CN109196971B

CN109196971B - Component mounting system

Info

Publication number: CN109196971B
Application number: CN201680086241.XA
Authority: CN
Inventors: 鬼头秀一郎; 杉山健二
Original assignee: Fuji Corp
Current assignee: Fuji Corp
Priority date: 2016-06-08
Filing date: 2016-06-08
Publication date: 2020-10-20
Anticipated expiration: 2036-06-08
Also published as: CN109196971A; JPWO2017212566A1; JP6807386B2; WO2017212566A1

Abstract

A component mounting system (1) is provided with: an electronic component mounting device (10), a control device (100), an image processing device (110), a storage device (115), and a display (120). An electronic component mounting device (10) is provided with: a conveying device (22), a moving device (24), a mounting head (26), a feeding device (28), and a component camera (90). During component switching in which an electronic component is changed from a first component to a second component, the supplied electronic component is held by a mounting head (26), and the held electronic component is imaged by a component camera (90). The image processing device (110) performs image processing on the captured image data of the electronic component to determine the position of the electronic component and whether the electronic component is good or not (S6). The controller (102) adjusts the processing content of the image processing in the first processing content data corresponding to the first element, generates common processing content data (S9), and suggests image processing of the common processing content data in the subsequent production (S26).

Description

Component mounting system

Technical Field

The present invention relates to a component mounting system that mounts a component picked up by a pickup nozzle on a substrate, and more particularly to a component mounting system that can determine whether the position of the component or the like is good or not using an image.

Background

Conventionally, as a facility for producing a substrate on which a plurality of components are mounted, a substrate production line is generally constructed by connecting a screen printing apparatus, a component mounting apparatus, a reflow soldering apparatus, and the like by a conveying apparatus. In a component mounting apparatus or the like constituting a substrate production line, a component is picked up by a pickup nozzle, and the component is mounted to a predetermined position on a substrate.

In order to mount a component at a predetermined position on a substrate with high accuracy, it is important to determine the position of the component picked up by a pickup nozzle and whether the component is good or not, and therefore in a component mounting apparatus or the like, the determination is performed based on image data obtained by imaging the component picked up by the pickup nozzle.

As an invention related to such a technique, an invention described in patent document 1 is known. The component mounting machine described in patent document 1 includes: the component mounting apparatus includes a component mounting head, a component transfer device, and an imaging monitoring device, and is configured to mount a component supplied from the component supply device onto a substrate transported to a predetermined position by the component transfer device by the component mounting head.

In patent document 1, an imaging monitoring device acquires image data by imaging a state in which a suction nozzle in a component mounting head sucks a component, and determines whether the component sucking state of the suction nozzle and the component are good or not. The imaging monitoring device of patent document 1 performs predetermined image processing on the image data to improve the accuracy of determination as to whether or not the component is sucked by the nozzle and whether or not the component is good.

Prior art documents

Patent document 1: japanese laid-open patent publication No. 2012 and 169383

Disclosure of Invention

Problems to be solved by the invention

Here, if the elements mounted on the substrate are elements of the same specification (for example, the same resistance value, capacitance, basic shape, and the like), the elements satisfy the requirements as the substrate. Therefore, in the production operation of the substrate, although the components have the same specification, the components may be changed to components of different component suppliers.

In this case, since the specification is the same, the technical conditions such as the resistance value and the basic shape are the same before and after the change of the element, but it is assumed that the details regarding the color of the body of the element, the width of the lead, and the like are different before and after the change of the element. Further, the difference in detail before and after the change of the component affects the result of the image processing, and there is a possibility that the accuracy of determination regarding the component suction state of the nozzle and the component quality may be lowered. In addition, since the reduction in the determination accuracy also leads to a reduction in the mounting accuracy of the element on the substrate, it is considered that the productivity of the substrate is also greatly affected.

The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a component mounting system capable of determining whether or not the position of a component or the like is good by using an image when mounting the component picked up by a pickup nozzle on a substrate, and capable of maintaining the determination accuracy by performing appropriate image processing even when there is a change in the component.

