JP2023068698A - Component mounting system, component mounting device, and component mounting method - Google Patents

Abstract

To provide a component mounting system capable of properly feeding back misalignment information of components mounted on a board, a component mounting device, and a component mounting method.SOLUTION: The component mounting system performs the steps below; acquiring first misalignment information of a component mounted on a first model board (ST2); calculating a second correction value that is a correction value when mounting a component onto the board based on the first misalignment information independent of the board type (ST4); when switching from the first product type board to the second product type board (Yes in ST5), mounting a component onto a second type board using a second correction value (ST6); acquiring second misalignment information of the component mounted on the second type board (ST7); calculating a third correction value when mounting a component onto a second type board based on the second misalignment information (ST8); and mounting the component onto the second type board using the third correction value when the third correction value is calculated (ST9).SELECTED DRAWING: Figure 7

Description

The present invention relates to a component mounting system, a component mounting apparatus, and a component mounting method for mounting components on a board.

In a component mounting system that mounts components on a board to produce a mounted board, an inspection device acquires positional deviation information of components mounted on the board, and the acquired positional deviation information is transferred to the subsequent board by the component mounting device. is used as feedback for correcting the mounting position when mounting (for example, see Patent Document 1). In the component mounting system described in Patent Literature 1, until positional deviation information is detected by an inspection device installed downstream of the component mounting device, variations due to thermal deformation of the component mounting device over time are detected in the mounting position. It is disclosed that the mounting position is corrected by adding the obtained positional deviation information to the variation caused by thermal deformation when the positional deviation information is acquired by the inspection apparatus.

JP 2016-58604 A

However, in the prior art including Patent Document 1, there are the following problems in a component mounting line that connects a plurality of component mounting apparatuses. That is, when switching the type of mounted boards to be produced in a component mounting line in which five component mounting apparatuses capable of retaining three boards in one component mounting apparatus are connected, the board before switching is changed. The board after switching cannot be put into the first component mounting apparatus until the flow on the component mounting line is completed. As a result, the production time for 10 or more substrates is wasted until the production is restarted, and there is a problem that the production efficiency is lowered.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting system, a component mounting apparatus, and a component mounting method capable of appropriately feeding back positional deviation information of a component mounted on a substrate.

A component mounting system according to the present invention includes a positional deviation information acquiring unit for acquiring positional deviation information of a component mounted on a board, and a first correction value when mounting the component on the board based on the positional deviation information. and a second correction value for calculating a second correction value independent of the type of board, which is a correction value for mounting the component on the board based on the positional deviation information. and a component mounting unit that mounts components on a board, wherein the second correction value calculating unit calculates the positional deviation information of the board on which components have been mounted so far, including at least the first type board. The second correction value is calculated based on the second type board, and at the beginning of switching from the first type board to the second type board, the component mounting section uses the second correction value to mount the component on the second type board. do.

A component mounting apparatus according to the present invention includes a component mounting section that mounts a component on a board, and a control section that controls the component mounting section, wherein the control section is switched from a first type board to a second type board. Initially, a component is mounted on the second type board using a second correction value that does not depend on the type of board, and the component is mounted on the second type board based on positional deviation information of the component mounted on the second type board. When the first correction value for mounting on the second type board is calculated, the component mounting section is controlled to mount the component on the second type board using the first correction value.

A component mounting method of the present invention acquires first positional deviation information of a component mounted on a first type board, and provides a correction value when mounting the component on the board based on the first positional deviation information. calculating a second correction value that does not depend on the type of board, and mounting a component on the second type board using the second correction value when the first type board is switched to the second type board; obtaining second positional deviation information of a component mounted on a second type board, calculating a first correction value for mounting the component on the second type board based on the second positional deviation information; When the first correction value is calculated, the component is mounted on the second type board using the first correction value.

ADVANTAGE OF THE INVENTION According to this invention, the positional deviation information of the components mounted on the board|substrate can be fed back appropriately.

