JP2019197898A - Component mounting system and component mounting method - Google Patents

Abstract

To provide a component mounting system and component mounting method which can feed back positional deviation information of a component in order to improve the mounting accuracy of a component.SOLUTION: An inspection device M4 for inspecting a substrate to which a component is mounted by component mounting devices M2, M3 (mounting devices) includes: detection parts (inspection processing part 32, inspection camera 33) which detect inspection information 31c having a positional deviation amount of a component mounted on the substrate; a determination part 30a which determines whether or not the detected positional deviation amount is within a prescribed first range; a transmission part 30b which transmits the detected positional deviation amount to the mounting devices; and a determination part 30c which determines whether or not to transmit the detected positional deviation amount to the mounting devices. The determination part 30c reserves transmission of the positional deviation amount to the mounting devices when it is determined that the positional deviation amount is within the first range and a prescribed condition is satisfied.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a component mounting system including an inspection device that inspects a substrate on which a component is mounted, and a component mounting method for mounting a component on a substrate in the component mounting system.

  A component mounting system that manufactures a mounting board by mounting components on a board is used for multiple mounting, such as a solder printing device that prints solder for joining components on the board, and a component mounting device that mounts components on the printed board. Constructed by connecting devices. The board after the component mounting by the component mounting apparatus becomes an inspection target of the inspection apparatus, and the mounting state of the component is inspected by optical inspection or the like. In the component mounting system having such a configuration, correction information for correcting the mounting program of the component mounting apparatus is generated based on component misalignment information obtained by inspecting a board after component mounting, and is fed back. Systems that do this are known. (For example, see Patent Document 1). In the feedback system of Patent Document 1, misalignment information corresponding to each component is accumulated, and the accumulated misalignment information is statistically processed to create correction information.

JP 2014-216353 A

  However, in the prior art including Patent Document 1, since all the obtained correction information is fed back to the component mounting apparatus, when a sudden positional deviation such as a coordinate deviation of a component due to contamination of foreign matter occurs, There is a problem that the mounting accuracy may be lowered by the correction information based on the positional deviation information.

  Accordingly, an object of the present invention is to provide a component mounting system and a component mounting method capable of feeding back component misalignment information for improving component mounting accuracy.

  The component mounting system of the present invention is a component mounting system including a mounting device for mounting a component on a substrate, and an inspection device for inspecting the substrate on which the component is mounted, and a detection unit included in the inspection device A determination unit that determines whether or not a positional deviation amount of the component mounted on the substrate included in the inspection information detected by the inspection information is within a predetermined first range, and based on the detected positional deviation amount, A correction amount calculation unit that calculates a correction amount for the mounting device to correct the mounting position and mount the component on the board; and based on the calculated correction amount, the mounting device detects the mounting position. A determination unit configured to determine whether or not to perform correction, wherein the determination unit determines that the amount of positional deviation is within the first range, and the detected amount of positional deviation is greater than that of the first range. Smaller than a predetermined second range The mounting position is corrected by the mounting apparatus based on the calculated correction amount, the positional deviation amount is determined to be within the first range, and the detected positional deviation is determined. If it is determined that the amount is larger than the second range, the mounting apparatus is suspended from correcting the mounting position based on the calculated correction amount.

  Another component mounting system of the present invention is a component mounting system including a mounting device for mounting a component on a substrate and an inspection device for inspecting the substrate on which the component is mounted. A determination unit that determines whether or not a positional deviation amount of the component mounted on the board included in the inspection information detected by the detection unit is within a predetermined first range, and based on the detected positional deviation amount A correction amount calculation unit that calculates a correction amount for the mounting device to correct the mounting position and mount the component on the substrate; and the mounting device based on the calculated correction amount. A determination unit configured to determine whether or not to correct the position, wherein the determination unit determines that the amount of positional deviation is within the first range, and the detected amount of positional deviation is the first amount. A predetermined second range less than the range If it is determined that the mounting position is smaller, the mounting apparatus is caused to correct the mounting position based on the calculated correction amount, and the positional deviation amount is determined to be within the first range, and the detected position is detected. When the positional deviation amount is larger than the second range, the mounting apparatus is not corrected for the mounting position based on the calculated correction amount.

  The component mounting method of the present invention is a component mounting for mounting the component on the substrate in a component mounting system including a mounting device for mounting the component on the substrate and an inspection device for inspecting the substrate on which the component is mounted. In the inspection apparatus, inspection information including a displacement amount of a component mounted on the board is detected in the inspection device, and the mounting apparatus corrects a mounting position based on the detected displacement amount. Calculating a correction amount for mounting the component on the board, determining whether the detected displacement amount is within a predetermined first range, and detecting the detected displacement amount as the first amount. If it is determined that it is within the range, it is further determined whether or not the detected positional deviation amount satisfies a condition whether it is larger than a predetermined second range smaller than the first range, and satisfies the condition Calculated, The withhold thereby correcting the mounting position on the mounting device on the basis of the correction amount.

  According to another component mounting method of the present invention, the component is mounted on the substrate in a component mounting system including a mounting device for mounting the component on a substrate and an inspection device for inspecting the substrate on which the component is mounted. In the component mounting method, the inspection apparatus detects inspection information including a displacement amount of a component mounted on the board, and the mounting device determines a mounting position based on the detected displacement amount. A correction amount for correcting and mounting the component on the board is calculated, it is determined whether or not the detected positional deviation amount is within a predetermined first range, and the positional deviation amount is determined by the first amount. If it is determined that it is within the range, it is further determined whether or not the detected displacement amount satisfies a condition that is greater than a predetermined second range that is smaller than the first range, and is determined to satisfy the condition. Before the calculated Not correcting the mounting position on the mounting device on the basis of the correction amount.

  According to the present invention, it is possible to feed back component misalignment information for improving component mounting accuracy.

Configuration explanatory diagram of a component mounting system according to an embodiment of the present invention The top view which shows the structure of the component mounting apparatus used for the component mounting system of one embodiment of this invention The fragmentary sectional view of the component mounting apparatus used for the component mounting system of one embodiment of this invention Structure explanatory drawing of the mounting head and component supply part of the component mounting apparatus used for the component mounting system of one embodiment of this invention The block diagram which shows the structure of the control system of the component mounting system of one embodiment of this invention (A) (b) Explanatory drawing of the test | inspection of the mounted components in the test | inspection apparatus of one embodiment of this invention. (A) Explanatory drawing which shows an example of the detection result of the amount of displacement detected in the inspection device of one embodiment of the present invention (b) Explanatory drawing which shows the result of statistical processing The flowchart of the test result transmission method in the test | inspection apparatus of one embodiment of this invention The flowchart of the component mounting method in the component mounting system of one embodiment of this invention The flowchart of the correction amount determination method in the component mounting system of one embodiment of this invention

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The configuration, shape, and the like described below are illustrative examples, and can be appropriately changed according to the specifications of the component mounting system, the component mounting apparatus, and the inspection apparatus. Below, the same code | symbol is attached | subjected to the element which respond | corresponds in all the drawings, and the overlapping description is abbreviate | omitted. In FIG. 2 and a part to be described later, as a biaxial direction orthogonal to each other in a horizontal plane, an X direction (horizontal direction in FIG. 2) of the substrate transport direction and a Y direction (vertical direction in FIG. 2) orthogonal to the substrate transport direction. Is shown. In FIG. 3 and a part to be described later, the Z direction (vertical direction in FIG. 3) is shown as the height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal plane.

