CN1764367A - Position related data conversion device and operation system of substrate mounting to parts - Google Patents
Position related data conversion device and operation system of substrate mounting to parts Download PDFInfo
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Abstract
To provide a position associated data conversion device which realizes easy data change, and a component mounting substrate operating machine comprising the data conversion device. In the component mounting inspection machine, a reference mark provided on each of a component and a glass substrate 30 is imaged from a rear side, and its position is obtained with both sides of the transparent glass substrate 30 constituting a liquid crystal panel inverted; mounting misregistration is obtained in the electronic circuit component mounting machine and printed; and an operator corrects it. In the process, designed mounting position coordinate data, mounting misregistration data, and the image of the glass substrate 30 as shown in (Fig 13(a)) and displayed in a display screen 124 are subjected to coordinate conversion as shown in (Fig 13(b)) in accordance with the state of the glass substrate 30 in inspection, and mounting misregistration data on a screen is corrected while monitoring mounting misregistration printed by the operator with the glass substrate 30 put in the same coordinate surface as the inspection coordinate surface in the same state. After corrected, mounting misregistration data or the like is returned to the data in a designed state of the glass substrate 30 as shown in (Fig 13(a)).
Description
Technical field
The present invention relates to position related data conversion device, particularly the data conversion due to the coordinate transform.
Background technology
Position related data for example has the installation site coordinate data that is used for installing electronic circuit component in electronic-circuit-component mounting machine on component-mounted substrate.When parts are installed, installation head and assembly supply device and base plate keeping device are relatively moved, take out electronic circuit component by installation head from assembly supply device, and it is installed on the parts installation site of component-mounted substrate according to the installation site coordinate data.At this moment, detect the site error of the caused parts installation sites such as holding position error of the component-mounted substrate due to the holding position sum of errors base plate keeping device that parts keep the electronic circuit component due to the tool, it is revised, electronic circuit component is installed on the component-mounted substrate, however, the installation site of electronic circuit component still has deviation.Therefore, in the real assembling system of the electronic circuit component of following patent literature 1 record, be independent of electronic-circuit-component mounting machine and be provided with the installation check machine, check installation accuracy, revise the installation site coordinate data as required.After electronic circuit component was installed, component-mounted substrate was fed to the installation check machine with intact posture, by camera head electronic circuit component is made a video recording, and detects position deviation according to this camera data, automatically the correcting part installation position data.
By contrast, the installation check that has is to make component-mounted substrate show back of the body counter-rotating, and the face that makes the side that electronic circuit component has been installed is that parts had both been installed under the prone state and carried out.For example, has plenty of face in a side that on component-mounted substrate, is mounted of the body of electronic circuit component, promptly keep on the face of opposition side of the side that tool keeps a plurality of datum marks being set by parts, after taking out electronic circuit component from assembly supply device, by camera head datum mark is made a video recording, obtain the holding position error that parts keep the electronic circuit component due to the tool, revise, install.Also have plenty of in a plurality of parts installation site of component-mounted substrate each a plurality of datum marks are set, they are made a video recording, thereby obtain the site error of parts installation site, revise, install.In this occasion, if component-mounted substrate is transparent, after making the counter-rotating of the table back of the body, no matter be parts installation site or electronic circuit component, datum mark all can see through and display from the component-mounted substrate dorsal part, thereby just can make a video recording to these datum marks, according to camera data, obtain the installation site deviation of the electronic circuit component that has been mounted.
Patent documentation 1: the spy opens the 2003-110288 communique
Summary of the invention
Yet, under the state that the component-mounted substrate table back of the body has been reversed, obtained the occasion of installation site deviation, just pretty troublesome if the operator revises the installation site coordinate data according to its deviation, be easy to generate job error.Component-mounted substrate is set at the state that has reversed with respect to the inspection coordinate surface table of the installation check machine back of the body, detects each the installation site deviation on X-axis, the Y direction.The X-axis of this inspection coordinate surface, the direction of Y-axis and positive and negative direction and the design coordinate surface that makes the installation site coordinate data are identical with the reference coordinate face that sets for electronic-circuit-component mounting machine, if make component-mounted substrate by show back of the body counter-rotating around the revolution of Y-axis, positive and negative just opposite when installing in the installation site of X-direction deviation, the operator will consider this point and revise, the installation site, operation is pretty troublesome, is easy to generate mistake.
The present invention is to be background with above-mentioned situation, is that problem proposes to provide a kind of data change to be easy to position related data conversion device.
In order to solve above-mentioned problem, position related data conversion device involved in the present invention comprises with the lower part and constituting: (a) storage is as the storage device of the position related data of the data that are associated with at least 1 position of coordinate transform object on first coordinate surface; (b) indication should be implemented coordinate transform instruction unit to the coordinate transform of second coordinate surface for being stored in above-mentioned position related data in this storage device; (c) abide by the coordinate transform indication that this coordinate transform instruction unit is done, implement to be stored in above-mentioned position related data in the above-mentioned storage device to the coordinate converting section of the coordinate transform of second coordinate surface; (d) the data change portion that on this second coordinate surface, above-mentioned position related data is changed; (e) indication should be the contrary coordinate transform of the above-mentioned position related data that has been changed by data change portion the contrary coordinate transform instruction unit of the position related data on above-mentioned first coordinate surface; And the indication of (f) abideing by this contrary coordinate transform instruction unit, implement contrary coordinate converting section against coordinate transform.
The inscape of this position related data conversion device such as storage device can be arranged on 1 device, also can separately be arranged on the multiple arrangement.Occasion the latter, taking and giving of data for example undertaken by connecting these devices with communication line or connecting line between multiple arrangement, or undertaken by wireless telecommunications, or carry out, thereby constitute position related data conversion device jointly with the state that on various recording mediums such as magnetic recording medias such as floppy disk, CD, photomagneto disk, has write down data.These communication lines etc. have constituted data transfer device, are controlled by data passes control part or data obtaining section, carry out giving and obtaining of data.
The change of the position related data that data change portion carried out can be with the change of for example data, variety of way such as revise, append, got carries out.
Position related data conversion device of the present invention, for example in the occasion of operator's change of location associated data, can be easily and mistake change rarely.This be because, data change carries out on second coordinate surface, but, the position related data that has been changed automatically becomes the position related data on first coordinate surface by inverse transformation, thereby the operator is as long as carry out data change to the coordinate transform object as the device on second coordinate surface, and self can not carry out it is scaled the change operation of the data on first coordinate surface.
Below, illustration is several in real desire, think the invention that can carry out the patent request (below, be sometimes referred to as " can ask invention "." the present invention " that can ask to invent the invention of having put down in writing in the scope that comprises at least as request also is " real desire invention ", but, the subordinate concept invention that comprises the real desire invention, upperseat concept that real desire is invented or the invention of other notion arranged also.) mode, describe for them.Each mode and claim item are such, by separately, to every pair with sequence number, quote other sequence number as required, put down in writing with this form.This is just in order to make understanding of the present invention easier, and technical characterictic that should be interpreted as putting down in writing in this specification and their combination do not only limit to the record of the following.Also having, put down in writing the occasion of a plurality of items in one, is not to adopt these a plurality of items by Chang Yiqi.Can only select, adopt a part of item.In a word, can ask to invent wait with reference to the record of every subsidiary record, embodiment and explain, as long as meet this explanation, additional again other the mode of inscape and the mode that deletes inscape from every mode of every mode all belonged to the formula that can ask the side that invents.
In addition, following every in, (1) item is equivalent to claim 1, (2) item is equivalent to claim 2, (3) item and (a 4) device that merges is equivalent to claim 3, (5) item is equivalent to claim 4, (6) item is equivalent to claim 5, (7) item is equivalent to claim 6, (8) item is equivalent to claim 7, and (10) item is equivalent to claim 8, and (12) item, (13) item and (14) device that merges are equivalent to claim 9, (17) item is equivalent to claim 10, and (18) item is equivalent to claim 11.
(1) a kind of position related data conversion device comprises:
Storage is as the storage device of the position related data of the data that are associated with at least 1 position of coordinate transform object on first coordinate surface;
Indication should be implemented coordinate transform instruction unit to the coordinate transform of second coordinate surface for being stored in above-mentioned position related data in this storage device;
Abide by the coordinate transform indication that this coordinate transform instruction unit is done, implement to be stored in above-mentioned position related data in the above-mentioned storage device to the coordinate converting section of the coordinate transform of second coordinate surface;
The data change portion that on this second coordinate surface, above-mentioned position related data is changed;
Indication should be the contrary coordinate transform of the above-mentioned position related data that has been changed by data change portion the contrary coordinate transform instruction unit of the position related data on above-mentioned first coordinate surface; And
Abide by the indication of this contrary coordinate transform instruction unit, implement the contrary coordinate converting section of contrary coordinate transform.
(2) according to the position related data conversion device of (1) record, wherein, above-mentioned coordinate transform instruction unit comprises that indication should implement the coordinate transforming instruction unit of the kind of coordinate transform for being stored in above-mentioned position related data in the above-mentioned storage device.
The kind of coordinate transform headed by the device of putting down in writing for the position related data conversion device of (8) item, has various kinds.The coordinate transform instruction unit can be the device of always only indicating identical coordinate transform (for example table of coordinate transform object back of the body counter-rotating), but, according to this position related data conversion device, can indicate at least 1 execution in the coordinate transform of a plurality of kinds, optionally carry out at least 1 of coordinate transform of a plurality of kinds, carry out the coordinate transform of position related data rich and variedly.
(3) according to (1) or (a 2) position related data conversion device of putting down in writing, wherein, comprise that demonstration carried out the above-mentioned position related data of coordinate transform by above-mentioned coordinate converting section and carried out at least one side's the display part of picture of the above-mentioned coordinate transform object of coordinate transform.
Also can be that display part shows the position related data that is stored in the storage device.
Display part can constitute in every way.Particularly, the display part of display position associated data can be with display frame, and 7 lines (section) are combined into 8 fonts, and make suitable line glittering, thereby the numerical value display part of the numeral of demonstration from 0 to 9, perhaps comprise a plurality of lamps, by their variety of ways such as the display part formation of optionally lighting a lamp video data.
If at least one side of the picture of display position associated data and coordinate transform object, for example, the operator just can easily carry out data change with reference to this demonstration.Particularly, if the picture of displaing coordinate transforming object thing just can confirm that being in what kind of state by coordinate transforming object thing after the coordinate transform carries out data change, easily.
(4) according to the position related data conversion device of (a 3) record, wherein, above-mentioned display part comprises display frame.
If employing display frame for example, just can once show a plurality of data.Also have, can change picture, or change and easily show lot of data with picture unit by continuity ground.
(5) position related data conversion device of any record in basis (1) to (4) item, wherein, above-mentioned coordinate converting section is to the relative position of the entity of the initial point of above-mentioned first coordinate surface with to the relative position device that constant mode is carried out coordinate transform before and after above-mentioned coordinate transform of the entity of the initial point of above-mentioned second coordinate surface with above-mentioned coordinate transform object.
(6) Xiang position related data conversion device is an example of this position related data conversion device, in addition, for example, the always certain mode of distance of the initial point of the initial point of the datum mark of having set on the coordinate transform object and first coordinate surface and second coordinate surface also is this a mode.
According to this position related data conversion device, for example,, just can easily carry out in the occasion that the operator carries out data change.This is because can not consider the variation to the relative position of the initial point of first, second coordinate surface of the coordinate transform object due to the coordinate transform.The relative position that also has plenty of entity does not change, thereby the computing of coordinate transform becomes simply, can carry out rapidly.
(6) according to (a 5) position related data conversion device of putting down in writing, wherein, above-mentioned coordinate converting section is the device that carries out coordinate transform in the initial point consistent mode of the initial point of the datum mark set on the above-mentioned coordinate transform object and above-mentioned first coordinate surface and second coordinate surface.
For example, position related data in being stored in storage device is to be the occasion that benchmark has made with the datum mark set on the coordinate transform object, the datum mark that position related data after the coordinate transform also becomes with the coordinate transform object is the data of benchmark, and coordinate transform is just very simple.
(7) according to the position related data conversion device of any record in (1) to (6), wherein, for above-mentioned first coordinate surface and second coordinate surface, X-axis all is parallel to each other with Y-axis each other each other, and for X-axis and Y-axis separately, positive negative direction is identical.
At first, second coordinate surface is the occasion of XY coordinate surface, the X-axis that can be a side X-axis and the opposing party's Y-axis, a side's Y-axis and the opposing party is parallel to each other, X-axis is parallel each other with Y-axis each other, coordinate surface for variety of way such as at least one side's of X-axis and Y-axis positive and negative direction is opposite, but, according to this position related data conversion device, coordinate transform is simple especially.Also have, the change of the position related data that the operator carried out is easy to.Though this is because the data that changed are with the data that the coordinate transform object is positioned at the state on first coordinate surface different, but just can obtain to be positioned at the data of the state on first coordinate surface by inverse transformation, thereby the operator can also be positioned at first coordinate surface with the coordinate transform object and considers equally in second coordinate surface, carry out data change, in addition, second coordinate surface had not both had the variation of the direction of X-axis and Y-axis with respect to first coordinate surface, do not have the variation of positive and negative direction yet, in second coordinate surface, can carry out data change equally yet with the occasion that the coordinate transform object is positioned at first coordinate surface.
In addition, be subordinated in the mode of (5) item and (6) item at this, as what illustrate, can carry out coordinate transform by the simple displacement or the alternation of signs of X coordinate and Y coordinate in the item of back inventive embodiment, coordinate transform is very simple.
(8) according to (a 7) position related data conversion device of putting down in writing, wherein, above-mentioned coordinate transform instruction unit comprises that indication should implement the coordinate transforming instruction unit of the kind of coordinate transform for being stored in above-mentioned position related data in the above-mentioned storage device, can be comprised by the kind of the coordinate transform of this coordinate transforming instruction unit indication around the counter-rotating of the back of the body of the table due to the revolution of X-axis, in the revolution of the counter-rotating of the back of the body of the table due to the revolution of Y-axis, positive direction and backward revolution at least 2 kinds.
