JP2013251475A - Calibration value obtaining method in electronic component mounting line and electronic component mounting method on electronic component mounting line - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a calibration value obtaining method in an electronic component mounting line and an electronic component mounting method on an electronic component mounting line capable of simply performing a calibration value obtaining operation for each electronic components mounting device constituting an electronic component mounting line in a short time.SOLUTION: After mounting plural samples C4 to plural target points C2H on a calibration substrate C2 in the order from an electronic component mounting device 12 at the upstream side to an electronic component mounting device 12 at the downstream side, images of the calibration substrate C2 mounted with the samples C4 are taken using a camera (substrate camera 30) positioned at the downstream side of the plural electronic component mounting devices 12. Calibration values of control data for the electronic component mounting devices 12 which performs mounting operation on the samples C4 are calculated from a positional relationship between the a position of the target points C2H on the calibration substrate C2 and an actual mounting positions of the samples C4 mounted using the target point C2H as the target on the basis of the image of the calibration substrate C2 obtained by the imaging.

Description

  The present invention relates to a calibration value acquisition method in an electronic component mounting line configured to include a plurality of electronic component mounting apparatuses that perform an electronic component mounting operation on a board, and an electronic component mounting method using an electronic component mounting line.

  The electronic component mounting line is configured to include a plurality of electronic component mounting devices. Each electronic component mounting device carries in and positions the board sent from the upstream process side, and controls the electronic components picked up by the mounting head. After being mounted on the substrate based on the above, the substrate is carried out to the downstream process side. In such an electronic component mounting line, each electronic component mounting device starts actual production work of the substrate so that the actual mounting position of each electronic component mounted on the substrate matches the mounting position on the control data as much as possible. Before, the amount of positional deviation between the position on the control data of the mounting head (specifically, each suction nozzle included in the mounting head) and the actual position is obtained, and the actual mounting is performed based on the obtained positional deviation amount. A calibration value for calibrating the control data is acquired so that the position approaches the mounting position on the control data.

  In the operation of obtaining the calibration value of the control data in each electronic component mounting apparatus, in general, calibration including a reference mark (reference mark) and a number of reference points arranged in a matrix with the reference mark as a reference. Prepare a circuit board and place it at a predetermined position on the electronic component mounting device, and control the mounting head so that the target (calibration electronic component) is mounted on each target point on the installed calibration board. Then, each target actually mounted on the calibration board is imaged by a camera fixed to the mounting head, and the position of each target point and the position of the imaging center of the camera are obtained from the obtained image. That is, the positional deviation from (ie, the position of the mark on the control data) is obtained. Then, an offset data value for offsetting the control data is calculated so that the obtained positional deviation is within a certain range (allowable variation range), and the calculated offset data is used as a calibration value for the control data in each electronic component mounting apparatus. Obtain (for example, Patent Document 1).

  Here, in the electronic component mounting line, the variation in the difference (position shift amount) between the actual electronic component mounting position in each electronic component mounting apparatus and the mounting position on the control data is based on the electronic component mounting apparatus. It is not enough to be within the allowable variation range, and it is necessary to guarantee the accuracy of the entire electronic component mounting line, so that the above variation range is within the allowable variation range determined for the entire electronic component mounting line. There is a need to. For this reason, after making the calibration board common to all electronic component mounting apparatuses, each electronic component mounting apparatus is mounted on the calibration board according to the control data, Is transferred to an inspection apparatus equipped with a camera for inspection separately provided with a calibration board, and the calibration value of the control data in each electronic component mounting apparatus is obtained from the image of each target obtained there, The average value of the amount of misalignment from the target point of the target is calculated, and the calibration value of the control data in each electronic component mounting apparatus is recalibrated using the calculated average value of the amount of misalignment as the recalibration value. .

JP 2005-121478 A

  However, in the method of obtaining the calibration value (the calibration value of the control data in each electronic component mounting apparatus and the recalibration value for recalibrating this calibration value) of each electronic component mounting apparatus constituting the electronic component mounting line by the conventional method described above. , Repeatedly installing and removing the calibration substrate from each electronic component mounting apparatus and installing and removing the calibration substrate (calibration substrate on which the target is mounted) taken out from each electronic component mounting apparatus. There was a problem that it was necessary and the work was troublesome and took a lot of time.

