CN107567275A - Component is positioned over the method, apparatus and component patch/inserter of substrate - Google Patents
Component is positioned over the method, apparatus and component patch/inserter of substrate Download PDFInfo
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- CN107567275A CN107567275A CN201710859970.0A CN201710859970A CN107567275A CN 107567275 A CN107567275 A CN 107567275A CN 201710859970 A CN201710859970 A CN 201710859970A CN 107567275 A CN107567275 A CN 107567275A
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Abstract
The invention provides the method, apparatus and component patch/inserter that a kind of component is positioned over substrate, wherein, the method that component is positioned over substrate includes：The positional information of component pick device corresponding to the attribute information and the component to be placed of component placement region attribute information, component to be placed on acquisition substrate, the total displacement of component to be placed movement and/or total duration corresponding to different orders are calculated, selects the component movement total displacement to be placed and/or the most short placement order of total duration as current placement order；Placed according to component corresponding to the pickup of component pick device described in the current placement sequential control.Optimize the path of component, the efficiency that component is positioned over substrate can be improved.So as to improve the efficiency of assembling of electronic product, production capacity is lifted.
Description
Technical field
The present invention relates to electronic assemblies technical field, and in particular to the method, apparatus of substrate is positioned over to a kind of component
And component patch/inserter.
Background technology
At present, with hyundai electronicses component to miniaturization, integrated and high reliability direction develop, particularly in face of day
Beneficial fierce market competition, the production of electronic product and manufacturing equipment are complete just towards high speed, high accuracy, intellectuality, multi-functional etc.
Automation direction develops.
Component is placed on substrate predeterminated position as a ring important in the production and manufacture of electronic product, for example,
Component is mounted, component inserting etc., and production capacity can be improved by improving component placement efficiency, production cost be reduced, existing
Have and component placement efficiency is improved in technology generally by adjustment feeder（Feeder）Position relationship, smaller component picks up
The moving displacement of device is taken, after feeder position determination, component to be placed is determined according to component relative position to be placed
Placement order, find an element nearest apart from a upper component to be placed, in this, as the next member to be placed
Device.
However, larger in substrate size, it is necessary to which the component locations placed are more, when distant, component pickup fills
The time for putting the motion on substrate has a great influence to component placement efficiency, passes through the phase of component to be placed in the prior art
Motion path and component placement order to position optimization component pick device, efficiency is placed for improving component
Improve unobvious.
Therefore, how improving component and being positioned over substrate efficiency turns into urgent problem to be solved.
The content of the invention
The technical problem to be solved in the present invention is to improve the efficiency that component is positioned over substrate.
According in a first aspect, the embodiments of the invention provide a kind of method that component is positioned over substrate, component passes through
Component pick device picks up and inserts or be mounted on to be comprised the following steps on the predeterminable area of substrate：Obtain first device on substrate
Part placement region attribute information；Obtain component to be placed attribute information and component to be placed corresponding to component pickup
The positional information of device；According to placement region attribute information, the attribute information of component to be placed and component pick device
The total displacement of component movement to be placed and/or total duration corresponding to positional information calculation difference placement order；Select to be placed
Component move total displacement and/or total duration it is most short placement order as current placement order；Controlled according to current placement order
Component corresponding to component pick device pickup processed is placed.
Alternatively, placement region attribute information includes：The positional information of placement region；The component obtained on substrate is placed
Area attribute information includes：Obtain substrate positioning point coordinates；Obtain component placement region coordinate；According to positioning point coordinates and put
Put the positional information that area coordinate determines placement region.
Alternatively, placement region attribute information includes：The positional information of placement region and the angle information of placement region；Treat
Placing the attribute information of component includes：The angle information of the positional information of component to be placed and component to be placed；According to
Placement region attribute information, the attribute information of component to be placed are different with the positional information calculation of component pick device to be placed
The total displacement of component movement to be placed and/or total duration include corresponding to order：According to position of the placement region on substrate
Information and the positional information of component to be placed determine the distance of component to be placed and placement region；According to the angle of placement region
The angle information of degree information and component to be placed confirms anglec of rotation when component is placed；According to component to be placed with putting
Put the positional information calculation member to be placed of component pick device corresponding to the distance, the anglec of rotation and component to be placed in region
The total displacement of device movement and/or total duration.
