CN109961067A - Choosing method, system, computer storage medium and the equipment of optical reference point - Google Patents
Choosing method, system, computer storage medium and the equipment of optical reference point Download PDFInfo
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- CN109961067A CN109961067A CN201910209602.0A CN201910209602A CN109961067A CN 109961067 A CN109961067 A CN 109961067A CN 201910209602 A CN201910209602 A CN 201910209602A CN 109961067 A CN109961067 A CN 109961067A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/20—Image preprocessing
- G06V10/24—Aligning, centring, orientation detection or correction of the image
- G06V10/245—Aligning, centring, orientation detection or correction of the image by locating a pattern; Special marks for positioning
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Abstract
The present invention provides choosing method, system, computer storage medium and the equipment of a kind of optical reference point, and the choosing method of the optical reference point includes: the pad image for obtaining component to be mounted in a substrate image；By detecting attribute or the pad Screening Treatment of the corresponding design document of the substrate image, the pad on the substrate image is determined in the pad image, using the optical reference point as component to be mounted；Wherein, the position of the component to be mounted is determined by the centre coordinate of the component to be mounted, and the centre coordinate of the component to be mounted is known by the corresponding coordinate file of the substrate image.The present invention, which can be improved, mounts component or bare chip to the precision on substrate in micro-group dress.
Description
Technical field
The invention belongs to electronic manufacturing technology fields, are related to a kind of datum mark choosing method, more particularly to a kind of optics
Choosing method, system, computer storage medium and the equipment of datum mark.
Background technique
As electronic system becomes increasingly complex, harsher requirement is proposed to the volume and weight of electronic equipment.It is small
The chip of type is more more and more universal for electronic product research and development, and the type of chip is also more and more, so that micro-group fills, system-level envelope
Fill (SiP) technology it is more more and more universal.Component or bare chip are mounted to the precision on substrate to will appear in micro-group dress
Not high problem.
The not high reason of attachment progress occur, mainly substrate (also referred to as plate figure) has not in attachment and in detection process
With the deformation of degree, causing component or bare chip to mount to the precision on substrate is reduced, to influence the quality of product.
It is by designing optical reference point on substrate, to solve substrate deformation for the above precision problem traditional technology
Numerical compensation gives original coordinate value, improves qualification rate when product attachment.
Optical reference point, also referred to as mark point, Fiducial point, Optical Parametric examination point, optical locating point etc..By in base
Optical reference point is designed on plate to solve the numerical compensation of substrate deformation to original coordinate value, but the method is asked there are still following
Topic: 1, optical reference point on substrate side is designed to compensate the precision that micro-group dress has been not achieved in correction coordinate.2, in component
Substrate does not have spatial design optical reference point if local optical reference point is designed on side.3, using the design optics base on substrate
On schedule, the qualification rate of product attachment is still reached to less than 100%.
Therefore, choosing method, system, computer storage medium and the equipment of a kind of optical reference point how are provided, with solution
Certainly the prior art can not improve the defects of placement accuracy of integrated circuit micro-group dress component, become those skilled in the art urgently
The technical issues of solution.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of selection sides of optical reference point
Method, system, computer storage medium and equipment can not improve the patch of integrated circuit micro-group dress component for solving the prior art
The problem of filling precision.
In order to achieve the above objects and other related objects, one aspect of the present invention provides a kind of selection side of optical reference point
Method, the choosing method of the optical reference point include: the pad image for obtaining component to be mounted in a substrate image；Pass through
Attribute or the pad Screening Treatment for detecting the corresponding design document of the substrate image determine the base in the pad image
Pad on plate image, using the optical reference point as component to be mounted；Wherein, the position of the component to be mounted
It is determined by the centre coordinate of the component to be mounted, the centre coordinate of the component to be mounted is by the substrate image pair
The coordinate file answered is known.
In one embodiment of the invention, the pad image of component to be mounted in one substrate image of the acquisition
Before step, the choosing method of the optical reference point further include: line layer and resistance by substrate design file acquisition substrate
Layer is as substrate image；Or it obtains and is derived from patch device substrate image collected.
