JP6587871B2 - Component mounting apparatus and component mounting system - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting system, and more particularly to a component mounting apparatus and a component mounting system that include a mounting unit that mounts a component on a board.

  2. Description of the Related Art Conventionally, a component mounting apparatus including a mounting unit that mounts a component on a board is known (see, for example, Patent Document 1).

  In Patent Document 1, a transfer head (mounting unit) for mounting components on a substrate and a control unit for controlling the lowering operation of the suction nozzle of the transfer head based on the measurement result of the height of solder on the substrate. An electronic component mounting apparatus (component mounting apparatus) is disclosed.

  Conventionally, when a component such as an IC (integrated circuit) chip having a plurality of leads is mounted on a substrate, the solder thickness in a plurality of solder placement areas on the substrate is measured, and the solder thickness is less than a threshold value. In such a case, a technique for discarding the board is known as a component cannot be mounted on the board. In addition, a technique is known in which the height of a plurality of leads of a component is measured, and the component is discarded because the component cannot be mounted on the board even when there is a variation in the height of each lead. .

JP 2000-151196 A

  In the electronic component mounting apparatus (component mounting apparatus) disclosed in Patent Document 1, when the above-described conventional technique is applied, the solder thickness of the board is required when mounting a component having a plurality of leads (connection portions). It is considered that whether or not the component can be mounted on the substrate is determined based on the heights of the plurality of leads of the component. In this case, in order to guarantee the quality of component mounting, it is necessary to strictly set each standard (standard of solder thickness and standard of the height of a plurality of leads of a component) that enables mounting. For this reason, since the number of boards that do not satisfy the solder thickness standard and the number of parts that satisfy the height standard of the leads of the component increase, respectively, the board and components that are determined not to be mountable on the board There is a problem that the amount to be discarded increases.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to increase the number of discarded boards and components when mounting components having a plurality of connecting portions. It is an object of the present invention to provide a component mounting apparatus and a component mounting system that can suppress this.

In order to achieve the above object, a component mounting apparatus according to a first aspect of the present invention includes a mounting portion for mounting a component on a substrate, solder thickness information for a plurality of solder placement regions on the substrate, and a plurality of solder placement regions. A control unit that determines whether or not the component can be mounted on the plurality of solder placement regions of the board based on the connection part height information of the plurality of connection parts of the corresponding component , and the control unit includes solder thickness information and The gap between the solder on the board and the connection part of the corresponding component is calculated based on the connection part height information to determine whether or not the component can be mounted on the plurality of solder placement areas on the board. of if it is not the component mounting of the first mounting points including a solder arrangement region, that is configured to determine a plurality of whether the implementation of parts of the solder arrangement region other mounting points including.

  In the component mounting apparatus according to the first aspect of the present invention, as described above, the solder thickness information of the plurality of solder placement regions of the substrate and the connection portion height of the plurality of connection portions of the component corresponding to the plurality of solder placement regions. Based on the information, a control unit is provided for determining whether or not components can be mounted on a plurality of solder placement regions of the board. Accordingly, it is possible to determine whether or not a component having a plurality of connection portions can be mounted in consideration of the compatibility between the solder thickness in the solder placement region and the height of the corresponding connection portion. For example, whether or not a component having a plurality of connection portions can be mounted can be determined based on the size of a gap corresponding to the unevenness of a plurality of solders on the substrate and the unevenness of a plurality of connection portions of the component. As a result, the individual standards must be stricter than when determining whether or not a component can be mounted on the substrate based on the solder thickness of the substrate and the height of the plurality of connecting portions of the component. Even the quality of component mounting can be ensured. As a result, when mounting a component having a plurality of connection portions, it is possible to suppress an increase in the number of discarded boards and components. Thereby, a yield can be improved. In addition, since it is possible to accurately determine whether or not a component can be mounted on the substrate, it is possible to suppress the occurrence of defective bonding between the connection portion of the component and the solder.

  In the component mounting apparatus according to the first aspect, preferably, the control unit contacts a part of the plurality of connection portions of the component with the corresponding solder based on the solder thickness information and the connection portion height information. In this case, the gap between the other solder of the substrate and the connection part of the corresponding component is calculated, and it is configured to determine whether or not the component can be mounted in a plurality of solder placement regions of the substrate. If comprised in this way, based on the clearance gap between the other solder of a board | substrate and the connection part of a corresponding component when a part of the connection part of a part is made to contact corresponding solder, a plurality Therefore, it is possible to accurately determine whether or not a component having the connection portion can be mounted.

  In this case, preferably, if the calculated gap between the solder on the board and the corresponding connection part of the component is equal to or less than the threshold value for all the connection parts, the component moves to a plurality of solder placement regions on the board. If it is determined that mounting is possible and the calculated gap between the solder on the board and the corresponding connection part of the component is larger than a threshold value for some or all of the connection parts, the component is moved to multiple solder placement areas on the board. It is configured to determine that it cannot be implemented. With this configuration, the component is placed on the plurality of solder placement regions on the substrate only when the calculated gap between the solder on the substrate and the corresponding connection portion of the component is larger than the threshold value for some or all of the connection portions. It is determined that it cannot be implemented. This effectively suppresses the increase in the number of discarded boards and components compared to the case where it is determined whether or not a component can be mounted on the substrate based on the height of a plurality of connection parts of the component. can do.