(9) according to the position related data conversion device of (a 8) record, wherein, the absolute value of above-mentioned rotating angle is 90 degree.
The absolute value of angle is that the coordinate transform due to 90 revolutions of spending is fairly simple, and conversion is easy.
(10) according to the position related data conversion device of (8) item or (9) record, wherein, above-mentioned coordinate transform instruction unit and above-mentioned contrary coordinate transform instruction unit can be indicated above-mentioned coordinate transform and above-mentioned contrary coordinate transform in a plurality of kinds ground separately overlappingly.
According to this position related data conversion device, can carry out coordinate transform in the mode of Duoing than the kind of coordinate transform.
(11) position related data conversion device of any record in basis (1) to (6) item, wherein, show the kind of above-mentioned coordinate transform by above-mentioned display part, and above-mentioned coordinate transform instruction unit comprises the coordinate transform kind selection portion of selecting the coordinate transform that will carry out from the kind of the coordinate transform that demonstrates.
Because the kind of coordinate transform is shown, thereby the indication of kind is easy to.If the kind of all coordinate transforms is shown simultaneously, it is just easy especially to select.
(12) according to the position related data conversion device of any record in (1) to (11) item, wherein, above-mentioned coordinate transform object is a component-mounted substrate.
Component-mounted substrate is electronic circuit component to be installed and the substrate that forms electronic circuit, the such transparency carriers of glass substrate such as constituting liquid crystal panel, plasma display is arranged, and in base materials such as paper or glass cloth the such opaque substrate of substrate of synthetic resin such as epoxy resin-impregnated.Under the state that the component-mounted substrate table back of the body has been reversed during from dorsal part identification component installation base plate, if can specify its position to the electronic circuit portion of having installed on the surface of component-mounted substrate etc. like that clearly discerns, just can be described as transparent, though in the occasion that can not discern electronic circuit portion etc. fully be not to discern fully, the occasion that can not specify the position is exactly opaque.
Be to wait by printing circuitous pattern is set on component-mounted substrate, electronic circuit component is installed.Component-mounted substrate can be just to have carried electronic circuit component and the device that is not electrically connected as yet, also can be that reality that be electrically connected the back electronic circuit component adorned the device of having finished, and also can be the semi-finished product that are in the process between them.
Also have, electronic circuit component can be real is contained on the component-mounted substrate and form the parts of electronic circuit, also can be the parts of monomer, also can be on component-mounted substrate electronic circuit component to be installed and the device that formed electronic circuit.
(13) position related data conversion device of putting down in writing according to (12), wherein, above-mentioned position related data comprise be installed in the circuitous pattern that is located on the above-mentioned component-mounted substrate on and constitute the installation site associated data that the installation site of the electronic circuit component of electronic circuit is associated, this installation site associated data comprises the installation site coordinate data of installation site of regulation electronic circuit component and at least one side of the installation site deviation associated data relevant with the deviation of the installation site of electronic circuit component.
Installation site deviation associated data for example comprises the installation site deviation data and is used to eliminate at least one side of the installation site deviation elimination data of installation site deviation.
According to this position related data conversion device, can implement coordinate transform and make its change the installation site associated data.
(14) according to (a 13) position related data conversion device of putting down in writing, wherein, above-mentioned data change portion comprises that at least one side to above-mentioned installation site coordinate data and above-mentioned installation site deviation associated data revises, and obtains the parts installation site correction portion that data are revised in the installation site.
The installation site revise data can be comprise in the design the installation site coordinate data and as the data of the correction installation site deviation associated data of the installation site deviation associated data that has been corrected, also can be the data that comprise as the correction installation site coordinate data of the installation site coordinate data that has been corrected, also can be to comprise the data of revising installation site deviation associated data.
Revise the occasion that data comprise the installation site coordinate data in the design and revise installation site deviation associated data in the installation site, installation site deviation associated data is corrected, according to installation site coordinate data in the design and correction installation site deviation associated data, acquisition can be eliminated deviation and installation site coordinate data that electronic circuit component is installed, and the installation site coordinate data just is corrected indirectly.In this occasion, when the correction of installation site coordinate data,, revise and carried out occasion repeatedly revising to revising installation site deviation associated data, just can revise up-to-date correction installation site deviation associated data, obtain new correction installation site deviation associated data.No matter installation site deviation associated data is the installation site deviation data, or installation site deviation elimination data, can both be updated to up-to-date data by correction.Revise data in the installation site and comprise the occasion of revising the installation site coordinate data, directly revise the installation site coordinate data, the installation site coordinate data itself of electronic circuit component being installed with regard to obtaining to eliminate deviation.
(15) according to (a 14) position related data conversion device of putting down in writing, wherein, above-mentioned contrary coordinate transform instruction unit indicates above-mentioned installation site to revise the inverse transformation of data, and contrary coordinate converting section is abideed by the indication that contrary coordinate transform instruction unit is done, and data is revised in the installation site carry out inverse transformation.
If the installation site coordinate data in the design is to make under component-mounted substrate is positioned at the state of first coordinate surface, just carry out inversion and bring the electron gain circuit block, promptly through correction and the installation site coordinate data of can precision installing well the employed data of the installation of component-mounted substrate by the installation site being revised data.
(16) according to the position related data conversion device of any record in (1) to (15), wherein, above-mentioned data change portion comprises the data input part of importing data.
Data input part can be at least a kind the device that comprises in the various input units such as positioning equipments such as mouse, tracking ball, touch-screen, keyboard.
(17) a kind of to the component-mounted substrate working rig, comprising:
(12) position related data conversion device of a record;
The base plate keeping device of holding member installation base plate;
Above-mentioned component-mounted substrate is implemented the operation head of operation;
The relative movement device that aforesaid substrate holding device and above-mentioned operation head are relatively moved; And
Control the control device of above-mentioned position related data conversion device, aforesaid substrate holding device, above-mentioned operation head and above-mentioned relative movement device.
The operation head for example have the installation head of electronic circuit component is installed on the component-mounted substrate, on component-mounted substrate high-viscosity fluids such as coating paste scolder or bonding agent applicator head, check electronic circuit component to the installation check head of the installment state of component-mounted substrate, check that high-viscosity fluid checks that to the coating of the coating state of component-mounted substrate head, ACF (AnisotropicConductive Film, anisotropic conductive film) paste first-class.Installation head for example had to the coating of component-mounted substrate the device of the parts installation site mounting electronic circuit component of high-viscosity fluid, mounting electronic circuit component and to its device that pressurizes, the device that heats again on component-mounted substrate.The ACF application head has for example pastes the device of paying ACF on the electrode terminal of glass substrate.
Inscape beyond the first-class position related data conversion device of operation has constituted the component-mounted substrate working rig.Position related data conversion device can be all to be located at 1 on the component-mounted substrate working rig, also can be that at least a portion is independent of the component-mounted substrate working rig is provided with.At least a portion at position related data conversion device is independent of the occasion that the component-mounted substrate working rig is provided with, this independently at least a portion for example can be located at comprising on the unified control computer that the production line unification of component-mounted substrate working rig is controlled, also can be arranged with unified control computer branch.
This to the component-mounted substrate operating system in, position related data comprises the job position associated data as the data that are associated with the job position of operation head, and the job position associated data comprises for example at least one side of job position coordinate data and job position deviation associated data.(13) extremely each feature of position related data conversion device of (16) record is being replaced installation head and operation head, the operation head is that the occasion of the operation head beyond the installation head also can adopt, according to this to the component-mounted substrate operating system, (1) item each effect and effect can be obtained, and the operating system that for example data change is easy, operation energy precision is carried out well can be obtained to the record of (16) item.For example, if the operation head is the adhesive applicating head, the change that just can obtain the adhesive applicating position related data is easily carried out, and applies the adhesive applicating system that precision can be carried out well.
(18) a kind of electronic circuit component installation system comprises:
(12) position related data conversion device of any record in (16);
Supply with the assembly supply device of electronic circuit component;
The base plate keeping device of holding member installation base plate;
Got above-mentioned electronic circuit component from above-mentioned assembly supply device, it is installed in installation head on the above-mentioned component-mounted substrate;
The relative movement device that above-mentioned assembly supply device, aforesaid substrate holding device and above-mentioned installation head are relatively moved; And
At least control the control device of above-mentioned position related data conversion device, aforesaid substrate holding device, above-mentioned installation head and above-mentioned relative movement device.
According to this, the change that can obtain installation site associated data for example easily, electronic circuit component can the fine electronic circuit component installation system that carries out of precision to the installation of component-mounted substrate.
Description of drawings
Fig. 1 is that summary is represented as the vertical view that can ask the electronic circuit component installation system of inventive embodiment.
Fig. 2 is the end view that above-mentioned electronic circuit component installation system represented in summary.
Fig. 3 is the vertical view of 1 set substrate mark that is illustrated in a plurality of parts installation site of the glass substrate that is mounted for chip part in the above-mentioned electronic circuit component installation system.
Fig. 4 is that expression is as the upward view that is installed in a kind of flip-chip of the electronic circuit component on the above-mentioned glass substrate.
Fig. 5 is illustrated in to press from both sides the vertical view that the state of flip-chip has been installed every the ACF belt on the above-mentioned glass substrate.
Fig. 6 is the block diagram that the control device of above-mentioned electronic circuit component installation system represented to control in summary.
Fig. 7 is that summary represents to check that electronic circuit component on the above-mentioned electronic-circuit-component mounting machine is to the vertical view of the parts installation check machine of the installment state of glass substrate.
Fig. 8 is the end view of inspection camera head of the summary inspection head of representing above-mentioned parts installation check machine etc.
Fig. 9 is the block diagram that the control device of above-mentioned parts installation check machine represented to control in summary.
Figure 10 be the above-mentioned parts installation check machine of explanation carried out installation check the time the figure of posture of glass substrate.
Figure 11 is the vertical view that expression makes the state that the glass substrate table back of the body that flip-chip has been installed reversed.
To be expression be displayed on the state in the display frame and the figure that obtains of the position of explanation datum mark and parts mark by the chip of the camera head of above-mentioned parts installation check machine shooting gained to Figure 12.
Figure 13 is when being illustrated in the inspection that above-mentioned parts installation check machine carried out, the looking like etc. and make glass substrate show to carry on the back counter-rotating and be presented at the figure that looks like etc. of installation site associated data in the display frame and component-mounted substrate when checking installment state from the posture of growing crosswise of the installation site associated data that shows at the initial stage in the display frame of electronic-circuit-component mounting machine, component-mounted substrate.
Figure 14 is when being illustrated in the inspection that above-mentioned parts installation check machine carried out, the looking like etc. and make glass substrate carry out being presented under the state of right rotation the figure that looks like etc. of installation site associated data in the display frame of electronic-circuit-component mounting machine and component-mounted substrate from the posture of growing crosswise of the installation site associated data that shows at the initial stage in the display frame of electronic-circuit-component mounting machine, component-mounted substrate.
Figure 15 is that expression makes glass substrate carry out right rotation and table back of the body counter-rotating and be presented at the figure that looks like etc. of installation site associated data in the display frame of electronic-circuit-component mounting machine and glass substrate when checking installment state from the posture of growing crosswise.
Figure 16 is that the block diagram to the control device of controlling as the electronic circuit component installation system of other embodiment that can ask to invent represented in summary.
Figure 17 is that summary is illustrated in the electronic-circuit-component mounting machine with control device that Figure 16 represents the block diagram that inspection is installed in the control device that the parts installation check machine of the installment state of the electronic circuit component on the glass substrate controls.
Embodiment
Embodiment
Following with reference to accompanying drawing, explain and can ask several embodiment of inventing.In addition, except following enforcement was somebody's turn to do, the mode that can ask invention to put down in writing from the item of above-mentioned (summary of the invention) according to those skilled in the art's knowledge, was implemented in the mode of having carried out various changes, improvement.
The electronic-circuit-component mounting machine of the electronic circuit component installation system of present embodiment, as shown in Figure 5, be with the fitting machine of ACF belt 8 pre-connections on the transparent glass substrate 30 that constitutes liquid crystal panel 28 (with reference to Fig. 1) as the chip part 92 of liquid crystal display drive circuit parts, with installation site related data conversion device, constituted as a kind of electronic circuit component installation system to the component-mounted substrate operating system as an embodiment that can ask to invent.
Chip part 92 is a kind of of electronic circuit component, the various parts such as flip-chip that for example have Fig. 4 to represent.It is a plurality of that chip part 92 (is installed in the face (being mounted face) of the side on the glass substrate 30, i.e. the face of the opposition side of a side that is kept by installation head described later) at the back side of body 94 and is provided with, and is 2 datum marks 96 in the present embodiment.These datum marks 96 are opaque mark in the present embodiment, and spaced-apart position on the diagonal of body 94 is symmetrical arranged the center of chip part 92, and the distance of this center in all directions of X-axis, Y-axis equated.After, datum mark 96 is called parts mark 96.Be the occasion of flip-chip at chip part 92, shown in Figure 4, be provided with a plurality of projections 98 in the rear side of body 94, parts mark 96 is located at the part that departs from the zone that is provided with these projections 98.Projection 98 is for example made by gold.
On the parts installed surface of the mounting core chip part 92 of glass substrate 30, as shown in Figure 3, be provided with datum mark 82.This datum mark 82 is called local mark, as shown in Figure 2, is provided with a plurality ofly for 1 parts installation site of glass substrate 30, in the present embodiment is 2.These 2 datum marks 82 become the state that has departed from chip part 92 under chip part 92 is installed in state on the glass substrate 30, be located at the straight line that is positioned at by the parts installation site, position on the diagonal of the chip part 92 that promptly has been mounted, to the parts installation site is symmetrical, and the distance of parts installation site in all directions of X-axis, Y-axis equated.Datum mark 82 is opaque in the present embodiment.After, datum mark 82 is called substrate mark 82.