  First, the configuration of the component mounting system 1 will be described with reference to FIG. The component mounting system 1 has a function of mounting a component on a substrate to manufacture a mounting substrate, and includes a solder printing device M1, component mounting devices M2 and M3, and an inspection device M4. These devices are connected to the management computer 3 via the communication network 2.

  The solder printing apparatus M1 screen-prints cream solder for component joining on a substrate to be mounted. The component mounting apparatuses M2 and M3 perform a component mounting operation for transporting and mounting the component taken out from the component supply unit onto the board on which the component joining cream solder is printed by the component mounting unit 12 (see FIG. 2). The inspection device M4 inspects the mounting state of the components on the mounted substrate on which the components are mounted by the component mounting devices M2 and M3 (mounting devices), and detects a misalignment state from the correct mounting position. In addition to the line management function, the management computer 3 calculates a correction amount in the component mounting work to be fed back to the component mounting apparatuses M2 and M3 based on the inspection information including the component displacement amount acquired by the inspection apparatus M4. have.

  Next, the configuration of the component mounting apparatuses M2 and M3 will be described with reference to FIGS. FIG. 3 schematically shows the AA cross section in FIG. In FIG. 2, a substrate transport mechanism 5 extending in the X direction is disposed at the center of the upper surface of the base 4. The board transport mechanism 5 transports the board 6 delivered from the upstream device, and positions and holds the board 6 at a mounting work position by the component mounting unit 12 described below.

  A component supply unit 7 is disposed on both sides of the substrate transport mechanism 5. A plurality of tape feeders 8 are arranged in the X direction in the component supply unit 7. The tape feeder 8 pitches the carrier tape holding the component to be mounted, and supplies the component to a component suction position where the mounting head of the component mounting unit 12 sucks the component. A Y-axis beam 9 having a linear drive mechanism extending in the Y direction is disposed on one end in the X direction on the upper surface of the base 4. Two X-axis beams 10 having a linear drive mechanism are coupled to the Y-axis beam 9 so as to be movable in the Y direction. A mounting head 11 is mounted on each of the two X-axis beams 10 so as to be movable in the X direction.

  In FIG. 3, the mounting head 11 includes a plurality of holding heads 11a. At the lower end of each holding head 11a, a mounting nozzle 11b that sucks and holds components and can be raised and lowered individually is mounted.

  In FIG. 2, by driving the Y-axis beam 9 and the X-axis beam 10, the mounting head 11 moves in the X direction and the Y direction. That is, the Y-axis beam 9 and the X-axis beam 10 constitute a moving mechanism that moves the mounting head 11 in the horizontal direction. As a result, the two mounting heads 11 mount the substrate 6 positioned by the substrate transport mechanism 5 by picking and holding the component by the mounting nozzle 11b from the component suction position of the tape feeder 8 of the corresponding component supply unit 7 respectively. Mount in place. The Y-axis beam 9, the X-axis beam 10, and the mounting head 11 constitute a component mounting unit 12 that mounts components on the substrate 6.

  A component recognition camera 13 is disposed between the component supply unit 7 and the board transport mechanism 5. When the mounting head 11 that has taken out a component from the component supply unit 7 moves above the component recognition camera 13, the component recognition camera 13 captures and recognizes the component held by the mounting head 11. A plate recognition camera 14 that is located on the lower surface side of the X-axis beam 10 and moves integrally with the mounting head 11 is mounted on the plate 10a to which the mounting head 11 is attached. As the mounting head 11 moves, the substrate recognition camera 14 moves above the substrate 6 positioned by the substrate transport mechanism 5 and images and recognizes the substrate 6.

  In the component mounting work on the substrate 6 by the mounting head 11, the component recognition result by the component recognition camera 13, the substrate recognition result by the substrate recognition camera 14, and the correction calculated by the component mounting apparatuses M2 and M3 or the management computer 3 The mounting position is corrected in consideration of the amount. As described above, the component mounting apparatuses M2 and M3 include the mounting nozzle 11b for mounting the component on the substrate 6 and the moving mechanism (Y-axis beam 9, X-axis beam 10) for moving the mounting nozzle 11b in the horizontal direction. The mounting apparatus is configured to correct the mounting position based on the correction amount and mount the component on the substrate 6.

  As shown in FIG. 3, a carriage 15 in which a plurality of tape feeders 8 are mounted in advance on a feeder base 15 a is set in the component supply unit 7. In the feeder base 15a, a feeder address for specifying the feeder position where the individual tape feeder 8 is mounted is set. The individual tape feeders 8 set on the feeder base 15a are specified through these feeder addresses. A carriage 15 mounted on the component supply unit 7 holds a supply reel 16 for storing a carrier tape 17 storing components in a wound state. The carrier tape 17 drawn from the supply reel 16 is pitch-fed by the tape feeder 8 to the component suction position by the mounting nozzle 11b.

  Next, the configuration of the mounting head 11 will be described with reference to FIG. The mounting head 11 includes a plurality of holding heads 11a, and each holding head 11a includes a driving mechanism. By driving the drive mechanism, the mounting nozzle 11b attached to the lower end of each holding head 11a can be raised and lowered (arrow b), and the mounting nozzle 11b can be rotated around the nozzle axis AN (arrow c). It has become.

  Next, the configuration of the control system of the component mounting system 1 including the component mounting apparatuses M2 and M3 and the inspection apparatus M4 will be described with reference to FIG. In FIG. 5, the management computer 3, the component mounting apparatuses M <b> 2 and M <b> 3, and the inspection apparatus M <b> 4 are connected via the communication network 2. The component mounting apparatuses M2 and M3 include a mounting control unit 20, a mounting storage unit 21, a component mounting unit 12, a display unit 22, an input unit 23, and a recognition processing unit 24. The mounting storage unit 21 stores a positional deviation amount data 21a and a correction amount 21b in addition to a mounting program and mounting data for executing the component mounting operation described above. The positional deviation amount data 21a includes the positional deviation amount of the component mounted on the board 6 transmitted from the inspection apparatus M4 described later.

  The mounting control unit 20 is an arithmetic device such as a CPU, and controls the following units based on programs and data stored in the mounting storage unit 21 and includes a correction amount calculation unit 20a as an internal processing function. In the correction amount calculation unit 20a, the component mounting apparatuses M2 and M3 (mounting apparatuses) correct the mounting position based on the positional shift amount included in the stored positional shift amount data 21a and mount the component on the board 6. A correction amount calculation process for calculating a correction amount 21b for the purpose is executed. The calculated correction amount 21b is stored in the mounting storage unit 21.

  The input unit 23 is an input device such as a keyboard, a touch panel, or a mouse, and is used when an operation command or data is input. The display unit 22 is a display device such as a liquid crystal panel, and displays various types of information such as misregistration amount data 21 a and correction amount 21 b in addition to various screens such as an operation screen for operation by the input unit 23.