  In the component mounting apparatus according to the first aspect, preferably, the connection portion height information includes flatness information of a plurality of connection portions of the component. With this configuration, even when the number of connection portions increases, it is easily determined whether or not components can be mounted on a plurality of solder placement regions of the board based on the flatness information of the plurality of connection portions of the component. can do.

  In the component mounting apparatus according to the first aspect, preferably, the solder thickness information is stored in an external storage device or is configured to be transferred from an upstream component mounting apparatus to a downstream component mounting apparatus. Yes. According to this configuration, when the solder thickness information is stored in the external storage device, the downstream component mounting apparatus uses the solder thickness information stored in the external storage device to the plurality of solder placement areas on the board. It is possible to easily determine whether or not the component can be mounted. In addition, when the solder thickness information is transferred from the upstream component mounting apparatus to the downstream component mounting apparatus, the solder thickness information can be transferred to the downstream component mounting apparatus along with the conveyance of the board. In the mounting apparatus, it is possible to easily determine whether or not components can be mounted on a plurality of solder placement regions of the board.

In the component mounting apparatus according to the first aspect, preferably, the solder thickness information and the connection portion height information are configured to be measured in advance of the component mounting operation by the component mounting apparatus or the external apparatus. Yes. With this configuration, when mounting the component, it is not necessary to measure the thickness of the solder and the height of the connection portion, so that the cycle time can be shortened accordingly.

In the component mounting apparatus according to the first aspect, preferably, when implementing a plurality of the same type components on a substrate, so as to sequentially implement to identify whether it is possible to mount components to a plurality of solder arrangement region of board It is configured. With this configuration, since the components are sequentially mounted at the mountable positions, the cycle time can be shortened as compared with the case where the mounting portion remounts the mountable components and then mounts them.

In this case, preferably, when mounting a plurality of the same type of components on the substrate, the plurality of components are mounted at appropriate positions in the plurality of solder placement regions of the substrate based on the solder thickness information and the connection portion height information. a first mode that is, a solder thickness information, based on the connection section height information, and a second mode in which parts to be held in the mounting portion are successively mounted on the plurality of solder arrangement areas of possible mounting board It is configured to be selectable. With this configuration, in the first mode in which a plurality of components are mounted at appropriate positions in a plurality of solder placement regions of the substrate, it is possible to effectively suppress the occurrence of defective bonding between the connection portions of the components and the solder. Can do. In addition, in the second mode in which a plurality of solder placement areas on a board on which a component can be mounted is identified and sequentially mounted, the components are sequentially mounted at a position where they can be mounted. The cycle time can be shortened compared to the case of mounting after.

A component mounting system according to a second aspect of the present invention includes a component mounting apparatus including a mounting portion for mounting a component on a board, solder thickness information of a plurality of solder placement areas of the board, and a component corresponding to the plurality of solder placement areas. And a control unit that determines whether or not a component can be mounted on a plurality of solder placement regions of the board based on the connection part height information of the plurality of connection parts. Based on the height information, the gap between the solder of the board and the connection part of the corresponding part is calculated, and it is judged whether or not the component can be mounted on the plurality of solder placement areas of the board. when mounting of components on one mounting points including a region is negative, that is configured to determine whether the component mounting to other mounting points including a plurality of solder placement area.

  In the component mounting system according to the second aspect of the present invention, as described above, the solder thickness information of the plurality of solder placement regions of the substrate and the connection portion height of the plurality of connection portions of the component corresponding to the plurality of solder placement regions. Based on the information, a control unit is provided for determining whether or not components can be mounted on a plurality of solder placement regions of the board. Accordingly, it is possible to determine whether or not a component having a plurality of connection portions can be mounted in consideration of the compatibility between the solder thickness in the solder placement region and the height of the corresponding connection portion. For example, whether or not a component having a plurality of connection portions can be mounted can be determined based on the size of a gap corresponding to the unevenness of a plurality of solders on the substrate and the unevenness of a plurality of connection portions of the component. As a result, the individual standards must be stricter than when determining whether or not a component can be mounted on the substrate based on the solder thickness of the substrate and the height of the plurality of connecting portions of the component. Even the quality of component mounting can be ensured. As a result, when mounting a component having a plurality of connection portions, it is possible to suppress an increase in the number of discarded boards and components. Thereby, a yield can be improved. In addition, since it is possible to accurately determine whether or not a component can be mounted on the substrate, it is possible to suppress the occurrence of defective bonding between the connection portion of the component and the solder.

  According to the present invention, as described above, it is possible to suppress an increase in the number of discarded boards and components when mounting a component having a plurality of connection portions.

