JP2005228949A - Inspection device, system, and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device, an inspection system, and an inspection method capable of improving the quality of mounted components in the early stage of a manufacturing process. <P>SOLUTION: The mounted component inspection device comprises: image incorporation means for incorporating an image; detection means for detecting a displacement of the component image from the reference position of an incorporation means; first judgement means for judging displaced amounts of at least three kinds including good article/warning/bad in response to the displacement amount from the detection means; and data display means for displaying an output result from the first judgement means. Herein, the device notifies an operator of badness before it occurs. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an inspection apparatus, an inspection system, and an inspection method.

  In component mounting of printed circuit boards used in recent mobile phones and mobile terminals, component mounting apparatuses are required to have higher functionality and higher speed. However, mounting defects occur in the component mounting manufacturing process, which is a quality problem. As one of the factors, with the recent trend of high-density mounting and high-speed mounting, the number of products that mount a lot of minute electronic components, for example, 0.6 mm × 0.3 mm electronic components on a printed circuit board, and A mounting apparatus mounts these components on a printed circuit board at high speed. On the other hand, the method of inspecting it is not clearly established.

  FIG. 6 is a configuration diagram of a mounting system according to Conventional Example 1 (mounting process organization chart including an inspection apparatus). In FIG. 6, 101 is a printing apparatus that prints solder paste on a printed circuit board, 102 is a first inspection apparatus that inspects the printing state of the printing apparatus 101, and 103 is a first device that mounts minute electronic components on a printed circuit board exclusively at high speed. Mounting device 105, a second mounting device 105 for mounting an odd-shaped electronic component or the like on a printed circuit board, 106 a reflow furnace for melting solder paste, 107 for inspecting the soldered terminals of each mounted component This is a third inspection device.

FIG. 7 is a block diagram showing the configuration of the inspection apparatus (third inspection apparatus 107) of Conventional Example 1. In FIG. 7, the third inspection apparatus 107 includes a camera for photographing the measurement object, an image capturing unit 201 that captures an image obtained by soldering a component to a printed circuit board, and extracts the measurement object from the image. A detection unit 202 that detects a deviation amount from a target position of a soldering position of a part, a determination unit 703 that outputs a determination result of a non-defective product or a defective product by software based on the deviation amount, and a data display unit that displays an image of the determination result 706, a storage unit 707 for storing the determination result and the data of the deviation amount.
In the mounting system of Conventional Example 1 shown in FIGS. 6 and 7 and the electronic component mounting system of Conventional Example 2 described in Patent Document 1, only the determination of a non-defective product or a defective product is performed.

Japanese Patent Laid-Open No. 2002-134998

  In the mounting system of Conventional Example 1, the third inspection device 107 that performs the final inspection only serves as a non-defective product or defective product discrimination device for the completed printed circuit board. When the completed printed circuit board is a defective product, most of the causes are manufacturing defects in the previous process. However, the mounting system of Conventional Example 1 cannot accurately capture the change in state of the devices arranged in each process, and does not have an inspection function for analyzing the true cause of defective products generated in the manufacturing process. It was. When the printed circuit board on which the solder paste is printed and the components are mounted passes through the reflow furnace 106, the final inspection is performed because the mounted state of the mounted components changes due to the surface tension of the molten solder. It was very difficult to analyze the true cause of the defective product generated in the manufacturing process from only the inspection result of the third inspection apparatus 107. For this reason, the quality of the printed circuit board completed depends on the operating state of each device arranged in the manufacturing process, and the root cause of defective products has not been investigated.

  The present invention confirms the state of the mounted component immediately after mounting the minute electronic component, manages the operating status and state change of the device arranged in the previous process, and at an early stage in the manufacturing process, An object is to provide an inspection apparatus, an inspection system, and an inspection method for improvement.