  Accordingly, the present invention provides a calibration value acquisition method in an electronic component mounting line, and an electronic component using the electronic component mounting line, which can easily and quickly perform a calibration value acquisition operation of each electronic component mounting apparatus constituting the electronic component mounting line. The purpose is to provide an implementation method.

  The calibration value acquisition method for an electronic component mounting line according to claim 1 is a method of carrying in and positioning a substrate sent from an upstream process side and mounting the electronic component picked up by a mounting head on the substrate based on control data. Then, a calibration value acquisition method in an electronic component mounting line configured to include a plurality of electronic component mounting apparatuses for performing an electronic component mounting operation for unloading the substrate to the downstream process side, the upstream of the electronic component mounting line A target mounting process for mounting a plurality of targets on a plurality of target points on a calibration substrate in the order of an electronic component mounting apparatus on the process side to an electronic component mounting apparatus on the downstream process side, and the electronic component mounting line A calibration board imaging step for imaging the calibration board after mounting the target using a camera located on the downstream side of the plurality of electronic component mounting apparatuses; Based on the image of the calibration substrate obtained in the calibration substrate imaging step, the position of the target on the calibration substrate and the actual mounting position of each target mounted with the target as the target A calibration value calculation step of calculating a calibration value of control data of each electronic component mounting apparatus that has performed the target mounting step from the positional relationship.

  The electronic component mounting method using the electronic component mounting line according to claim 2 carries in and positions the substrate sent from the upstream process side, and mounts the electronic component picked up by the mounting head on the substrate based on the control data. Then, an electronic component mounting method using an electronic component mounting line configured to include a plurality of electronic component mounting apparatuses for carrying out an electronic component mounting operation for unloading the board to the downstream process side, upstream of the electronic component mounting line A target mounting process for mounting a plurality of targets on a plurality of target points on a calibration substrate in the order of an electronic component mounting apparatus on the process side to an electronic component mounting apparatus on the downstream process side, and the electronic component mounting line A calibration board imaging step for imaging the calibration board after mounting the target using a camera located on the downstream side of the plurality of electronic component mounting apparatuses; Based on the image of the calibration substrate obtained in the calibration substrate imaging step, the position of the target on the calibration substrate and the actual mounting position of each target mounted with the target as the target A calibration value calculation step of calculating a calibration value of control data of each electronic component mounting apparatus that has performed the target mounting step from a positional relationship, and the electronic component mounting corresponding to the calibration value calculated in the calibration value calculation step The electronic component is mounted on the board by performing the electronic component mounting operation by the electronic component mounting apparatus in the electronic component mounting line.

  In the present invention, the calibration substrate is inserted into the electronic component mounting line and the calibration substrate is mounted on each electronic component mounting device in the same manner as when the electronic component mounting device constituting the electronic component mounting line is caused to perform the electronic component mounting operation. After mounting multiple specimens, image the calibration board after mounting the specimens by all the electronic component mounting devices that make up the electronic component mounting line. Each electronic component mounting that constitutes the electronic component mounting line based on the positional relationship between the position of the target on the calibration substrate and the actual mounting position of each target mounted with the target as the target The calibration value of the control data of the apparatus is acquired. As in the past, the calibration board taken out from each electronic component mounting apparatus (the target is installed) powered by Since the there is no need to install a repeated extraction execution of the calibration substrate) of the inspection apparatus, it is possible to obtain a calibration value easily and in a short time of each electronic component mounting apparatus constituting the electronic component mounting line.

Simplified overall configuration diagram of an electronic component mounting line in an embodiment of the present invention The top view of the electronic component mounting apparatus which comprises the electronic component mounting line in one embodiment of this invention The side view of the electronic component mounting apparatus in one embodiment of this invention The block diagram which shows the control system of the electronic component mounting apparatus in one embodiment of this invention The flowchart which shows the procedure of the electronic component mounting operation which the electronic component mounting apparatus in one embodiment of this invention performs The figure which shows the state which is performing the acquisition operation of the calibration value of control data in the electronic component mounting line in one embodiment of this invention The perspective view of the board | substrate for a calibration used in the calibration value acquisition operation | work of the control data which the electronic component mounting line in one embodiment of this invention performs The flowchart which shows the procedure of the calibration value acquisition operation | work of the control data which the electronic component mounting line in one embodiment of this invention performs The flowchart which shows the execution procedure of the mounting operation | work of the target with respect to the board | substrate for a calibration which each electronic component mounting apparatus performs in the calibration value acquisition operation of the control data which the electronic component mounting line in one embodiment of this invention performs

