JP3636153B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Electronic component mounting apparatus and electronic component mounting method Download PDF

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Publication number
JP3636153B2
JP3636153B2 JP2002075759A JP2002075759A JP3636153B2 JP 3636153 B2 JP3636153 B2 JP 3636153B2 JP 2002075759 A JP2002075759 A JP 2002075759A JP 2002075759 A JP2002075759 A JP 2002075759A JP 3636153 B2 JP3636153 B2 JP 3636153B2
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Japan
Prior art keywords
electronic component
mounting
camera
substrate
pickup
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Expired - Fee Related
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JP2002075759A
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Japanese (ja)
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JP2003273167A (en
Inventor
宏 土師
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松下電器産業株式会社
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Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components on a substrate.
[0002]
[Prior art]
In the electronic component mounting apparatus, the mounting operation of holding the electronic component taken out from the electronic component supply unit by the mounting head and mounting it on the substrate is repeatedly performed. Of electronic components, electronic components on which bumps as connection terminals are formed, such as flip chips, are generally supplied in a posture in which the bump forming surface is on the upper surface side. Such an electronic component is taken out from the electronic component supply unit by the pickup head, and then reversed to a posture in which the bumps are on the lower surface side, and then delivered to the mounting head.
[0003]
[Problems to be solved by the invention]
However, when an electronic component that requires such reversal in a conventional electronic component mounting apparatus is used, the work efficiency is poor because the electronic component is individually taken out and reversed and then delivered to the mounting head. There was a problem.
[0004]
Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of improving the work efficiency of an electronic component mounting operation for an electronic component that requires reversal.
[0005]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus mounts the electronic component on the substrate by aligning the terminal of the electronic component with the electrode formed at the electronic component mounting position of the substrate. An electronic component supply unit that supplies a plurality of electronic components arranged in a plane in an upward state, a substrate holding unit disposed in a position away from the electronic component supply unit in the first direction, and an upper side of the substrate holding unit Board recognition means for processing the image captured by the first camera and recognizing the electronic component mounting position of the board, and the second camera moving above the electronic component supply unit. First electronic component recognition means for recognizing the position of the electronic component of the component supply unit with the second camera, and a plurality of pickup nozzles and moving up and down the electronic component picked up by the electronic component supply unit Anti The pick-up means positioned at the delivery position and a plurality of mounting nozzles arranged in the same array as the pick-up nozzle, and a plurality of electronic components that are inverted up and down by the pick-up nozzles are held by the substrate holding portion. The mounting nozzle for individually mounting the electronic component mounting position on the substrate, and a third camera for capturing an image of the electronic component held by the mounting nozzle, and processing the image captured by the third camera to process the mounting nozzle A second electronic component recognizing unit for recognizing the position of the electronic component held by the control unit and the pickup unit, and (1) based on the positions of the plurality of electronic components recognized by the first electronic component recognizing unit. And (2) an electronic component in which the plurality of pickup nozzles are individually aligned with these electronic components and individually picked up. Pickup control means for performing a delivery operation for positioning a plurality of picked-up pickup nozzles in a delivery position in an upside down state, and controlling the mounting means. (1) The plurality of mounting nozzles at the delivery position with the plurality of mounting nozzles. A receiving operation for simultaneously receiving and holding a plurality of electronic components upside down by the pickup nozzles from the plurality of pickup nozzles; and (2) the position of the electronic component mounting position recognized by the board recognition unit and the second electronic component recognition unit There is provided mounting control means for performing a mounting operation for individually mounting the electronic components held by the mounting nozzle on the electronic component mounting position of the substrate based on the recognized position of the electronic components.
[0006]
The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, further comprising a first camera moving mechanism that moves the first camera above the substrate holding portion. The camera moving mechanism is controlled to (1) move the first camera above the substrate holding portion when the mounting means moves away from above the substrate holding portion (2) the substrate by the first camera The first camera movement processing means for retracting the first camera to a position where it does not interfere with the mounting means is provided.
[0007]
According to a third aspect of the present invention, there is provided the electronic component mounting apparatus according to the first aspect, further comprising a viscous material supply unit that supplies a viscous material to a terminal of the electronic component held by the mounting nozzle.
[0008]
The electronic component mounting apparatus according to claim 4 is the electronic component mounting apparatus according to claim 1, wherein the pickup means includes a plurality of pickup nozzles and a reversing mechanism for vertically reversing these pickup nozzles. And a pickup head moving mechanism for moving the pickup head between the component supply unit and the delivery position, wherein the mounting means includes a mounting head having a plurality of the mounting nozzles, and the mounting head as the delivery position and the substrate. A mounting head moving mechanism for moving between the holding unit and the holding unit is provided, and the second camera is moved integrally with the pickup head by the pickup head moving mechanism.
[0009]
The electronic component mounting method according to claim 5 is an electronic component mounting method in which an electronic component is mounted on a substrate by aligning a terminal of the electronic component with an electrode formed at the electronic component mounting position of the substrate. A first step of picking up an image of the board held by the first camera, acquiring an image, and processing the image to recognize a plurality of electronic component mounting positions on the board; A second step of recognizing the position of the plurality of electronic components by capturing a plurality of electronic components arranged in a plane in a state of being taken with a second camera, obtaining an image, and processing the image; A third step of aligning the plurality of pickup nozzles with these electronic components and individually picking them up based on the positions of the plurality of electronic components recognized in the step; A fourth step of vertically inverting a plurality of electronic components picked up by the pickup nozzle by reversing, and simultaneously receiving and holding the plurality of vertically inverted electronic components from the plurality of pickup nozzles by a plurality of mounting nozzles. A fifth step, and a sixth step of capturing a plurality of electronic components held by the mounting nozzle with a third camera, obtaining an image, processing the image, and recognizing the positions of these electronic components; The electronic component terminals and electronic component mounting held by the mounting nozzle based on the positions of the plurality of electronic component mounting positions recognized in the first step and the positions of the plurality of electronic components recognized in the sixth step A seventh step of positioning and individually mounting the electrodes was provided.