Alternatively, component to be placed movement total displacement and/or the most short placement order of total duration is selected to include：Selection member
Device move total displacement and/or total duration it is most short placement order as placement to be determined order；Judge placement order to be determined
Whether corresponding total displacement and/or total duration are less than total displacement and/or total duration corresponding to default placement order；Put when to be determined
When putting total displacement corresponding to order and/or total duration less than total displacement corresponding to default placement order and/or total duration, it will treat really
Placement order is determined as current placement order.
Alternatively, when the corresponding mobile total displacement of placement to be determined order and/or total duration are corresponding more than default placement order
Total displacement and/or during total duration, the placement order that will prestore as current placement sequentially.
Alternatively, include before the component placement region attribute information on substrate is obtained：Obtain component and place number
According to；The type and quantity of component to be placed are determined according to placement data.
According to second aspect, the embodiments of the invention provide the device that a kind of component is positioned over substrate, including：First obtains
Modulus block, for obtaining the component placement region attribute information on substrate；Second acquisition module, for obtaining first device to be placed
The positional information of component pick device corresponding to the attribute information of part and component to be placed；Computing module, for basis
Placement region attribute information, the attribute information of component to be placed are different with the positional information calculation of component pick device to be placed
The total displacement of component movement to be placed and/or total duration corresponding to order；Order confirms module, for selecting first device to be placed
Part move total displacement and/or total duration it is most short placement order as current placement order；Control placement module, for according to work as
Component corresponding to preceding placement sequential control component pick device pickup is placed.
Alternatively, placement region attribute information includes：The positional information of placement region；First acquisition module includes：First
Acquiring unit, for obtaining substrate positioning point coordinates；Second acquisition unit, for obtaining component placement region coordinate；Position
Determining unit, for determining position of the placement region on substrate according to positioning point coordinates and placement region coordinate.
Alternatively, placement region attribute information includes：The angle of positional information and placement region of the placement region on substrate
Spend information；The positional information of component to be placed includes：The angle of the positional information of component to be placed and component to be placed
Information；Computing module includes：Distance determining unit, for according to positional information of the placement region on substrate and first device to be placed
The positional information of part determines the distance of component to be placed and placement region；Angle determination unit, for according to placement region
The angle information of angle information and component to be placed confirms anglec of rotation when component is placed；Computing unit, for basis
The position of component to be placed component pick device corresponding with the distance, the anglec of rotation and component to be placed of placement region
Information calculates total displacement and/or the total duration of component movement to be placed.
According to the third aspect, the embodiments of the invention provide a kind of component patch/inserter, including：Component patch/plug-in unit
Machine body；Controller, including：At least one processor；And the memory being connected with least one processor communication；Wherein,
Memory storage, which has, to be instructed by the instruction of a computing device by least one computing device, so that at least one place
Reason device performs the method that the component as described in above-mentioned first aspect any one is positioned over substrate.
According to fourth aspect, the embodiments of the invention provide a kind of non-transient storage media, non-transient computer is readable to deposit
Storage media stores computer instruction, and computer instruction is used to make computer perform the member as described in above-mentioned first aspect any one
The method that device is positioned over substrate.
A kind of computer program product is provided according to the 5th aspect, computer program product includes being stored in non-transient meter
Calculation procedure on calculation machine readable storage medium storing program for executing, computer program include programmed instruction, when programmed instruction is computer-executed,
Computer is set to perform the method that the component as described in above-mentioned first aspect any one is positioned over substrate.