  The recognition processing unit 24 detects the position of the substrate 6 by performing recognition processing on the imaging result obtained by the substrate recognition camera 14. In addition, the recognition processing unit 24 detects the position of the component in the state held by the mounting head 11 by performing recognition processing on the imaging result by the component recognition camera 13. The mounting control unit 20 controls the component mounting unit 12 based on the mounting program, and corrects the mounting position in consideration of the position detection result of the board 6 and the component by the recognition processing unit 24 and the stored correction amount 21b. Perform component mounting work.

  5, the inspection apparatus M4 includes an inspection control unit 30, an inspection storage unit 31, an inspection processing unit 32, a display unit 34, and an input unit 35. The inspection control unit 30 is an arithmetic device such as a CPU, and includes a determination unit 30a, a transmission unit 30b, a determination unit 30c, and a variation calculation unit 30d as internal processing functions. The inspection storage unit 31 is a storage device, and stores mounting data 31a, threshold information 31b, inspection information 31c, statistical information 31d, and the like. The mounting data 31a is data that is referred to when a component is mounted on the substrate 6, and includes information such as the coordinates of the mounting position of the component on the substrate 6, the type of component to be mounted, and the size of the component. Yes.

  The inspection processing unit 32 executes an inspection process for detecting inspection information 31c including a positional deviation amount and a component size of a component mounted on the board 6 to be described later based on an imaging result by the inspection camera 33. That is, the inspection processing unit 32 and the inspection camera 33 serve as a detection unit that detects the inspection information 31c including the amount of displacement of the component mounted on the substrate 6 and the size of the component. The detection result is linked to the component mounting apparatuses M2 and M3, the mounting head 11, the holding head 11a, the mounting nozzle 11b, the tape feeder 8 (feeder address), and the like that are mounted for each component P, and the inspection storage unit as inspection information 31c. 31. That is, the inspection storage unit 31 is an inspection result storage unit that stores the amount of displacement detected by the detection unit (inspection processing unit 32, inspection camera 33).

  Here, referring to FIG. 6A and FIG. 6B, an example of the positional deviation amount of the component mounted on the substrate 6 detected by the detection unit and the size of the component included in the inspection information 31c. explain. First, the displacement amount of a component will be described with reference to FIG. In the component mounting operation, the component P taken out from the tape feeder 8 of the component supply unit 7 by the mounting nozzle 11b of the mounting head 11 is transferred and mounted using the mounting position M set on the substrate 6 as a target position. At this time, the component center C of the component P does not necessarily coincide with the mounting position M correctly, and the positional deviation amount ΔX in the X direction and the positional deviation amount ΔY in the Y direction and the θ direction (the rotation direction in the XY plane). The position is shifted by the amount of shift Δθ.

  The displacement amounts ΔX, ΔY, and Δθ are acquired (detected) by performing recognition processing by the inspection processing unit 32 on the result of imaging the component P mounted on the substrate 6 by the inspection camera 33. The positional deviation amounts ΔX, ΔY, Δθ are positional deviation information of the component P, and the positional deviation amounts ΔX, ΔY, Δθ are acquired and stored as inspection information 31c for a plurality of components P mounted on one substrate 6. .

  Next, the size of the component will be described with reference to FIG. The component size Sx in the X direction and the component size Sy in the Y direction of the component P mounted on the substrate 6 are acquired (detected) by the recognition processing of the imaging result of the inspection camera 33 by the inspection processing unit 32. Is done. When the component P is normally mounted, the detected component sizes Sx, Sy (hereinafter referred to as “detected component sizes Sx *, Sy *”) are the component sizes Sx, Sy included in the mounting data 31a. Matches.

  On the other hand, when the component P is mounted on the substrate 6 in a tilted state, for example, by climbing on the foreign object W in the vicinity of the mounting position M, the detected component sizes Sx * and Sy * are smaller than the component sizes Sx and Sy. Become. In the example of FIG. 6B, the right end of the component P is mounted on the substrate 6 in a state where the right end of the component P is lifted upward (Z direction) by the foreign matter W below the component P. Therefore, the detected component size Sx * in the X direction is detected smaller than the component size Sx by the difference ΔSx. By comparing the detected component sizes Sx * and Sy * detected in this way with the component sizes Sx and Sy included in the mounting data 31a, an abnormal state in which the component P is tilted and mounted on the board 6 is obtained. Can be detected.

  In FIG. 5, the threshold information 31b includes an upper transmission threshold, a lower transmission threshold, an upper warning threshold, a lower warning threshold, a warning range Rs of the component size, and the like. The upper transmission threshold value is a threshold value that prevents the positional deviation amounts ΔX, ΔY, Δθ from being transmitted to the component mounting apparatuses M2, M3 when the detected positional deviation amounts ΔX, ΔY, Δθ exceed this threshold value. The lower transmission threshold value is a threshold value at which the positional deviation amounts ΔX, ΔY, Δθ are not transmitted to the component mounting apparatuses M2, M3 when the detected positional deviation amounts ΔX, ΔY, Δθ are below this threshold value. Between the upper transmission threshold and the lower transmission threshold is a transmission determination range Rt (first range). That is, the positional deviation amounts ΔX, ΔY, Δθ outside the transmission determination range Rt are not transmitted (feedback) to the component mounting apparatuses M2, M3 (mounting apparatus).

  The upper warning threshold value smaller than the upper transmission threshold value suspends transmission of the positional deviation amounts ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3 if the detected positional deviation amounts ΔX, ΔY, Δθ exceed this threshold value (hereinafter referred to as “the upper warning threshold value”). , Referred to as “transmission hold”). The lower warning threshold value that is larger than the lower transmission threshold value is a threshold value for holding the transmission of the positional deviation amounts ΔX, ΔY, Δθ when the detected positional deviation amounts ΔX, ΔY, Δθ exceed this threshold value. A transmission warning range Rw (second range) smaller than the transmission determination range Rt is between the upper warning threshold and the lower warning threshold. The warning range Rs for the size of the component P is a threshold for holding transmission of the positional deviation amounts ΔX, ΔY, Δθ when the detected detected component sizes Sx *, Sy * are outside this range.

  In FIG. 5, the determination unit 30a executes a determination process for determining whether or not the detected positional deviation amounts ΔX, ΔY, Δθ are within the transmission determination range Rt (first range). Further, when the determination unit 30a determines that the positional deviation amounts ΔX, ΔY, Δθ are outside the transmission determination range Rt, the determination unit 30a notifies the display unit 34 to that effect. Note that the determination unit 30a may notify the display unit 22 of the component mounting apparatuses M2 and M3 or the display unit 42 of the management computer 3 described later to that effect.

  The transmission unit 30b executes transmission processing for transmitting the detected positional deviation amounts ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3 (mounting apparatus). Further, the transmission unit 30b transmits the inspection information 31c including the detected positional deviation amounts ΔX, ΔY, Δθ, and the detected component sizes Sx *, Sy * to the management computer 3. The determination unit 30c executes determination processing for determining whether or not to transmit the detected positional deviation amounts ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3 (mounting apparatus).