[0010]
The electronic component mounting method according to claim 6 is the electronic component mounting method according to claim 5, wherein the first step overlaps at least a part of the time from the fifth step to the sixth step. To do.
[0011]
The electronic component mounting method according to claim 7 is the electronic component mounting method according to claim 5, wherein a plurality of electronic components to be mounted next are mounted within a time period during which the sixth step to the seventh step are executed. On the other hand, the second step is completed.
[0012]
The electronic component mounting method according to claim 8 is the electronic component mounting method according to claim 5, wherein the plurality of mountings are performed within a time period from the completion of the fifth step to the start of the seventh step. A viscous material is applied to the terminals of a plurality of electronic components held by the nozzle.
[0013]
According to the present invention, there is provided pick-up means for taking out a plurality of electronic components from an electronic component supply unit that supplies electronic components in a planar shape with the terminal facing upward, and inverting the taken-out electronic components upside down and delivering them to the mounting head. By providing, it is possible to improve the work efficiency of the electronic component mounting work for an electronic component that requires reversal.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side sectional view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 is a partial perspective view of an electronic component supply unit of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 5 is an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 6 is a functional block diagram showing the processing function of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 7, FIG. 8, FIG. 9, FIG. FIG. 13 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention, and FIG.
[0015]
First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. 1, FIG. 2, and FIG. 2 shows an AA arrow view in FIG. 1, and FIG. 3 shows a BB arrow view in FIG. In FIG. 1, an electronic component supply unit 2 is disposed on a base 1. As shown in FIGS. 2 and 3, the electronic component supply unit 2 includes a jig holder 3, and the jig holder 3 detachably holds the jig 4 to which the adhesive sheet 5 is attached. A flip chip 6 (hereinafter simply abbreviated as “chip 6”), which is an electronic component having bumps 6a (see FIG. 4), which are terminals for external connection, is attached to the adhesive sheet 5. In a state where the jig 4 is held by the jig holder 3, the electronic component supply unit 2 supplies a plurality of chips 6 arranged in a plane with the bumps 6a on the upper surface side (see FIG. 4).
[0016]
As shown in FIG. 2, an ejector 8 is disposed below the adhesive sheet 5 held by the jig holder 3 so as to be horizontally movable by an ejector XY table 7. The ejector 8 includes a pin lifting mechanism that lifts and lowers an ejector pin (not shown) for pushing up a chip. When the chip 6 is picked up from the adhesive sheet 5 by a mounting head described later, the ejector pin is below the adhesive sheet 5. The chip 6 is peeled off from the adhesive sheet 5 by pushing up the chip 6 from above. The ejector 8 is an adhesive sheet peeling mechanism that peels the chip 6 from the adhesive sheet 5.
[0017]
As shown in FIG. 3, a substrate holding unit 10 is arranged at a position away from the electronic component supply unit 2 on the upper surface of the base 1 in the Y direction (first direction). A substrate carry-in conveyor 12, a substrate sorting unit 11, a substrate delivery unit 13, and a substrate carry-out conveyor 14 are arranged in series in the X direction on the upstream side and the downstream side of the substrate holding unit 10, respectively. The substrate carry-in conveyor 12 receives the substrate 16 supplied from the upstream side and passes it to the substrate sorting unit 11.
[0018]
The substrate distribution unit 11 has a configuration in which a distribution conveyor 11a is slidable in the Y direction by a slide mechanism 11b, and the substrate 16 received from the substrate carry-in conveyor 12 is included in the substrate holding unit 10 described below. It selectively distributes to two substrate holding mechanisms. The substrate holding unit 10 includes a first substrate holding mechanism 10A and a second substrate holding mechanism 10B, and holds the substrate 16 distributed by the substrate distribution unit 11 and positions it at the mounting position.
[0019]
Similarly to the substrate distribution unit 11, the substrate delivery unit 13 has a configuration in which a delivery conveyor 13a is slidable in the Y direction by a slide mechanism 13b. The delivery conveyor 13a includes the first substrate holding mechanism 10A and the second substrate holding mechanism 10A. By selectively connecting to the substrate holding mechanism 10 </ b> B, the mounted substrate 16 is received and transferred to the substrate carry-out conveyor 14. The board carry-out conveyor 14 carries the delivered mounted board 16 downstream.
[0020]
In FIG. 1, a first Y-axis base 20A and a second Y-axis base 20B are arranged at both ends of the upper surface of the base 1 with the longitudinal direction facing the Y direction perpendicular to the substrate transport direction (X direction). It is installed. On the upper surfaces of the first Y-axis base 20A and the second Y-axis base 20B, a Y-direction guide 21 is disposed over the entire length in the longitudinal direction (Y direction), and the pair of Y-direction guides 21 are parallel to each other. In addition, the electronic component supply unit 2 and the substrate holding unit 10 are arranged to be sandwiched therebetween.
[0021]
The pair of Y-direction guides 21 includes three beam members, a first beam member 31, a center beam member 30, and a second beam member 32, both ends of which are supported by the Y-direction guide 21 in the Y direction. It is slidably installed.
[0022]
A nut member 23b protrudes from the right side end of the center beam member 30, and a feed screw 23a screwed into the nut member 23b is disposed in the horizontal direction on the first Y-axis base 20A. It is rotationally driven by the Y-axis motor 22. By driving the Y-axis motor 22, the center beam member 30 moves horizontally in the Y direction along the Y direction guide 21.
[0023]
Further, nut members 25b and 27b project from the left side end portions of the first beam member 31 and the second beam member 32, respectively. Feed screws 25a and 27a screwed into the nut members 25b and 27b are respectively Each of them is rotationally driven by Y-axis motors 24 and 26 disposed horizontally on the second Y-axis base 20B. By driving the Y axis motors 24 and 26, the first beam member 31 and the second beam member 32 move horizontally in the Y direction along the Y direction guide 21.