Means for solving the problems

In view of the above-described problems, the component mounting system according to the technique disclosed in the present application is characterized in that a component supply unit supplies a component to be mounted on a predetermined position of a substrate; a pickup nozzle for picking up the component supplied from the component supply part; an imaging unit that images the component picked up by the pickup nozzle to obtain image data; a storage unit that stores image data captured by the imaging unit and processing content data indicating content of image processing to be performed on the image data; an image processing execution unit that performs image processing on the image data based on the processing content data; and a determination unit configured to determine a position of the component and whether the component is good or not based on image data on which image processing has been performed by the image processing execution unit, wherein the component supply unit supplies a second component having the same specification as a predetermined first component and different details of appearance from the first component, and wherein the storage unit stores first processing content data which is applied to image data obtained by imaging the first component and which indicates content of image processing for performing the image processing on the image data so that the determination unit can perform the determination, and wherein the component mounting system includes: a processing content adjustment unit configured to generate common processing content data by adjusting content of image processing in the first processing content data, the common processing content data being applied to image data obtained by imaging the first element and image data obtained by imaging the second element in common and indicating content of image processing performed on the image data so that the determination unit can perform determination; and a presentation unit configured to present a content of the image processing performed by the image processing execution unit on the image data obtained by imaging the first element and the image data obtained by imaging the second element as a content of the image processing based on the common processing content data.

Effects of the invention

According to the technology disclosed in the present application, the technology comprises: the component supply unit, the pickup nozzle, the imaging unit, the storage unit, the image processing execution unit, and the determination unit can image the component picked up by the pickup nozzle, perform image processing related to processing content data on the image data, and determine the position of the component and the quality of the component. When a predetermined first element is subsequently supplied to a second element having the same specification as the first element and different details of appearance, the processing content adjustment unit adjusts the content of image processing in the first processing content data to generate common processing content data, and thus it is possible to perform appropriate image processing in common to image data obtained by imaging the first element and image data obtained by imaging the second element, and thereby it is possible to accurately determine the position of the element and the quality of the element with respect to both the first element and the second element. Further, since the presenting unit presents that the image processing of the image data obtained by imaging the first element and the image data obtained by imaging the second element is changed to the image processing based on the common processing content data, it is possible to prevent the component mounting work from being performed in an unexpected situation.

Drawings

Fig. 1 is a perspective view of the component mounting apparatus of the present embodiment.

Fig. 2 is a block diagram showing a control system of the component mounting system according to the present embodiment.

Fig. 3 is an example of the storage contents of the storage device according to the present embodiment.

Fig. 4 is a flowchart of a component mounting processing program according to the present embodiment.

Fig. 5 is a flowchart of an image processing content adjustment program according to the present embodiment.

Detailed Description

Hereinafter, an embodiment of embodying the component mounting system of the present invention as the component mounting system 1 having the electronic component mounting apparatus 10 will be described with reference to the drawings. Fig. 1 is a perspective view of an electronic component mounting apparatus 10 according to the present embodiment.

< Structure of electronic component mounting apparatus >

The electronic component mounting apparatus 10 of the present embodiment is an apparatus for mounting an electronic component on a circuit board. The electronic component mounting apparatus 10 has a system base 14 and 2 mounting machines 16 arranged in an array on the system base 14. In the following description, the arrangement direction of the mounting machines 16 is referred to as an X-axis direction, and a horizontal direction perpendicular to the X-axis direction is referred to as a Y-axis direction.

Each mounting machine 16 mainly includes a mounting machine body 20, a conveying device 22, a head moving device 24 (hereinafter, may be simply referred to as "moving device 24"), a mounting head 26, a feeding device 28, a component camera 90, and the like. The mounting machine body 20 includes a frame portion 32 and a beam portion 34 extending from the frame portion 32.

The conveyance device 22 includes two conveyance devices (conveyance device 40 and conveyance device 42). The conveying device 40 and the conveying device 42 are disposed in parallel with each other on the frame portion 32 so as to extend in the X-axis direction. The

conveying devices

40 and 42 convey the circuit boards respectively supported by the electromagnetic motors 46 (see fig. 2) in the X-axis direction. The circuit board is fixedly held at a predetermined position by a board holding device 48 (see fig. 2).

The moving device 24 is an XY robot type moving device, and includes an electromagnetic motor 52 (see fig. 2) that slides the slider 50 in the X-axis direction and an electromagnetic motor 54 (see fig. 2) that slides the slider 50 in the Y-axis direction. A mounting head 26 is attached to the slider 50, and the mounting head 26 is moved to an arbitrary position on the frame portion 32 by the operation of an electromagnetic motor 52 and an electromagnetic motor 54.