In one embodiment of the invention, the step of the pad image for obtaining component to be mounted in a substrate image
It suddenly include: the centre coordinate that the component to be mounted is obtained from the corresponding coordinate file of the substrate image；It will be described
The centre coordinate of component to be mounted is overlapped with the image center location of component to be mounted on the substrate image；Circulation
It executes the centre coordinate for obtaining component to be mounted and the centre coordinate of component and the image center location of component is overlapped
The step of, to extract the pad image of component to be mounted on the substrate image one by one.
In one embodiment of the invention, the pad image of component to be mounted in one substrate image of the acquisition
After step, passing through the attribute for detecting the corresponding design document of the substrate image or pad Screening Treatment, in the pad
The pad on the substrate image is determined in image, the step of using optical reference point as component to be mounted before, institute
State the choosing method of optical reference point further include: according to the rectangle flat-face fillet weld disk and/or circle on substrate image with centre coordinate
Shape pad determines the selection range of the optical reference point.
In one embodiment of the invention, the attribute by detecting the corresponding design document of the substrate image,
The pad on the substrate image is determined in the pad image, the step of using optical reference point as component to be mounted
It include: the existing attribute for searching the design document；According to the existing attribute of the design document, it is determined as optical reference point
Pad coordinate information.
It is described by pad Screening Treatment in one embodiment of the invention, the base is determined in the pad image
Pad on plate image includes: according to an automatic selection mechanism using the step of optical reference point as component to be mounted
It will should be in the pin coordinate of component to be mounted and the substrate image in the corresponding coordinate file of the substrate image
The position of the pad image of mounted component is matched, and covers all of the component to be mounted to filter out one by one
Pad is chosen and is wherein no less than two pads as optical reference point；Wherein, the centre coordinate position of the component to be mounted
In using wherein no less than two pads as the rectangular area diagonally constituted；Or it is determined according to the automatic selection mechanism
The component outline border regional scope to be mounted, filtered out in the component outline border regional scope to be mounted one by one
All pads are chosen and are wherein no less than two pads as optical reference point；The centre coordinate position of the component to be mounted
In using wherein no less than two pads as the rectangular area diagonally constituted.
Another party of the present invention provides a kind of selecting system of optical reference point, the selecting system packet of the optical reference point
It includes: pad extraction module, for obtaining the pad image of component to be mounted in a substrate image；Module is chosen, for leading to
The attribute for detecting the corresponding design document of the substrate image or pad Screening Treatment are crossed, in the pad image described in determination
Pad on substrate image, using the optical reference point as component to be mounted；Wherein, the position of the component to be mounted
It sets and is determined by the centre coordinate of the component to be mounted, the centre coordinate of the component to be mounted is by the substrate image
Corresponding coordinate file is known.
In one embodiment of the invention, the selecting system of the optical reference point further include: module is obtained, for passing through
The line layer and solder mask of substrate design file acquisition substrate are as substrate image；Or it obtains collected derived from a patch device
Substrate image.
Another aspect of the invention provides a kind of computer storage medium, is stored thereon with computer program, the computer journey
The choosing method of the optical reference point is realized when sequence is executed by processor.
Last aspect of the present invention provides a kind of equipment, comprising: processor and memory；The memory is based on storing
Calculation machine program, the processor is used to execute the computer program of the memory storage, so that the equipment executes the light
Learn the choosing method of datum mark.
As described above, choosing method, system, computer storage medium and the equipment of optical reference point of the present invention,
Have the advantages that product attachment qualification rate (qualification rate reaches 100%) can be improved in the present invention, so that product raw material
Scrappage be 0, avoid the waste of raw material, shorten the project cycle of product, significantly save the cost, improve the well-known of enterprise
Degree obtains the approval in industry faster.
Detailed description of the invention
Fig. 1 is shown as principle flow chart of the choosing method of optical reference point of the invention in an embodiment.
Fig. 2 is shown as datum mark schematic diagram of the choosing method of optical reference point of the invention in an embodiment.
Fig. 3 is shown as flow operations figure of the choosing method of optical reference point of the invention in an embodiment.
Fig. 4 is shown as datum mark of the choosing method of optical reference point of the invention in embodiment two and chooses schematic diagram.