[0024]
A first camera 34 is mounted on the first beam member 31, and a nut member 44 b is coupled to a bracket 34 a (see FIG. 2) that holds the first camera 34. The feed screw 44 a screwed into the nut member 44 b is rotationally driven by the X-axis motor 43, and the first camera 34 is provided on the side surface of the first beam member 31 by driving the X-axis motor 43. It is guided by a guide 45 (see FIG. 2) and moves in the X direction.
[0025]
By driving the Y-axis motor 24 and the X-axis motor 43, the first camera 34 moves horizontally in the X direction and the Y direction. Thus, the first camera 34 moves the substrate holding unit 10 above the substrate holding unit 10 for imaging the substrate 16 held by the first substrate holding mechanism 10A and the second substrate holding mechanism 10B of the substrate holding unit 10, and the substrate. Movement for evacuation from the holding unit 10 can be performed.
[0026]
A pair of Y-direction guides 21, a first beam member 31, a Y-direction drive mechanism (Y-axis motor 24, feed screw 25a and nut member 25b) for moving the first beam member 31 along the Y-direction guide 21, and a first The X-direction drive mechanism (X-axis motor 43, feed screw 44a and nut member 44b) that moves one camera 34 along the X-direction guide 45 moves the first camera 34 at least above the substrate holder 10. A first camera moving mechanism is configured.
[0027]
A second camera 35 is attached to the second beam member 32, and a nut member 47 b is coupled to a bracket 35 a (see FIG. 2) that holds the second camera 35. The feed screw 47a screwed to the nut member 47b is rotationally driven by the X-axis motor 46, and the second camera 35 is provided in the X direction provided on the side surface of the second beam member 32 by driving the X-axis motor 46. It is guided by a guide 48 (see FIG. 2) and moves in the X direction.
[0028]
As shown in FIG. 4, a pickup head 37 is attached to the lower end of the bracket 35a. The pickup head 37 includes a Z-axis table 36, and a U-shaped lifting member 37 c is coupled to the Z-axis table 36. A nozzle holding portion 37a on which a plurality of nozzles 37b are mounted is held at the tip of the elevating member 37c so as to be rotatable around a horizontal rotation axis. Here, since the nozzle holding part 37a is held by the U-shaped elevating member 37c, the nozzle holding part 37a is arranged so as not to interfere with the imaging of the electronic component supply part 2 by the second camera 35.
[0029]
Each nozzle 37b of the nozzle holding portion 37a can be individually protruded downward from the nozzle holding portion 37a by a nozzle lifting mechanism (not shown) built in the nozzle holding portion 37a. The chip 6 can be picked up from the adhesive sheet 5 by the individual nozzle 37b by lowering the nozzle holding portion 37a by the Z-axis table 36 with one nozzle 37b protruding.
[0030]
The nozzle holding part 37a is driven to rotate by a rotation driving part 37d, and the nozzle holding part 37a is rotated upside down to switch the direction of the nozzle 37b upward or downward. The rotation drive unit 37d is a reversing mechanism that vertically inverts the nozzle 37b. The chip 6 in the face-up state with the bump forming surface facing upward is taken out by the nozzle 37b in the downward posture, and then the nozzle 37b is turned upward to invert the chip 6 and face down with the bump forming surface facing downward. Can be held.
[0031]
By driving the Y-axis motor 26 and the X-axis motor 46, the pickup head 37 and the second camera 35 move horizontally in the X direction and the Y direction. Accordingly, the pickup head 37 performs an operation for picking up the chip 6 held in the electronic component supply unit 2 and a movement operation to a delivery position for delivering the picked-up chip 6 to a mounting head 33 described later. The second camera 35 moves above the electronic component supply unit 2 for imaging the chip 6 held by the electronic component supply unit 2.
[0032]
A Y-direction drive mechanism (Y-axis motor 26, feed screw 27 a and nut member 27 b) that moves the pair of Y-direction guides 21, the second beam member 32, and the second beam member 32 along the Y-direction guide 21; The X-direction drive mechanism (X-axis motor 46, feed screw 47a, and nut member 47b) that moves the second camera 35 along the X-direction guide 48 includes at least an electronic component supply unit for the pickup head 37 and the second camera 35. 2, the second camera 35 moves integrally with the pickup head 37.
[0033]
In the above-described configuration, a pickup head 37 having a plurality of nozzles 37b and a rotation drive unit 37d that inverts the nozzles 37b up and down, and a pickup head movement that moves the pickup head 37 between the electronic component supply unit 2 and the delivery position. The mechanism constitutes a pick-up means that flips the chip 6 picked up in the electronic component supply unit 2 upside down and positions it at the delivery position to the mounting head 33.
[0034]
A mounting head 33 is mounted on the center beam member 30, and a feed screw 41 a screwed into a nut member 41 b coupled to the mounting head 33 is rotationally driven by an X-axis motor 40. By driving the X-axis motor 40, the mounting head 33 is guided by an X-direction guide 42 (see FIG. 2) provided on the side surface of the center beam member 30 in the X direction and moves in the X direction.
[0035]
The mounting head 33 includes a plurality of nozzles 33a (mounting nozzles) arranged in the same arrangement as the nozzles 37b in the pickup head 37, and the plurality of chips 6 are held by adsorbing the chips 6 to the nozzles 33a. It is movable. Each nozzle 33a can be moved up and down individually by a built-in nozzle lifting mechanism (not shown). As a result, a plurality of chips 6 held by the pickup head 37 are received simultaneously at the time of chip delivery, and the chips 6 are individually mounted by moving the nozzles 33a up and down individually when mounted on the substrate 16. Can do.
[0036]
By driving the Y-axis motor 22 and the X-axis motor 40, the mounting head 33 moves horizontally in the X direction and the Y direction, picks up and holds the chip 6 of the electronic component supply unit 2, and holds the held chip 6 on the substrate. It is mounted on the electronic component mounting position 16 a of the substrate 16 held by the holding unit 10.
[0037]
A pair of Y-direction guides 21, a center beam member 30, a Y-direction drive mechanism (Y-axis motor 22, feed screw 23 a and nut member 23 b) that moves the center beam member 30 along the Y-direction guide 21, and a mounting head 33 The X-direction drive mechanism (the X-axis motor 40, the feed screw 41a, and the nut member 41b) moves the mounting head 33 between the electronic component supply unit 2 and the substrate holding unit 10 along the X-direction guide 42. A mounting head moving mechanism is configured.