1 is an explanatory diagram of the configuration of a component mounting system according to an embodiment of the present invention; FIG. 1 is a plan view showing the configuration of a main part of a component mounting apparatus according to one embodiment of the present invention; FIG. 2 is an explanatory diagram of the configuration of the main parts of the mounting head and the component supply section of the component mounting apparatus according to one embodiment of the present invention; 1 is a block diagram showing the configuration of a control system of a component mounting system according to one embodiment of the present invention; FIG. FIG. 4 is an explanatory diagram of component mounting position deviation amounts acquired by the inspection apparatus according to the embodiment of the present invention; (a) (b) Explanatory diagrams of the effect of the rotation of the nozzle on the component mounting position deviation amount in the component mounting apparatus according to the embodiment of the present invention. FIG. 1 is a flowchart of a component mounting method according to one embodiment of the present invention; (a) (b) (c) (d) (e) Explanatory diagrams of component mounting processes in the component mounting system according to one embodiment of the present invention

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be changed as appropriate according to the specifications of the component mounting system, management computer, component mounting apparatus, and inspection apparatus. In the following, the same reference numerals are given to the corresponding elements in all the drawings, and redundant explanations are omitted. In FIG. 1 and a part described later, two axes perpendicular to each other in the horizontal plane are the X-axis (horizontal direction in FIG. 1) in the substrate transfer direction and the Y-axis (vertical direction in FIG. 1) perpendicular to the substrate transfer direction. shown. In FIG. 3 and a part to be described later, the Z-axis (vertical direction in FIG. 3) is shown as the height direction orthogonal to the horizontal plane. In FIG. 3 and a part described later, the θ direction, which is the direction of rotation about the Z axis, is shown.

First, the configuration of a component mounting system 1 will be described with reference to FIG. The component mounting system 1 has a function of manufacturing a mounting board by mounting a component on the board. In the component mounting system 1, four component mounting apparatuses M1 to M4 and an inspection apparatus M5 are arranged in series from upstream (left side of the paper surface) to downstream (right side of the paper surface) in the board transfer direction. Each device is connected to a management computer 3 via a communication network 2 . Also, each device transmits and receives data to and from each other via the communication network 2 . Note that the number of component mounting apparatuses M1 to M4 provided in the component mounting system 1 is not limited to four, and may be one, two, three, or five or more.

In FIG. 1, the component mounting apparatuses M1 to M4 and the inspection apparatus M5 are provided with board transfer sections 4 and 5, respectively. The substrate B is transported from the upstream device to the downstream device by the substrate transport units 4 and 5 . The component mounting apparatus M1 receives the board B from production equipment such as a printing apparatus that prints solder paste on the electrodes formed on the board B arranged upstream (arrow a). The component mounting apparatus M1 carries out a component mounting operation in which the mounting head picks up the component D from the component supply section and mounts it at the mounting position of the received board B, and carries out the board B to the downstream component mounting apparatus M2. Similarly, the component mounting apparatuses M2 to M4 perform the component mounting work of mounting the component D on the mounting position of the board B carried out from the upstream apparatus.

The inspection device M5 inspects the mounting state of the component D on the board B on which the component D is mounted by the component mounting devices M1 to M4 with the inspection camera 6, acquires positional deviation information of the component D from the normal position, and the like. Judge the acceptability of the mounting board. After the inspection, the substrate B is carried out to a reflow device or the like that heats the substrate B arranged downstream to melt the solder paste (arrow b). The management computer 3 has a function of centrally controlling the component mounting system 1 including the component mounting apparatuses M1 to M4 and the inspection apparatus M5.

Next, referring to FIG. 2, the configuration of component mounting apparatuses M1 to M4 will be described. At the center of the base 7, the substrate transfer section 4 is installed along the X-axis. The substrate transport unit 4 transports the substrate B unloaded from the upstream device, and positions and holds it at a mounting work position by the mounting head described below. Further, the board transfer section 4 carries out the board B on which the component mounting work (component mounting work) has been completed to a downstream device.

The substrate transfer unit 4 includes a fixed rail 4a fixed to the base 7 and a movable rail 4b movable along the Y-axis. The board transfer section 4 includes a rail moving section 8 that moves the movable rails 4b in the width direction (Y-axis direction) of the board B to be transferred. The rail moving unit 8 includes a feed screw 8a, a nut 8b that meshes with the feed screw 8a arranged on the movable rail 4b, and a rail moving motor 8c that rotates the feed screw 8a. By operating the rail moving motor 8c to rotate the feed screw 8a, the movable rail 4b moves along the Y-axis (arrow a). Thereby, the space between the fixed rail 4a and the movable rail 4b can be changed according to the width of the board B conveyed by the board conveying section 4. FIG.