  Embodiments of the present invention will be described below with reference to the drawings. An electronic component mounting line 1 according to an embodiment of the present invention shown in FIG. 1 is for producing an electronic circuit forming substrate 2S by mounting an electronic component 4 on an electrode part 3 of a substrate 2, and a screen printing machine 11, Multiple (here, three) electronic component mounting apparatuses 12 (first electronic component mounting apparatus 12a, second electronic component mounting apparatus 12b, and third electronic component mounting apparatus 12c in this order from the upstream process side) and a reflow furnace 13 are arranged in this order.

  The screen printing machine 11 screen-prints solder (not shown) on the electrode part 3 of the substrate 2, and among the three electronic component mounting apparatuses 12, the first one located on the most upstream process side (left side in FIG. 1). The board 2 is delivered to the electronic component mounting apparatus 12a.

  The first electronic component mounting apparatus 12a mounts the electronic component 4 on the electrode part 3 of the substrate 2 sent from the screen printing machine 11, and delivers the substrate 2 to the electronic component mounting apparatus 12 on the downstream process side. The second electronic component mounting apparatus 12b mounts the electronic component 4 on the electrode part 3 of the substrate 2 sent from the first electronic component mounting apparatus 12a, and passes it to the third electronic component mounting apparatus 12c on the downstream process side. Deliver the substrate 2. The third electronic component mounting apparatus 12c mounts the electronic component 4 on the electrode part 3 of the substrate 2 sent from the second electronic component mounting apparatus 12b, and delivers the substrate 2 to the reflow furnace 13 on the downstream process side. The reflow furnace 13 heats the substrate 2 on which the electronic component 4 is mounted by the three electronic component mounting apparatuses 12 while heating the substrate 2 to melt the solder (solder reflow), and the electronic component 4 is placed on the electrode portion 3 of the substrate 2. The electronic circuit forming substrate 2S completed by being fixed to is carried out.

  2 and 3, the three electronic component mounting apparatuses 12 have the same configuration, and the substrate 2 is placed in the horizontal direction at the center of the base 21 (the transport direction of the substrate 2 is the X-axis direction ( A board transfer conveyor 22 is provided for transferring the left and right directions as viewed from the operator OP). A plurality of parts feeders 23 are mounted side by side in the X-axis direction at the end in the horizontal plane direction (Y-axis direction (front-rear direction viewed from the operator OP)) orthogonal to the X-axis direction of the base 21. Each of the parts feeders 23 continuously supplies the electronic component 4 to the electronic component supply port 23a.

  On the base 21, two front and rear head moving mechanisms 24 (a front head moving mechanism 24F and a rear head moving mechanism 24R) are provided. The front head moving mechanism 24F and the rear head moving mechanism 24R are respectively supported at one end side by a Y-axis table 24a and a Y-axis table 24a provided on the right side of the base 21 so as to extend in the Y-axis direction. The extended X-axis table 24b and a movable stage 24c provided so as to be movable along the X-axis table 24b include a mounting head 25 attached to each movable stage 24c. Here, the two head moving mechanisms 24 (the front head moving mechanism 24F and the rear head moving mechanism 24R) share the Y-axis table 24a, and the Y-axis direction of the X-axis table 24b with respect to the Y-axis table 24a is the same. By combining this movement and the movement of the moving stage 24c in the X-axis direction with respect to the X-axis table 24b, each mounting head 25 can be moved independently in the horizontal plane.

  In FIG. 3, each mounting head 25 is provided with a plurality of shaft members 26 extending downward (the vertical direction is the Z-axis direction), and the electronic component 4 is attracted to the lower end of each shaft member 26. The suction nozzle 27 is detachably attached. Each shaft member 26 is driven by a shaft drive mechanism 28 (FIG. 2) provided in each mounting head 25 to perform vertical movement with respect to the mounting head 25 and rotation around the Z axis. Each mounting head 25 is provided with a suction mechanism 29 (FIG. 2) that causes the suction nozzle 27 to perform a suction operation of the electronic component 4.