The mounting head 26 mounts electronic components to the circuit substrate. The mounting head 26 has a suction nozzle 62 provided on a lower end surface. The suction nozzle 62 communicates with a positive/negative pressure supply device 66 (see fig. 2) via a negative pressure air passage and a positive pressure air passage. The suction nozzle 62 sucks and holds the electronic component by negative pressure, and separates the held electronic component by positive pressure. The mounting head 26 also has a nozzle lifting device 65 (see fig. 2) for lifting and lowering the nozzles 62. The mounting head 26 changes the position of the held electronic component in the vertical direction by the nozzle lifting and lowering device 65.

The supply device 28 is a feeder type supply device, and is disposed at one end of the frame portion 32 in the Y axis direction. The supply device 28 has a tape feeder 81. The tape feeder 81 stores a taped component, which is formed by knitting electronic components, in a wound state. The tape feeder 81 feeds out the tape-shaped components by a feeding device 82 (see fig. 2). Thereby, the feeder type supply device 28 supplies the electronic components at the supply position by the feeding out of the taped components. The tape feeder 81 is detachable from the frame portion 32, and can be adapted to replacement of electronic components, and can add electronic components by splicing tape-like components.

The mounter 16 includes a component camera 90 and a mark camera 91 (see fig. 2). As shown in fig. 1, the component camera 90 is disposed between the transport device 22 and the supply device 28 on the frame portion 32 in an upward state. Thereby, the component camera 90 can photograph the component sucked and held by the suction nozzle 62 of the mounting head 26. The mark camera 91 is attached to the slider 50 in a downward state, and moves in the X direction, the Y direction, and the Z direction together with the mounting head 26. Thereby, the marker camera 91 can photograph an arbitrary position on the frame section 32.

As shown in fig. 2, the mounting machine 16 includes a control device 100. The control device 100 includes a controller 102, and the controller 102 includes a CPU, a ROM, a RAM, and the like, and mainly includes a computer. The controller 102 is connected to a plurality of drive circuits 106, and the plurality of drive circuits 106 are connected to the electromagnetic motor 46, the electromagnetic motor 52, the electromagnetic motor 54, the substrate holding device 48, the nozzle elevating device 65, the positive/negative pressure supply device 66, and the delivery device 82. Thus, the operations of the transport apparatus 22, the moving apparatus 24, and the like are controlled by the controller 102.

The controller 102 is connected to the image processing apparatus 110, the storage apparatus 115, and the display 120. The image processing apparatus 110 performs image processing on the image data obtained by the part camera 90 and the mark camera 91, and the controller 102 acquires various information from the image data. The display 120 is a display device capable of displaying various information, and displays various information related to the component mounting system 1, such as the operating state of the component mounting system 1 and the occurrence of an error, based on a control signal from the controller 102.

The storage device 115 is a storage device configured by an HDD or the like, and stores various information necessary for executing an installation operation, such as image data obtained by the part camera 90 and the mark camera 91 in a predetermined situation, and processing content data (see fig. 3) indicating the content of image processing on an image captured by the part camera 90. Therefore, the controller 102 can acquire information necessary for the mounting work from the storage device 115. The controller 102 can also acquire information (for example, processing content data) necessary for image processing of the image processing apparatus 110 from the storage device 115 and input the information to the image processing apparatus 110.

< mounting work by mounting machine >

In the mounting machine 16, with the above configuration, the mounting operation of the electronic component can be performed on the circuit board held by the transport device 22 by the mounting head 26. Specifically, the controller 102 executes a component mounting processing program (see fig. 4) described later, thereby enabling the component mounting system 1 to perform an operation of picking up an electronic component, a determination regarding the picked-up component, and an operation of mounting the electronic component on a circuit board.

In accordance with instructions of the controller 102, the circuit substrate is conveyed to the working position where it is fixedly held by the substrate holding device 48. The tape feeder 81 sends out taped components in accordance with an instruction from the controller 102, and supplies electronic components at a supply position. The mounting head 26 moves upward from the supply position of the electronic component in response to a command from the controller 102, and holds the electronic component by suction by the suction nozzle 62.