In FIG. 2, component supply units 9 are installed on both sides of the board transfer unit 4 (in the front-rear direction of the Y-axis). A plurality of tape feeders 10 are arranged in parallel along the X-axis in the component supply section 9 . The tape feeder 10 pitch-feeds a component tape having a pocket for storing the component D in a direction (tape feed direction) from the outside of the component supply unit 9 toward the substrate transport unit 4, so that the mounting head picks up the component. The component D is supplied to the component supply position where the

A Y-axis table 11 having a linear driving mechanism is arranged at both ends of the X-axis on the upper surface of the base 7 . Between the two Y-axis tables 11, a beam 12 similarly equipped with a linear mechanism is connected so as to be movable along the Y-axis. A mounting head 13 is attached to the beam 12 via a plate 12a so as to be movable along the X axis. The mounting head 13 has a nozzle 13b attached to its lower end for sucking and holding the component D, and includes a plurality of (here, eight) suction units 13a capable of moving up and down the attached nozzle 13b (see FIG. 3). ).

In FIG. 2, the Y-axis table 11 and the beam 12 constitute a head moving mechanism for moving the mounting head 13 in the horizontal direction (X-axis direction, Y-axis direction). Further, the head moving mechanism and the mounting head 13 pick up the component D from the component supply position of the tape feeder 10 mounted on the component supply section 9 and mount it on the mounting position of the board B held by the board transfer section 4. A component mounting section 14 for performing component mounting work is configured. In the component mounting operation, the mounting head 13 moves above the component supply unit 9, picks up a predetermined component D with each nozzle, moves above the board B, and mounts the component D held by each nozzle. Repeat a series of mounting turns that mount to the position.

A head camera 15 is attached to the plate 12a to which the mounting head 13 is attached. As the mounting head 13 moves, the head camera 15 moves above the board B positioned at the mounting work position of the board conveying section 4, and a board mark (not shown) provided on the board B, the board B Take an image of the mounting position of

In FIG. 2, a component recognition camera 16 is installed between the component supply section 9 and the substrate transfer section 4 . The component recognition camera 16 takes an image of the component D held by the nozzle from below when the mounting head 13 that has taken out the component D from the component supply unit 9 is positioned above the component recognition camera 16 . When the mounting head 13 mounts the component D on the board B, the mounting position is corrected in consideration of the recognition result of the board B by the head camera 15 and the recognition result of the component by the component recognition camera 16 .

A touch panel 17 operated by a worker is installed at a position where the worker works on the front surface of the component mounting apparatuses M1 to M4. The touch panel 17 displays various information on its display section, and the operator uses operation buttons displayed on the display section to input data and operate the component mounting apparatuses M1 to M4.

Next, referring to FIG. 3, the configuration of the mounting head 13 will be described. The mounting head 13 includes a plurality of suction units 13a. Each suction unit 13a has a drive mechanism (not shown). By driving the drive mechanism, the shaft 13c with the nozzle 13b attached to the lower end thereof moves up and down (arrow b). Further, by driving the drive mechanism, the shaft 13c rotates and the nozzle 13b rotates in the θ direction with the nozzle axis AN as the rotation axis (arrow c). Thus, the mounting head 13 provided in the component mounting section 14 has the nozzle 13b that holds and rotates the component D to mount the component D on the substrate B at a predetermined rotation angle.

Next, the configuration of the control system of the component mounting system 1 will be described with reference to FIG. Here, among the functions of the component mounting system 1, when changing the production model of the mounting board to be manufactured, the mounting position deviation information of the component D mounted on the board B is appropriately fed back to the component mounting apparatuses M1 to M4. This section focuses on functions that Management computer 3, component mounting apparatuses M1 to M4, and inspection apparatus M5 are interconnected via communication network 2. FIG. The component mounting apparatuses M1 to M4 are equipped with a mounting control device 20, a substrate transport section 4, a rail moving section 8, a tape feeder 10, a component mounting section 14, a head camera 15, a component recognition camera 16, and a touch panel 17. The mounting control device 20 includes a mounting storage unit 21, a board change processing unit 22, an acquisition unit 23, a first correction value calculation unit 24, a second correction value calculation unit 25, a mounting control unit 26, and a mounting communication unit 27. .