  In order to achieve the above object, the invention according to claim 1 of the present invention takes an image in which a solder paste is printed on a printed board, an image in which a component is placed on the printed board, or an image in which a component is soldered on the printed board. Image capturing means to be detected, detection means for detecting a deviation amount from a target position of a solder paste printing position, a component placement position, or a component soldering position in an image captured from the image capture means, and the detection means And a warning indicating that there is a possibility of a defective product or a non-defective product, but it is likely to become a defective product if it is shifted slightly. An inspection apparatus comprising: a first determination unit that outputs a type of deviation amount determination result; and a data display unit that displays the deviation amount determination result.

  The invention according to claim 2 of the present invention is the inspection apparatus according to claim 1, wherein the image capturing means outputs an image in which a solder paste is printed on a printed board or an image in which a component is placed on the printed board. A first inspection apparatus, which is an image capturing means to be captured, wherein the detection means is a detection means for detecting a deviation amount from a target position of a solder paste printing position or a component placement position; The image capturing unit is an image capturing unit that captures an image obtained by soldering a component to a printed circuit board, and the detection unit is configured to shift a component soldering position from a target position. The second inspection device, which is a detection means for detecting the amount, and at least the second inspection device from the second inspection device to the first inspection device by wired or wireless communication or medium. A communication path for transmitting information derived based on a deviation amount determination result of the inspection device, and the first inspection device is derived based on a displacement amount determination result of the second inspection device Based on the information, the first determination unit further includes a correction processing unit that corrects a threshold value for generating the deviation amount determination result, and the first determination unit sets the threshold value changed by the correction processing unit. An inspection system characterized in that the deviation amount determination result is output based on the result.

  According to a third aspect of the present invention, the first inspection device or the second inspection device is configured to obtain the determination result of the first determination unit of the second inspection device and data associated with the determination result. Based on the data stored from the storage means and the data from the storage means, a defective product or warning deviation amount determination result has continuously occurred for a predetermined threshold number of times, or a defective product or warning deviation amount determination result is a predetermined inspection. At least one of the following: a cumulative occurrence of a predetermined threshold number of times or a defective product or warning deviation determination result that has accumulated more than a predetermined number of inspections less than the predetermined threshold number of times And a second determination unit that outputs a second determination result including information, wherein the correction processing unit of the first inspection apparatus is configured to output the first determination result based on the second determination result. Judgment means is misaligned Correcting the threshold value for generating a judgment result, an inspection system according to claim 2, characterized in that.

  The invention according to claim 4 of the present invention is characterized in that the data display means of the first inspection device or the second inspection device displays the second determination result. It is an inspection system.

  The invention according to claim 5 of the present invention includes an image capturing step of capturing an image in which a solder paste is printed on a printed circuit board, an image in which a component is placed on the printed circuit board, or an image in which a component is soldered on the printed circuit board, In the image captured in the image capture step, according to the detection step of detecting a shift amount from the target position of the solder paste printing position, the component placement position or the component soldering position, and the detection step, Outputs at least three types of misalignment judgment results, including non-defective products, defective products, and warnings indicating that there is a possibility of defective products, or that they are not defective but are likely to become defective products if they are shifted slightly. And a data display step for displaying the result of determination of the deviation amount.

  The invention according to claim 6 of the present invention is the inspection method according to claim 5, wherein the image capturing step includes an image in which a solder paste is printed on a printed circuit board, or an image in which a component is placed on the printed circuit board. 6. A first inspection method, which is an image capturing step to be captured, wherein the detection step is a detection step of detecting a deviation amount from a target position of a solder paste printing position or a component placement position; The image capturing step is an image capturing step for capturing an image in which a component is soldered on a printed circuit board, and the detecting step is a deviation of the soldering position of the component from the target position. And a second inspection method that is a detection step for detecting the amount, wherein the first inspection method is derived based on a deviation amount determination result of the second inspection method. The first determination step further includes a correction processing step for correcting a threshold value for generating a deviation amount determination result based on the information, and the first determination step is a threshold value varied by the correction processing step. The shift amount determination result is output based on the inspection method.

