TWI735277B - Soldering apparatus and method capable of soldering alignment by means of image overlapping - Google Patents

Abstract

A soldering apparatus capable of soldering alignment by means of image overlapping, includes a platform, a beam splitter, an image capturing device and an electronic components fixing device. The platform is movable. The beam splitter is disposed on a side of the platform and movable to adjust the location of the beam splitter with respect to the platform. The image capturing device is disposed on a side of the platform and movable to adjust the location of the image capturing device with respect to the platform. The electronic components fixing device is disposed on a side of the platform and movable to adjust the location of the electronic components fixing device with respect to the platform.

Description

Ghost registration welding device and method

The present invention relates to a ghost registration welding device and method.

In order to be able to solder more electronic parts on the Printed Circuit Board (PCB) of the same area, the Surface Mount Technology (SMT) is currently used to mount the Surface Mount Device (SMD) such as: Resistors, capacitors, transistors, integrated circuits, etc. are soldered to the printed circuit board, so that electronic products can be designed to be lighter, thinner and shorter. Throughout the welding process, the accuracy of the placement position of the surface-adhesive parts will greatly affect the yield and reliability of the welding process. The traditional surface-mounted part placement process requires that the placement coordinates of each surface-mounted part are input into the machine in advance, and then the surface-mounted part is placed on the printed circuit board by the robotic arm according to the placement coordinates, so that the surface-mounted part can be welded The feet are accurately placed on the pads of the printed circuit board to complete the placement of the surface-adhesive parts. The input of the placement coordinates is mostly manual, which is time-consuming and prone to human input errors, often resulting in process yield And the reliability is reduced.

In view of this, the main purpose of the present invention is to provide a ghost registration welding device that uses a ghost registration method to locate surface-adhesive parts, which can avoid manual input of erroneous placement coordinates, and has fast speed and accuracy. High advantages, which can greatly improve the process yield and Reliability.

The ghost registration welding device of the present invention includes a platform, a beam splitter, an image capturing device and an electronic component fixing device. The platform is movable. The beam splitter is arranged on one side of the platform, and the beam splitter can be moved to adjust the relative position of the beam splitter and the platform. The image capturing device is arranged on one side of the platform, and the image capturing device can be moved to adjust the relative position of the image capturing device and the platform. The electronic component fixing device is arranged on one side of the platform, and the electronic component fixing device can be moved to adjust the relative position of the electronic component fixing device and the platform.

The ratio of transmittance to reflectance of the beam splitter can be between 0.82 and 1.22.

The electronic component fixing device includes a vacuum pump and a vacuum chuck.

The image capturing device includes an image sensing element and an objective lens. The image sensing element receives a visible light image taken by the objective lens and converts the visible light image into an image signal.

The magnification of the objective lens can be between 4.5 times and 5.5 times.

The objective lens includes an optical axis. When the objective lens captures a visible light image, the angle between the optical axis and a vertical axis of the platform can be between 27 degrees and 33 degrees.

The ghost registration welding device of the present invention may further include an infrared heater arranged on one side of the platform, and the infrared heater can be moved to adjust the relative position of the infrared heater and the platform.

The heating temperature of the infrared heater can be between 135°C and 165°C.

In order to make the above-mentioned objectives, features, and advantages of the present invention more obvious and understandable, preferred embodiments are described in detail below in conjunction with the accompanying drawings.

1: Ghost registration welding device

10: Platform

20: Spectroscope

21: Spectroscope mount

30: Image capture device

301: Image sensor

302: Objective

40: Electronic component fixing device

401: Vacuum Suction Cup

402: Vacuum Pump

50: infrared heater

60: printed circuit board

70: SMD resistance

X: X axis direction

Y: Y axis direction

Z: Z axis direction

Figure 1 is a 3D schematic diagram of an embodiment of a ghost welding device.

Figure 2 is a partial 2D enlarged schematic diagram of an embodiment of the ghost welding device after positioning is completed.

Please refer to FIG. 1. FIG. 1 is a 3D schematic diagram of an embodiment of the ghost registration welding device of the present invention. The ghost registration welding device 1 includes a platform 10, a beam splitter 20, an image capturing device 30, an electronic component fixing device 40 and an infrared heater 50.

The platform 10 can be used to place an electronic component. The electronic component can be a printed circuit board. The platform 10 can adjust its X-axis position and Y-axis direction in space through the XYZ three-axis moving platform (not shown) Position and Z-axis direction position.

The beam splitter 20 is arranged on one side of the platform 10, and the beam splitter 20 is fixed to the beam splitter mount 21. The beam splitter mount 21 can rotate horizontally (XY plane), move up and down (Z axis direction) and adjust the tilt angle (X axis direction) , Y-axis direction), so that the beam splitter 20 can be adjusted relative to the platform 10, the beam splitter 20 of this embodiment has a transmittance to reflectance ratio of 1, or a ratio between 0.82 and 1.22 The beam splitter should also belong to the scope of this creation.