[0038]
The mounting head 33 and the mounting head moving mechanism have a plurality of nozzles 33a arranged in the same arrangement as the nozzles 37b, and the chip 6 that is vertically inverted by the nozzles 37b by the nozzles 33a is placed at the electronic component mounting position 16a of the substrate 16. It is a mounting means to mount individually.
[0039]
As shown in FIG. 3, a third camera 15 and a viscous material supply stage 17 are disposed between the electronic component supply unit 2 and the substrate holding unit 10. The viscous material supply stage 17 includes a container 17a for storing the viscous material 18 (see FIG. 7), and a squeegee mechanism that smoothens the liquid surface of the viscous material 18 such as flux or adhesive in a plane (in FIG. 7). (Not shown). The container 17a can be moved up and down by a cylinder 17b.
[0040]
By moving the mounting head 33 holding the chip 6 on the nozzle 33a up and down with respect to the viscous material supply stage 17, the viscous material 18 is applied to the lower surface of the bump 6a of the chip 6 by transfer. The viscous material supply stage 17 is a viscous material supply means for supplying the viscous material 18 to the bumps 6a of the chip 6 held by the nozzle 33a. When the bump 6a of the chip 6 is solder, a flux is used as the viscous body 18, and when it is not solder, a resin adhesive or the like is used.
[0041]
When a method of applying or printing a viscous material in advance on the substrate 16 is used, the viscous material supply stage 17 can be omitted, but it is preferable to use the viscous material supply stage 17 by transfer as in the present embodiment. There is no need to add a large-scale device such as a printing device, which is advantageous in terms of simplification of equipment.
[0042]
The third camera 15 includes a line-type camera, and the mounting head 33 holding the chip 6 after the viscous body is transferred moves in the X direction over the third camera 15, thereby The camera 15 images the chip 6 held on the mounting head 33. An area type camera may be used as the third camera 15.
[0043]
Thereafter, the mounting head 33 mounts the chip 6 on the substrate 16 held by the substrate holding unit 10. Here, since the mounting head 33 mounts the chip delivered from the pickup head 37 on the substrate 16, the height position of the substrate holding unit 10 is set to a delivery height necessary for delivery of the chip 6 as shown in FIG. 2. The height is higher than the electronic component supply unit 2 by the height (the height difference caused by the upside down of the nozzle holding unit 37a).
[0044]
Next, the configuration of the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 5, the mechanism drive unit 50 includes a motor driver that electrically drives a motor of each mechanism shown below, a control device that controls air pressure supplied to an air cylinder of each mechanism, and the like. By controlling the mechanism drive unit 50 by the unit 54, the following drive elements are driven.
[0045]
The X-axis motor 40 and the Y-axis motor 22 drive a mounting head moving mechanism that moves the mounting head 33. The X-axis motor 43 and the Y-axis motor 24 move the first camera moving mechanism for moving the first camera 34, and the X-axis motor 46 and the Y-axis motor 26 move the pickup head 37 and the second camera 35. Each pickup head moving mechanism is driven.
[0046]
The mechanism driving unit 50 drives a mounting mechanism 33, a lifting mechanism for the pickup head 37, a component suction mechanism using the nozzle 33a and the nozzle 37b, and a lifting cylinder 17b for the viscous material supply stage 17 and a lifting cylinder for the ejector 8. And the drive motor of the ejector XY table 7 is driven. Further, the mechanism driving unit 50 drives the substrate carry-in conveyor 12, the substrate carry-out conveyor 14, the substrate sorting unit 11, the substrate delivery unit 13, the first substrate holding mechanism 10A, and the second substrate holding mechanism 10B.
[0047]
The first recognition processing unit 55 processes the image captured by the first camera 34 to recognize the position of the electronic component mounting position 16a (see FIG. 13) of the substrate 16 held by the substrate holding unit 10. The electronic component mounting position 16a indicates the entire position of the electrode 16b to which the bump 6a is bonded on the substrate 16, and the position can be detected by image recognition.
[0048]
In addition, the first recognition processing unit 55 performs substrate pass / fail inspection by detecting the presence / absence of a bad mark applied to the substrate 16 at each electronic component mounting position 16a in the previous process, and further performs imaging with the first camera 34. The processed image is processed to inspect the mounting state such as the positional deviation of the chip 6 mounted at the electronic component mounting position 16a. The first camera 34 and the first recognition processing unit 55 have a first camera 34 that moves information on the substrate holding unit 10, processes an image captured by the first camera 34, and electronic components on the substrate 16. A substrate recognition means for recognizing the mounting position 16a is configured.
[0049]
The second recognition processing unit 56 processes the image captured by the second camera 35 to obtain the position of the chip 6 in the electronic component supply unit 2. The second camera 35 and the second recognition processing unit 56 have a second camera 35 that moves information of the electronic component supply unit 2, and the second camera 35 recognizes the position of the chip 6 of the electronic component supply unit 2. It becomes the 1st electronic component recognition means to do.
[0050]
The third recognition processing unit 57 processes the image captured by the third camera 15 and recognizes the position of the chip 6 held by the mounting head 33. The third camera 15 and the third recognition processing unit 57 have the third camera 15 that images the chip 6 held by the mounting head 33, processes the image captured by the third camera 15, and mounts the mounting head. The second electronic component recognizing means recognizes the position of the chip 6 held by 33.
[0051]
The recognition results obtained by the first recognition processing unit 55, the second recognition processing unit 56, and the third recognition processing unit 57 are sent to the control unit 54. The data storage unit 53 stores various data such as the inspection result of the mounting state inspection of the chip 6. The operation unit 51 is an input device such as a keyboard or a mouse, and performs data input and control command input. The display unit 52 displays an imaging screen by the first camera 34, the second camera 35, and the third camera 15 and displays a guidance screen at the time of input by the operation unit 51.