  The invention according to claim 7 of the present invention is based on the determination result of the first determination step and the data accompanying the determination result of the second inspection method, and the data stored in the storage step. The defective product or warning deviation amount determination result has continuously occurred for a predetermined threshold number of times, or the defective product or warning deviation amount determination result has been accumulated for a predetermined inspection number of times or more. And a second determination result including at least one of information indicating that the determination result of the deviation amount of the defective product or the warning is accumulated more than a predetermined number of times less than a predetermined threshold number of times. The correction processing step of the first inspection method, wherein the first determination step generates a deviation amount determination result based on the second determination result. Correcting the threshold value of the order is an inspection method according to claim 6, characterized in that.

  The invention according to claim 8 of the present invention is characterized in that the data display step of the first inspection method or the second inspection method displays the second determination result. This is an inspection method.

According to the present invention, not only the quality of the manufactured product is good, but also a warning indicating that the manufactured product is likely to be defective or that it is not defective but is likely to become defective if it is shifted slightly. This is advantageous in that an inspection apparatus and an inspection method that can adjust the target value of the mounting position of the mounting apparatus in the previous process or correct the inspection threshold value of the inspection apparatus in the previous process can be realized. An effect is obtained.
According to the present invention, immediately after mounting a minute electronic component, the state of the mounted component is confirmed, the operating state of the mounting apparatus and the change point of the operation of the mounting apparatus are managed, and the mounting of the pre-process of the manufacturing process is performed. It is possible to realize an inspection apparatus, an inspection system, and an inspection method that can improve the manufacturing quality and the manufacturing yield by adjusting the target value of the mounting position of the apparatus or correcting the inspection threshold value of the inspection apparatus in the previous process. An advantageous effect is obtained.

According to the present invention, the function of warning is added to the function of discriminating between the non-defective product and the defective product of the conventional device, thereby measuring the presence / absence of electronic components and the amount of deviation in the vertical and horizontal directions to determine the changing point of the mounting device. Predict or recognize the trend of the operating status of the mounting device before creating defects by setting the degree of occurrence of the measured electronic component deviation and the trend of the warning content that occurs continuously for each component. Therefore, an advantageous effect that an inspection apparatus, an inspection system, and an inspection method for taking measures against trouble in advance can be realized is obtained.
According to the present invention, in the process of determining allowable dimension values in the vertical and horizontal directions for good products, warnings, and defects, the inspection results are obtained from the inspection device via external communication, and correction is performed to determine the determination criteria of the inspection device. An advantageous effect that an inspection apparatus, an inspection system, and an inspection method for improving the efficiency of the determination time can be realized.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments that specifically show the best mode for carrying out the present invention will be described below with reference to the drawings.

<< Embodiment >>
First, the inspection system according to the embodiment will be described. FIG. 1 is a configuration diagram (mounting process organization chart including an inspection apparatus) of an inspection system according to an embodiment of the present invention. In FIG. 1, 101 is a printing apparatus that prints solder paste on a printed circuit board, 102 is inspecting the printing state of the printing apparatus 101, detects the amount of deviation of the solder paste printing position from the target position, and determines whether it is acceptable or not. A first inspection device 103 is a first mounting device for high-speed mounting of minute electronic components, and 104 is used to inspect the mounting state of the first mounting device, and the amount of deviation from the target position of the component mounting position is determined. A second inspection apparatus that detects and determines pass / fail, 105 a second mounting apparatus that mounts an odd-shaped electronic component, 106 a reflow furnace that melts solder paste and connects the component to a printed circuit board, 107 A third inspection device 108 that inspects the state in which all the components are soldered to the printed circuit board, detects the amount of deviation from the target position of the soldering position of the components, and determines pass / fail, 108 is a communication path .