The image capturing device 30 is disposed on the upper side of the platform 10. The image capturing device 30 includes an image sensing element 301 and an objective lens 302. The objective lens 302 includes an optical axis (not shown). The image capturing device 30 can be moved to adjust and The relative position of the platform 10 and the angle between the optical axis (not shown) and a vertical axis (not shown) of the platform 10. The objective lens 302 can capture a visible light image, and the image sensor 301 receives the visible light image and converts it into an image signal On the screen (not The figure) shows that the objective lens 302 of this embodiment has a magnification of 5 times, and the angle between the optical axis (not shown) and the vertical axis (not shown) of the platform 10 is 30 degrees, and the magnification can also be changed to For the objective lens between 4.5 times and 5.5 times, the angle between the optical axis (not shown) and the vertical axis (not shown) of the platform 10 can be adjusted between 27 degrees and 33 degrees, which should also be within the scope of this creation.

The electronic component fixing device 40 is arranged on one side of the platform 10. The electronic component fixing device 40 can move to adjust the relative position with the platform 10. The electronic component fixing device 40 includes a vacuum chuck 401 and a vacuum pump 402. The electronic component fixing device of the embodiment adopts a vacuum suction method to suck and fix the electronic component, and it can also be fixed by other methods, such as clamping and fixing by a robotic arm, which also belongs to the scope of the present invention.

The infrared heater 50 is arranged on one side of the platform 10. The infrared heater can be moved to adjust the relative position with the platform 10. Its heating temperature is about 150°C. The heating temperature of the infrared heater in this embodiment can also be changed to medium Between 135°C and 165°C, infrared heaters can also be changed to other types of heaters, which should also belong to the scope of this creation.

Before welding electronic components on a printed circuit board, the surface of the printed circuit board needs to be designed and manufactured in advance according to various types and shapes of surface adhesive parts, so as to be used for welding of various types and shapes of surface adhesive parts. Each welding is performed before welding. The surface of the pad needs to be printed with solder paste, and then the solder feet of the surface-adhesive parts are accurately placed on the solder pad that has been printed with solder paste, and then heated to melt the solder paste into liquid, and the liquid solder paste will adhere to the surface The solder feet of the parts are covered. After the temperature is cooled, the solder paste will return to a solid state, and the surface-adhesive parts can be soldered on the printed circuit board. The following will explain in further detail the welding process of the ghost registration welding device applied to the surface adhesive parts of the printed circuit board.

Please refer to Fig. 1 and Fig. 2 at the same time, Fig. 2 is a ghost butt welding device A partial 2D enlarged schematic diagram after positioning is completed in an embodiment. Place the printed circuit board 60 on the platform 10, and then move the image capturing device 30 to the upper side of the printed circuit board 60 so that the optical axis (not shown) of the objective lens 302 is perpendicular to one of the vertical axes of the platform 10 (not shown, Z The included angle of the axial direction is approximately 30 degrees, and a visible light image of the side of the solder pad (not shown) to be soldered on the printed circuit board 60 is captured, and the visible light image will be displayed on the screen (not shown).

Then horizontally rotate (XY plane) the beam splitter holder 21 so that the beam splitter 20 is located above the printed circuit board 60, and move the beam splitter holder 21 up and down (Z axis direction) and adjust the tilt angle (X axis direction, Y axis direction) , So that the beam splitter 20 and the printed circuit board 60 are as parallel as possible, and the image of the solder pad (not shown) displayed on the screen (not shown) is still clear.

Then turn on the power switch of the vacuum pump 402 to pump air, hold an SMD resistor 70 in your hand or use tweezers to contact the vacuum chuck 401, so that the SMD resistor 70 is adsorbed by the vacuum chuck 401. At this time, the welding foot of the SMD resistor 70 ( (Not shown) should face the beam splitter 20, and then adjust the spatial position of the electronic component fixing device 40 so that the SMD resistor 70 is located directly above the beam splitter 20. At this time, except for the clear welding on the screen (not shown) In addition to the image of the pad (not shown), you can also see the fuzzy image of the solder foot (not shown). Continue to adjust the position of the SMD resistor 70 to move it to the beam splitter 20 until the screen (not shown) can see the solder foot (not shown) As shown in the figure), the screen (not shown) can see the clear image of the solder pad (not shown) and the solder foot (not shown) at the same time. The two clear images are not overlapped but overlap each other to form a overlap. If you turn off the power of the vacuum pump 402 at this time, the solder feet (not shown) will not be accurately placed on the solder pads (not shown) that have been printed with solder paste, that is to say, the solder pads (not shown) (Shown) and solder feet (not shown) have not been positioned yet, you need to fine-tune the spatial position of the electronic component fixing device 40 to fine-tune the position of the SMD resistor 70 until the solder pads (not shown) seen on the screen (not shown) (Pictured) and solder feet (not pictured) The clear images overlap each other to complete the positioning of the SMD resistor 70.