  In FIG. 2 and FIG. 3, the mounting head 25 is attached with a substrate camera 30 with the imaging field of view facing downward, and an imaging field of view is located in the region between the substrate transport conveyor 22 and the parts feeder 23 on the base 21. A component camera 31 is provided with the facing upward.

  In FIG. 4, the substrate 2 is transported and positioned by the substrate transport conveyor 22, the electronic component 4 is supplied by each parts feeder 23, and the two head moving mechanisms 24 (the front head moving mechanism 24F and the rear head moving mechanism 24R) are used. Control of the movement operation of the two mounting heads 25, the vertical movement of each shaft member 26 by the shaft drive mechanism 28, and the rotation around the vertical axis (Z axis) is performed by the control device 40 provided in the electronic component mounting apparatus 12. . Further, the suction operation through the suction nozzle 27 by each shaft member 26 is performed by the control device 40 controlling the operation of the suction mechanism 29 described above.

  The image capturing operation control by the substrate camera 30 and the image capturing operation control by the component camera 31 are performed by the control device 40, and the image data obtained by the image capturing operation of the substrate camera 30 and each image data obtained by the image capturing operation of the component camera 31 are controlled. The image is transmitted to the device 40, and image recognition is performed in the image recognition unit 40a (FIG. 4) of the control device 40.

  4, the storage device 41 connected to the control device 40 includes an electronic component mounting program PG1 that defines an operation procedure when the electronic component mounting apparatus 12 performs an electronic component mounting operation for mounting the electronic component 4 on the board 2. In addition, a calibration value acquisition program PG2 that defines an operation procedure for performing a calibration value acquisition operation for acquiring a calibration value of control data of each electronic component mounting apparatus 12 is stored.

  The storage device 41 also stores control data (offset data) for compensating the final alignment between the electronic component 4 and the substrate 2. The control data is unique to each of the front head moving mechanism 24F and the rear head moving mechanism 24R. In the electronic component mounting apparatus 12 of the present embodiment, the control data of the front head moving mechanism 24F and the rear head moving mechanism 24R is stored. Has been. Further, the storage device 41 also stores a calibration value of the control data (hereinafter referred to as a calibration value). This calibration value is also unique to each of the front head moving mechanism 24F and the rear head moving mechanism 24R, and is acquired by executing the calibration value acquisition program PG2.

  In the production of the electronic circuit forming substrate 2S by the electronic component mounting line 1, first, screen printing of the solder on the substrate 2 is performed by the screen printer 11, and then the first electronic component mounting apparatus 12a and the second electronic component mounting are performed. The electronic component 4 is mounted on the substrate 2 in the order of the device 12b and the third electronic component mounting device 12c.

  In the mounting operation (electronic component mounting operation) of the electronic component 4 on the board 2 in each electronic component mounting apparatus 12, the control device 40 of each electronic component mounting apparatus 12 operates according to the above-described electronic component mounting program PG1. The transport conveyor 22 is operated to load the substrate 2 received from the upstream process side and position it at a predetermined work position (step ST1 shown in the flowchart of FIG. 5). Then, each mounting head 25 is moved to move the substrate camera 30 above the substrate 2, and the substrate camera 30 performs imaging of a pair of reference marks 2 m (FIG. 2) provided at the corners of the substrate 2. Recognizing and calculating the positional deviation (substrate positional deviation) from the reference position of the substrate 2 (step ST2).

  When the control device 40 calculates the displacement of the substrate 2 from the reference position, the control device 40 controls the operation of the parts feeder 23 to supply the electronic component 4 to the electronic component supply port 23a, and each mounting head 25 is moved to the parts feeder 23. The electronic component 4 is picked up (sucked) by each suction nozzle 27 (step ST3). Then, the mounting head 25 is moved so that the electronic component 4 picked up by each suction nozzle 27 passes over one of the two component cameras 31, and the component camera 31 performs imaging of each electronic component 4. The image is recognized (step ST4), and the positional deviation (component adsorption deviation) of each electronic component 4 with respect to the suction nozzle 27 is calculated (step ST5).