Electronic-circuit-component mounting machine, represent to have base station 10, be located at base positioner 12 on the base station 10, pressing platform 14, apparatus for mounting component 16, assembly supply device 18 and control camera system 22, control the control device 24 (with reference to Fig. 6) of these devices 12 etc. etc. as Fig. 1 and Fig. 2 summary.Base positioner 12 has as the operation post 34 of substrate holder and operation post mobile device 36.Operation post mobile device 36 is to make the X-direction of operation post 34 2 directions of mutually orthogonal in as horizontal plane and Y direction and move respectively with the Z-direction of the vertical direction of this X-axis, Y direction quadrature in the present embodiment, and makes it around the rotating device of the axis parallel with Z-direction.In addition, this X-axis, Y direction are the directions on the XY coordinate surface of setting as the reference coordinate face for this electronic-circuit-component mounting machine.
Operation post mobile device 36 as shown in Figure 2, comprises operation post X-direction mobile device 40, operation post Y direction mobile device 42, operation post Z-direction mobile device 44 and operation post slewing equipment 46.Operation post Y direction mobile device 42 is included in Y-axis slide block 48 that is provided with movably in Y direction on the base station 10 and the Y-axis slide block mobile device that Y-axis slide block 48 is moved in Y direction.Operation post X-direction mobile device 40 is included in X-axis slide block 50 that is provided with movably in X-direction on the Y-axis slide block 48 and the X-axis slide block mobile device that X-axis slide block 50 is moved in X-direction.Operation post Z-direction mobile device 44 is included in Z axle slide block 52 that is provided with movably at above-below direction on the X-axis slide block 50 and the Z-direction mobile device that makes 52 liftings of Z axle slide block.Each mobile device of this X-direction, Y direction and Z-direction is that drive source constitutes with servo motor 54,56,58 (with reference to Fig. 6) respectively, makes the slide block 50,48,52 as each moving-member of X-axis, Y-axis, Z axle move to position arbitrarily at each direction of principal axis respectively.Constitute the servo motor the 54,56, the 58th of drive source, actuator a kind of is a kind of motoring motor as electro-motor, is the motor that the precision of angle of revolution can be controlled well.Can replace servo motor with stepper motor.Can with the linear motor drive source also.
On Z axle slide block 52, be provided with operation post 34 pivotally, make its revolution by operation post slewing equipment 46 around vertical axis.In the present embodiment, operation post slewing equipment 46 be make operation post 34 around vertical axis by set angle, for example by the rotating device of 90 degree substeps.Operation post 34 has substrate supporting face 62 upwards and substrate sucking device (diagram is omitted).The substrate sucking device has a plurality of sorptions hole in 62 upper sheds of substrate supporting face, these sorption holes optionally are communicated with negative pressure source and atmosphere by transfer valve, the sorption on substrate supporting face 62 by the supply of negative pressure, keep liquid crystal panel 28, it is communicated with atmosphere and unclamps liquid crystal panel 28.
Apparatus for mounting component 16 as depicted in figs. 1 and 2, comprises installation head 350, installation head mobile device 352, heater 354 and pressue device 356.It is a Y direction mobile device, a Z-direction mobile device and a slewing equipment of drive source separately with the servo motor that installation head mobile device 352 has in the present embodiment, be to make installation head 350 move to position arbitrarily in Y-axis and Z axle all directions, and around the axis parallel with Z-direction in just contrary two directions with the device of angle rotary arbitrarily.
Parts keep tool 362 to have parts maintaining part 366 in body 360 outstanding bottoms from the beginning.Parts maintaining part 366 is to come the device of sorption, holding core chip part 92 by negative pressure, and the switching by transfer valve makes it optionally be communicated with negative pressure source and atmosphere.Parts maintaining part 366 is communicated with negative pressure source, and the sorption chip part 92 by being supplied to negative pressure is by unclamping chip part 92 to atmosphere opening.On parts maintaining part 366, be provided with heater 354.Heater 354 comprises heater in the present embodiment.
Above-mentioned assembly supply device 18 as shown in Figure 1, is located at the position of leaving base positioner 12 in Y direction.Assembly supply device 18 is the device of being supplied with said chip parts 92 by pallet in the present embodiment.Chip part 92 is taken out from pallet and is placed on by the illustrated parts withdrawing device of omission in the present embodiment and presets on the platform (diagram is omitted), and installation head 350 is got this chip part 92.Also have, the above-mentioned platform 14 of pressing is provided with base positioner 12 adjacency in Y direction on base station 10.Pressing platform 14 is substrate supporting parts, is made by a kind of quartz glass as transparent material in the present embodiment, allows seeing through of light, has the substrate supporting face 370 of the level that is shaped as the コ font long in X-direction, that see from Y direction.
Above-mentioned camera system 22 has parts image unit 380, substrate image unit 382 and image unit mobile device 384 (with reference to Fig. 6) in the present embodiment as shown in Figure 2.Parts image unit 380 has parts camera head 386 and lighting device 388 (with reference to Fig. 6),,, by the chip part 92 that installation head 350 is keeping it is made a video recording from the below illumination in installation head 350 with pressing between the platform 14 in Z-direction.Substrate image unit 382 has substrate camera head 392 and lighting device 394 (with reference to Fig. 6), is positioned at above-mentioned below of pressing platform 14, makes a video recording from the below to glass substrate 30 by the transparent platform 14 of pressing.Camera head 386,392 is the device of being made a video recording by ccd video camera in the present embodiment, and lighting device 388,394 all is the device of irradiation visible light.Image unit 380,382 is provided with integratedly, by means of as the image unit mobile device 384 of common mobile device and move in X-axis, Y-axis and Z axle all directions.Therefore, it is each mobile device of X-axis, Y-axis and the Z-direction of drive source with the servo motor separately that image unit mobile device 384 has, and makes parts image unit 380 and substrate image unit 382 move to position arbitrarily at each direction of principal axis.
Above-mentioned control device 24 as shown in Figure 6, is to have CPU100, ROM102, RAM104 and to be connected the device of installation and control computer 106 of their bus.Bus is connected with input/output interface 108, thereby is connected with the pattern process computer 110 of handling the view data that is obtained by camera head 386,392, image unit 380,382, input unit 114, data read writing station 116 etc.Input unit 114 comprises for example positioning equipment and keyboard such as mouse.
Input/output interface 108 also is connected with printer 126 grades with the various actuator of the formation drive source of the various devices of formation electronic-circuit-component mounting machine such as servo motor 54 by drive circuit 120, controls display frame 124 by control circuit 122.The part of the control display frame 124 of display frame 124 and control device 24 has constituted display unit.
Store among ROM102 and the RAM104 this electronic-circuit-component mounting machine the elemental motion program, with become various programs such as the program (being called the parts installation procedure later on) of the glass substrate 30 corresponding components installation exercises of manipulating object, the program of parts installation site associated data correction operation and data etc.The component information of each parts of comprise the data relevant in the parts installation procedure, having supplied with etc. as the data of the erection sequence of the coordinate data of the position of the coordinate data of the parts installation site of position that should mounting core chip part 92 on the glass substrate 30, substrate mark 82, regulation electronic circuit component, at the data of parts installation site mounted component and never illustrated PDG (parts data maker) with the assembly supply device 18 of supplying with chip part 92 and parts supply unit thereof.Erection sequence is set in a plurality of installation sites each.Program is carried out by the elemental motion program, make installation head 350 move to the parts extracting position by means of installation head mobile device 352, from assembly supply device 18, take out chip part 92, it is moved to the parts installation site of having set on the glass substrate 30 and install.
The parts installation position data that comprises in the parts installation procedure is a design data, in the present embodiment with on the glass substrate 30 predefined 1 be that datum mark makes.For example, the glass substrate 30 that Fig. 1 represents be make mutually orthogonal 2 edge portions each since glass substrate 130 outstanding to foreign side, as and the short brink installation portion 252 of the long side installation portion 250 of the parallel protuberance in its long limit and the protuberance parallel with its minor face on the device of chip part 92 has been installed separately, but, with 1 in 4 summits, for example, as 2 installation portions 250, a side of 252 long side installation portion 250, summit as the opposition side of the opposing party's short brink installation portion 252 sides is a datum mark, make this datum mark be positioned at initial point as the design coordinate surface of XY coordinate surface, long limit is parallel with X-direction, minor face is parallel with Y direction, and with each coordinate figures of all parts installation sites for X-axis, Y-axis becomes the posture of negative value and makes design data.Installation site for being installed in all chip parts 92 on the glass substrate 30 makes design data with this posture.The reference coordinate face that has set for this electronic-circuit-component mounting machine, be supported on the operation post 34 orientating glass substrate 30 as, chip 92 is installed under the state of the posture on the long side installation portion 250, it is parallel with X-axis, the Y-axis of design coordinate surface respectively just to be configured to X-axis, Y-axis, and the positive and negative direction of X-axis, Y-axis is identical with the positive and negative direction of the X-axis that designs coordinate surface, Y-axis.The reference coordinate face of design coordinate surface and electronic-circuit-component mounting machine is orientated as under the state that chip part 92 is installed in the posture on the long side installation portion 250 at glass substrate 30, just becomes X-axis and Y-axis is parallel to each other, and their positive and negative direction unanimity.According to the position and the installation site coordinate data of the datum mark in the reference coordinate face, just can obtain the position of electronic-circuit-component mounting machine on the reference coordinate face of parts installation site.In addition, in this electronic-circuit-component mounting machine, beyond the glass substrate that chip part 92 is mounted is 2 limits at its mutually orthogonal, the occasion of the device of mounting core chip part 92 on 1 limit, 3 limits or 4 limits for example, also be similarly to set datum mark, each coordinate figure with all parts installation sites becomes negative value for X-axis, Y-axis, the long limit posture parallel with X-direction and make design data.The posture that these glass substrates have at end points under the state that chip part 92 has been installed on the long side installation portion of datum mark is the benchmark posture.
This electronic-circuit-component mounting machine is to be used as that the ACF belt 8 that connects material couples together chip part 92 and glass substrate 30 and the device that constitutes the electronic circuit assembly line of formation electronic circuit, diagram is omitted, but, at the substrate carriage direction, be provided with at the upstream side of electronic-circuit-component mounting machine ACF belt 8 is sticked on ACF labelling machine on the glass substrate 30, be provided with installing in the downstream, the chip part 92 of pre-connection on glass substrate 30 heats, pressurize, make junctor and even this press-connection machine of the electrode electrical connection that on glass substrate 30 and chip part 92, is provided with respectively.Glass substrate 30 from the ACF Tape dispenser transport and to the transporting of electronic-circuit-component mounting machine, be transported into the transporting and transporting, be transported into respectively and undertaken with glass substrate 30 from electronic-circuit-component mounting machine by omitting illustrated glass substrate conveyer to this press-connection machine.
Above-mentioned press-connection machine for example has base plate keeping device, heater and pressue device.Pressue device from clip up and down folder every ACF belt 8 and pre-connection glass substrate 30 and chip part 92, with the pressure higher than the pressurization of being undertaken by installation head 350 in electronic-circuit-component mounting machine chip part 92 is pressurizeed, heater is to heat it than the high temperature of heating of being undertaken by installation head 350.By this pressurization and heating, ACF belt 8 just pastes to be paid between the electrode pad of the electrode of chip part 92 and glass substrate 30, and chip part 92 is fixed on the glass substrate 30, and by the conducting particles in the ACF belt 8 two electrodes is electrically connected.
To be installed in chip part 92 on the glass substrate 30 is that the situation of flip-chip (being called for short chip later on) is an example, illustrates that this chip 92 is to the installation of glass substrate 30, the inspection of installment state and the correction of installation site associated data.Liquid crystal panel 28 has been pasted on the electrode pad of glass substrate 30 under the state of ACF belt 8 and has been transported into the electronic-circuit-component mounting machine from the ACF Tape dispenser, is positioned on the substrate supporting face 62 of operation post 34 and by sorption, maintenance.At this moment, liquid crystal panel 28 becomes long side installation portion 250 and short brink installation portion 252 and is held to the outstanding state of foreign side from operation post 34 as depicted in figs. 1 and 2.Also have, make operation post 34 be positioned at the high position of substrate supporting face 370 that its substrate supporting face 62 specific pressures platform 14, with respect to pressing platform 14 can move in the horizontal direction.
Then, at first, it is parallel with X-direction and be positioned at the posture of pressing on the platform 14 that operation post 34 is held in long side installation portion 250 to glass substrate 30, move by means of operation post mobile device 36, make in a plurality of parts installation site of long side installation portion 250 1 be positioned at the predefined crimping position of horizontal plane (be in the present embodiment X-direction long pressing platform 14 than the length direction middle position) the top.
After glass substrate 30 and chip 92 move, parts mark 96 and substrate mark 82 are made a video recording.During shooting, parts image unit 380 and substrate image unit 382 move to camera position by means of image unit mobile device 384 from escape hole.Camera position is for parts image unit 380, be positioned at the below that parts keep the chip 92 that tool 362 kept, it is the position that parts mark 96 is made a video recording, for substrate image unit 382, being positioned at the below of the parts installation site of glass substrate 30, is the position that substrate mark 82 is made a video recording.Parts image unit 380 moves in X-axis, Y direction by means of image unit mobile device 384, and 112 parts marks 96 to setting on the chip 92 are made a video recording, and move at above-below direction, focus on for parts mark 96.Substrate image unit 382 moves by means of image unit mobile device 384 too, focuses on, and 112 substrate marks 82 that are provided with on the parts installation site is made a video recording.The position of the Z-direction of glass substrate 30 (highly) is regulated by means of the lifting of operation post 34 also as required.Substrate image unit 382 is configured in the below of pressing platform 14, and but, it is transparent pressing platform 14, makes a video recording by transparent pressing platform 14 and transparent 30 pairs of substrate marks 82 of glass substrate.After the shooting, image unit 380,382 is hidden to escape hole.Escape hole is for example to leave crimping position in X-axis, Y direction, does not hinder the position that chip that installation head 350 carried out is installed.