  The first to third inspection apparatuses 102, 104, and 107, the printing apparatus 101, the first mounting apparatus 103, and the second mounting apparatus 105 transmit and receive data to and from each other via the communication path 108. The configuration diagram (FIG. 1) of the inspection system of the embodiment is different from the configuration diagram (FIG. 6) of the mounting system of the conventional example 1 in that a second inspection device 104 is added to the subsequent process of the first mounting device 103. That the first to third inspection devices 102, 104, and 107 have an additional function to be described later, and that these inspection devices and mounting devices are connected to each other via a communication path 108. is there.

  FIG. 2 is a block diagram showing a configuration of the inspection apparatus (first to third inspection apparatuses 102, 104, and 107) according to the embodiment of the present invention. The first to third inspection apparatuses 102, 104, and 107 have a common block diagram shown in FIG. The second inspection apparatus 104 will be described as an example. In FIG. 2, the second inspection apparatus 104 includes a camera that captures an image of a measurement object, an image capturing unit 201 that captures an image of the measurement object, and a measurement object (part placed on a printed board) from the image. The detection unit 202 that detects the amount of deviation from the target position of the component placement position, and outputs three types of deviation amount judgment results of non-defective product, warning, and defective product based on the detected amount of deviation A first determination unit 203, a warning processing unit 204 that extracts only warnings and defective products from the deviation amount determination result and processes them with software, a correction processing unit 205, a data display unit 206 that displays an image, a storage unit 207, The second determination unit 208 includes a data interface 209 that includes an interface such as Ethernet (registered trademark) that exchanges information from the outside.

  In the second inspection apparatus 104, the image capturing unit 201 captures an image in which a component is placed on a printed board. The detection unit 202 has a library in which the shape of the component to be inspected is registered as a template in order to recognize minute electronic components at high speed and accurately, and the component image captured by the image capturing unit 201 and the registered component shape And pattern matching is performed to extract parts from the image. The detection unit 202 uses CAD data for manufacturing a printed circuit board, compares the target center position (reference coordinate) of the component in the CAD data with the center coordinate of the actual component recognized by pattern matching, and uses the difference as a deviation amount. Calculate. The detection unit 202 detects a deviation amount that means a distance that the detected placement position of the component is shifted from the target position.

The first determination unit 203 compares the deviation amount detected by the detection unit 202 with a threshold value (determination criterion) of the deviation amount, and has three types of non-defective product (OK), warning (WAR), and defective product (NG). Outputs the deviation judgment result. The warning indicates that the manufactured product may be defective or not defective, but is likely to become defective if it is slightly shifted.
FIG. 3 is a diagram schematically illustrating the respective areas 302, 303, and 304 that the first determination unit 203 determines as non-defective, warning, and defective, and a threshold that is a boundary between adjacent areas. A conventional inspection apparatus sets only a non-defective region and a defective region with reference to a center position of a part as a reference (target position) 301, and determines that the product is a non-defective product or a defective product. The first determination unit 203 of the present invention provides a warning region 303 between the non-defective product region 302 and the defective product region 304, thereby quantitatively calculating a time-series change amount of the shift amount from the good product region to the defective region. We are trying to grasp it.

Next, calculation formulas for determination in the horizontal axis direction of each region of the first determination unit 203 are shown below. The correction value will be described later. The same formula is used for the vertical direction.
0 ≦ non-defective area ≦ displacement amount A = mounting accuracy of the first mounting apparatus 103 + recognition error displacement amount A of the second inspection apparatus 104 <warning area ≦ displacement amount (A + B) = deviation amount A + deviation amount allowable value + correction value
Deviation amount (A + B) <defective product area ≦ deviation amount (A + B + C) = deviation amount detection range + correction value
The first determination unit 203 can independently set different values for the vertical shift amount detection range and the horizontal shift amount detection range. Accordingly, it is possible to set a shift amount detection range that individually corresponds to the shape of the electronic component and the size of the fillet.