Then rotate the beam splitter holder 21 horizontally (XY plane) so that the beam splitter 20 is not above the platform 10, and then adjust the spatial position of the electronic component fixing device 40 so that the SMD resistor 70 moves along the Z axis until it is almost in line with the printing When the circuit board 60 is in contact, turn off the power of the vacuum pump 402. The SMD resistor 70 will no longer be sucked by the vacuum chuck 401, but will be placed on the surface of the printed circuit board 60. At this time, the solder feet of the SMD resistor 70 (not shown) ) Place it accurately on the solder pad (not shown) that has been printed with solder paste.

Finally, the infrared heater 50 is used to heat the solder paste to melt the solder paste and cover the solder feet (not shown). After the solder paste is cured, the SMD resistor 70 can be soldered and fixed on the surface of the printed circuit board 60.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone familiar with the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to the scope of the attached patent application.

1: Ghost registration welding device

10: Platform

20: Spectroscope

21: Spectroscope mount

30: Image capture device

301: Image sensor

302: Objective

40: Electronic component fixing device

401: Vacuum Suction Cup

402: Vacuum Pump

50: infrared heater

X: X axis direction

Y: Y axis direction

Z: Z axis direction

Claims (10)

A ghost registration welding device, comprising: a platform for carrying a printed circuit board, the printed circuit board includes a soldering pad, the platform is movable; a beam splitter; a screen; an image capturing device; and an electronics The component fixing device is used to hold a surface-adhesive part, the surface-adhesive part includes a solder foot; wherein the beam splitter is arranged on one side of the platform, and the beam splitter can be moved to adjust the relative position of the beam splitter and the platform Wherein the image capturing device is arranged on one side of the platform, the image capturing device can move to adjust the relative position of the image capturing device and the platform; wherein the image capturing device captures the image of the side of the solder pad and the solder foot And displayed on the screen; wherein the electronic component fixing device is set on one side of the platform, and the electronic component fixing device can be moved to adjust the relative position of the electronic component fixing device and the platform to adjust The position of the surface adhered part until the welding pad and the welding foot image on the screen coincide. In the ghost registration welding device described in item 1 of the scope of the patent application, the ratio of the transmittance to the reflectance of the beam splitter is between 0.82 and 1.22. The ghost registration welding device described in the first item of the scope of patent application, wherein the electronic component fixing device includes a vacuum pump and a vacuum chuck. The ghost registration welding device described in the first item of the scope of patent application, wherein the image capturing device includes an image sensing element and an objective lens, the image sensing element receives a visible light image taken by the objective lens, and combines the The visible light image is converted into an image signal. For the ghost registration welding device described in item 4 of the scope of patent application, the magnification of the objective lens is between 4.5 times and 5.5 times. The ghost registration welding device described in item 4 of the scope of patent application, wherein the objective lens includes an optical axis, and when the objective lens captures the visible light image, the angle between the optical axis and a vertical axis of the platform is between 27 degrees and 33 degrees Between degrees. For example, the ghost registration welding device described in item 1 of the scope of patent application, which further includes an infrared heater arranged on one side of the platform, and the infrared heater can be moved to adjust the relative position of the infrared heater and the platform . In the ghost registration welding device described in item 7 of the scope of patent application, the heating temperature of the infrared heater is between 135°C and 165°C. A method for ghost registration welding, including: providing a printed circuit board, the printed circuit board including a soldering pad; capturing an image of the side of the soldering pad with an image capturing device, and displaying it on a screen; moving a beam splitter To the top of the printed circuit board; an electronic component fixing device is used to hold a surface-adhesive part, the surface-adhesive part is located above the beam splitter, and the solder feet of the surface-adhesive part face the beam splitter, and the image capture device Simultaneously capture the image of the soldering pad and the soldering foot and display it on the screen; adjust the position of the surface-adhesive part until the soldering pad and the soldering foot’s image on the screen coincide; Move the beam splitter away from the top of the printed circuit board; make the electronic component fixing device release the surface-adhesive parts, so that the solder feet are placed on the solder pads; heat the solder paste on the solder pads to turn the solder paste into liquid, To cover the solder foot. For example, the ghost registration welding device described in item 9 of the scope of patent application, wherein when the beam splitter is moved to the upper side of the printed circuit board, the position and angle of the beam splitter are adjusted to make the beam splitter and the printed circuit board The circuit boards are roughly parallel.

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