According to the camera data of mark 82,96, just can obtain X-axis as chip 92 and glass substrate 30, Y direction site error horizontal position error and as rotating position error around the site error of Z axle.Obtain each position of 2 substrate marks 82, and obtain their mean place, obtain each position of 2 parts marks 96, and obtain their mean place, obtain the deviation of these mean places, just can obtain horizontal position error.Also have, obtain the straight line at the straight line at each center by 2 substrate marks 82 and each center by 2 parts marks 96, obtain the deviation of the rotation direction of these straight lines, thereby obtain rotating position error.
By operation post mobile device 36 operation post 34 is moved, revise the X-axis of glass substrate 30, each position of Y-axis, thereby revise the horizontal position error of chip 92 and glass substrate 30 by the elimination of level site error.The chip 92 and the X-axis of glass substrate 30, the position deviation of Y direction that produce owing to the correction of rotating position error also are corrected together.Also have, the rotating position error of chip 92 and glass substrate 30 makes installation head 350 be corrected, eliminate around the revolution of Z axle by a slewing equipment, and the position of chip 92 and glass substrate 30 is harmonious.Operation post 34 is descended, make substrate supporting face 62 and substrate prop up face 370 and be located in the same horizontal plane, the long side installation portion 250 of glass substrate 30 is positioned in is pressing on the platform 14.Then, installation head 350 descends by means of a Z shaft moving device, and chip 92 is positioned on the glass substrate 30.Chip 92 as shown in Figure 5, is installed on the glass substrate 30 with the posture of the approaching state of substrate mark 82 respectively with 2 parts marks 96.At this moment, parts maintenance tool 362 drops to respect to a body 360 by means of cylinder 364 and is positioned at the decline end position, from chip 92 and glass substrate 30 state of contact, Z axle slide block is descended, and makes chip 92 by glass substrate 30 crimping.The decline of this Z axle slide block is allowed to owing to a body 360 and parts keep relatively moving of tool 362, follow therewith, pressure in the balancing gate pit of cylinder 364 increases, if become more than the setting, just reduce pressure by pressure-reducing valve, make parts keep tool 362 to retreat with respect to a body 360, chip 92 just by glass substrate 30 with predefined pressure crimping.Also have, chip 92 is heated by the heater 354 that is provided with on the parts maintaining part, and 8 pressurized, the heating of ACF belt make chip 92 and glass substrate 30 pre-connections.In the present embodiment, a Z shaft moving device and cylinder 364 have constituted pressue device 356.
After the installation of chip 92, make installation head 350 unclamp chip 92 and rising, leave chip 92.Also have, operation post 350 is risen, glass substrate 30 is left pressing platform 14.The occasion of a plurality of chips 92 has been installed at the long side installation portion 250 of glass substrate 30, by moving of operation post 34 glass substrate 30 is moved, the parts installation site that next chip 92 is mounted moves to the top of crimping position, carry out after the correction of the shooting of mark 82,96 and site error, operation post 34 is descended, on the substrate supporting face 370 that long side installation portion 250 is positioned in pressing platform 14, carry out the installation of chip 92.
If all predetermined chips 92 have been installed on long side installation portion 250, operation post 350 is risen, glass substrate 30 is left pressing platform 14, and its dextrorotation is turn 90 degrees (see glass substrate 30 from the top, be clockwise direction), make short brink installation portion 252 become its posture parallel with the X-direction of the reference coordinate of electronic-circuit-component mounting machine than length direction.Then, carry out equally to the installation of long side installation portion 250, chip 92 is installed at short brink installation portion 252 with chip 92.In addition, the design and installation position coordinate data of design data is the data that glass substrate 30 is in the state of benchmark posture, and when the installation of 92 pairs of short brink installation portions 252 of chip, the installation site coordinate data will be carried out coordinate transform.
If install respectively all the parts installation sites at glass substrate 30, pre-connection chip 92, operation post 34 just rises by means of operation post mobile device 36, glass substrate 30 is left pressing platform 14, and it is moved in the horizontal direction, move it the position that transports that liquid crystal panel 28 is transported this press-connection machine.Then, liquid crystal panel 28 is transported this press-connection machine, in this press-connection machine, chip 92 and ACF belt 8 are heated, pressurize, projection 98 is electrically connected with pad by the conducting particles in the ACF belt 8.
For the chip 92 that like this has been connected, check installment state by parts installation check machine 150 (with reference to Fig. 7) with glass substrate 30.In the present embodiment, inspection is that this heating and this pressurization carried out at this press-connection machine finish, chip 92 is electrically connected with glass substrate 30 and carries out under the state that has been fixed, in the present embodiment, is undertaken by substrate mark 82 and parts mark 96 are made a video recording simultaneously.If chip 92 by ACF belt 8 and with glass substrate 30 pre-connections, under the state that has been pre-fixed, chip 92 can not depart from, and then also can check under this pre-fixes state.
When the installation of 92 pairs of glass substrates 30 of chip as described above, revise the chip 92 that installation head 350 kept and the horizontal position error and the rotating position error of glass substrate 30, however, the installation site also can produce deviation sometimes.Can think, this installation site deviation is not the holding position error as the glass substrate 30 due to the holding position sum of errors operation post 34 of the chip 92 due to the installation head 350, it is the deviation that chip 92 and glass substrate 30 produce separately, but for example, the deviation that the thermal expansion of the ball-screw of the position error of the image unit 380,382 due to the thermal expansion of the formation portion material of image unit mobile device 384 etc. and operation post mobile device 36, installation head mobile device 352 etc. etc. are produced by common reason for different chip 92 and glass substrate 30.Therefore, after chip 92 was installed, the inspection part installment state changed the installation site coordinate data according to this check result.
Followingly parts installation check machine 150 is described according to Fig. 7 to Fig. 9.Parts installation check machine 150 is independent of electronic-circuit-component mounting machine and is provided with, but, be made as in the present embodiment and can wholely move,, be made as the approaching position of electronic-circuit-component mounting machine that can move it with the installation of having carried out chip 92 for the glass substrate 30 that is carried out installation check.Parts installation check machine 150 is the digital quantizer of optical profile type in the present embodiment, as shown in Figure 7, comprise inspection desk 152, installation check head (be called for short later on and check head) 154, inspection head moving device 156, input unit 158, display unit 160 (with reference to Figure 12) and control device 162 (with reference to Fig. 9).
Inspection desk 152 has shape, the size that can also can set the glass substrate 30 of size a plurality of kinds inequality with the posture of lengthwise with the posture of growing crosswise, glass substrate 30 with level and on 2 limits of datum mark quadrature respectively with the X-axis posture parallel of checking coordinate surface with Y-axis, be fixed on the inspection desk 152 by fixture (diagram is omitted).Check head moving device 156 on a plane parallel, promptly in the inspection coordinate surface of level, check that 154 move making with the parallel respectively direction of the X-axis of mutually orthogonal and Y-axis with inspection desk 152.Therefore, check head moving device 156, represent, comprise that X-axis mobile device and y-axis shift move device as Fig. 7 summary.The X-axis mobile device comprises X-axis guide plate 170 and X-axis guide plate mobile device, and the moving device of y-axis shift comprises Y-axis guide plate 172 and Y-axis guide plate mobile device.X-axis guide plate mobile device and Y-axis guide plate mobile device respectively with the X-axis guide plate move with motor 176 and Y-axis guide plate move with motor 178 (with reference to Fig. 9) be drive source, comprise ball-screw and nut, make X-axis guide plate 170 and Y-axis guide plate 172 move to position arbitrarily in X-direction and Y direction respectively.
Check that 154 move to the position of checking in the coordinate surface arbitrarily by means of checking head moving device 156, the chip of the glass substrate of setting at inspection desk 152 30 having been installed from the top 92 is made a video recording.
Check 154, as shown in Figure 8, comprise and check camera head 400, lighting device 402 and guiding device 404, be located on the framework 410 of case shape.Check that camera head 400 is the device of being made a video recording by ccd video camera in the present embodiment, optical axis is horizontally disposed with.This ccd video camera is the device that can respond to visible light and the long near infrared light of ripple.Lighting device 402 has visible light source 412 and near-infrared light source 414, and guiding device 404 has prism 416 and half-reflecting mirror 418.
Control device 162 as shown in Figure 9, constitutes based on the computer (be called later on check computer) 210 that comprises CPU200, ROM202, RAM204 and be connected their bus.Bus is connected with input/output interface 212, thereby is connected with data read writing station 220 with the pattern process computer 218 of handling the view data that is obtained by 400 shootings of inspection camera head, inspection camera head 400, lighting device 402, input unit 158.Input unit 158 constitutes equally with above-mentioned input unit 114, and has the X-axis guide plate moved to move with motor 178 with motor 176 and Y-axis guide plate and carry out the function that fine motion is operated respectively.Be provided with motor operated device and even check a mobile actuating device.Input/output interface 212 also moves to move with motor 178 with motor 176 and Y-axis guide plate with the X-axis guide plate by drive circuit 226 and is connected, and controls display frame 232 by control circuit 230.The part of the control display frame 232 of display frame 232 and control device 162 has constituted display unit 160.Said motor 176,178 is made of servo motor in the present embodiment.
When the installation check of chip 92, make installation check machine 150 be positioned near the position of electronic-circuit-component mounting machine, here the operator can easily compare the display frame 124 of electronic-circuit-component mounting machine and 232 liang of sides of display frame of installation check machine 150.Then, glass substrate 30 is set on the inspection desk 152.Can check object substrate to glass substrate 30 grades with a plurality of inspection postures, the posture of for example growing crosswise, right rotation posture and left side revolution posture and make both both make progress postures and make parts that both certain in 6 postures of the combination of the downward posture of installed surface and being set on the inspection desk 152 of prone parts both had been installed of installed surface of the parts that make progress of installed surface of parts.
Shown in two dot dot dash among Figure 10, the posture of growing crosswise of glass substrate 30 is length direction and the parallel posture of X-axis of checking coordinate surface.Inspection desk 152 and fixture constitute, be set to the posture of growing crosswise at glass substrate 30, be parts both installed surface make progress posture the time, can set glass substrate 30, make that the direction and the positive and negative direction of direction and positive and negative direction and the X-axis of checking coordinate surface and Y-axis of the X-axis of above-mentioned design coordinate surface and Y-axis is identical, the posture that is set in the glass substrate 30 on the inspection desk 152 with the posture of growing crosswise and making progress is identical with the said reference posture, and the posture during promptly with installation chip 92 on long side installation portion 250 is identical.Inspection desk 152 (inspection coordinate surface) and fixture are set like this: when the glass substrate 30 that the posture during with design data on the design coordinate surface is placed is placed on the inspection desk 152, X-axis, the Y-axis of X-axis, Y-axis and the inspection coordinate surface of design coordinate surface are parallel to each other respectively, and positive and negative direction is also identical.Also have, the right rotation posture be make glass substrate 30 from be set in the posture of growing crosswise state on the inspection desk 152 (from above see the occasion of glass substrate 30, be clockwise direction) turned round 90 postures of spending to positive direction, left side revolution posture be to contrary direction (from above see the occasion of glass substrate 30, be counterclockwise) turned round the postures of 90 degree.
Parts had both been installed prone posture, as shown in figure 11, made glass substrate 30 show to carry on the back counter-rotating and obtain.Glass substrate 30 is transparent, also have, ACF belt 8 is the devices that are included in the conducting particles that the surperficial plating nickel of goldc grains forms, but be to reduce at the transit dose that makes illumination light and picture form light but contain the device of conducting particles on the belt with photopermeability of identification sign 96 with the distribution density that allows light scattering, sees through, can make a video recording to parts mark 96 by ACF belt 8.Therefore, make the counter-rotating of the glass substrate 30 table back of the body, parts had both been installed under the prone state, can it be made a video recording, check from the upside of glass substrate 30 (from the face side of the opposition side of parts both installed surface) perspective substrate mark 82 and 96 liang of sides of parts mark.In the present embodiment, the counter-rotating of the table back of the body is to be undertaken by the revolution around the Y-axis of checking coordinate surface of glass substrate 30.
Installation check carries out like this: the operator handles and checks head moving device 156, makes to check that 154 move, and substrate mark 82 and parts mark 96 are made a video recording, and obtains their position data.Glass substrate 30 is transparent, can both see the substrate mark 82 that is located at the position that the part that is mounted from the chip 92 of glass substrate 30 departed from from the table side of glass substrate 30 and dorsal part, but, the body 94 of chip 92 is opaque, can only see parts mark 96 from the face side that is installed in the side on the glass substrate 30 of chip 92, under chip 92 is installed in state on the glass substrate 30, just see parts mark 96 by glass substrate 30 and ACF belt 8 from the dorsal part (opposition side of parts installed surface) of glass substrate 30.Therefore, during inspection, make liquid crystal panel 28 show to carry on the back counter-rotating and be set on inspection desk 152.
Also have, in the present embodiment, installation check is to make glass substrate 30 table back of the body counter-rotatings, and identical direction is carried out when direction is in length and breadth installed with chip with respect to X-axis, Y-axis.Therefore, when the inspection of chip 92 has been installed on long side installation portion 250, glass substrate 30 to show to carry on the back the posture after the counter-rotating from the posture of growing crosswise corresponding and be set on the inspection desk 152 with the benchmark posture, when the inspection of chip 92 has been installed on short brink installation portion 252, for example glass substrate 30 carrying out right rotation from the posture of growing crosswise corresponding with the benchmark posture, and the posture after the counter-rotating of the table back of the body and being set on the inspection desk 152.
Installation check is by predefined order, and for example identical with parts erection sequence order is carried out.In electronic-circuit-component mounting machine, come the set parts erection sequence by above-mentioned parts installation procedure.Therefore, shown in Figure 13 (a), serial number, name of parts, installation site coordinate data and installation site deviation data that the operator installs display frame 124 display units of electronic-circuit-component mounting machine make according to the installation site coordinate data and to check that 154 move.