  After calculating the positional deviation of each electronic component 4 with respect to the suction nozzle 27, the control device 40 positions the mounting head 25 above the substrate 2 and mounts each electronic component 4 sucked by the suction nozzle 27 on the target 2. After contacting the position, the supply of the vacuum pressure to each suction nozzle 27 is released, and the sucked electronic component 4 is mounted on the substrate 2 (step ST6). In step ST6, the control device 40 detects the substrate position deviation obtained in step ST2, the component adsorption deviation obtained in step ST5, and the head moving mechanism 24 (the front head moving mechanism 24F or the rear head) that moves the mounting head 25. Based on the control data and the calibration value of the moving mechanism 24R), the final stop position of the mounting head 25 by the head moving mechanism 24 is calculated, and the mounting head 25 is moved by the head moving mechanism 24 to the calculated stop position. As a result, the position of the suction nozzle 27 is corrected and the electronic component 4 is accurately positioned at the target mounting position on the substrate 2.

  When the electronic component 4 is mounted on the substrate 2, the control device 40 determines whether or not the mounting of all the electronic components 4 to be mounted on the substrate 2 has been completed (step ST7). When the mounting of all the electronic components 4 to be mounted on the substrate 2 has not been completed, the process returns to step ST3, and when the mounting of all the electronic components 4 to be mounted on the substrate 2 has been completed, the substrate transfer conveyor. 22 is operated and the board | substrate 2 is carried out from the electronic component mounting apparatus 12 (step ST8).

  When the three electronic component mounting apparatuses 12 perform the mounting operation of the electronic component 4 on the substrate 2 according to the above procedure and the substrate 2 is unloaded from the third electronic component mounting apparatus 12c, the reflow furnace 13 is soldered to the substrate 2 Execute reflow and carry out.

  The electronic circuit board 2S is manufactured by the electronic component mounting line 1 according to the above-described procedure. As the operating time of each electronic component mounting apparatus 12 accumulates, the moving mechanism of the mounting head 25 (here, the head moving mechanism 24). The control device 40 can appropriately prevent deterioration of the mounting accuracy of the electronic component 4 due to the change with time only by the control data stored in the storage device 41 at the start of operation. I can't. For this reason, before performing the mounting operation of the electronic component 4 by each electronic component mounting line 1, the calibration value of the control data of each electronic component mounting apparatus 12 is acquired and the control data is calibrated using the calibration value. ing.

  As shown in FIG. 6, the calibration value acquisition operation for acquiring the calibration value of the control data of each electronic component mounting apparatus 12 by the electronic component mounting line 1 includes three electronic component mounting apparatuses 12 constituting the electronic component mounting line 1. For the (first electronic component mounting apparatus 12a, second electronic component mounting apparatus 12b, and third electronic component mounting apparatus 12c), the calibration substrate C2 shown in FIG. 7 and the target mounted on the calibration substrate C2 Use C4.

  As shown in FIG. 7, the calibration substrate C2 is based on a flat plate-shaped member having the same size as the substrate 2 made of glass or the like capable of precise surface processing, and has a pair of upper surfaces. A large number of reference points C2H arranged in a matrix with respect to the reference mark C2m and the pair of reference marks C2m are formed.

  The target C4 has the same size as the electronic component 4 mounted on the substrate 2, and is mounted with the target C2H on the calibration substrate C2 as a target. In addition, a mark M having a predetermined shape is applied to the upper surface position corresponding to the center position so that the center position can be easily recognized when the image is taken from above while mounted on the calibration substrate C2. Yes.

  In the calibration value acquisition work in the electronic component mounting line 1, first, the calibration substrate C2 is carried in by the first electronic component mounting apparatus 12a (step ST11 shown in the flowchart of FIG. 8), and the first electronic component mounting apparatus 12a. The control device 40 executes the mounting operation of the specimen C4 on the calibration substrate C2 in accordance with the calibration value acquisition program PG2 (step ST12).

  In the mounting operation of the specimen C4 on the calibration substrate C2 according to the calibration value acquisition program PG2, the control device 40 first positions the calibration substrate C2 carried by the substrate transport conveyor 22 at a predetermined position (the flowchart in FIG. 9). Step ST31), the substrate camera 30 is moved above the calibration substrate C2, the reference mark C2m provided at the corner of the calibration substrate C2 is imaged, image recognition is performed, and the reference of the calibration substrate C2 is determined. A positional deviation from the position is calculated (step ST32).

