axes of the inspection coordinate plane are parallel to each other. The inspection table 152 (inspection coordinate plane) and the fixing device are provided so that the positive and negative directions are the same. Further, the right-turning posture is a posture in which the glass substrate 30 is rotated 90 degrees in a forward direction (clockwise when the glass substrate 30 is viewed from above) from a state in which the glass substrate 30 is set in the horizontally long posture. Yes, the left turning posture is a posture rotated 90 degrees in the reverse direction (counterclockwise when the glass substrate 30 is viewed from above).

  As shown in FIG. 11, the component already mounted surface downward posture is obtained by turning the glass substrate 30 upside down. The glass substrate 30 is transparent, and the ACF tape 8 includes conductive particles in which nickel is plated on the surface of the gold grains, and reduces the amount of transmission of illumination light and image forming light. The conductive particles are included in a light-transmitting tape capable of recognizing 96 at a dispersion density allowing light scattering and transmission, and the part mark 96 can be imaged via the ACF tape 8. Therefore, both the substrate mark 82 and the component mark 96 are viewed from the upper side of the glass substrate 30 (from the side opposite to the component-mounted surface) with the glass substrate 30 turned upside down and the component-mounted surface facing downward. Can be seen through, and can be imaged for inspection. In the present embodiment, the front / back inversion is performed by the rotation of the glass substrate 30 around the Y axis of the inspection coordinate plane.

  The mounting inspection is performed by an operator operating the inspection head moving device 156 to move the inspection head 154 to image the board mark 82 and the component mark 96 and acquire their position data. The glass substrate 30 is transparent, and the substrate mark 82 provided at a position away from the portion where the chip 92 of the glass substrate 30 is mounted can be seen from the front side or the back side of the glass substrate 30. The main body 94 is opaque, and the component mark 96 can be seen only from the side of the chip 92 on the side where the chip 92 is mounted. When the chip 92 is mounted on the glass substrate 30, The component mark 96 is seen through the glass substrate 30 and the ACF tape 8 from the back side (the side opposite to the component mounting surface). Therefore, at the time of inspection, the liquid crystal panel 28 is reversed and set on the inspection table 152.

  In the present embodiment, the mounting inspection is performed by inverting the glass substrate 30 upside down and in the same direction as the chip mounting with respect to the X and Y axes. Therefore, at the time of inspecting the chip 92 mounted on the long side mounting portion 250, the glass substrate 30 is set on the inspection table 152 in a posture reversed from the horizontally long posture corresponding to the reference posture to the short side mounting portion 252. When inspecting the chip 92 mounted on the glass substrate 30, for example, the glass substrate 30 is turned to the right from the horizontally long posture corresponding to the reference posture, and is set on the inspection table 152 in a reversed posture.

  The mounting inspection is performed in a preset order, for example, the same order as the component mounting order. In the electronic circuit component mounting machine, the component mounting order is set by the component mounting program. Therefore, as shown in FIG. 13A, the operator displays the component mounting sequence number, the component name, the mounting position coordinate data, and the mounting position deviation data on the display screen 124 of the electronic circuit component mounting machine. The inspection head 154 is moved according to the position coordinate data.

  In this embodiment, the mounting position related data, which is position related data, includes mounting position coordinate data and mounting position deviation data. Based on the inspection of the component mounting state, in this embodiment, the mounting position deviation is described later. The data is corrected. The mounting position coordinate data displayed on the display screen 124 is design mounting position coordinate data which is mounting position data created on the design coordinate plane, and the mounting position deviation data is corrected corrected mounting position deviation data. When the chip 92 is mounted on the glass substrate 30, mounting position coordinate data that can be mounted by canceling the mounting position shift is obtained based on the design mounting position coordinate data and the corrected mounting position shift data. In this embodiment, the mounting position correction data includes design mounting position coordinate data and corrected mounting position deviation data. The data displayed on the display screen 124 is created based on the component mounting program excluding the mounting position deviation data, and is stored in the RAM 104 of the computer 106 including the corrected mounting position deviation data. Display data that is displayed for inspection and mounting position correction, and is also used to acquire mounting position coordinate data for canceling mounting position deviation, and is used to obtain mounting position coordinate data that has been canceled. Is done.

  On the display screen 124, as an initial display, as shown in FIG. 13A, the display data itself, that is, the X, X of design mounting position coordinate data, which is mounting position coordinate data created on the design coordinate plane, is displayed. The Y coordinate value and the like are displayed. Further, when the mounting inspection is performed for the first time after the mounting of the chips 92 on the plurality of glass substrates 30, the mounting position deviation is 0, and 0 is displayed as the X and Y coordinate values. FIG. 13A shows a state where the mounting position deviation has already been acquired and input.

  The display screen 124 also displays images of the glass substrates 30 and 130 and the chip 92. These are also displayed as an initial display of an image of the glass substrates 30 and 130 in the reference posture and an image of the chip 92 mounted on the glass substrate 30. As described above, the reference posture of the glass substrate 30 is a posture when the chip 92 is mounted on the long-side mounting portion 250, and is the same posture as the posture on the design coordinate plane. The orientation is an orientation in which the vertical direction is parallel to the X axis of the electronic circuit component mounting machine) and the orientation in which the front and back are not reversed (the orientation in which the component already mounted surface is directed upward). A mounting order is attached to the image of the chip 92. The display screen 124 further displays a reference point set at a corner of the glass substrate 30, for example, an X axis, and a Y axis. By scrolling the display screen 124, a plurality of display data is sequentially displayed in the order of chip mounting.

  First, the mounting inspection of the chip 92 mounted on the long side mounting portion 250 of the glass substrate 30 will be described. At the time of this inspection, the liquid crystal panel 28 is turned upside down from the horizontally long posture around the Y axis, and the part mounting surface is set on the inspection table 152 in a downward posture. Therefore, the operator causes the display screen 124 to display the mounting position related data and the image of the glass substrate 30 and the like in a state where the glass substrate 30 is reversed from the reference posture. In this case, the operator scrolls the display screen 124 and designates the mounting position related data set for the long side mounting unit 250 among all the mounting position related data, that is, data of sequence numbers 1 to 4. Instruct the mounting position related data and the reverse of the image of the glass substrate 30 or the like. As shown in FIG. 13 (a), the display screen 124 displays all coordinate conversion types together with the mounting position related data and the like. In the present embodiment, there are three types of coordinate conversion: reverse (inverted by turning around the Y axis), right turn and left turn, and the absolute value of the turn angle is 90 degrees in this embodiment. . The operator uses the input device 114 to select the type of coordinate transformation from which the placement position related data that matches the posture of the glass substrate 30 set on the examination table 152 is obtained from the displayed types of coordinate transformation. Instruct. Here, the execution of turning over is instructed, and as shown in FIG. 13 (b), coordinate conversion is performed for reversing the front and back by rotating the mounting position related data around the Y axis, and the image of the glass substrate 30 or the like is reversed. Displayed.