In the present embodiment, comprise installation site coordinate data and installation site deviation data, in the present embodiment as described later, revise the installation site deviation data according to the inspection of component installation state as the installation site associated data of position related data.In the installation site coordinate data that shows in the display frame 124 is design and installation position coordinate data as the installation position data that makes on above-mentioned design coordinate surface, the installation site deviation data is the correction installation site deviation data of having revised, at chip 92 during to the installation of glass substrate 30, according to the design and installation position coordinate data with revise the installation site deviation data, obtain to have eliminated the installation site deviation and installation site coordinate data that chip 92 can be installed.In the present embodiment, correction data in installation site comprise the design and installation position coordinate data and revise the installation site deviation data.Data presented in display frame 124, except the installation site deviation data, all make according to the parts installation procedure, also comprise and revise the installation site deviation data, all be stored among the RAM104 of computer 106, these data are to be used for that installment state inspection and installation site are revised and the video data that is shown, also be that the deviation that has been used to obtain to eliminate the installation site coordinate data of installation site deviation is eliminated the installation site coordinate data and obtained data, revising the installation site deviation data can be updated.
Shown in Figure 13 (a), at first, show as the initial stage, in display frame 124, show video data itself, i.e. the X of the design and installation position coordinate data of the installation site coordinate data that conduct has made, Y coordinate figure etc. on above-mentioned design coordinate surface.Also have, begin the back when carrying out installation check for the first time at chip 92 to the installation of a plurality of glass substrates 30, the installation site deviation is 0, shows 0 as its X, Y coordinate figure.In Figure 13 (a), illustrate the state of having obtained, imported the installation site deviation.
The picture that also shows glass substrate 30,130 and chip 92 in the display frame 124.They also are to show and show the picture of the chip of having installed on the picture of glass substrate 30,130 of benchmark posture and the glass substrate 30 92 as the initial stage.The benchmark posture of glass substrate 30, as mentioned above, it is the posture when long side installation portion 250 is installed chip 92, be and the identical posture of posture on above-mentioned design coordinate surface, be the posture (posture that length direction is parallel with the X-axis of electronic-circuit-component mounting machine) of growing crosswise, promptly do not make the posture (parts both installed surface become posture upwards) of its table back of the body counter-rotating.On the picture of chip 92, pay erection sequence is arranged.Also show the datum mark for example on the angle of glass substrate 30, set and X-axis, Y-axis in the display frame 124.Display frame 124 is rolled, thereby show a plurality of video datas in turn by the chip erection sequence.
The installation check of the chip of having installed at the long side installation portion 250 of glass substrate 30 92 at first, is described.When this is checked, make liquid crystal panel 28 from upwards and the posture of growing crosswise show back of the body counter-rotating around Y-axis, prone posture both be installed and be set on the inspection desk 152 with parts.Therefore, the operator makes in the display frame 124 and to show and make glass substrate 30 carry out the picture of installation site associated data under the state after the counter-rotating of the table back of the body and glass substrate 30 etc. from the benchmark posture.In this occasion, the operator rolls display frame 124, therefrom specify the installation site associated data of having set for long side installation portion 250 in all installation site associated datas, promptly from the data of serial number 1 to 4, the table back of the body of the picture of indication installation site associated data and glass substrate 30 etc. reverses.Shown in Figure 13 (a), in display frame 124,, show the kind of all coordinate transforms with installation site associated data etc.In the present embodiment, the kind of coordinate transform is 3 kinds of upset (the table back of the body counter-rotating due to the revolution of Y-axis), right rotation and anticlockwises, and the absolute value of the anglec of rotation is 90 degree in the present embodiment.The coordinate transform of the kind of the installation site associated data that acquisition in the kind of the coordinate transform that the operator has selected to be shown by input unit 114 is consistent with the posture of the glass substrate of having set on inspection desk 152 30, indication is carried out.The execution of indication upset herein shown in Figure 13 (b), is carried out the coordinate transform of the table back of the body counter-rotating due to the revolution of Y-axis of installation site associated data, and makes the picture of glass substrate 30 etc. show back of the body counter-rotating, and it is shown.
In the present embodiment, the above-mentioned design coordinate surface that makes the installation site coordinate data has constituted first coordinate surface, first coordinate surface and obtain to carry out second coordinate surface of the coordinate transform data that coordinate transform forms for the data on first coordinate surface, in the present embodiment, all be that X-axis is parallel each other with Y-axis each other, and the positive and negative separately direction of X-axis and Y-axis is identical.Also have, coordinate transform is that the datum mark of the glass substrate 30 that the table back of the body reversed is carried out with the initial point of second coordinate surface is consistent.Therefore, the installation site coordinate data is through after the coordinate transform, and the Y coordinate figure is intact, but, the X coordinate figure become positive and negative symbol anti-value.
In display frame 124, the glass substrate 30 that has reversed with the table back of the body is harmonious and shows datum mark and X-axis, Y-axis.This X-axis, Y-axis are X-axis, the Y-axis of second coordinate surface, but, parallel with X-axis, the Y-axis of first coordinate surface, positive and negative direction is also identical, thereby second coordinate surface with check that coordinate surface becomes identical coordinate surface, consistent in the posture of the picture of glass substrate 30 grades that demonstrate in the display frame 124 with the posture of the glass substrate of on inspection desk 152, having set 30, the operator just can easily move check 154 while the demonstration of seeing display frame 124 according to erection sequence, allow check that 400 pairs of chips 92 of camera head make a video recording.In the present embodiment, the design coordinate surface has constituted first coordinate surface, as mentioned above, for design coordinate surface and inspection coordinate surface, X-axis, Y-axis are parallel to each other, positive and negative direction is also identical, thus second coordinate surface with check that coordinate surface becomes identical coordinate surface, on second coordinate surface with checking coordinate surface on the identical posture of posture place glass substrate 30.
In the present embodiment, the operator carries out the fine motion operation by input unit 158 to motor 176,178, and X-axis guide plate 170 and Y-axis guide plate 172 are moved, and makes to check on 154 chip 92 that move to as the inspection object.Shooting is to be undertaken by checking that 400 pairs of each 1 substrate marks 82 near each other of camera head and parts mark 96 are made a video recording simultaneously.At this moment, shine visible light and near infrared light respectively from visible light source 412 and near-infrared light source 414.The glass substrate 30 that visible light transmissive is transparent and irradiated substrate mark 82 see through glass substrate 30 from the reverberation of substrate mark 82, through prism 416 and the level bending, see through half-reflecting mirror 418 and to checking camera head 400 incidents.Make visible light source 412 illumination of being carried out and the light shaft coaxle of checking camera head 400, substrate mark 82 is by the visible light vertical irradiation, thereby fall to penetrating the given illumination light of illumination and form the picture of substrate mark 82 by means of coaxial, substrate mark 82 just can clearly be made a video recording by inspection camera head 400.
See through glass substrate 30 and ACF belt 8 and irradiation part mark 96 from the near infrared light of near-infrared light source 414 irradiation, the picture that has been reflected by parts mark 96 forms light transmission ACF belt 8, glass substrate 30, bending behind prism 416 is through half-reflecting mirror 418 and to checking camera head 400 incidents.Parts mark 96 is also formed picture by radiation of visible light.The light transmission ACF belt 8 of irradiation part mark 96 and arrive parts mark 96, light quantity has reduced, and but, the long near-infrared luminous energy of ripple that produces from near-infrared light source 414 sees through ACF belt 8 and irradiation part mark 96 fully.Picture forms the light quantity of light also owing to ACF belt 8 has reduced, and but, near infrared light cooperates irradiation part mark 96 with visible light, form picture by two light, thereby owing to the effect that multiplies each other of visible light and near infrared light, just can clearly make a video recording to parts mark 96.
Camera data is handled by pattern process computer 218, shown in Figure 12 (a), and the picture of display mark 82,96 in display frame 232.In addition, also make a video recording to being located at pad on the glass substrate 30 etc., but, diagram has been omitted.Figure 12 (a) illustrates the understanding for the ease of the relation of the picture of the picture of substrate mark 82 and parts mark 96, each 2 substrate mark 82 and parts mark 96 are made a video recording, it has been presented at state in the display frame 232, but, in fact be shown in Figure 12 (b) by what check that camera head 400 makes a video recording simultaneously, shows, the part of chip 92 promptly has only 1 substrate mark 82 and near 1 parts mark 96 thereof.
Shown in Figure 12 (b), the picture with chip 92 in display frame 232 waits, and shows 4 cursor CX1, CX2, CY1, CY2.Cursor CX1, CX2 are parallel with Y-axis respectively straight lines, and cursor CY1, CY2 are parallel with X-axis respectively straight lines, are presented in the display frame 232 fullly.The operator operates by input unit 158, can make cursor CX1, CX2 move to position arbitrarily in X-direction respectively, makes cursor CY1, CY2 move to position arbitrarily in Y direction respectively.
The operator makes cursor CX1, CX2 respectively shown in Figure 12 (b), is harmonious the obtaining of indicating positions with the center of substrate mark 82 and the center of parts mark 96.In display frame 232,, they are differently shown, for example with 2 cursors, show CX1, CX2 as the cursor name, and preestablishing is that certain and substrate mark 82 among cursor CX1, the CX2 are harmonious, and still is harmonious with parts mark 96, indicates to the operator., cursor CX1 and substrate mark 82 are harmonious herein, cursor CX2 and parts mark 96 are harmonious.Also have, the operator is harmonious cursor CY1, CY2 respectively with the center of substrate mark 82 and the center of parts mark 96, the obtaining of indicating positions.Cursor CY1 and substrate mark 82 are harmonious, and cursor CY2 and parts mark 96 are harmonious.The position of cursor is the position of mark, check computer 210 the position of cursor CX1, CX2, CY1, CY2 as each X-axis of substrate mark 82 and parts mark 96, the position of Y direction (coordinate figure on the inspection coordinate surface), the serial number of for example installing with the data that specify chip 92 is mapped, and is stored among the RAM204.Serial number obtains by operator's input.In the present embodiment, shooting is undertaken by erection sequence, thereby erection sequence also is shooting order, also can with the shooting storaging position data that is mapped in proper order.Also have, each position data of each X-axis of 2, Y direction pay expression be in substrate mark 82 and the parts mark 96 which position data the mark recognition data and be stored.
If obtained the position for one group substrate mark 82 and parts mark 96, the operator just operation of the fine motion by motor 176,178 makes and checks that 154 move, shown in Figure 12 (c), inspection camera head 400 is made a video recording to the substrate mark 82 and the parts mark 96 of another group, it is presented in the display frame 232.Then, cursor CX1, CX2, CY1, CY2 are harmonious with substrate mark 82 and parts mark 96, obtaining of indicating positions each position data of substrate mark of obtaining 82 and parts mark 96, is stored among the RAM204 with each position data of one group substrate mark 82 and parts mark 96.
The operator makes successively according to erection sequence and checks that 154 move, and chip 92 is made a video recording, and obtains the position of substrate mark 82 and parts mark 96.If obtained the position of mark 82,96 for all chips 92 of having installed at long side installation portion 250, just write in the photomagneto disk as recording medium, in its input installation and control computer 106 being stored in position datas among the RAM204 by data read writing station 220.
The following installation check of the chip 92 installed at the short brink installation portion 252 of glass substrate 30 of explanation.
In this occasion, for example, the operator make glass substrate 30 from upwards and the posture of growing crosswise carry out after the right rotation, with the state that carried out the counter-rotating of the table back of the body around Y-axis and be set on the inspection desk 152.Then, the operator makes and shows in the display frame 124 of electronic-circuit-component mounting machine and make glass substrate 30 show that from initial stage of Figure 14 (a) expression posture carries out the picture of installation site associated data under the state that right rotation and the table back of the body reversed and glass substrate 30 etc., carry out the fine motion operation of motor 176,178 while seeing this display frame 124, make and check that 154 move, make and check that 400 pairs of substrate marks 82 of camera head and parts mark 96 make a video recording in order by the installation of chip 92.
In this occasion, the operator selects " right rotation " in display frame 124, after indication is carried out, selects " upset " again, and indication is carried out.The operator rolls display frame 124, shown in Figure 14 (a), makes it show the installation site associated data of having set for the chip 92 that is installed in short brink installation portion 252, i.e. the installation site associated data of serial number 5,6 etc.Then, specify these installation site associated datas, and select " right rotation ", indication is carried out.Like this, shown in Figure 14 (b), just show the right rotation of coordinate transform carry out to(for) the installation site associated data, and show and also make the picture of glass substrate 30 etc. carry out right rotation.In this occasion also be, make that for first coordinate surface and second coordinate surface, X-axis is parallel each other with Y-axis each other, and the positive and negative separately direction of X-axis and Y-axis is identical, right rotation the datum mark of glass substrate 30 and the initial point of second coordinate surface also consistent, carry out coordinate transform like this.Therefore, the Y coordinate figure before the right rotation becomes the X coordinate figure after the revolution, the positive and negative sign-inverted of the X coordinate figure before the right rotation value (the X coordinate figure before the revolution is multiplied by the value of-1 gained) become Y coordinate figure after the right rotation, carry out coordinate transform like this.
Under the state of the installation site associated data of having specified serial number 5,6, carry out selection, the execution indication of " upset " again.Like this, as shown in figure 15, in display frame 124, show the installation site associated data of the coordinate transform carried out right rotation and the counter-rotating of the table back of the body, and show the picture of glass substrate 30 etc.Also be to make that X-axis is parallel each other with Y-axis each other for first coordinate surface and second coordinate surface in this occasion, and the positive and negative separately direction of X-axis and Y-axis is identical, also have, the datum mark of glass substrate 30 is consistent with the initial point of second coordinate surface, carries out coordinate transform like this.For the right rotation shown in Figure 14 (b) the installation site associated data, carrying out the Y coordinate figure does not change, the coordinate transform of the positive and negative counter-rotating of X coordinate figure, installation site associated data for the A-stage of Figure 14 (a) expression, the positive and negative sign-inverted of this Y coordinate figure value become X coordinate figure after right rotation and the table back of the body counter-rotating, the positive and negative sign-inverted of X coordinate figure value become Y coordinate figure after right rotation and the table back of the body counter-rotating, carry out coordinate transform like this.In addition, coordinate transform can be after having selected right rotation and upset, indication is carried out in the lump, can also not show installation relative position data and picture in the way, be the related installation site associated data and the picture of coordinate transform of right rotation, but in display frame 124, show last installation site associated data etc., and promptly after the right rotation, installation site associated data and picture that the table back of the body has reversed.