1 is a diagram schematically showing an overall configuration of a component mounting system according to an embodiment of the present invention. It is the figure which showed roughly the component mounting apparatus of the component mounting system by one Embodiment of this invention. It is a figure for demonstrating the solder thickness of a board | substrate. It is a figure for demonstrating the height of the some lead | read | reed of components. It is a figure for demonstrating the clearance gap between the solder of a board | substrate, and the lead of components. It is a figure for demonstrating the case where several same kind components are mounted in a board | substrate in the component mounting system by one Embodiment of this invention. It is a flowchart for demonstrating the calculation process of the clearance gap for every connection part by the component mounting system by one Embodiment of this invention. It is a figure of the board | substrate and components for demonstrating the calculation process of the clearance gap for every connection part by the component mounting system by one Embodiment of this invention. It is a flowchart for demonstrating the mounting process of the components by the component mounting system by one Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  With reference to FIG. 1, the structure of the component mounting system 100 by one Embodiment of this invention is demonstrated.

(Configuration of component mounting system)
The component mounting system 100 according to the present embodiment is configured to mount the components 431 and 432 on the substrate 10 and manufacture the substrate 10 on which the components 431 and 432 are mounted. As shown in FIG. 1, the component mounting system 100 includes a control device 1, a printing machine 2, an inspection device 3, and mounting devices 4 (4a, 4b, 4c). A plurality of component mounting apparatuses 4 (4a, 4b, 4c) are provided along the board production line. The control device 1 is an example of the “external storage device” in the claims.

  Further, the component mounting system 100 is configured such that the board 10 is transported from the upstream side (left side) to the downstream side (right side) along the board manufacturing line. Further, each device (printing machine 2, inspection device 3, component mounting device 4) constituting the component mounting system 100 is a self-supporting device having a control unit, and the operation of each device is performed by each control unit. Are controlled individually. The control device 1 has a role of executing the control program (production program) to control the entire component mounting system 100. That is, the control device 1 and each device are configured to perform production of the substrate 10 on which the components 431 and 432 are mounted in the component mounting system 100 by transmitting and receiving information on the production plan as needed.

  Next, the configuration of each device constituting the component mounting system 100 will be described.

  The control device 1 is configured to control each device of the component mounting system 100. Moreover, the control apparatus 1 is provided with the memory | storage part 1a. The control device 1 is, for example, a management personal computer that manages the component mounting system 100.

  The printing machine 2 is a screen printing machine and has a function of applying cream solder onto the mounting surface of the substrate 10. The printing machine 2 is configured to deliver the printed substrate 10 to the downstream inspection apparatus 3. Specifically, the printing machine 2 includes a transport unit that transports the substrate 10 and a working unit that prints cream solder on the substrate 10 fixed at a predetermined position.

  The inspection device 3 has a function of inspecting the appearance of the substrate 10 with visible light. Specifically, the inspection apparatus 3 is configured to inspect the state of the solder 11 printed on the substrate 10. Further, the inspection device 3 is configured to measure the height of the solder 11 printed on the substrate 10 and obtain solder thickness information. The inspection device 3 is configured to deliver the substrate 10 after inspection to the downstream component mounting device 4 (4a).

  The component mounting apparatus 4 has a function of mounting (mounting) a component at a predetermined mounting position of the substrate 10 on which cream solder is printed. Note that the components include small pieces of electronic components such as LSIs, ICs, transistors, capacitors, and resistors. A plurality of component mounting apparatuses 4 (4 a to 4 c) are arranged along the conveyance direction of the substrate 10. The plurality of component mounting apparatuses 4 are arranged in the order of the component mounting apparatus 4a, the component mounting apparatus 4b, and the component mounting apparatus 4c from the upstream in the conveyance direction of the substrate 10. The component mounting apparatuses 4a to 4c have the same configuration. As shown in FIG. 2, the component mounting apparatus 4 (4a to 4c) includes a base 41, a pair of conveyors 42, a component supply unit 43, a head unit 44, a support unit 45, and a pair of rails. Unit 46, component recognition imaging unit 47, and control unit 48. The head unit 44 is an example of the “mounting unit” in the claims.

  The pair of conveyors 42 is installed on the base 41 and configured to transport the substrate 10 in the X direction. Further, the pair of conveyors 42 is configured to hold the substrate 10 being transported in a state of being stopped at the mounting work position. The pair of conveyors 42 is configured to be able to adjust the interval in the Y direction according to the dimensions of the substrate 10.

  The component supply unit 43 is disposed outside the pair of conveyors 42 (Y1 side and Y2 side). The component supply unit 43 is provided with a plurality of tape feeders 43a or component supply trays 43b.

  The tape feeder 43a holds a reel (not shown) on which a tape holding a plurality of components 431 at a predetermined interval is wound. The tape feeder 43a is configured to supply the component 431 from the tip of the tape feeder 43a by feeding a tape that holds the component 431 by rotating the reel. The component supply tray 43 b is configured to supply a large component 432. Specifically, the parts 432 are arranged at a predetermined interval on the parts supply tray 43b. The component 432 is an electronic component having a plurality of leads 432a (connection portions) (see FIG. 4).