  In this embodiment, the design coordinate plane on which the mounting position coordinate data is created constitutes a first coordinate plane, and the first coordinate plane and coordinate conversion data obtained by performing coordinate conversion on the data on the first coordinate plane are In the present embodiment, the obtained second coordinate plane is such that the X-axis and the Y-axis are both parallel to each other, and the positive and negative directions are the same for each of the X-axis and the Y-axis. In addition, the coordinate conversion is performed so that the reference point of the glass substrate 30 that has been turned upside down coincides with the origin of the second coordinate plane. For this reason, the Y coordinate value of the mounting position coordinate data remains unchanged, but the X coordinate value is a value obtained by reversing the sign of the sign.

  On the display screen 124, the reference point, the X axis, and the Y axis are displayed in accordance with the glass substrate 30 that is turned upside down. These X-axis and Y-axis are the X-axis and Y-axis of the second coordinate plane, but are parallel to the X-axis and Y-axis of the first coordinate plane and have the same positive and negative directions. The inspection coordinate plane is the same coordinate plane, and the attitude of the image of the glass substrate 30 or the like displayed on the display screen 124 and the attitude of the glass substrate 30 set on the inspection table 152 coincide with each other. The inspection head 154 can be easily moved in accordance with the mounting order while viewing the display 124, and the inspection imaging device 400 can image the chip 92. In this embodiment, the design coordinate plane constitutes the first coordinate plane. As described above, the design coordinate plane and the inspection coordinate plane are parallel to each other in the X and Y axes, and the positive and negative directions are the same. Therefore, the second coordinate plane and the inspection coordinate plane are the same coordinate plane, and the glass substrate 30 is positioned in the same orientation as the orientation on the inspection coordinate plane on the second coordinate plane.

  In this embodiment, the operator performs inching operation of the motors 176 and 178 by the input device 158 to move the X-axis slide 170 and the Y-axis slide 172, and moves the inspection head 154 onto the chip 92 to be inspected. The imaging is performed by simultaneously imaging the board mark 82 and the component mark 96 that are close to each other by the inspection imaging device 400. At this time, visible light and near infrared light are emitted from the visible light source 412 and the near infrared light source 414, respectively. Visible light passes through the transparent glass substrate 30 and is irradiated onto the substrate mark 82. Reflected light from the substrate mark 82 passes through the glass substrate 30, is bent horizontally by the prism 416, and passes through the half mirror 418. Then, the light enters the inspection imaging device 400. The illumination by the visible light source 412 is coaxial with the optical axis of the inspection imaging device 400, and the substrate mark 82 is irradiated with visible light vertically, so that an image of the substrate mark 82 is formed by the illumination light by the coaxial incident illumination, The board mark 82 is clearly imaged by the inspection imaging device 400.

  Near-infrared light emitted from the near-infrared light source 414 passes through the glass substrate 30 and the ACF tape 8 and is radiated to the component mark 96, and image forming light reflected by the component mark 96 is ACF tape 8 and glass The light passes through the substrate 30, is bent by the prism 416, passes through the half mirror 418, and enters the inspection imaging device 400. The component mark 96 is also irradiated with visible light to form an image. The light irradiated to the component mark 96 passes through the ACF tape 8 to reach the component mark 96 and the amount of light is reduced. However, near infrared light having a long wavelength emitted from the near infrared light source 414 passes through the ACF tape 8. The component mark 96 can be sufficiently irradiated through the light. The amount of image forming light is also reduced by the ACF tape 8, but the component mark 96 is irradiated with near infrared light together with visible light, and an image is formed by both light. The component mark 96 is clearly imaged by the synergistic effect.

  The captured image data is processed by the image processing computer 218, and the images of the marks 82 and 96 are displayed on the display screen 232 as shown in FIG. In addition, although the pad etc. which were provided in the glass substrate 30 are also imaged, illustration is abbreviate | omitted. In FIG. 12A, in order to facilitate understanding of the relationship between the image of the board mark 82 and the image of the component mark 96, two board marks 82 and two component marks 96 are captured and displayed on the display screen 232. Although the displayed state is illustrated, what is actually imaged and displayed simultaneously by the inspection imaging apparatus 400 is a part of the chip 92 as shown in FIG. Only the board mark 82 and one component mark 96 in the vicinity thereof.

  On the display screen 232, as shown in FIG. 12B, four cursors CX1, CX2, CY1, and CY2 are displayed together with an image of the chip 92 and the like. The cursors CX1 and CX2 are straight lines parallel to the Y axis, and the cursors CY1 and CY2 are straight lines parallel to the X axis, and are displayed on the full display screen 232. The operator can move the cursors CX1 and CX2 to arbitrary positions in the X-axis direction and the cursors CY1 and CY2 to arbitrary positions in the Y-axis direction by operating the input device 158, respectively.

  The operator aligns the cursors CX1 and CX2 with the center of the board mark 82 and the center of the component mark 96 as shown in FIG. The display screen 232 displays two cursors and a display for distinguishing them, for example, CX1 and CX2 as cursor names, and which of the cursors CX1 and CX2 is aligned with the board mark 82 and the component mark 96. Is preset and instructed to the operator. Here, the cursor CX1 is set to the board mark 82, and the cursor CX2 is set to the component mark 96. Further, the operator aligns the cursors CY1 and CY2 with the center of the board mark 82 and the center of the component mark 96, respectively, and instructs acquisition of the position. The cursor CY1 is aligned with the board mark 82, and the cursor CY2 is aligned with the component mark 96. The position of the cursor is the mark position, and the inspection computer 210 determines the positions of the cursors CX1, CX2, CY1, and CY2 in the X-axis and Y-axis positions of the board mark 82 and the component mark 96 (on the inspection coordinate plane). As coordinate values), it is stored in the RAM 204 in association with data for specifying the chip 92, for example, the sequence number of mounting. The sequence number is obtained by operator input. In the present embodiment, since the imaging is performed in the mounting order, the imaging order is also the mounting order, and the position data may be stored in association with the imaging order. Further, each position data in the X-axis and Y-axis directions is stored with mark identification data indicating which position data is the board mark 82 or the component mark 96.

  If the positions of one set of the board mark 82 and the component mark 96 are acquired, the operator moves the inspection head 154 by inching operation of the motors 176 and 178, and as shown in FIG. The set of board marks 82 and component marks 96 are imaged by the inspection imaging device 400 and displayed on the display screen 232. Then, the cursors CX1, CX2, CY1, and CY2 are aligned with the board mark 82 and the component mark 96 to instruct the acquisition of the position, and each position data of the acquired board mark 82 and the part mark 96 is one set of board marks. 82 and part mark 96 are stored in the RAM 204 together with position data.

  The operator sequentially moves the inspection head 154 in accordance with the mounting order to pick up an image of the chip 92 and acquire the positions of the board mark 82 and the component mark 96. If the positions of the marks 82 and 96 are acquired for all the chips 92 mounted on the long side mounting section 250, the position data stored in the RAM 204 is converted into light as a recording medium by the data reading / writing device 220. The data is written on the magnetic disk and input to the mounting control computer 106.