Fig. 5 is shown as datum mark of the choosing method of optical reference point of the invention in embodiment three and chooses schematic diagram.
Fig. 6 is shown as structure principle chart of the choosing method of optical reference point of the invention in an embodiment.
Component label instructions
The selecting system of 2 optical reference points
21 whole plate optical reference points
22 veneer optical reference points
23 indicative of local optical datum marks
41 U625 the first optical reference points
42 U625 the second optical reference points
43 U625 centre coordinates
44 U625 outline borders
45 substrate images
51 U628 the first optical reference points
52 U628 the second optical reference points
53 U628 centre coordinates
54 U628 outline borders
The selecting system of 6 optical reference points
60 obtain module
61 pad extraction modules
62 ranges limit module
63 choose module
The choosing method step of S10~S13 optical reference point
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.It should be noted that in the absence of conflict, following embodiment and implementation
Feature in example can be combined with each other.
It should be noted that illustrating the basic structure that only the invention is illustrated in a schematic way provided in following embodiment
Think, only shown in schema then with related component in the present invention rather than component count, shape and size when according to actual implementation
Draw, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its assembly layout kenel
It is likely more complexity.
The choosing method of optical reference point of the present invention, system, the technical principle of computer storage medium and equipment are such as
Under: obtain the pad image of component to be mounted in a substrate image；By detecting the corresponding design text of the substrate image
The attribute of part or pad Screening Treatment determine the pad on the substrate image in the pad image, using as to be mounted
Component optical reference point；Wherein, the position of the component to be mounted is sat by the center of the component to be mounted
Mark determines that the centre coordinate of the component to be mounted is known by the corresponding coordinate file of the substrate image.
Embodiment one
The present embodiment provides a kind of choosing method of optical reference point, the choosing method of the optical reference point includes:
Obtain the pad image of component to be mounted in a substrate image；
By detecting attribute or the pad Screening Treatment of the corresponding design document of the substrate image, in the pad image
Pad on the middle determination substrate image, using the optical reference point as component to be mounted；Wherein, described to be mounted
The position of component is determined that the centre coordinate of the component to be mounted is by institute by the centre coordinate of the component to be mounted
The corresponding coordinate file of substrate image is stated to know.
The choosing method of the point of optical reference provided by the present embodiment is described in detail below with reference to diagram.
Referring to Fig. 2, being shown as datum mark signal of the choosing method of optical reference point of the invention in an embodiment
Figure.As shown in Fig. 2, optical reference point type includes: whole plate optical reference point 21, veneer optical reference point 22 and indicative of local optical base
On schedule 23.The choosing method of the point of optical reference described in the present embodiment solves the indicative of local optical benchmark of micro-group cartridge chip in integrated circuit
The On The Choice of point 23, and the chosen position of local optical reference point 23 is optimized.Referring to Fig. 1, being shown as the present invention
Optical reference point principle flow chart of the choosing method in an embodiment.As shown in Figure 1, the selection of the optical reference point
Method specifically includes following steps:
S10, by the line layer and solder mask of the entire substrate of substrate design file acquisition as substrate image；Or obtain source
In patch device substrate image collected.The substrate design file is the files such as PCB CAD, Gerber, GDSII, is come
Derived from Cadence, the EDA design software such as Mentor.
Specifically, Fig. 3 and Fig. 4 are please referred to, the choosing method for being respectively indicated as optical reference point of the invention is implemented in one
Datum mark of the choosing method of flow operations figure and optical reference point of the invention in example in embodiment two chooses schematic diagram.
(1) substrate in kind is carried out to substrate and takes pictures or import substrate file.It is taken pictures by equipment such as SMT, obtains substrate (PCB) image
45.Or it is offline by importing substrate design file, such as the front line layer and solder mask of Gerber file, it is shown after importing
Image substantially and camera shooting acquisition true substrate it is consistent.
S11 obtains the pad image of component to be mounted in a substrate image.
The S11 includes:
S111 obtains the centre coordinate of the component to be mounted from the corresponding coordinate file of the substrate image.