Next, the mounting head 26 moves to a predetermined position above the part camera 90 according to an instruction of the controller 102. The component camera 90 photographs the electronic component sucked and held by the mounting head 26 in accordance with an instruction of the controller 102. The captured image data is stored in the storage device 115 according to an instruction from the controller 102. The image processing apparatus 110 performs image processing based on the processing content data (see fig. 3) on the image data in accordance with an instruction from the controller 102. The controller 102 determines the posture and position of the electronic component held by the mounting head 26 and whether the electronic component is good or not based on the image data subjected to the image processing by the image processing device 110.

Then, the mounting head 26 moves from above the component camera 90 to above the circuit board held by the board holding device 48 in accordance with the instruction of the controller 102, and mounts the electronic component whose determination result is good to a predetermined position on the circuit board. In addition, the mounting head 26 discards the electronic component whose determination result is defective, in accordance with an instruction of the controller 102.

< storage contents of storage device >

Next, the contents stored in the storage device 115 in the component mounting system 1 according to the present embodiment will be described with reference to fig. 3. As described above, the storage device 115 is connected to the controller 102 of the control device 100 and stores various data. Specifically, the storage device 115 stores image data obtained by imaging the electronic component held by the mounting head 26 with the component camera 90 and processing content data indicating the content of image processing performed by the image processing device 110.

The image data is image data obtained by imaging the electronic component held by the mounting head 26 by the component camera 90, and is image data imaged during the component switching period. Here, the element switching period is a period before and after switching an element mounted on the circuit board from a predetermined first element to a second element which is the same type as the first element and which indicates the same technical condition. Therefore, the image data stored in the storage device 115 includes both the image data obtained by imaging the first element and the image data obtained by imaging the second element.

The processing content data indicates the content of image processing performed on image data obtained by imaging the electronic component, and a reference for determining the position and the quality of the component with respect to the mounting head 26, and is associated with each type of component such as a connector, a chip, and an IC. Specifically, the processing content data includes element shape data, algorithm pattern data, tolerance value data, template (search line) data for rough positioning, and the like for each type of element.

The component shape data is data indicating the external shape of the component, and is used as a reference for determining the position and the quality of the component with respect to the mounting head 26. The algorithm pattern data defines a combination and a sequence of image processing algorithms to be executed as preprocessing for determining the position and the quality of the component with respect to the mounting head 26. Since the combination and order of the optimal image processing algorithms differ according to the color tone, contrast, and the like of the elements in the image data, a plurality of algorithm modes are defined for one element type. The tolerance value data specifies the tolerance for determining the position and the quality of the component with respect to the mounting head 26 using the component shape data.

< processing contents of component mounting processing program >

Next, the processing content of the component mounting process performed by the controller 102 will be described with reference to flowcharts shown in fig. 4 and 5. In the following description, the first component is an electronic component supplied from the supplier (a) under a predetermined technical condition, and the second component is an electronic component supplied from the supplier (B) under the same technical condition as the first component. The second element differs in the details of its appearance (e.g., the color of the body or the length, spacing, etc. of the leads) when compared to the first element.

In the supply device 28, the taped component holding the first component is attached to the tape feeder 81, and the taped component holding the second component is added by splicing the taped components. The storage device 115 stores first processing content data including a pattern of an appropriate image processing algorithm for the first component image data as processing content data for image data (hereinafter, first component image data) obtained by imaging the first component with the part camera 90.

As shown in fig. 4, in step (hereinafter, abbreviated as "S") 1, the controller 102 starts a production cycle after initial processing such as conveyance and positioning of the circuit substrate by the conveyance device 22, position confirmation of the circuit substrate, and reading confirmation of the substrate ID is performed (S2 to S11).

When moving to S2, the controller 102 performs control related to the pickup of the component by the mounting head 26. Specifically, the controller 102 outputs a control signal to the tape feeder 81 of the supply device 28 to feed out the taped component and supply the electronic component at the supply position. The controller 102 outputs a control signal to the transfer device 24 and the mounting head 26 to move the mounting head 26 above the supply position of the electronic component, and the electronic component is sucked and held by the suction nozzle 62.

When moving to S3, the controller 102 performs control related to imaging of the electronic component held by the mounting head 26. Specifically, the controller 102 outputs a control signal to the transfer device 24 and the mounting head 26 to move the mounting head 26 holding the electronic component above the component camera 90. The controller 102 controls the component camera 90 via the image processing device 110 to capture an image of the electronic component held by the mounting head 26.