The mounting communication unit 27 transmits and receives data to and from the inspection device M5 and the management computer 3 via the communication network 2 . The mounting storage unit 21 is a storage device, and stores mounting data 21a, positional deviation information 21b, first correction value information 21c, second correction value information 21d, and the like. The mounting data 21a includes the production model name (board name) of the mounting board, the size of the board B, the type (part name) of the component D mounted on the board B, the mounting position (XY coordinates), and the mounting direction (θ direction). , the mounting position of the tape feeder 10 that supplies the component D, the mounting position of the nozzle, and the like.

In FIG. 4, the board change processing unit 22 changes the board B on which component mounting work is to be performed by the component mounting apparatuses M1 to M4, based on a command from the management computer 3 or based on an operator's operation from the touch panel 17. Execute substrate change processing for changing the production model. Specifically, the board change processing unit 22 causes the mounting storage unit 21 to store the changed board B mounting data 21 a transmitted from the management computer 3 . Then, the board change processing section 22 controls the rail moving section 8 based on the changed width (the length in the Y-axis direction) of the board B included in the mounting data 21a, so that the board conveying section 4 changes the width of the board B after the change. The position of the movable rail 4b is moved so that the substrate B can be transported.

In FIG. 4, the acquisition unit 23 obtains positional deviation information (mounting positional deviation amounts ΔX, ΔY, Δθ) of the component D mounted on the board B calculated by imaging the component D mounted on the board B by the inspection device M5. is stored in the mounting storage unit 21 as the positional deviation information 21b. The first correction value calculator 24 is used when the component mounting apparatuses M1 to M4 mount the component D on the board B based on the mounting position deviation amounts ΔX, ΔY, and Δθ of the component D included in the positional deviation information 21b. A first correction value to be calculated. That is, the first correction value calculator 24 calculates the first correction value based on the positional deviation information 21b of the board B (first type board) currently being manufactured. The first correction value calculator 24 stores the calculated first correction value in the mounting storage unit 21 as the first correction value information 21c.

The second correction value calculator 25 is used when the component mounting apparatuses M1 to M4 mount the component D on the board B based on the mounting position deviation amounts ΔX, ΔY, and Δθ of the component D included in the positional deviation information 21b. A second correction value that does not depend on the type of board B (manufacturing model) or the type of component D is calculated. That is, the second correction value calculator 25 calculates the second correction value based on the positional deviation information 21b of the substrates B manufactured so far, including at least the substrate B (first type substrate) currently being manufactured. . The second correction value calculation unit 25 stores the calculated second correction value in the mounting storage unit 21 as the second correction value information 21d. An example of the second correction value will be described later.

4, the mounting control unit 26 (control unit) controls the mounting position and mounting direction included in the mounting data 21a, the first correction value included in the first correction value information 21c, and the second correction value included in the second correction value information 21d. 2 The component D is mounted on the board B by controlling the board conveying section 4, the tape feeder 10, the component mounting section 14, the head camera 15, and the component recognition camera 16 based on the correction value. That is, the component mounting unit 14 detects the position of the board B imaged by the head camera 15, the pickup position deviation information, the first correction value included in the first correction value information 21c, or the second correction value included in the second correction value information 21d. 2 The component D is mounted on the board B by correcting the position of the mounting head 13 based on the correction value.

More specifically, when the production type of the mounting board to be manufactured is switched from the first type board to the second type board, the mounting control unit 26 performs the second correction that does not depend on the type of the board B or the type of the component D. The value is used to mount part D on the second type board. Then, when the first correction value for mounting the component D on the second type board is calculated based on the positional deviation information 21b of the component D mounted on the second type board, the mounting control unit 26 The component mounting unit 14 is controlled to mount the component D on the second type board using the 1 correction value.

As a result, even when the production model of the mounting board manufactured in the component mounting system 1 is switched, the component mounting work by the component mounting apparatuses M1 to M4 is not stopped, and the positional deviation of the component D mounted on the board B is prevented. The information 21b can be appropriately fed back.