  The head unit 44 is provided so as to move between the pair of conveyors 42 and the component supply unit 43, and a plurality (five) of mounting heads 441 having nozzles attached to the lower end, a board, A recognition camera 442 and an imaging unit 443 are included.

  The mounting head 441 is configured to be movable up and down (movable in the Z direction), and is supplied from the tape feeder 43a or the component supply tray 43b by the negative pressure generated at the tip of the nozzle by a negative pressure generator (not shown). The component (component 431 or the component 432) to be held is sucked and held, and the component is mounted (mounted) at the mounting position on the substrate 10.

  The substrate recognition camera 442 is configured to image the fiducial mark F of the substrate 10 in order to recognize the position and posture of the substrate 10. Then, by imaging and recognizing the position of the fiducial mark F, it is possible to accurately acquire the mounting position of the components (components 431 and 432) on the substrate 10.

  The imaging unit 443 is attached to the head unit 44. As a result, the imaging unit 443 is configured to move in the XY direction together with the head unit 44 when the head unit 44 moves in the XY direction. Further, the imaging unit 443 can image the mounting position of the substrate 10 from a plurality of directions (angles). For example, the imaging unit 443 includes a stereo camera. The imaging unit 443 is configured to be able to measure the height of the mounting position of the substrate 10 by imaging. Further, the imaging unit 443 is configured to measure the height of the solder 11 printed on the substrate 10 and acquire solder thickness information.

  Specifically, as shown in FIG. 3, the imaging unit 443 is configured to be able to measure the thickness (height) (ha1 to ha12) of the solder 11 in a plurality of solder arrangement regions at the mounting position 12 of the substrate 10. Yes. The thickness (ha1 to ha12) of the solder 11 may be different depending on changes in the solder viscosity over time, the solder type, the mask opening direction of the printing machine 2 and the squeegee movement direction, and the like.

  As shown in FIG. 2, the support portion 45 includes a motor 451. The support unit 45 is configured to move the head unit 44 in the X direction along the support unit 45 by driving a motor 451. Both ends of the support portion 45 are supported by a pair of rail portions 46.

  The pair of rail portions 46 are fixed on the base 41. The rail portion 46 on the X1 side includes a motor 461. The rail portion 46 is configured to move the support portion 45 in the Y direction perpendicular to the X direction along the pair of rail portions 46 by driving the motor 461. The head unit 44 is movable in the X direction along the support portion 45, and the support portion 45 is movable in the Y direction along the rail portion 46, whereby the head unit 44 is movable in the XY direction. .

  The component recognition imaging unit 47 is fixed on the upper surface of the base 41. The component recognition imaging unit 47 is disposed outside the pair of conveyors 42 (Y1 side and Y2 side). The component recognition imaging unit 47 lowers (Z2 side) the component sucked by the nozzle of the mounting head 441 in order to recognize the suction state (suction posture) of the component prior to mounting of the components (components 431 and 432). It is comprised so that it may image from. Thereby, it is possible to acquire the suction state of the parts (parts 431 and 432) sucked by the nozzles of the mounting head 441. In addition, the component recognition imaging unit 47 is configured to be able to measure the heights of the plurality of leads 432a of the component 432 and acquire the connection portion height information of the component 432. Specifically, as illustrated in FIG. 4, the component recognition imaging unit 47 is configured to be able to measure the heights (hb1 to hb12) of the plurality of leads 432a of the component 432. The component recognition imaging unit 47 can image the component 432 from a plurality of directions (angles). For example, the component recognition imaging unit 47 includes a stereo camera.

  The control unit 48 includes a CPU and controls the entire component mounting apparatus 4 such as a transport operation of the substrate 10 by the pair of conveyors 2, a mounting operation by the head unit 44, and an imaging operation by the component recognition imaging unit 47 and the imaging unit 443. It is configured to control the operation.

  Here, in the present embodiment, the control unit 48 converts the solder thickness information of the plurality of solder placement regions of the substrate 10 and the connection portion height information of the plurality of leads 432a of the component 432 corresponding to the plurality of solder placement regions. Based on this, it is configured to determine whether or not the component 432 can be mounted on a plurality of solder placement regions of the substrate 10.

  Specifically, as shown in FIG. 5, the control unit 48 transfers a part of the plurality of leads 432 a of the component 432 to the corresponding solder 11 based on the solder thickness information and the connection portion height information. When the contact is made, the gaps (d1 to d5) between the other solder 11 of the substrate 10 and the leads 432a of the corresponding component 432 are calculated, and the mounting of the component 432 in a plurality of solder placement regions of the substrate 10 is performed. It is configured to determine whether it is possible.