In S4, the controller 102 determines whether the current mounting work of the electronic component is within the component switching period. As described above, the element switching period is a period before and after the elements mounted on the circuit board are switched from the predetermined first element to the second element, and specifically, a period from the time when the remaining number of first elements in the lot to which the first element relates becomes the predetermined number (for example, five) to the time when the number of second elements is switched to the lot to which the second element relates and the predetermined number (for example, five) of second elements are supplied.

In the present embodiment, the total number of electronic components constituting a batch (i.e., the total number of electronic components held by the taped components) is known, and the number of electronic components used for mounting in the electronic component mounting apparatus 10 can be grasped by counting the number of electronic components for each mounting operation. Therefore, the controller 102 can determine whether or not the current mounting work of the electronic component is within the component switching period based on the information. If it is within the element switching period (yes in S4), the controller 102 moves the process to S5. On the other hand, if the time is not within the element switching period (S4: no), the controller 102 moves the process to S6.

In S5, the controller 102 executes an image saving process to save the first element image data and the second element image data captured during the element switching period in the storage device 115. That is, since the first component image data and the second component image data captured by the component camera 90 are stored only before and after the time when the component lot or the component supplier is changed, it is possible to store image data with a large change in the appearance of the component in advance in a small storage capacity without processing a large amount of image data.

In S6, the controller 102 acquires the processing content data of the electronic component from the storage device 115 and outputs a control command to the image processing device 110. The image processing apparatus 110 performs image processing on the image data based on the processing content data. For example, with respect to the first element image data, image processing is performed in an algorithm mode of first processing content data. The image processing apparatus 110 corrects the amount of deviation between the suction nozzle 62 and the center of the component, confirms the presence or absence of rotation or inclination of the component with respect to the suction nozzle 62, and confirms the external shape of the component to be sucked. Thus, when the component suction state of the suction nozzle 62 is abnormal or the component shape itself is abnormal, it is determined that the image processing is erroneous.

In S7, the controller 102 determines whether or not the electronic component held by the mounting head 26 has been switched from the first component to the second component based on information such as the total number of electronic components constituting the lot and the number of electronic components used for the mounting job in the electronic component mounting device 10. In the case where the switch to the second element has been made (S7: YES), the controller 102 moves the process to S8. On the other hand, if the first element is not switched to the second element but remains switched (no in S7), the controller 102 moves the process to S11.

When moving to S8, the controller 102 determines whether or not the result of performing the image processing based on the first processing content data on the second element image data is an image processing error, based on the result of the image processing of S6. In the case of an image processing error (S8: YES), the controller 102 shifts the process to S9. On the other hand, in the case where it is not an image processing error (S8: NO), the controller 102 obtains an appropriate determination result even if image processing based on the first processing content data is performed on the second element image, and therefore moves the process to S11.

In S9, the controller 102 executes the image processing content adjustment program (see fig. 5) because an appropriate determination result cannot be obtained even if the image processing based on the first processing content data is performed on the second component image. The controller 102 adjusts the first processing content data in accordance with the image processing content adjustment program, thereby generating processing content data (i.e., either common processing content data or second processing content data, which will be described later) that enables at least the second element image to be subjected to appropriate image processing.

< processing content of image processing content adjustment program >

Next, the processing content of the image processing content adjustment program executed in S9 will be described in detail with reference to fig. 5. As shown in fig. 5, when moving to S9 to start executing the image processing content adjustment program, the controller 102 automatically adjusts one item (e.g., algorithm mode or tolerance value) constituting the first processing content data to avoid generating an image processing error for the second element image (S21).

For example, when the component type of the first component is connector (white) and the algorithm mode of the first processed content data is "algorithm mode (a)", in S21, the controller 102 automatically adjusts the image processing so as to avoid an image processing error with respect to the connector (white), that is, the second component image, as in "algorithm mode (B)" "algorithm mode (C)" ….

In S22, the controller 102 executes image processing for the first element image data in accordance with the processing content data automatically adjusted in S21. The content of the image processing at this time is automatically adjusted in S21, and therefore is different from the processing content of the first processing content data.