A mounting inspection of the chip 92 mounted on the short side mounting section 252 of the glass substrate 30 will be described.
In this case, for example, the operator turns the glass substrate 30 upward from the horizontally long posture, and then sets the glass substrate 30 on the inspection table 152 in a state where the glass substrate 30 is turned upside down around the Y axis. Then, the operator turns the glass substrate 30 on the display screen 124 of the electronic circuit component mounting machine to the right from the initial display posture shown in FIG. An image of the glass substrate 30 or the like is displayed, and the inspection head 154 is moved by inching operation of the motors 176 and 178 while viewing the display screen 124, and the substrate mark 82 and the component mark 96 are placed on the inspection image pickup device 400. Images are taken in order of wearing.

  In this case, the operator selects “turn right” on the display screen 124 and instructs execution, and then selects “turn over” and instructs execution. The operator scrolls the display screen 124 and, as shown in FIG. 14A, is mounting position related data set for the chip 92 mounted on the short side mounting section 252 and includes sequence numbers 5 and 6. Display data related to the mounting position of the. Then, the mounting position related data is designated, and “right turn” is selected and execution is instructed. As a result, as shown in FIG. 14B, the right-turning coordinate conversion is performed on the mounting position related data and displayed, and the image of the glass substrate 30 and the like is also turned right and displayed. Also in this case, the first coordinate plane and the second coordinate plane are such that the X-axis and the Y-axis are parallel to each other, and the positive and negative directions are the same for each of the X-axis and the Y-axis, Coordinate conversion is performed so that the reference point of the glass substrate 30 turned rightward coincides with the origin of the second coordinate plane. Therefore, the Y coordinate value before the right turn becomes the X coordinate value after the turn, and a value obtained by inverting the sign of the X coordinate value before the right turn (by multiplying the X coordinate value before the turn by -1). Coordinate conversion is performed in which the value obtained is the Y coordinate value after turning right.

  Further, in the state where the mounting position related data of sequence numbers 5 and 6 are designated, “turn over” is selected and an execution instruction is performed. As a result, as shown in FIG. 15, the mounting position related data that has been subjected to the coordinate transformation for reversing the front and back in addition to the right turn is displayed on the display screen 124 and an image of the glass substrate 30 or the like is displayed. Also in this case, the first and second coordinate planes are such that the X-axis and the Y-axis are parallel to each other, and the positive and negative directions are the same for each of the X-axis and the Y-axis. Coordinate conversion is performed so that the reference point of the substrate 30 coincides with the origin of the second coordinate plane. The Y-coordinate value is not changed with respect to the right-turned mounting position related data shown in FIG. 14B, and coordinate conversion is performed in which the sign of the X-coordinate value is reversed, as shown in FIG. For the mounting position related data in the initial state, the value obtained by inverting the sign of the Y coordinate value becomes the X coordinate value after turning right and turning the front and back, and the sign of the X coordinate value is inverted. Coordinate conversion is performed so that the value becomes the Y coordinate value after turning right and turning upside down. The coordinate conversion may be instructed to be executed collectively after selecting the right turn and the reverse, and the attachment-related position data and image in the middle, that is, the attachment position-related data by the right-turn coordinate conversion and The image may not be displayed, and only the final mounting position related data or the like, that is, only the mounting position related data and the image that are turned upside down after turning right may be displayed on the display screen 124.

  In this manner, the display position 124 displays the mounting position related data and the image such as the glass substrate 30 that have been subjected to the right-turning and front-back reversal coordinate conversion. , The component mark 96 and the board mark 82 of the chip 92 mounted on the short side mounting section 252 are imaged by the inspection imaging device 400, and the position is acquired. The acquired position is stored in the RAM 204 in association with the sequence number and the mark identification data, and written to the magneto-optical disk after the inspection is completed.

  If the mounting inspection is performed for all the chips 92 mounted on the glass substrate 30, the operator causes the data reading / writing device 116 of the mounting control computer 106 to read the magneto-optical disk on which the position data is written. Then, the position data of the marks 82 and 96 are input to the mounting control computer 106 and the calculation of the mounting position deviation for each of the plurality of chips 92 mounted on the glass substrate 30 is instructed. For each chip 92, the X-axis and Y-axis coordinate values of two board marks 82 and component marks 96 are stored, and the mounting control computer 106 averages the X-coordinate values of the two board marks 82. The average value of the value and each Y coordinate value is calculated, and the X and Y coordinate values of the component mounting position are obtained. Further, the average value of the X coordinate values and the average value of the Y coordinate values of the two component marks 96 are calculated, and the X and Y coordinate values of the center position of the chip 92 are obtained. Then, the deviation of the center position of the chip 92 from the component mounting position is obtained, and the mounting position deviation is obtained. The rotational position error may be obtained and corrected.

  If the mounting position deviation is calculated for all the chips 92, the operator prints the mounting position deviation data by the printer 126. The position of the board mark 82 and the like is stored in association with the mounting sequence number, and the mounting sequence number is printed together with the mounting position shift data, and the operator views the mounting position shift data of the mounting position related data while looking at it. Correct it. An operator may input an inspection posture at the time of inspection, and may be stored and printed together with the positions of the marks 82 and 96 and displayed to the operator.

  This correction is performed in the electronic circuit component mounting machine. The operator displays the mounting sequence number, the part name, the mounting position coordinate data, the mounting position shift data, and the images of the glass substrates 30, 130 and the chip 92 on the display screen 124, and corrects the mounting position shift data. The mounting inspection is performed on the long side mounting portion 250 by turning the glass substrate 30 upside down from a horizontally long posture, and the mounting position deviation data is data obtained in that state. Therefore, when the worker corrects the mounting position related data set for the long side mounting unit 250, the worker selects the mounting position related data of sequence numbers 1 to 4 and displays the coordinates displayed on the display screen 124. Among the types of conversion, select the inside out and instruct the execution. As a result, the display screen 124 is switched as shown in FIG. 13B, and the mounting position coordinate data and the mounting position deviation data, which are mounting position related data, are converted and displayed, and an image of the glass substrate 30, etc. Is displayed reversed.

  Then, the operator corrects the mounting position deviation with the input device 114 while viewing the printed mounting position deviation. Here, the correction of the mounting position deviation is not to cancel the mounting position deviation, but to update the latest mounting position deviation that has actually occurred and is a deviation from the design mounting position coordinates. At the time of correction, the value of the mounting position deviation obtained by the inspection can be used as it is, and the correction can be performed quickly without considering the posture of the glass substrate 30 at the time of inspection. As described above, the second coordinate plane and the inspection coordinate plane are the same coordinate plane, both the X axis and the Y axis are parallel, and the positive and negative directions of the X axis and the Y axis are the same. This is because the glass substrate 30 is turned upside down in any coordinate plane. These mounting position shifts in the coordinate plane are not shifts in the state where the glass substrate 30 is in the reference posture, but are not shifts in the reference coordinate plane set for the electronic circuit component mounting machine. Therefore, the glass substrate 30 is automatically displaced in the reference posture, and the long side mounting portion 250 is displaced at the time of component mounting. It is not necessary to convert the mounting position deviation in the posture state, and correction can be performed easily and without mistakes. When the mounting inspection is performed for the first time and the mounting position coordinate data is corrected for the first time, the operator may input the acquired mounting position deviation as it is. When the mounting inspection is performed for the second time or later, the operator inputs a value obtained by adding the acquired mounting position deviation to the already inputted and displayed mounting position deviation. This calculation can be easily performed by adding the acquired value as it is to the displayed value. The first input of the mounting position deviation is correction of zero mounting position deviation. FIG. 13B shows a state in which the mounting position deviation is input.