  The determination unit 30c determines that the positional deviation amounts ΔX, ΔY, Δθ are determined to be within the transmission determination range Rt (first range) by the determination unit 30a and satisfy the predetermined condition described below. The transmission unit 30b suspends transmission of the positional deviation amounts ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3 (mounting apparatuses) (transmission suspension). As a result, even when the positional deviation amounts ΔX, ΔY, Δθ are smaller than the transmission determination range Rt, the positional deviation amounts ΔX, ΔY, Δθ that may reduce the mounting accuracy of the component P are used as they are at the mounting position M. Without being used for correction, the operator can determine the situation and determine whether to use it for correction.

  Alternatively, when the determination unit 30c determines that the positional deviation amounts ΔX, ΔY, Δθ are within the transmission determination range Rt (first range) and satisfies a predetermined condition, the positional deviation amounts ΔX, ΔY, Δθ May not be transmitted to the component mounting apparatuses M2 and M3 (mounting apparatuses). Thereby, the positional deviation amounts ΔX, ΔY, Δθ that may reduce the mounting accuracy of the component P are not used for correcting the mounting position M, and the mounting accuracy of the component P can be improved.

  One of the predetermined conditions is that the detected positional deviation amounts ΔX, ΔY, Δθ are larger than the transmission warning range Rw (second range). Accordingly, when the positional deviation amounts ΔX, ΔY, Δθ suddenly increase and exceed the transmission warning range Rw, the operator can check the situation and make an appropriate determination. One of the predetermined conditions is that the detected component sizes Sx *, Sy * (the detected component size) are outside the component size warning range Rs (predetermined size range). is there. Thereby, when there is a possibility that the component P is inclined and mounted on the board 6, the operator can check the situation and make an appropriate determination. It is also possible to detect when a component P different from the designation is mounted.

  Further, one of the predetermined conditions is that the positional deviation amounts ΔX, ΔY, Δθ detected after transmitting the positional deviation amounts ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3 (mounting apparatuses) (plus, Minus) is the same as the direction of the positional deviation amounts ΔX, ΔY, Δθ before transmission. As a result, when there is a problem that the mounting position M continues to shift to one side in the component mounting apparatuses M2 and M3 or a failure of the detection unit, the worker can check the situation and make an appropriate determination. it can.

  Thus, the predetermined condition is that the detected positional deviation amounts ΔX, ΔY, Δθ are larger than the predetermined transmission warning range Rw (second range) that is smaller than the transmission determination range Rt (first range). The detected component size Sx *, Sy * (detected component size) included in the inspection information 31c is outside the component size warning range Rs (predetermined size range), and the amount of displacement The directions of the positional deviation amounts ΔX, ΔY, Δθ detected after transmitting ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3 (mounting apparatuses) are the directions of the positional deviation amounts ΔX, ΔY, Δθ before transmission. One of the things that doesn't change. That is, the predetermined condition is a condition that may reduce the mounting accuracy of the component P if the inspection information 31c is fed back to the component mounting apparatuses M2 and M3 to correct the mounting position M.

  Here, with reference to FIG. 7A, an example of the detection result of the positional deviation amounts ΔX, ΔY, Δθ will be described. In FIG. 7A, the positional deviation amount ΔX (Y axis) in the X direction of the component P mounted on the substrate 6 is shown in time series (X axis) for each substrate 6 on which the component P is mounted. The board 6 on which the component P is mounted is displayed as the board 6 (1), the board 6 (2),.

  In FIG. 7A, the positional deviation amount ΔX of the substrate 6 (2) exceeds the upper warning threshold value, and the positional deviation amount ΔX of the substrate 6 (4) is lower than the lower warning threshold value, which are outside the transmission warning range Rw. Therefore, the determination unit 30c determines that transmission is suspended. The positional deviation amount ΔX from the board 6 (8) to the board 6 (12) is negative for five consecutive times within the transmission warning range Rw. That is, although the positional deviation amounts ΔX, ΔY, Δθ are fed back and the mounting position M is corrected, the direction of the positional deviation amounts ΔX, ΔY, Δθ before transmission does not change, so that the determination unit 30c determines that transmission is suspended. To be judged. The determination of transmission suspension is not limited to 5 consecutive minus or 5 consecutive plus, and can be set as appropriate, such as 3 times, 4 times, or 6 times or more continuously.

  In FIG. 7A, the positional deviation amount ΔX of the board 6 (5) exceeds the upper transmission threshold value, and the positional deviation amount ΔX of the board 6 (7) is lower than the lower transmission threshold value, each outside the transmission determination range Rt. is there. Therefore, the determination unit 30a determines that the transmission determination range is outside the transmission determination range Rt and notifies the display unit 34 of that fact, and the transmission unit 30b does not transmit the positional deviation amounts ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3.

  In FIG. 5, the variation calculation unit 30d statistically processes the positional deviation amounts ΔX, ΔY, Δθ in the predetermined period stored as the inspection information 31c in the inspection storage unit 31 to perform the variation range of the positional deviation amounts ΔX, ΔY, Δθ. A variation calculation process for calculating Rv is executed. The statistical process is, for example, a process in which a range of ± 3σ of the standard deviation σ calculated from the positional deviation amounts ΔX, ΔY, Δθ in a predetermined period is set as the variation range Rv. FIG. 7B shows the frequency (Y axis) of the positional deviation amount ΔX (X axis) in the X direction of the component P mounted on the substrate 6 and the variation range Rv (± 3σ range) calculated from this distribution. Is shown. As the variation range Rv, other statistics such as a quartile range that is a range from the upper 25% to 75% may be used.

  The determination unit 30c sets one of the predetermined conditions that the positional deviation amounts ΔX, ΔY, and Δθ are outside the variation range Rv, and holds the positional deviation amounts ΔX, ΔY, and Δθ on hold. Thus, a statistical determination is made based on recent detection results (positional deviation amounts ΔX, ΔY, Δθ during a predetermined period), and when the positional deviation amounts ΔX, ΔY, Δθ are large, the operator confirms the situation. Judgment can be made appropriately. That is, the predetermined condition is that the detected positional deviation amounts ΔX, ΔY, Δθ are outside the variation range Rv of the calculated positional deviation amounts ΔX, ΔY, Δθ.

  The input unit 35 is an input device such as a keyboard, a touch panel, or a mouse, and is used when an operation command or data is input. The display unit 34 is a display device such as a liquid crystal panel. In addition to various screens such as an operation screen for operation by the input unit 35, the misalignment amounts ΔX, ΔY, Δθ and the like included in the inspection information 31c and the statistical information 31d are displayed. Displays various information. That is, the inspection apparatus M4 receives the display unit 34 that displays the inspection information 31c and whether or not to transmit the detected positional deviation amounts ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3 (mounting apparatus). The input unit 35 is provided.

  When the determination unit 30c determines that transmission is suspended, the display unit 34 displays the positional deviation amounts ΔX, ΔY, Δθ for which transmission is suspended, and the input unit 35 waits for an instruction to be input. Then, based on the information displayed on the display unit 34, the operator determines whether or not to correct the mounting position M based on the positional deviation amounts ΔX, ΔY, Δθ, and the positional deviation for which transmission has been suspended. Instructs whether or not to send the amounts ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3. That is, when the determination unit 30c determines that transmission of the detected positional deviation amounts ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3 (mounting apparatus) is suspended (transmission suspension), the display unit 34 The misalignment amounts ΔX, ΔY, Δθ for which transmission is suspended are displayed, and the input unit 35 inputs whether or not to transmit the misalignment amounts ΔX, ΔY, Δθ for which transmission has been suspended to the component mounting apparatuses M2, M3. stand by.