In S23, the controller 102 determines whether or not the result of performing the image processing based on the automatically adjusted processing content data on the first element image data is an image processing error based on the result of the image processing in S22. If it is an image processing error (S23: YES), the controller 102 shifts the process to S24. On the other hand, in the case where it is not an image processing error (S23: NO), the controller 102 shifts the process to S26.

When the process proceeds to S24, the controller 102 determines whether or not there is another adjustment item that is not the subject of the automatic adjustment of S22 among the items constituting the processed content data. If there are other adjustment items (yes in S24), the controller 102 returns the process to S22 to automatically adjust S22 for the other adjustment items. On the other hand, in the case where there are no other adjustment items (S24: NO), the controller 102 moves the process to S25.

In S25, the controller 102 suggests a multi-vendor function via the display 120 or the like based on the processing results of S21 to S24. The multi-vendor function is a setting for generating second processing content data indicating the content of second-component-specific image processing, which is performed by a different component vendor, although the second processing content data is a component of the same kind and under the same technical conditions, separately from the first processing content data for the first component image, and performing image processing based on the second processing content data for the second component image.

In the case of moving to S25, the processing content data is automatically adjusted for each item constituting the processing content data so as to avoid an image processing error of the second component image, but if image processing based on the same processing content data is performed on the first component image, an image processing error state occurs. In other words, the processing content data (i.e., the second processing content data) unique to the second element image is generated by performing automatic adjustment of each item based on the first processing content data.

Therefore, in this S25, the controller 102 displays a message on the display 120 asking whether or not to set a setting for executing image processing based on second processing content data different from the first processing content data for the second element. Then, the controller 102 ends the image processing content adjustment program, and moves the process to S10 of the component mounting processing program (see fig. 4).

When the process proceeds to S26, the controller 102 suggests image processing for the processing content common to the first element and the second element via the display 120 or the like based on the processing results of S21 to S24. Since the first component and the second component are components of the same kind and the same technical conditions but are different only in component suppliers, a common processing content may be set for both components. If common process content data indicating common process contents can be set for both, even if switching of the component suppliers of the first component and the second component occurs thereafter, the processing can be quickly handled, and this is useful in terms of accuracy of determination of the first component and the second component and productivity of the circuit board.

When the process proceeds to S26, the process content data is automatically adjusted so that image processing errors of the second component image do not occur in each item constituting the process content data, and even if image processing based on the same process content data is performed on the first component image, no image processing error occurs (S23: no). In other words, the processing content data (i.e., common processing content data) that can be used for both the first component image and the second component image is generated by performing automatic adjustment of each item based on the first processing content data.

Therefore, in S26, the controller 102 displays a message asking whether or not to set the first element and the second element to execute the image processing based on the common processing content data in which the first processing content data is adjusted, on the display 120. Then, the controller 102 ends the image processing content adjustment program, and moves the process to S10 of the component mounting processing program (see fig. 4).

As shown in fig. 4, when moving to S10, the controller 102 determines whether the processing content suggested in S25 or S26 is approved. The judgment processing of S10 is judged by whether or not an approval operation is performed for the devices constituting the component mounting system 1. In the case where the advice is approved (S10: YES), the controller 102 moves the process to S11. In the case where the suggestion is not approved (S10: no), the controller 102 waits for processing while keeping the mounting operation of the mounting head 26 for the component stopped.

In S11, the controller 102 outputs a control signal to the transfer device 24 and the mounting head 26 via the drive circuit 106 in order to mount the electronic component held by the mounting head 26 at the mounting position on the circuit board. Specifically, the controller 102 outputs a control signal based on the mounting position data stored in the RAM to the moving device 24, thereby moving the mounting head 26 above the mounting position on the circuit board. Then, the controller 102 outputs a control signal to the mounting head 26 moved to the mounting position, thereby lowering the electronic component and mounting the electronic component at the mounting position on the circuit board.

When moving to S12, the controller 102 repeats the production cycle in the case where all the components are not mounted. In the case where all the components are mounted, the controller 102 ends the production cycle and ends the component mounting process program.