  When the correction of the mounting position deviation is completed, the operator instructs execution of inverse coordinate conversion. In the present embodiment, the type of coordinate transformation that has been executed is selected again, and execution is instructed to instruct execution of inverse coordinate transformation of that coordinate transformation. As a result, the design mounting position coordinate data and the corrected mounting position deviation data, which is the corrected mounting position deviation data, are subjected to inverse coordinate conversion, and as shown in FIG. 13A, the initial display data, that is, the glass substrate 30 is set to the reference posture. It is data in a certain state, and the long side mounting portion 250 is displayed as data at the time of component mounting. Further, the deviation-removed mounting position coordinate data acquisition data including the corrected and reverse-converted mounting position correction data is replaced with the deviation-removed mounting position coordinate data acquisition data before the mounting position deviation correction, and is stored in the RAM 104. Used when wearing.

  The mounting position related data set for the short side mounting unit 252 is similarly corrected by the operator. In this case, the operator designates the mounting position related data of sequence numbers 5 and 6 and, at the same time as the mounting inspection, first selects “right turn”, instructs execution, and coordinates for right turn. Let the conversion take place. After that, in the state where the mounting position related data of sequence numbers 5 and 6 are designated, “inside out” is selected, execution is instructed, the right turn coordinate conversion is performed, and the mounting position in which the reverse coordinate conversion is performed is performed. The related data and the image of the glass substrate 30 or the like are displayed, and the mounting position deviation data subjected to coordinate conversion is corrected. Also in this case, the second coordinate plane and the inspection coordinate plane are the same coordinate plane, and the mounting position related data and the image of the glass substrate 30 are displayed on the display screen 124 in the same state as at the time of the inspection. Is a printed mounting position deviation, and the mounting position deviation obtained by the inspection can be used as it is to correct the mounting position deviation.

  If the execution of reverse coordinate conversion is instructed after correction, the mounting position coordinate data and the mounting position deviation data are automatically converted into data that is not subjected to coordinate conversion by turning right and turning upside down, as shown in FIG. Thus, it is automatically converted into mounting position coordinate data and corrected mounting position deviation data on the first coordinate plane. Inverse coordinate conversion is performed by selecting reverse and right turn again in the reverse order of the coordinate conversion and instructing execution. Then, the deviation-removed mounting position coordinate data acquisition data including the mounting position related data that has been corrected and reversely converted is replaced with the data before correction, stored in the RAM 104, and used at the time of component mounting.

  At the time of component mounting, the deviation-removed mounting position coordinate data acquisition data for the chip 92 currently performing the mounting operation is read from the component mounting sequence number, and the design mounting position coordinate data is corrected based on the corrected mounting position shift data. Then, the mounting head 350 is moved by the mounting head moving device 352 according to the correction data, and the chip 92 is mounted. As described above, the positional deviation obtained by the inspection after mounting the component is a positional deviation that occurs in common even if the chip 92 and the glass substrate 30 are different from each other, and the design mounting position coordinate data so that the positional deviation is canceled out. Is corrected and mounted, the chip 92 is mounted on the glass substrate 30 with high accuracy.

  In this case, the deviation-removed mounting position coordinate data acquisition data acquired for the long-side mounting unit 250 is used as it is, but the data acquired for the short-side mounting unit 252 is 90 ° right-turn coordinate conversion. Done and used. When the chip 92 is mounted on the short side mounting portion 252, the glass substrate 30 is rotated 90 degrees to the right so that the short side mounting portion 252 is in the X-axis direction of the reference coordinate plane of the electronic circuit component mounting machine. It is because it is made to become parallel with.

As described above, the design data is created in the same posture for all the chips 92 mounted on the glass substrate 30, whereas the mounting inspection and the data correction are performed in the orientation and orientation in which the vertical and horizontal postures are different from those at the time of design. However, after correction, the data is returned to the data on the design coordinate plane by inverse coordinate transformation. Therefore, it is not necessary to distinguish the design data according to the posture of the glass substrate 30 at the time of mounting, and data management is easy. is there.
Further, it is not indispensable to make the vertical and horizontal orientations of the glass substrate 30 the same at the time of component mounting and mounting inspection. For example, the mounting inspection of the chip 92 mounted on the short side mounting portion 252 is performed on the long side side. Similarly to the mounting inspection of the chip 92 mounted on the mounting unit 250, the liquid crystal panel 28 may be mounted in an upside-down orientation from the horizontally long orientation. Regardless of the posture of the glass substrate 30 at the time of acquisition of the mounting position deviation, correction is performed in the same posture as at the time of acquisition, and after the correction, the inversely converted data causes the mounting posture that caused the mounting position deviation. This is because the mounting position deviation can be corrected if it is used for mounting the component in the same posture. The same applies to the upper and lower (front and back) orientations of the substrate to be inspected.

While the glass substrate 30 is turned left and the front and back are reversed, the inspection and the mounting position deviation may be corrected. However, they are inspected and corrected while the glass substrate 30 is turned right and reversed. Since it is performed in the same way except for the case where the positive and negative signs of the X coordinate value and the Y coordinate value are reversed, illustration and description are omitted.
Further, depending on the posture of the glass substrate 30 set on the inspection table 152, coordinate conversion of right turn or left turn may be performed a plurality of times.

  The case where the mounting position deviation data is corrected based on the mounting inspection and the mounting position coordinate data is corrected has been described above. However, in this electronic circuit component mounting system, the mounting position coordinate data is changed and the mounting position is related. You can also add data. For example, when the mounting position shift of the chip 92 acquired by the mounting inspection is large beyond the shift range in at least one of the X-axis direction and the Y-axis direction, for example, it is considered that the design data is incorrect. In this case, the design mounting position coordinate data itself is changed based on the mounting position deviation. The mounting position coordinate data displayed on the display screen 124 is changed, and the mounting position coordinate data of the deviation elimination mounting position coordinate data acquisition data is changed. This change is performed in a state where the mounting position related data is coordinate-converted and displayed in accordance with the posture of the glass substrate 30 at the time of inspection, which is the same as when the mounting position deviation is corrected. In addition, when the magnitude | size of the acquired shift | offset | difference contains the value below a decimal point, a mounting position coordinate should be changed using an integer part, for example, and the part below a decimal point should just be set as a mounting position shift | offset | difference. The design mounting position coordinate data of the component mounting program may also be changed.

  Further, for example, if the operator looks at the glass substrate 30 on which the chip 92 has been mounted and the chip 92 is not mounted at a position where the chip 92 is to be mounted, the mounting position related data is added and the chip 92 is mounted. To be. At the time of addition, the mounting position related data in a state where the glass substrate 30 is in the reference posture is displayed on the display screen 124, and the operator selects “add data” displayed on the display screen 124 and instructs execution. . Thereby, for example, input fields for sequence number, part name, and mounting position related data are displayed on the display screen 124, and the operator inputs data using the input device 114. At this time, the operator can input data with reference to the image of the glass substrate 30 or the like displayed on the display screen 124. When adding mounting position related data for the short side mounting section 252, data such as right-turned coordinate conversion is displayed on the mounting position related data and the like is added, and after the addition, inverse coordinate conversion is performed. Thus, the design-related mounting position related data may be used. By adding the mounting position related data or the like, the sequence number is automatically shifted for the mounting position related data after the same sequence number as the added data. The order of mounting the added chips 92 may be automatically set based on all mounting position related data including the mounting position related data. Further, the addition of data may be performed together with the correction. The mounting position related data is also added to the component mounting program, and the chip 92 is mounted at the added mounting position.