  As described above, the inspection apparatus M4 includes a detection unit (inspection processing unit 32, inspection camera 33) that detects the inspection information 31c including the positional deviation amounts ΔX, ΔY, and Δθ of the component P mounted on the substrate 6, and the detection. The component mounting apparatus uses the determination unit 30a for determining whether or not the detected positional deviation amounts ΔX, ΔY, Δθ are within a predetermined transmission determination range Rt (first range), and the detected positional deviation amounts ΔX, ΔY, Δθ. A transmission unit 30b that transmits to M2 and M3 (mounting apparatus) and a determination unit 30c that determines whether or not to transmit the detected positional deviation amounts ΔX, ΔY, and Δθ to the component mounting apparatuses M2 and M3. The board 6 on which the component P is mounted is inspected by the component mounting apparatuses M2 and M3.

  When the determination unit 30c determines that the positional deviation amounts ΔX, ΔY, Δθ are within the transmission determination range Rt and satisfies a predetermined condition, the determination unit 30c determines the positional deviation amounts ΔX, ΔY, Δθ as the component mounting apparatuses M2, M2. Suspend transmission to M3. As a result, the inspection apparatus M4 uses only the component P positional deviation information (positional deviation amounts ΔX, ΔY, Δθ, detected component sizes Sx *, Sy *) that can improve the mounting accuracy of the component P, as the component mounting apparatus M2. , M3 can be fed back.

  In FIG. 5, the management computer 3 includes a management control unit 40, a management storage unit 41, a display unit 42, and an input unit 43. The management control unit 40 is an arithmetic device such as a CPU, and includes a correction amount calculation unit 40a, a determination unit 40b, a transmission unit 40c, a determination unit 40d, and a variation calculation unit 40e as internal processing functions. The management storage unit 41 is a storage device, and stores mounting data 41a, threshold information 41b, inspection information 41c, statistical information 41d, correction amount 41e, and the like.

  The mounting data 41a and the threshold information 41b include information similar to the mounting data 31a and the threshold information 31b stored in the inspection storage unit 31 of the inspection apparatus M4, respectively. In the inspection information 41c, the inspection information 31c detected by the inspection apparatus M4 is transmitted and stored. The correction amount calculation unit 40a has the same function as the correction amount calculation unit 20a included in the component mounting apparatuses M2 and M3. In other words, the correction amount calculation unit 40a uses the component mounting apparatuses M2 and M3 (mounting apparatuses) as the mounting positions M based on the positional deviation amounts ΔX, ΔY, and Δθ included in the inspection information 41c stored in the management storage unit 41. And a correction amount 41e for mounting the component P on the substrate 6 is calculated and stored in the management storage unit 41.

  In FIG. 5, a determination unit 40b, a transmission unit 40c, a determination unit 40d, and a variation calculation unit 40e are based on the inspection information 41c stored in the management storage unit 41, respectively, and the determination unit 30a and the transmission unit 30b included in the inspection apparatus M4. The determination process, the transmission process, the determination process, and the variation calculation process similar to those performed by the determination unit 30c and the variation calculation unit 30d are executed. That is, the determination unit 40b is a component mounted on the board 6 included in the inspection information 41c detected by the detection unit (inspection processing unit 32, inspection camera 33) included in the inspection apparatus M4 and stored in the management storage unit 41. It is determined whether or not the P positional deviation amounts ΔX, ΔY, Δθ are within the transmission determination range Rt (predetermined first range). The statistical information 41d obtained by the variation calculation process by the variation calculation unit 40e is stored in the management storage unit 41.

  The input unit 43 is an input device such as a keyboard, a touch panel, or a mouse, and is used when an operation command or data is input. The display unit 42 is a display device such as a liquid crystal panel, and includes various screens such as an operation screen for operation by the input unit 43, as well as misregistration amounts ΔX, ΔY, and Δθ included in the inspection information 41c and the statistical information 41d. Displays various information.

  Next, in accordance with the flow of FIG. 8, an inspection result transmission method for transmitting inspection results (position displacement amounts ΔX, ΔY, Δθ, etc.) detected by the inspection device M4 to the component mounting devices M2, M3 will be described. The inspection by the inspection apparatus M4 is performed on a plurality of components P mounted on each substrate 6, and after determining whether or not to transmit (feedback) the inspection results, the components mounted with the components P, respectively. It is transmitted (feedback) to the mounting apparatuses M2 and M3. For convenience, the following description is limited to one component P mounted (mounted) on the substrate 6.

  First, the detection unit (inspection processing unit 32, inspection camera 33) executes inspection processing, and includes positional deviation amounts ΔX, ΔY, Δθ of the component P mounted on the substrate 6 and detection component sizes Sx *, Sy *. Inspection information 31c is detected (ST1). Next, the variation calculation unit 30d executes variation calculation processing, and statistically processes the stored positional deviation amounts ΔX, ΔY, Δθ for a predetermined period to calculate a variation range Rv of the positional deviation amounts ΔX, ΔY, Δθ (ST2). ).

  Next, the determination unit 30a executes a determination process to determine whether or not the detected positional deviation amounts ΔX, ΔY, Δθ are within a predetermined transmission determination range Rt (first range) (ST3). When the positional deviation amounts ΔX, ΔY, Δθ are not within the transmission determination range Rt (No in ST3) (board 6 (5), board 6 (7) in FIG. 7A), the display unit 34 indicates that (error ) Is notified (ST4). The component mounting apparatuses M2 and M3 (mounting apparatuses) are not allowed to transmit the positional deviation amounts ΔX, ΔY, and Δθ. When the positional deviation amounts ΔX, ΔY, Δθ are within the transmission determination range Rt (Yes in ST3), the determination unit 30a executes a determination process, and the detected positional deviation amounts ΔX, ΔY, Δθ are transmitted in the transmission warning range Rw (first (Range of 2) is determined whether or not (ST5).

  In FIG. 8, when the positional deviation amounts ΔX, ΔY, Δθ are not outside the transmission warning range Rw (No in ST5), the determination unit 30a detects the detected component sizes Sx *, Sy * (the detected component P size Sx). , Sy) is determined whether it is outside the warning range Rs (predetermined size range) of the size of the component P (ST6). When the detected component sizes Sx * and Sy * are not outside the warning range Rs of the size of the component P (No in ST6), the determination unit 30a executes determination processing, and the positional deviation amounts ΔX, ΔY, and Δθ are component mounting apparatuses. Whether or not the directions of the positional deviation amounts ΔX, ΔY, Δθ of the component P on the board 6 on which the component P is mounted after being transmitted (feedback) to M2 and M3 and correcting the mounting position M are the same as before transmission (feedback). Is determined (ST7).

  If the corrected misregistration amounts ΔX, ΔY, Δθ are not in the same direction (No in ST7), the determination unit 30a executes a determination process to determine whether the misregistration amounts ΔX, ΔY, Δθ are within the variation range Rv. It is determined whether or not (ST8). When the positional deviation amounts ΔX, ΔY, Δθ are within the variation range Rv (Yes in ST8), the determination unit 30c executes a determination process and determines that the predetermined condition is not satisfied. Then, the transmission unit 30b executes a transmission process to transmit (feedback) the positional deviation amounts ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3 on which the component P is mounted (ST9). The received component mounting apparatuses M2 and M3 store the received misregistration amounts ΔX, ΔY, and Δθ as misregistration amount data 21a, and the correction amount calculation unit 20a calculates the correction amount 21b so that the mounting position M of the component P is obtained. Is corrected.