[0052]
Next, processing functions of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 6, a broken line frame 54 indicates a processing function by the control unit 54 shown in FIG. Here, the processing functions executed by the first camera movement processing unit 54a, the second camera movement processing unit 54b, the pickup head operation processing unit 54c, and the mounting head operation processing unit 54d are the first camera movement control means, Second camera movement control means, pickup control means, and mounting control means are configured.
[0053]
The first camera movement processing unit 54 a controls the first camera moving mechanism to position the first camera 34 when imaging the substrate 16 held by the substrate holding unit 10, and the mounting head 33. The retreat operation of moving the first camera 34 to a position that does not hinder the mounting of the chip 6 is performed. Here, the imaging of the substrate 16 is performed by imaging the bad mark application position when the substrate 16 is carried in, imaging the electronic component mounting position 16a before the chip 6 is mounted, and electronic component after the chip 6 is mounted. This is performed for three types of imaging of the mounting position 16a. The second camera movement processing unit 54b controls the pickup head moving mechanism to perform the positioning operation of the second camera 35 when imaging the chip 6 of the electronic component supply unit 2.
[0054]
The pickup head operation processing unit 54c shows a function realized by executing a program for controlling the pickup head 37 and the pickup head moving mechanism. Based on the recognition result of the second recognition processing unit 56, the electronic component Control related to a series of operations from picking up the chip 6 from the supply unit 2 by the pick-up head 37 to delivery of the chip 6 to the mounting head 33 is performed.
[0055]
That is, the pickup head operation processing unit 54c controls the pickup unit to (1) set the plurality of nozzles 37b to these chips 6 based on the positions of the plurality of chips 6 recognized by the first electronic component recognition unit. Pickup control means for performing a pickup operation of individually aligning and picking up individually, and (2) a delivery operation of positioning a plurality of nozzles 37b picking up the chip 6 in the delivery position in an inverted state. Yes.
[0056]
The mounting head operation processing unit 54d indicates a function executed by a program for controlling the mounting head 33 and the mounting head moving mechanism. The mounting head 33 has a function of controlling a series of operations from receiving the chip 6 to mounting on the substrate 16. This is performed based on the position of the electronic component mounting position 16 a obtained by the electronic component mounting position detection processing unit 55 a of the first recognition processing unit 55 and the position of the chip 6 obtained by the third recognition processing unit 57.
[0057]
That is, the mounting head operation processing unit 54d controls the mounting means to receive (1) a plurality of nozzles 33a that are vertically inverted by the nozzles 37b at the delivery position and simultaneously receiving and holding the plurality of chips 6 from the plurality of nozzles 37b. Based on the operation and (2) the position of the electronic component mounting position 16a recognized by the substrate recognition unit and the position of the chip 6 recognized by the second electronic component recognition unit, the chip 6 held by the nozzle 33a is replaced with the substrate 16 It is a mounting control means for performing the mounting operation of mounting individually on the electronic component mounting position 16a.
[0058]
In addition to the electronic component mounting position detection processing unit 55a, the first recognition processing unit 55 includes a board inspection processing unit 55b and a mounting state inspection processing unit 55c. In the mounting operation by the mounting head operation processing unit 54d, the pass / fail determination result of the substrate 16 detected by the substrate inspection processing unit 55b is referred to, and only the electronic component mounting position 16a determined to pass in the pass / fail determination is a chip. 6 is executed.
[0059]
The inspection result recording processing unit 54f performs processing for storing the above-described substrate pass / fail determination result by the substrate inspection processing unit 55b and the mounting state inspection result of the chip 6 by the mounting state inspection processing unit 55c. These inspection results are sent to the inspection result recording processing unit 54 f for data processing and stored in the inspection result storage unit 53 a provided in the data storage unit 53.
[0060]
This electronic component mounting apparatus is configured as described above. Hereinafter, an electronic component mounting method will be described with reference to FIGS. In FIG. 7, a large number of chips 6 are attached to the adhesive sheet 5 held by the electronic component supply unit 2. In the substrate holding unit 10, the substrate 16 is positioned on each of the first substrate holding mechanism 10A and the second substrate holding mechanism 10B. In the electronic component mounting shown here, a plurality (four in this case) of chips 6 are sucked and held by four nozzles 33a arranged in a predetermined arrangement on the mounting head 33, and these four chips 6 are held in one mounting turn. The plurality of electronic component mounting positions 16a of the substrate 16 are sequentially mounted.
[0061]
First, as shown in FIG. 7A, the first camera 34 is moved onto the substrate 16 held by the first substrate holding mechanism 10A of the substrate holding unit 10 by the first camera moving mechanism. Then, as shown in FIG. 13A, the first camera so that the image capturing range 19 sequentially surrounds the left four electronic component mounting positions 16 a among the eight electronic component mounting positions 16 a set on the substrate 16. 34 are sequentially moved to capture a plurality of electronic component mounting positions 16a and bad mark application positions and capture images, and then the first camera 34 is retracted from above the substrate 16 (see FIG. 7B). .
[0062]
Then, the image of the image capturing range 19 captured by the first camera 34 is processed by the first recognition processing unit 55 to recognize the position of the electronic component mounting position 16a (see FIG. 13A) on the substrate 16 (see FIG. 13A). First step). In the recognition of the substrate 16, along with the position recognition of the electronic component mounting position 16 a, it is determined whether the substrate 16 is a defective substrate to which a bad mark is applied as a result of substrate inspection performed in the previous process. Is called.
[0063]
In parallel with the imaging operation in the substrate holding unit 10, the second camera 35 is moved above the electronic component supply unit 2 by the pickup head moving mechanism, and a plurality of lines arranged in a plane with the bumps 6a facing upwards. The chip 6 is imaged by the second camera 35. The acquired image is processed by the second recognition processing unit 56 to recognize the positions of the plurality of chips 6 (second step). At this time, the mounting head 33 stands by at the delivery position of the chip 6. The container 17a of the viscous material supply stage 17 is in a lowered state in which the rod of the cylinder 17b is immersed in order to avoid interference with the pickup head 37.