  For example, when the amount of component misalignment enters the defective product area and the first determination unit 203 determines that the product is defective, the warning processing unit 204 displays an image of the entire printed circuit board displaying the defective part, an enlarged screen of the defective part, Are combined and sent to the data display unit 206. A data display unit 206, which is a display, displays a composite image. The user can visually compare the composite screen with the registered template, and can determine whether the product is a non-defective product or a defective product by artificial determination. At that time, the user can set the threshold values for the determination in the vertical direction and the horizontal direction by changing values in the library in accordance with the shape and size of the component. By configuring such a line organization and providing warning processing for inspections, instead of dealing with the after-effects of mounting failures due to mounting devices, the trend of mounting device operation is analyzed and predicted in advance, and countermeasures are taken Information that can be provided can be provided to the operator.

  The storage unit 207 stores the shift amount determination result and the shift amount data of the first determination unit 203. The storage unit 207 may further store information including occurrence time, number of cases, images, and other detailed contents. The contents of the data stored in the storage unit 207 can be arbitrarily set according to the result to be obtained by the operator.

  Based on the data from the storage unit 207, the second determination unit 208 indicates that a defective product or warning deviation amount determination result has continuously occurred for a predetermined threshold number of times, or that a defective product or warning deviation amount determination result is present. A second determination result including information indicating that the predetermined number of inspections has accumulated more than a predetermined threshold number of times is output. Instead of this, or in addition to this, the second determination unit 208 generates information indicating that the defective product or warning deviation amount determination result is accumulated more than a predetermined number of times in the number of inspections less than a predetermined threshold number of times. It may be output. The second determination unit 208 detects the tendency of defective products and warnings except for single defective products and warnings.

  The data interface 209 outputs the determination result of the second determination unit 208 and the deviation amount data to the communication path 108. When the second determination unit 208 of the second inspection apparatus outputs a determination result indicating that the component arrangement with a large amount of deviation continues in a certain direction, the first information received via the communication path 108 The mounting apparatus 103 automatically corrects the target position on which the component is placed in a direction in which the amount of deviation decreases. The second determination unit 208 outputs a determination result of the warning level, and the first mounting apparatus 103 corrects the placement position of the component accordingly, so that the first product before the defective product is generated. The setting of the mounting apparatus 103 is appropriately corrected.

  The data interface 209 of the second inspection device 104 transmits the determination result of the second determination unit 208 of the third inspection device 107 and the data of the deviation amount transmitted from the third inspection device 107 via the communication path 108. Receive. The first determination unit 203 of the second inspection apparatus 104 determines that the first mounting apparatus 103 is operating properly (the component is placed at a correct position and a good product is produced). And However, when the second determination unit 208 of the third inspection apparatus 107, which is a subsequent process, outputs a determination result indicating that the component tends to be soldered with its position shifted as a result of reflow, It is considered that the set values for the non-defective product, warning, and defective product determination of the first determination unit 203 of the second inspection apparatus 104 are not appropriate. Based on the determination result of the second determination unit 208 of the third inspection apparatus 107, the correction processing unit 205 sets the determination of the non-defective product, the warning, and the defective product of the first determination unit 203 of the second inspection apparatus 104. A correction value of the value is derived. The first determination unit 203 performs subsequent shift amount determination based on the set value corrected with the correction value.

  The first inspection device 102 and the third inspection device 107 also have the same configuration as the second inspection device 104, and the second inspection device 104 and the second mounting device 105 are each in the second process. The determination result of the determination unit 208 and the data of the deviation amount are transmitted. Based on this information, the pre-printing apparatus 101 and the second mounting apparatus 105 automatically correct the set values (the origin position of the coordinates for determining the solder paste printing position, the component placement position, etc.).