In FIG. 4 , the inspection device M5 includes an inspection control device 30 , a board transfer section 5 , an inspection camera 6 and an inspection camera moving mechanism 31 . The examination control device 30 includes an examination storage section 32 , an examination control section 33 , a recognition processing section 34 and an examination communication section 35 . The inspection communication unit 35 transmits and receives data to and from the component mounting apparatuses M1 to M4 and the management computer 3 via the communication network 2 . The inspection storage unit 32 is a storage device, and stores inspection data 32a and the like. The inspection data 32a includes the production model name (board name) of the mounted board, the size of the board B, the type (part name) of the component mounted on the board B, the mounting position (XY coordinates), the mounting direction (θ direction), the defect Includes judgment values.

The inspection control unit 33 controls the board transport unit 5 to transport the mounted board B unloaded from the upstream component mounting apparatus M4 to the inspection work position, position it, and hold it there, so that the board for which the inspection work has been completed is carried out. B is carried out downstream. Further, based on the inspection data 32a, the inspection control unit 33 controls the inspection camera moving mechanism 31 to sequentially move the inspection camera 6 above the mounting position of the board B held at the inspection work position. At 6, the component D mounted on the board B is imaged.

In FIG. 4, the recognition processing unit 34 performs recognition processing on an image captured by the inspection camera 6, and performs mounting position deviation amounts ΔX, ΔY, and Δθ (FIG. 5 ) are calculated. Further, the recognition processing unit 34 determines that the component D is defective in mounting (the board B is defective) when the calculated mounting position deviation amounts ΔX, ΔY, and Δθ exceed the defect determination value included in the inspection data 32a. Further, the recognition processing unit 34 transmits positional deviation information (mounting positional deviation amounts ΔX, ΔY, Δθ) of the component D mounted on the board B to the component mounting apparatuses M1 to M4. Acquisition unit 23 of component mounting apparatuses M1 to M4 causes mounting storage unit 21 to store received positional deviation information 21b. As described above, the inspection device M5 is a positional deviation information acquisition unit that acquires the positional deviation information 21b of the component D mounted on the board B. FIG.

Here, an example of a method of calculating the mounting position deviation amounts ΔX, ΔY, and Δθ from the normal mounting position Q of the component D mounted on the board B by the recognition processing unit 34 will be described with reference to FIG. The inspection control unit 33 images the component D mounted on the board B at a position where the imaging center of the inspection camera 6 coincides with the normal mounting position Q of the component D. The recognition processing unit 34 detects the component center C of the mounted component D by performing recognition processing on the captured image. Then, the recognition processing unit 34 calculates the positional deviation amount ΔX in the X-axis direction and the positional deviation amount ΔY in the Y-axis direction from the difference between the component center C (ΔX, ΔY) and the mounting position Q (0, 0). Further, the recognition processing unit 34 calculates the tilt of the component D in the θ direction as the positional deviation amount Δθ.

In FIG. 4, the management processing device 40 of the management computer 3 includes a management storage section 41, a production change processing section 42, an input section 43, a display section 44, and a management communication section 45. FIG. The input unit 43 is an input device such as a keyboard, touch panel, mouse, etc., and is used for inputting operation commands and data. The display unit 44 is a display device such as a liquid crystal panel, and displays various information such as various screens such as an operation screen for operation by the input unit 43 . The management communication unit 45 is a communication interface, and exchanges signals and data with the component mounting apparatuses M1 to M4 and the inspection apparatus M5 via the communication network 2. FIG.

The management storage unit 41 is a storage device and stores production data 41a and the like. The production data 41a includes the production model name (board name) of the mounting board, the size of the board B, the type (part name) of the component D mounted on the board B, the size of the component D, the mounting position (XY coordinates), the mounting direction (θ direction), component mounting apparatuses M1 to M4 (component mounting units 14) for mounting components D, mounting positions of tape feeders 10 for supplying components D, information specifying mounting heads 13, mounting positions of nozzles, and the like. Contains information. That is, the production data 41a includes the mounting data 21a used by the component mounting apparatuses M1 to M4 for each production model of the mounted substrate manufactured by the component mounting system 1. FIG.