Component provided in an embodiment of the present invention is positioned over the method, apparatus and component patch/inserter of substrate, obtains base
Corresponding to the attribute information and the component to be placed of component placement region attribute information component to be placed on plate
The positional information of component pick device, calculate the total displacement of component to be placed movement corresponding to different orders and/or total
Duration, the component to be placed movement total displacement and/or the most short placement order of total duration are selected as current placement order；
Placed according to component corresponding to the pickup of component pick device described in the current placement sequential control.Consider member
The position of device pick device, the attribute of placement region can be position and/or angle, and the attribute of component to be placed includes position
Put, the information such as angle, pin determines the most short component placement order of total displacement and/or total duration, optimize the path of component,
The efficiency that component is positioned over substrate can be improved.So as to improve the efficiency of assembling of electronic product, production capacity is lifted.
Brief description of the drawings
Fig. 1 shows that the component of the embodiment of the present invention is positioned over the method flow schematic diagram of substrate；
Fig. 2 shows that the component of the embodiment of the present invention is positioned over the schematic diagram of the device of substrate；
Fig. 3 shows the hardware architecture diagram of the controller of component patch/inserter of the embodiment of the present invention.
Embodiment
Technical scheme is clearly and completely described below in conjunction with accompanying drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
In addition, term " first ", " second ", " the 3rd " etc. are only used for describing purpose, and it is not intended that indicating or implying relatively important
Property.
The embodiments of the invention provide a kind of method that component is positioned over substrate, wherein, component is picked up by component
Take device to pick up and insert or be mounted on the predeterminable area of substrate, as shown in figure 1, this method comprises the following steps：
S10. the component placement region attribute information on substrate is obtained.In the present embodiment, alleged component placement region category
Property information can include the positional information of component placement region.In the particular embodiment, component is placed on substrate
It predeterminable area, can include component being mounted on substrate surface, can also include component being inserted on substrate.In this reality
Apply in example, component can be Surface Mount Component, can be placing components, for example, heterotype element.In the present embodiment
In, anchor point is provided with substrate, can by vision system obtain substrate position point coordinates, according to component placement region with
Substrate positioning point coordinates obtains the coordinate of component placement region.In the present embodiment, component placement region can also be independent
Anchor point is set, point coordinates is positioned by substrate and component placement region positions point coordinates Computing Meta device placement area and sat
Mark.Component placement region positional information can be determined according to placement region coordinate.
S20. obtain component to be placed attribute information and component to be placed corresponding to component pick device
Positional information.In the present embodiment, component pick device can be multiple, or one, be placed to improve component
Efficiency, in the present embodiment, component pick device are multiple, and component pick device can be suction nozzle, for drawing first device
Part, or chuck, for gripping component.Multiple component pick device distributing positions are different, and different components pick up
Device is taken correspondingly to correspond to different components to be placed, different component pick devices can also correspond to identical and wait to put
Component is put, same component pick device can correspond to different components to be placed, can be according to the position of specific feeder
Put, and the component species that feeder is carried determines, in the particular embodiment, can be obtained by vision system and wait to put
Put the positional information of component, angle information, pinout information etc..In the present embodiment, can be placed according to component to be placed
Position determines the position with the closest component pick device of component to be placed.
S30. according to the position of placement region attribute information, the attribute information of component to be placed and component pick device
Confidence breath calculates the total displacement of component movement to be placed and/or total duration corresponding to different placement orders.Specifically implementing
In example, it is that component pick device is moved to above component to be placed from initial position that component, which places flow, picks up and waits to put
Component is put, component to be placed is placed into component placement region, component pick device returns to original position.In this reality
Apply in example, component pick device can be calculated since initial position, all components to be placed are all placed into therewith
Corresponding predeterminated position, return to out in the placement flow of beginning position, component apparatus for placing passes through total displacement, in the present embodiment
In, the total displacement of all components to be placed can also be calculated.Because the average speed of component pick device is predetermined speed,
After obtaining total displacement, it can be obtained placing the total duration in flow according to total displacement and average speed.In the present embodiment, to total
The influence factor of displacement and/or total duration can be it is a variety of, generally, distance, the anglec of rotation of component to be placed and placement region
The position of component pick device, can calculate total displacement and/or total duration, specifically corresponding to degree and component to be placed
, component to be placed and placement region are determined according to the position of position of the placement region on substrate and component to be placed
Distance；Anglec of rotation when confirming that component is placed according to the angle of placement region and the angle of component to be placed.In this reality
Apply in example, total displacement and/or the total duration of the movement of component pick device can be calculated, component to be placed can also be calculated and moved
Dynamic total displacement and/or total duration, specifically, in one embodiment, because component pick device need to be by component to be placed
The specified location of substrate is placed into, the factor being had an impact to total displacement and/or total duration can include the position of placement region；
Because component pick device needs to pick up component in the position of component to be placed, total displacement and/or total duration are produced
The factor of influence can include the position of placement region；Component pick device needs to move from initial position when picking up component
Component locations to be placed are moved, the factor being had an impact to total displacement and/or total duration can include component pick device
Position.In another embodiment, component pick device moves between component locations to be placed and placement region position, treats
Placement region position, the position of component to be placed and the position of component pick device have to total displacement and/total duration
Influence.In the present embodiment, it is heterotype element in placing element, and/or the presentation certain angle of placement region, and/or wait to put
Put when component has certain angle in feeder, it is necessary to be adjusted to its angle, so as to by component to be placed more
Accurately it is placed in placement region, total duration can also include the angle adjustment time.