As described above, the component mounting system 1 of the present embodiment includes: electronic component mounting apparatus 10, image processing apparatus 110, storage apparatus 115, and display 120. In the electronic component mounting apparatus 10, each mounting machine 16 includes: a conveying device 22, a moving device 24, a mounting head 26, a feeding device 28, and a component camera 90. The mounter 16 holds the electronic components supplied from the supply device 28 by the mounting head 26, and images the held electronic components by the component camera 90. Then, the mounter 16 holds and moves the electronic component by the mounting head 26, thereby mounting the electronic component on the circuit board conveyed to a predetermined position by the conveying device 22. Then, the component mounting system 1 performs image processing according to the processing content data by the image processing apparatus 110 on the image data of the electronic component captured by the component camera 90, and determines the position of the electronic component with respect to the mounting head 26 and the quality of the electronic component (S6).

Here, in the production of the circuit board, when a second element having the same specification as the first element and different details of appearance is supplied by the supply device 28 following the predetermined first element, the controller 102 adjusts the processing content of the image processing in the first processing content data corresponding to the first element, generates common processing content data indicating the processing content capable of coping with the image processing of both the first element and the second element (S9), and displays the common processing content data on the display 120 to suggest that the image processing of the common processing content data is performed for the first element and the second element in the subsequent production (S26). By setting the image processing based on the common processing content data, the component mounting system 1 can determine the position of the component and the quality of the component with high accuracy regardless of which of the first component and the second component is. Since the display 120 displays and suggests that the image processing based on the common processing content data be performed, the component mounting system 1 can prevent the mounting work of the components from being performed in an unexpected situation, and as a result, can prevent production defects and the like of the circuit board.

In the component mounting system 1, when the controller 102 cannot adjust the content of the image processing in the first processing content data and generates the common processing content data that can be commonly applied to the first component and the second component (S24: no), the controller automatically adjusts the processing content in the first processing content data and generates the second processing content data that can be applied only to the image data of the second component (S21 to S24). Also, according to this component mounting system 1, in this case, a multi-vendor function of applying image processing of first processing content data to an image of a first component and applying image processing of second processing content data to an image of a second component is suggested via the display 120 (S25). In this case, although the first processing content data and the second processing content data are stored separately in advance, and therefore a storage capacity is required as compared with the case of generating the common processing content data, according to the component mounting system 1, the second component can be subjected to appropriate image processing, and therefore, the second component can be also kept high in the accuracy of determination as to the position of the component and whether the component is good or not. In addition, the component mounting system 1 can suppress a decrease in the productivity of the circuit board by maintaining high accuracy of determination regarding the position of the component and the quality of the component.

In the component mounting system 1, the controller 102 stores the image data captured by the part camera 90 in the storage device 115 during the component switching period (S5), and adjusts the processing content of the first processing content data using the first component image data and the second component image data captured during the component switching period (S9). The first component image data and the second component image data captured during the component switching period are image data in which the change in the appearance of the component is large, and therefore the component mounting system 1 can efficiently adjust the processing content of the first processing content data without processing a large amount of image data.

In the component mounting system 1, when the process proceeds to S10 with the advice message at S25 or S26 displayed on the display 120, the controller 102 waits until the adjustment result (i.e., the advice message) is approved (S10: no), and stops the mounting work of the second component. Therefore, according to the component mounting system 1, the user can confirm whether the adjustment result of the image processing content adjustment (S10) is appropriate, and the intention of the user can be reflected in the subsequent production of the circuit board.

In the above embodiment, the component mounting system 1 and the electronic component mounting apparatus 10 are examples of the component mounting system of the present invention, and the supply apparatus 28 and the tape feeder 81 are examples of the component supply unit of the present invention. The mounting head 26 and the suction nozzle 62 are examples of the pickup nozzle of the present invention, and the component camera 90 is an example of the imaging unit of the present invention. The storage device 115 is an example of the storage unit of the present invention, and the image processing device 110 is an example of the image processing execution unit of the present invention. The control device 100 and the controller 102 are examples of the determination unit, the processing content adjustment unit, and the installation control unit of the present invention, and the display 120 is an example of the presentation unit of the present invention.

The present invention has been described above based on the embodiments, but the present invention is not limited to the above embodiments at all, and various modifications and changes can be made without departing from the scope of the present invention. For example, although the component mounting system 1 is configured by the electronic component mounting apparatus 10, the control apparatus 100, the image processing apparatus 110, the storage apparatus 115, and the display 120 in the above embodiment, the present invention is not limited to this configuration.