In FIG. 4 , the production change processing unit 42 executes production change processing for changing the production model of the mounting board manufactured in the component mounting system 1 . Specifically, when the mounting board manufactured in the component mounting system 1 is changed from the first-kind board to the second-kind board, the production change processing unit 42 performs the component-mounting operation on the last board BA55 of the first-kind board. Mounting data 21a of the second type board and a setup change command are transmitted to the component mounting apparatuses M1 to M4 that have completed (see FIG. 8). When the board change processing is completed in the component mounting apparatuses M1 to M4 that have received the command, the component mounting apparatuses M1 to M4 receive the first board BB1 of the second type board from the upstream device and perform the component mounting work.

Next, as an example of the second correction value that does not depend on the type of the substrate B or the type of the component D, the correction value calculated for each rotation angle of the nozzle 13b will be described with reference to FIG. The nozzle 13b is attached to the suction unit 13a in a posture in which the nozzle axis AN is vertical (in the Z-axis direction), as indicated by a two-dot chain line in FIG. 6(a). However, there are cases where the nozzle axis AN is tilted from the vertical direction due to the attachment condition of the nozzle 13b and the distortion of the shaft 13c and the nozzle 13b. The inclination of the nozzle axis AN differs for each suction unit 13a or for each nozzle 13b, but does not depend on the production model of the mounting board or the type of the component D.

When the mounting operation is performed by the nozzle 13b with the tilted nozzle axis AN, the component D is mounted on the board B with the component center C displaced from the normal mounting position Q. Further, as shown in FIG. 6(b), when the nozzle 13b is rotated, the component center C of the component D is moved according to the rotation angle and mounted on the board B. As shown in FIG. Accordingly, as in the example shown in FIG. 6B, the mounting position deviation amounts ΔX, ΔY, and Δθ are different for each rotation angle of 0°, 90°, 180°, and 270°.

Immediately after the mounting board manufactured in the component mounting system 1 is changed from the first type board to the second type board, the positional deviation information 21b of the second type board is not acquired. Therefore, immediately after the change, the first correction value based on the positional deviation information 21b of the second type board is not calculated. Therefore, immediately after the change, by using the correction value (second correction value) for each rotation angle of the nozzle 13b calculated based on the positional deviation information 21b of the first type substrate, component mounting by the component mounting apparatuses M1 to M4 is performed. Without stopping the work, it is possible to perform component mounting work on the second-kind board to which the positional deviation information 21b is appropriately fed back.

Next, referring to FIG. 8 along the flow of FIG. A component mounting method for appropriately feeding back the deviation information 21b and continuing the component mounting work will be described.

In FIG. 7, in the component mounting system 1, a considerable number of boards are manufactured after the mounting board to be manufactured is changed to the first type board, and the component mounting apparatuses M1 to M4 regularly manufacture components for the first type board. Assume that implementation work is being done. That is, the component mounting units 14 of the component mounting apparatuses M1 to M4 use the first correction values included in the first correction value information 21c to mount the components D on the boards BA52 to BA53 (ST1: first component mounting process) (see FIG. 8(a)).

Further, in the inspection apparatus M5, the positional deviation information 21b (first positional deviation information) of the component D mounted on the board BA51 of the first type board is acquired from the result of imaging by the inspection camera 6 (ST2: first positional deviation information). deviation information acquisition step) (see FIG. 8(a)). The acquired positional deviation information 21b (first positional deviation information) of the first type board is transmitted to the component mounting apparatuses M1 to M4. After that, the first correction value calculator 24 of the component mounting apparatuses M1 to M4 replaces the component D with the first type board based on the acquired positional deviation information 21b (first positional deviation information) of the first type board. Calculating a first correction value for mounting on the device (ST3: first correction value calculation step). The calculated first correction value is stored in the mounting storage unit 21 as the first correction value information 21c.

In FIG. 7, the second correction value calculator 25 of each of the component mounting apparatuses M1 to M4 also calculates a value depending on the type of board based on the acquired positional deviation information 21b (first positional deviation information) of the first type board. A second correction value that does not need to be calculated (ST4: second correction value calculation step). The calculated second correction value is stored in the mounting storage unit 21 as the second correction value information 21d.

When the boards on which the component mounters M1 to M4 mount components are of the first type (No in ST5), the component mounters M1 to M4 perform the first component mounting step (ST1) and the first correction value calculation step ( ST3) and the second correction value calculation step (ST4) are repeatedly performed, and the first positional deviation information acquisition step (ST2) is repeatedly performed in the inspection apparatus M5. When the board on which the component mounting work is to be performed is changed from the first type board to the second type board (Yes in ST5), board change processing is executed in component mounting apparatuses M1 to M4.