  Here, the position coordinates of the target point C2H on the calibration substrate C2 when each target C4 is mounted must be defined in a coordinate system unique to the electronic component mounting apparatus 12 that mounts the target C4. However, this is because the position coordinates of the pair of reference marks C2m on the calibration board C2 acquired in step ST32 in the coordinate system unique to the electronic component mounting apparatus 12 and the calibration determined with reference to the pair of reference marks C2m. It can be calculated from the data of the position coordinates of each target point C2H in the coordinate system (εη coordinate system shown in FIG. 7) unique to the substrate C2. Note that the position coordinate data in the coordinate system unique to the calibration board C2 of each calibration point C2H, that is, the coordinate data of the position where the target C4 is to be mounted is written in the storage device 41 of the control device 40, for example. Like that.

  After calculating the positional deviation of the calibration substrate C2, the control device 40 moves the mounting head 25 and supplies the parts feeder 23 (denoted by reference numeral 23C in FIG. 6) prepared for supplying the specimen C4. The target C4 to be picked up is picked up by each suction nozzle 27 of each mounting head 25 (step ST33). Then, each mounting head 25 is moved so that the target C4 picked up by each suction nozzle 27 passes over one of the two component cameras 31, and the component C31 is imaged of the target C4. Then, the image is recognized (step ST34), and the suction displacement of the target C4 with respect to each suction nozzle 27 is detected (step ST35), and then the target C4 is placed at the position of the reference point C2H on the calibration substrate C2 (standard mark). It is mounted (with the position of the point C2H as a target) (step ST36). At this time, the control device 40 detects the positional deviation of the calibration substrate C2 detected in step ST32, the adsorption deviation of the target C4 detected in step ST35, and the head moving mechanism 24 (forward head movement) that moves the mounting head 25. The final stop position of the mounting head 25 by the head moving mechanism 24 is calculated based on the control data of the mechanism 24F or the rear head moving mechanism 24R), and the mounting head 25 is moved to the calculated stop position by the head moving mechanism 24. . Thus, the position of the suction nozzle 27 is corrected and the target C4 should be positioned at the position of the target C2H. However, in actuality, the above-described positional deviation occurs.

  After mounting the target C4 on the calibration substrate C2, the control device 40 mounts all the targets C4 to be mounted on the electronic component mounting apparatus 12 (to all areas allocated on the calibration substrate C2). It is determined whether or not the mounting of the target C4 is completed (step ST37). When the mounting of all the targets C4 to be mounted on the calibration substrate C2 has not been completed, the process returns to step ST33, and when the mounting of all the targets C4 to be mounted on the calibration substrate C2 has been completed. Then, the mounting operation of the specimen C4 on the calibration substrate C2 is completed. When the mounting operation of the specimen C4 on the calibration substrate C2 is completed, several to several tens of specimens are placed on the calibration board C2 by the plurality of suction nozzles 27 included in the first electronic component mounting apparatus 12a. C4 is mounted on the entire area of the calibration substrate C2 on an average (with no bias).

  When the mounting process of the specimen C4 by the one electronic component mounting apparatus 12a on the calibration board C2 is completed as described above, the calibration board C2 is unloaded from the first electronic component mounting apparatus 12a (FIG. 8). Step ST13 shown in the flowchart, and then the calibration board C2 is carried in by the second electronic component mounting apparatus 12b (step ST14), and then similar to the mounting of the target C4 by the first electronic component mounting apparatus 12a described above. In this manner, the specimen C4 is mounted on the calibration substrate C2 by the second electronic component mounting apparatus 12b (step ST15). When the mounting of the specimen C4 by the second electronic component mounting apparatus 12b is completed, the calibration board C2 is unloaded from the second electronic component mounting apparatus 12b (step ST16), and then the third electronic component mounting is performed. After carrying in the calibration substrate C2 by the apparatus 12c (step ST17), the third electronic component mounting is performed in the same manner as the mounting of the target C4 on the calibration substrate C2 by the first electronic component mounting apparatus 12a described above. The target C4 is mounted by the device 12c (step ST18).

  When the target C4 is mounted on the calibration substrate C2 by the third electronic component mounting apparatus 12c, the control device 40 of the third electronic component mounting apparatus 12c includes two substrates included in the third electronic component mounting apparatus 12 The calibration substrate C2 is imaged by one of the cameras 30 (step ST19). In the imaging of the calibration substrate C2, an area including each reference point C2H on the calibration substrate C2 is imaged.