S40. component to be placed movement total displacement and/or the most short placement order of total duration is selected to be placed as current
Sequentially.In the present embodiment, by total displacement and/or total duration corresponding to the different placement order of calculating, can select wherein
Total displacement and/or total duration it is most short placement order as component current placement sequentially.In the present embodiment, can also incite somebody to action
The placement order being calculated, can total displacement corresponding with the placement order to prestore and/or total as placement to be determined order
Duration is contrasted, and in the present embodiment, the placement order to prestore can be the order for the last time place operation, can also
The placement order rule of thumb set for staff, judges that total displacement and/or total duration are corresponding to placement order to be determined
It is no to be less than total displacement and/or total duration corresponding to default placement order；When total displacement corresponding to placement order to be determined and/or always
It is when duration is less than total displacement corresponding to default placement order and/or total duration, placement to be determined order is suitable as currently placing
Sequence, when the corresponding mobile total displacement of placement to be determined order and/or total duration be more than total displacement corresponding to default placement order and/or
During total duration, component is placed using default placement order.
S50. placed according to component corresponding to current placement sequential control component pick device pickup.
Obtain the attribute information of the component placement region attribute information component to be placed on substrate and described wait to put
The positional information of component pick device corresponding to component is put, calculates component movement to be placed corresponding to different orders
Total displacement and/or total duration, select the component to be placed movement total displacement and/or the most short placement order conduct of total duration
Current placement order；Put according to component corresponding to the pickup of component pick device described in the current placement sequential control
Put.Consider the position of component pick device, the attribute of placement region can be position and/or angle, first device to be placed
The attribute of part includes the information such as position, angle, pin and determines the most short component placement order of total displacement and/or total duration, excellent
Change the path of component, the efficiency that component is positioned over substrate can be improved.So as to improve the efficiency of assembling of electronic product, lifting
Production capacity.
Due to the demand of actual production technique, the type and quantity for the component to be placed that identical substrate may need are not
Together, efficiency is placed to improve, in alternatively embodiment, before the component placement region attribute information on substrate is obtained,
It can determine the type and quantity of component to be placed first according to actual production process requirements, placed specifically, obtaining component
Data, in the present embodiment, component place the process requirements that data can be production, can include the component that production needs
Species, quantity, the data such as placement location.The type and quantity of component to be placed are determined according to placement data, in this implementation
Example in, can according to place data to temporarily without using component to be placed shield, to some component to be placed not
Carry out actual when the individually shielded sign of the use of value is handled.
In an alternate embodiment of the invention, component to be placed can also be detected by vision system, to underproof
Component carries out material casting processing, and picks up again, is placed.The quality of product can be ensured.Improve and place efficiency.