[0064]
Next, the pickup head 37 is moved on the electronic component supply unit 2, and as shown in FIG. 7B, the mounting head 33 is moved to these chips based on the positions of the plurality of chips 6 recognized in the second step. 6 are sequentially aligned, and a plurality of chips 6 are individually picked up by the nozzle 37b (third step).
[0065]
Next, as shown in FIG. 8A, the pickup head 37 moves to the delivery position, where the chip 6 is delivered to the mounting head 33. First, the nozzle 37b is turned upside down, and the plurality of chips 6 picked up by the nozzle 37b are turned upside down (fourth step). The plurality of chips 6 that are turned upside down and have the bumps 6a facing upward are simultaneously received and held from the nozzles 37b by the plurality of nozzles 33a of the mounting head 33 (fifth step).
[0066]
Thereafter, the pickup head 37 moves onto the electronic component supply unit 2. Then, the mounting head 33 moves onto the viscous material supply stage 17. At this time, the container 17a is raised by the cylinder 17b, and the chip 6 is lowered with respect to the viscous body 18 in the container 17a, whereby the viscous body 18 is transferred and applied to the bumps 6a on the lower surface.
[0067]
Next, the mounting head 33 holding the four chips 6 in each nozzle 33 a moves above the third camera 15 and performs a scanning operation for imaging the chip 6. Thereby, the image of the lower surface of the chip 6 held by each nozzle 33a is captured by the third camera 15, and the position of the chip 6 is recognized by the third recognition processing unit 57 performing recognition processing on this image. (Sixth step).
[0068]
Thereafter, the operation shifts to the mounting operation. At this time, the chip 6 is mounted only on the electronic component mounting position 16a for which the first recognition processing unit 55 determines that the board inspection is acceptable. The mounting head 33 moves above the substrate holding unit 10 as shown in FIG. And here, based on the position of the electronic component mounting position 16a obtained by the first recognition processing unit 55 in the first step and the position of the chip 6 obtained by the third recognition processing unit 57 in the sixth step, The bumps 6a of the plurality of chips 6 held by the nozzles 33a are aligned with the electrodes 16b at the electronic component mounting position 16a, and the chips 6 are individually mounted as shown in FIG. 13B (step 7). . Here, among the plurality of electronic component mounting positions 16a of the substrate 16 positioned by the first substrate holding mechanism 10A, the chip 6 is mounted only at the electronic component mounting position 16a determined as non-defective in the substrate inspection.
[0069]
When the mounting head 33 mounts the chip 6, the second camera 35 is moved above the plurality of chips 6 to be picked up next in the electronic component supply unit 2, and the plurality of chips 6 are moved to the second camera. The image is taken at 35 and the position of the chip 6 is recognized. Then, as shown in FIG. 9B, the pickup head 37 is moved on the electronic component supply unit 2, and the plurality of chips 6 are sequentially picked up by the nozzles 37 b based on the recognized positions of the plurality of chips 6.
[0070]
In parallel with this operation, the first camera 34 images the substrate 16. Here, the inspection of the mounting state of the chip 6 mounted on the substrate 16, the position detection of a plurality of electronic component mounting positions 16 a on which the chip 6 is mounted in the next mounting turn, and the board quality of these electronic component mounting positions 16 a A determination is made.
[0071]
That is, in this imaging, as shown in FIG. 13C, the first camera 34 is sequentially moved so that the image capturing range 19 sequentially surrounds the eight electronic component mounting positions 16 a set on the substrate 16. Then, the first camera 34 is retracted from above the substrate 16. Then, the image captured by the first camera 34 is processed by the first recognition processing unit 55, and the next inspection process is performed.
[0072]
First, for the images in the four image capturing ranges 19 on the left side, an inspection of the mounting state of the chip 6, that is, whether or not the position / posture deviation of the chip 6 is normal is inspected. For the four image capturing ranges 19 on the right side, the substrate inspection before the chip 6 is mounted is performed together with the position detection of the electronic component mounting position 16a of the substrate 16.
[0073]
Next, as shown in FIG. 10A, the pickup head 37 moves to the delivery position, where the chip 6 is delivered to the mounting head 33. That is, first, the nozzle holding portion 37a is turned upside down so that the chip 6 held by the nozzle 37b faces upward. Then, the nozzles 33a of the mounting head 33 are aligned with the chips 6 and moved up and down, and the plurality of chips 6 are simultaneously sucked by the nozzles 33a.
[0074]
Thereafter, as shown in FIG. 10B, the pickup head 37 moves onto the electronic component supply unit 2. Then, the transfer head 33 moves onto the viscous material supply stage 17 and lowers the chip 6 with respect to the viscous material 18 in the container 17a in the raised state, thereby transferring the viscous material 18 to the bumps 6a on the lower surface. Apply.
[0075]
Next, the mounting head 33 that holds four chips in each nozzle 33 a performs a scanning operation that moves above the third camera 15. Thereby, the image of the chip 6 held by each nozzle 33a is taken into the third camera, and the position of the chip 6 is detected by the third recognition processing unit 57 performing recognition processing on this image.
[0076]
Next, the operation moves to the mounting operation. At this time, the chip 6 is mounted only on the electronic component mounting position 16a for which the first recognition processing unit 55 determines that the board inspection is acceptable. The mounting head 33 moves above the substrate holder 10 as shown in FIG. Then, the mounting operation is performed based on the position of the electronic component mounting position 16a obtained by the first recognition processing unit 55, the position of the chip 6 obtained by the third recognition processing unit 57, and the determination result by the substrate inspection.
[0077]
In other words, among the plurality of electronic component mounting positions 16a of the substrate 16 positioned by the first substrate holding mechanism 10A, the chips 6 held by the nozzles 33a of the mounting head 33 are sequentially positioned at the electronic component mounting positions 16a determined to be non-defective. The chip 6 held by the mounting head 33 is mounted on the four electronic component mounting positions 16 a that are not mounted on the substrate 16 while causing the mounting head moving mechanism to perform the positioning operation.