  Thus, the detected positional deviation amounts ΔX, ΔY, Δθ are within the transmission warning range Rw and the variation range Rv, and the detected component sizes Sx *, Sy * are within the warning range Rs of the size of the component P. Further, when the corrected positional deviation amounts ΔX, ΔY, Δθ are not in the same direction (when a predetermined condition is not satisfied), the positional deviation amounts ΔX, ΔY, Δθ are transmitted (feedback) to the component mounting apparatuses M2, M3. Is done. As a result, only the position shift information (position shift amounts ΔX, ΔY, Δθ) of the component P that can improve the mounting accuracy of the component P can be fed back (transmitted) to the component mounting apparatuses M2, M3.

  In FIG. 8, when the detected positional deviation amounts ΔX, ΔY, Δθ are outside the transmission warning range Rw (Yes in ST5) (substrate 6 (2), substrate 6 (4) in FIG. 7A), or When the detected component sizes Sx *, Sy * are outside the warning range Rs of the size of the component P (Yes in ST6), or the directions of the positional deviation amounts ΔX, ΔY, Δθ are the same even after correction (Yes in ST7) (Substrate 6 (8) to Substrate 6 (12) in FIG. 7A), or when the positional deviation amounts ΔX, ΔY, Δθ are not within the variation range Rv (No in ST8), determination processing by the determination unit 30c Therefore, it is determined that a predetermined condition is satisfied. Then, the determination unit 30c suspends transmission of the positional deviation amounts ΔX, ΔY, Δθ.

  That is, when it is determined that the predetermined condition is satisfied, transmission (feedback) of the detected positional deviation amounts ΔX, ΔY, Δθ to the component mounting apparatuses M2, M3 (mounting apparatus) is suspended. Then, the display unit 34 displays the information on the component P and the detected displacement amounts ΔX, ΔY, Δθ (ST10), and the input unit 35 waits for an instruction input by the operator (ST11).

  When the operator who has confirmed the information displayed on the display unit 34 determines that the detected positional deviation amounts ΔX, ΔY, Δθ are to be transmitted (feedback) (Yes in ST11), the process proceeds to (ST9) and is performed by the transmitting unit 30b. The detected positional deviation amounts ΔX, ΔY, Δθ are transmitted to the component mounting apparatuses M2, M3 on which the component P is mounted. On the other hand, the displacements ΔX, ΔY, Δθ detected by the operator are determined to be caused by a sudden event such as a suction error by the mounting nozzle 11b or a foreign matter W on the substrate 6, and the displacements ΔX, ΔY, Δθ. Is determined not to be transmitted (No in ST11), the positional deviation amounts ΔX, ΔY, Δθ are not transmitted to the component mounting apparatuses M2, M3 (ST12). Thereby, it is possible to prevent the mounting accuracy of the component P from being lowered.

  Next, a component mounting method for mounting the component P on the substrate 6 in the component mounting system 1 including the component mounting apparatuses M2 and M3 (mounting apparatus) and the inspection apparatus M4 will be described in accordance with the flow of FIGS. To do. For convenience, the following description is limited to one component P mounted (mounted) on the substrate 6.

  In FIG. 9, the component mounting apparatuses M2 and M3 mount the component P on the board 6 by correcting the mounting position M in consideration of the correction amount 21b (ST21). Thereafter, the board 6 on which the component P is mounted is conveyed to the inspection apparatus M4, where the inspection information 31c is detected by the inspection apparatus M4 and transmitted to the management computer 3, and the correction amount 41e is determined by the management computer 3 (ST22: Correction amount determination step). The determined correction amount 41e is transmitted (feedback) to the component mounting apparatuses M2 and M3 and stored in the mounting storage unit 21 as the correction amount 21b. In (ST21), the mounting position M is corrected and the component P is mounted.

  Next, the details of the correction amount determination step (ST22) (correction amount determination method) will be described with reference to FIG. First, in the inspection apparatus M4 to which the board 6 is conveyed, the inspection information 31c including the positional deviation amounts ΔX, ΔY, Δθ of the component P mounted on the board 6 is detected (detection step). Then, the inspection information 31c is transmitted to the management computer 3 by the transmission unit 30b, and is stored in the management storage unit 41 as the inspection information 41c in the management computer 3 (ST31). The following processing is executed in the management computer 3.

  The correction amount calculation unit 40a executes correction amount calculation processing, and the component mounting devices M2, M3 (mounting devices) based on the positional deviation amounts ΔX, ΔY, Δθ detected by the inspection device M4 included in the inspection information 41c. Corrects the mounting position M and calculates a correction amount 41e for mounting the component P on the board 6 (ST32: correction amount calculating step). Next, the variation calculation unit 40e executes variation calculation processing, and statistically processes the positional deviation amounts ΔX, ΔY, Δθ in a predetermined period to calculate a variation range Rv of the positional deviation amounts ΔX, ΔY, Δθ (ST33: Variation calculation). Process).

  In FIG. 10, the determination unit 40b executes a determination process to determine whether or not the detected positional deviation amounts ΔX, ΔY, Δθ are within the transmission determination range Rt (predetermined first range) (ST34). When the positional deviation amounts ΔX, ΔY, Δθ are not within the transmission determination range Rt (No in ST34), the display unit 42 notifies that (error) (ST35). Then, the component mounting apparatuses M2 and M3 (mounting apparatuses) do not transmit the correction amount 41e or the positional deviation amounts ΔX, ΔY, and Δθ. When the positional deviation amounts ΔX, ΔY, Δθ are within the transmission determination range Rt (Yes in ST34), the determination unit 40b executes a determination process, and the detected positional deviation amounts ΔX, ΔY, Δθ are transmitted in the transmission warning range Rw (first). 2), it is determined whether or not (ST36).

  When the positional deviation amounts ΔX, ΔY, Δθ are not outside the transmission warning range Rw (No in ST36), the determination unit 40b executes a determination process to detect the detected component sizes Sx *, Sy * (the size of the detected component P). It is determined whether or not Sx, Sy) is outside the warning range Rs (predetermined size range) of the size of the component P (ST37). When the detected component sizes Sx * and Sy * are not outside the warning range Rs of the size of the component P (No in ST37), the determination unit 40b executes determination processing, and the positional deviation amounts ΔX, ΔY, and Δθ are component mounting apparatuses. Whether or not the directions of the positional deviation amounts ΔX, ΔY, Δθ of the component P on the board 6 on which the component P is mounted after being transmitted (feedback) to M2 and M3 and correcting the mounting position M are the same as before transmission (feedback). Is determined (ST38).