  The first inspection apparatus 102 receives the determination result of the second determination unit 208 of the third inspection apparatus 107 and the data of the deviation amount transmitted from the third inspection apparatus 107 via the communication path 108. It is assumed that the first determination unit 203 of the first inspection apparatus 102 determines that the printing apparatus 101 is operating properly (printing solder paste at the correct position and producing non-defective products). However, when the second determination unit 208 of the third inspection apparatus 107, which is a subsequent process, outputs a determination result that the tendency that the solder position is shifted and not properly soldered continues as a result of reflowing, It is considered that the set values for the non-defective product, the warning, and the defective product determination in the first determination unit 203 of the first inspection apparatus 102 are not appropriate. Based on the determination result of the second determination unit 208 of the third inspection apparatus 107, the correction processing unit 205 sets the determination of the non-defective product, the warning, and the defective product of the first determination unit 203 of the first inspection apparatus 102. A correction value of the value is derived. The first determination unit 203 performs subsequent shift amount determination based on the set value corrected with the correction value.

  Next, the inspection method according to the embodiment will be described. FIG. 4 is a flowchart showing a deviation amount determination processing method of the first determination unit 203 of the inspection apparatus according to the embodiment of the present invention. The first to third inspection apparatuses 102, 104, and 107 execute the common deviation amount determination processing method shown in FIG. A method for determining the amount of deviation of the second inspection apparatus 104 will be described as an example. In FIG. 4, it is determined in step 401 whether or not a threshold value correction process is necessary. If correction processing is necessary, the process proceeds to step 402 to perform correction processing (details will be described in FIG. 5). When the correction process is unnecessary, the process proceeds to steps 403 and 404 to set the warning range threshold and the defect range threshold set for each electronic component.

  In step 405, the first determination unit 203 determines whether the amount of deviation is within a non-defective range (| X | <Xok and | Y | <Yok). If it is within the non-defective range, the process proceeds to step 406 to perform non-defective product processing and proceeds to the next part measurement. If it is out of the non-defective range, the process proceeds to step 407, and the first determination unit 203 determines whether the deviation amount is a value within the warning range (| X | <Xwng and | Y | <Ywng). If it is within the warning range, the process proceeds to step 408 to perform a warning process and proceed to the next component measurement. If it is out of the warning range, the process proceeds to step 409 to perform defect processing and proceed to the next component measurement. In the warning process (step 408) and the defect process (step 409), based on conditions set in advance, an image using time series means and data associated therewith are stored in the storage unit 207 together with the determination result.

FIG. 5 is a flowchart showing a correction processing method (details of step 402) of the correction processing unit 205 of the inspection apparatus according to the embodiment of the present invention. The first to third inspection apparatuses 102, 104, and 107 execute a common correction processing method shown in FIG. The correction processing method of the second inspection apparatus 104 will be described as an example.
Based on the time-series data from the storage unit 207, the second determination unit 208 of the third inspection apparatus 107 indicates that a defective product or warning shift amount determination result has continuously occurred for a predetermined threshold number of times, or has failed. A second determination result including information indicating that the non-defective product or warning shift amount determination result is accumulated at a predetermined number of times more than a predetermined threshold number of times is output. The third inspection apparatus 107 transmits the second determination result, the deviation amount data, and the like via the data interface 209.

  In FIG. 5, in step 501, the second inspection apparatus 104 receives data transmitted from the third inspection apparatus 107 via the data interface 209. In step 502, the correction processing unit 205 extracts the part type and part name included therein from the data transmitted by the third inspection apparatus 107. In step 503, the correction processing unit 205 determines whether there is a part that is the same as the part inspected by the second inspection apparatus 104. If there is no same part, the process proceeds to step 504 to output a message indicating that correction is unnecessary. If there is the same part, the process proceeds to step 505 to determine whether the measurement result of the part is a warning or a defective product. In the case of a warning, the process proceeds to step 506, and a message for confirming the mounting apparatus is displayed on the data display unit 206 to alert the user. In step 508, the user determines whether correction processing is necessary. In step 508, the correction processing unit 205 may determine automatically. When the correction process is unnecessary, this flowchart is ended.