  As is clear from the above description, in this embodiment, the portion of the RAM 104 of the mounting control computer 106 that stores the design mounting position coordinate data and the mounting position deviation data constitutes the storage means, and the input device 114 inputs the data. And a coordinate conversion instructing unit, an inverse coordinate conversion instructing unit, a coordinate conversion type selecting unit, and an inverse coordinate conversion type selecting unit. The calculation is performed on the mounting position coordinate data and the mounting position deviation data according to the type, and the portion that performs coordinate conversion and inverse coordinate conversion constitutes the coordinate conversion unit and the inverse coordinate conversion unit, and the input device 114 is the component mounting position correction unit, mounting A position related data adding unit and a mounting position related data changing unit are configured. The inverse coordinate conversion unit can also be considered as a design state data return unit. The portion of the mounting control computer 106 that calculates the mounting position deviation based on the operator's instruction constitutes a mounting position deviation calculation unit, and constitutes a mounting position deviation acquisition unit as a data correction amount acquisition unit that is a data change amount acquisition unit. Can be considered. It can also be considered that the part that takes in the data read by the data reading / writing device 116 of the mounting control computer 106 constitutes a data change amount acquisition unit. Further, the table 34 and the substrate suction device provided on the table 34 constitute a substrate holding device, and the table moving device 36 and the mounting head moving device 352 constitute a relative moving device that relatively moves the substrate holding device and the mounting head 350. is doing. The mounting head 350 is a pressure head and a heating head.

The mark position data and the like may be input from the inspection computer 210 to the mounting control computer 106 by communication.
In addition, the inspection computer 210 may require a displacement of the mounting position of the chip 92. In this case, for example, a printer is provided in the mounting inspection machine 150, and the operator prints the required mounting position deviation, and corrects the mounting position deviation data in the electronic circuit component mounting machine. Alternatively, mounting position deviation data or the like may be stored in a recording medium and printed by a printer of the electronic circuit component mounting machine.

  Another embodiment of the claimable invention will be described with reference to FIGS. In this embodiment, at the time of mounting inspection, the inspection head 154 is automatically moved to the chip 92 in the mounting order based on the mounting position coordinate data and images the marks 82 and 96, and the mounting position shift is performed in the electronic circuit component mounting machine. Has been fixed automatically. In addition, data is exchanged between the electronic circuit component placement machine and the placement inspection machine via a communication line. Therefore, as shown in FIG. 16, the control device 300 of the electronic circuit component mounting machine is configured mainly by the mounting control computer 302 as in the case of the control device 24, but the input / output interface 108 is connected to the component mounting inspection. The inspection computer 312 which is the main body of the machine control device 310 is connected by a communication line. As shown in FIG. 17, the mounting control computer 302 is also connected to the input / output interface 212 of the inspection computer 312 of the control device 310 of the component mounting inspection machine via a communication line. Further, the inspection imaging device 316 and the illumination device 318 of the component mounting inspection machine are configured in the same manner as the inspection imaging device 400 and the illumination device 402, but in this embodiment, two component marks 96 and two board marks are provided. It is supposed that 82 can be simultaneously illuminated and imaged.

  Designed mounting position coordinate data and mounting order data are input to the inspection computer 312 from the mounting control computer 302 through communication and stored in the RAM 204. In the component mounting inspection machine 150, mounting position coordinate data is read in the order of component mounting positions, and the inspection head 154 is automatically moved onto the chip 92 that is the imaging target. As described above, the glass substrate 30 is set on the inspection table 152 in various postures, and the position of the reference point of the glass substrate 30 in the inspection coordinate plane changes according to the posture. Therefore, for example, after setting the glass substrate 30 on the inspection table 152 in the same posture as the reference posture, the operator moves the inspection head 154 to the reference point of the glass substrate 30 by the inching operation of the motors 176 and 178, and the inspection imaging apparatus. In 316, the reference point is imaged and the inspection computer 312 is made to acquire the position of the reference point using the cursor. Alternatively, a positioning device for positioning the glass substrate 30 on the inspection table 152 and two sides orthogonal to each other in the reference point in the X-axis direction and the Y-axis direction is provided, and the position of the reference point is determined based on the positioning position of the glass substrate 30 by the positioning device. To be acquired. You may acquire the position of a reference point in the state set to the inspection posture. The moving position of the inspection head 154 is obtained based on the position of the reference point of the glass substrate 30 in the inspection coordinate plane, the design mounting position coordinate data, and the inspection posture of the glass substrate 30. The inspection posture of the glass substrate 30 is input by an operator. At this time, the inspection computer 312 converts the design mounting position coordinate data based on the inspection posture of the glass substrate 30 and obtains the movement position of the inspection head 154. This coordinate conversion may be performed by the mounting control computer 302 and supplied to the inspection computer 312.

  After the inspection head 154 moves, the chip 92 is imaged and enlarged and displayed on the display screen 232. The operator aligns the cursors CX1, CX2, CY1, and CY2 with the board mark 82 and the component mark 96, respectively, and the inspection computer 312. In the same manner as in the above embodiment, the positions of the two substrate marks 82 in the X-axis and Y-axis directions and the positions of the two component marks 96 in the X-axis and Y-axis directions are acquired. Of the two board marks 82 and component marks 96, the cursor is moved to obtain the position of one set of adjacent board marks 82 and component marks 96, and then the other set of board marks 82 and component marks 96 is set. Place the cursor on to get the position. The acquired positions of the board mark 82 and the component mark 96 are stored in association with the mounting order and the mark identification data. Thus, when the positions of the marks 82 and 96 are acquired, the operator displays the image of the mounting sequence number, the part name, the mounting position related data and the glass substrate 30 on the display screen 124 of the electronic circuit component mounting machine. It is displayed in a state in accordance with 30 inspection postures. If the inspection is performed in a posture in which the glass substrate 30 is turned upside down from the horizontally long posture, the operator instructs the coordinate conversion by turning it over, whereby the coordinate-converted mounting position related data and the glass substrate turned upside down. 30 images are displayed on the display screen 124. For example, the operator gives an instruction for imaging while checking the display screen 124 to determine which chip 92 is to be subjected to the mounting inspection. Can do. If one chip 92 is imaged and the positions of the board mark 82 and the component mark 96 are acquired, the operator is instructed to image the next chip 92 and acquire the positions of the marks 82 and 96, thereby inspecting. The head 154 is automatically moved to the chip 92 based on the mounting order and mounting position coordinate data, and imaging is performed by the inspection imaging device 316.