The embodiment of the present invention additionally provides the device that a kind of component is positioned over substrate, as shown in Fig. 2 the device includes：
First acquisition module 100, for obtaining the component placement region attribute information on substrate；Second acquisition module 200, for obtaining
Take component to be placed attribute information and component to be placed corresponding to component pick device positional information；Calculate mould
Block 300, for being believed according to the position of placement region attribute information, the attribute information of component to be placed and component pick device
Breath calculates the total displacement of component movement to be placed and/or total duration corresponding to different placement orders；Order confirms module 400,
For selecting component to be placed movement total displacement and/or the most short placement order of total duration as current placement order；Control
Placement module 500, for being placed according to component corresponding to current placement sequential control component pick device pickup.
In an alternate embodiment of the invention, placement region attribute information includes：The positional information of placement region；First acquisition module
Including：First acquisition unit, for obtaining substrate positioning point coordinates；Second acquisition unit, for obtaining component placement region
Coordinate；Position determination unit, for determining position of the placement region on substrate according to positioning point coordinates and placement region coordinate.
In an alternate embodiment of the invention, placement region attribute information includes：Positional information of the placement region on substrate and put
Put the angle information in region；The positional information of component to be placed includes：The positional information of component to be placed and member to be placed
The angle information of device；Computing module includes：Distance determining unit, for according to positional information of the placement region on substrate and
The positional information of component to be placed determines the distance of component to be placed and placement region；Angle determination unit, for basis
The angle information of the angle information of placement region and component to be placed confirms anglec of rotation when component is placed；Calculate single
Member, for being picked up according to component to be placed component corresponding with the distance, the anglec of rotation and component to be placed of placement region
Take total displacement and/or the total duration of the positional information calculation component movement to be placed of device.
In an alternate embodiment of the invention, order confirms that module includes：Selecting unit, for selecting component to move total displacement
And/or the placement order conduct placement to be determined order that total duration is most short；Judging unit, for judging that placement order to be determined is right
Whether the total displacement answered and/or total duration are less than total displacement and/or total duration corresponding to default placement order；First determines list
Member, for when total displacement corresponding to placement order to be determined and/or total duration be less than total displacement corresponding to default placement order and/
Or during total duration, using placement to be determined order as current placement order；Second determining unit, is used for, when placement to be determined is suitable
When ordered pair should move total displacement and/or total duration more than total displacement corresponding to default placement order and/or total duration, it will deposit in advance
Order is put as current placement order.
In an alternate embodiment of the invention, component is positioned over the device of substrate and also included：3rd acquisition module, for obtaining member
Device places data；Determining module, for determining the type and quantity of component to be placed according to placement data.
The embodiment of the present invention also provides a kind of component patch/inserter, including component patch/placement device body and control
Device.
Fig. 3 is the hardware architecture diagram of the controller of component patch/placement device provided in an embodiment of the present invention, such as Fig. 3
Shown, the controller includes one or more processors 310 and memory 320, in Fig. 3 by taking a processor 310 as an example.
Controller can also include：Input unit 330 and output device 340.
Processor 310, memory 320, input unit 330 and output device 340 can pass through bus or other modes
Connect, in Fig. 3 exemplified by being connected by bus.
Processor 310 can be central processing unit（Central Processing Unit, CPU）.Processor 310 may be used also
Think other general processors, digital signal processor（Digital Signal Processor, DSP）, application specific integrated circuit
（Application Specific Integrated Circuit, ASIC）, field programmable gate array（Field-
Programmable Gate Array, FPGA）Either other PLDs, discrete gate or transistor logic,
The chips such as discrete hardware components, or the combination of above-mentioned all kinds of chips.General processor can be microprocessor or the processing
Device can also be any conventional processor etc..
Memory 320 is used as a kind of non-transient computer readable storage medium storing program for executing, available for storing non-transient software program, non-
Transient computer executable program and module, the journey as corresponding to the component in the embodiment of the present application is positioned over the method for substrate
Sequence instruction/module.Processor 310 is stored in non-transient software program, instruction and module in memory 320 by operation,
Various function application and data processing so as to execute server, that is, realize that above method embodiment component is positioned over substrate
Method.