For example, the component mounting system 1 can be realized as the electronic component mounting apparatus 10 by incorporating the control apparatus 100, the image processing apparatus 110, the storage apparatus 115, and the display 120 in one electronic component mounting apparatus 10. Further, the component mounting system 1 can be realized by incorporating a part of the image processing apparatus 110, the storage apparatus 115, and the display 120 in the electronic component mounting apparatus 10 and connecting the rest to the electronic component mounting apparatus 10 via a network.

In the above embodiment, the component mounting system 1 has a configuration including one electronic component mounting apparatus 10, one image processing apparatus 110, and one storage apparatus 115, but is not limited to this configuration. The component mounting system 1 may be configured such that a plurality of electronic component mounting apparatuses 10 are connected to the image processing apparatus 110, the storage apparatus 115, and the display 120.

Description of the reference numerals

1 component mounting system

10 electronic component mounting apparatus

16 mounting machine

22 conveying device

24 moving device

26 mounting head

28 supply device

62 suction nozzle

81 belt type feeder

90 parts camera

100 control device

102 controller

110 image processing device

115 storage device

120 display

Claims

1. A component mounting system, comprising:

a component supply unit for supplying components mounted at predetermined positions on the substrate;

a pickup nozzle that picks up the component supplied by the component supply section;

an imaging unit that images the component picked up by the pickup nozzle to obtain image data;

a storage unit that stores image data captured by the imaging unit and processing content data indicating content of image processing to be performed on the image data;

an image processing execution unit that performs image processing on the image data based on the processing content data; and

a determination unit that determines the position of the element and whether the element is good or not based on the image data on which the image processing is performed by the image processing execution unit,

the component supply part supplies a second component having the same specification as a predetermined first component and different details of appearance from the first component, subsequent to the first component,

the storage unit stores first processing content data which is applied to first element image data obtained by imaging the first element and indicates content of image processing for performing determination by the determination unit on the first element image data,

the component mounting system has:

a processing content adjustment unit configured to generate common processing content data by adjusting a content of image processing in the first processing content data, the common processing content data being applied to first component image data obtained by imaging the first component and second component image data obtained by imaging the second component in common and indicating a content of image processing performed on the first component image data and the second component image data so that the determination unit can perform determination; and

and a presentation unit configured to present a content of the image processing performed by the image processing execution unit on the first device image data obtained by imaging the first device and the second device image data obtained by imaging the second device as a content of the image processing based on the common processing content data.

2. The component mounting system according to claim 1,

the processing content adjusting unit generates second processing content data by adjusting the content of image processing in the first processing content data, the second processing content data being applied to second element image data obtained by imaging the second element and indicating the content of image processing performed on the second element image data so that the determining unit can perform determination, when the common processing content data cannot be generated by adjusting the content of image processing in the first processing content data,

the presentation unit presents a change of the content of the image processing performed by the image processing execution unit on the second device image data obtained by capturing the second device to the content of the image processing based on the second processing content data.

3. The component mounting system according to claim 1,

the imaging unit images the first component and the second component picked up by the pickup nozzle to acquire a plurality of image data and stores the plurality of image data in the storage unit during a component switching period from a time when a remaining quantity of components in a lot relating to the first component supplied by the component supply unit reaches a predetermined number to a time when the use is started and the predetermined number of lots relating to the second component is used,

the processing content adjusting unit adjusts the processing content of the first processing content data by using a plurality of image data acquired during the element switching period.

4. The component mounting system according to claim 2,

5. The component mounting system according to any one of claims 1 to 4,

the component mounting system includes a mounting control unit configured to stop a mounting operation of the second component when the presentation unit presents a presentation related to a content of image processing on second component image data obtained by imaging the second component.

6. A component mounting system, comprising:

a storage unit that stores image data captured by the imaging unit and processing content data indicating content of image processing performed on the image data;

the component mounting system has:

a processing content adjusting unit configured to generate second processing content data indicating content of image processing to be performed on the second element image data so that the determining unit can perform determination, the second processing content data being applied to second element image data obtained by imaging the second element, by adjusting content of image processing in the first processing content data; and

and a presenting unit configured to present a change of a content of the image processing performed by the image processing executing unit on the second device image data obtained by capturing the second device to a content of the image processing based on the second processing content data.

7. The component mounting system according to claim 6,

8. Component mounting system according to claim 6 or 7,