  In FIG. 10, when the corrected misregistration amounts ΔX, ΔY, and Δθ are not in the same direction (No in ST38), the determination unit 40b executes a determination process, and the misregistration amounts ΔX, ΔY, and Δθ vary within the variation range Rv. It is determined whether it is within (ST39). When the positional deviation amounts ΔX, ΔY, Δθ are within the variation range Rv (Yes in ST39), the determination unit 40d performs determination processing and determines that the predetermined condition is not satisfied. Then, the transmission unit 40c executes transmission processing, and transmits (feeds back) the correction amount 41e to the component mounting apparatuses M2 and M3 on which the component P is mounted (ST40). In the received component mounting apparatuses M2 and M3, the received correction amount 41e is stored as the correction amount 21b, and the mounting position M of the component P is corrected.

  Thus, the detected positional deviation amounts ΔX, ΔY, Δθ are within the transmission warning range Rw and the variation range Rv, and the detected component sizes Sx *, Sy * are within the warning range Rs of the size of the component P. Further, when the corrected positional deviation amounts ΔX, ΔY, Δθ are not in the same direction (when a predetermined condition is not satisfied), the correction amount 41e is transmitted (feedback) to the component mounting apparatuses M2, M3. As a result, only the positional deviation information (correction amount 41e) of the component P that can improve the mounting accuracy of the component P can be fed back (transmitted) to the component mounting apparatuses M2 and M3.

  In FIG. 10, when the detected positional deviation amounts ΔX, ΔY, Δθ are outside the transmission warning range Rw (Yes in ST36), or the detected component sizes Sx *, Sy * are outside the warning range Rs where the size of the component P is present. (Yes in ST37), or after correction, the direction of the positional deviation amounts ΔX, ΔY, Δθ is the same (Yes in ST38), or the positional deviation amounts ΔX, ΔY, Δθ are not within the variation range Rv. (No in ST39), it is determined that the predetermined condition is satisfied by the determination process by the determination unit 40d. The determination unit 40d suspends transmission of the correction amount 41e or the positional deviation amounts ΔX, ΔY, Δθ.

  That is, when the detected positional deviation amounts ΔX, ΔY, Δθ are determined to be within the transmission determination range Rt (first range), it is further determined whether or not a predetermined condition is satisfied, and if the predetermined condition is satisfied If it is determined, the component mounting apparatuses M2 and M3 (mounting apparatuses) are suspended from correcting the mounting position M based on the calculated correction amount 41e.

  Then, the display unit 42 displays information on the component P and the calculated correction amount 41e or the detected displacement amounts ΔX, ΔY, Δθ (ST41), and the input unit 43 waits for an instruction input by the operator (ST41). ST42). That is, when the component mounting apparatuses M2 and M3 (mounting apparatuses) hold the correction of the mounting position M, the correction amount 41e or the positional deviation amount ΔX, ΔY and Δθ are displayed, and the system waits for an input from the input unit 43 as to whether or not the component mounting apparatuses M2 and M3 are to correct the mounting position M based on the correction amount 41e that is reserved to be corrected.

  In FIG. 10, when the operator who has confirmed the information displayed on the display unit 42 determines to transmit (feedback) the calculated correction amount 41e (Yes in ST42), the process proceeds to (ST40) and is transmitted by the transmission unit 40c. The correction amount 41e or the positional deviation amounts ΔX, ΔY, Δθ is transmitted to the component mounting apparatuses M2, M3 on which the component P is mounted.

  On the other hand, the operator determines that the correction amount 41e or the positional deviation amounts ΔX, ΔY, Δθ is caused by a sudden event such as a suction error by the mounting nozzle 11b or a foreign matter W on the substrate 6, and the correction amount 41e or the positional deviation amount. If it is determined not to transmit ΔX, ΔY, Δθ (No in ST42), the correction amount 41e or the positional deviation amounts ΔX, ΔY, Δθ are not transmitted to the component mounting apparatuses M2, M3 (ST43). That is, when it is determined that the predetermined condition is satisfied, the component mounting apparatuses M2 and M3 (mounting apparatuses) are not corrected for the mounting position M based on the calculated correction amount 41e. Thereby, it is possible to prevent the mounting accuracy of the component P from being lowered.

  As described above, in the component mounting method of the present embodiment, the inspection information M including the positional deviation amounts ΔX, ΔY, Δθ of the component P mounted on the substrate 6 is detected in the inspection apparatus M4. Then, based on the detected positional deviation amounts ΔX, ΔY, Δθ, the component mounting apparatuses M2, M3 (mounting apparatuses) correct the mounting position M and use the correction amount 41e for mounting the component P on the substrate 6. It is calculated and determined whether or not the detected positional deviation amounts ΔX, ΔY, Δθ are within the transmission determination range Rt (predetermined first range), and the detected positional deviation amounts ΔX, ΔY, Δθ are the transmission determination range. If it is determined that it is within Rt, it is further determined whether or not a predetermined condition is satisfied. If it is determined that the predetermined condition is satisfied, the mounting positions of the component mounting apparatuses M2 and M3 are determined based on the calculated correction amount 41e. It is pending to correct M.

  As a result, the correction amount 41e based on the suddenly large misalignment amounts ΔX, ΔY, Δθ that may reduce the mounting accuracy of the component P is not fed back to the component mounting apparatuses M2, M3, and the mounting of the component P is performed. Only the positional deviation information (correction amount 41e) of the component P for improving the accuracy can be fed back (transmitted).

  The determination of the correction amount 41e is not limited to execution by the management computer 3. For example, in the inspection apparatus M4, detection, determination processing, determination processing, variation calculation processing, and transmission processing of the inspection information 31c are executed, and the positional deviation of the component P that does not satisfy a predetermined condition (improves mounting accuracy of the component P) The information (positional deviation amounts ΔX, ΔY, Δθ) may be transmitted to the component mounting apparatuses M2 and M3, and the correction amount calculation process may be executed in the component mounting apparatuses M2 and M3 to calculate the correction amount 21b.

  Further, the execution of the variation calculation process (ST2 in the inspection result transmission method, ST33 in the correction amount determination method) is not limited to the determination process. If the variation calculation process has been executed before determining whether the detected positional deviation amounts ΔX, ΔY, Δθ are within the variation range Rv (ST8 in the inspection result transmission method, ST39 in the correction amount determination method). Good.

  INDUSTRIAL APPLICABILITY The component mounting system and the component mounting method of the present invention have an effect of being able to feed back component positional deviation information for improving component mounting accuracy, and are useful in the component mounting field for mounting components on a board. is there.