[0078]
Thereby, as shown in FIG. 13D, the mounting of the chip 6 on the eight electronic component mounting positions 16a of the substrate 16 is completed. During the mounting operation of the chip 6 by the mounting head 33, the second camera 35 is moved again onto the chip 6 of the electronic component supply unit 2, and the next chip 6 picked up by the second camera 35 is imaged. .
[0079]
Then, as shown in FIG. 11B, the pickup head 37 is moved above the electronic component supply unit 2, and the chips 6 are sequentially moved by the nozzles 37 b based on the positions of the chips 6 obtained by the second recognition processing unit 56. Pick up. In parallel with this operation, the first camera 34 is moved onto the substrate 16 held by the first substrate holding mechanism 10A of the substrate holding unit 10 by the first camera moving mechanism. Then, among the eight electronic component mounting positions 16a of the substrate 16, the first camera 34 is sequentially moved so as to capture the images so that the image capturing range 19 sequentially surrounds the right four electronic component mounting positions 16a (FIG. 13). (E)).
[0080]
Then, the image of the image capturing range 19 captured by the first camera 34 is processed by the first recognition processing unit 55, and the mounting state of the chip 6 at the electronic component mounting position 16a of the substrate 16 is inspected. In addition, the first camera 34 that has finished imaging with the first substrate holding mechanism 10A moves onto the non-mounted substrate 16 held by the second substrate holding mechanism 10B, where the chip 6 is mounted next. The planned electronic component mounting position 16a is imaged, and the position detection and board inspection of the electronic component mounting position 16a are performed.
[0081]
After this imaging operation, as shown in FIG. 12, the substrate 16 is carried out from the first substrate holding mechanism 10A to the substrate delivery section 13, and a new substrate 16 is carried into the first substrate holding mechanism 10A. Thereafter, the same operation is continuously repeated.
[0082]
In the process of repeatedly executing the above mounting operation, as described below, a plurality of operations are executed in parallel, and there are restrictions and degrees of freedom in the execution timing of the plurality of operations. To do. For example, in the first step of imaging the substrate 16 of the substrate holding unit 10 by the first camera 34 and recognizing the position, the plurality of chips 6 that are turned upside down are received by the mounting head 33, and the third camera 15 What is necessary is just to carry out at the time until imaging and position recognition. That is, the operation of the first step shown in FIG. 7A overlaps at least a part of the time for executing the operations of the fifth step to the sixth step shown in FIGS. 8A to 8B. Do it on time.
[0083]
Further, in the electronic component supply unit 2, the next chip 6 is imaged and recognized by the second camera 35 within the time from the imaging / position recognition by the third camera 15 to the mounting of the chip 6 on the substrate 16. Just complete it. That is, the second step is completed for a plurality of chips 6 to be mounted next within the time period from the sixth step shown in FIG. 8B to the seventh step shown in FIG. 9A. Let
[0084]
Further, the viscous body 18 is applied to the bumps 6a of the chip 6 from the time when the chip 6 is received and held by the mounting head 33 to the time when the chip 6 is mounted on the substrate 16, that is, as shown in FIG. This is performed within the time from the completion of the step until the start of the seventh step shown in FIG.
[0085]
As shown in the above embodiment, in an electronic component mounting operation for mounting an electronic component that requires inversion on a substrate, such as a chip on which a bump is formed, a plurality of electronic components are taken out from the electronic component supply unit. By providing the pickup means that is reversed and delivered to the mounting head, the work efficiency of the electronic component mounting work can be improved.
[0086]
【The invention's effect】
According to the present invention, there is provided pick-up means for taking out a plurality of electronic components from an electronic component supply unit that supplies electronic components in a planar shape with the terminal facing upward, and inverting the taken-out electronic components upside down and delivering them to the mounting head. By providing, it is possible to improve the work efficiency of the electronic component mounting work for an electronic component that requires reversal.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a side sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 3 is a plan sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.
FIG. 4 is a partial perspective view of an electronic component supply unit of the electronic component mounting apparatus according to the embodiment of the present invention.
FIG. 5 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention.
FIG. 6 is a functional block diagram showing processing functions of the electronic component mounting apparatus according to the embodiment of the present invention.
FIG. 7 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
FIG. 8 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
FIG. 9 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
FIG. 10 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
FIG. 11 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
FIG. 12 is a process explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.
FIG. 13 is a plan view of a substrate to be mounted with an electronic component according to an embodiment of the present invention.
[Explanation of symbols]
2 Electronic parts supply department
6 chips
10 Substrate holder
10A First substrate holding mechanism
10B Second substrate holding mechanism
15 Third camera
16 substrates
16a Electronic component mounting position
17 Viscous material supply stage
30 Center beam member
31 First beam member
32 Second beam member
33 Mounted head
33a nozzle
34 First camera
35 Second camera
37 Pickup head
37b nozzle
54c Pickup Head Operation Processing Unit
54d Mounted head motion processing unit
55 1st recognition process part
56 Second recognition processing unit
57 Third recognition processing unit

Claims (8)

  1. An electronic component mounting apparatus for mounting an electronic component on a substrate by aligning a terminal of the electronic component with an electrode formed at an electronic component mounting position of the substrate, wherein the electronic component is planarized with the terminal facing upward A plurality of electronic component supply units arranged and supplied; a substrate holding unit disposed at a position away from the electronic component supply unit in the first direction; and a first camera that moves above the substrate holding unit. A board recognition unit that processes an image captured by the first camera and recognizes an electronic component mounting position of the board; and a second camera that moves above the electronic component supply unit. A first electronic component recognizing means for recognizing the position of the electronic component in the component supply unit; and a pin that has a plurality of pickup nozzles and vertically flips the electronic component picked up by the electronic component supply unit to be positioned at the delivery position And a plurality of mounting nozzles arranged in the same arrangement as the pickup nozzle, and a plurality of electronic components inverted by the pickup nozzle by the mounting nozzle at the mounting position of the substrate held by the substrate holding portion A mounting means for individually mounting and a third camera for capturing an image of the electronic component held by the mounting nozzle, and an image of the electronic component held by the mounting nozzle by processing an image captured by the third camera A second electronic component recognizing means for recognizing a position; and the pickup means for controlling (1) the plurality of pickup nozzles based on the positions of the plurality of electronic components recognized by the first electronic component recognizing means. Pick-up operation for individually picking up these electronic components and individually picking them up. (2) Multiple pick-ups that pick up electronic components. Pick-up control means for performing a delivery operation for positioning the nozzle in the delivery position with the nozzle turned upside down, and controlling the mounting means. (1) Upside down by the pickup nozzle at the plurality of mounting nozzles at the delivery position Receiving operation for simultaneously receiving and holding a plurality of electronic components from a plurality of pickup nozzles, and (2) the position of the electronic component mounting position recognized by the substrate recognition means and the electronic component recognition recognized by the second electronic component recognition means An electronic component mounting apparatus comprising mounting control means for performing a mounting operation for individually mounting the electronic components held by the mounting nozzle on the electronic component mounting position of the substrate based on the position.