In FIG. 8A, in the component mounting apparatus M1, the component mounting operation using the first correction value is performed on the last board BA55 of the first type board. When the board BA55 is ejected from the component mounting apparatus M1, according to a command from the management computer 3, board change processing is executed in the component mounting apparatus M1 to switch the target of the component mounting work to the second type board. In FIG. 8B, when the board change processing in the component mounting apparatus M1 is completed, the first board BB1 of the second type board is conveyed to the component mounting apparatus M1, and the component mounting operation using the second correction value is performed. be. During this time, the component mounting apparatus M2 carries out component mounting work using the first correction value on the board BA55 of the first type board.

In FIG. 8(c), after that, when the component mounting work using the first correction value for the last board BA55 is completed in the component mounting apparatuses M2 to M4, board change processing for switching the target of the component mounting work to the second type board. are executed in sequence.

In FIG. 7, when the target of the component mounting operation is switched from the first type board to the second type board in the component mounting apparatuses M1 to M4 (Yes in ST5), the component mounting section 14 of the component mounting apparatuses M1 to M4 changes to the second type board. 2. Using the second correction value contained in the correction value information 21d, mount the component D on the boards BB1 to BB5 of the second type board (ST6: second component mounting step) (FIGS. 8B to 8D). reference). Next, when the first board BB1 of the second type board is transported to the inspection apparatus M5, the positional deviation information 21b (second positional deviation information) of the component D mounted on the board BB1 of the second type board is acquired ( ST7: second positional deviation information acquisition step) (see FIG. 8(d)).

The acquired positional deviation information 21b (second positional deviation information) of the second type board is transmitted to the component mounting apparatuses M1 to M4. Then, the first correction value calculator 24 of the component mounting apparatuses M1 to M4 replaces the component D with the second type board based on the acquired positional deviation information 21b (second positional deviation information) of the second type board. A first correction value (third correction value) for mounting on the BB 6 is calculated (ST8: third correction value calculation step). The calculated first correction value (third correction value) is stored in the mounting storage unit 21 as the first correction value information 21c.

In FIG. 8D, the first substrate BB1 of the second type substrate is transported to the inspection apparatus M5, and positional deviation information 21b (second positional deviation information) is acquired. The acquired positional deviation information 21b (second positional deviation information) of the board BB1 is transmitted to the component mounting apparatuses M1 to M4, and the first correction value (third correction value) is calculated.

In FIG. 7, when the first correction value (third correction value) is calculated (ST8), the component mounting units 14 of the component mounting apparatuses M1 to M4 obtain the first correction value ( Third correction value) is used to mount components D on boards BB3 to BB6 of the second type board (ST9: third component mounting step). That is, the first correction value (third correction value) is used for the board BB6 in the component mounting apparatus M1, the board BB5 in the component mounting apparatus M2, the board BB4 in the component mounting apparatus M3, and the board BB3 in the component mounting apparatus M4. A third component mounting step (ST9) is executed (see FIG. 8(e)).

In this way, the inspection apparatus M5 (positional deviation information acquiring section) acquires the positional deviation information 21b of the second type board (ST7), and the first correction value calculating section 24 acquires the positional deviation information 21b of the second type board. (ST8), the component mounting section 14 mounts the component D on the second type board using the first correction value (third correction value) for the second type board. is implemented (ST9).

After that, the inspection apparatus M5 acquires positional deviation information 21b (second positional deviation information) of the component D mounted on the board BB2 of the second type board (ST10). That is, the second positional deviation information acquisition step (ST7) is executed. Next, the first correction value calculator 24 of the component mounting apparatuses M1 to M4 calculates the first correction value (third correction value) based on the acquired positional deviation information 21b (second positional deviation information). That is, the third correction value calculation step (ST8) is executed. Further, the second correction value calculator 25 of the component mounting apparatuses M1 to M4 calculates a second correction value (fourth correction value) is calculated (ST12: fourth correction value calculation step).