Like this, under the state of the picture of installation site associated data that shows the coordinate transform carried out right rotation and the counter-rotating of the table back of the body in the display frame 124 and glass substrate 30 etc., the operator moves inspection 154 while seeing that these show, the parts mark 96 and the substrate mark 82 of the chip 92 of checking that 400 pairs of camera heads have been installed at short brink installation portion 252 are made a video recording, obtain the position.The position of having obtained and serial number and mark recognition data be mapped to be stored among the RAM204, check finish after, it is write in the photomagneto disk.
If carried out installation check for all chips 92 of having installed on the glass substrate 30, the operator just allows the data read writing station 116 of installation and control computer 106 read the photomagneto disk that has write position data, to the position data of installation and control computer 106 input marks 82,96, and indication is for each the computing of installation site deviation in a plurality of chips 92 of installing on glass substrate 30.Each 2 the substrate mark 82 and each X-axis, the Y-axis coordinate figure of parts mark 96 have been stored in advance for 1 chip 92, the mean value of each X coordinate figure of 2 substrate marks 82 of installation and control computer 106 computings and the mean value of each Y coordinate figure are obtained X, the Y coordinate figure of parts installation site.Also have, the mean value of each X coordinate figure of 2 parts marks 96 of computing and the mean value of each Y coordinate figure are obtained X, the Y coordinate figure of the center of chip 92.Then, obtain the deviation of parts installation site, obtain the installation site deviation the center of chip 92.In addition, obtain, revise rotating position error, so also can.
If for all chip 92 computings the installation site deviation, the operator just prints the installation site deviation datas by printer 126.The storage that is mapped of the position of aforesaid substrate mark 82 grades and installation sequence number with the installation site deviation data, is printed the installation sequence number, while the operator is seeing that it revises the installation site deviation data of installation site associated data.Operator's input checking posture during inspection stores its position with mark 82,96, print, and shows to the operator, so also can.
This correction is carried out in electronic-circuit-component mounting machine.The operator makes display frame 124 show the picture of installation sequence number, name of parts, installation site coordinate data, installation site deviation data and glass substrate 30,130, chip 92, revises the installation site deviation data.Installation check is for long side installation portion 250, make glass substrate 30 from upwards and the posture of growing crosswise show to carry on the back that counter-rotating carries out, the installation site deviation data is the data that obtain under this state.Therefore, when the operator revises in the installation site associated data of having set for long side installation portion 250, select the installation site associated data of serial number 1 to 4, be chosen in the upset in the kind of the coordinate transform that shows in the display frame 124, indicate this execution.Like this, shown in Figure 13 (b), display frame 124 will be switched, and be shown through coordinate transform as the installation site coordinate data and the installation site deviation data of installation site associated data, and the picture of glass substrate 30 waits through the table back of the body and reverses and be shown.
Then, on one side the operator is seeing the installation site deviation that prints, Yi Bian revise the installation site deviation by input unit 114.Herein, the correction of installation site deviation is not to eliminate the installation site deviation, but be updated to installation site coordinate in the design right deviation, the promptly actual up-to-date installation site deviation that produces.During correction, can intactly use the value by the installation site deviation of checking gained, the posture of the glass substrate 30 in the time of can not considering to check can be revised rapidly.As mentioned above, this is because second coordinate surface and check that coordinate surface is identical coordinate surface, and promptly X-axis is all parallel with Y-axis, and the positive and negative direction of X-axis, Y-axis is identical, also has, and all is that the glass substrate 30 table back ofs the body are reversed in which coordinate surface.In the installation site deviation on these coordinate surfaces is not that glass substrate 30 is in the deviation under the state of benchmark posture, it or not the deviation on the reference coordinate face of having set for electronic-circuit-component mounting machine, but, after the correction, automatically become the deviation under the state that glass substrate 30 is in the benchmark posture by carrying out contrary coordinate transform, deviation when promptly being the parts installation for long side installation portion 250, thereby the operator can not be converted into glass substrate 30 and be in installation site deviation under the state of benchmark posture, easily and error-free revises.In addition, carry out for the first time at installation check, the occasion that the installation site coordinate data is corrected for the first time, the operator intactly imports obtained installation site deviation and gets final product.At installation check is the 2nd later occasion, and the operator imports obtained installation site deviation is added the value that the installation site deviation that obtains, show forms.This computing also is to add intactly that on the value that demonstrates obtained value gets final product, and is easy to.The input of installation site deviation is the correction of 0 installation site deviation for the first time.Figure 13 (b) diagram has been imported the state of installation site deviation.
If the correction of installation site deviation finishes, the operator is the execution of the contrary coordinate transform of indication just.In the present embodiment, the kind of the coordinate transform of having selected once more to carry out, indication is carried out, thereby indicate the execution of the contrary coordinate transform of this coordinate transform.Come like this to carry out contrary coordinate transform to the design and installation position coordinate data with as the correction installation site deviation data of the installation site deviation data that has been corrected, shown in Figure 13 (a), demonstration initial stage video data, be that glass substrate 30 is in the data under the state of benchmark posture, the data during also promptly for long side installation portion 250 installing components.Also have, comprise that this is corrected, inverse transformation the installation site deviation of revising data eliminate the installation site coordinate data and obtain deviation before data and the installation site drift correction and eliminate the installation site coordinate data and obtain data and replace and be stored among the RAM104, use when parts are installed.
Revise by the operator too for the installation site associated data that short brink installation portion 252 has been set.In this occasion, the installation site associated data of operator's specified sequence number 5,6, and identical during with installation check, at first to select " right rotation ", indication is carried out, and makes it carry out the coordinate transform of right rotation.After this, under the state of the installation site associated data of having specified serial number 5,6, select again " upset ", indication is carried out, after the coordinate transform of right rotation, make its demonstration carry out the picture of the installation site associated data of coordinate transform of upset and glass substrate 30 etc., revise the installation site deviation data that has carried out coordinate transform.In this occasion also be, make second coordinate surface and check that coordinate surface is identical coordinate surface, the picture of installation site associated data and glass substrate 30 waits with state identical when checking and is presented in the display frame 124, thereby the operator can intactly use the installation site deviation that prints, promptly by checking that the installation site deviation that obtains revises the installation site deviation.
After the correction, if the execution of the contrary coordinate transform of indication, just installation site coordinate data and installation site deviation data, Figure 14 is shown in (a), automatically be inversely transformed into the data of not carrying out right rotation and showing to carry on the back the coordinate transform due to reversing, automatically be transformed to the installation site coordinate data on first coordinate surface and revise the installation site deviation data.Contrary coordinate transform is that the opposite sequence by respectively once more with coordinate transform the time is selected upset and right rotation, and indication is carried out and carried out.And, be corrected comprising, inverse transformation the deviation of the installation site associated data data before eliminating the installation site coordinate data and obtaining data and revise replace, be stored among the RAM104 use when parts are installed.
When parts are installed, serial number according to the parts installation, read for actual deviation elimination installation site coordinate data of carrying out the chip 92 of installation exercise and obtain data, revise the design and installation position coordinate data according to revising the installation site deviation data, according to these correction data installation head 350 is moved by means of installation head mobile device 352, carry out the installation of chip 92.The position deviation that obtains by the inspection after the parts installation is as mentioned above, even chip 92 and the glass substrate 30 different position deviations that also can produce jointly, the design and installation position coordinate data is revised, install to eliminate this position deviation, make chip 92 precision be installed in well on the glass substrate 30.
In this occasion, the deviation that obtains for long side installation portion 250 is eliminated the installation site coordinate data and is obtained data and can intactly use, and but, will could use through the coordinate transforms of 90 degree right rotations for the data that short brink installation portion 252 is obtained.This is because in the occasion of chip 92 being installed for short brink installation portion 252, glass substrate 30 dextrorotation are turn 90 degrees, thereby make short brink installation portion 252 parallel with the X-direction of the reference coordinate face of electronic-circuit-component mounting machine.
Like this, design data is to make under for the situation of all chips 92 for identical posture that is installed on the glass substrate 30, by contrast, installation check and data correction are to carry out under the situation of in length and breadth posture different direction and posture during with design, but, after the correction, just can get back to the data that design on the coordinate surface by contrary coordinate transform, thereby the posture of glass substrate 30 that can be when installing distinguishes design data, and data management is easy to.
Also have, it is not indispensable making during with installation check the direction in length and breadth of glass substrate 30 identical when parts are installed, for example, the same with the installation check of the chip of having installed at long side installation portion 250 92, can with liquid crystal panel 28 from upwards and the posture of growing crosswise show to carry on the back the installation check that posture after the counter-rotating is carried out the chip 92 installed at short brink installation portion 252.This is because which type of posture is the posture of the glass substrate 30 when no matter the installation site deviation obtains are, all carry out with posture correction identical when obtaining, and after revising, inverse transformation the parts that are used under the posture identical of data with the mounting position that has produced the installation site deviation install, just can revise the installation site deviation.For the direction of (showing the back of the body) about the inspection object substrate too.
Also glass substrate 30 anticlockwises can be made, and check correction under the state that its table back of the body has been reversed with the installation site deviation, but, this with make glass substrate 30 right rotations, and the occasion of checking, revising under the state that its table back of the body has been reversed is compared, except the positive and negative symbol of X coordinate figure and Y coordinate figure is opposite this point, carries out equally, thereby omit diagram and explanation.
Also have, with the difference of the posture of the glass substrate of having set on inspection desk 152 30, what have also carries out repeatedly right rotation or left rotating coordinate transform.
More than illustrated according to installation check and revised the installation site deviation data, revise the situation of installation site coordinate data in view of the above, but, in this electronic circuit component installation system, also can carry out the change of installation site coordinate data and appending of installation site associated data.For example, in the installation site deviation of the chip of obtaining by installation check 92 at least one side of X-direction and Y direction greatly to the occasion of the scope that surpasses deviation, for example, can consider it is that design data is confused.In this occasion, just change installation site coordinate data itself in the design according to the installation site deviation.The installation site coordinate data that change shows in display frame 124, the change deviation is eliminated the installation site coordinate data that the installation site coordinate data obtains data.This change is in glass substrate 30 postures when checking, the installation site associated data is carried out coordinate transform, and with what carry out under its state that demonstrates, this is identical during with the correction of installation site deviation.In addition, comprise in the size of the deviation that has obtained and the occasion of the value below the decimal point for example, to change the installation site coordinate, the part below the decimal point is got final product as the installation site deviation with integer part.Also can change the design and installation position coordinate data of parts installation procedure.
Also have, for example, the operator is seeing the glass substrate 30 that the reality dress of chip 92 is through with, and not being installed in as fruit chip 92 should the installation position, just appends the installation site associated data, installation chip 92.When appending, allow display frame 124 show that glass substrates 30 are in the state installation site associated data down of benchmark posture, the operator is chosen in " data supplementing " that shows in the display frame 124, the indication execution.Like this, the input field of display sequence number, name of parts and installation site associated data in display frame 124 for example, the operator is just with input unit 114 input data.At this moment, the operator just can import data with reference to the picture of glass substrate 30 grades that shown in display frame 124.In the occasion of appending the installation site associated data for short brink installation portion 252, also can show the data etc. of having carried out the coordinate transform of right rotation for installation site associated data etc., append, after appending, carry out contrary coordinate transform, with it as the installation site associated data in the design.According to appending of installation site associated data etc., for its later installation site associated data of data identical sequence number of being appended, serial number automatically staggers.The erection sequence of the chip 92 that has been added also can automatically be set according to all installation site associated datas that comprise this installation site associated data.Also have, appending also of data can be carried out with revising.Also to append the installation site associated data for the parts installation procedure, chip 92 is installed on the installation site that has been added.
By above explanation as can be known, in the present embodiment, the design Storage installation site coordinate data of the RAM104 of installation and control computer 106 and the part of installation site deviation data have constituted storage device, input unit 114 has constituted data input part, and constituted the coordinate transform instruction unit, contrary coordinate transform instruction unit, coordinate transform kind selection portion and contrary coordinate transform kind selection portion, installation and control computer 106 as indicated the kind of coordinate transform and the kind of contrary coordinate transform, carry out computing for installation site coordinate data and installation site deviation data, the part of carrying out coordinate transform and contrary coordinate transform has constituted coordinate converting section and contrary coordinate converting section, and input unit 114 has constituted parts installation site correction portion, the installation site associated data is appended portion and installation site associated data changing unit.Can think that also contrary coordinate converting section is a design point reduction of data portion.Can think that the indication according to the operator of installation and control computer 106 comes the part of computing installation site deviation to constitute installation site deviation operational part, constitute as the installation site deviation obtaining section of serving as the data correction amount obtaining section of data change amount obtaining section.Can think that also the section data that has been read by data read writing station 116 that is taken into of installation and control computer 106 has constituted data change amount obtaining section.Also have, the substrate sucking device that is provided with on operation post 34 and the operation post 34 has constituted base plate keeping device, and operation post mobile device 36 and installation head mobile device 352 have constituted the relative movement device that base plate keeping device and installation head 350 are relatively moved.Installation head 350 is polishing heads, also is heating head.
In addition, also can be by communication, mark position data etc. from checking that computer 210 is to 106 inputs of installation and control computer.