  If the positions of each of the substrate marks 82 and the component marks 96 in the X-axis and Y-axis directions for all the chips 92 are acquired, the mark position data, the mounting order data, and the attitude of the glass substrate 30 at the time of inspection. Data is supplied and input to the mounting control computer 302 by communication. The mounting control computer 302 obtains the mounting position deviation of the chip 92 based on the input mark position data, and corrects the mounting position deviation data stored in the RAM 104 as a part of the data for acquiring the position canceling mounting position coordinate data. . The mounting position deviation correction work performed by the operator in the above embodiment is automatically performed by the mounting control computer 302.

  At this time, the correction of the mounting position deviation data is performed according to the posture of the glass substrate 30 at the time of mounting inspection. If the mounting position deviation is acquired in a posture in which the glass substrate 30 is reversed from the landscape orientation, the mounting position deviation data subjected to the reverse coordinate conversion is corrected by the acquired mounting position deviation. . After the correction, the inverse coordinate conversion is automatically performed, and the mounting position coordinate data and the corrected mounting position deviation data are used as data for the glass substrate 30 in the reference posture. Inverse coordinate transformation may be performed based on an instruction to perform inverse coordinate transformation by the operator.

  In the present embodiment, the data is acquired by the operator by causing the component mounting inspection machine 150 to obtain the position of the cursor CX1, CX2, CY1, CY2 by aligning the marks 82, 96 with the cursor CX1, CX2, CY1, CY2. An input device 158 that is a change operation for moving the cursors CX1, CX2, CY1, and CY2 constitutes a data change unit. A data changing unit is provided on the mounting inspection machine 150 side. Further, the RAM 104 of the mounting control computer 302 constitutes a storage means, and when correcting the mounting position deviation data, the coordinate conversion of the mounting position related data in accordance with the inspection posture of the glass substrate 30 is instructed. And the coordinate conversion unit, and after correction, the inverse coordinate conversion is instructed, and the part to be executed constitutes the inverse coordinate conversion instruction unit and the inverse coordinate conversion unit, which together with the data changing unit on the component mounting inspection machine 150 side A mounting position related data converter is configured. In this embodiment, both the coordinate conversion instruction and the inverse coordinate conversion instruction are automatically performed.

  It can be considered that the portion of the mounting control computer 302 that receives the mark position data constitutes a data receiving unit as a data changing unit, and mounting position deviation data stored as mounting position related data based on the mark position data It can also be considered that the part that corrects the component constitutes the component mounting position correcting unit and the data changing unit. In these cases, the data change is automatically performed, and the entire mounting position related data conversion device is provided on the electronic circuit component mounting machine side. At this time, if the operator thinks that the operation of aligning the cursors CX1, CX2, CY1, and CY2 with the two board marks 82 and the component mark 96 is also part of the data changing unit, the data changing unit is mounted with the electronic circuit component. It is provided across both the machine and the component mounting inspection machine 150. Further, it can be considered that the portion of the mounting control computer 302 that receives the mark position data from the inspection computer 312 constitutes a data correction amount acquisition unit as a data change amount acquisition unit, and the mounting position is determined based on the mark position data. It can be considered that the portion for obtaining the deviation constitutes a data correction amount acquisition unit as a data change amount acquisition unit, and the data correction amount acquisition unit constitutes a part of the component mounting position correction unit. You can also The mounting position deviation based on the mark position data may be calculated by the inspection computer 312 and supplied to the mounting control computer 302 by communication. In this case, it can be considered that the part for calculating the mounting position deviation of the inspection computer 312 also constitutes a part of the data changing unit, and the part for receiving the mounting position deviation of the mounting control computer 302 serves as the data receiving unit as the data changing unit. It can also be considered that the data change amount acquisition unit is configured.

  The inspection head 154 is automatically moved to the next chip 92 where the positional deviation is acquired every time the chip 92 is imaged and the cursor is placed on the marks 82 and 96 and the positional deviation is acquired. You may do it.

  The mounting position-related data conversion device of each of the above embodiments can be used for various data conversions such as data conversion when a mounting position deviation is acquired without turning the component mounting board upside down. For example, if the component mounting inspection can be performed from the front side (component mounting surface side of the component mounting board), the component mounting surface is in an upward orientation and the component mounting board is in a landscape orientation, Inspection is performed in a right-turned or left-turned posture from a horizontally long posture with the part mounting surface facing upward, and coordinate conversion, inverse coordinate conversion, and data change are made to the mounting position related data converter according to the posture. To do. For example, even if the component mounting board is opaque and it is not possible to see through the components provided on the component mounting surface or the mounted electronic circuit components from the back side, inspection is performed from the component mounting surface side to detect misalignment. You may be able to get it. For example, when an electrode is provided on the body of an electronic circuit component so that it can be recognized from the component mounting surface side, a mark is provided on the surface opposite to the component mounting surface side of the body of the electronic circuit component, and the mark is mounted on the component When the lead can be recognized from the surface side, or when the lead is provided to protrude sideways from the body, the electrodes, marks and leads are connected from the component mounting surface side with the electronic circuit component mounted on the component mounting board. It is possible to recognize, and it is possible to acquire a mounting position shift based on the recognition, or to acquire a mounting position shift based on the position of the component mark and the board mark. It is also possible to take an image of the main body of the electronic circuit component, find its position, and compare it with the normal position to find the mounting position deviation. If the electronic circuit component main body is transparent, for example, if the electronic circuit component is an FPC board and the main body is transparent, the component mark provided on the mounting surface of the component mounting substrate is the mounting surface. It can also be recognized from the opposite side. The mounting position related data conversion device includes an electronic circuit component mounting machine for mounting electronic circuit components on a transparent component mounting board, and an electronic circuit component mounting machine for mounting electronic circuit components on an opaque component mounting board. It is provided in various electronic circuit component mounting machines such as an electronic circuit component mounting machine to perform data conversion. The mounting inspection can be performed, for example, in a state of turning right or turning left from a horizontally long posture, or in a state of performing right turn or left turn a plurality of times. When the positional deviation can be obtained in this manner, even if the component mounting board is transparent, the positional deviation is acquired from the component mounting surface side of the component mounting board without reversing the front and back, and the position related data is based on that. Can be changed.

If the component mounting board is transparent and the electrode or lead of the component can be recognized through the connection material such as the circuit pattern and ACF, the mounting position deviation is inspected by inverting the component mounting board. At this time, the positional deviation may be detected based on the recognition (imaging) of the circuit pattern and the electrodes or leads. Circuit patterns and the like are used as board marks and component marks.
Even when the position-related data conversion device is provided in a work system other than the electronic circuit component mounting system, the coordinate conversion can be performed in various modes according to the characteristics of the coordinate conversion object, the contents of the work, and the like.

  Further, the correction of the mounting position related data may be performed every time a mounting position shift is detected. For example, when correction is performed by an operator, the mounting position deviation is calculated and displayed each time two component marks and reference mark positions are obtained for each electronic circuit component in the mounting inspection machine. Look at it and make corrections. Alternatively, it is displayed each time one mounting position deviation is calculated in the mounting control computer, and is corrected by the operator. When correction is performed automatically, for example, data exchange between the mounting control computer and the inspection computer is always performed by communication, and each time mark position data is acquired, the data is sent from the inspection computer to the mounting control computer. Thus, the mounting position deviation is obtained and corrected. If the inspection and correction are performed on the same computer, data transmission is not necessary.