  Further, if the calculated gap between the solder 11 of the substrate 10 and the corresponding lead 432a of the component 432 is equal to or less than the threshold value for all the leads 432a, the control unit 48 places the plurality of solder placements on the substrate 10 on the component 432. It is configured to determine that the area can be mounted. Note that the threshold value is set to such a value that the lead 432a can be joined to the solder 11 when the component 432 is pressed (mounted) onto the solder 11. If the calculated gap between the solder 11 of the substrate 10 and the corresponding lead 432a of the component 432 is larger than the threshold value for some or all of the leads 432a, the control unit 48 determines that the component 432 is a plurality of the plurality of substrates 10. It is configured to determine that mounting on the solder placement area is not possible.

  In the present embodiment, the connection portion height information includes flatness information of the plurality of leads 432a of the component 432. The flatness (coplanarity) information is information indicating how much each of the leads 432a of the component 432 is displaced from a plane. The connection part height information including the flatness information is configured to be measured in advance by the component mounting apparatus 4 or an external apparatus. For example, when connecting part height information is measured in advance by the component mounting apparatus 4, it is performed when the board 10 is carried in and out of the component mounting apparatus 4 or when the board 10 is waiting to be transported. In addition, the component 432 whose connection portion height information has been measured in advance is placed at a predetermined position on the component supply tray 43b in a state where the measurement result is linked.

  The solder thickness information is configured to be measured in advance by the component mounting apparatus 4 or an external apparatus. For example, when the solder thickness information is measured in advance by an external device, it is performed by the inspection device 3 after the solder 11 is printed by the printing machine 2. Also, the solder thickness information is stored in the external control device 1 or transferred from the upstream component mounting device 4 (4a or 4b) to the downstream component mounting device 4 (4b or 4c). Has been. That is, when the solder thickness information is acquired by the upstream device, the solder thickness information is stored in the storage unit 1a of the external control device 1 or transferred to the downstream device as the substrate 10 is transported. ing.

  In this embodiment, when mounting a plurality of the same type of components 432 on the substrate 10, the component mounting apparatus 4 attaches the plurality of components 432 to the substrate 10 based on the solder thickness information and the connection portion height information. A first mode for mounting at a suitable position in each of the plurality of solder placement areas and a second mode for identifying and sequentially mounting the plurality of solder placement areas on the substrate 10 on which the component 432 can be mounted can be selected. . Specifically, as shown in FIG. 6, when there is a mounting position 12 where a plurality of similar components 432 are mounted on the substrate 10, in the first mode, based on the solder thickness information and the connection portion height information. The plurality of components 432 are mounted (mounted) at the optimum positions of the plurality of mounting positions 12 on the substrate 10. In the second mode, the components 432 held by the head unit 44 are sequentially mounted (mounted) on the mounting position 12 where the components 432 held by the head unit 44 can be mounted based on the solder thickness information and the connection portion height information.

(Calculation process for gaps at each connection)
Next, with reference to FIG. 7 and FIG. 8, the calculation process of the clearance for each connection part by the control part 48 of the component mounting apparatus 4 of this embodiment is demonstrated.

  In step S1, three points are extracted in order from the thickest (highest) solder among the plurality of solders 11 (see FIG. 3) in the mounting region 12 where the component 432 is mounted on the substrate 10. In step S2, a solder side surface passing through the tips of the three extracted solders 11 is calculated.

  In step S3, as shown in FIG. 8, the unevenness amount of each solder 11 is calculated with respect to the calculated solder side surface. That is, the difference between the solder 11 other than the extracted three points and the solder side surface is calculated. In this case, a negative value is obtained when the solder 11 is below the solder side surface, and a positive value is obtained when the solder 11 is above the solder side surface.

  In step S4 of FIG. 7, the component-side surface is calculated using points corresponding to the three solders 11 used to calculate the solder-side surface. That is, the component side surface passing through the tip of the lead 432a (connection portion) of the component 432 corresponding to the solder 11 used for the solder side surface is calculated.

  In step S5, as shown in FIG. 8, the unevenness amount of each lead 432a is calculated with respect to the calculated component side surface. That is, the difference between the lead 432a other than the three points used for calculating the component-side surface and the component-side surface is calculated. In this case, a negative value is obtained when the lead 432a is below the component side surface, and a positive value is obtained when the lead 432a is above the component side surface.

  In step S6 of FIG. 7, a gap for each connection portion (lead 432a) is calculated. The gap between the connecting portions is calculated by subtracting the corresponding unevenness on the solder side from the unevenness on the component side lead 432a. A positive value indicates that there is a gap. On the other hand, if the value is negative, it indicates that the lead 432a is embedded in the solder 11.

  In step S7, it is determined whether all the gaps are 0 or more. If all the gaps are equal to or greater than 0, the gap calculation process for each connection portion is terminated. On the other hand, if some of the gaps are less than 0, the process proceeds to step S8. In step S8, the three points to be extracted are selected again from the one with the smaller gap. Then, the process returns to step S2. Thereafter, the processes in steps S2 to S8 are repeated until all the gaps become 0 or more.

(Parts mounting process)
Next, with reference to FIG. 9, the component mounting process by the control part 48 of the component mounting apparatus 4 of this embodiment is demonstrated.