  When the control device 40 of the third electronic component mounting apparatus 12c images the calibration substrate C2, based on the obtained image of the calibration substrate C2, the position of the reference point C2H on the calibration substrate C2; A positional deviation amount from the actual mounting position (center position of the target C4) of each target C4 mounted with the target C2H as a target is obtained, and the position is determined for each head moving mechanism 24 involved in mounting the target C4. The deviation amount is divided into groups, statistical processing is performed for each group, and the calibration value of the control data for each head moving mechanism 24 is calculated. Specifically, the average value of the positional deviation amounts in the group is adopted as the calibration value. The control device 40 stores the calculated calibration value in the storage device 41, and displays the calibration value in association with the head moving mechanism 24 on the display device 50 (FIG. 4) connected to the control device 40 (step ST20).

  After calculating and displaying the calibration value in step ST20, the control device 40 of the third electronic component mounting apparatus 12c carries out the calibration substrate C2 (step ST21), thereby obtaining the calibration value of the control data. Ends.

  The calibration values for each electronic component mounting apparatus 12 obtained in this way are stored in the storage device 41 of the control device 40 of the corresponding electronic component mounting apparatus 12, whereby the control data of each head moving mechanism 24 is calibrated. Made. The storage of the calibration value in the storage device 41 may be automatically performed via a communication unit connected to each electronic component mounting device 12 or may be manually input by the operator from each electronic component mounting device 12. You may make it do.

  Here, the process of step ST19 and the process of step ST20 are not performed by the first electronic component mounting apparatus 12a and the second electronic component mounting apparatus 12b, but only by the third electronic component mounting apparatus 12c. However, the content of the process of step ST19 and the process of step ST20 may be described only in the calibration value acquisition program PG2 stored in the third electronic component mounting apparatus 12c. Both the component mounting apparatus 12 stores a common calibration value acquisition program PG2 in which the contents of the process of step ST19 and the process of step ST20 are described, but the first electronic component mounting apparatus 12a and the second electronic component mounting are stored. The apparatus 12b does not execute the process of step ST19 and the process of step ST20 (or only the third electronic component mounting apparatus 12c). Step ST19 steps to the execution of step and step ST20) may be of so that changing the execution pattern of the calibration value acquisition program PG2 as.

  As described above, the electronic component mounting line 1 in the present embodiment carries in and positions the substrate 2 sent from the upstream process side, and the electronic component 4 picked up by the mounting head 25 is based on the control data. The electronic component mounting apparatus 12 includes a plurality (three in this case) of electronic component mounting apparatuses 12 for performing an electronic component mounting operation for unloading the substrate 2 to the downstream process side after mounting on the substrate 2. The calibration value acquisition method in the line 1 includes a plurality of calibration points C2H on the calibration substrate C2 in order from the electronic component mounting apparatus 12 on the upstream process side to the electronic component mounting apparatus 12 on the downstream process side. A target mounting step (step ST12, step ST15 and step ST18) for mounting each target C4, mounting a plurality of electronic components on the electronic component mounting line 1 A calibration substrate imaging step (for imaging the calibration substrate C2 on which the target C4 has been mounted) using a camera (substrate camera 30 provided in the third electronic component mounting apparatus 12c) located on the downstream process side of the device 12 Based on the image of the calibration substrate C2 obtained in step ST19) and the calibration substrate imaging step, the position of the target C2H on the calibration substrate C2 and the actual of each target C4 mounted with the target C2H as a target. This includes a calibration value calculation step (step ST20) for calculating a calibration value of the control data of each electronic component mounting apparatus 12 that has performed the target mounting step from the positional relationship with the mounting position.

  In addition, the electronic component mounting method in the electronic component mounting line 1 according to the present embodiment includes each step of the calibration value acquisition method (a specimen mounting step, a calibration board imaging step, and a calibration value calculation step), and calculates a calibration value. The calibration value calculated in the process is set in the corresponding electronic component mounting apparatus 12 and the electronic component mounting operation (step ST1 to step ST8) by the electronic component mounting apparatus 12 is performed on the electronic component mounting line 1 to mount the electronic component 4 on the board 2. Is supposed to be installed.