  The inverse coordinate transformation may be performed collectively after all the mounting position related data has been changed, and is performed each time the mounting position related data is changed by one or a plurality of preset data. It may be broken.

  Further, the inverse coordinate conversion may be performed by, for example, displaying a display of “inverse coordinate conversion” together with the type of coordinate conversion on the display screen, and performing the selection and execution instructions, or enter the display screen. Display, end display, or return display to initial display is provided, and after data input, enter or end or initial display is selected, and execution is instructed to execute reverse conversion. It may be.

  Further, the mounting position coordinate data may be directly corrected based on the acquired mounting position deviation.

  Alternatively, the mounting position deviation cancellation data may be displayed instead of the mounting position deviation, and the mounting position deviation cancellation data may be updated and displayed based on the detected mounting position deviation.

  Further, if the reference point of the component mounting board, the X axis, and the Y axis are displayed on the display screen, it is easy for the operator to understand. However, the display is not essential, and at least one display may be omitted.

  Furthermore, a mounting position related data conversion device may be provided in the component mounting inspection machine. In this case, necessary data such as deviation-removed mounting position coordinate data acquisition data or the like is input to the inspection computer by using a recording medium or communication, and a program for coordinate conversion and inverse coordinate conversion is provided in the inspection computer. In addition, two display screens are provided, or one display screen can be divided into two, and a mounting inspection is performed while displaying a picked-up board mark or the like on one side and displaying mounting position related data on the other side. After the inspection, the mounting position deviation is corrected automatically or manually while displaying the mounting position related data and the like on the display screen. The corrected data is recorded on a recording medium or input to the mounting control computer by wireless or wired communication.

  Furthermore, a storage means may be provided in the electronic circuit component mounting machine, and other components of the position-related data conversion device such as a coordinate conversion instruction unit may be provided in another device such as a mounting inspection machine. In this case, the results of coordinate transformation, data change and inverse coordinate transformation performed in another device are returned to the electronic circuit component mounting machine, and the storage of the storage means is updated.

  Furthermore, in the component mounting inspection machine, when the inspection head is automatically moved to the mounting component and the image pickup apparatus picks up the board mark and the component mark, only the one board mark and the component mark located close to each other are present. You may make it image simultaneously. In this case, the position data of the board mark is supplied from the mounting control computer to the inspection computer together with the component mounting data including the design mounting position coordinate data and the component mark arrangement position data in the electronic circuit component, and the moving position of the imaging device based on them. Is required. The imaging apparatus simultaneously images one of the two component marks provided for the mounted component and the board mark adjacent to the component mark, and then automatically captures the other component mark and the board mark adjacent to the component mark. The component mark and the board mark are imaged more clearly.

  Moreover, although ACF was supposed to contain a thermoplastic resin film in the said Example, it may contain a thermosetting resin film.

  Further, the ACF tape may be individually attached to each of at least one component mounting position set on the component mounting board.

  Moreover, when affixing the ACF tape to the component mounting substrate, the substrate mark and the part corresponding to the component mark of the component mounting substrate may be removed and affixed so as not to cover them. By doing so, the part mark is imaged without going through the ACF tape, and the lighting device is a device including only a visible light source, or the part mark is recognized even when the ACF tape does not allow light transmission. can do.

  Further, when the electronic circuit component is bonded to the component mounting board using the ACF, the temporary pressure bonding and the main pressure bonding may be performed on one working machine.

Further, the component mounting board is not limited to a glass substrate, FPC board (Flexible Printed Circuit Board, flexible printed circuit board) may even like, various substrates are the coordinate transformation object. A flexible printed circuit board is a printed wiring board in which a conductor pattern is formed on a flexible and insulating film. For example, a transparent polyimide resin or polyester having heat resistance and flexibility and insulation. A conductor pattern is formed on a resin film and an electronic circuit component such as a flip chip is mounted. The FPC board may be mounted on the glass substrate as an electronic circuit component, and the mark provided on the FPC board and the mark provided on the glass substrate can be imaged, and the mounting position deviation can be acquired and corrected. A mounting position related data converter can be used for the acquisition and correction. Further, the electrodes of the electronic circuit component and the electrodes of the component mounting substrate are not limited to the connection method using the ACF tape, and can be connected by, for example, a molten solder bonding method or a metal bonding method. The molten solder bonding method is a method of melting the solder and electrically joining the electrode terminals to each other. For example, cream solder is applied to the electrode terminals of the component mounting board, and the electrode terminals of the electronic circuit component are applied onto the applied solder. Is heated and melted in a state of mounting, or is heated and melted in a state where solder bumps provided on the electronic circuit component are in contact with the electrode terminals of the component mounting board. The metal bonding method is a method of bonding by bringing metal electrode terminals, for example, gold, into direct contact with each other and applying pressure and ultrasonic vibration. There is also a method of connection using light or thermosetting resin. As these component connection methods, an appropriate method is selected according to the type and characteristics of the component mounting board and the electronic circuit component. For example, the molten solder bonding method is excellent in heat resistance and is suitable for joining electrode terminals on a component mounting board that can withstand the heat during melting of the solder. For example, a flexible printed wiring board is made of a heat-resistant resin. It can be used for joining electronic circuit components. When the base material of the flexible printed wiring board is made of a transparent synthetic resin, it is possible to inspect the position of the component mounted on the flexible printed wiring board in a state where the front and back are reversed.

  When electronic circuit components are joined to a component mounting board by soldering, if there is no fear that the electronic circuit components will shift when soldered, the electronic circuit components may be temporarily fixed. The inspection may be performed in a state where the solder is melted and the electronic circuit component is electrically connected to the component mounting board.

Further, the position-related data may be changed by inspecting the ACF application position on the component mounting board by the ACF application head or the cut length of the ACF by the ACF cutting head. The ACF cutting head is a work head that indirectly performs work on the component mounting board by cutting the ACF tape affixed to the component mounting board to a set length. The ACF application position data is data related to the position of the component mounting board, which is a coordinate conversion object, and the cut length of the ACF can also be obtained from the application position, and the application position data defining the length is position related. It is data. The ACF application position may be inspected after the ACF tape is attached to the component mounting substrate and before the electronic circuit component is mounted, or after the mounting. If the component mounting substrate is a transparent substrate, the mounting position of the ACF tape may be obtained by inverting the component mounting substrate after mounting the electronic circuit component. When inspecting the ACF application position, the position may be acquired for one preset position of the ACF to acquire misalignment, etc., the position may be acquired for a plurality of locations, and the misalignment etc. may be acquired based on the position. May be. The ACF includes conductive particles. For example, the presence / absence, number, and density of conductive particles are acquired by imaging the ACF with an imaging device, and the ACF attachment position and length are acquired based on the acquired ACF. Further, when inspecting the ACF cut length, for example, inspection positions are set at a plurality of positions set in advance on the ACF tape, for example, at four positions separated in the longitudinal direction, and based on the presence or absence of the ACF tape at each inspection position. The position of the end of the ACF tape is obtained to obtain the length, and the difference from the normal length is obtained. Based on the actual deviation of the ACF application position and the difference between the actual length of the ACF cut length, for example, the set ACF application position and the cut position are changed, and the ACF application head at the time of ACF application The relative position with respect to the component mounting board is corrected, or the cutting position by the tape cutting device is corrected. A position related data converter is used for this change.
Even when the ACF sticking head is for sticking the ACF to the electronic circuit component, the sticking position or the like may be inspected to change the position related data. In this case, the electronic circuit component is a coordinate conversion object.