  In step S11, the solder thickness information of the target mounting point (mounting region 12) is acquired. In step S12, it is determined whether or not there is a component 432 from which coplanarity information (flatness information) has been acquired. If there is a component 432, the process proceeds to step S13, and if there is no component 432, the process proceeds to step S17.

  In step S13, it is determined whether or not the target component (component 432 for which flatness information has been acquired) can be mounted on the target mounting point (mounting region 12). Specifically, whether or not the component 432 can be mounted on the substrate 10 is determined based on the solder thickness information of the plurality of solder placement regions of the substrate 10 and the connection portion height information of the plurality of leads 432a of the corresponding component 432. To be judged. If it can be mounted, the process proceeds to step S14, and if it cannot be mounted, the process proceeds to step S25. In step S <b> 14, the component 432 is sucked by the head unit 44. Further, positioning recognition of the sucked component 432 is performed, and the component 432 is mounted (mounted) on the substrate 10.

  In step S15, it is determined whether there is a next mounting point. If there is a next mounting point, the process proceeds to step S16. If there is no next mounting point, the component mounting process is terminated. In step S16, after the next target mounting point (mounting area 12) is set, the process returns to step S11.

  If it is determined in step S12 that there is no part 432 for which coplanarity information has been acquired, the part 432 at the next suction position is picked up in step S17. Further, positioning recognition of the sucked part 432 is performed. Further, coplanarity information (flatness information) of the sucked part 432 is acquired.

  In step S18, it is determined whether or not the coplanarity (flatness) of the sucked part 432 is equal to or less than a threshold value. That is, it is determined whether or not the unevenness of the unevenness of the lead 432a of the component 432 is large. If the coplanarity is less than or equal to the threshold value, the process proceeds to step S20, and if the coplanarity is greater than the threshold value, the process proceeds to step S19. In step S19, the part 432 whose coplanarity is larger than the threshold value is discarded. Thereafter, the process returns to step S17.

  In step S20, it is determined whether or not the sucked component 432 can be mounted on the target mounting point (mounting region 12). Specifically, whether or not the component 432 can be mounted on the substrate 10 is determined based on the solder thickness information of the plurality of solder placement regions of the substrate 10 and the connection portion height information of the plurality of leads 432a of the corresponding component 432. To be judged. If it can be mounted, the process proceeds to step S21, and if it cannot be mounted, the process proceeds to step S22. In step S <b> 21, the component 432 is mounted (mounted) on the substrate 10. Thereafter, the process proceeds to step S15.

  In step S22, it is determined whether there is another mounting point that can be mounted. That is, based on the connection portion height information of the plurality of leads 432a of the component 432 and the solder thickness information of the other corresponding mounting region 12 of the substrate 10, the mounting point (mounting region 12) to the other mounting point of the substrate 10 is determined. Whether the component 432 can be mounted is determined. If there is another mounting point, the process proceeds to step S23, and if there is no other mounting point, the process proceeds to step S24.

  In step S23, the sucked component 432 is mounted (mounted) at another mounting point (mounting region 12) where mounting is possible. Then, it returns to step S11. In step S24, the sucked part 432 is stocked as a part for which coplanarity information (flatness information) has been acquired. Then, it returns to step S11.

  If it is determined in step S13 that the target component cannot be mounted, it is determined in step S25 whether there is a component 432 for which coplanarity information (flatness information) has been acquired. If there is a component 432, the process proceeds to step S26, and if there is no component 432, the process proceeds to step S17. In step S26, after the next target part is set, the process returns to step S13.

(Effect of embodiment)
In the present embodiment, the following effects can be obtained.

  In the present embodiment, as described above, based on the solder thickness information of the plurality of solder placement regions of the substrate 10 and the connection portion height information of the plurality of leads 432a of the component 432 corresponding to the plurality of solder placement regions, A control unit 48 for determining whether or not the component 432 can be mounted on a plurality of solder placement regions of the substrate 10 is provided. Accordingly, it is possible to determine whether or not the component 432 having the plurality of leads 432a can be mounted in consideration of the compatibility between the solder thickness in the solder placement region and the height of the corresponding lead 432a. That is, whether or not the component 432 having the plurality of leads 432a can be mounted is determined based on the size of the corresponding gap between the unevenness of the plurality of solders 11 on the substrate 10 and the unevenness of the plurality of leads 432a of the component 432. Can do. As a result, each criterion is compared with the case where it is determined whether or not the component 432 can be mounted on the substrate 10 based on the solder thickness of the substrate 10 and the height of the plurality of leads 432a of the component 432. Even if it is not strict, the quality of component mounting can be guaranteed. As a result, when the component 432 having the plurality of leads 432a is mounted, it is possible to suppress an increase in the number of discarded substrates 10 and components 432. Thereby, a yield can be improved. In addition, since it is possible to accurately determine whether or not the component 432 can be mounted on the substrate 10, it is possible to suppress the occurrence of bonding failure between the lead 432 a of the component 432 and the solder 11.