  In the calibration value acquisition method (electronic component mounting method) in the present embodiment, each electronic component mounting apparatus 12 constituting the electronic component mounting line 1 performs the electronic component mounting work (step ST1 to step ST8). After the calibration board C2 is inserted into the electronic component mounting line 1 and each electronic component mounting apparatus 12 is loaded with a plurality of specimens C4 on the calibration board C2, the three electronic component mounting apparatuses 12 are connected. The calibration substrate C2 in which the mounting of the target C4 by all the electronic component mounting apparatuses 12 constituting the electronic component mounting line 1 is completed by the substrate camera 30 positioned on the downstream process side (the substrate camera 30 positioned on the most downstream process side). Based on the image of the calibration substrate C2 obtained by this imaging, the position of the reference point C2H on the calibration substrate C2 and the reference point C2H are mounted as targets. Calibration of control data of each electronic component mounting apparatus 12 constituting the electronic component mounting line 1 from the positional relationship between the actual mounting position of each target C4 and the target mounting position of each target C4 with reference to the calibration substrate C2. The value is acquired, and the calibration board C2 taken out from each electronic component mounting apparatus 12 (the target C4 is mounted) is installed and removed from each electronic component mounting apparatus 12 as in the prior art. Since it is not necessary to repeatedly perform installation and removal of the calibration board C2) on the inspection apparatus, the calibration values of the electronic component mounting apparatuses 12 constituting the electronic component mounting line 1 can be obtained easily and in a short time. Can do.

  In the above-described embodiment, an example in which the board camera 30 of the electronic component mounting apparatus 12 is used as a camera located on the downstream process side of the electronic component mounting apparatus 12 is described. As a camera located on the downstream process side, a camera of an inspection apparatus that inspects the mounting state of the electronic component 4 on the substrate 2 may be used.

  Provided are a calibration value acquisition method in an electronic component mounting line and an electronic component mounting method by an electronic component mounting line, which can easily and quickly acquire a calibration value of each electronic component mounting apparatus constituting the electronic component mounting line. .

DESCRIPTION OF SYMBOLS 1 Electronic component mounting line 2 Board | substrate 4 Electronic component 12 Electronic component mounting apparatus 25 Mounting head 30 Board | substrate camera (camera)
C2 Calibration board C2H Mark C4 Target

Claims (2)

After loading and positioning the board sent from the upstream process side and mounting the electronic component picked up by the mounting head on the board based on the control data, the electronic component mounting work for unloading the board to the downstream process side is performed. A calibration value acquisition method in an electronic component mounting line configured to include a plurality of electronic component mounting devices to perform,
A target mounting process for mounting a plurality of targets on a plurality of target points on a calibration board in the order of an electronic component mounting apparatus on the upstream process side of the electronic component mounting line and an electronic component mounting apparatus on the downstream process side. When,
A calibration board imaging step for imaging the calibration board after the mounting of the target using a camera located on the downstream side of the plurality of electronic component mounting apparatuses in the electronic component mounting line;
Based on the image of the calibration substrate obtained in the calibration substrate imaging step, the position of the target on the calibration substrate and the actual mounting position of each target mounted with the target as a target; And a calibration value calculation step of calculating a calibration value of control data of each electronic component mounting apparatus that has performed the target mounting step based on the positional relationship between the electronic component mounting line and the electronic component mounting line. After loading and positioning the board sent from the upstream process side and mounting the electronic component picked up by the mounting head on the board based on the control data, the electronic component mounting work for unloading the board to the downstream process side is performed. An electronic component mounting method by an electronic component mounting line configured to include a plurality of electronic component mounting apparatuses to be performed,
A target mounting process for mounting a plurality of targets on a plurality of target points on a calibration board in the order of an electronic component mounting apparatus on the upstream process side of the electronic component mounting line and an electronic component mounting apparatus on the downstream process side. When,
A calibration board imaging step for imaging the calibration board after the mounting of the target using a camera located on the downstream side of the plurality of electronic component mounting apparatuses in the electronic component mounting line;
Based on the image of the calibration substrate obtained in the calibration substrate imaging step, the position of the target on the calibration substrate and the actual mounting position of each target mounted with the target as a target; A calibration value calculation step of calculating a calibration value of control data of each electronic component mounting apparatus that has performed the target mounting step from the positional relationship of,
The calibration value calculated in the calibration value calculation step is set in the corresponding electronic component mounting apparatus, and the electronic component mounting operation is performed by the electronic component mounting apparatus in the electronic component mounting line to mount the electronic component on the substrate. An electronic component mounting method using an electronic component mounting line.

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