As shown in figure 4, obtaining component U625 centre coordinate 43 to be mounted after obtaining substrate image.Substrate can be clicked by mouse
The center of component to be mounted obtains coordinate and angle as U625 centre coordinate 43 on image 45, can also pass through seat
Mark file imports and is aligned coordinate and substrate image 45；As shown in figure 5, obtaining component to be mounted after obtaining substrate image
U628 centre coordinate 53.Can be clicked by mouse component to be mounted on substrate image 45 center obtain coordinate and
Angle can also be imported by coordinate file as U628 centre coordinate 53 and be aligned coordinate and substrate image 45.
S112, by the figure of component to be mounted on the centre coordinate of the component to be mounted and the substrate image
Inconocenter position is overlapped, to find the position of component to be mounted on substrate image.As shown in figure 4, by the substrate image
U625 centre coordinate 43 is overlapped with the center of the image of U625 on the substrate image 45 in corresponding coordinate file；Such as figure
Shown in 5, by the figure of U628 on U628 centre coordinate 53 in the corresponding coordinate file of the substrate image and the substrate image 45
The center of picture is overlapped.
S113, circulation, which executes, obtains the centre coordinate of component and the centre coordinate of component and component to be mounted
The step of image center location is overlapped, to extract the pad image of component to be mounted on the substrate image one by one.Such as Fig. 4
It is shown, all pads of U625 are extracted according to U625 centre coordinate 43；As shown in figure 5, being extracted according to U628 centre coordinate 53
All pads of U628.
S12 determines the light according to the rectangle flat-face fillet weld disk and/or circular pad on substrate image with centre coordinate
The selection range of datum mark is learned, and then executes step S13.
Specifically, the selection range of the optical reference point is subjected to list management, and edited in a tabular form, referring to table
The classification of type table of 1 optical reference point.The optical reference point that U625 chooses in Fig. 4 is two circular pads, optical reference point
Coordinate be circular pad central coordinate of circle；The optical reference point that U628 chooses in Fig. 5 is rectangular pads, optical reference
The coordinate of point is the centre coordinate of rectangular pads, another optical reference point is 0 pad of right angle, and the coordinate of optical reference point is
The intersecting point coordinate at right angle.The optical reference point pad information that above-mentioned choosing method is determined carries out list management, and with table
Case form editor, the optical reference point information table for being U625 and U628 referring to table 2.
Table 1: the classification of type table of optical reference point
The optical reference point information table of table 2:U625
S13, by detecting attribute or the pad Screening Treatment of the corresponding design document of the substrate image, in the pad
The pad on the substrate image is determined in image, using the optical reference point as component to be mounted；Wherein, described wait paste
The position of the component of dress determines by the centre coordinate of the component to be mounted, the centre coordinate of the component to be mounted
Known by the corresponding coordinate file of the substrate image.
In the present embodiment, step S13 includes:
S131 searches the existing attribute of the design document；According to the existing attribute of the design document, it is determined as light
Learn the coordinate information of the pad of datum mark.In the present embodiment, during the existing attribute refers to substrate design, for each
A component specifies at least two pads as optical reference point, and carries out sign flag to specified pad.
Having attribute refering to Fig. 4, in design document may specify the first optical reference of U625 point 41 and U625 the second optics base
The 42 optical reference point as U625 on schedule, the intersection point of right-angled intersection is the coordinate of optical reference point in figure；As shown in figure 5, setting
Having attribute in meter file may specify that the first optical reference of U628 point 51 is optical reference point, and type is rectangle, and cross is handed in figure
The intersection point of fork is the coordinate of optical reference point, obtains size x=0.5mm, y=0.25mm.Optical reference point coordinate are as follows: x=
16.925mm y=33.948mm.Having attribute in design document may specify that the second optical reference of U628 point 52 is optical reference
Point, type right angle 0 obtain size x=0.5mm, y=0.25mm.Optical reference point coordinate are as follows: x=16.925mm, y=
33.948mm。
S132, according to an automatic selection mechanism by component to be mounted in the corresponding coordinate file of the substrate image
Pin coordinate matched with the position of the pad image of the component to be mounted in the substrate image, to screen one by one
Cover all pads of the component to be mounted out, chooses and be wherein no less than two pads as optical reference point；Wherein,
The centre coordinate of the component to be mounted, which is located at using described, is wherein no less than two pads as the rectangle region diagonally constituted
In domain；Or
Specifically, pass through algorithm automatic screening the first optical reference of the U625 point 41 and the second light of U625 of automatic selection mechanism
Optical reference point of the datum mark 42 as U625 is learned, there is the pin coordinate of U625 in the substrate coordinate file of reading.According to first device
The component's feet of part U625, by and pin coordinate encounter, overlapping intersect tens pads all screen.According to image
The rectangle frame that no less than two pads are linked to be is chosen to be included component centre coordinate；As shown in figure 5, by choosing automatically
Optics base of algorithm automatic screening the first optical reference of the U628 point 51 and the second optical reference of U628 point 52 of mechanism as U628
On schedule, there is the pin coordinate of U628 in the substrate coordinate file of reading.According to the component's feet of component U628, will and pin
Tens pads that coordinate is encountered, overlapping intersects all screen.The square for being no less than two pads and being linked to be is chosen according to image
Component centre coordinate is included by shape frame.