1 Component mounting system 6 Substrate P Component Sx *, Sy * Detection component size ΔX, ΔY, Δθ Misalignment

Claims (16)

A component mounting system comprising a mounting device for mounting a component on a substrate, and an inspection device for inspecting the substrate on which the component is mounted,
A determination unit that determines whether or not a positional deviation amount of the component mounted on the substrate included in the inspection information detected by the detection unit included in the inspection apparatus is within a predetermined first range;
A correction amount calculation unit that calculates a correction amount for mounting the component on the substrate by correcting the mounting position by the mounting apparatus based on the detected displacement amount;
A determination unit that determines whether to allow the mounting apparatus to correct the mounting position based on the calculated correction amount;
When the determination unit determines that the displacement amount is within the first range and the detected displacement amount is smaller than a predetermined second range that is smaller than the first range, the calculation is performed. Based on the corrected amount, the mounting apparatus corrects the mounting position, the positional displacement amount is determined to be within the first range, and the detected positional displacement amount is the second amount. A component mounting system that suspends causing the mounting apparatus to correct the mounting position based on the calculated correction amount when it is determined that it is larger than the range.   When the determination unit determines that the size of the detected component included in the inspection information is outside a predetermined size range, the mounting unit is mounted on the mounting apparatus based on the calculated correction amount. The component mounting system according to claim 1, wherein the correction of the position is suspended.   The determination unit satisfies a condition that a direction of the positional deviation amount detected after transmitting the positional deviation amount to the mounting apparatus is not different from a direction of the positional deviation amount before transmission. 3. The component mounting system according to claim 1, wherein when the determination is made, the mounting apparatus is suspended from correcting the mounting position based on the calculated correction amount. A display unit for displaying the inspection information or the correction amount;
An input unit for inputting whether or not to cause the mounting apparatus to correct the mounting position based on the calculated correction amount;
When the determination unit suspends the mounting apparatus from correcting the mounting position based on the calculated correction amount,
The display unit displays the correction amount or the positional deviation amount that is suspended to be corrected,
4. The component according to claim 1, wherein the input unit waits for an input as to whether or not to cause the mounting apparatus to correct the mounting position based on the correction amount suspended to be corrected. 5. Implementation system. An inspection result storage unit that stores the amount of displacement detected by the detection unit;
A variation calculating unit that statistically processes the amount of misregistration stored for a predetermined period and calculates a variation range of the amount of misregistration;
When the determination unit determines that the detected displacement amount is outside the range of the calculated variation in the displacement amount, the mounting unit adds the mounting position to the mounting apparatus based on the calculated correction amount. The component mounting system according to any one of claims 1 to 4, wherein the correction is suspended. A component mounting system comprising a mounting device for mounting a component on a substrate, and an inspection device for inspecting the substrate on which the component is mounted,
A determination unit that determines whether or not a positional deviation amount of the component mounted on the substrate included in the inspection information detected by the detection unit included in the inspection apparatus is within a predetermined first range;
A correction amount calculation unit that calculates a correction amount for mounting the component on the substrate by correcting the mounting position by the mounting apparatus based on the detected displacement amount;
A determination unit that determines whether to allow the mounting apparatus to correct the mounting position based on the calculated correction amount;
When the determination unit determines that the displacement amount is within the first range and the detected displacement amount is smaller than a predetermined second range that is smaller than the first range, the calculation is performed. Based on the corrected amount, the mounting apparatus corrects the mounting position, the positional displacement amount is determined to be within the first range, and the detected positional displacement amount is the second amount. A component mounting system that does not cause the mounting apparatus to correct the mounting position based on the calculated correction amount when larger than the range.   When the determination unit determines that the size of the detected component included in the inspection information is outside a predetermined size range, the mounting unit is mounted on the mounting apparatus based on the calculated correction amount. The component mounting system according to claim 6, wherein the position is not corrected.   The determination unit detects the direction of the displacement amount detected after the mounting apparatus corrects the mounting position based on the calculated correction amount and mounts the component before the correction. The apparatus according to claim 6 or 7, wherein the mounting position is not corrected by the mounting apparatus based on the calculated correction amount, which is determined to satisfy a condition that is any one of the directions of the positional deviation amount. Component mounting system. A component mounting method for mounting the component on the substrate in a component mounting system comprising a mounting device for mounting the component on a substrate, and an inspection device for inspecting the substrate on which the component is mounted,
In the inspection apparatus, detecting inspection information including a positional deviation amount of a component mounted on the substrate,
Based on the detected displacement amount, the mounting apparatus corrects the mounting position and calculates a correction amount for mounting the component on the board,
Determining whether the detected amount of positional deviation is within a predetermined first range;
When it is determined that the detected positional deviation amount is within the first range, a condition that the detected positional deviation amount is greater than a predetermined second range that is smaller than the first range is further satisfied. Whether or not
A component mounting method that suspends the mounting apparatus from correcting the mounting position based on the calculated correction amount when it is determined that the condition is satisfied. When it is determined that the detected positional deviation amount is within the first range, the detected component size in which the detected positional deviation amount is included in the inspection information is a predetermined size. Further determine whether it is out of range or not,
The component mounting method according to claim 9, wherein when it is determined that the condition is satisfied, the mounting apparatus is suspended from correcting the mounting position based on the calculated correction amount. When it is determined that the detected positional deviation amount is within the first range, the mounting apparatus further corrects the mounting position based on the correction amount for which the detected positional deviation amount is calculated. Further determining whether or not the direction of the positional deviation amount detected after mounting the component satisfies a condition that does not change from the direction of the positional deviation amount detected before correction,
11. The component mounting method according to claim 9, wherein, when it is determined that the condition is satisfied, the mounting apparatus is suspended from correcting the mounting position based on the calculated correction amount. A display unit for displaying the inspection information or the correction amount;
An input unit for inputting whether or not to cause the mounting apparatus to correct the mounting position based on the calculated correction amount;
When the mounting apparatus is suspended to correct the mounting position, the correction amount or the positional deviation amount that is suspended is displayed on the display unit,
12. The component mounting method according to claim 9, wherein the component mounting method waits for an input as to whether or not the mounting apparatus is to correct the mounting position based on the correction amount with which correction is suspended. . Statistically processing the positional deviation amount for a predetermined period to calculate a variation range of the positional deviation amount,
When it is determined that the positional deviation amount is within the first range, it is further determined whether the detected positional deviation amount is outside a range of the calculated deviation of the positional deviation amount,
When it is determined that the detected displacement amount is outside the range of the calculated displacement amount, the mounting apparatus is caused to correct the mounting position based on the calculated correction amount. The component mounting method according to claim 9, wherein the method is suspended. A component mounting method for mounting the component on the substrate in a component mounting system comprising a mounting device for mounting the component on a substrate, and an inspection device for inspecting the substrate on which the component is mounted,
In the inspection apparatus, detecting inspection information including a positional deviation amount of a component mounted on the substrate,
Based on the detected displacement amount, the mounting apparatus corrects the mounting position and calculates a correction amount for mounting the component on the board,
Determining whether the detected amount of positional deviation is within a predetermined first range;
When it is determined that the positional deviation amount is within the first range, it is further determined whether or not the detected positional deviation amount satisfies a condition that is greater than a predetermined second range that is smaller than the first range. And
A component mounting method that does not cause the mounting apparatus to correct the mounting position based on the calculated correction amount when it is determined that the condition is satisfied. When it is determined that the detected positional deviation amount is within the first range, the detected component size in which the detected positional deviation amount is included in the inspection information is a predetermined size. Further determine whether it is out of range or not,
The component mounting method according to claim 14, wherein, when it is determined that the condition is satisfied, the mounting position is not corrected by the mounting apparatus based on the calculated correction amount. When it is determined that the detected positional deviation amount is within the first range, the mounting apparatus further corrects the mounting position based on the correction amount for which the detected positional deviation amount is calculated. Further determining whether or not the direction of the positional deviation amount detected after mounting the component satisfies a condition that does not change from the direction of the positional deviation amount detected before correction,
The component mounting method according to claim 14 or 15, wherein, when it is determined that the condition is satisfied, the mounting position is not corrected by the mounting apparatus based on the calculated correction amount.

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