In FIG. 7, the third component mounting step (ST9), the third correction value calculating step (ST11 (ST8)), the fourth correction value calculating step (ST12) is repeatedly performed, and the second misalignment information acquiring step (ST10 (ST7)) is repeatedly performed in the inspection apparatus M5. As a result, the positional deviation information 21b of the components D mounted on the boards BB1 to BB6 can be appropriately fed back to the component mounting apparatuses M1 to M4.

As described above, the component mounting system 1 of the present embodiment includes a positional deviation information acquisition unit (inspection device M5) that acquires the positional deviation information 21b of the components D mounted on the boards BB1 to BB6, and a positional deviation information 21b, a first correction value calculator 24 for calculating a first correction value (third correction value) when mounting the component D on the boards BB1 to BB6, and the component D based on the positional deviation information 21b. A second correction value calculator 25 for calculating a second correction value (fourth correction value) that is a correction value for mounting on the boards BB1 to BB6 and does not depend on the type of board, boards BA51 to BA55, and board BB1 and a component mounting section 14 for mounting the component D on the BB6.

The second correction value calculation unit 25 calculates a second correction value based on the positional deviation information 21b of the boards BA51 to BA55 on which the component D has been mounted so far, including at least the first type board, and calculates the first type board. , the component mounting unit 14 uses the second correction value to mount the components D on the boards BB1 to BB5 of the second type board. As a result, the positional deviation information 21b of the components D mounted on the boards BB1 to BB6 can be appropriately fed back to the component mounting apparatuses M1 to M4.

INDUSTRIAL APPLICABILITY The component mounting system, component mounting apparatus, and component mounting method of the present invention have the effect of being able to appropriately feed back positional deviation information of components mounted on a board, and are useful in the field of component mounting on a board. be.

1 component mounting system 13b nozzle 14 component mounting unit B, BA51 to BA55, BB1 to BB6 board D component M1 to M4 component mounting device M5 inspection device (position deviation information acquisition unit)

Claims (8)

a positional deviation information acquisition unit that acquires positional deviation information of a component mounted on a substrate;
a first correction value calculation unit that calculates a first correction value for mounting the component on the substrate based on the positional deviation information;
a second correction value calculation unit that calculates a second correction value that is a correction value for mounting a component on a board based on the positional deviation information and that does not depend on the type of the board;
a component mounting unit for mounting components on the substrate,
The second correction value calculation unit calculates the second correction value based on the positional deviation information of a board on which components have been mounted so far, including at least a first type board,
A component mounting system according to claim 1, wherein at the beginning of switching from the first type board to the second type board, the component mounting unit mounts the component on the second type board using the second correction value. the positional deviation information acquiring unit acquires the positional deviation information of the second type board;
When the first correction value calculation unit calculates the first correction value based on the positional deviation information of the second type board,
2. The component mounting system according to claim 1, wherein said component mounting section uses said first correction value for said second type board to mount a component on said second type board. The component mounting unit includes a nozzle that holds and rotates the component to mount the component on the board at a predetermined rotation angle,
3. The component mounting system according to claim 1, wherein said second correction value is a correction value for each rotation angle of said nozzle. 4. The component mounting system according to claim 1, wherein said second correction value does not depend on the type of component and board. a component mounting unit that mounts components on the substrate;
A control unit that controls the component mounting unit,
The control unit
At the beginning of switching from the first-kind board to the second-kind board, mounting the component on the second-kind board using a second correction value that does not depend on the type of the board,
When a first correction value for mounting the component on the second type board is calculated based on the positional deviation information of the component mounted on the second type board, the first correction value is used to calculate the A component mounting apparatus that controls the component mounting section to mount a component on a second type board. 6. The component mounting apparatus according to claim 5, further comprising a first correction value calculator that calculates said first correction value based on said positional deviation information. 7. The component mounting apparatus according to claim 5, further comprising a second correction value calculator that calculates said second correction value based on said positional deviation information. Acquiring first positional deviation information of a component mounted on the first type board,
calculating, based on the first positional deviation information, a second correction value that is a correction value for mounting the component on the board and that does not depend on the type of the board;
When the first-kind board is switched to the second-kind board, mounting a component on the second-kind board using the second correction value;
acquiring second misalignment information of a component mounted on the second type board;
calculating a first correction value for mounting the component on the second type board based on the second positional deviation information;
The component mounting method, wherein, when the first correction value is calculated, the component is mounted on the second type board using the first correction value.

Images