The component outline border regional scope to be mounted is determined according to the automatic selection mechanism, to filter out institute one by one
All pads in component outline border regional scope to be mounted are stated, chooses and is wherein no less than two pads as optical reference
Point；The centre coordinate of the component to be mounted, which is located at using described, is wherein no less than two pads as the rectangle diagonally constituted
In region.
In the present embodiment, the automatic selection mechanism is a pad filtering algorithm, and the pad filtering algorithm is according to every
The pin pad coordinate of one component and the matching principle of pin pad picture position and component outline border limit principle to pad
Carry out Screening Treatment.
With continued reference to Fig. 4, pass through algorithm automatic screening the first optical reference of the U625 point 41 and U625 of automatic selection mechanism
Optical reference point of the second optical reference point 42 as U625 will be several in range according to the size of component U625 outline border 44
Ten pads all screen.Choose the rectangle frame that no less than two pads are linked to be according to image includes by component centre coordinate
Inside；As shown in figure 5, algorithm automatic screening the first optical reference of the U628 point 51 and the second light of U628 that pass through automatic selection mechanism
Optical reference point of the datum mark 52 as U628 is learned, according to the size of component U628 outline border 54, by tens welderings in range
Disk all screens.The rectangle frame that no less than two pads are linked to be is chosen according to image to be included component centre coordinate.
In the present embodiment, the optical reference of component to be mounted can be also chosen when the pad Screening Treatment by mouse
Point.
The present embodiment provides a kind of computer storage mediums, are stored thereon with computer program, which is located
Reason device realizes the choosing method of the optical reference point when executing.
Those of ordinary skill in the art will appreciate that: realize that all or part of the steps of above-mentioned each method embodiment can lead to
The relevant hardware of computer program is crossed to complete.Computer program above-mentioned can store in a computer-readable storage computer
In storage medium.When being executed, execution includes the steps that above-mentioned each method embodiment to the program；And storage computer above-mentioned is deposited
Storage media includes: the various computer storage mediums that can store program code such as ROM, RAM, magnetic or disk.
Product attachment qualification rate can be improved in the choosing method of the point of optical reference described in the present embodiment, and (qualification rate reaches
100%), so that the scrappage of product raw material is 0, the waste of raw material is avoided, shortens the project cycle of product, significantly saves
About cost improves the popularity of enterprise, obtains the approval in industry faster.
Embodiment two
The present embodiment provides a kind of selecting system of optical reference point, the selecting system of the optical reference point includes:
Pad extraction module, for obtaining the pad image of component to be mounted in a substrate image；
Module is chosen, for passing through the attribute or the pad Screening Treatment that detect the corresponding design document of the substrate image,
The pad on the substrate image is determined in the pad image, using the optical reference point as component to be mounted；Its
In, the position of the component to be mounted is determined by the centre coordinate of the component to be mounted, first device to be mounted
The centre coordinate of part is known by the corresponding coordinate file of the substrate image.