  The electronic circuit component mounting inspection may be automatically performed after the component mounting board is set in the inspection machine. For example, the inspection head is automatically moved to the electronic circuit component based on the mounting position coordinate data of the electronic circuit component, etc. The amount of positional deviation is acquired by comparison with. Alternatively, the mounting position deviation may be acquired by imaging the component mark and the board mark. In this case, subsequent to the mounting inspection, the mounting position related data may be automatically changed.

  The coordinate conversion object is not limited to an electronic circuit component or a component mounting board, and can be a coordinate conversion object as long as it is a member on which some work is performed by a work head, for example. In addition, when the coordinate conversion object is a component mounting board, the electronic circuit component to be mounted is not limited to the liquid crystal drive circuit component, but the component mounting such as a package component such as QFP (Quad Flat Package) and CSP (Chip Size Package). Various electronic circuit components are mounted in accordance with the type of the substrate and the like. For example, the mounting position related data of the electronic circuit components is changed by the mounting position related data conversion device.

  As described above, the various aspects related to the acquisition of positional deviation and the position-related data conversion device and the like can also be adopted in a component mounting board working system other than the electronic circuit component mounting system.

It is a top view which shows roughly the electronic circuit component mounting system which is an Example of claimable invention. It is a side view which shows the said electronic circuit component mounting system schematically. It is a top view which shows the board | substrate mark provided about one of several component mounting positions of the glass substrate in which a chip component is mounted in the said electronic circuit component mounting system. It is a bottom view which shows the flip chip which is 1 type of the electronic circuit components with which the said glass substrate is mounted | worn. It is a top view which shows the state by which the flip chip was mounted | worn through the ACF tape on the said glass substrate. It is a block diagram which shows roughly the control apparatus which controls the said electronic circuit component mounting system. It is a top view which shows roughly the component mounting inspection machine which test | inspects the mounting state to the glass substrate of the electronic circuit component in the said electronic circuit component mounting machine. It is a side view which shows roughly the test | inspection imaging device etc. of the test | inspection head of the said component mounting test | inspection machine. It is a block diagram which shows roughly the control apparatus which controls the said component mounting inspection machine. It is a figure explaining the attitude | position of the glass substrate at the time of the mounting inspection by the said component mounting inspection machine. It is a top view which shows the state which reversed the front and back of the glass substrate with which the flip chip was mounted | worn. It is a figure explaining the acquisition of the position of a reference mark and a component mark while showing the state where the chip imaged by the imaging device of the above-mentioned component mounting inspection machine was displayed on the display screen. During the inspection by the component mounting inspection machine, the mounting position related data initially displayed on the display screen of the electronic circuit component mounting machine, the image of the component mounting board, and the glass board are reversed from the horizontal orientation to check the mounting state. FIG. 5 is a diagram showing mounting position related data, an image of a component mounting board, and the like displayed on a display screen when a display is performed. The electronic circuit with the mounting position related data initially displayed on the display screen of the electronic circuit component mounting machine, the image of the component mounting board, and the glass substrate rotated rightward from the horizontal position during the inspection by the component mounting inspection machine. It is a figure which shows the mounting position related data, the image of a component mounting board, etc. which are displayed on the display screen of a component mounting machine. The figure which shows the mounting position related data, the image of a glass substrate, etc. which are displayed on the display screen of an electronic circuit component mounting machine when a glass substrate is rotated rightward from a horizontally long posture and turned upside down and the mounting state is inspected It is. It is a block diagram which shows roughly the control apparatus which controls the electronic circuit component mounting system which is another Example of claimable invention. It is a block diagram which shows roughly the control apparatus which controls the component mounting inspection machine which test | inspects the mounting state of the electronic circuit component mounted in the glass substrate in the electronic circuit component mounting machine which has a control apparatus shown in FIG.

Explanation of symbols

  16: Component mounting device 24: Control device 30: Component mounting substrate (glass substrate) 34: Table 36: Table moving device 350: Mounting head 352: Mounting head moving device 92: Chip component 114: Input device 124: Display screen 150: Component mounting inspection machine 162: Control device 300, 310: Control device

Claims (5)

Position-related data, which is data related to the position of at least one point of the board constituting the electronic circuit on the first coordinate plane having the X axis and the Y axis orthogonal to each other as the coordinate axes. Storage means for storing
In the position-related data stored in the storage means, a second axis having an X axis and a Y axis orthogonal to each other as coordinate axes and a positive / negative direction for each of the X axis and the Y axis is the same as the first coordinate axis . A coordinate conversion instruction unit for instructing to perform coordinate conversion to a coordinate plane;
A coordinate transformation section for performing coordinate transformation into the second coordinate plane of the position-related data stored in the storage means in accordance with the coordinate conversion instruction by the coordinate conversion specification unit,
A data changing unit for changing the position related data on the second coordinate plane;
An inverse coordinate conversion instruction unit for instructing that the position related data changed by the data change unit should be inversely converted into position related data on the first coordinate plane;
See contains an inverse coordinate transformation unit for performing an inverse coordinate transformation in accordance with an instruction of the reverse coordinate conversion specification unit, and the transformed coordinate instruction unit which the coordinate conversion instruction unit instructs the kind of coordinate transformation to be performed in the coordinate transformation unit And the type of coordinate conversion indicated by the conversion coordinate designating unit is at least one of reverse rotation by rotation around the X axis, reverse rotation by rotation around the Y axis, forward rotation and reverse rotation A position-related data conversion device including two . 2. The position-related data conversion device according to claim 1, further comprising a display screen that displays at least one of the position-related data whose coordinates have been converted by the coordinate conversion unit and the image of the substrate whose coordinates have been converted. . The coordinate conversion unit, a coordinate conversion so unchanged before and after the relative position against the origin of that relative position against the origin of the first coordinate surface of the substrate the second coordinate plane has a coordinate transformation The position-related data conversion device according to claim 1 or 2 , wherein Before Symbol position related data, is mounted on the circuit pattern provided before Kimoto plate comprises a mounting position related data related to the mounting positions of the electronic circuit components constituting the electronic circuit, its mounting position related data, wherein Including at least one of mounting position coordinate data defining a mounting position of the electronic circuit component and mounting position deviation related data relating to a shift in the mounting position of the electronic circuit component, wherein the data changing unit includes the mounting position coordinate data and the mounting positional deviation and correct at least one of the associated data, location-related data conversion apparatus according to any one of 3 claims 1 comprises a component mounting position correction unit for obtaining the mounting position correction data. The position-related data conversion device according to any one of claims 1 to 4 ,
A substrate holding device for holding the substrate;
A working head for working on the substrate;
A relative movement device for relatively moving the substrate holding device and the working head;
And a control device for controlling the position-related data conversion device, the substrate holding device, the work head, and the relative movement device.

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