  2. A first camera moving mechanism for moving the first camera above the substrate holding portion; and controlling the first camera moving mechanism; (1) when the mounting means is separated from above the substrate holding portion; The first camera is moved above the substrate holding part (2) After the substrate is imaged by the first camera, the first camera is retracted to a position where it does not interfere with the mounting means. 2. The electronic component mounting apparatus according to claim 1, further comprising camera movement processing means.
  3. The electronic component mounting apparatus according to claim 1, further comprising a viscous material supply unit configured to supply a viscous material to a terminal of the electronic component held by the mounting nozzle.
  4. The pickup means includes a pickup head having a plurality of pickup nozzles and a reversing mechanism for reversing the pickup nozzles, and a pickup head moving mechanism for moving the pickup head between the component supply unit and the delivery position. And the mounting means includes a mounting head having a plurality of mounting nozzles and a mounting head moving mechanism for moving the mounting head between the delivery position and the substrate holding portion, and the pickup head moving mechanism causes the second to move. 2. The electronic component mounting apparatus according to claim 1, wherein the camera is moved integrally with the pickup head.
  5. An electronic component mounting method for mounting an electronic component on a substrate by aligning a terminal of the electronic component with an electrode formed at the electronic component mounting position of the substrate, wherein the substrate held by the substrate holding portion is captured by the first camera. A first step of recognizing a plurality of electronic component mounting positions on the substrate by capturing and acquiring an image and processing the image, and a plurality of lines arranged in a plane with the terminals facing upward in the electronic component supply unit A second step of recognizing the position of a plurality of electronic components by capturing an image of the electronic component with a second camera, processing the image, and processing the image, and a plurality of electronic components recognized in the second step A third step of aligning the plurality of pickup nozzles with these electronic components based on the positions and individually picking up the pick-up nozzles, and turning the plurality of pickup nozzles upside down. A fourth step of vertically flipping a plurality of electronic components picked up by a nozzle, and a fifth step of simultaneously receiving and holding the plurality of vertically flipped electronic components from a plurality of pickup nozzles by a plurality of mounting nozzles; In a sixth step and a first step, the third camera captures a plurality of electronic components held by the mounting nozzle, acquires images, processes the images, and recognizes the positions of these electronic components. Based on the recognized positions of the plurality of electronic component mounting positions and the positions of the plurality of electronic components recognized in the sixth step, the electronic component terminals held by the mounting nozzle and the electrodes of the electronic component mounting position are aligned. The electronic component mounting method characterized by including the 7th step which mounts individually by performing.
  6. 6. The electronic component mounting method according to claim 5, wherein the first step is performed at a time that overlaps at least a part of a time during which the fifth to sixth steps are executed.
  7. 6. The electronic component mounting method according to claim 5, wherein the second step is completed for a plurality of electronic components to be mounted next within a time period during which the sixth step to the seventh step are executed.
  8. The viscous material is applied to the terminals of the plurality of electronic components held by the plurality of mounting nozzles within a time period from the completion of the fifth step to the start of the seventh step. 5. The electronic component mounting method according to 5.
JP2002075759A 2002-03-19 2002-03-19 Electronic component mounting apparatus and electronic component mounting method Expired - Fee Related JP3636153B2 (en)

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US7033842B2 (en) 2002-03-25 2006-04-25 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
WO2005041630A1 (en) 2003-10-24 2005-05-06 Matsushita Electric Industrial Co. Ltd. Electronic component mounting apparatus and electronic component mounting method
JP4949114B2 (en) * 2007-04-11 2012-06-06 新光電気工業株式会社 Connection material coating apparatus and semiconductor device manufacturing method
JP5358526B2 (en) * 2010-07-15 2013-12-04 ヤマハ発動機株式会社 Mounting machine
JP5358529B2 (en) 2010-07-23 2013-12-04 ヤマハ発動機株式会社 Mounting machine
JP5505658B2 (en) * 2011-12-20 2014-05-28 Tdk株式会社 Electronic device manufacturing method, electronic component mounting frame, electronic component stored in mounting frame, and surface mounting device
JP6038526B2 (en) * 2012-06-01 2016-12-07 ローム株式会社 Electronic component assembly manufacturing equipment
CN104956785B (en) * 2013-01-31 2019-02-26 株式会社富士 Bare die feedway
WO2015145530A1 (en) * 2014-03-24 2015-10-01 富士機械製造株式会社 Die mounting system and die mounting method
CN107546137B (en) * 2016-06-23 2019-11-26 上海微电子装备(集团)股份有限公司 Chip bonding device and its bonding method
JP2019012782A (en) * 2017-06-30 2019-01-24 Towa株式会社 Work conveying apparatus, manufacturing apparatus of electronic component, work conveying method, and manufacturing method of electronic component

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JP3341753B2 (en) * 1996-07-04 2002-11-05 松下電器産業株式会社 Bonding equipment for workpieces with bumps
JP3301433B2 (en) * 2000-07-27 2002-07-15 松下電器産業株式会社 Electronic component mounting equipment

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