The selecting system of the point of optical reference provided by the present embodiment is described in detail below with reference to diagram.It needs
What is illustrated is, it should be understood that the division of the modules of following selecting system is only a kind of division of logic function, practical to realize
When can completely or partially be integrated on a physical entity, can also be physically separate.And these modules can be all with soft
Part is realized by way of processing element calls, and can also all be realized in the form of hardware, can be passed through place with part of module
The form for managing element calling software realizes that part of module passes through formal implementation of hardware.Such as: x module can be individually to set up
Processing element, also can integrate and realized in some chip of following selecting systems.In addition, x module can also be with program
The form of code is stored in the memory of following selecting systems, is called and is held by some processing element of following selecting systems
The function of the following x module of row.The realization of other modules is similar therewith.These modules completely or partially can integrate together,
It can independently realize.Processing element described here can be a kind of integrated circuit, the processing capacity with signal.It was realizing
Cheng Zhong, each step of the above method or following modules can by the integrated logic circuit of the hardware in processor elements or
The instruction of person's software form is completed.
These modules can be arranged to implement one or more integrated circuits of above method below, such as: one
Or multiple specific integrated circuits (Application Specific Integrated Circuit, abbreviation ASIC), one or more
A microprocessor (Digital Singnal Processor, abbreviation DSP), one or more field programmable gate array
(Field Programmable Gate Array, abbreviation FPGA) etc..When some following module passes through processing element caller
When the form of code is realized, which can be general processor, such as central processing unit (Central Processing
Unit, abbreviation CPU) or it is other can be with the processor of caller code.These modules can integrate together, with system on chip
The form of (System-on-a-chip, abbreviation SOC) is realized.
Referring to Fig. 6, being shown as structure principle chart of the choosing method of optical reference point of the invention in an embodiment.
As shown in fig. 6, the selecting system 6 of the optical reference point includes: to obtain module 60, pad extraction module 61, range to limit mould
Block 62 and selection module 63.
The connection of pad extraction module 61 one obtains module 60, and the acquisition module 60 is used to pass through substrate design file
The line layer and solder mask for obtaining substrate are as substrate image；Or it obtains and is derived from patch device substrate image collected, institute
It states pad extraction module 61 and pad image is obtained with this.
The pad extraction module 61 is described to be mounted for obtaining from the corresponding coordinate file of the substrate image
The centre coordinate of component；By component to be mounted on the centre coordinate of the component to be mounted and the substrate image
Image center location be overlapped；Circulation, which executes, obtains the centre coordinate of component to be mounted and the centre coordinate of component and member
The step of image center location of device is overlapped, to extract the pad of all components to be mounted on the substrate image one by one
Image.
Attribute or pad Screening Treatment using selection module 63 by the corresponding design document of the detection substrate image,
The pad on the substrate image is determined in the pad image, using the optical reference point as component to be mounted；Its
In, the position of the component to be mounted is determined by the centre coordinate of the component to be mounted, first device to be mounted
The centre coordinate of part is known by the corresponding coordinate file of the substrate image.
In the present embodiment, range limits module 62 and is used for according to the rectangle flat-face fillet weld on substrate image with centre coordinate
Disk and/or circular pad determine the selection range of the optical reference point.
In the present embodiment, the existing attribute chosen 63 one side of module and be used to search the design document；According to
The existing attribute of the design document is determined as the coordinate information of the pad of optical reference point.The existing attribute refers to base
In plate design process, for each component, specify at least two pads as optical reference point, and to specified pad into
Row sign flag.
63 another aspect of selection module is used for according to an automatic selection mechanism in the corresponding coordinate of the substrate image
By the pad image of the component to be mounted in the pin coordinate of component to be mounted and the substrate image in file
Position is matched, and to filter out all pads for covering the component to be mounted one by one, is chosen two of them pad and is made
For optical reference point；Wherein, the centre coordinate of the component to be mounted is located at using the two of them pad as diagonally
In the rectangular area of composition；Or the component outline border regional scope to be mounted is determined according to the automatic selection mechanism, with
All pads in the component outline border regional scope to be mounted are filtered out one by one, choose two of them pad as optics
Datum mark；The centre coordinate of the component to be mounted is located at using the two of them pad as the rectangle region diagonally constituted
In domain.
In the present embodiment, the automatic selection mechanism is a pad filtering algorithm, and the pad filtering algorithm is according to every
The pin pad coordinate of one component and the matching principle of pin pad picture position and component outline border limit principle to pad
Carry out Screening Treatment.