Memory 320 can include storing program area and storage data field, wherein, storing program area can store operation system
Application program required for system, at least one function；Storage data field can store uses institute according to the XXX processing units operated
Data of establishment etc..In addition, memory 320 can include high-speed random access memory, non-transient memory can also be included,
A for example, at least disk memory, flush memory device or other non-transient solid-state memories.In certain embodiments, deposit
Reservoir 320 is optional including that can pass through network connection relative to the remotely located memory of processor 310, these remote memories
The device of substrate is positioned over to component.The example of above-mentioned network include but is not limited to internet, intranet, LAN,
Mobile radio communication and combinations thereof.
Input unit 330 can receive the numeral or character information of input, and produce and set with the user of XXX processing unit
Put and the input of key signals that function control is relevant.Output device 340 may include the display devices such as display screen.
One or more of modules are stored in the memory 320, when by one or more of processors
During 310 execution, method as shown in Figure 1 is performed.
The said goods can perform the method that the embodiment of the present invention is provided, and possesses the corresponding functional module of execution method and has
Beneficial effect.The ins and outs of detailed description, the correlation that for details, reference can be made in embodiment as shown in Figure 1 are not retouched in the present embodiment
State.
The embodiment of the present invention additionally provides a kind of non-transient computer storage medium, and the computer-readable storage medium is stored with
Computer executable instructions, the component that the computer executable instructions can perform in above-mentioned any means embodiment are positioned over base
The method of plate.Wherein, the storage medium can be magnetic disc, CD, read-only memory（Read-Only Memory, ROM）、
Random access memory（Random Access Memory, RAM）, flash memory（Flash Memory）, hard disk（Hard
Disk Drive, abbreviation：HDD）Or solid state hard disc（Solid-State Drive, SSD) etc.；The storage medium can also wrap
Include the combination of the memory of mentioned kind.
Although being described in conjunction with the accompanying embodiments of the present invention, those skilled in the art can not depart from this hair
Various modification can be adapted in the case of bright spirit and scope and modification, and such modifications and variations are each fallen within by appended claims
Within limited range.
Claims (11)
1. a kind of method that component is positioned over substrate, the component is picked up by component pick device and inserts or mount
On the predeterminable area of substrate, it is characterised in that methods described includes：
Obtain the component placement region attribute information on the substrate；
Obtain component to be placed attribute information and the component to be placed corresponding to component pick device position
Information；
According to the position of the placement region attribute information, the attribute information of the component to be placed and component pick device
Information calculates the total displacement of component movement to be placed and/or total duration corresponding to different placement orders；
The component to be placed movement total displacement and/or the most short placement order of total duration are selected as current placement order；
Placed according to component corresponding to the pickup of component pick device described in the current placement sequential control.
2. the method that component as claimed in claim 1 is positioned over substrate, it is characterised in that
The placement region attribute information includes：The positional information of placement region；
The component placement region attribute information obtained on the substrate includes：
Obtain substrate positioning point coordinates；
Obtain component placement region coordinate；
The positional information of the placement region is determined according to the positioning point coordinates and the placement region coordinate.
3. the method that component as claimed in claim 1 is positioned over substrate, it is characterised in that
The placement region attribute information includes：The positional information of placement region and the angle information of placement region；
The attribute information of the component to be placed includes：The angle of the positional information of component to be placed and component to be placed
Information；
It is described according to the placement region attribute information, the attribute information of the component to be placed and component pick device
The total displacement of component movement to be placed and/or total duration include corresponding to positional information calculation difference placement order：
Treated according to determining placement region positional information on the substrate and the positional information of component to be placed
Place component and the distance of the placement region；
When confirming that component is placed according to the angle information of the angle information of the placement region and the component to be placed
The anglec of rotation；
According to the component to be placed and distance, the anglec of rotation and the component pair to be placed of the placement region
The total displacement of component movement to be placed and/or total duration described in the positional information calculation for the component pick device answered.