  In the case of a defective product in step 505 and in the case where correction processing is required in step 508, the process proceeds to step 507, and the correction processing unit 205 determines whether the warning or the background of occurrence of defective products is accumulated or continuous (third inspection). (Refer the determination result of the 2nd determination part 208 of the apparatus 107.). In the case of accumulation, the process proceeds to step 510, a message for confirming the occurrence is displayed on the data display unit 206, and the user is warned. In the case of continuous, the process proceeds to step 509, and the correction processing unit 205 calculates the difference amount between the current target position (0 or correction value) and the deviation amount of the third inspection apparatus 107, which is a subsequent process, and the difference A correction value corresponding to the amount is automatically determined, and a new inspection threshold (allowable range) is set.

  In this manner, the failure state of the first mounting apparatus 103 in operation can be determined by arranging the amount of deviation of parts as a time-series change amount, depending on whether it occurs continuously for each product type or when it occurs in a cumulative manner. However, it is possible to quantitatively grasp whether the content is concentrated on the mounting device at a specific location or the content is intermittently generated based on the combined factors. For example, warning determination and defect determination can be performed continuously or cumulatively for each component type, and the data display unit 206 can warn the operator using numerical data or images.

Conventional inspection devices can only determine good or defective products. By inspecting the state of the measurement object and organizing / analyzing the state of the measurement object, the inspection apparatus of the present invention can grasp the state that changes during the operation of the mounting apparatus and can deal with it before making a defect. An inspection apparatus, an inspection system, and an inspection method are realized.
The present invention can shorten the setting time of the inspection range by automatically calculating the inspection allowable range, and the difference from the theoretical setting range becomes clear based on the statistical result of the recognition error. An inspection apparatus, an inspection system, and an inspection method capable of determining a threshold value from a close viewpoint are realized.
The present invention provides an inspection apparatus, an inspection system, and an inspection apparatus that enable an operator to easily identify an abnormal part such as the first mounting apparatus by referring to a display result, and to implement an efficient trouble countermeasure. Realize the inspection method.

  INDUSTRIAL APPLICABILITY The inspection apparatus, inspection system, and inspection method of the present invention are useful as an inspection method and apparatus for inspecting the state of mounted microelectronic components.

Mounting process organization diagram including inspection apparatus according to an embodiment of the present invention The block diagram which shows the structure of the inspection apparatus of embodiment of this invention The figure which shows typically the determination area | region of the inspection apparatus of embodiment of this invention The flowchart which shows the determination method of the test | inspection apparatus of embodiment of this invention The flowchart which shows the correction | amendment method of the inspection apparatus of embodiment of this invention Mounting process organization chart including inspection apparatus of Conventional Example 1 The block diagram which shows the structure of the inspection apparatus of the prior art example 1.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 Printing apparatus 102 1st inspection apparatus 103 1st mounting apparatus 104 2nd inspection apparatus 105 2nd mounting apparatus 106 Reflow furnace 107 3rd inspection apparatus 201 Image taking-in part 202 Detection part 203 1st determination part 204 Warning processing unit 205 Correction processing unit 206, 706 Data display unit 207, 707 Storage unit 208 Second determination unit 209 Data interface 301 Part center position 302 Non-defective region 303 Warning region 304 Defect region 703 Determination unit A Non-defective region size B Warning Area dimension C Defective area dimension

Claims (8)