  Further, in the present embodiment, the control unit 48 makes a case where a part of the plurality of leads 432a of the component 432 is brought into contact with the corresponding solder 11 based on the solder thickness information and the connection portion height information. The gap between the other solder 11 of the substrate 10 and the lead 432a of the corresponding component 432 is calculated to determine whether or not the component 432 can be mounted in a plurality of solder placement regions of the substrate 10. Thereby, when a part of the plurality of leads 432a of the component 432 is brought into contact with the corresponding solder 11, based on the gap between the other solder 11 of the substrate 10 and the lead 432a of the corresponding component 432, Whether or not the component 432 having the plurality of leads 432a can be mounted can be accurately determined.

  In the present embodiment, the control unit 48 causes the component 432 to be mounted on the substrate 10 if the calculated gap between the solder 11 of the substrate 10 and the corresponding lead 432a of the component 432 is equal to or less than the threshold value for all the leads 432a. If the calculated gap between the solder 11 of the substrate 10 and the corresponding lead 432a of the component 432 is larger than the threshold value for some or all of the leads 432a, The configuration is such that it is determined that the component 432 cannot be mounted on a plurality of solder placement regions of the substrate 10. As a result, the component 432 has a plurality of solder arrangements on the substrate 10 only when the calculated gap between the solder 11 of the substrate 10 and the corresponding lead 432a of the component 432 is larger than the threshold value for some or all of the leads 432a. It is determined that it cannot be mounted in the area. As a result, the number of discarded substrates 10 and components 432 increases compared to the case where it is determined whether or not the components 432 can be mounted on the substrate 10 based on the heights of the plurality of leads 432a of the components 432, respectively. Can be effectively suppressed.

  In the present embodiment, the connection portion height information includes flatness information of the plurality of leads 432a of the component 432. Thereby, even when the number of leads 432a increases, it is easily determined whether or not the component 432 can be mounted on the plurality of solder placement regions of the substrate 10 based on the flatness information of the plurality of leads 432a of the component 432. be able to.

  In the present embodiment, the solder thickness information is stored in the external control device 1 or transferred from the upstream component mounting device 4 (4a or 4b) to the downstream component mounting device 4 (4b or 4c). To be configured. Accordingly, when the solder thickness information is stored in the external control device 1, the plurality of solder arrangements on the substrate 10 are used in the component mounting device 4 on the downstream side by using the solder thickness information stored in the external control device 1. Whether or not the component 432 can be mounted in the region can be easily determined. Further, when the solder thickness information is transferred from the upstream component mounting apparatus 4 to the downstream component mounting apparatus 4, the solder thickness information can be transferred to the downstream component mounting apparatus 4 along with the conveyance of the substrate 10. In the component mounting apparatus 4 on the downstream side, it is possible to easily determine whether or not the component 432 can be mounted on a plurality of solder placement regions of the substrate 10.

  In the present embodiment, the solder thickness information and the connection portion height information are configured to be measured in advance by the component mounting apparatus 4 or an external apparatus. Thereby, when mounting the component 432, it is not necessary to measure the thickness of the solder and the height of the lead 432a, so that the cycle time can be shortened accordingly.

  In the present embodiment, when a plurality of the same type of components 432 are mounted on the substrate 10, a plurality of solder placement regions of the substrate 10 on which the components 432 can be mounted are identified and sequentially mounted. As a result, the components 432 are sequentially mounted at the mountable positions, so that the cycle time can be shortened as compared with the case where the head unit 44 mounts the mountable components 432 again.

  Further, in the present embodiment, when a plurality of the same kind of components 432 are mounted on the substrate 10, the plurality of components 432 are arranged in a plurality of solder arrangement regions of the substrate 10 based on the solder thickness information and the connection portion height information. A first mode for mounting at appropriate positions and a second mode for identifying and sequentially mounting a plurality of solder placement regions of the substrate 10 on which the component 432 can be mounted can be selected. Thus, in the first mode in which the plurality of components 432 are mounted at appropriate positions in the plurality of solder placement regions of the substrate 10, it is possible to effectively suppress the occurrence of bonding failure between the lead 432 a of the component 432 and the solder 11. Can do. Further, in the second mode in which a plurality of solder placement areas of the substrate 10 on which the component 432 can be mounted is identified and sequentially mounted, the component 432 is sequentially mounted at a position where the component can be mounted. The cycle time can be shortened as compared with the case of mounting after re-adsorbing 432.

(Modification)
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above embodiment, the control unit provided in the component mounting apparatus shows an example of a configuration that determines whether or not the component can be mounted on the board based on the solder thickness information and the connection portion height information. The present invention is not limited to this. In the present invention, a control unit provided outside the component mounting apparatus may determine whether or not the component can be mounted on the board based on the solder thickness information and the connection portion height information. For example, the control device 1 that controls the entire component mounting system may determine whether or not the component can be mounted on the board based on the solder thickness information and the connection portion height information. In this case, the control device 1 is an example of the “control unit” in the claims.