Also have, also can in checking computer 210, obtain the installation site deviation of chip 92.In this occasion, for example, on installation check machine 150, printer is set, the operator is printed the installation site deviation of having obtained, and revises the installation site deviation data in electronic-circuit-component mounting machine.Or also can allow recorded medium stores installation site deviation data etc., allow the printer prints of electronic-circuit-component mounting machine.
The following explanation according to Figure 16 and Figure 17 can be asked other embodiment of inventing.In the present embodiment, during installation check, make and check that 154 automatically move to chip 92 by erection sequence according to the installation site coordinate data, mark 82,96 is made a video recording, in electronic-circuit-component mounting machine, automatically revise the installation site deviation.Also have, between electronic-circuit-component mounting machine and installation check machine, taking and giving of data undertaken by communication line.Therefore, as shown in figure 16, the control device 300 of electronic-circuit-component mounting machine, the same with above-mentioned control device 24, constitute based on installation and control computer 302, but, its input/output interface 108 is connected with inspection computer 312 as the main body of the control device 310 of parts installation check machine by communication line.As shown in figure 17, the input/output interface 212 of the inspection computer 312 of the control device 310 of parts installation check machine also is connected with installation and control computer 302 by communication line.Also have, the inspection camera head 316 of parts installation check machine and lighting device 318 are formations same with above-mentioned inspection camera head 400 and lighting device 402, but are can be to 2 parts marks 96 and 2 devices that substrate mark 82 throws light on simultaneously, makes a video recording in the present embodiment.
By communication design and installation position coordinate data and erection sequence data are imported to inspection computer 312 from installation and control computer 302, be stored among the RAM204.And, in parts installation check machine 150, read the installation site coordinate data by parts installation site order, make and check on 154 chip 92 that automatically move to as the shooting object.As mentioned above, glass substrate 30 is set on the inspection desk 152 with various postures, and is corresponding with this posture, and the position of the datum mark of glass substrate 30 in checking coordinate surface can change.Therefore, for example, on inspection desk 152, set after the glass substrate 30 with the posture identical with the benchmark posture, the operator makes glass substrate 30 move to datum mark by the fine motion operation of motor 176,178, allow and check that 316 pairs of datum marks of camera head make a video recording, and use up to be marked on and check and obtain the position of checking a datum mark of 154 on the computer 312.Or also can be provided with to make is in X-direction and Y direction on 2 limits of datum mark quadrature and glass substrate 30 is positioned at positioner on the inspection desk 152, obtains the position of datum mark according to the position location of the glass substrate 30 that positioner carried out.Also the position of obtaining datum mark under the state of checking posture can be set at.Just can obtain according to the inspection posture of position, design and installation position coordinate data and the glass substrate 30 of the datum mark of the glass substrate 30 in this inspection coordinate surface and to check a shift position of 154.The inspection posture of glass substrate 30 is imported by the operator.At this moment, in checking computer 312,, the design and installation position coordinate data is carried out coordinate transform, just can obtain the shift position of inspection 154 according to the inspection posture of glass substrate 30.Also can in installation and control computer 302, carry out this coordinate transform, and it is supplied with inspection computer 312.
After checking 154 move, chip 92 is made a video recording, and it is shown enlarged in the display frame 232, the operator is harmonious cursor CX1, CX2, CY1, CY2 and substrate mark 82 and parts mark 96 respectively, make and check that computer 312 obtains the position of the position of 2 substrate marks, 82 each comfortable X-axis, Y direction and 2 parts mark 96 each comfortable X-axis, Y direction, this is same as the previously described embodiments.Approaching a group substrate mark 82 and parts mark 96 in each 2 substrate mark 82 and the parts mark 96 are harmonious cursor, have obtained after the position, for another group substrate mark 82 and parts mark 96, cursor are harmonious, and obtain the position.Each position of substrate mark of having obtained 82 and parts mark 96 and erection sequence and mark recognition data be mapped store.So just can obtain the position of mark 82,96, the operator allows the display frame 124 of electronic-circuit-component mounting machine show the picture of installation sequence number, name of parts, installation site associated data and glass substrate 30 etc. under the state that the inspection posture with glass substrate 30 is harmonious.If carried out from the posture of growing crosswise showing to carry on the back under the posture of reversing checking at glass substrate 30, the operator is the coordinate transform of indication upset just, thereby coordinate transform the installation site associated data and the picture of the glass substrate 30 that overturn be presented in the display frame 124, for example, the operator can see on one side display frame 124 confirms which the chip 92 that installation check is performed is, on one side the indication shooting etc.If 1 chip 92 is made a video recording, obtained the position of substrate mark 82 and parts mark 96, just indicate the obtaining of position of the shooting of next chip 92 and mark 82,96 by the operator, like this, just make and check that 154 automatically move to chip 92 according to erection sequence and installation site coordinate data, by checking that camera head 316 makes a video recording.
If obtained each substrate mark 82 of 2 and each X-axis of parts mark 96, the position of Y direction for all chips 92, just these mark position datas, erection sequence data and the gesture data of the glass substrate 30 when checking supply with and with its input to installation and control computer 302 by communication.Installation and control computer 302 is obtained the installation site deviation of chip 92 according to the mark position data of having imported, and the installation site deviation data that is stored among the RAM104 eliminate the installation site coordinate data to obtain the part of data as deviation is revised.The installation site drift correction operation of being undertaken by the operator is automatically carried out by installation and control computer 302 in the above-described embodiments.
At this moment, the correction of installation site deviation data is mutually incompatible the carrying out of posture of the glass substrate 30 during with installation check.If make glass substrate 30 carry out from the posture of growing crosswise having obtained the installation site deviation under the posture of table back of the body counter-rotating, carried out the installation site deviation data of the coordinate transform of upset and will revise according to the installation site deviation that has obtained.After the correction, carry out contrary coordinate transform automatically, making the installation site coordinate data and revising the installation site deviation data becomes data for the glass substrate 30 that is in the benchmark posture.Also can carry out contrary coordinate transform according to the indication of the execution of the contrary coordinate transform that the operator did.
In the present embodiment, the operator is for parts installation check machine 150, cursor CX1, CX2, CY1, CY2 and mark 82,96 are harmonious, obtain its position, obtain the installation site deviation, this is a data change, makes the input unit 158 of operation that cursor CX1, CX2, CY1, CY2 move etc. constitute data change portion.Data change portion is located at installation check machine 150 sides.Also have, the RAM104 of installation and control computer 302 has constituted storage device, when the correction of installation site deviation data, the part of the coordinate transform of the installation site associated data that the inspection posture of indication, execution and glass substrate 30 is harmonious has constituted coordinate transform instruction unit and coordinate converting section, after the correction, the part of indication, the contrary coordinate transform of execution has constituted contrary coordinate transform instruction unit and contrary coordinate converting section, and they have constituted the installation site related data conversion device with the data change portion of parts installation check machine 150 sides.In the present embodiment, the indication of the indication of coordinate transform and contrary coordinate transform is all carried out automatically.
Can think also that the part of being got the mark position data of installation and control computer 302 has constituted as the data of data change portion and be got portion, can think that also the part of revising the installation site deviation data that has been stored as the installation site associated data according to the mark position data has constituted parts installation site correction portion, has constituted data change portion.In these occasions, data change carries out automatically, and the installation site related data conversion device all is located at the electronic-circuit-component mounting machine side.At this moment, if think that it also is the part of data change portion with the operation that each 2 substrate mark 82 and parts mark 96 are harmonious that the operator makes cursor CX1, CX2, CY1, CY2, then data change portion strides electronic-circuit-component mounting machine and 150 liang of sides of parts installation check machine and is provided with.Also have, also can think from installation and control computer 302 from checking that computer 312 is got the part of mark position data and constituted data correction amount obtaining section as data change amount obtaining section, can think that also the part of obtaining the installation site deviation according to the mark position data has constituted the data correction amount obtaining section as data change amount obtaining section, can think that also data correction amount obtaining section has constituted the part of parts installation site correction portion.Also can in checking computer 312, computing by communication it be supplied with installation and control computer 302 based on the installation site deviation of mark position data.In this occasion, can think that also the part of the computing installation site deviation of checking computer 312 has also constituted the part of data change portion, can think also that the part of being got the installation site deviation of installation and control computer 302 has constituted as the data of data change portion and be got portion, and constitute data change amount obtaining section.
Also can make and check that 154 are made a video recording at 1 chip 92 at every turn, cursor and mark 82,96 are harmonious and when having obtained the deviation of installation site, just automatically move to next chip of obtaining position deviation 92.
The installation site related data conversion device of the various embodiments described above can be used for not making component-mounted substrate to show to carry on the back the counter-rotating and the various data conversions such as data conversion that obtain the occasion of installation site deviation.For example, if can carry out the parts installation check from table side (the parts installed surface side of component-mounted substrate), just be posture upwards with parts both installed surface, and component-mounted substrate is that the posture of growing crosswise is checked, perhaps under the state that parts both installed surface make progress so that its posture of having carried out right rotation or anticlockwise from the posture of growing crosswise check, corresponding with this posture and make the installation site related data conversion device carry out coordinate transform, contrary coordinate transform, data change.For example, even opaque at component-mounted substrate sometimes, the occasion of the parts that can not be provided with at the parts installed surface from dorsal part perspective and the electronic circuit component of installation also can be adorned the face side from parts and check, obtains position deviation.For example, can be located at the occasion on the body of electronic circuit component from parts installed surface side at electrode with discerning, on the face of the opposition side of the parts installed surface side of the body of electronic circuit component, be provided with mark, can discern the occasion of this mark from parts installed surface side, and lead-in wire and the occasion that be provided with etc. outstanding to the side from body, just can under the state that electronic circuit component has been installed on the component-mounted substrate, discern these electrodes from parts installed surface side, mark and lead-in wire, discern according to this and to obtain the installation site deviation, perhaps obtain the installation site deviation according to the position of parts mark and substrate mark.Also can make a video recording, obtain its position, itself and regular position are compared and obtain the installation site deviation the body of electronic circuit component.Body at electronic circuit component is transparent occasion, and for example, if electronic circuit component is the FPC substrate, body is transparent, then also can be identified in the parts mark that the face that is mounted of this component-mounted substrate is provided with from the face side of the opposition side that is mounted face.The installation site related data conversion device can be located to transparent component-mounted substrate install electronic circuit component electronic-circuit-component mounting machine, install on the electronic-circuit-component mounting machine of electronic circuit component, the various electronic-circuit-component mounting machines such as electronic-circuit-component mounting machine that both can both carry out to opaque component-mounted substrate, carry out data conversion.Installation check can for example carry out under the state of right rotation or anticlockwise from the posture of growing crosswise, or has carried out carrying out under repeatedly right rotation or the left rotating state.In the occasion that can obtain position deviation like this, even component-mounted substrate is transparent, also can make its table back of the body counter-rotating and get position deviation from the parts installed surface side-draw of component-mounted substrate, come the change of location associated data in view of the above.
Also have, if component-mounted substrate is transparent, and can be connected material and the electrode or the lead-in wire of identification component with ACF etc. by circuitous pattern, in the time of then can checking the installation site deviation, detect position deviation according to the identification (shooting) of circuitous pattern and electrode or lead-in wire making component-mounted substrate show back of the body counter-rotating.Circuitous pattern etc. as substrate mark and parts mark.
Occasion on the operating system beyond position related data conversion device is located at the electronic circuit component installation system also can be carried out coordinate transform in every way according to the characteristic of coordinate transform object, the content of operation etc.
Also have, the correction of installation site associated data also can be carried out when detecting the installation site deviation at every turn.For example, revising the occasion of being undertaken by the operator, each when obtaining each position of each 2 parts mark and datum mark for electronic circuit component in the installation check machine, with regard to computing and show the installation site deviation, the operator is seeing that it revises.Or, in the installation and control computer, show during the deviation of 1 installation site of computing at every turn, allow the operator revise.In correction is the occasion of carrying out automatically, for example, make between installation and control computer and inspection computer, taking and giving of data always undertaken by communication, obtain the mark position data at every turn, just give the installation and control computer from checking computer, obtain the installation site deviation and revise it.Checking that the occasion of being undertaken by identical computer with correction does not need data to transmit.
Contrary coordinate transform can be carried out carried out change for all installation site associated datas after in the lump, also can carry out the change of 1 or predefined a plurality of installation sites associated data at every turn.
Also have, contrary coordinate transform also can be for example in display frame the kind with coordinate transform show the demonstration of " contrary coordinate transform ", indication by this selection, execution is carried out, or the reduction demonstration that enters demonstration, finishes demonstration or show to the initial stage can be set in display frame also, after the data inputs, select to enter, end or initial stage show that indication is carried out, this is the execution indication of inverse transformation, carries out inverse transformation like this.
Have again, also can be and directly revise the installation site coordinate data according to the installation site deviation that has obtained.
Also have, can show that also the installation site deviation eliminates data, replace the installation site deviation, upgrade, show installation site deviation elimination data according to the installation site deviation that has detected.
Have again, if in display frame the datum mark of display unit installation base plate, X-axis and Y-axis, the operator just easily understands that but, this demonstration is not indispensable, can omit 1 demonstration at least.
Have again, also can on parts installation check machine, the installation site related data conversion device be set.In this occasion, use by recording medium and communication etc. are eliminated the installation site coordinate data to deviation and are obtained data necessary such as data and be input to the inspection computer, and be provided for the program of coordinate transform and contrary coordinate transform in checking computer.Also have, 2 display frames can be set, or 1 display frame is carried out 2 to be cut apart, on a side, show the substrate mark made a video recording etc., on the opposing party, show installation site associated data etc., carry out installation check, after the inspection, in display frame, show installation site associated data etc. and automatically or manually carry out the correction of installation site deviation.Revised data are recorded on the recording medium, or import to the installation and control computer by wireless or wired communication etc.
Have, also storage device can be set on electronic-circuit-component mounting machine, the inscape beyond the position related data conversion devices such as coordinate transform instruction unit can be arranged on other device such as installation check machine.In this occasion, the result of the coordinate transform of having carried out in other device, data change and contrary coordinate transform is sent back in the electronic-circuit-component mounting machine, the storage of storage device upgraded.