Product attachment qualification rate can be improved in the selecting system of the point of optical reference described in the present embodiment, and (qualification rate reaches
100%), so that the scrappage of product raw material is 0, the waste of raw material is avoided, shortens the project cycle of product, significantly saves
About cost improves the popularity of enterprise, obtains the approval in industry faster.
Embodiment three
The present embodiment provides a kind of equipment, comprising: processor, memory, transceiver, communication interface or/and system bus；
Memory and communication interface connect with processor and transceiver by system bus and complete mutual communication, and memory is used for
Computer program is stored, communication interface is used for and other equipment are communicated, and processor and transceiver are for running computer journey
Sequence makes the equipment execute each step of the choosing method of optical reference point as described in embodiment one.
System bus mentioned above can be Peripheral Component Interconnect standard (Peripheral Component
Interconnect, abbreviation PCI) bus or expanding the industrial standard structure (Extended Industry Standard
Architecture, abbreviation EISA) bus etc..The system bus can be divided into address bus, data/address bus, control bus etc..
Communication interface is for realizing the communication between database access device and other equipment (such as client, read-write library and read-only library).
Memory may include random access memory (Random Access Memory, abbreviation RAM), it is also possible to further include non-volatile
Property memory (non-volatile memory), for example, at least a magnetic disk storage.
Above-mentioned processor can be general processor, including central processing unit (Central Processing Unit,
Abbreviation CPU), network processing unit (Network Processor, abbreviation NP) etc.；It can also be digital signal processor
(Digital Signal Processing, abbreviation DSP), specific integrated circuit (Application Specific
Integrated Circuit, abbreviation ASIC), field programmable gate array (Field Programmable Gate Array,
Abbreviation FPGA) either other programmable logic device, discrete gate or transistor logic, discrete hardware components.
The protection scope of the choosing method of optical reference point of the present invention is not limited to the present embodiment the step of enumerating and holds
The increase and decrease of the step of row sequence, the prior art that all principles according to the present invention are done, step are replaced realized scheme and are all wrapped
It includes within the scope of the present invention.
The present invention also provides a kind of selecting system of optical reference point, the selecting system of the optical reference point be may be implemented
The choosing method of optical reference point of the present invention, but the realization device of the choosing method of optical reference of the present invention point
Including but not limited to the structure of the selecting system of optical reference point enumerated of the present embodiment, all principles according to the present invention are done
The prior art malformation and replacement, be included in protection scope of the present invention.
In conclusion choosing method, system, computer storage medium and the equipment of optical reference point of the present invention can be with
Product attachment qualification rate (qualification rate reaches 100%) is improved, so that the scrappage of product raw material is 0, avoids the wave of raw material
Take, shorten the project cycle of product, significantly save the cost, improve the popularity of enterprise, obtains the approval in industry faster.
The present invention effectively overcomes various shortcoming in the prior art and has high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (10)
1. a kind of choosing method of optical reference point, which is characterized in that the choosing method of the optical reference point includes:
Obtain the pad image of component to be mounted in a substrate image；
By detecting attribute or the pad Screening Treatment of the corresponding design document of the substrate image, in the pad image really
Pad on the fixed substrate image, using the optical reference point as component to be mounted；Wherein, first device to be mounted
The position of part is determined that the centre coordinate of the component to be mounted is by the base by the centre coordinate of the component to be mounted
The corresponding coordinate file of plate image is known.
2. the choosing method of optical reference point according to claim 1, which is characterized in that in one substrate image of the acquisition
In component to be mounted pad image the step of before, the choosing method of the optical reference point further include:
By the line layer and solder mask of substrate design file acquisition substrate as substrate image；Or
It obtains and is derived from patch device substrate image collected.
3. the choosing method of optical reference point according to claim 1, which is characterized in that in one substrate image of the acquisition
The step of pad image of component to be mounted includes:
The centre coordinate of the component to be mounted is obtained from the corresponding coordinate file of the substrate image；
By the picture centre position of component to be mounted on the centre coordinate of the component to be mounted and the substrate image
Set coincidence；
Circulation executes the picture centre for obtaining the centre coordinate of component and the centre coordinate of component and component to be mounted
The step of position is overlapped, to extract the pad image of component to be mounted on the substrate image one by one.