An image capturing means for capturing an image obtained by printing a solder paste on a printed circuit board, an image in which a component is placed on the printed circuit board, or an image in which a component is soldered on the printed circuit board;
Detecting means for detecting a deviation amount from a target position of a solder paste printing position, a component placement position, or a component soldering position in an image captured from the image capture means;
According to the amount of deviation from the detection means, a non-defective product, a defective product, and a warning indicating that there is a possibility of a defective product or a non-defective product, but is likely to become a defective product when it is slightly shifted. First determination means for outputting at least three types of displacement amount determination results including:
Data display means for displaying the deviation determination result;
An inspection apparatus comprising: 2. The inspection apparatus according to claim 1, wherein the image capturing unit is an image capturing unit that captures an image obtained by printing a solder paste on a printed circuit board or an image in which a component is placed on the printed circuit board. A first inspection apparatus, wherein the means is a detection means for detecting a deviation amount from a target position of a solder paste printing position or a component placement position;
2. The inspection apparatus according to claim 1, wherein the image capturing means is an image capturing means for capturing an image obtained by soldering a component to a printed circuit board, and the detecting means is a target position of a soldering position of the component. A second inspection device which is a detection means for detecting the amount of deviation from
A communication path for transmitting information derived based on a determination result of a deviation amount of the second inspection device from at least the second inspection device to the first inspection device by wired or wireless communication or a medium; ,
Have
The first inspection device corrects a threshold value for the first determination unit to generate the displacement amount determination result based on information derived based on the displacement amount determination result of the second inspection device. And further comprising a correction processing means, wherein the first determination means outputs the deviation amount determination result based on a threshold variable by the correction processing means.
Inspection system characterized by that. The first inspection device or the second inspection device is:
Storage means for storing the determination result of the first determination means of the second inspection apparatus and data associated with the determination result;
Based on the data from the storage means, a defective product or warning deviation amount determination result has continuously occurred for a predetermined threshold number of times, or a defective product or warning deviation amount determination result is a predetermined threshold number of times at a predetermined number of inspections. A second information that includes at least one of the above-described cumulative occurrence and that the defective product or warning deviation amount determination result is accumulated more than a predetermined number of times less than a predetermined threshold number of times. Second determination means for outputting a determination result;
Further comprising
The correction processing means of the first inspection apparatus corrects a threshold value for the first determination means to generate a deviation amount determination result based on the second determination result.
The inspection system according to claim 2.   The inspection system according to claim 3, wherein the data display means of the first inspection device or the second inspection device displays the second determination result. An image capturing step for capturing an image obtained by printing a solder paste on a printed circuit board, an image in which a component is placed on the printed circuit board, or an image in which a component is soldered on the printed circuit board;
A detection step of detecting a deviation amount from a target position of a solder paste printing position, a component placement position, or a component soldering position in the image captured in the image capturing step;
In accordance with the amount of deviation in the detection step, a non-defective product, a defective product, and a warning indicating that there is a possibility of a defective product or a non-defective product but is likely to become a defective product if it is slightly shifted. A first determination step for outputting at least three types of displacement amount determination results;
A data display step for displaying the deviation determination result;
An inspection method characterized by comprising: 6. The inspection method according to claim 5, wherein the image capturing step is an image capturing step for capturing an image in which a solder paste is printed on a printed circuit board or an image in which a component is placed on the printed circuit board. A first inspection method in which the step is a detection step of detecting a deviation amount from a target position of a solder paste printing position or a component placement position;
6. The inspection method according to claim 5, wherein the image capturing step is an image capturing step for capturing an image obtained by soldering a component to a printed circuit board, and the detecting step is a target position of a soldering position of the component. A second inspection method which is a detection step for detecting a deviation amount from
Have
The first inspection method corrects a threshold for the first determination step to generate a displacement amount determination result based on information derived based on the displacement amount determination result of the second inspection method. A correction processing step, wherein the first determination step outputs the deviation amount determination result based on the threshold variable by the correction processing step;
Inspection method characterized by that. A storage step of storing a determination result of the first determination step of the second inspection method and data associated with the determination result;
Based on the data stored in the storage step, a defective product or warning deviation amount determination result has continuously occurred for a predetermined threshold number of times, or a defective product or warning deviation amount determination result is a predetermined threshold value at a predetermined number of inspections. A second information that includes at least one of the following: the occurrence of a cumulative number of times more than the number of times, and the occurrence of a defective product or warning deviation amount determination result that has accumulated more than a predetermined number of times less than a predetermined threshold number of times. A second determination step for outputting the determination result of
Further comprising
The correction processing step of the first inspection method corrects a threshold value for the first determination step to generate a deviation amount determination result based on the second determination result.
The inspection method according to claim 6.   The inspection method according to claim 6, wherein the data display step of the first inspection method or the second inspection method displays the second determination result.

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