  Moreover, in the said embodiment, although the example in which the connection part of components is a lead was shown, this invention is not limited to this. In the present invention, the connecting portion of the component may be a ball-shaped electrode. In this case, you may make it acquire connection part height information by measuring the height of the ball-shaped electrode of components.

  Moreover, in the said embodiment, although the component supplied from a component supply tray showed the example of the structure which judges the propriety of mounting of the component on a board | substrate based on solder thickness information and connection part height information, The present invention is not limited to this. In the present invention, the configuration may be such that components supplied from other than the component supply tray are determined as to whether or not the components can be mounted on the board based on the solder thickness information and the connection portion height information. For example, the configuration may be such that the component supplied from the tape feeder determines whether or not the component can be mounted on the board based on the solder thickness information and the connection portion height information.

  Moreover, in the said embodiment, although the example of the structure by which the printing machine and the test | inspection apparatus were provided separately was shown, this invention is not limited to this. In the present invention, the printing press may have a function of an inspection device and may be configured integrally. In this case, the thickness of the solder on the substrate printed by the printing machine may be measured by the printing machine, and the solder thickness information may be obtained by the printing machine.

  Moreover, in the said embodiment, although the example of the structure by which the control apparatus was provided in the component mounting system was shown, this invention is not limited to this. In the present invention, the substrate mounting process may be controlled by the respective control units of the plurality of apparatuses.

  In the above embodiment, for convenience of explanation, the processing operation of the control unit has been described using a flow-driven flowchart that performs processing in order along the processing flow, but the present invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

1 Control device (external storage device, control unit)
4, 4a, 4b, 4c Component mounting apparatus 10 Substrate 11 Solder 44 Head unit (mounting part)
48 Control unit 100 Component mounting system 431, 432 Component 432a Lead (connection unit)

Claims (9)

A mounting part for mounting components on the board;
The plurality of solder placement areas of the substrate based on the solder thickness information of the plurality of solder placement areas of the substrate and the connection portion height information of the plurality of connection portions of the component corresponding to the plurality of solder placement areas and a said control unit for determining whether the component mounting to,
The control unit calculates a gap between the solder of the board and the connection part of the corresponding component based on the solder thickness information and the connection part height information, and In addition to determining whether the component can be mounted in the solder placement area, and not including the plurality of solder placement areas when the mounting of the component at one mounting point including the plurality of solder placement areas is not possible A component mounting apparatus configured to determine whether or not the component can be mounted on the mounting point .   The control unit is configured to change another part of the substrate when contacting a part of the plurality of connection parts of the component with the corresponding solder based on the solder thickness information and the connection part height information. The gap between the solder and the connection portion of the corresponding component is calculated to determine whether or not the component can be mounted on the plurality of solder placement regions of the substrate. The component mounting apparatus described.   If the calculated gap between the solder on the substrate and the corresponding connection portion of the component is equal to or less than a threshold value for all the connection portions, the component is the plurality of solder placement regions on the substrate. If the calculated gap between the solder of the substrate and the corresponding connection portion of the component is larger than a threshold value for some or all of the connection portions, the component is The component mounting apparatus according to claim 2, wherein the component mounting apparatus is configured to determine that mounting on the plurality of solder placement regions is not possible.   The component mounting apparatus according to claim 1, wherein the connection portion height information includes flatness information of a plurality of connection portions of the component.   5. The solder thickness information according to claim 1, wherein the solder thickness information is stored in an external storage device or is transferred from an upstream component mounting device to a downstream component mounting device. The component mounting apparatus described. The solder thickness information and the connection portion height information are configured to be measured in advance of the mounting operation of the component by the component mounting device or an external device. The component mounting apparatus according to item 1. When implementing the component of the plurality of the same type on the substrate, is configured to sequentially implement to identify whether it is possible to mount the components on the plurality of solder placement region before Symbol substrate, according to claim 1 The component mounting apparatus of any one of -6. When a plurality of the same types of components are mounted on the substrate, the plurality of components are respectively positioned at suitable positions in the plurality of solder placement regions of the substrate based on the solder thickness information and the connection portion height information. a first mode that is implemented, and the solder thickness information, based on said connection section height information, successively mounted on the plurality of solder placement area of the component can be mounted a said substrate held on the mounting portion It is selectably configured a second mode that is, the component mounting apparatus according to claim 7. A component mounting apparatus including a mounting unit for mounting components on a substrate;
The plurality of solder placement areas of the substrate based on the solder thickness information of the plurality of solder placement areas of the substrate and the connection portion height information of the plurality of connection portions of the component corresponding to the plurality of solder placement areas and a said control unit for determining whether the component mounting to,
The control unit calculates a gap between the solder of the board and the connection part of the corresponding component based on the solder thickness information and the connection part height information, and In addition to determining whether the component can be mounted in the solder placement area, and not including the plurality of solder placement areas when the mounting of the component at one mounting point including the plurality of solder placement areas is not possible A component mounting system configured to determine whether or not the component can be mounted on the mounting point .

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