4. the choosing method of optical reference point according to claim 1, which is characterized in that described by detecting the substrate
The attribute of the corresponding design document of image or pad Screening Treatment determine the weldering on the substrate image in the pad image
Disk, the step of using optical reference point as component to be mounted before, the choosing method of the optical reference point further include:
According to the rectangle flat-face fillet weld disk and/or circular pad on substrate image with centre coordinate, the optical reference point is determined
Selection range.
5. the choosing method of optical reference point according to claim 4, which is characterized in that described by detecting the substrate
The attribute of the corresponding design document of image determines the pad on the substrate image, as wait paste in the pad image
The step of optical reference point of the component of dress includes:
Search the existing attribute of the design document；
According to the existing attribute of the design document, it is determined as the coordinate information of the pad of optical reference point.
6. the choosing method of optical reference point according to claim 4, which is characterized in that it is described by pad screening at
Reason determines the pad on the substrate image, using the optical reference point as component to be mounted in the pad image
The step of include:
According to automatic selection mechanism by the pin coordinate of component to be mounted in the corresponding coordinate file of the substrate image
The position of the pad image of the component to be mounted with this in the substrate image is matched, with filter out one by one cover it is described
All pads of component to be mounted are chosen and are wherein no less than two pads as optical reference point；Wherein, described to be mounted
The centre coordinate of component be located at using described and be wherein no less than two pads as in the rectangular area diagonally constituted；Or
Determine the component outline border regional scope to be mounted according to the automatic selection mechanism, with filter out one by one it is described to
All pads in mounted component outline border regional scope are chosen and are wherein no less than two pads as optical reference point；Institute
The centre coordinate for stating component to be mounted, which is located at using described, is wherein no less than two pads as the rectangular area diagonally constituted
It is interior.
7. a kind of selecting system of optical reference point, which is characterized in that the selecting system of the optical reference point includes:
Pad extraction module, for obtaining the pad image of component to be mounted in a substrate image；
Module is chosen, for passing through the attribute or the pad Screening Treatment that detect the corresponding design document of the substrate image, in institute
The pad determined on the substrate image in pad image is stated, using the optical reference point as component to be mounted；Wherein, institute
The position for stating component to be mounted is determined by the centre coordinate of the component to be mounted, in the component to be mounted
Heart coordinate is known by the corresponding coordinate file of the substrate image.
8. the selecting system of optical reference point according to claim 7, which is characterized in that the selection of the optical reference point
System further include:
Module is obtained, for the line layer and solder mask by substrate design file acquisition substrate as substrate image；Or it obtains
Derived from patch device substrate image collected.
9. a kind of computer storage medium, is stored thereon with computer program, which is characterized in that when the program is executed by processor
Realize the choosing method of any one of claim 1 to 6 optical reference point.
10. a kind of equipment characterized by comprising processor and memory；
The memory is used to execute the computer journey of the memory storage for storing computer program, the processor
Sequence, so that the equipment executes the choosing method of the optical reference point as described in any one of claims 1 to 6.
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| CN201910209602.0A CN109961067B (en) | 2019-03-19 | 2019-03-19 | Method and system for selecting optical reference point, computer storage medium and equipment |
| PCT/CN2019/126505 WO2020186851A1 (en) | 2019-03-19 | 2019-12-19 | Method and system for selecting optical reference point, and computer storage medium and device |
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| CN201910209602.0A CN109961067B (en) | 2019-03-19 | 2019-03-19 | Method and system for selecting optical reference point, computer storage medium and equipment |
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| WO2020186851A1 (en) * | 2019-03-19 | 2020-09-24 | 上海望友信息科技有限公司 | Method and system for selecting optical reference point, and computer storage medium and device |
| CN116362957A (en) * | 2021-12-27 | 2023-06-30 | 广州镭晨智能装备科技有限公司 | PCB card image alignment method, device, medium and electronic equipment |
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| Publication number | Publication date |
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| CN109961067B (en) | 2021-05-28 |
| WO2020186851A1 (en) | 2020-09-24 |
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