4. the method that component as claimed in claim 1 is positioned over substrate, it is characterised in that the selection member to be placed
Device move total displacement and/or total duration it is most short placement order include：
Component movement total displacement and/or the most short placement order of total duration are selected as placement to be determined order；
Judge whether total displacement corresponding to the placement order to be determined and/or total duration are less than corresponding to default placement order always
Displacement and/or total duration；
When total displacement corresponding to the placement order to be determined and/or total duration are less than total position corresponding to the default placement order
When shifting and/or total duration, using the placement order to be determined as current placement order.
5. the method that component as claimed in claim 4 is positioned over substrate, it is characterised in that when the placement order to be determined
When corresponding mobile total displacement and/or total duration are more than total displacement corresponding to the default placement order and/or total duration, by described in
Placement order prestore as current placement order.
6. the method that the component as described in claim 1-5 any one is positioned over substrate, it is characterised in that in the acquisition
Include before component placement region attribute information on the substrate：
Obtain the component and place data；
The type and quantity of the component to be placed are determined according to the placement data.
7. a kind of component is positioned over the device of substrate, it is characterised in that including：
First acquisition module, for obtaining the component placement region attribute information on the substrate；
Second acquisition module, for obtain component to be placed attribute information and the component to be placed corresponding to first device
The positional information of part pick device；
Computing module, for the attribute information and component according to the placement region attribute information, the component to be placed
The total displacement of component movement to be placed and/or total duration corresponding to the positional information calculation difference placement order of pick device；
Order confirms module, for selecting the component to be placed movement total displacement and/or the most short placement order of total duration
As current placement order；
Placement module is controlled, for according to first device corresponding to the pickup of component pick device described in the current placement sequential control
Part is placed.
8. the method that component as claimed in claim 7 is positioned over substrate, it is characterised in that
The placement region attribute information includes：The positional information of placement region；
First acquisition module includes：
First acquisition unit, for obtaining substrate positioning point coordinates；
Second acquisition unit, for obtaining component placement region coordinate；
Position determination unit, for determining the placement region in institute according to the positioning point coordinates and the placement region coordinate
State the position on substrate.
9. component as claimed in claim 7 or 8 is positioned over the device of substrate, it is characterised in that
The placement region attribute information includes：The angle of placement region positional information on the substrate and placement region letter
Breath；
The positional information of the component to be placed includes：The angle of the positional information of component to be placed and component to be placed
Information；
The computing module includes：
Distance determining unit, for the position according to placement region positional information on the substrate and component to be placed
Confidence breath determines the component to be placed and the distance of the placement region；
Angle determination unit, the angle information for the angle information according to the placement region and the component to be placed are true
Recognize anglec of rotation when component is placed；
Computing unit, for the distance according to the component to be placed and the placement region, the anglec of rotation and described
The total displacement of component to be placed movement described in the positional information calculation of component pick device corresponding to component to be placed and/
Or total duration.
A kind of 10. component patch/inserter, it is characterised in that including：
Component patch/inserter body；
Controller, including：At least one processor；And the memory being connected with least one processor communication；Wherein,
The memory storage has and can held by the instruction of one computing device, the instruction by least one processor
OK, so that at least one computing device component as claimed in any one of claims 1 to 6 is positioned over the side of substrate
Method.
11. a kind of non-transient storage media, it is characterised in that the non-transient computer readable storage medium storing program for executing storage computer refers to
Order, the component that the computer instruction is used to make the computer execution as claimed in any one of claims 1 to 6 are positioned over
The method of substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710859970.0A CN107567275B (en) | 2017-09-21 | 2017-09-21 | Method and device for placing component on substrate and component pasting/inserting machine |
Applications Claiming Priority (1)
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Effective date of registration: 20200615 Address after: 621000 Sichuan city of Mianyang province high tech Zone Puming South East No. 95 Co-patentee after: SICHUAN CHANGHONG AIR CONDITIONING Co.,Ltd. Patentee after: SICHUAN CHANGHONG INTELLIGENT MANUFACTURING TECHNOLOGY Co.,Ltd. Address before: 621000 Sichuan city of Mianyang province high tech Zone Puming South East No. 95 Patentee before: SICHUAN CHANGHONG INTELLIGENT MANUFACTURING TECHNOLOGY Co.,Ltd. |