Have, make in parts installation check machine and check that head automatically moves to installing component, the occasion that allows camera head that substrate mark and parts mark are made a video recording also can only be made a video recording to each substrate mark and parts mark of 1 near each other simultaneously.In this occasion, from the installation and control computer to checking computer, the parts data of the allocation position data of the parts mark on comprising design and installation position coordinate data and electronic circuit component, the position data of supplying substrate mark just can be obtained the shift position of camera head according to them.Camera head is to after making a video recording simultaneously for the side in 2 parts marks of installing component setting with the approaching substrate mark of this parts mark, make it be automatically moved to the opposing party's parts mark and the substrate mark approaching with this parts mark, it is made a video recording simultaneously, just can more clearly make a video recording parts mark and substrate mark.
Also have, in the above-described embodiments, ACF is the device that comprises the thermoplastic resin membrane, but, also can be the device that comprises the heat-curing resin film.
Have, the ACF belt also can stick on respectively in 1 parts installation site having set on the component-mounted substrate each at least again.
Also have, when on component-mounted substrate, pasting the ACF belt, avoid the part corresponding, do not cover them and paste with the parts mark of substrate mark and component-mounted substrate.So just can make the parts mark and do not made a video recording by the ACF belt, lighting device includes only the device of visible light source, does not perhaps allow the occasion that sees through of light also can the identification component mark at the ACF belt.
Also have, with ACF the occasion that electronic circuit component parts and installation base plate couple together, also can on 1 working rig, carry out precompressed and connect and this crimping.
Have, component-mounted substrate is not limited to glass substrate again, also can be FPC substrate (FlexiblePrinted Circuit Board), circuit substrate etc., and various substrates can be as the coordinate transform object.The flexible wiring plate of printing is the printing wiring plate that has formed conductor fig on the film with flexible and insulating properties, for example, has thermal endurance, have on the film of the transparent polyimide resin of flexible, insulating properties and mylar system and form conductor fig, carry electronic circuit components such as flip-chip.The FPC substrate also is installed on the glass substrate as electronic circuit component sometimes, can make a video recording to mark that is provided with thereon and the mark that on glass substrate, is provided with, obtain, revise the installation site deviation, can obtain for this, revise and use the installation site related data conversion device.Also have, the electrode of electronic circuit component and the electrode of component-mounted substrate are not limited to adopt the method for attachment of ACF belt, for example, also can adopt fusion welding associated methods, melts combine method to connect.The fusion welding associated methods is fusion welding and electrode electrically connected terminal method each other, for example, on the electrode terminal of component-mounted substrate, apply the paste scolder, in mounting on the solder-coating state under the electrode terminal of electronic circuit component is heated, make its fusion, under the state that the solder protuberance that is provided with on the electronic circuit component has been contacted with the electrode terminal of component-mounted substrate, heat, make its fusion.The melts combine method is to make metallic, and for example the electrode terminal of gold system is in direct contact with one another, by adding the method that upward pressure is connected with ultrasonic vibration.The method that adopts light or heat-curing resin to connect is also arranged.These component connecting methods can wait suitably according to the kind of component-mounted substrate and electronic circuit component etc. and characteristic and select.For example, the fusion welding associated methods is suitable for that thermal endurance is outstanding, the connection of the electrode terminal of the component-mounted substrate of the heating during the ability melt solder, for example, print the occasion that wiring plate is made by stable on heating resin, can be used for the connection of electronic circuit component in flexibility.The base material of printing wiring plate in flexibility is transparent plastic occasion, can carry out printing the position component inspection of having installed on the wiring plate in flexibility under the state that the table back of the body has reversed.
In the occasion that electronic circuit component and component-mounted substrate is coupled together with scolder, if electronic circuit component can not depart under the state that electronic circuit component and component-mounted substrate has been pre-fixed with scolder, then can under the state that has pre-fixed, carry out installation check, check under the state that also can be melted, electronic circuit component has been electrically connected with component-mounted substrate at scolder.
Also have, also can check the Cutting Length etc. that the ACF paste position of component-mounted substrate or ACF are cut off the ACF due to the head due to the ACF application head, position related data is changed.It is the ACF belt of having pasted on the component-mounted substrate is cut off by preseting length and to implement the operation head of operation indirectly on component-mounted substrate that ACF cuts off head.ACF paste position data are the data that are associated with position as the component-mounted substrate of coordinate transform object, and the Cutting Length of ACF also can obtain according to this paste position, and the paste position data of specific length are position related datas.The ACF paste position can be checked after the stickup of component-mounted substrate, before the installation of electronic circuit component at the ACF belt, also can check after installation.If component-mounted substrate is a transparency carrier, also can be after the installation of electronic circuit component, make component-mounted substrate show to carry on the back the counter-rotating and the paste position of obtaining the ACF belt.Occasion checking the ACF paste position can obtain the position for predefined 1 position of ACF, obtains position deviation etc., also can obtain the position for a plurality of positions, obtains position deviation etc. according to them.Contain conducting particles among the ACF, for example, obtain the having or not of conducting particles, number and density, obtain paste position and the length of ACF in view of the above by the shooting of the ACF that camera head carried out.Also have, in the occasion of checking the ACF Cutting Length, for example, for predefined a plurality of positions on the ACF belt, for example, 4 positions that are being separated by than length direction, set and check the position, according to the position that has or not the end of obtaining the ACF belt of checking the ACF belt of position at each, obtain length, obtain poor to regular length.Poor according to the ACF paste position deviation of these reality that obtained, the ACF Cutting Length and regular length again, for example, changed for ACF paste position, the cutting position set, correction when ACF pastes the ACF application head and the relative position of component-mounted substrate, revise the off-position that the belt shearing device is carried out.Use location related data conversion device in this change.
In the ACF application head is the occasion of pasting the device of ACF on electronic circuit component, also can check this paste position etc., is changed for position related data.In this occasion, electronic circuit component just becomes the coordinate transform object.
The installation check of circuit block also can all automatically carry out at component-mounted substrate after being provided with of inspection machine.For example, according to the installation site coordinate data of electronic circuit component etc., make and check that head automatically moves to electronic circuit component, for example, electronic circuit component integral body is made a video recording, obtain its position, with its with do not have the regular position of deviation to compare, obtain the position deviation amount.Or also can make a video recording to parts mark, substrate mark, obtain the installation site deviation.In this occasion, also can behind installation check,, all automatically carry out to the change of installation site associated data.
The coordinate transform object is not limited to electronic circuit component and component-mounted substrate, for example, so long as the parts of implementing certain operation by the operation head just can become the coordinate transform object.Also have, at the coordinate transform object is the occasion of component-mounted substrate, the electronic circuit component that is mounted is not limited to the liquid crystal display drive circuit parts, can be according to kind of QFP (Quad Flat Package), CSP package parts such as (ChipSize Package) etc., component-mounted substrate etc. and various electronic circuit components are installed, for example, the installation site associated data of these electronic circuit components is changed by the installation site related data conversion device.
More than illustrated with the obtaining and relevant variety of way such as position related data conversion device of position deviation, beyond the electronic circuit component installation system to the component-mounted substrate operating system in also can adopt.
Claims (11)
1. position related data conversion device comprises:
Storage is as the storage device of the position related data of the data that are associated with at least 1 position of coordinate transform object on first coordinate surface;
Indication should be implemented coordinate transform instruction unit to the coordinate transform of second coordinate surface for being stored in described position related data in this storage device;
Abide by the coordinate transform indication that this coordinate transform instruction unit is done, implement to be stored in described position related data in the described storage device to the coordinate converting section of the coordinate transform of second coordinate surface;
The data change portion that on this second coordinate surface, described position related data is changed;
Indication should be the contrary coordinate transform of the described position related data that has been changed by data change portion the contrary coordinate transform instruction unit of the position related data on described first coordinate surface; And
Abide by the indication of this contrary coordinate transform instruction unit, implement the contrary coordinate converting section of contrary coordinate transform.
2. position related data conversion device according to claim 1, it is characterized in that described coordinate transform instruction unit comprises that indication should implement the coordinate transforming instruction unit of the kind of coordinate transform for being stored in described position related data in the described storage device.
3. position related data conversion device according to claim 1, it is characterized in that, comprise that demonstration carried out the described position related data of coordinate transform by described coordinate converting section and carried out at least one side's the display frame of picture of the described coordinate transform object of coordinate transform.
4. position related data conversion device according to claim 1, it is characterized in that described coordinate converting section is to the relative position of the entity of the initial point of described first coordinate surface with to the relative position device that constant mode is carried out coordinate transform before and after described coordinate transform of the entity of the initial point of described second coordinate surface with described coordinate transform object.
5. position related data conversion device according to claim 4, it is characterized in that described coordinate converting section is the device that carries out coordinate transform in the initial point consistent mode of the initial point of datum mark of having set on the described coordinate transform object and described first coordinate surface and second coordinate surface.
6. position related data conversion device according to claim 1 is characterized in that, for described first coordinate surface and second coordinate surface, X-axis all is parallel to each other with Y-axis each other each other, and for X-axis and Y-axis separately, positive negative direction is identical.
7. position related data conversion device according to claim 6, it is characterized in that, described coordinate transform instruction unit comprises the coordinate transforming instruction unit of the kind of the coordinate transform that indication should be implemented for the described position related data that is stored in the described storage device, can be comprised by the kind of the coordinate transform of this coordinate transforming instruction unit indication around the counter-rotating of the back of the body of the table due to the revolution of X-axis, in the revolution of the counter-rotating of the back of the body of the table due to the revolution of Y-axis, positive direction and backward revolution at least 2 kinds.
8. position related data conversion device according to claim 7 is characterized in that, described coordinate transform instruction unit and described contrary coordinate transform instruction unit can be indicated described coordinate transform and described contrary coordinate transform in a plurality of kinds ground separately overlappingly.
9. position related data conversion device according to claim 1, it is characterized in that, described coordinate transform object is a component-mounted substrate, described position related data comprise be installed in the circuitous pattern that is located on the described component-mounted substrate on and constitute the installation site associated data that the installation site of the electronic circuit component of electronic circuit is associated, this installation site associated data comprises the installation site coordinate data of installation site of regulation electronic circuit component and at least one side of the installation site deviation associated data relevant with the deviation of the installation site of described electronic circuit component, described data change portion comprises that at least one side to described installation site coordinate data and described installation site deviation associated data revises, and obtains the parts installation site correction portion that data are revised in the installation site.
10. one kind to the component-mounted substrate operating system, it is characterized in that comprising:
Any described position related data conversion device in the claim 1 to 9 that described coordinate transform object is a component-mounted substrate;
The base plate keeping device that keeps described component-mounted substrate;
Described component-mounted substrate is implemented the operation head of operation;
The relative movement device that described base plate keeping device and described operation head are relatively moved; And
Control the control device of described position related data conversion device, described base plate keeping device, described operation head and described relative movement device.
11. an electronic circuit component installation system is characterized in that comprising:
Any described position related data conversion device in the claim 1 to 9;
Supply with the assembly supply device of electronic circuit component;
The base plate keeping device of holding member installation base plate;
Got described electronic circuit component from described assembly supply device, it is installed in installation head on the described component-mounted substrate;
The relative movement device that described assembly supply device, described base plate keeping device and described installation head are relatively moved; And
At least control the control device of described position related data conversion device, described base plate keeping device, described installation head and described relative movement device.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004302061A JP4541095B2 (en) | 2004-10-15 | 2004-10-15 | Position-related data converter and component mounting board work system |
| JP2004302061 | 2004-10-15 |
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| CN1764367A true CN1764367A (en) | 2006-04-26 |
| CN100551222C CN100551222C (en) | 2009-10-14 |
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| CNB2005101135308A Active CN100551222C (en) | 2004-10-15 | 2005-10-17 | Position related data conversion device and to the component-mounted substrate operating system |
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| CN (1) | CN100551222C (en) |
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| CN102273333A (en) * | 2009-01-08 | 2011-12-07 | 松下电器产业株式会社 | Component mounting device and method |
| CN102781211B (en) * | 2011-05-13 | 2016-06-22 | 富士机械制造株式会社 | Parts mounting system |
| CN102781211A (en) * | 2011-05-13 | 2012-11-14 | 富士机械制造株式会社 | Part installing system |
| CN104105390B (en) * | 2013-04-11 | 2017-03-01 | 韩华泰科株式会社 | Material spinning solution in material production equipment |
| CN104105390A (en) * | 2013-04-11 | 2014-10-15 | 三星泰科威株式会社 | Material rotating method in material producing equipment |
| CN105988658A (en) * | 2014-12-19 | 2016-10-05 | 韩华泰科株式会社 | Apparatus and method for distributing mounted points of board and system utilizing the same for manufacturing PCB |
| CN105988658B (en) * | 2014-12-19 | 2019-08-06 | 韩华精密机械株式会社 | Substrate mounting point distribution apparatus and method and PCB production system using the same |
| CN110383966A (en) * | 2017-03-08 | 2019-10-25 | 株式会社富士 | Conveying device and installation associated apparatus |
| CN110383966B (en) * | 2017-03-08 | 2023-03-10 | 株式会社富士 | Conveying device and installation-related device |
| CN111819915B (en) * | 2018-03-15 | 2022-08-23 | 株式会社富士 | Mounting system |
| CN112514553A (en) * | 2018-07-25 | 2021-03-16 | 雅马哈发动机株式会社 | Surface mounting machine |
| CN112514553B (en) * | 2018-07-25 | 2022-04-12 | 雅马哈发动机株式会社 | Surface mounting machine |
| CN114148703A (en) * | 2020-09-08 | 2022-03-08 | 爱来音科技有限公司 | Workpiece attitude control device, workpiece supply system provided with same, and workpiece attitude control method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4541095B2 (en) | 2010-09-08 |
| CN100551222C (en) | 2009-10-14 |
| JP2006114782A (en) | 2006-04-27 |
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